TWI493254B - Fabricating method of thick film on large area substrate, thick film structure thereof, and back light unit and lcd using the same - Google Patents
Fabricating method of thick film on large area substrate, thick film structure thereof, and back light unit and lcd using the same Download PDFInfo
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Description
本發明係關於一種在一大面積基板上塗覆一厚膜之方法及一厚膜;一種背光單元以去除一導光板即使用該厚膜來確保其光效率;以及使用該背光單元之一LCD。 The present invention relates to a method of coating a thick film on a large area substrate and a thick film; a backlight unit to remove a light guide plate to use the thick film to ensure its light efficiency; and an LCD using the backlight unit.
一般而言,一液晶顯示器(liquid crystal display,LCD)係為一可根據影像資訊單獨地提供一資料訊號給排列於矩陣陣列中之畫素,並調整該些畫素之光學透射率(optical transmittance)以形成一期望影像的裝置。因為LCD本身並不發光,故一背光單元係被裝設於該LCD之一後表面,以顯示一影像。 Generally, a liquid crystal display (LCD) is a pixel that can separately provide a data signal according to image information to pixels arranged in a matrix array, and adjust optical transmittance of the pixels (optical transmittance) ) to form a desired image. Since the LCD itself does not emit light, a backlight unit is mounted on the rear surface of one of the LCDs to display an image.
參閱圖1,一背光單元1係形成,使一平面導光板30被設置在一基板20之上,而複數個側光式發光二極體10(side view LED)(僅繪示其中一者)係被排列於導光板30之一側。 Referring to FIG. 1, a backlight unit 1 is formed such that a planar light guide plate 30 is disposed on a substrate 20, and a plurality of side view LEDs (only one of which is shown) It is arranged on one side of the light guide plate 30.
在LED 10中,入射於導光板30之光線L係由一微反射結構(fine reflection pattern)或形成於導光板30之一底面上之一反射板40反射至一上部分,且係自導光板30發出以提供背光給位於下個導光板30之上方的一LCD面板50。如圖2所示,該背光單元可形成於一結構中,其係進一步提供有複數個光學片如一擴散片31(diffusion sheet);稜鏡片32、33(prism sheets); sheets);以及一保護片34等等於導光板30與LCD面板50之間。 In the LED 10, the light L incident on the light guide plate 30 is reflected by a fine reflection pattern or a reflection plate 40 formed on one of the bottom surfaces of the light guide plate 30 to an upper portion, and is a self-light guide plate. 30 is emitted to provide backlighting to an LCD panel 50 located above the next light guide plate 30. As shown in FIG. 2, the backlight unit can be formed in a structure, which is further provided with a plurality of optical sheets such as a diffusion sheet 31; prism sheets 32, 33 (prism sheets); And a protective sheet 34 and the like between the light guide plate 30 and the LCD panel 50.
該背光單元係用以從該LCD之背面均勻地照明該LCD(該LCD係無法自行發光者)以顯示一影像,且進一步地,該導光板係為可均勻地將光自一光源(如發光二極體)傳送至該LCD之一整體表面的一種塑膠模製鏡片,並係具有提供亮度與均勻照明於該背光單元之功能。 The backlight unit is configured to uniformly illuminate the LCD from the back side of the LCD (the LCD is not self-illuminating) to display an image, and further, the light guide plate is configured to uniformly light the light from a light source (eg, light) A plastic molded lens that is delivered to an integral surface of one of the LCDs and that provides brightness and uniform illumination to the backlight unit.
因此,該導光板係用作為背光單元之一必要組成部件;然而,因為導光板之厚度的關係,其整體產品很難達到輕薄的要求,且當背光單元為大面積時,影像品質可能會下降。 Therefore, the light guide plate is used as an essential component of the backlight unit; however, because of the thickness of the light guide plate, the overall product is difficult to achieve the thin and light requirements, and when the backlight unit has a large area, the image quality may be degraded. .
本發明係欲解決上述之缺陷,且本發明之一方面係關於提供一種背光單元,其係由去除在傳統背光單元中係必須組成元件之一導光板,並使用一膜型樹脂層(film type resin layer)來導光,藉此減少光源的數量。同時,根據本發明之背光單元之結構,藉由提供一硬塗覆樹脂層於該樹脂層之上,可提高各層間的耦接力並改善耐久性;且進一步地,該背光單元之一整體厚度係被縮小,進而增加產品設計之自由度。尤其,本發明之一方面係在於一技術,其係可實施用於該背光單元之一多層樹脂,其中塗層之均勻度及可靠度係靠著在塗覆時施用一雙塗覆方法於彼此不同之方向 來改善。 The present invention is to solve the above-mentioned drawbacks, and an aspect of the present invention relates to providing a backlight unit which is obtained by removing a light guide plate which is a constituent element in a conventional backlight unit, and using a film type resin layer (film type) Resin layer) to guide light, thereby reducing the number of light sources. Meanwhile, according to the structure of the backlight unit of the present invention, by providing a hard coating resin layer on the resin layer, the coupling force between the layers can be improved and the durability can be improved; and further, the overall thickness of one of the backlight units The system is shrunk, which increases the freedom of product design. In particular, an aspect of the invention resides in a technique for implementing a multilayer resin for the backlight unit wherein the uniformity and reliability of the coating is applied by applying a double coating method during coating Different directions To improve.
