TWI493059B - Method for plating film - Google Patents

Description

Coating method

The present invention relates to a method of forming a film layer, and more particularly to a method of coating a film on a large-sized substrate.

Organic Light Emittine Diode (OLED) has excellent structure, no need for external backlight, high resolution, good pixel independent color performance, and short reaction time. It has been widely used in flat panel displays. Full color process technology.

The method for fabricating an organic light-emitting diode display device is to deposit an organic light-emitting material on a glass substrate by using a shadow mask and a pixel alignment technique to form a patterned organic light-emitting layer, wherein the mask is made of a metal. The film and a frame connected to the peripheral region of the metal film are formed.

In recent years, as the production technology of glass substrates has progressed, the size of glass substrates has been increasing, and therefore, it has been required to use a mask having a large size. However, the increase in the size of the mask may cause problems. For example, an increase in the size of the frame may result in an increase in weight and an easy deformation. Therefore, the handling of the personnel and the design of the machine during the storage, handling, and manufacturing process may increase the difficulty. The manufacturing cost is increased; the size of the metal film is limited by the supplier, so it is difficult to obtain a large-sized metal film; and as the size of the metal film increases, the tool for processing the metal film must also be enlarged, so that the manufacturing cost is large. improve.

An embodiment of the invention provides a method for coating a film, comprising: providing a substrate, and a coating source opposite to the substrate, providing a shadow mask unit between the substrate and the coating source and corresponding to a first region of the substrate, wherein the shadow The mask unit has an opening pattern; the shadow mask unit is used as a mask, and a first coating process is performed by using the coating source to form a first patterned coating on the first region exposed by the opening pattern; The relative displacement between the screen unit and the substrate is such that the displaced shadow mask unit corresponds to a second area of the substrate, the second area partially overlaps or separates from the first area; and the shadow mask unit is used as a mask And performing a second coating process by using the coating source to form a second patterned coating on the second region exposed by the opening pattern.

The manner of making and using the embodiments of the present invention will be described in detail below. It should be noted, however, that the present invention provides many inventive concepts that can be applied in various specific forms. The specific embodiments discussed herein are merely illustrative of the invention and are not intended to limit the scope of the invention. Moreover, repeated numbers or labels may be used in different embodiments. These repetitions are merely for the purpose of simplicity and clarity of the invention and are not to be construed as a limitation of the various embodiments and/or structures discussed. Furthermore, when a first material layer is referred to or on a second material layer, the first material layer is in direct contact with or separated from the second material layer by one or more other material layers. In the drawings, the shape or thickness of the embodiment may be expanded to simplify or facilitate the marking.

1A to 1D are top views of a coating process according to an embodiment of the present invention. 2A to 2D are cross-sectional views taken along line I-I' of Figs. 1A to 1D, respectively.

Referring to FIG. 1A and FIG. 2A simultaneously, a substrate 110 and a coating source 120 are disposed opposite to the substrate 110. The coating source 120 is, for example, an evaporation source, and is adapted to vaporize an electroluminescent material on the substrate, for example. Organic light-emitting diode (OLED) material. The substrate 110 is, for example, a glass substrate. A shadow mask unit 130 is provided between the substrate 110 and the coating source 120, and the shadow mask unit 130 corresponds to one of the first regions A1 of the substrate 110. In an embodiment, the shadow mask unit 130 is disposed on the first area A1.

In detail, the shadow mask unit 130 has an opening pattern 132 exposing a portion of the first area A1. In an embodiment, the opening pattern 132 has a plurality of openings 132a. In an embodiment, the area of the shadow mask unit 130 is smaller than the area of the substrate 110, that is, the size of the shadow mask unit 130 is smaller than the size (eg, length and/or width) of the substrate 110. In one embodiment, the shadow mask unit 130 includes a metal film 134 having an opening pattern 132 and a frame 136 that contacts the peripheral region of the metal film 134 to support the metal film 134.

