TWI494468B - - Google Patents
Info
- Publication number
- TWI494468B TWI494468B TW101151255A TW101151255A TWI494468B TW I494468 B TWI494468 B TW I494468B TW 101151255 A TW101151255 A TW 101151255A TW 101151255 A TW101151255 A TW 101151255A TW I494468 B TWI494468 B TW I494468B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210153374.8A CN103422072B (en) | 2012-05-16 | 2012-05-16 | A kind of mounting table for vacuum treatment installation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201348509A TW201348509A (en) | 2013-12-01 |
| TWI494468B true TWI494468B (en) | 2015-08-01 |
Family
ID=49647449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101151255A TW201348509A (en) | 2012-05-16 | 2012-12-28 | Mounting table used in vacuum treatment device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103422072B (en) |
| TW (1) | TW201348509A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5639343A (en) * | 1995-12-13 | 1997-06-17 | Watkins-Johnson Company | Method of characterizing group III-V epitaxial semiconductor wafers incorporating an etch stop layer |
| US6066204A (en) * | 1997-01-08 | 2000-05-23 | Bandwidth Semiconductor, Llc | High pressure MOCVD reactor system |
| US20030008070A1 (en) * | 2001-06-12 | 2003-01-09 | Applied Materials,Inc | Low-resistivity tungsten from high-pressure chemical vapor deposition using metal-organic precursor |
| TW200933797A (en) * | 2007-12-06 | 2009-08-01 | Ulvac Inc | Vacuum processing apparatus and substrate processing method |
| US8043471B2 (en) * | 2006-03-31 | 2011-10-25 | Tokyo Electron Limited | Plasma processing apparatus |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7102871B2 (en) * | 2003-10-29 | 2006-09-05 | Taiwan Semiconductor Manufacturing Co,, Ltd. | Electrostatic chuck assembly having disassembling device |
| JP4702799B2 (en) * | 2006-03-17 | 2011-06-15 | ルネサスエレクトロニクス株式会社 | Bolt and semiconductor manufacturing equipment |
| JP4905375B2 (en) * | 2008-01-30 | 2012-03-28 | 住友電気工業株式会社 | Support structure for wafer holder |
| KR20110121370A (en) * | 2010-04-30 | 2011-11-07 | 엘에스메카피온 주식회사 | Connecting means for spin chuck and shaft of spin motor |
-
2012
- 2012-05-16 CN CN201210153374.8A patent/CN103422072B/en active Active
- 2012-12-28 TW TW101151255A patent/TW201348509A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5639343A (en) * | 1995-12-13 | 1997-06-17 | Watkins-Johnson Company | Method of characterizing group III-V epitaxial semiconductor wafers incorporating an etch stop layer |
| US6066204A (en) * | 1997-01-08 | 2000-05-23 | Bandwidth Semiconductor, Llc | High pressure MOCVD reactor system |
| US20030008070A1 (en) * | 2001-06-12 | 2003-01-09 | Applied Materials,Inc | Low-resistivity tungsten from high-pressure chemical vapor deposition using metal-organic precursor |
| US8043471B2 (en) * | 2006-03-31 | 2011-10-25 | Tokyo Electron Limited | Plasma processing apparatus |
| TW200933797A (en) * | 2007-12-06 | 2009-08-01 | Ulvac Inc | Vacuum processing apparatus and substrate processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103422072A (en) | 2013-12-04 |
| TW201348509A (en) | 2013-12-01 |
| CN103422072B (en) | 2015-09-02 |