根據本發明一實施例,提供一種可改善形成一厚膜之一樹脂的厚度均勻度,以促進與一上部板(upper plate)之黏著;且可將該厚膜實施為平坦者,以改善產品之可靠度。 According to an embodiment of the present invention, there is provided a method for improving the thickness uniformity of a resin forming a thick film to promote adhesion to an upper plate; and the thick film can be implemented as a flat to improve the product. Reliability.
另外,根據本發明一實施例,提供一種背光單元,其中在傳統背光單元中為必須組成元件之一導光板係被去除,且係使用具有上述雙層結構之一樹脂層,據此可顯著地將該背光單元之厚度減小。同時,藉由印刷一硬塗覆樹脂層於該樹脂層之一上表面上,該樹脂層可被保護,且各結構中的黏著力可被改善。 In addition, according to an embodiment of the present invention, there is provided a backlight unit in which a light guide plate is removed in a conventional backlight unit, and a resin layer having the above two-layer structure is used, whereby The thickness of the backlight unit is reduced. Meanwhile, by printing a hard coat resin layer on the upper surface of one of the resin layers, the resin layer can be protected, and the adhesion in each structure can be improved.
根據本發明一實施例,提供一種在大面積基板上的厚膜,其中,當塗覆一厚膜於大面積基板上時,塗層之均勻度及可靠度係藉由施用一雙塗覆方法於彼此不同之方向來改善。 According to an embodiment of the present invention, there is provided a thick film on a large-area substrate, wherein when coating a thick film on a large-area substrate, uniformity and reliability of the coating are applied by applying a double coating method Improve in different directions.
尤其,係使用上述之雙塗覆方法中所實施之一多層樹脂來去除在傳統背光單元中為必須組成元件之一導光板,且可形成使用一膜型樹脂層來導光之一結構,以使光源之數量可被減少。另外,該硬塗覆樹脂層可被提供於該樹脂層之上,以增強各層間的耦接力並改善耐久性;並且,該背光單元之一整體厚度係被縮小,進而增加產品設計之自由度。 In particular, a multilayer resin which is implemented in the above double coating method is used to remove a light guide plate which is a constituent element in a conventional backlight unit, and a structure in which a film type resin layer is used to guide light can be formed. So that the number of light sources can be reduced. In addition, the hard coating resin layer may be provided on the resin layer to enhance the coupling force between the layers and improve durability; and, the overall thickness of one of the backlight units is reduced, thereby increasing the degree of freedom in product design. .
特別是,一側發光式LED可被直接地向下裝設,以將光源之數量顯著地減少,並達到光學特性;而包含一反射微結構於該樹脂層之上的一反射膜以及一擴散片係被提供,以提升穩定的發光特性以及光均勻度光學特性。 In particular, one side of the LED can be directly mounted downward to significantly reduce the number of light sources and achieve optical characteristics; and a reflective film comprising a reflective microstructure on the resin layer and a diffusion Sheets are provided to enhance stable luminescent properties and optical uniformity optical properties.
上述及其他本發明實施例之方面、功效、與優點將配合附圖示說明之。 The aspects, functions, and advantages of the above and other embodiments of the invention will be described in conjunction with the drawings.
在以下參考所附圖示,將詳細說明本發明之實施例。相同參考的數字將會指定到圖示解說中的相同元件,重複解說的部分將予省略。應理解的是,「第一」、「第二」以及類似的用詞在此是用來描述不同的元件;這些元件並不限制於此些用詞。這些用詞係用以區分各項元件者。 Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The same reference numerals will be assigned to the same elements in the illustrated explanation, and the repeated explanation will be omitted. It should be understood that the terms "first," "second," and the like are used herein to describe various elements; these elements are not limited to such terms. These terms are used to distinguish between components.
1.第一實施例 1. First embodiment
在圖3中,係繪示有將一樹脂層(厚膜)形成於一習知之大面積基板上之一流程。如圖3所示,該樹脂層係可大致形成為有一金屬模具M(metal jig)形成於一基底基板S(base substrate)之上,且一厚膜塗覆材料係被塗覆於該金屬模具M之內表面上,然後金屬模具M係被去除。 In Fig. 3, there is shown a flow of forming a resin layer (thick film) on a conventional large-area substrate. As shown in FIG. 3, the resin layer may be formed substantially as a metal jig formed on a base substrate S, and a thick film coating material is applied to the metal mold. On the inner surface of M, the metal mold M is then removed.
然而,如圖3(b)(沿圖3(a)中A-A’線所繪示)所示,因塗 覆材料本身之表面張力之故,在將厚膜塗覆材料C塗覆於金屬模具M之內表面上時,會形成一固定間隙G(constant gap),進而因該間隙的產生而降低塗覆的均勻度,並降低一產品之可靠度如內部結構之突起等。 However, as shown in Fig. 3(b) (shown along the line A-A' in Fig. 3(a)), The surface tension of the covering material itself is such that when the thick film coating material C is applied to the inner surface of the metal mold M, a constant gap G is formed, and the coating is lowered due to the generation of the gap. Uniformity and reduce the reliability of a product such as protrusions of internal structures.
因此,根據本發明一實施例,被用於大面積基板上之一樹脂層(厚膜)可由施用圖4中所示之方法來形成。 Therefore, according to an embodiment of the present invention, a resin layer (thick film) applied to a large-area substrate can be formed by applying the method shown in FIG.
