TWI495050B - Resin-sealed semiconductor device, mold for resin seal, method for manufacturing resin-sealed semiconductor device and lead frame - Google Patents

Description

Resin-sealed semiconductor device, resin sealing mold, resin sealing type semiconductor device manufacturing method, and lead frame

The present invention relates to a resin-sealed semiconductor device in which a heat dissipation fan can be mounted, a resin sealing mold used in the production of a resin-sealed semiconductor device, a method of manufacturing a resin-sealed semiconductor device, and a lead frame for a resin-sealed semiconductor device.

A resin-sealed semiconductor device in which a semiconductor element and a semiconductor element mounting portion such as a die pad (such as a die pad, a top plate, and a die pad) are sealed with a resin (see Non-Patent Document 1) ), is widely used in various electronic machines.

FIG. 24 is a perspective view showing a conventional resin sealing type semiconductor device 900 disclosed in Non-Patent Document 1. Here, FIG. 24 is a view showing a transparent display of a resin. Moreover, the conventional resin-sealed type semiconductor device 900 shown in FIG. 24 is a single-row in-line bridge type diode.

As shown in FIG. 24, the conventional resin-sealed semiconductor device 900 includes a die pad (first die pad 911 and second die pad 912) as a semiconductor element mounting portion, a semiconductor element, and a bonding connection terminal (first a resin-sealed type semiconductor device main body (hereinafter simply referred to as "main body") 930 formed by resin sealing, such as a joint connection terminal 921 and a second joint connection terminal 922), and four external wires (first external wires 951, 952 and second outer conductor 953, 954).

In the resin-sealed type semiconductor device 900 of such a structure, a screw passage hole H is provided on the back surface of the main body 930 (inside the paper sheet in Fig. 24) for mounting the heat dissipation fan 980 by screws (refer to Fig. 25).

FIG. 25 is an explanatory view showing a state in which the heat dissipation fan 980 is attached to the conventional resin-sealed semiconductor device 900 shown in FIG. When the heat dissipating fan 980 is attached to the conventional resin sealing type semiconductor device 900, the screw 990 is inserted into the screw through hole H from the front surface of the main body 930 while the heat dissipating fan 980 is in contact with the back surface of the main body 930, and the screw 990 is screwed in. The female screw portion (ie, the nut portion, not shown) provided on the heat dissipation fan 980 is attached to the heat dissipation fan 980 by tightening the screw 990.

Advanced technical literature

Patent literature

Non-Patent Document 1: Product Information > Semiconductor Products > Diodes > Bridge Diodes > Wire Insertion Type, [online], New Electric Industrial Co., Ltd., [Search on September 16, 2010], Internet ( Internet), URL: http://www.shindengen.co.jp/product/semi/list_detail_NEW.php? Category_id=01&sub_id=03&product_id=D25JAB80V>

However, when the resin-sealed semiconductor device 900 manufactured as described above is mounted on a substrate (not shown) of an electronic device, the external wires 951 to 954 are inserted into the mounting holes provided on the substrate, and then generally soldered or the like. Electrical connections. In this case, the resin-sealed semiconductor device is mounted in various forms in recent years due to the high functionality and miniaturization of the electronic device. Therefore, when the resin-sealed semiconductor device 900 is mounted on a substrate or the like, the degree of freedom in mounting is attached. The demand is getting higher and higher. Therefore, the mounting position of the heat dissipation fan 980 may not necessarily be provided on the back surface of the main body 930, but may be, for example, the upper surface (top surface) of the main body 930 or the like.

However, in the conventional resin-sealed type semiconductor device 900, since the mounting position of the heat radiating fan 980 is fixed, it is not easy to change the mounting position of the heat radiating fan 980.

In view of the above, it is an object of the present invention to provide a resin-sealed semiconductor device in which the mounting position of the heat-dissipating fan can be selected to improve the degree of freedom in mounting the resin-sealed semiconductor device on a substrate or the like. Further, another object of the present invention is to provide a resin sealing mold (metal mold) and a resin sealing type semiconductor device which can produce the resin-sealed semiconductor device of the present invention. Further, another object of the present invention is to provide a lead frame which can improve heat dissipation performance by using the resin-sealed type semiconductor device of the present invention.

[1] The resin-sealed type semiconductor device of the present invention has a body in which a semiconductor element and a semiconductor element mounting portion are resin-sealed, and an external wire extending from the body to the outside in a predetermined direction, when the external wire is extended The surface that is out is the lower surface of the main body, the reverse side of which is the upper surface of the main body, and the surface on which the heat dissipating fan can be mounted between the lower surface and the upper surface is the back surface of the main body, and the reverse side thereof is the front surface of the main body. A first screw passing portion and a second screw passing portion for mounting the heat dissipating fan on the back surface or the upper surface are provided on different faces of the main body.

[2] In the resin-sealed type semiconductor device of the present invention, the semiconductor element mounting portion is constituted by a plate-like die pad for mounting the semiconductor element, and the die pad holder has a loading portion on which the semiconductor element is mounted And a curved flat portion formed by bending the end portion of the upper surface side of the loading portion toward the front surface side.

[3] In the resin-sealed semiconductor device of the present invention, the tip end portion of the curved flat portion is formed at a position closer to the front surface side than an intermediate position between the front surface and the back surface.

[4] In the resin-sealed semiconductor device of the present invention, the main body is provided with a misalignment preventing joint for preventing the mounting position of the heat dissipating fan from being displaced.

[5] In the resin-sealed semiconductor device of the present invention, the first screw passage portion and the second screw passage portion form a first insertion path and a second insertion path through the screw, the first A plug-in path and the second plug-in path are cross-arranged.

[6] In the resin-sealed type semiconductor device of the present invention, the first screw passing portion and the second screw passing portion are first through the first protruding portion for forming the first screw passing portion A mold and a resin sealing mold formed of a second mold having a second protruding portion for forming the second screw passing portion are formed.

[7] In the resin-sealed semiconductor device of the present invention, the first screw passage portion is configured by a first U-shaped space and a second U-shaped space that shares a space with the first U-shaped space. The first U-shaped space has a U-shape having a semicircular curved portion and an opening portion on the front surface, and the curved portion is located on the upper end side and the lower surface side of the front surface of the front surface Between the end edges, at the same time, the opening portion is located at an end side of the lower surface side of the front surface, the first U-shaped space is formed to a predetermined position facing the back surface, and the second U-shaped space a U-shape having a semicircular curved portion and an opening portion on the lower surface, the curved portion being located between the end side of the lower surface on the front side and the end side on the back side, and The opening portion is located at an end side of the lower surface of the lower surface, the second U-shaped space is formed to a predetermined position facing the upper surface, and the second screw passage portion is formed by a third U-shaped space And a fourth U-shaped space sharing the space with the third U-shaped space, the third U-shaped space a U-shape having a semicircular curved portion and an opening portion on the back surface, the curved portion being located between the end side of the upper surface side of the back surface and the end side of the lower surface side, and The opening portion is located at an end side of the upper surface side of the back surface, the third U-shaped space is formed to a predetermined position facing the front surface, and the fourth U-shaped space has a a semi-circular curved portion and a U-shape of the opening portion, wherein the curved portion is located between the end side of the upper surface side and the end side of the back surface side, and the opening portion is located at the The fourth U-shaped space on the upper side of the upper surface is formed to a predetermined position facing the lower surface, and the first screw passage portion and the second screw passage portion share a space, and the observation is made Above or below, the curved portion of the second U-shaped space and the curved portion of the fourth U-shaped space form a circular first path of the insertion, when the front or The back surface, the curved portion of the first U-shaped space and the third U-shaped space Circular curved portion of the second insertion path.

[8] In the resin-sealed semiconductor device of the present invention, the screw is bent by the first U-shaped space and the third U when the heat dissipating fan is attached to the back surface Positioning a curved portion of the word space, the screw being bent by the curved portion of the second U-shaped space and the curved portion of the fourth U-shaped space when the heat dissipating fan is mounted on the upper surface Positioning.

[9] In the resin-sealed type semiconductor device of the present invention, the first screw passage portion is formed as an open groove by grooving the front surface from the upper surface to the lower surface, and the open groove is The upper surface has a U-shaped portion having a semicircular curved portion and an opening portion, and the curved portion is located between the end side of the upper surface side and the end side of the back surface side, and at the same time, An opening portion is located at an end side of the upper surface side of the upper surface, the curved portion and the opening portion are formed to the front surface, the curved portion is used as the first insertion path, the second screw The passage portion is formed as a through hole penetrating from the curved surface to the back surface, and the through hole is used as the second insertion path, and has a circular shape when the front surface or the back surface is observed.

[10] In the resin-sealed type semiconductor device of the present invention, at least one of the first screw passing portion and the second screw passing portion is formed on the main body by an opening machine.

[11] The resin sealing mold of the present invention is a resin sealing mold for producing a resin sealing type semiconductor device having a body in which a semiconductor element and a semiconductor element mounting portion are sealed by a resin, and An external wire extending from the main body to the outside in a predetermined direction, wherein the outer wire protrudes from a lower surface of the main body, the reverse surface thereof is an upper surface of the main body, and the lower surface and the upper surface may be When the surface on which the heat dissipation fan is mounted is the back surface of the main body and the reverse side thereof is the front surface of the main body, the first screw passage portion and the second screw passage portion for mounting the heat dissipation fan on the back surface or the upper surface Provided on a different surface of the main body, the resin sealing mold having a first mold corresponding to the front side and when the main body is divided into the front side and the back side a second mold corresponding to the back side, a mold cavity of the first mold is provided with a first protrusion for forming the first screw passage portion, and a mold cavity of the second mold Providing a second protrusion for forming the second screw passing portion, the first protrusion and the second protrusion being on an opening face of the mold cavity of the first mold and the second mold When the resin is formed by injecting resin into the space formed by the opening of the mold cavity, the first screw passing portion and the second screw passing portion may be formed on the main body.

[12] In the resin sealing mold of the present invention, in the respective surfaces of the mold cavity of the first mold and the mold cavity of the second mold, the lower surface of the main body is formed as a lower surface a molding surface from a surface of the mold cavity of the first mold and a mold of the second mold in a state where the lower molding surface is leveled and the first mold and the second mold are placed upward When the opening surface of the cavity is respectively observed inside the mold cavity of the first mold and the inside of the mold cavity of the second mold, the left-right direction is the x-axis, the front-rear direction is the y-axis, and the vertical direction is the z-axis. The first protruding portion is formed as a flat surface at a lower end of the first protruding portion, and at the tip end of the first protruding portion, a semicircle is formed from a lower end of the first protruding portion along a z-axis to a predetermined position. a first curved end surface of the shape, at an upper end of the first protruding portion, from a base portion of the first protruding portion along a y-axis to a predetermined position, a semi-circular upper end curved surface is formed at the first Forming between the tip end curved surface and the upper end curved surface a first inclined surface inclined at a predetermined angle, the second protruding portion is formed with a flat surface at an upper end of the second protruding portion, and at a tip end of the second protruding portion, at an upper end side from the second protruding portion A second tip end curved surface having a semicircular shape is formed along the z-axis to a predetermined position, and a lower end of the second protruding portion is formed at a position from the base portion of the second protruding portion along the y-axis to a predetermined position. A semicircular lower end curved surface is formed with a second inclined surface having a shape corresponding to the first inclined surface between the second tip end curved surface and the lower end curved surface.

[13] In the resin sealing mold of the present invention, in the respective surfaces of the mold cavity of the first mold and the mold cavity of the second mold, the lower surface of the main body is formed as a lower surface a molding surface from a surface of the mold cavity of the first mold and a mold of the second mold in a state where the lower molding surface is leveled and the first mold and the second mold are placed upward When the opening surface of the cavity is respectively observed inside the mold cavity of the first mold and the inside of the mold cavity of the second mold, the left-right direction is the x-axis, the front-rear direction is the y-axis, and the vertical direction is the z-axis. The first protrusion is formed at a tip end of the first protrusion, and has a semicircular curved surface from an upper end to a lower end of the inner portion of the first mold along a z-axis, and the second protrusion is formed along a y-axis a cylindrical protrusion protruding in a direction and formed on a curved surface formed at a tip end of the first protrusion.

[14] In the resin sealing mold of the present invention, a protruding portion having a cylindrical portion with the cylindrical protruding portion is provided on a curved surface formed at a tip end of the first protruding portion in a y-axis direction The first end face corresponds to the first end face of the shape.

[15] In the resin sealing mold of the present invention, the second mold has a joint forming portion that forms a joint for preventing misalignment, and the joint for preventing misalignment is attached to the main body In the state of being used, the position of the heat dissipation fan is prevented from being displaced.

[16] A method of manufacturing a resin-sealed semiconductor device according to the present invention is to manufacture a main body having a semiconductor element and a semiconductor element mounting portion sealed by a resin, and an external wire extending from the main body to the outside in a predetermined direction. The surface on which the outer wire protrudes is the lower surface of the main body, the reverse surface of which is the upper surface of the main body, and the surface on which the heat dissipation fan can be mounted between the lower surface and the upper surface is the back surface of the main body, and the reverse side thereof is In the front surface of the main body, the back surface or the upper surface of the main body is respectively provided with a resin of a resin sealing type semiconductor device in which the heat dissipating fan is attached to the first screw passing portion and the second screw passing portion of the main body The method for producing a sealed semiconductor device includes a resin sealing mold preparation process for preparing a resin sealing mold, wherein the mold has a main body side and a front surface side when the main body is divided into the front side and the back side Corresponding first mold and a second mold corresponding to the main body on the back side, the mold cavity of the first mold is provided on the mold cavity for forming the first screw a first protruding portion of the wire passing portion, wherein the mold cavity of the second mold is provided with a second protruding portion for forming the second screw passing portion, the first protruding portion and the second protruding portion, Forming the first body on the body when injecting resin into the space formed by the opening face of the mold cavity of the first mold facing the opening of the mold cavity of the second mold a screw passage portion and a shape of the second screw passage portion; a semiconductor component mounting process in which the semiconductor component is mounted on the semiconductor component mounting portion; and a predetermined range including the semiconductor component and the semiconductor component mounting portion After the resin sealing mold is covered, the resin is injected into the resin sealing mold, and the resin including the semiconductor element and the predetermined range of the semiconductor element mounting portion is sealed with a resin.