參閱圖4,根據本發明實施例之一製造方法係可包括:一第一步驟,其係將一第一樹脂以一基底基板110之一第一方向X塗覆於基底基板110之上,藉此形成一第一樹脂層120;以及一第二步驟,其係將一第二樹脂層130以一第二方向Y塗覆於第一樹脂層120之一上表面上(S1至S3)。 Referring to FIG. 4, a manufacturing method according to an embodiment of the present invention may include a first step of coating a first resin on a base substrate 110 in a first direction X of a base substrate 110. This forms a first resin layer 120; and a second step of applying a second resin layer 130 to the upper surface of one of the first resin layers 120 in a second direction Y (S1 to S3).
特別是,在第一步驟中,基底基板110在第一方向X可塗覆有該第一樹脂,然後再在與第一方向X為反向之第二方向Y塗覆一第二樹脂。 In particular, in the first step, the base substrate 110 may be coated with the first resin in the first direction X, and then coated with a second resin in the second direction Y opposite to the first direction X.
尤其,在此情況下,該第一樹脂與該第二樹脂可由相同或不同之材料製成。 In particular, in this case, the first resin and the second resin may be made of the same or different materials.
當使用相同材料來製造該厚膜時,可增強該第一樹脂與該第二樹脂間黏著之可靠度,並提升均勻度。另外,可去除表面張力所造成之平面度誤差(errors of flatness)。在此情況下,該第一樹脂層與該第二樹脂層之材料可為一熱固性樹脂 (thermosetting resin)或一光硬化樹脂(photocurable resin),且該材料之一例可使用一合成樹脂包含一丙烯酸胺基甲酸酯寡聚物(urethane acrylate oligomer)。另外,當該第一及第二樹脂層,而非背光單元之導光板(將在下文中詳述),被使用時,其可主要地由丙烯酸胺基甲酸酯寡聚物樹脂形成。舉例而言,作為合成寡聚物(synthetic oligomer)之丙烯酸氨基甲酸酯寡聚物與高分子型(polymer type)的聚丙烯(polyacryl)之一混合物可被使用。當然,該混合物可進一步包含具有一低沸點之一反應性稀釋單體(diluted type-reactive monomer),混合有丙烯酸異冰片酯(isobornyl acrylate,IBOA)和丙烯酸羥基丙酯(hydroxylpropyl acrylate,HPA)、丙烯酸2-羥基乙酯(2-hydroxyethyl acrylate,2-HEA);且一添加劑,一光起始劑(photo initiator)如1-羥基環己基苯基酮(1-Hydroxycyclohexyl Phenyl-Ketone)等等,一抗氧化劑(antioxidant)可被混合。 When the same material is used to manufacture the thick film, the reliability of adhesion between the first resin and the second resin can be enhanced, and uniformity can be improved. In addition, the errors of flatness caused by surface tension can be removed. In this case, the material of the first resin layer and the second resin layer may be a thermosetting resin. (thermosetting resin) or a photocurable resin, and one of the materials may comprise a urethane acrylate oligomer using a synthetic resin. Further, when the first and second resin layers, instead of the light guide plate of the backlight unit (which will be described in detail later), are used, they may be mainly formed of an urethane acrylate resin. For example, a mixture of an acrylic urethane oligomer and a polymer type polyacryl as a synthetic oligomer can be used. Of course, the mixture may further comprise a diluted type-reactive monomer having a low boiling point, mixed with isobornyl acrylate (IBOA) and hydroxylpropyl acrylate (HPA), 2-hydroxyethyl acrylate (2-HEA); and an additive, a photo initiator such as 1-Hydroxycyclohexyl Phenyl-Ketone, etc. An antioxidant can be mixed.
又,當第一樹脂層120與第二樹脂層130係由不同材料形成時,第一樹脂層120與第二樹脂層130其中任一者可較佳地由一透明材料形成。另外,用以增強光反射之一珠粒(bead)可被包含在形成上述結構第一樹脂層或第二樹脂層之樹脂中,且當第一樹脂層120與第二樹脂層130,而非背光單元之導光板(將在下文中詳述),被使用時,珠粒可根據該第一區域之整體重量而被保持在 0.01至0.03%。 Further, when the first resin layer 120 and the second resin layer 130 are formed of different materials, either of the first resin layer 120 and the second resin layer 130 may preferably be formed of a transparent material. In addition, one of the beads for enhancing light reflection may be contained in the resin forming the first resin layer or the second resin layer of the above structure, and when the first resin layer 120 and the second resin layer 130 are a light guide plate of a backlight unit (which will be described later in detail), when used, the beads can be held according to the overall weight of the first region 0.01 to 0.03%.
在上述大面積基板上之該厚膜之製造過程中,厚度均勻度以及平坦度基本上可由在塗覆該大面積基板時施用一雙塗覆方法於彼此不同之方向來達到,藉此可改善與上部板之黏著,並在未來被應用於一裝置如背光單元等時,藉此達到可靠的光學特性。 In the manufacturing process of the thick film on the large-area substrate, the thickness uniformity and the flatness can be basically achieved by applying a double coating method in different directions when applying the large-area substrate, thereby improving It adheres to the upper plate and is used in a device such as a backlight unit in the future, thereby achieving reliable optical characteristics.
2.第二實施例 2. Second Embodiment
在下文中,將詳細說明一第二實施例中之背光單元,其中係應用在第一實施例中所實施之具有多層樹脂結構之一大面積基板上之一厚膜。 Hereinafter, a backlight unit in a second embodiment will be described in detail, in which a thick film on a large-area substrate having a multilayer resin structure implemented in the first embodiment is applied.
在第二實施例之該多層樹脂結構中,以一硬塗覆方法實施之一第二樹脂層可被層壓在一第一樹脂層之上表面上,進而保護該第一樹脂層,並改善各結構之間的黏著力。 In the multilayer resin structure of the second embodiment, one of the second resin layers may be laminated on the upper surface of the first resin layer by a hard coating method, thereby protecting the first resin layer and improving The adhesion between the various structures.
圖5係根據本發明一實施例,繪示有一背光單元之剖面圖。 FIG. 5 is a cross-sectional view showing a backlight unit according to an embodiment of the invention.
參閱圖5,根據本發明一實施例,該背光單元係包含有複數個LED光源130形成於印刷電路板110之上;一第一樹脂層140用以將光擴散、導引向前;一第二樹脂層150形成於第一樹脂層140之上;以及一擴散片160設置於第二樹脂層150之上。 Referring to FIG. 5, the backlight unit includes a plurality of LED light sources 130 formed on the printed circuit board 110. A first resin layer 140 is used to diffuse and guide the light forward. The two resin layer 150 is formed on the first resin layer 140; and a diffusion sheet 160 is disposed on the second resin layer 150.
另外,一稜鏡片以及一保護片可進一步地被提供於擴散片160之上方。尤其,根據本發明,用以屏蔽或反射光之一光學微結構161可被設置於第二樹脂層150與擴散片160之間。在此情況下, 光學微結構161可在擴散片160之一上表面或一下表而上一體成型地形成,或可在第二樹脂層150之一上表面或一下表面上一體成型地形成,或可一體成型地被印刷於設置在第二樹脂層150與擴散片160之間的一透明基板之上。 In addition, a die and a protective sheet may be further provided over the diffusion sheet 160. In particular, according to the present invention, one of the optical microstructures 161 for shielding or reflecting light may be disposed between the second resin layer 150 and the diffusion sheet 160. In this situation, The optical microstructure 161 may be integrally formed on one surface or the lower surface of the diffusion sheet 160, or may be integrally formed on one surface or the lower surface of the second resin layer 150, or may be integrally formed. Printing is performed on a transparent substrate disposed between the second resin layer 150 and the diffusion sheet 160.
特別是,第一樹脂層140可用來向前導光而無須去除一現存之導光板並以一膜型樹脂取代之;且較佳地,可進一步被層壓於埋有發光二極體光源230之印刷電路板之上。另外,形成於第一樹脂層140上之第二樹脂層150可形成為一硬塗覆層於第一樹脂層140之上表面上,以形成另一樹脂層,進而保護第一樹脂層140,並改善各結構如光學微結構、擴散片等等之間的耦合力與黏著。 In particular, the first resin layer 140 can be used to guide light forward without removing an existing light guide plate and replacing it with a film type resin; and preferably, it can be further laminated to the printed light emitting diode 230. Above the board. In addition, the second resin layer 150 formed on the first resin layer 140 may be formed as a hard coating layer on the upper surface of the first resin layer 140 to form another resin layer, thereby protecting the first resin layer 140, And improve the coupling force and adhesion between various structures such as optical microstructures, diffusers and the like.
形成第二樹脂層150之材料係可使用一樹脂,其係包括一寡聚物,一單體型紫外線硬化樹脂(monomer-type ultraviolet-curing resin),或上述之混合。在此情況下,該寡聚物可使用丙烯酸氨基甲酸酯、環氧丙烯酸酯(epoxy acrylate)、聚酯丙烯酸酯(polyester acrylate)、壓克力丙烯酸酯(Acrylic Acrylate)其中任一者;而該單體可使用一單官能單體(monofunctional monomer)、一雙官能單體(bifunctional monomer)、一三官能單體(trifunctional monomer)、及一四官能單體(tetrafunctional)。另,該硬塗覆樹脂層之一厚度可為10 μm至100μm,且該硬塗覆樹脂層之一硬度可對應至一鉛筆硬度:B至2H。 The material forming the second resin layer 150 may be a resin including an oligomer, a monomer-type ultraviolet-curing resin, or a mixture thereof. In this case, the oligomer may use any one of acryl urethane, epoxy acrylate, polyester acrylate, and Acrylic Acrylate; The monomer may use a monofunctional monomer, a bifunctional monomer, a trifunctional monomer, and a tetrafunctional monomer. In addition, one of the hard coating resin layers may have a thickness of 10 Μm to 100 μm, and one of the hard coat resin layers may have a hardness corresponding to a pencil hardness: B to 2H.
在下文中將說明根據本發明之一結構。 A structure according to the present invention will be explained hereinafter.
發光二極體光源230其中至少一者可被排列於基底基板110之上,以發出光,且一側光式LED可被用於本發明之一較佳實施例中。也就是說,關於來自發光二極體光源230之光的方向,可使用一光源,其中光通過該光源後係向側邊行進,而非直接向上發出。另外,該側光式LED可直接地向下裝設,故可使用用以實施一光擴散及反射功能之一樹脂層來減少整體光源之數量,進而將背光單元之整體厚度縮小。如圖5所示,一背蓋B(back cover)可藉由一黏著劑P來黏合於基底基板110之一下表面上。 At least one of the light emitting diodes 230 can be arranged above the base substrate 110 to emit light, and a side optical LED can be used in a preferred embodiment of the present invention. That is to say, with respect to the direction of the light from the light-emitting diode light source 230, a light source can be used, wherein the light passes through the light source and travels to the side instead of directly upward. In addition, the edge-lit LED can be directly mounted downward, so that a resin layer for performing a light diffusion and reflection function can be used to reduce the number of the entire light source, thereby reducing the overall thickness of the backlight unit. As shown in FIG. 5, a back cover B can be bonded to the lower surface of one of the base substrates 110 by an adhesive P.