[17] The lead frame of the present invention is a lead frame for a resin-sealed type semiconductor device having a body in which a semiconductor element and a semiconductor element mounting portion are sealed by a resin, and a body from the body An external wire extending outward in a predetermined direction, wherein a surface of the outer wire protruding from the lower surface of the main body, a reverse surface thereof is an upper surface of the main body, and a heat dissipating fan may be installed between the lower surface and the upper surface When the surface is the back surface of the main body and the back surface thereof is the front surface of the main body, the back surface or the upper surface of the main body is respectively provided with a first screw passing portion and a first screw connecting the heat dissipating fan to the main body a screw passing portion having a plate-like die holder mounting the semiconductor element and the external lead, the die pad having a loading portion for loading the semiconductor element, and by loading the same An end portion of the upper surface of the portion is curved at a curved plane portion formed on the front side.

[18] In the lead frame of the present invention, the tip end of the curved flat portion is formed at a position closer to the front side than an intermediate position between the front surface and the back surface.

[19] A lead frame for manufacturing a resin-sealed type semiconductor device, which has a body for sealing a semiconductor element and a semiconductor element mounting portion by resin, and a body from the body, together with a resin sealing mold An external wire extending outward in a predetermined direction, wherein a surface of the outer wire protruding from the lower surface of the main body, a reverse surface thereof is an upper surface of the main body, and a heat dissipating fan may be installed between the lower surface and the upper surface When the surface is the back surface of the main body and the back surface thereof is the front surface of the main body, the back surface or the upper surface of the main body is respectively provided with a first screw passing portion and a first screw connecting the heat dissipating fan to the main body In the second screw passing portion, the resin sealing mold has a first mold corresponding to the front side body and a main body on the back side when the main body is divided into the front side and the back side Corresponding second mold, the first cavity of the first mold is provided with a first protrusion for forming the first screw passage portion, and the mold cavity of the second mold is provided a second protrusion for forming the second screw passing portion, the first protrusion and the second protrusion, at an opening face of the mold cavity of the first mold and a mold of the second mold When the body is formed by injecting resin into the space formed by the opening of the cavity, the shape of the first screw passing portion and the second screw passing portion may be formed on the main body, the lead frame having Mounting a plate-like die holder of the semiconductor element and the external lead, and forming a space portion on the die pad for avoiding a mold cavity of the first mold with the resin sealing mold At least one of the first protrusion and the second protrusion provided on the mold cavity of the second mold are abutted.

According to the resin-sealed semiconductor device of the present invention, since the first screw passing portion and the second screw passing portion are provided to mount the heat dissipating fan on the back surface or the upper surface of the main body, the heat dissipating fan can be selectively attached to the back surface of the main body or Above. As described above, in the resin-sealed semiconductor device of the present invention, when the resin-sealed semiconductor device is mounted on a substrate of an electronic device or the like, the degree of freedom in mounting can be improved.

In addition, when the main body is divided into a front side and a back side, the resin sealing mold of the present invention has a first mold corresponding to the front side of the main body and a second mold corresponding to the back side of the main body, first The mold is provided with a first protrusion forming a first screw passage portion, and the second mold is provided with a second protrusion forming a second screw passage portion. Therefore, the resin-sealed semiconductor device according to the above [1] can be produced by using the resin sealing mold of the present invention.

In addition, the resin sealing type semiconductor device manufacturing method of the present invention has a resin sealing mold preparation process for preparing a resin sealing mold which can form a first screw passing portion and a second screw passing portion in a main body, and is used in a semiconductor. The semiconductor element mounting process in which the semiconductor element is mounted on the element mounting portion, and the predetermined range including the semiconductor element and the semiconductor element mounting portion are covered by the resin sealing mold, and then resin is injected into the resin sealing mold to include the semiconductor element and the semiconductor element. The predetermined range of the mounting portion is subjected to a resin sealing resin sealing process. Therefore, the resin-sealed semiconductor device according to the above [1] can be manufactured by sequentially performing the above-described processes.

According to the lead frame of the present invention, since the die pad has a curved flat portion formed by bending the upper end of the loading portion toward the front side of the main body, the heat dissipating fan can be mounted on a large area when the heat dissipating fan is mounted on the main body. The curved plane faces opposite. In this way, a higher heat dissipation effect can be obtained.

According to the lead frame of the present invention, since the space portion is formed in the die pad, the first protrusion portion and the mold cavity inside the second mold for avoiding the inside of the mold cavity of the first mold for the resin sealing mold are avoided. Since any of the protruding portions of the second protruding portion is in contact with each other, when the main body is formed by using the resin sealing mold, the die holder constituting the lead frame of the present invention does not abut against the protruding portion provided in the resin sealing mold. . Thus, the die pad can be smoothly placed in the resin sealing mold.

Specific embodiments of the present invention will be described below.

Embodiment 1

FIG. 1 is an explanatory view showing a configuration of a resin-sealed semiconductor device 200A according to the first embodiment. 1(a) is a perspective view showing the resin-sealed semiconductor device 200A as viewed from the front side oblique direction, and FIG. 1(b) is a perspective view showing the resin-sealed semiconductor device 200A as viewed obliquely from the front. Here, the resin-sealed semiconductor device 200A will be described by taking a single-row in-line bridge diode as an example. In addition, FIG. 1 is an explanatory view showing a state in which the heat dissipation fan 500 (see FIGS. 6 and 7) is not attached.

As shown in FIG. 1, the resin-sealed semiconductor device 200A of the first embodiment includes a resin-sealed semiconductor device main body (also simply referred to as "main body" in the embodiment) 210 and a lead frame 100A (see FIG. 2(a)). External wires (first outer wires 121, 122 and second outer wires 123, 124). The structure of the lead frame 100A will be described later. Further, the first outer leads 121, 122 and the second outer leads 123, 124 protrude from the body 210 along the z-axis (arrow z' direction).

Further, in this specification, with respect to each surface of the main body 210, the surface on which the external wires 121 to 124 protrude is the lower surface 210a, and the reverse surface thereof (the surface of the main body 210 when the main body 210 is viewed in the arrow z' direction in FIG. 1) is A surface of the upper surface 210b, the lower surface 210a and the upper surface 210b may be mounted with a heat dissipating fan 500 (not shown in FIG. 1) (the surface of the main body 210 when the main body 210 is viewed in the direction of the arrow y in FIG. 1) is the back surface 210c and the reverse side thereof ( The surface of the main body 210 when the main body 210 is viewed in the direction of the arrow y' in FIG. 1 is the front surface 210d, and the surface when the main body 210 is viewed from the arrow x direction or the x' direction is the side surface 210e.

Further, the lower surface 210a, the upper surface 210b, the rear surface 210c, the front surface 210d, and the side surface 210e may be expressed as "the lower surface 210a of the main body 210", "the upper surface 210b of the main body 210", "the rear surface 210c of the main body 210", and "the front surface of the main body 210". 210d" and "side surface 210e of the main body 210" may be omitted from "the main body 210" and may be directly referred to as "lower surface 210a", "upper surface 210b", "back surface 210c", "front surface 210d", and "side surface 210e".

The shape of the side surface 210e of the main body 210 (hereinafter referred to as "side shape") is a square or a square shape, that is, the entirety of the main body 210 is a rectangular parallelepiped. In addition, in the present specification, a square or a square is expressed as "square shape".

In addition, on the main body 210, the first screw passing portion 300 and the second screw passing portion 400, which are mounted on the back surface 210c or the upper surface 210b of the main body 210, may be disposed on the main body 210. Different faces. The first screw passing portion 300 and the second screw passing portion 400 will be described later.

FIG. 2 is an explanatory view showing a manufacturing process of the resin-sealed semiconductor device 200A according to the first embodiment. In Fig. 2, only the various stages of the stage before the installation of the cooling fan 500 are shown. FIG. 3 is an enlarged view showing the first die pad 111 and the second die pad 112.

Fig. 2(a) shows a lead frame preparation process for preparing the lead frame 100A. The lead frame 100A prepared here has a semiconductor element mounting portion 110 composed of a plate-like die pad (first die pad 111 and second die pad 112) as a plurality of terminals with external terminals (4) The outer leads (the first outer leads 121, 122 and the second outer leads 123, 124) are arranged to connect the respective leads of the first outer leads 121, 122 and the second outer leads 123, 124, The tie bar 130 for preventing resin from flowing out in the resin sealing process is provided as an auxiliary lever for connecting the respective leading ends of the first outer wires 121, 122 and the second outer wires 123, 124 for maintaining the rigidity of the lead frame 100A. 140. The tie rod 130 and the auxiliary rod 140 will eventually be separated from the outer conductors (the first outer conductors 121, 122 and the second outer conductors 123, 124).

The first die pad 111 has two semiconductor component mounting portions (hereinafter referred to as "loading portions") 111a, 111b respectively loaded with one semiconductor element (not shown in FIG. 2(a)), and in the first die pad holder The lower end of 111 is connected to the first connecting portion 111c of the above-described loading portions 111a and 111b. Further, the second die pad 1112 has two loading portions 112a and 112b respectively loaded with one semiconductor element (not shown in FIG. 2(a)), and the above-described loading portion 112a is connected to the upper end of the first die pad 112. a second connecting portion 112c of 112b. The first die pad 111 and the second die pad 112 are as shown in an enlarged view of FIG. 3 .

The first die pad 111 and the second die pad 112 will be described below with reference to FIG. As shown in FIG. 3, the first die pad 111 has curved flat portions 111d and 111e formed by bending the end portion on the upper surface 210b side of the main body 210 of the loading portions 111a and 111b by 90 degrees on the front surface 210d side (y-axis direction). Similarly, the second die pad 112 has curved flat portions 112d and 112e which are formed by bending the end portion on the upper surface 210b side of the main body 210 of the loading portions 112a and 112b by 90 degrees toward the front surface 210d side (y-axis direction). In addition, the length of the curved flat portions 111d, 112d, and 112e in the y-axis direction (hereinafter simply referred to as "bending length") is "k", and the curved length of the curved flat portion 111e is "k'". The bending lengths k and k' will be described later.

Further, the second connecting portion 112c that connects the loading portions 112a and 112b is provided to connect the curved leading end portions of the curved flat portions 112d and 112e of the loading portions 112a and 112b.

Further, a space portion S is formed on the die pad (the first die pad 111 and the second die pad 112). The space portion S is for preventing the die pad from abutting against the second projecting portion 722 provided on the second die 720 of the resin sealing mold 700 (see FIGS. 8 and 9) forming the main body 210.

By forming such a space portion S, when the main body 210 is formed using the resin sealing mold 700, the die pad (the first die pad 111 and the second die pad 112) constituting the lead frame 100A may not be disposed. The second protrusions 722 on the second mold 720 abut. Thus, the die pad (the first die pad 111 and the second die pad 112) can be smoothly placed in the resin sealing mold 700.

Next, return to Fig. 2(a) for explanation. The first outer lead 121 of the first outer lead wires 121, 122 is formed integrally with the first die pad 111, and is disposed such that the tip end projects in the direction of the arrow z'. Further, the first outer lead 122 of the first outer lead wires 121, 122 is integrally formed with the second die pad 112, and is disposed such that the tip end projects in the direction of the arrow z' in the figure.

The second outer lead 123 of the second outer leads 123, 124 is configured to be isolated from the second die pad 112 while the rear end has a connecting portion 123a, the tip end being configured to protrude in the direction of the arrow z'. In addition, the second outer lead 124 of the second outer leads 123, 124 is configured to be isolated from the first die pad 111 while the rear end has a connecting portion 124a, the tip end being configured to protrude in the direction of the arrow z'.

The tie bar 130 is disposed in a direction orthogonal to the first outer leads 121, 122 and the second outer leads 123, 124, and is integrally formed with the first outer leads 121, 122 and the second outer leads 123, 124.

2(b) and 2(c) are schematic views showing a semiconductor element mounting process in which the semiconductor elements 151 to 154 are mounted. As shown in FIG. 2(b), the semiconductor element mounting process is performed by soldering to the semiconductor elements (diodes) 151 and 152 on the mounting portions 111a and 111b of the first die pad 111, and at the same time, Electrical connection to the semiconductor elements (diodes) 153, 154 is performed on the pads 112a, 112b of the second die pad 112. In addition, the loading portions 111a, 111b of the first die paddle 111 have a larger area than the semiconductor elements 151, 152. Likewise, the loading portions 112a, 112b of the second die pad 112 have a larger area than the semiconductor components 153, 154.

Next, as shown in FIG. 2(c), one end of the elliptical first joint connection terminal 161 is connected to the semiconductor elements 152, 153 while the other end is connected to the connection portion 124a of the second outer conductor 124, and the semiconductor is connected. The elements 152, 153 are electrically connected to the second outer lead 124. Further, one end of the second joint connection terminal 162 which is similar in length to the first joint connection terminal 161 is connected to the semiconductor elements 151, 154 while the other end is connected to the connection portion 123a of the second outer lead 123, and the semiconductor element is connected. 151, 154 are electrically connected to the second outer lead 123.

The resin sealing process was then carried out. In the resin sealing process, the first die pad 111 and the second die pad 112, the semiconductor elements 151 to 154, the first bonding terminal 161, and the second bonding are formed by the resin sealing die 700 (see FIGS. 8 and 9). After the connection terminal 162 or the like is covered, the resin is injected into the inside of the resin sealing mold 700, and the injected resin is cured to form the main body 210 (see FIG. 2(d)). Further, when the resin is injected into the inside of the resin sealing mold 700, the presence of the tie bar 130 prevents the resin from flowing out of the resin sealing mold 700.

In addition, a tie bar separation process for separating the tie bars 130 by a die cutting die (not shown) is also performed. In the tie separation process, separation of the auxiliary lever 140 will also be performed. Thus, the resin-sealed type semiconductor device 200A shown in Fig. 2(e) can be manufactured.

Next, the first screw passing portion 300 and the second screw passing portion 400 will be described.

FIG. 4 is an explanatory view showing the first screw passing portion 300 and the second screw passing portion 400. 4(a) is an enlarged view showing the first screw passing portion 300 and the second screw passing portion 400 of the main body 210 and its periphery, and FIG. 4(b) is a view showing the aa of the aa shown in FIG. 4(a). Surface map.

FIG. 5 is an explanatory view showing the first screw passing portion 300 and the second screw passing portion 400 shown in FIG. 4 as seen from various directions. Fig. 5(a) is a view as seen from the front surface 210d of the main body 210, Fig. 5(b) is a view as seen from the rear surface 210c of the main body 210, and Fig. 5(c) is a view as viewed from the upper surface 210b of the main body 210. Fig. 5(d) is a view showing the lower surface 210a of the main body 210.

In Figs. 5(a) and 5(b), the upper surface 210b is shown at the upper side of the figure, and in Figs. 5(c) and 5(d), the front surface 210d is shown at the left side of the figure.

The first screw passing portion 300 and the second screw passing portion 400 are formed by a U-shaped space having a semicircular curved portion and an opening portion. First, the first screw passing portion 300 will be described.

The first screw passage portion 300 is a second U-shaped space 320 that is shared by the first U-shaped space 310 (see FIG. 5( a )) and the first U-shaped space 310 (see FIG. 5( d ) ) constitutes.

As shown in FIG. 5(a), the first U-shaped space 310 has a U-shape on the front surface 210d of the main body 210, and has a semicircular curved portion 311 and an opening portion 312. In such a first U-shaped space 310, the curved portion 311 is located between the end side on the upper surface 210b side of the main body 210 of the front surface 210d and the end side on the lower surface 210a side, while the opening portion 312 is located on the lower surface 210a side of the front surface 210d. The end of the line. The first U-shaped space 310 is formed to a predetermined position toward the back surface 210c.

As shown in FIG. 5(d), the second U-shaped space 320 has a U-shape on the lower surface 210a of the main body 210, and has a semicircular curved portion 321 and an opening portion 322. In such a second U-shaped space 320, the curved portion 321 is located between the end side on the front surface 210d side of the main body 210 of the lower surface 210a and the end side on the back surface 210c side, and the opening portion 322 is located on the front surface 210d side of the lower surface 210a. The end of the line. The second U-shaped space 320 is formed to a predetermined position toward the upper surface 210b.

Further, the second screw passage portion 400 is a fourth U-shaped space 420 that is shared by the third U-shaped space 410 (see FIG. 5(b)) and the third U-shaped space 410 (see FIG. 5 (refer to FIG. 5 ( c)).

As shown in FIG. 5(b), the third U-shaped space 410 has a U-shape on the back surface 210c, and has a semicircular curved portion 411 and an opening portion 412. In such a third U-shaped space 410, the curved portion 411 is located between the end side on the upper surface 210b side of the main body 210 of the back surface 210c and the end side on the lower surface 210a side, and the opening portion 412 is located on the upper surface 210b side of the back surface 210c. The end of the line. The third U-shaped space 410 is formed to a predetermined position toward the front surface 210d.

As shown in FIG. 5, the fourth U-shaped space 420 has a U-shape on the upper surface 210b, and has a semicircular curved portion 421 and an opening portion 422. In the fourth U-shaped space 420, the curved portion 421 is located between the end side on the front surface 210d side of the main body 210 of the upper surface 210b and the end side on the back surface 210c side, and the opening portion 422 is located on the back surface 210c side of the upper surface 210b. The end of the line. The fourth U-shaped space 420 is formed to a predetermined position toward the lower surface 210a.

With the first screw passing portion 300 and the second screw passing portion 400, the first screw passing portion 300 and the second screw passing portion 400 have a common common structure inside the main body 210. Further, as shown in FIGS. 5(a) and 5(b), the first U-shaped space 310 of the first screw passing portion 300 is along the center line L1 in the z-axis direction and the third U of the second screw passing portion 400. The center line L2 of the word space 410 along the z-axis direction exists on the same axis (y-axis), and as shown in FIGS. 5(c) and 5(d), the second U-shape of the first screw passing portion 300 The center line L3 of the space 320 in the y-axis direction and the center line L4 of the fourth U-shaped space 420 of the second screw passing portion 400 in the y-axis direction exist on the same axis (z axis).

The first screw passing portion 300 and the second screw passing portion 400 are configured such that the first screw passing portion 300 and the second screw passing portion 400 are shared spaces in the main body 210, and only the portion sharing the space The first screw passing portion 300 and the second screw passing portion 400 can be provided in a small space.

Further, when viewed from the upper surface 210b or the lower surface 210a, the first screw passing portion 300 and the second screw passing portion 400 pass through the first screw passing portion 300 as shown in FIGS. 5(c) and 5(d). The curved portion 321 of the two U-shaped space 320 and the curved portion 421 of the fourth U-shaped space 420 of the second screw passing portion 400 form a circular first insertion path Wa.

Further, when viewed from the front surface 210d or the rear surface 210c, the first screw passing portion 300 and the second screw passing portion 400 pass through the first screw passing portion 300 as shown in FIGS. 5(a) and 5(b). The curved portion 311 of the U-shaped space 310 and the curved portion 411 of the third U-shaped space 410 of the second screw passage portion 400 form a circular second insertion path Wb.

Hereinafter, the simplification of the description will be described as "the curved portion 311 of the first U-shaped space 310 of the first screw passing portion 300" as "the curved portion 311 of the first screw passing portion 300", and the "first screw passing portion" The curved portion 321" of the second U-shaped space 320 of 300 is expressed as "the curved portion 321 of the first screw passing portion 300", and the "curved portion 411 of the third U-shaped space 410 of the second screw passing portion 400" The expression "the curved portion 411 of the second screw passing portion 400" is described as "the curved portion 421 of the fourth U-shaped space 420 of the second screw passing portion 400" as "the curved portion 421 of the second screw passing portion 400". .

In such a configuration, when the upper surface 210b is observed, as shown in Fig. 5(c), the lower surface 210a can be seen through the first insertion path Wa. In addition, when observing the lower surface 210a, as shown in FIG. 5(d), the upper surface 210b can be seen through the second insertion path Wb to a farther distance.

In addition, when observing the front surface 210d, as shown in FIG. 5(a), the back surface 210c can be seen through the second insertion path Wb to a farther position; when the back surface 210c is observed, as shown in FIG. 5(b), The second insertion path Wb sees through the front surface 210d to a greater extent.

By the above configuration of the first screw passage portion 300 and the second screw passage portion 400, the screw 600 (see FIGS. 6 and 7) for mounting the heat dissipation fan 500 can be passed through the back surface 210c from the front surface 210d of the main body 210, and also The upper surface 210b may be penetrated from the lower surface 210a of the main body 210. Thus, the heat dissipation fan 500 can be selectively mounted on the back surface 210c or the upper surface 210b of the main body 210.

In the resin sealed semiconductor device 200A of the first embodiment, the position of the central axis Pa of the first insertion path Wa is, for example, 1/2 of the size of the main body 210 in the y-axis direction (front surface 210d and rear surface 210c). There is, for example, an intermediate position therebetween, at the same time, for example, a position of 1/2 of the dimension of the main body 210 in the x-axis direction (for example, an intermediate position between the two side faces 210e).

In the resin sealing type semiconductor device 200A of the first embodiment, the position of the central axis Pb of the second insertion path Qb is, for example, 1/2 of the dimension of the main body 210 in the z-axis direction (the upper surface 210b of the main body 210) At least an intermediate position between the lower surface 210a and the lower surface of the main body 210, for example, a position of 1/2 (for example, an intermediate position between the two side surfaces 210e). Further, if the central axes Pa of the first insertion path Wa and the central axes Pb of the second insertion path Wb are orthogonal to each other, they may be slightly shifted from the respective positions.

Further, the heat radiating fan 500 is provided with a female screw portion 500a that fixes the heat radiating fan 500 to the main body 210 by screws. The female screw portion 500a is provided at a central portion of a mounting surface 510 (hereinafter simply referred to as "heat dissipation fan side mounting surface 510") on the heat radiating fan side when the heat radiating fan 500 is attached to the main body 210.

By thus arranging the positions of the first insertion path Wa and the second insertion path Wb of the main body 210 and the position of the female screw portion 500a of the heat dissipation fan 500, regardless of whether the heat dissipation fan 500 is attached to the back surface 210c or the upper surface 210b of the main body 210, The heat dissipation fan 500 can be installed in a stable state. This is because the screw fixing position when the heat radiating fan 500 is attached to the back surface 210c or the upper surface 210b of the main body 210 is located at almost the center of the back surface 210c or the upper surface 210b in the main body 210. Further, in the heat dissipation fan 500, it is located at the center of the heat dissipation fan side mounting surface 510.

Further, the bending length k of the curved flat portion 111d formed on the first die pad 111 (refer to FIG. 3) and the curved length k of the curved flat portions 112d and 112e formed on the second die pad 112 (refer to FIG. 3) The curved tip end portions of the curved flat portions 111d, 112d, and 112e are set to be at least closer to the front surface 210d side of the main body 210 than the central axis Pa of the first insertion path Wa. Further, similarly, the curved length k' (see FIG. 3) of the curved flat portion 111e formed on the first die pad 111 is similar, and the curved tip end portion of the curved flat portion 111e is set to be at least smaller than the first insertion path Wa The center axis Pa is closer to the position on the front side 210d side of the main body 210.

In the resin-sealed semiconductor device 200A of the first embodiment, the bending length k and the bending length k' are in the height h along the z-axis direction of the first die pad 111 and the second die pad 112 (see FIG. 3). Equivalent or almost equal. However, since there is a second connecting portion 112c connecting the curved flat portions 112d, 112e of the second die pad 112, the bending length k' is slightly shorter than the bending length k.

Thus, since the bending length k and the bending length k' are equal or nearly equal in the height h (see FIG. 3) of the first die pad 111 and the second die pad 112 in the z-axis direction, the crystal grains are When the seat and the semiconductor element are resin-sealed, the side surface shape of the main body 210 may be square.

Since the side surface shape of the main body 210 is square, the upper surface 210b of the main body 210 has the same area as the rear surface 210c of the main body 210 having a large area.

FIG. 6 is an explanatory view showing that the heat dissipation fan 500 is attached to the back surface 210c of the main body 210. 6(a) is a perspective view, and FIG. 6(b) is an enlarged cross-sectional view showing the relationship between the first screw passing portion 300 and the second screw passing portion 400 and the screw 600.

When the heat dissipation fan 500 is mounted on the back surface 210c of the main body 210, as shown in FIG. 6, in a state where the heat dissipation fan 500 is brought into contact with the back surface 210c of the main body 210, the tip end portion of the screw 600 is provided from the front surface 210d of the main body 210. The first screw passing portion 300 passes through the second insertion path Wb (refer to FIG. 5(c)), and then protrudes from the back surface 210c of the main body 210. At the same time, the tip end portion of the screw 600 is inserted into the female screw portion 500a of the heat dissipation fan 500 and screwed to fix the heat dissipation fan 500. Thus, the heat dissipation fan 500 can be mounted on the back surface 210c of the main body 210.

Further, the screw 600 passes through two curved portions (the curved portion 311 of the first screw passing portion 300 and the curved portion 411 of the second screw passing portion 400) in the direction in which the screw 600 is inserted, and the portion of the screw 600 near the head is The portions close to the tip end portions are respectively positioned on the opposite sides (see FIG. 6(b)), so that the left and right directions and the up and down direction are not displaced, so that the heat radiating fan 500 can be fixed in a stable state.

As shown in FIG. 6 , when the heat dissipation fan 500 is mounted on the back surface 210 c of the main body 210 , the heat dissipation fan 500 is disposed opposite to the first die pad 111 and the second die pad 112 by a large area, and thus Get a higher heat dissipation. As shown in FIG. 3, this is because the first die pad 111 and the second die pad 112 located on the back surface 210c of the main body 210 have a large area, thereby making the heat dissipation fan 500 and the first having such a large area. When the die pad 111 and the second die pad 112 are opposed to each other, a high heat dissipation effect can be obtained.

FIG. 7 is an explanatory view showing that the heat dissipation fan 500 is attached to the upper surface 210b of the main body 210. Fig. 7(a) is a perspective view, and Fig. 7(b) is an enlarged cross-sectional view showing the relationship between the first screw passing portion 300 and the second screw passing portion 400 and the screw 600.

When the heat dissipation fan 500 is mounted on the upper surface 210b of the main body 210, as shown in FIG. 7, in a state where the heat dissipation fan 500 is placed on the upper surface 210b of the main body 210, the tip end portion of the screw 600 is disposed from the main body 210. The first screw passing portion 300 of the lower portion 210a passes through the first insertion path Wa (refer to FIG. 5(b)), and then protrudes from the upper surface 210b of the main body 210. At the same time, the tip end portion of the screw 600 is inserted into the female screw portion 500a of the heat dissipation fan 500 and screwed to fix the heat dissipation fan 500. Thus, the heat dissipation fan 500 can be mounted on the upper surface 210b of the main body 210.

Further, in the case shown in FIG. 7, the screw 600 passes through the two bent portions (the curved portion 321 of the first screw passing portion 300 and the curved portion 421 of the second screw passing portion 400) in the direction in which the screw 600 is inserted. The portion of the screw 600 near the head and the portion near the tip end are respectively positioned on the opposite side (refer to FIG. 7(b)), so that the left and right directions and the up and down direction are not displaced, so that the heat dissipation fan 500 can be stabilized. fixed.