第一樹脂層140可被層壓以環繞發光二極體光源230,並可用將來自一光源之光擴散於一側向。亦即,第一樹脂層140可被用作為一習知導光板來使用。 The first resin layer 140 may be laminated to surround the light emitting diode light source 230, and may diffuse light from a light source in one side. That is, the first resin layer 140 can be used as a conventional light guide plate.
第一樹脂層140可由任何可擴散光之樹脂材料形成。根據本發明一實施例之樹脂層之一主要材料之一例可使用一樹脂包含一丙烯酸胺基甲酸酯寡聚物(urethane acrylate oligomer)。舉例而言,作為合成寡聚物(synthetic oligomer)之丙烯酸氨基甲酸酯寡聚物與高分子型(polymer type)的聚丙烯(polyacryl)之一混合物可被使用。當然,該混合物可進一步包含具有一低沸點之一 反應性稀釋單體(diluted type-reactive monomer),混合有丙烯酸異冰片酯(isobornyl acrylate,IBOA)和丙烯酸羥基丙酯(hydroxylpropyl acrylate,HPA)、丙烯酸2-羥基乙酯(2-hydroxyethyl acrylate,2-HEA);且一添加劑,一光起始劑(photo initiator)如1-羥基環己基苯基酮(1-Hydroxycyclohexyl Phenyl-Ketone)等等,一抗氧化劑(antioxidant)可被混合。 The first resin layer 140 may be formed of any resin material that can diffuse light. One of the main materials of the resin layer according to an embodiment of the present invention may be a resin containing an urethane acrylate oligomer. For example, a mixture of an acrylic urethane oligomer and a polymer type polyacryl as a synthetic oligomer can be used. Of course, the mixture may further comprise one having a low boiling point Diluted type-reactive monomer mixed with isobornyl acrylate (IBOA) and hydroxylpropyl acrylate (HPA), 2-hydroxyethyl acrylate, 2 -HEA); and an additive, a photo initiator such as 1-Hydroxycyclohexyl Phenyl-Ketone, etc., an antioxidant can be mixed.
在第一樹脂層140或第二樹脂層150中,可包含用以增強光擴散及光反射之一珠粒141。珠粒141係佔第一樹脂層140整體總重量之0.01至0.3wt%。也就是說,自LED側向發出之光可經第一樹脂層140及珠粒141而被擴散及反射,以向上行進。在此處,當提供一反射膜220與一反射微結構121(將在下文中詳述)時,能夠促進此項反射功能。一般被習知導光板所佔據之一產品的厚度,可顯著地經由上述之樹脂層來縮小,進而使產品達到輕薄,且該樹脂層,因其中之一延展性材料(ductile material),可被應用於一可彎曲的顯示器,進而達到多樣性(versatility)。 In the first resin layer 140 or the second resin layer 150, one of the beads 141 for enhancing light diffusion and light reflection may be included. The beads 141 are 0.01 to 0.3% by weight based on the total weight of the entire first resin layer 140. That is, light emitted from the side of the LED can be diffused and reflected through the first resin layer 140 and the beads 141 to travel upward. Here, when a reflective film 220 and a reflective microstructure 121 (which will be described later in detail) are provided, this reflective function can be promoted. Generally, the thickness of a product occupied by a conventional light guide plate can be remarkably reduced by the above-mentioned resin layer, thereby making the product light and thin, and the resin layer, due to one of the ductile materials, can be Applied to a flexible display to achieve versatility.
另外,反射膜220可經一黑白印刷(white printing)方法來提供反射微結構121,以擴散來自光源之光,並促進光反射。反射微結構121可使用一反射墨水來印刷,該反射墨水係包含有TiO2、CaCO3、BaSO4、Al2O3、silicon、及PS其中任一者。 In addition, the reflective film 220 can provide a reflective microstructure 121 via a white printing method to diffuse light from the source and promote light reflection. The reflective microstructure 121 can be printed using a reflective ink comprising any of TiO 2 , CaCO 3 , BaSO 4 , Al 2 O 3 , silicon, and PS.
擴散片160可擴散通過第一樹脂層140以被發出之光,且係包括一光學微結構161形成於該擴散片之下表面上。光學微結構161可為一遮光微結構(light shielding pattern),以避免因一極強的光強度而造成光學特性被減弱,或以避免光發黃,藉此可部分地實施一遮光效果。亦即,該遮光微結構可使用遮光墨水(light shielding ink)來印刷,以避免光匯聚。該光學微結構可實施以調整擴散度或使用一單一光學微結構來遮光進而部分地遮蔽或擴散光,而非完全地只屏蔽光線。另外,較佳地,根據本發明實施例之該光學微結構可被實施於一複合微結構(complex pattern)之一重疊印刷結構(superposition printing structure)中。該重疊印刷結構可指一結構,其中印刷有一單一微結構,且另一微結構系被印刷於該單一微結構之上。 The diffusion sheet 160 may diffuse through the first resin layer 140 to be emitted light, and includes an optical microstructure 161 formed on a lower surface of the diffusion sheet. The optical microstructure 161 can be a light shielding pattern to prevent the optical properties from being attenuated due to a very strong light intensity, or to avoid yellowing of the light, thereby partially implementing a light blocking effect. That is, the light-shielding microstructure can be printed using a light shielding ink to avoid light convergence. The optical microstructure can be implemented to adjust the degree of diffusion or to use a single optical microstructure to illuminate and thereby partially shield or diffuse light, rather than completely shielding only light. Additionally, preferably, the optical microstructures according to embodiments of the present invention can be implemented in a superposition printing structure of a composite pattern. The overlay printed structure can refer to a structure in which a single microstructure is printed and another microstructure is printed on the single microstructure.
光學微結構161之重疊印刷結構之一例中,可使用遮光墨水包含選自由TiO2、CaCO3、BaSO4、Al2O3、及silicon其中至少一者將一擴散微結構以一發光方向形成於一聚合物膜(polymer film)之一下表面上,以提供該擴散微結構;且可使用一遮光墨水包含Al或Al及TiO2之混合物,以提供一遮光微結構。也就是說,具有擴散微結構以黑白印刷方法形成於聚合物膜之表面上,然後形成遮光微結構於該擴散微結構上(或反之)之一雙層結構可被實施。 In one example of the overlapping printed structure of the optical microstructure 161, the light-shielding ink may be used to comprise a diffusion microstructure formed by a light-emitting direction selected from at least one of TiO 2 , CaCO 3 , BaSO 4 , Al 2 O 3 , and silicon. A lower surface of a polymer film to provide the diffusion microstructure; and a light-shielding ink comprising Al or a mixture of Al and TiO 2 may be used to provide a light-shielding microstructure. That is, a two-layer structure having a diffusion microstructure formed on the surface of the polymer film in a black-and-white printing method and then forming a light-shielding microstructure on the diffusion microstructure (or vice versa) can be implemented.
顯而易見的是,微結構之形狀係根據光效率、光強度、以及一遮光比(light shielding ratio)而變動。該微結構可形成於一三層結構(triple-layered structure)中,其中遮光微結構(亦及一金屬微結構)係形成為依序層疊結構中之一中間層,而擴散微結構係分別形成為上層與下層。較佳地,使用一三層結構,其中一單擴散微結構係使用具有絕佳折射率(refraction index)之TiO2形成,另一擴散微結構係使用具有絕佳光穩定度(light stability)與色感(color sense)之TiO2與CaCO3形成,而遮光微結構係使用具有絕佳光遮蔽(concealment)性之Al形成,進而獲取光效率與光均勻度。 It will be apparent that the shape of the microstructure varies depending on light efficiency, light intensity, and a light shielding ratio. The microstructure may be formed in a triple-layered structure, wherein the light-shielding microstructure (also a metal microstructure) is formed as an intermediate layer in a sequential laminated structure, and the diffusion microstructures are respectively formed For the upper and lower layers. Preferably, a three-layer structure is used in which a single diffusion microstructure is formed using TiO 2 having an excellent refractive index, and the other diffusion microstructure is used with excellent light stability and The color sense of TiO 2 is formed with CaCO 3 , and the light-shielding microstructure is formed using Al having excellent concealment properties, thereby obtaining light efficiency and light uniformity.
尤其,CaCO3可經由減弱黃光之暴露以最終地實施白光,藉此以得到較穩定及有效率之光;且除CaCO3之外,可應用一具有大粒徑與一相似結構之無機材料如BaSO4、Al2O3、silicon、一珠粒等等。另外,依據光效率,光學微結構之一微結構密度可被調整,以使在微結構離LED光源之發光方向變遠時,降低該微結構密度。 In particular, CaCO 3 can ultimately perform white light by attenuating the exposure of yellow light, thereby obtaining a relatively stable and efficient light; and in addition to CaCO 3 , an inorganic material having a large particle size and a similar structure such as BaSO can be applied. 4 , Al 2 O 3 , silicon, a bead, etc. Additionally, depending on the light efficiency, one of the microstructures of the optical microstructure can be adjusted to reduce the density of the microstructure as the microstructure becomes distant from the direction of illumination of the LED source.
另外,根據本發明實施例之反射膜220可被層壓至印刷電路板210之上,且發光二極體光源230可通過形成於反射膜220上之一孔而突伸至外界。當發光二極體光源230係被實施為一側光式LED結構時,如上所述,光源的數量可被顯著地減少,且反射微結構可被實施,以顯著地改善光的反射率。 In addition, the reflective film 220 according to an embodiment of the present invention may be laminated onto the printed circuit board 210, and the light emitting diode light source 230 may protrude to the outside through a hole formed in the reflective film 220. When the light-emitting diode light source 230 is implemented as a one-side light LED structure, as described above, the number of light sources can be significantly reduced, and the reflective microstructure can be implemented to significantly improve the reflectance of light.
如圖5所示,反射微結構可形成於LED光源之一發光方向,且特別是可被設置為使其微結構密度可在該微結構距離LED光源之發光方向變遠時增加。另外,該反射微結構可使用包含選自由TiO2、CaCO3、BaSO4、Al2O3、及silicon其中至少一者之一反射墨水來印刷。 As shown in FIG. 5, the reflective microstructure can be formed in one of the LED light sources, and in particular can be configured such that its microstructure density can be increased as the microstructure becomes farther away from the direction of illumination of the LED source. Additionally, the reflective microstructure can be printed using an ink comprising a reflective layer selected from at least one of TiO 2 , CaCO 3 , BaSO 4 , Al 2 O 3 , and silicon.