As shown in FIG. 7, when the heat radiating fan 500 is attached to the upper surface 210b of the main body 210, a high heat radiating effect can be obtained similarly to when the heat radiating fan 500 is attached to the back surface 210c of the main body 210. This is because when the heat radiating fan 500 is attached to the upper surface 210b of the main body 210, the heat radiating fan side mounting surface 510 is a curved flat portion 111d, 111e and curved which have almost the same area as the mounting portions 111a and 111b and the loading portions 112a and 112b. The flat portions 112d and 112e are mounted in a state of being opposed to each other.

In other words, the curved lengths k and k' of the respective curved flat portions 111d, 111e and 112d, 112e are equal or nearly equal to the height h in the z-axis direction of the first die pad 111 and the second die pad 112 (refer to FIG. 3). Therefore, the side surface shape of the main body 210 is square, and therefore, the upper surface 210b of the main body 210 has the same area as the rear surface 210c of the main body 210 having a large area.

Thus, when the heat dissipation fan 500 is mounted on the upper surface 210b of the main body 210 (refer to FIG. 7), since the heat dissipation fan 500 is opposed to the curved flat portions 111d, 111e, 112d, and 112e with a large area, it is possible to obtain and The heat dissipation fan 500 is mounted on the back surface 210c of the main body 210 with the same high heat dissipation effect.

As described above, with the resin-sealed semiconductor device 200A of the first embodiment, the heat dissipation fan 500 can be selectively attached to the back surface 210c or the upper surface 210b of the main body 210 (see FIGS. 6 and 7). Therefore, the mounting position of the heat radiating fan 500 can be easily operated in addition to the back surface 210c of the main body 210 when it is desired to be mounted on the upper surface 210b of the main body 210, so that the mounting of the resin sealing type semiconductor device 200A on the substrate can be improved. Installation freedom.

Next, a resin sealing mold 700 for manufacturing the resin-sealed semiconductor device 200A of the first embodiment will be described.

FIG. 8 and FIG. 9 are explanatory views showing a resin sealing mold 700 for manufacturing the resin-sealed semiconductor device 200A according to the first embodiment. 8 is an explanatory view showing a relationship between the resin-sealed type semiconductor device 200A and the resin sealing mold 700 when the front surface 210d of the main body 210 is viewed from an oblique direction. FIG. 9 is a view showing the resin when the back surface 210c of the main body 210 is viewed from the obliquely downward direction. An explanatory view of the relationship between the hermetic semiconductor device 200A and the resin sealing mold 700.

The resin sealing mold 700 is composed of a pair of molds (a first mold 710 and a second mold 720). The first mold 710 is a mold corresponding to the front surface 210d side when the main body 210 is divided into the front surface 210d side and the back surface 210c side, and the second mold 720 is divided into the front surface 210d side and the back surface 210c side when the main body 210 is divided. A mold corresponding to the side of the back surface 210c. In addition, as shown in FIG. 8 and FIG. 9, after the resin injected in the resin sealing mold 700 is cured, the first mold 710 and the second mold 720 are removed, and the resin sealing type semiconductor device 200A is manufactured. In the project, it corresponds to the project shown in Figure 2(d). The first mold 710 and the second mold 720 are omitted in FIG. 2(d).

Next, the first mold 710 and the second mold 720 will be described with reference to FIGS. 8 and 9. The first mold 710 has a mold cavity 711 provided with a space for injecting resin into the inside, and the second mold 720 has a mold cavity 721 provided with a space for injecting resin into the inside. Further, in the respective inner faces of the mold cavity 711 of the first die 710 and the die cavity 721 of the second die 720, the faces for forming the lower surface 210a of the body 210 are the lower forming faces 714, 724, respectively, in FIG. The state of the first mold 710 and the second mold 720 shown in FIG. 9 is such that the lower forming surfaces 714, 724 are level (on the xy plane) and are placed upward (in the arrow z direction).

First, the second mold 720 will be described with reference to Fig. 8 . As shown in FIG. 8, the second mold 720 has a protruding portion 722 (hereinafter simply referred to as "second protruding portion 722") for forming the second screw passing portion 400 of the main body 210.

A flat surface 722a is formed at an upper end of the second protruding portion 722, and a tip end curved surface 722c having a semicircular shape is formed at a tip end of the second protruding portion 722. The tip end curved surface 722c is formed at a predetermined position along the z-axis to the arrow z' direction from the flat surface 722a formed from the upper end of the second protrusion portion 722.

Further, a lower end curved surface 722b having a semicircular shape is formed at the lower end of the second protruding portion 722. The lower end curved surface 722b is formed at a predetermined position from the base of the second protrusion 722 in the y-axis to the arrow y direction. Further, between the tip end curved surface 722c and the lower end curved surface 722b, an inclined surface 722d inclined at a predetermined angle (for example, 45 degrees) is formed.

In addition, as shown in FIG. 9, the first mold 710 has a protruding portion 712 (hereinafter simply referred to as "first protruding portion 712") for forming the first screw passing portion 300 of the main body 210.

A flat surface 712a is formed at a lower end of the first protruding portion 712, and an upper end curved surface 712b having a semicircular shape is formed at an upper end of the first protruding portion 712. The upper end curved surface 712b is formed at a predetermined position from the base of the first protrusion 712 in the y-axis to the arrow y' direction.

Further, a tip end curved surface 712c having a semicircular shape is formed at the tip end of the first protruding portion 712. The tip end curved surface 712c is formed at a predetermined position along the z-axis to the arrow z direction from the flat surface 712a formed from the lower end of the first protrusion portion 712. Further, between the upper end curved surface 712b and the tip end curved surface 712c, an inclined surface 712d inclined at a predetermined angle (45 degrees at this time) similar to the inclined surface 722d of the second protruding portion 722 is formed. Further, the inclined surface 712d and the inclined surface 722d have mutually corresponding shapes.

In addition, in order to clearly distinguish the tip end curved surface 712c formed in the first protruding portion 712 from the tip end curved surface 722c formed in the second protruding portion 722, the tip end curved surface 712c formed in the first protruding portion 712 may be expressed as "the first" The tip end curved surface 712c" expresses the tip end curved surface 722c formed in the second protruding portion 722 as "second tip curved surface 722c". Similarly, in order to clearly distinguish the inclined surface 712d formed in the first protruding portion 712 from the inclined surface 722d formed in the second protruding portion 722, it is possible to express the inclined surface 712d formed at the first protruding portion 712 as "the first inclined surface" hereinafter. 712d", the inclined surface 722d formed in the second protruding portion 722 is expressed as "second inclined surface 722d".

FIG. 10 is an enlarged cross-sectional view showing a relationship between the first protruding portion 712 and the second protruding portion 722 when the first mold 710 and the second mold 720 are disposed opposite to each other. In addition, FIG. 10 is an e-e cross-sectional view showing a state in which the first mold 710 and the second mold 720 are correctly disposed opposite each other in FIG. 8, and shows a state before the resin is injected. In addition, in FIG. 10, illustration of the lead frame 100A etc. of the resin sealing type semiconductor device 200A is abbreviate|omitted.

As shown in FIG. 10, in a state where the first mold 710 and the second mold 720 are disposed opposite each other, the first inclined surface 712d of the first protruding portion 712 and the second inclined surface 722d of the second protruding portion 722 are in close contact with each other. In addition, when the first mold 710 and the second mold 720 are disposed opposite each other, the second protrusion 722 disposed on the second mold 720 does not overlap with the die holder of the lead frame 100A (the first die pad 111 and the second The die pads 112) abut. This is because, as described with reference to FIG. 3, the space portion S is formed on the first die pad 111 and the second die pad 112.

In the state shown in FIG. 10, resin is injected into the space formed by the mold cavity 711 and the mold cavity 721, and after the injected resin is cured, the first mold 710 and the first mold are removed as shown in FIGS. 8 and 9. After the second mold 720, the body 210 as shown in Fig. 2(d) can be formed. Further, by separating the tie bar 130 and the auxiliary lever 140 by a punching die (not shown), the resin-sealed type semiconductor device 200A shown in Fig. 2(e) can be manufactured.

That is, the curved portion 311 of the first screw passing portion 300 can be formed by the upper end curved surface 712b of the first protruding portion 712 of the first die 710 (refer to FIGS. 4(b) and 5(a)), through the first protruding The first tip end curved surface 712c of the portion 712 can form the curved portion 321 of the first screw passing portion 300 (see FIGS. 4(b) and 5(d)). Further, the curved portion 411 of the second screw passing portion 400 can be formed by the lower end curved surface 722b of the second protruding portion 722 of the second mold 720 (refer to FIGS. 4(b) and 5(b)), and the second protruding portion is formed. The second tip end curved surface 722c of the portion 722 can form the curved portion 421 of the second screw passing portion 400 (see FIGS. 4(b) and 5(c)).

Further, when the resin in the resin sealing mold 700 is cured, when the first mold 710 and the second mold 720 are separated, the first mold 710 is shifted in the direction of the arrow y shown in FIGS. 8 and 9 and the second is The mold 720 is shifted in the direction of the arrow y' shown in FIGS. 8 and 9, and the first mold 710 and the second mold 720 can be separated.

Further, after the resin is cured, the first mold 710 and the second mold 720 can be separated because the resin sealing mold 700 has the structure shown in FIGS. 8 and 9. That is, when the first mold 710 and the second mold 720 are separated from each other, the first protruding portion 712 and the second protruding portion 722 have a shape that is not implicated for the cured resin. Further, after the first mold 710 and the second mold 720 are separated, when the main body 210 is taken out from the mold on one side, an extrusion pin is used.

Embodiment 2

FIG. 11 is an explanatory view showing a resin-sealed semiconductor device 200B according to the second embodiment. Fig. 11 (a) is a perspective view showing an appearance of a resin sealing type semiconductor device 200B according to a second embodiment, and Fig. 11 (b) is a perspective view showing a lead frame 100B of the resin sealing type semiconductor device 200B according to the second embodiment. Here, the lead frame 100B shown in FIG. 11(b) is in a state in which the tie bar (not shown) and the auxiliary lever (not shown) are removed from the lead frame 100B.

The resin-sealed semiconductor device 200B of the second embodiment has basically the same configuration as the resin-sealed semiconductor device 200A of the first embodiment, but the resin-sealed semiconductor device 200B is provided with two semiconductor elements of the semiconductor elements 151 and 154. The resin-sealed semiconductor device 200A of the first embodiment is different.

In other words, the resin-sealed semiconductor device 200B of the second embodiment is a resin-sealed semiconductor device 200B having two semiconductor elements (for example, diodes) 151 and 154, and has one first external lead as the first external lead. 121. Two second outer leads 123 and 124 as second outer leads, and a die pad 180. Further, as the joint connection terminal, the resin-sealed type semiconductor device 200B of the second embodiment further has a first joint connection terminal 171 and a second joint connection terminal 172.

One end of the first joint connection terminal 171 is connected to the semiconductor element 151 on one side, and the other end is connected to the connection portion 123a of the second outer lead 123 of the two second outer leads 123, 124, thereby connecting the semiconductor element 151 with The second outer lead 123 is electrically connected.

One end of the second joint connection terminal 172 is connected to the semiconductor element 154 on the other side, and the other end is connected to the connection portion 124a of the second outer lead 124 of the two second outer leads 123, 124, thereby the semiconductor element 154. Electrically connected to the second outer lead 124.

Further, in the resin-sealed semiconductor device 200B of the second embodiment, the first screw passing portion 300 and the second screw passing portion 400 are provided in the main body 210 similarly to the resin-sealed semiconductor device 200A of the first embodiment. However, in the resin-sealed type semiconductor device 200B of the second embodiment, the main body 210 is formed to protrude more laterally (in the direction of the x-axis) than the external lead (for example, the first outer lead 121) located at the end portion. The "extension portion" is provided with a first screw passing portion 300 and a second screw passing portion 400.

The configuration of the first screw passing portion 300 and the second screw passing portion 400 is the same as that of the resin sealed semiconductor device 200A of the first embodiment. Further, the position of the central axis Pa of the first insertion path Wa (not shown in FIG. 11 and not shown in FIG. 5) formed by the first screw passing portion 300 and the second screw passing portion 400 in the y-axis direction and the second insertion The position of the central axis Pb of the path Wb (not shown in FIG. 11 and referring to FIG. 5) in the z-axis direction is the same as that of the resin-sealed semiconductor device 200A of the first embodiment.

In the resin-sealed semiconductor device 200B of the second embodiment, the die pad 180 has a curved flat portion 180b by bending the end portion on the upper surface 210b side of the main body 210 of the mounting portion 180a by 90 degrees toward the front surface 210d side. Similarly to the resin-sealed semiconductor device 200A of the first embodiment, the curved tip end portion of the curved flat portion 180b is set at least closer to the main body 210 than the central axis Pa of the first insertion path Wa (see FIG. 5(c)). The front side of the 210d side. Therefore, the bending length k of the curved flat portion 180b is equal to or nearly equal to the height h of the projection portion of the die pad 180 in the z-axis direction, similarly to the resin-sealed semiconductor device 200A of the first embodiment.

FIG. 12 is a schematic view showing a state in which the heat dissipation fan 500 is attached to the resin-sealed semiconductor device 200B of the second embodiment. Fig. 12 (a) is a schematic view showing a state in which the heat radiating fan 500 is attached to the rear surface 210c of the main body 210, and Fig. 12 (b) is a view showing a state in which the heat radiating fan 500 is attached to the upper surface 210b of the main body 210.

As described above, in the resin-sealed semiconductor device 200B of the second embodiment, as shown in FIG. 12, the heat dissipation fan 500 can be selectively attached to the back surface 210c or the upper surface 210b of the main body 210. Thereby, the degree of freedom in mounting of the resin-sealed type semiconductor device 200B can be improved.