根據本發明實施例之背光單元可被實施為發出光線L之光源之一配置結構,如圖5所示。也就是說,為求減少光源的數目,可提供側光式LED之發光二極體光源230。 The backlight unit according to an embodiment of the present invention can be implemented as one of light source illuminating light L, as shown in FIG. That is to say, in order to reduce the number of light sources, a light-emitting diode light source 230 of an edge-lit LED can be provided.
又,根據本發明實施例之背光單元可經下述結構與功能而被應用於一LCD。也就是說,光自發光二極體光源230發出,然後在形成以代替習知導光板之第一樹脂層140中被反射、擴散。在此處,反射效率可由反射膜220與反射微結構121來提升,故光可被導引向前。在此方式下,通過第一樹脂層140與第二樹脂層150之光可經光學微結構161而被擴散或屏蔽,且該純化之光線(purified light)係具有純化光學性質,以提高均勻度。在此處,通過一光學片如一稜鏡片170、一偏極化片180(DBEF)等等之光係以一白光之形式入射於LCD面板。 Further, the backlight unit according to an embodiment of the present invention can be applied to an LCD through the following structure and function. That is, the light is emitted from the light-emitting diode light source 230, and then reflected and diffused in the first resin layer 140 formed to replace the conventional light guide plate. Here, the reflection efficiency can be enhanced by the reflective film 220 and the reflective microstructure 121 so that the light can be guided forward. In this manner, light passing through the first resin layer 140 and the second resin layer 150 can be diffused or shielded through the optical microstructure 161, and the purified light has purified optical properties to improve uniformity. . Here, the light of an optical sheet such as a cymbal sheet 170, a polarizing plate 180 (DBEF) or the like is incident on the LCD panel in the form of a white light.
圖7係繪示有根據本發明另一實施例之背光單元。在有根據本實施例之背光單元中,光係自一側光式發光二極體光源230以一側向發出,然後係在根據本實施例形成以代替習知導光板之一 樹脂層中被擴散、反射。在此處,反射效率可由一反射膜220與一反射微結構221而進一步改善,以使光可被導引向前。在此方式下,通過第一樹脂層240之光可經形成於擴散片260上之一光學微結構261而被擴散或屏蔽,且該純化之光線L係通過一光學片如稜鏡片270等,而以一白光之形式入射於LCD面板。樹脂層可基本地包含有第一樹脂層240與第二樹脂層250,且可被用作取代習知導光板,藉此以達到平坦,進而實現可靠的光擴散。在此情況下,在第一樹脂層240或第二樹脂層250中,一珠粒可如上述被包含在內。另外,當第一樹脂層240及第二樹脂層250不使用相同材料時,第一樹脂層240及第二樹脂層250其中任一者可如上述包含一透明材料。尤其,與圖5中結構之差異係在於光學微結構261係形成於擴散片260之下表面上,且光學微結構261係填入於第二樹脂層250中。 FIG. 7 illustrates a backlight unit in accordance with another embodiment of the present invention. In the backlight unit according to the present embodiment, the light is emitted from one side of the light-emitting diode light source 230 in one direction, and then formed in accordance with the present embodiment to replace one of the conventional light guide plates. The resin layer is diffused and reflected. Here, the reflection efficiency can be further improved by a reflective film 220 and a reflective microstructure 221 so that light can be directed forward. In this manner, the light passing through the first resin layer 240 can be diffused or shielded through one of the optical microstructures 261 formed on the diffusion sheet 260, and the purified light L passes through an optical sheet such as the cymbal sheet 270 or the like. It is incident on the LCD panel in the form of a white light. The resin layer may substantially include the first resin layer 240 and the second resin layer 250, and may be used as a substitute for a conventional light guide plate, thereby achieving flatness, thereby achieving reliable light diffusion. In this case, in the first resin layer 240 or the second resin layer 250, one bead may be included as described above. In addition, when the first resin layer 240 and the second resin layer 250 do not use the same material, either of the first resin layer 240 and the second resin layer 250 may include a transparent material as described above. In particular, the difference from the structure in FIG. 5 is that the optical microstructures 261 are formed on the lower surface of the diffusion sheet 260, and the optical microstructures 261 are filled in the second resin layer 250.
如上所述,在有根據本發明實施例之背光單元中,導光板可被去除,而側光式LED可被應用作為光源;光可經樹脂層的擴散與反射來導引,以縮小產品之厚度,並減少光源的數量。另外,該硬塗覆樹脂層可被印刷於樹脂層之上表面上,以保護該樹脂層並改善各結構間的黏著力。又,因光源減少而可能產生之亮度減弱與均勻度降低,可使用反射微結構與遮光微結構來調整,進而改善光學性質。 As described above, in the backlight unit according to the embodiment of the present invention, the light guide plate can be removed, and the edge-lit LED can be applied as a light source; the light can be guided by the diffusion and reflection of the resin layer to narrow the product. Thickness and reduce the number of light sources. Further, the hard coat resin layer may be printed on the upper surface of the resin layer to protect the resin layer and improve the adhesion between the respective structures. Moreover, the brightness reduction and uniformity which may occur due to the reduction of the light source can be adjusted by using the reflective microstructure and the light-shielding microstructure, thereby improving the optical properties.