Further, when the heat radiating fan 500 is mounted on the upper surface 210b of the main body 210, since the heat radiating fan 500 faces the curved flat portion 180b with a large range, the same as when the heat radiating fan 500 is mounted on the rear surface 210c, High heat dissipation. This is because the bending length k of the curved flat portion 180b is equal to or nearly equal to the height of the projection portion of the die pad 180 in the z-axis direction, similarly to the resin-sealed type semiconductor device 200A of the first embodiment.

In the resin sealing mold used in the production of the resin-sealed semiconductor device 200B of the second embodiment, a mold having substantially the same structure as the resin sealing mold 700 used in the resin-sealed semiconductor device 200A of the first embodiment can be used. However, in the resin-sealed semiconductor device 200B of the second embodiment, since the positions of the first screw passage portion 300 and the second screw passage portion 400 are different from those of the resin-sealed type semiconductor device 200A of the first embodiment, the first mold 710 is The first protruding portion 712 and the second protruding portion 722 of the second mold 720 are different from those of the resin sealing mold 700 used in the production of the resin-sealed semiconductor device 200A of the first embodiment, although not shown in the drawings. position.

Embodiment 3

FIG. 13 is an explanatory view showing a resin-sealed semiconductor device 200C according to the third embodiment. Fig. 13 (a) is a perspective view showing an appearance of a resin sealed semiconductor device 200C according to a third embodiment, and Fig. 13 (b) is a perspective view showing a lead frame 100C used in the resin sealed semiconductor device 200C of the third embodiment. Here, the lead frame 100C shown in FIG. 13(b) is a state in which a tie bar (not shown) and an auxiliary lever (not shown) are removed from the lead frame 100C.

The resin-sealed semiconductor device 200C of the third embodiment basically has the same configuration as the resin-sealed semiconductor device 200A of the first embodiment. However, unlike the resin-sealed semiconductor device 200A of the first embodiment, the resin-sealed semiconductor device is different from the resin-sealed semiconductor device 200A of the first embodiment. 200C is a resin-sealed type semiconductor device 200C having a three-terminal type semiconductor element 190.

In other words, the resin-sealed semiconductor device 200C of the third embodiment is a resin-sealed semiconductor device having a three-terminal type semiconductor element 190 (for example, a POWER MOSFET, an IGBT, a thyristor or the like), and has one as the first external lead. The first outer lead 121, the two second outer leads 123 and 124 as the second outer lead, and the die pad 180. Further, as the joint connection terminal, the resin-sealed type semiconductor device 200C of the third embodiment further has a first joint connection terminal 171 and a second joint connection terminal 172.

One end of the first joint connection terminal 171 is connected to the first region of the semiconductor element 190, and the other end is connected to the connection portion 123a of the second outer conductor 123 on one of the two second outer conductors 123 and 124, thereby The first region of the semiconductor component 190 is electrically connected to the second outer conductor 123.

One end of the second joint connection terminal 172 is connected to a second region different from the first region of the semiconductor element 190, while the other end is connected to the second outer conductor 124 of the other of the two second outer conductors 123 and 124 The connection portion 124a is connected to electrically connect the second region of the semiconductor element 190 with the second external lead.

Further, in the resin-sealed semiconductor device 200C of the third embodiment, the first screw passing portion 300 and the second screw passing portion 400 are provided on the main body 210 in the same manner as the resin-sealed semiconductor device 200B of the second embodiment. In the resin-sealed semiconductor device 200C of the third embodiment, similarly to the resin-sealed semiconductor device 200B of the second embodiment, the main body 210 is more external than the external lead (for example, the first external lead 121) located at the end. In the lateral direction (in the direction of the x-axis), an extended "projecting portion" is formed, and the "projecting portion" is provided with a first screw passing portion 300 and a second screw passing portion 400.

In the resin-sealed semiconductor device 200C of the third embodiment, the die pad 180 also bends the end portion on the upper surface 210b side of the main body 210 of the package portion 180a by 90 degrees toward the front surface 210d side to form a curved flat portion 180b. Similarly to the resin-sealed semiconductor device 200A of the first embodiment, the curved tip end portion of the curved flat portion 180b is set at least closer to the main body 210 than the central axis Pa of the first insertion path Wa (see FIG. 5(c)). The position on the front side of the 210d side. Therefore, the bending length k of the curved flat portion 180b is equal to or nearly equal to the height h of the die pad 180 in the z-axis direction, similarly to the resin-sealed semiconductor device 200A of the first embodiment.

When the heat dissipation fan 500 is mounted on the resin-sealed semiconductor device 200C of the third embodiment, it can be similar to the resin-sealed semiconductor device 200B of the second embodiment (see FIG. 12), and the resin-sealed semiconductor of the second embodiment can be obtained. The same effect of the device 200B.

In the resin sealing mold used in the resin sealing type semiconductor device 200C of the third embodiment, a mold having substantially the same structure as the resin sealing mold 700 used in the resin sealing type semiconductor device 200A of the first embodiment can be used. In the resin-sealed semiconductor device 200C of the third embodiment, similarly to the resin-sealed semiconductor device 200B of the second embodiment, the positions of the first screw passing portion 300 and the second screw passing portion 400 are sealed with the resin of the first embodiment. The semiconductor device 200A is different, and thus the first protruding portion 712 of the first mold 710 and the second protruding portion 722 of the second mold 720 are provided in the resin-sealed semiconductor of the first embodiment, although not shown in the drawings. The resin sealing mold 700 used in the apparatus 200A has different positions.

Embodiment 4

FIG. 14 is an explanatory view showing a configuration of a resin-sealed semiconductor device 200D according to the fourth embodiment. (a) of FIG. 14 is a perspective view when the front surface 210d of the resin-sealed semiconductor device 200D is viewed from the lateral direction, and (b) is a perspective view when the rear surface 210c of the resin-sealed semiconductor device 200D is viewed from the obliquely downward direction. . Similarly to the resin-sealed semiconductor device 200A of the first embodiment, the resin-sealed semiconductor device 200D of the fourth embodiment is a single-row in-line bridge diode. In addition, FIG. 14 shows a state in which the heat dissipation fan 500 is not mounted.

Similarly to the resin-sealed semiconductor device 200A of the first embodiment, the resin-sealed semiconductor device 200D of the fourth embodiment has external wires (first external wires 121 and 122 and second external portions) of the main body 210 and the lead frame 100D (see FIG. 16). Wires 123, 124). Further, the side shape (the shape viewed in the x-axis direction) of the main body 210 is a square shape. In addition, the manufacturing process of the resin-sealed semiconductor device 200D of the fourth embodiment can be manufactured by the same manufacturing process (see FIG. 2) as the resin-sealed semiconductor device 200A of the first embodiment, and thus the description thereof will be omitted.

The resin-sealed semiconductor device 200D of the fourth embodiment differs from the resin-sealed semiconductor device 200A of the first embodiment in the configuration of the first screw passing portion 300 and the second screw passing portion 400. In the following description, the first screw passing portion and the second screw passing portion of the resin-sealed type semiconductor device 200D of the fourth embodiment are referred to as "first screw passing portion 300D" and "second screw passing portion 400D".

FIG. 15 is an explanatory view showing the first screw passing portion 300D and the second screw passing portion 400D of the resin-sealed type semiconductor device 200D of the fourth embodiment as seen from the respective directions. Fig. 15(a) is an explanatory view as seen from the front surface 210d of the main body 210, Fig. 15(b) is an explanatory view as seen from the rear surface 210c of the main body 210, and Fig. 15(c) is a view as seen from the upper surface 210b of the main body 210. FIG. 15(d) is an explanatory view showing the lower surface 210a of the main body 210.

In addition, in FIGS. 15(a) and 15(b), the upper surface 210b is indicated on the upper side in the drawing, and in FIGS. 15(c) and 15(d), the front surface 210d is indicated on the left side in the drawing. position.

As shown in FIGS. 14 and 15, the first screw passing portion 300D forms an opening groove 351 which is opened at a predetermined width m from the upper surface 210b to the lower surface 210a, and the opening groove 351 has a U shape on the upper surface 210b. The semicircular curved portion 352 and the opening portion 353 (see FIGS. 15(c) and 15(d)). 15(c) and 15(d), the opening 353 is indicated by an elongated elliptical dotted line frame, which indicates that the opening 353 is located in the broken line frame.

Further, the curved portion 352 is located between the end side of the front surface 210d side of the upper surface 210b of the main body 210 and the end side of the back surface 210c side, and the opening portion 353 is located at the side of the front surface 210d side of the upper surface 210b of the main body 210. Further, the curved portion 352 and the opening portion 353 are formed to the lower surface 210a of the main body 210 (see FIG. 15(a)), and the curved portion 352 is used as the first insertion path Wa.

Here, the center Pc of the curved portion 352 is located at a position of, for example, 1/2 of the dimension of the main body 210 in the y-axis direction in the resin-sealed type semiconductor device 200D of the fourth embodiment (between the front surface 210d and the rear surface 210c of the main body 210) For example, the intermediate position) is located at a position of, for example, 1/2 of the dimension of the body 210 in the x-axis direction. In addition, the center Pc of the curved portion 352 refers to the center Pc of the virtual circle when the curved portion 352 is considered as an imaginary circle extending toward the opposite side (the front surface 210d side). Further, the diameter of the imaginary circle forming the curved portion 352 is the same as the width m of the opening groove 351, and the diameter (hereinafter referred to as "diameter m") is such a degree that the screw 600 for fixing the heat dissipation fan 500 can pass.

Further, the second screw passage portion 400D is formed as a through hole 451 that penetrates the curved portion 352 of the opening groove 351 to the back surface 210c. The through hole 451 is used as the second insertion path Wb, and is observed when the front surface 210d or the back surface 210c is observed. Round (see Fig. 15 (a), Fig. 15 (b)). Further, the diameter of the through hole 451 is the same as the width m of the opening groove 351.

In the resin-sealed semiconductor device 200D of the fourth embodiment, the position of the central axis Pd of the through-hole 451 is, for example, 1/2 of the dimension of the main body 210 in the z-axis direction (the upper surface 210b of the main body 210 and the lower surface) For example, an intermediate position between 210a, at the same time, for example, a position of 1/2 of the dimension of the main body 210 in the x-axis direction (for example, an intermediate position between the both side faces 210e of the main body 210).

Further, the center line L5 (see FIG. 15(a)) in the z-axis direction (see FIG. 15(a)) and the second screw passing portion 400D passing through the center Pc (see FIG. 15(c)) of the curved portion 352 of the first screw passing portion 300D The center line L6 (see FIG. 15(c)) along the y-axis direction in which the central axis Pd of the through hole 451 (see FIG. 15(a)) coincides is orthogonal to each other. In addition, when the center Pc of the curved portion 352 and the central axis Pd of the through hole 451 are set to be orthogonal to the center line L5 passing through the center Pc of the curved portion 352 and the center line L6 that coincides with the central axis Pd of the through hole 451, Some positions can be slightly offset along the x-axis, y-axis, and z-axis, respectively.

The curved portion 352 of the first screw passage portion 300D of the main body 210 and the through hole 451 of the second screw passage portion 400D are set at such positions, and the position of the female screw portion 500a of the heat dissipation fan 500 is set to the above position ( Since the central portion of the cooling fan side mounting surface 510 is attached to the rear surface 210c or the upper surface 210b of the main body 210, the heat radiating fan 500 can be mounted in a stable state. This is because the screw fixing position when the heat dissipation fan 500 is attached to the back surface 210c or the upper surface 210b of the main body 210 is located substantially at the center of the back surface 210c or the upper surface 210b in the main body 210. Further, in the heat dissipation fan 500, it is located at the center of the heat dissipation fan side mounting surface 510.

Next, the lead frame 100D used in the resin-sealed semiconductor device 200D of the fourth embodiment will be described. The structure of the lead frame 100D is basically the same as that of the lead frame 100A used in the resin-sealed type semiconductor device 200A of the first embodiment, and therefore the same portions are denoted by the same reference numerals.

FIG. 16 is an explanatory view showing the first die pad 111 and the second die pad 112 of the lead frame 100D in the resin-sealed semiconductor device 200D of the fourth embodiment.

As shown in FIG. 16, the first die pad 111 is bent toward the front surface 210d side (y-axis direction) by the end portion on the upper surface 210b side of the main body 210 of the 111a of the mounting portions 111a and 111b on which the semiconductor elements 151 and 152 are mounted. At 90 degrees, a curved flat portion 111d is formed. Further, the second die pad 112 is bent by 90 degrees toward the front surface 210d side (y-axis direction) by the end portions on the upper surface 210b side of the main body 210 of the mounting portions 112a and 112b on which the semiconductor elements 153 and 154 are mounted, and is formed to be curved. Flat portions 112d and 112e. Further, it is assumed that the curved lengths of the curved flat portions 111d, 112d, and 112e are "k".

The curved length k, the curved tip end portions of the curved flat portions 111d, 112d, and 112e are located at least closer to the front surface 210d side of the main body 210 than the center Pc (see FIG. 15(c)) of the curved portion 352 of the first screw passing portion 300. Further, in the resin-sealed semiconductor device 200D of the fourth embodiment, the bending length k is equal to the height h (see FIG. 3) of the protruding portions of the first die pad 111 and the second die pad 112 in the z-axis direction. Almost the same.

Thus, since the bending length k is equal to or nearly equal to the height h (see FIG. 3) of the protruding portions of the first die pad 111 and the second die pad 112 in the z-axis direction, these die pads and semiconductors are used. When the element or the like is resin-sealed, the side surface shape of the main body 210 may be square.

Since the side surface shape of the main body 210 is a square shape, the upper surface 210b of the main body 210 can have the same area as the rear surface 210c of the main body 210 having a large area.

Further, in the lead frame 100A in the resin-sealed semiconductor device 200A of the first embodiment, the tips of the curved flat portions 112d and 112e of the second die pad 112 are connected by the second connecting portion 112c, but the resin of the fourth embodiment In the lead frame 100D of the hermetic semiconductor device 200D, the rear ends of the curved flat portions 112d and 112e of the second die pad 112 are connected by the second connecting portion 112c, and the tips of the curved flat portions 112d and 112e are isolated from each other. This is because, as shown in FIG. 14, the main body 210 of the resin-sealed type semiconductor device 200D of the fourth embodiment needs to form the opening groove 351 from the lower surface 210a to the upper surface 210b of the main body 210 in the front surface 210d of the main body 210.

Further, space portions S1 and S2 are formed on the die pad holders (the first die pad 111 and the second die pad 112) of the lead frame 100D. The space portions S1 and S2 are a first protruding portion 812 and a second mold which are provided on the first mold 810 for avoiding the die holder and the resin sealing mold 800 (see FIGS. 19 and 20) for forming the main body 210. The second protrusions 822 provided on the 820 abut.

When the main body 210 is formed by using the resin sealing mold 800 by forming the space portions S1 and S2, the die pad (the first die pad 111 and the second die pad 112) constituting the lead frame 100D may not The first protrusion 812 provided on the first mold 810 and the second protrusion 822 provided on the second mold 820 abut. Therefore, the die pad (the first die pad 111 and the second die pad 112) can be smoothly placed in the resin sealing mold 800.

FIG. 17 is an explanatory view showing that the heat dissipation fan 500 is attached to the back surface 210c of the main body 210 of the resin-sealed semiconductor device 200D of the fourth embodiment. 17(a) is a perspective view, and FIG. 17(b) is an enlarged cross-sectional view showing the relationship between the first screw passing portion 300D and the second screw passing portion 400D and the screw 600.

When the heat dissipation fan 500 is attached to the back surface 210c of the main body 210, as shown in FIG. 17, the through hole 451 is used as the second insertion path Wb, and the heat dissipation fan 500 is attached to the back surface 210c of the main body 210. In other words, in a state where the heat radiating fan 500 is in contact with the back surface 210c of the main body 210, the leading end of the screw 600 passes through the through hole 451 of the second screw passing portion 400D from the first screw passing portion 300D (refer to FIG. 17(b)). Thereafter, the front end portion of the screw 600 protrudes from the back surface 210c of the main body 210, and the tip end portion of the screw 600 is inserted into the female screw portion 500a of the heat dissipation fan 500 to be screwed, thereby fixing the heat dissipation fan 500. Thus, the heat dissipation fan 500 can be mounted on the back surface 210c of the main body 210.

When the heat dissipation fan 500 is mounted on the back surface 210c of the main body 210 as shown in FIG. 17, since the heat dissipation fan 500 is opposed to the first die pad 111 and the second die pad 112 with a large area, a high height can be obtained. heat radiation. This is because, as shown in FIG. 16, the first die pad 111 and the second die pad 112 located on the back surface 210c of the main body 210 have a large area, and the heat dissipation fan 500 passes through the first crystal having such a large area. The granular seat 111 and the second die holder 112 are disposed opposite to each other, so that a high heat dissipation effect can be obtained.

FIG. 18 is an explanatory view showing that the heat dissipation fan 500 is attached to the upper surface 210b of the resin-sealed semiconductor device 200D of the fourth embodiment. 18(a) is a perspective view, and FIG. 18(b) is an enlarged cross-sectional view showing the relationship between the first screw passing portion 300D and the second screw passing portion 400D and the screw 600.

When the heat radiating fan 500 is attached to the upper surface 210b of the main body 210, as shown in FIG. 18, the curved portion 352 of the opening groove 351 is used as the first insertion path Wa, and the heat radiating fan 500 is attached to the upper surface 210b of the main body 210. That is, in a state where the heat radiating fan 500 is placed on the upper surface 210b of the main body 210, the leading end portion of the screw 600 passes through the curved portion 352 of the opening groove 351 of the first screw passing portion 300D of the main body 210, and is then passed from the main body 210. The upper surface 210b protrudes, and the tip end portion of the screw 600 is inserted into the female screw portion 500a of the heat dissipation fan 500 and screwed to fix the heat dissipation fan 500. Thus, the heat dissipation fan 500 can be mounted on the upper surface 210b of the main body 210.

When the heat dissipation fan 500 is mounted on the upper surface 210b of the main body 210 as shown in FIG. 18, a high heat dissipation effect can be obtained as in the case where the heat dissipation fan 500 is attached to the back surface 210c of the main body 210. This is because when the heat radiating fan 500 is attached to the upper surface 210b of the main body 210, the curved flat portions 111d and 111e and the curved flat portions 112d and 112e have almost the same area as the loading portions 111a and 111b and the loading portions 112a and 112b, and the heat radiating fan The side mounting surface 510 is attached in a state of being opposed to the curved flat portions 111d and 111e and the curved flat portions 112d and 112e.

In other words, the curved length k of the curved flat portion 111d and the curved flat portions 112d and 112e is equal to or nearly equal to the height h of the first die pad 111 and the second die pad 112 in the z-axis direction (see FIG. 16). Since the side surface of the main body 210 has a square shape, the upper surface 210b of the main body 210 has the same area as the rear surface 210c of the main body 210 having a large area.

Thus, when the heat radiating fan 500 is mounted on the upper surface 210b of the main body 210 (refer to FIG. 18), the heat radiating fan 500 faces the curved flat portions 111d, 112d, and 112e with a large area, and thus the heat radiating fan 500 is mounted. Also in the case of the back surface 210c of the main body 210, a high heat dissipation effect can be obtained.

As described above, the resin sealing type semiconductor device 200D of the fourth embodiment can selectively attach the heat dissipation fan 500 to the back surface 210c or the upper surface 210b of the main body 210 (see FIGS. 17 and 18). Therefore, the mounting position of the heat radiating fan 500 can be easily operated when it is desired to be mounted on the upper surface 210b of the main body 210 in addition to the back surface 210c of the main body 210, so that the mounting of the resin sealing type semiconductor device 200D on the substrate can be improved. Installation freedom.

Next, a resin sealing mold 800 for manufacturing the resin-sealed type semiconductor device 200D of the fourth embodiment will be described.

19 and FIG. 20 are explanatory views showing a resin sealing mold 800 used in the production of the resin-sealed semiconductor device 200D of the fourth embodiment. 19 is an explanatory view showing a relationship between the resin-sealed semiconductor device 200D and the resin sealing mold 800 when the front surface 210d of the main body 210 is viewed from the oblique direction, and FIG. 20 is a resin seal when the rear surface 210c of the main body 210 is viewed from the oblique direction. An explanatory view of the relationship between the semiconductor device 200D and the resin sealing mold 800.

The resin sealing mold 800 is composed of a pair of molds (a first mold 810 and a second mold 820). The first mold 810 is a mold corresponding to the front surface 210d side when the main body 210 is divided into the front surface 210d side and the back surface 210c side, and the second mold 820 is divided into the front surface 210d side and the back surface 210c when the main body 210 is divided. A mold corresponding to the side of the back surface 210c. In addition, as shown in FIG. 19 and FIG. 20, the resin injected in the resin sealing mold 800 is cured, and the first mold 810 and the second mold 820 are removed.

Next, the first mold 810 and the second mold 820 will be described with reference to FIGS. 19 and 20. The first mold 810 has a mold cavity 811 provided with a space for injecting resin into the inside, and the second mold 820 has a mold cavity 821 provided with a space for injecting resin into the inside. In addition, in FIGS. 19 and 20, the surfaces of the mold cavity 811 of the first die 810 and the die cavity 821 of the second die 820 are respectively formed as the lower surface of the lower surface 210a of the main body 210. The molding surfaces 814 and 824, and the first mold 810 and the second mold 820 shown in the drawing are placed at the level of the lower molding surfaces 814 and 824 (in the xy plane) and upward (in the arrow z direction).

First, the second mold 820 will be described with reference to Fig. 19 . As shown in FIG. 19, the second mold 820 has a protruding portion 822 (hereinafter simply referred to as "second protruding portion 822") for forming the second screw passing portion 400D. The second projecting portion 822 is formed as a cylindrical projecting portion in which the front end surface 822a is circular and protrudes along the y-axis. In the following description, the second protrusion 822 may be expressed as a cylindrical protrusion 822.

In addition, as shown in FIG. 20, the first mold 810 has a protruding portion 812 (hereinafter simply referred to as "first protruding portion 812") for forming the first screw passing portion 300D. At the tip end of the first protrusion 812, a semicircular curved surface 812a is formed along the z-axis from the upper surface to the lower surface of the inside of the mold cavity 811. Further, on the curved surface 812a, a cylindrical projection 813 having a front end surface 813a corresponding to the shape of the front end surface 822a of the cylindrical projection 822 of the second mold 820 (hereinafter referred to as "cylinder front end surface 822a") is formed. (hereinafter referred to as "auxiliary protrusion 813").

The first mold 810 and the second mold 820 having such a structure are formed in a butt joint state, and the first end surface 813a of the auxiliary protrusion 813 of the curved surface 812a of the first mold 810 and the cylindrical protrusion 822 of the second mold 820 are formed. The cylindrical front end faces 822a are in close contact.

21 is an enlarged cross-sectional view showing the relationship between the first protruding portion 812 and the second protruding portion 822 when the first die 810 and the second die 820 are in the butted state. 21 is a cross-sectional view showing the f-f of the first mold 810 and the second mold 820 in the mated state in FIG. 19, showing a state before the resin is injected. In addition, in FIG. 21, illustration of the lead frame 100D etc. of the resin sealing type semiconductor device 200D is abbreviate|omitted.

As shown in FIG. 21, in a state where the first mold 810 and the second mold 820 are butted, the front end surface 813a and the second protrusion portion 822 of the auxiliary protrusion portion 813 of the curved surface 812a of the first protrusion portion 812 are formed (cylindrical shape). The cylindrical leading end faces 822a of the projections 822) are in close contact.

In addition, when the first mold 810 and the second mold 820 are in the butted state, the first protrusion 812 and the second protrusion 822 do not overlap with the die holder of the lead frame 100D (the first die pad 111 and the second die) Block 112) abuts. This is because, as described in the description of FIG. 16, the space portions S1 and S2 are formed on the first die pad 111 and the second die pad 112.

In the state shown in FIG. 21, resin is injected into the space formed by the mold cavity 811 and the mold cavity 821, and after the injected resin is cured, as shown in FIGS. 19 and 20, the first mold 810 and the second mold are formed. The body 210 is formed by separating 820. Further, the resin sealing type semiconductor device 200D can be manufactured by separating the tie bar 130 and the auxiliary lever 140 (both referring to FIG. 2) by a punching die (not shown).

In the main body 210 of the resin-sealed type semiconductor device 200D thus manufactured, the first screw passing portion 300D can be formed by the first protruding portion 812 of the first mold 810, and the curved surface 812a formed on the first protruding portion 812 can be formed. The upper auxiliary protruding portion 813 and the second protruding portion 822 (cylindrical protruding portion 822) of the second mold 820 can form the second screw passing portion 400D (through hole 451).

Further, when the resin in the resin sealing mold 800 is cured, when the first mold 810 and the second mold 820 are separated, the first mold 810 can be removed in the direction of the arrow y shown in FIGS. 19 and 20, and simultaneously pressed. The first mold 810 and the second mold 820 can be separated by removing the second mold 820 in the direction of the arrow y' shown in FIGS. 19 and 20.

Thus, after the resin is cured, the first mold 810 and the second mold 820 can be separated because the resin sealing mold 800 has the structure shown in FIGS. 19 and 20. That is, when the first mold 810 and the second mold 820 are separated in the direction in which they are respectively removed (the first mold 810 is in the direction of the arrow y and the second mold 820 is in the direction of the arrow y'), the first protruding portion 812 and the second portion The protrusion 822 has no shape to be implicated for the hardened resin. Further, after the first mold 810 and the second mold 820 are separated, when the main body 210 is taken out from the mold of one side, an extrusion pin is used.

In the fourth embodiment, the resin-sealed semiconductor device 200D having the same configuration as the resin-sealed semiconductor device 200A of the first embodiment is described as an example. However, the first screw-passing portion 300D is actually formed by changing. The position of the second screw passing portion 400D can also be applied to the resin sealed semiconductor device 200B of the second embodiment and the resin sealed semiconductor device 200C of the third embodiment.

Embodiment 5

FIG. 22 is an explanatory view showing a resin-sealed semiconductor device 200E according to the fifth embodiment. (a) of FIG. 22 is a perspective view when the back surface 210c of the resin-sealed semiconductor device 200E is viewed from an oblique direction, FIG. 22(b) is a perspective view of the heat dissipation fan 500, and FIG. 22(c) is a view of the main body 210. The state diagram of the heat sink fan 500 is installed on the upper 210b.

In the resin-sealed semiconductor device 200E of the fifth embodiment, it is possible to prevent misalignment when the heat dissipation fan 500 is attached to the main body 210. Further, in the resin-sealed semiconductor device 200E of the fifth embodiment, the screw passing portion (the first screw passing portion 300D and the second screw passing portion 400D) similar to the resin-sealed type semiconductor device 200D of the fourth embodiment is provided.

As shown in FIG. 22, in the resin-sealed semiconductor device 200E of the fifth embodiment, the misalignment-preventing joint portions 291 and 292 having an L-shaped cross section are provided at the upper end corner portion of the back surface 210c of the main body 210. On the side, projections 511 and 512 which are coupled to the respective misalignment preventing joint portions 291 and 292 are provided. In FIG. 22, the same constituent elements as those in FIG. 14 are denoted by the same reference numerals.

Further, the misalignment prevention coupling portions 291 and 292 provided on the main body 210 side and the projections 511 and 512 provided on the side of the heat dissipation fan 500 are provided so as to be attached to the rear surface 210c or the upper surface 210b of the main body 210. Shared location relationship. Further, in a state in which the misalignment preventing coupling portions 291 and 292 of the main body 210 are coupled to the projections 511 and 512 of the heat radiating fan 500, the center Pc of the curved portion 352 of the first screw passing portion 300D or the second screw passing portion 400D is penetrated. The central axis Pd of the hole 451 is necessarily set in advance so as to coincide with the central axis of the female screw portion 500a of the heat dissipation fan 500.