雖然參考實施例之許多說明性實施例來描述實施例,但應理解,熟習此項技術者可想出將落入本發明之原理的精神及範疇內的眾多其他修改及實施例。因此,本發明之範疇應由所附之專利範圍之範疇,而非本參考書之說明內文,來定義,且所有落入本發明範疇之修改均應被理解為被包括於本發明申請範疇之內。 While the embodiments have been described with reference to the embodiments of the embodiments the embodiments Therefore, the scope of the present invention should be construed as being included in the scope of the appended claims, and all modifications within the scope of the present invention should be construed as being included in the scope of the present invention. within.
1‧‧‧背光單元 1‧‧‧Backlight unit
10‧‧‧側光式發光二極體 10‧‧‧Side-light LEDs
20‧‧‧基板 20‧‧‧Substrate
30‧‧‧平面導光板 30‧‧‧Flat light guide
40‧‧‧反射板 40‧‧‧reflector
50‧‧‧LCD面板 50‧‧‧LCD panel
31、160、260‧‧‧擴散片 31, 160, 260‧‧‧ diffuser
32、33、170、270‧‧‧稜鏡片 32, 33, 170, 270‧‧‧ pictures
34‧‧‧保護片 34‧‧‧Protection film
110‧‧‧基底基板 110‧‧‧Base substrate
120、140、240‧‧‧第一樹脂層 120, 140, 240‧‧‧ first resin layer
130、150、250‧‧‧第二樹脂層 130, 150, 250‧‧‧ second resin layer
121、221‧‧‧反射微結構 121, 221‧‧‧reflective microstructure
141‧‧‧珠粒 141‧‧‧ beads
161、261‧‧‧光學微結構 161, ‧ ‧ ‧ optical microstructure
180‧‧‧偏極化片 180‧‧‧Polarized film
210‧‧‧印刷電路板 210‧‧‧Printed circuit board
220‧‧‧反射膜 220‧‧‧Reflective film
230‧‧‧發光二極體光源 230‧‧‧Lighting diode source
B‧‧‧背蓋 B‧‧‧Back cover
C‧‧‧厚膜塗覆材料 C‧‧‧Thick film coating material
G‧‧‧固定間隙 G‧‧‧Fixed clearance
L‧‧‧光線 L‧‧‧Light
M‧‧‧金屬模具 M‧‧‧ metal mold
P‧‧‧黏著劑 P‧‧‧Adhesive
S‧‧‧基底基板 S‧‧‧ base substrate
S1~S3‧‧‧步驟 S 1~ S 3 ‧‧‧Steps
X‧‧‧第一方向 X‧‧‧ first direction
Y‧‧‧第二方向 Y‧‧‧second direction
圖1、2係根據一習知技藝,繪示有一背光單元之結構圖;圖3係繪示有將一厚膜塗覆於一習知大面積基板之方法;圖4係根據本發明一實施例,繪示有形成一厚膜於一大面積基板上之流程;圖5係根據本發明一實施例,繪示有一背光單元之一結構之主要部分;圖6係根據本發明一實施例,繪示有一LED光源之設置;以及圖7係根據本發明另一實施例,繪示有一背光單源之應用例。 1 and 2 are structural diagrams of a backlight unit according to a prior art; FIG. 3 illustrates a method of applying a thick film to a conventional large-area substrate; and FIG. 4 is an embodiment of the present invention. For example, a process for forming a thick film on a large-area substrate is shown; FIG. 5 is a main portion of a structure of a backlight unit according to an embodiment of the invention; FIG. 6 is an embodiment of the present invention, An arrangement of an LED light source is shown; and FIG. 7 illustrates an application example of a backlight single source according to another embodiment of the present invention.
S1~S3‧‧‧步驟 S 1 ~S 3 ‧‧‧Steps
110‧‧‧基底基板 110‧‧‧Base substrate
120‧‧‧第一樹脂層 120‧‧‧First resin layer
130‧‧‧第二樹脂層 130‧‧‧Second resin layer
X、Y‧‧‧方向 X, Y‧‧ direction
Claims (20)
Priority Applications (1)
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TW100132836A TWI493254B (en) | 2011-09-13 | 2011-09-13 | Fabricating method of thick film on large area substrate, thick film structure thereof, and back light unit and lcd using the same |
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TW100132836A TWI493254B (en) | 2011-09-13 | 2011-09-13 | Fabricating method of thick film on large area substrate, thick film structure thereof, and back light unit and lcd using the same |
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TWI493254B true TWI493254B (en) | 2015-07-21 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200508794A (en) * | 2003-05-08 | 2005-03-01 | Dsm Ip Assets Bv | Radiation-curable resin composition for forming optical part and optical part |
KR20110032486A (en) * | 2009-09-23 | 2011-03-30 | 엘아이지에이디피 주식회사 | Back light unit with light-refractive patterns, its manufacturing method, and lcd device having it |
KR20110055425A (en) * | 2009-11-17 | 2011-05-25 | 한국생산기술연구원 | Polymer-organic nano-fiber composite having superior thermal expansion property and light-transmission and transparent composite film |
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2011
- 2011-09-13 TW TW100132836A patent/TWI493254B/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200508794A (en) * | 2003-05-08 | 2005-03-01 | Dsm Ip Assets Bv | Radiation-curable resin composition for forming optical part and optical part |
KR20110032486A (en) * | 2009-09-23 | 2011-03-30 | 엘아이지에이디피 주식회사 | Back light unit with light-refractive patterns, its manufacturing method, and lcd device having it |
KR20110055425A (en) * | 2009-11-17 | 2011-05-25 | 한국생산기술연구원 | Polymer-organic nano-fiber composite having superior thermal expansion property and light-transmission and transparent composite film |
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