In such a configuration, when the heat dissipating fan 500 is mounted on the upper surface 210b of the main body 210, the heat dissipating fan 500 is placed on the main body 210, and the misalignment preventing portions 291, 292 of the main body 210 and the protrusion 511 of the heat dissipating fan 500 are provided. The 512 is combined and fixed by the screw 600. Further, when the heat dissipation fan 500 is attached to the back surface 210c of the main body 210, the projections 511 and 512 of the heat dissipation fan 500 are set to the upper surface 210b side of the main body 210, and the projections 511 and 512 of the heat dissipation fan 500 are combined with the misalignment prevention of the main body 210. The portions 291, 292 are combined and fixed by screws 600.

As described above, when the heat radiating fan 500 is attached to the main body 210, the projections 511 and 512 of the heat radiating fan 500 are coupled to the misalignment preventing portions 291 and 292 of the main body 210, so that the movement of the cooling fan 500 can be restricted. Thus, the heat dissipation fan 500 does not appear to be misaligned, and the installation state for the main body 210 can be maintained for a long time.

When the heat dissipating fan 500 is attached to the upper surface 210b of the main body 210, the first screw passing portion 300D becomes the opening groove 351, and the front surface 210d of the main body 210 becomes an opening, so that the screw 600 may be displaced on the front surface 210d side, and the cooling fan may be disposed. The 500 may also fall off from the main body 210. However, in the resin-sealed semiconductor device 200E of the fifth embodiment, the misalignment preventing coupling portions 291 and 292 provided on the main body 210 are combined with the projections 511 and 512 of the heat dissipation fan 500, so that the heat dissipation fan 500 does not appear in the structure. The front surface 210d of the main body 210 is displaced, and the heat dissipation fan 500 does not fall off from the main body 210, so that the heat dissipating fan 500 can be properly mounted for a long time.

In addition, the misalignment prevention coupling portions 291 and 292 provided on the main body 210 and the projections 511 and 512 provided on the heat dissipation fan 500 function to position the heat dissipation fan 500 when the heat dissipation fan 500 is mounted on the main body 210. Therefore, the operability at the time of installing the heat dissipation fan 500 can be improved.

In order to provide the misalignment preventing joint portions 291 and 292 shown in FIG. 22 on the back surface 210c of the main body 210, it is only necessary to form a projection portion corresponding to the misalignment preventing joint portions 291 and 292 on the second mold 820 (not shown). Just fine. At this time, since the joint portions 291 and 292 for preventing misalignment have an L-shaped cross section as shown in FIG. 22, the protruding portion may have a shape that is not implicated in the cured resin. Therefore, after the resin is hardened, the first mold 810 and the second mold 820 can be separated.

In addition, the shape of the joints 291 and 292 for preventing misalignment provided on the main body 210 is not limited to the L-shaped cross section shown in FIG. 22, but it is necessary to remove the resin sealing mold 800. The two molds 820 have no shape to be implicated for the hardened resin. Further, the number of the misalignment preventing coupling portions 291 and 292 is not limited to two.

Further, the position at which the joint portions 291 and 292 for preventing the misalignment are not limited to the position shown in FIG. However, in the main body 210 of the first screw passing portion 300D having the front surface 210d as an opening, when the heat dissipating fan 500 is mounted on the upper surface 210b of the main body 210, in order to prevent the heat dissipating fan 500 from being displaced on the front surface 210d side, the misalignment prevention position should be combined. The portions 291 and 292 are provided at positions where the heat dissipation fan 500 is prevented from being displaced on the front surface 210d side.

Further, in the fifth embodiment, when the heat radiating fan 500 is attached to the upper surface 210b of the main body 210 and to the rear surface 210c, the misalignment preventing joint portions 291 and 292 are shared, but the heat dissipating fan 500 is mounted. When the upper surface 210b of the main body 210 is attached to the rear surface 210c, dedicated misalignment preventing joint portions 291, 292 may be provided on the main body 210, respectively. For example, the misalignment preventing coupling portions 291 and 292 may be provided not only at the upper end corner portion of the rear surface 210c of the main body 210 but also at the lower end corner portion of the rear surface 210c of the main body 210.

In addition, the misalignment preventing joint portions 291, 292 formed on the main body 210, in FIG. 22, are illustrated as an example of being disposed as a recessed portion on the main body 210, but may not actually be a depressed portion but on the main body 210. Set to protrusion. At this time, on the heat radiating fan 500, it is necessary to provide a recessed portion that is combined with the projection.

In the fifth embodiment, the screw passing portion (the first screw passing portion 300D and the second screw passing portion 400D) similar to the resin sealing type semiconductor device 200D of the fourth embodiment is described as an example. Actually, it can be applied to the resin-sealed semiconductor device 200A of the first embodiment, the resin-sealed semiconductor device 200B of the second embodiment, and the resin-sealed semiconductor device 200C of the third embodiment. However, in the case of the resin-sealed semiconductor device 200B of the second embodiment and the resin-sealed semiconductor device 200C of the third embodiment, since the centers of the first screw passing portion 300 and the second screw passing portion 400 are not located at the center of the main body 210, Therefore, when the heat radiating fan 500 is mounted on the upper surface 210b and the back surface 210c of the main body 210, it is necessary to separately provide dedicated misalignment preventing joint portions 291 and 292.

The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the invention. For example, it may be the following modification.

(1) In the above embodiments, the first screw passing portion 300 and the second screw passing portion 400 (the first screw passing portion 300D and the second screw passing portion 400D in the fourth embodiment) are sealed by a resin. The mold 700 (the resin sealing mold 800 in the fourth embodiment) may be formed by a machine for drilling a drill or the like. For example, when a screw hole H for mounting a heat dissipating fan (see FIG. 24) is provided in the main body 930 by a resin sealing process, the resin sealing type semiconductor device 900 (see FIG. 24) can be opened by a drill or the like. The machine forms a screw hole in the vertical direction orthogonal to the screw hole H (the screw hole in the horizontal direction).

FIG. 23 is a schematic view showing a configuration of the resin sealing type semiconductor device 200F when a screw through hole as a screw passing portion is formed by a drilling machine such as a drill. As shown in FIG. 23, the resin sealing type semiconductor device 200F is provided with a screw through hole H1 in the horizontal direction of the first screw passing portion 300 of the first to third embodiments, for example, as the main body 210. For example, the second screw of the first embodiment to the third embodiment passes through the screw through hole H2 in the vertical direction of the portion 400. Further, in the fourth embodiment, the second screw passing portion 400D may be formed by an opening machine.

When the two screw via holes H1 and H2 are provided, for example, as in the conventional resin sealing type semiconductor device 900 (see FIG. 24), one screw via hole H has been provided by the resin sealing process (in the horizontal direction) In the case of the screw through hole H1), the screw through hole H2 in the vertical direction orthogonal to the screw through hole H1 in the horizontal direction is formed by a drill or the like. Further, in the resin sealing process, the screw through hole H1 in the horizontal direction and the screw through hole H2 in the vertical direction may be newly set by the drill or the like at the end of the resin sealing process.

(2) In the first embodiment and the fourth embodiment, the resin-sealed semiconductor device of the present invention is described as a resin-sealed semiconductor device using a single-row in-line bridge diode, and in the second embodiment described above The resin-sealed semiconductor device of the present invention is described using a resin-sealed semiconductor device having two semiconductor elements. In the third embodiment, a resin-sealed semiconductor device having a three-terminal type semiconductor device is used. Although the resin sealing type semiconductor device of the invention has been described, the present invention is not limited to these resin sealing type semiconductor devices, and can be applied to other resin sealing type semiconductor devices.

(3) In the above-described first and fourth embodiments, the resin-sealed semiconductor device of the present invention is described using a resin-sealed semiconductor device having four external wires, and the second and third embodiments described above In the resin-sealed semiconductor device of the present invention, a resin-sealed semiconductor device having three external wires is used. However, the present invention is not limited to these resin-sealed semiconductor devices, and may be applied to have 2 A resin-sealed type semiconductor device of strips or five or more external leads.

(4) In the above embodiments, the joint connection terminal is a joint connection terminal made of a plate-shaped metal member. However, the present invention is not limited thereto, and a wire joint connection terminal may be used as the joint connection. Terminal. At this time, the connection of the semiconductor element and the second external lead can be connected using a wire bonding method.

(5) In the resin sealing mold 700 described in the first embodiment, the shape of the first protruding portion 712 of the first die 710 and the second protruding portion 722 of the second die 720 is not limited to those of FIGS. 8 and 9 . The shape shown. That is, the shape of the first protruding portion 712 of the first mold 710 and the second protruding portion 722 of the second mold 720 may be formed on the main body 210 by the resin sealing to form the first screw passing portion 300 explained in the above embodiment. And the second screw passing portion 400, and when the first mold 710 and the second mold 720 are respectively removed in the direction in which the resin is cured, the shape is not implicated in the cured resin.

Similarly, in the resin sealing mold 800 described in the fourth embodiment, the shapes of the first protruding portion 812 of the first die 810 and the second protruding portion 822 of the second die 820 are not limited to those of FIGS. 19 and 20 . The shape shown.

100A, 100B, 100C, 100D. . . Lead frame

110. . . Semiconductor component mounting

111. . . First die holder

111d, 111e, 112d, 112e, 180b. . . Curved plane

112. . . Second die holder

121~124. . . External wire (first outer wire and second outer wire)

130. . . Tie

140. . . Auxiliary rod

151~154,190. . . Semiconductor component

200A, 200B, 200C, 200D, 200E, 200F. . . Resin sealed semiconductor device

210. . . main body

210a. . . Under the main body

210b. . . Top of the body

210c. . . Back of the main body

210d. . . Front of the main body

210e. . . Side of the body

291,292. . . Anti-dislocation joint

300,300D. . . First screw passage

310. . . First U-shaped space

311,321,352,411,421. . . Bending

320. . . Second U-shaped space

351. . . Open slot

400,400D. . . Second screw passage

410. . . Third U-shaped space

420. . . Fourth U-shaped space

451. . . Through hole

500. . . Cooling fan

500a. . . Female thread

510. . . Cooling fan side mounting surface

700,800. . . Resin sealing mold

710,810. . . First mold

711,721,811,821. . . Mold cavity

712,812. . . First protrusion

712a. . . Flat surface

712b. . . Upper curved surface

712c. . . Tip curved surface (first tip curved surface)

712d. . . Inclined surface (first inclined surface)

714,724,814,824. . . Forming surface below

720,820. . . Second mold

722,822. . . Second protrusion

722a. . . Flat surface

722b. . . Bottom curved surface

722c. . . Tip curved surface (second leading curved surface)

722d. . . Inclined surface (second inclined surface)

812a. . . Curved surface

813. . . Auxiliary protrusion

H1, H2. . . screw hole

Pa. . . The central axis of the first insertion path Wa

Pb. . . Central axis of the second insertion path Wb

Pc. . . Center of the bend

Pd. . . Central axis of the through hole

S, S1, S2. . . Space department

Wa. . . First insertion path

Wb. . . Second insertion path

1 is an explanatory view showing a configuration of a resin-sealed semiconductor device 200A according to the first embodiment;

FIG. 2 is an explanatory view showing a manufacturing process of the resin-sealed semiconductor device 200A according to the first embodiment;

3 is an enlarged view showing the first die pad 111 and the second die pad 112;

4 is an explanatory view showing the first screw passing portion 300 and the second screw passing portion 400;

FIG. 5 is an explanatory view showing the first screw passing portion 300 and the second screw passing portion 400 illustrated in FIG. 4 as seen from various directions;

FIG. 6 is an explanatory view showing that the heat dissipation fan 500 is attached to the back surface 210c of the main body 210;

FIG. 7 is an explanatory view showing that the heat dissipation fan 500 is mounted on the upper surface 210b of the main body 210;

FIG. 8 is an explanatory view showing a resin sealing mold 700 for manufacturing the resin-sealed semiconductor device 200A of the first embodiment;

FIG. 9 is an explanatory view showing a resin sealing mold 700 for manufacturing the resin-sealed semiconductor device 200A of the first embodiment;

FIG. 10 is an enlarged cross-sectional view showing the relationship between the first protruding portion 712 and the second protruding portion 722 in a state in which the first mold 710 and the second mold 720 are disposed opposite to each other;

FIG. 11 is an explanatory view showing a resin-sealed semiconductor device 200B according to the second embodiment;

FIG. 12 is an explanatory view showing a state in which the heat dissipation fan 500 is attached to the resin-sealed semiconductor device 200B of the second embodiment;

FIG. 13 is an explanatory view showing a resin-sealed semiconductor device 200C according to the third embodiment;

FIG. 14 is an explanatory view showing a configuration of a resin-sealed semiconductor device 200D according to the fourth embodiment;

15 is an explanatory view showing the first screw passing portion 300D and the second screw passing portion 400D of the resin-sealed type semiconductor device 200D of the fourth embodiment as seen from the respective directions;

FIG. 16 is an explanatory view showing the first die pad 111 and the second die pad 112 of the lead frame 100D of the resin-sealed semiconductor device 200D according to the fourth embodiment;

FIG. 17 is an explanatory view showing a state in which the heat dissipation fan 500 is attached to the back surface 210c of the main body 210 of the resin-sealed semiconductor device 200D of the fourth embodiment;

FIG. 18 is an explanatory view showing a state in which the heat dissipation fan 500 is attached to the upper surface 210b of the main body 210 of the resin-sealed semiconductor device 200D of the fourth embodiment;

FIG. 19 is an explanatory view showing a resin sealing mold 800 for manufacturing the resin-sealed semiconductor device 200D of the fourth embodiment;

FIG. 20 is an explanatory view showing a resin sealing mold 800 for manufacturing the resin-sealed semiconductor device 200D of the fourth embodiment;

21 is an enlarged cross-sectional view showing the relationship between the first protruding portion 812 and the second protruding portion 822 in a state where the first mold 810 and the second mold 820 are disposed opposite each other;

FIG. 22 is an explanatory view showing a resin-sealed semiconductor device 200E according to the fifth embodiment;

FIG. 23 is a schematic diagram showing a configuration of a resin-sealed type semiconductor device 200F when a screw via hole as a screw passing portion is formed by a drilling machine such as a drill;

FIG. 24 is a perspective view showing a conventional resin sealing type semiconductor device 900 disclosed in Non-Patent Document 1;

FIG. 25 is a schematic view showing a state in which the heat dissipation fan 980 is attached to the conventional resin-sealed semiconductor device 900 shown in FIG.

121~124. . . External wire (first outer wire and second outer wire)

200A. . . Resin sealed semiconductor device

210. . . main body

210a. . . Under the main body

210b. . . Top of the body

210d. . . Front of the main body

210e. . . Side of the body

300. . . First screw passage

400. . . Second screw passage

Claims (19)

A resin-sealed type semiconductor device having a body in which a semiconductor element and a semiconductor element mounting portion are resin-sealed, and an external wire extending from the body to the outside in a predetermined direction, when the external wire protrudes The surface of the main body is the lower surface of the main body, the reverse surface of which is the upper surface of the main body, and the surface on which the heat dissipating fan can be mounted between the lower surface and the upper surface is the back surface of the main body, and the reverse side thereof is the front surface of the main body. A first screw passing portion and a second screw passing portion for mounting the heat dissipating fan on the back surface or the upper surface are provided on different faces of the main body. The resin-sealed semiconductor device according to claim 1, wherein the semiconductor element mounting portion is formed of a plate-like die pad for mounting the semiconductor element, and the die pad has A loading portion for loading the semiconductor element and a curved flat portion formed by bending an end portion of the upper surface side of the loading portion toward the front surface side. The resin-sealed type semiconductor device according to claim 2, wherein the tip end portion of the curved flat portion is formed closer to the front surface than an intermediate portion between the front surface and the back surface Side position. The resin-sealed type semiconductor device according to any one of claims 1 to 3, wherein the main body is provided with a misalignment preventing joint for preventing a position at which the heat radiating fan is displaced. The resin-sealed semiconductor according to any one of claims 1 to 3 The device is characterized in that a first insertion path and a second insertion path for passing through the screw are formed by the first screw passing portion and the second screw passing portion, the first insertion path and the The second plug-in path is set and handed over. The resin-sealed semiconductor device according to any one of claims 1 to 3, wherein the first screw passing portion and the second screw passing portion are formed by forming the first screw It is formed by a resin sealing mold composed of a first mold having a first protruding portion and a second mold having a second protruding portion for forming the second screw passing portion. The resin-sealed type semiconductor device according to claim 6, wherein the first screw passing portion is formed by a first U-shaped space and a second U-shaped space sharing the space with the first U-shaped space. The first U-shaped space has a U-shape having a semicircular curved portion and an opening portion on the front surface, and the curved portion is located at an end side of the upper surface side of the front surface Between the end sides of the lower side, and at the same time, the opening portion is located at an end side of the lower surface side of the front surface, and the first U-shaped space is formed to a predetermined position facing the back surface, the first The U-shaped space has a U-shape having a semicircular curved portion and an opening portion on the lower surface, and the curved portion is located on the front side end side and the back side end side of the lower surface Meanwhile, at the same time, the opening portion is located at an end side of the lower surface of the lower surface, the second U-shaped space is formed to a predetermined position facing the upper surface, and the second screw passage portion is formed by a third portion a U-shaped space and a fourth U-shaped space sharing the space with the third U-shaped space, The third U-shaped space has a semi-circular curved portion on the back surface and a U-shape of the opening portion between the end side of the upper surface side of the back surface and the end side of the lower surface side, and the opening portion is located on the upper surface side of the back surface The third U-shaped space is formed at a predetermined position facing the front surface, and the fourth U-shaped space has a U-shape having a semicircular curved portion and an opening portion on the upper surface. The curved portion is located between the end side of the upper front side and the end side of the back side, and at the same time, the opening portion is located at an end side of the upper side of the upper side, the fourth U a word space is formed to a predetermined position facing the lower surface, the first screw passage portion and the second screw passage portion share a space, and when the upper surface or the lower surface is observed, the second U word The curved portion of the space and the curved portion of the fourth U-shaped space form the first insertion path that is circular, and when the front surface or the back surface is observed, the first U-shaped space The curved portion and the curved portion of the third U-shaped space form the second insertion path that is circular The resin-sealed type semiconductor device according to claim 7, wherein the screw is bent by the first U-shaped space when the heat dissipating fan is attached to the back surface. Positioning with a curved portion of the third U-shaped space, the screw is bent by the second U-shaped space and the fourth U when the heat dissipating fan is mounted on the upper surface The curved portion of the word space is positioned. The resin-sealed type semiconductor device according to claim 6, wherein the first screw passage portion is formed as an open groove by grooving the front surface from the upper surface to the lower surface. The open groove has a U-shape having a semicircular curved portion and an opening portion on the upper surface, and the curved portion is located on the upper surface Between the end side of the front side and the end side of the back side, and at the same time, the opening is located at the front side of the upper surface, and the curved portion and the opening are formed to In the front surface, the curved portion is used as the first insertion path, and the second screw passage portion is formed to penetrate a through hole from the curved surface to the back surface, and the through hole is used as the second The insertion path is used to be circular when observing the front side or the back side. The resin-sealed semiconductor device according to any one of claims 1 to 3, wherein at least one of the first screw passing portion and the second screw passing portion passes The opening is formed on the body by a machine. A resin sealing mold for manufacturing a resin-sealed semiconductor device, characterized in that the resin-sealed semiconductor device has a body that seals a semiconductor element and a semiconductor element mounting portion by a resin, and from the body to the outside An external wire extending in a predetermined direction, wherein the outer wire protrudes from a lower surface of the main body, the reverse surface thereof is an upper surface of the main body, and a surface on which a heat dissipating fan can be mounted between the lower surface and the upper surface is When the back surface of the main body and the reverse side thereof are the front surface of the main body, the first screw passing portion and the second screw passing portion for mounting the heat dissipating fan on the back surface or the upper surface are provided in the main body In the different surface, the resin sealing mold has a first mold corresponding to the front side and a second corresponding to the back side when the main body is divided into the front side and the back side a mold, a mold cavity of the first mold is provided with a first protrusion for forming the first screw passage portion, and a mold cavity of the second mold is provided for forming the mold Two screws through the second projection portion, the first portion and the second protruding portion protruding in a mold to the first mold The first screw passing portion and the second screw may be formed on the main body when the opening is formed in the space formed by the opening surface of the cavity facing the opening of the mold cavity of the second mold to form the main body. Pass the shape of the part. The resin sealing mold according to claim 11, wherein the main body is formed in each of the inner surfaces of the mold cavity of the first mold and the mold cavity of the second mold. The lower surface of the mold is the lower molding surface, and the opening surface of the mold cavity of the first mold is placed in a state where the lower molding surface is leveled and the first mold and the second mold are placed upward. When the opening surface of the mold cavity of the second mold is respectively observed inside the mold cavity of the first mold and the inside of the mold cavity of the second mold, the left-right direction is the x-axis, the front-rear direction is the y-axis, and the upper and lower sides are The direction is a z-axis, the first protrusion is formed as a flat surface at a lower end of the first protrusion, and at a tip end of the first protrusion, from a lower end of the first protrusion along a z-axis to a predetermined position Forming a semi-circular first leading end curved surface, and at an upper end of the first protruding portion, a semi-circular upper end curved surface is formed from a base portion of the first protruding portion along a y-axis to a predetermined position At the first tip end curved surface and the Between the upper end curved faces, a first inclined surface inclined at a predetermined angle is formed, the second protruding portion is formed with a flat surface at an upper end of the second protruding portion, and at the apex of the second protruding portion, at the The upper end side of the second protrusion is formed along the z-axis to a predetermined position, and is formed with a semi-circular second tip end curved surface at a lower end of the second protrusion portion at a y-axis from a base portion of the second protrusion portion a predetermined lower end curved surface is formed, and between the second front end curved surface and the lower end curved surface, a second slope having a shape corresponding to the first inclined surface is formed surface. The resin sealing mold according to claim 11, wherein the main body is formed in each of the inner surfaces of the mold cavity of the first mold and the mold cavity of the second mold. The lower surface is the lower forming surface, The opening surface of the mold cavity of the first mold and the opening surface of the mold cavity of the second mold in a state where the lower molding surface is horizontal and the first mold and the second mold are placed upward When the inside of the mold cavity of the first mold and the inside of the mold cavity of the second mold are respectively observed, the left and right directions are the x-axis, the front-rear direction is the y-axis, and the vertical direction is the z-axis, and the first protrusion is At a tip end of the first protrusion, a semicircular curved surface is formed from an upper end to a lower end of the inner portion of the first mold along the z-axis, and the second protrusion is formed along the y-axis direction and is oriented a cylindrical protrusion protruding from a curved surface formed by the tip end of the first protrusion. The resin sealing mold according to claim 11, wherein a protruding portion is provided on a curved surface formed at a tip end of the first protruding portion in a y-axis direction, the protruding portion having the same The cylindrical leading end face of the cylindrical projection corresponds to the leading end face of the shape. The resin sealing mold according to any one of the above-mentioned claims, wherein the second mold has a card-forming portion that forms a joint for preventing misalignment, and the joint for preventing misalignment In a state where the heat dissipation fan is mounted on the main body, the position of the heat dissipation fan is prevented from being displaced. A method of manufacturing a resin-sealed semiconductor device for manufacturing a resin-sealed semiconductor device, characterized in that the resin-sealed semiconductor device has a body in which a semiconductor element and a semiconductor element mounting portion are sealed by a resin, and a body from the body An external wire extending outward in a predetermined direction, wherein a surface of the outer wire protruding from the lower surface of the main body, a reverse surface thereof is an upper surface of the main body, and a heat dissipating fan may be installed between the lower surface and the upper surface When the surface is the back surface of the main body and the reverse side is the front surface of the main body, the rear surface or the upper surface of the main body is respectively provided with the heat dissipation fan installed therein The first screw passing portion and the second screw passing portion of the main body, the method for manufacturing a resin sealing type semiconductor device, comprising a resin sealing mold preparation process for preparing a resin sealing mold, wherein the mold has a body for dividing the main body In the case of the front side and the back side, a first mold corresponding to the front side main body and a second mold corresponding to the back side main body are provided on the mold cavity of the first mold a first protrusion forming the first screw passing portion, and a second protrusion portion for forming the second screw passing portion, the first protrusion portion and the The second protruding portion is formed by injecting a resin into a space formed by the opening face of the mold cavity of the first mold facing the opening of the mold cavity of the second mold to form the main body. Forming a shape of the first screw passing portion and the second screw passing portion; mounting a semiconductor element mounting work on the semiconductor element mounting portion; and including the semiconductor element The predetermined range of the semiconductor element mounting portion is covered with the resin sealing mold, and then the resin is injected into the resin sealing mold to seal the predetermined range of the semiconductor element and the semiconductor element mounting portion with a resin-sealed resin. engineering. A lead frame for a resin-sealed type semiconductor device, characterized in that the resin-sealed type semiconductor device has a body in which a semiconductor element and a semiconductor element mounting portion are sealed by a resin, and a predetermined direction from the body to the outside An external conductor extending, wherein the surface on which the outer conductor protrudes is the lower surface of the main body, the opposite surface of which is the upper surface of the main body, and the surface on which the heat dissipation fan can be mounted is the main body When the back surface and the reverse side thereof are the front surface of the main body, the back surface or the upper surface of the main body is respectively provided with a first screw passing portion and a second screw passing portion for mounting the heat dissipating fan on the main body. The lead frame having a plate-shaped die pad mounting the semiconductor element and the external lead, the die pad having a loading portion for loading the semiconductor component, and by passing the upper surface of the loading portion The end portion of the side is bent toward the front side to form a curved flat portion. The lead frame according to claim 17, wherein the tip end of the curved flat portion is formed at a position closer to the front side than an intermediate position between the front surface and the back surface. A lead frame for manufacturing a resin-sealed semiconductor device together with a mold for sealing a resin, characterized in that the resin-sealed semiconductor device has a body in which a semiconductor element and a semiconductor element mounting portion are sealed by a resin, and An external wire extending outward from the main body in a predetermined direction, wherein a surface on which the outer wire protrudes is a lower surface of the main body, a reverse surface thereof is an upper surface of the main body, and a heat dissipation can be installed between the lower surface and the upper surface When the surface of the fan is the back surface of the main body and the reverse side thereof is the front surface of the main body, the back surface or the upper surface of the main body is respectively provided with a first screw passing portion for mounting the heat dissipating fan on the main body And a second screw passing portion, wherein the resin sealing mold has a first mold corresponding to the front side body and the back side when the main body is divided into the front side and the back side a second mold corresponding to the main body, the mold cavity of the first mold is provided with a first protrusion for forming the first screw passage portion, and the mold of the second mold a second protruding portion for forming the second screw passing portion is provided on the cavity, the first protruding portion and the second protruding portion are on an opening surface of the mold cavity of the first mold When the resin is formed in the space formed by the opening of the mold cavity of the two molds to form the main body, the shape of the first screw passing portion and the second screw passing portion may be formed on the main body. a lead frame having a plate-like die pad mounting semiconductor element and the outer portion a wire having a space portion formed on the die pad for avoiding the first protrusion and the second mold provided on a mold cavity of the first mold of the resin sealing mold At least one of the second protrusions provided on the mold cavity abuts.