Then, using the shadow mask unit 130 as a mask, a coating process (for example, an evaporation process) is performed by the coating source 120 to form a patterned plating film 142 on the first region A1 exposed by the opening pattern 132 (eg, 1B and 2B)).

Then, referring to FIG. 1B and FIG. 2B simultaneously, the shadow mask unit 130 and the substrate 110 are relatively displaced, so that the displaced shadow mask unit 130 corresponds to a second area A2 of the substrate 110. In detail, in the present embodiment, the relative displacement between the shadow mask unit 130 and the substrate 110 is such that the shadow mask unit 130 is moved with the substrate 110 fixed in position to change the shadow mask unit 130 and the substrate 110. Relative position. In an embodiment, the second area A2 and the first area A1 do not overlap each other.

In one embodiment, the shadow mask unit 130 is located on one surface 112 of the substrate 110, and the moving direction of the shadow mask unit 130 (such as the moving direction V1 shown in FIG. 2B) is parallel to any of the surfaces 112. direction. In addition, when moving the shadow mask unit 130, the coating source 120 can be moved together to align the coating source 120 with the shadow mask unit 130.

Then, using the shadow mask unit 130 as a mask, a coating process is performed by the coating source 120 to form a patterned plating film 144 on the second region A2 exposed by the opening pattern 132 (as shown in FIG. 1C and FIG. 2C). Shown). In an embodiment, the patterned plating film 142 and the patterned plating film 144 are separated from each other.

Next, referring to FIGS. 1C and 2C, the shadow mask unit 130 and the substrate 110 are again relatively displaced so that the shadow mask unit 130 after the displacement again corresponds to a third region A3 of the substrate 110. In an embodiment, the third area A3 and the first area A1 and the second area A2 are separated from each other. In one embodiment, the direction of movement of the shadow mask unit 130 (such as the direction of movement V2 shown in FIG. 2C) is parallel to either direction of the surface 112.

Then, using the shadow mask unit 130 as a mask, a coating process is performed by the coating source 120 to form a patterned plating film 146 on the third region A3 exposed by the opening pattern 132 (such as 1D and 2D). Shown). The material of the patterned plating film 142, 144, 146 is, for example, an electroluminescent material such as an organic light emitting diode material.

Thereafter, as shown in FIG. 1D and FIG. 2D, the foregoing process steps (including sequentially causing relative displacement between the shadow mask unit 130 and the substrate 110 and performing a coating process) may be repeated one or more times to further One or more patterned plating films 148 are formed on the substrate 110.

In an embodiment, when the length L1 of the shadow mask unit 130 is not less than the length L2 of the substrate 110, and the width W1 of the shadow mask unit 130 is smaller than the width W2 of the substrate 110 (as shown in FIG. 1A), The moving direction V1 of the relative displacement and the moving direction V2 of the relative displacement are both parallel to the width direction of the substrate 110 (as shown in FIG. 1C).

FIG. 3A is a top view showing a coating process according to another embodiment of the present invention. Fig. 3B is a cross-sectional view along line I-I' of Fig. 3A. In another embodiment, as shown in FIGS. 3A and 3B, the first region A1 and the second region A2 may partially overlap, and the patterned plating film 142 and the patterned plating film 144a formed after the coating process may be mutually Partial overlap. Thereafter, the shadow mask unit can be repeatedly moved and the plating process is performed until all of the patterned plating films predetermined to be formed on the substrate 110 are completed.

4 is a top view of a coating process according to still another embodiment of the present invention. In still another embodiment, as shown in FIG. 4, when the width W1 of the shadow mask unit 130 is smaller than the width W2 of the substrate 110, and the length L1 of the shadow mask unit 130 is smaller than the length L2 of the substrate 110, the shadow The mask unit 130 is required to be relatively displaced along the length direction of the substrate 110 and the width direction to complete the coating of all regions on the substrate 110. Therefore, the moving direction V1 of the relative displacement may not be parallel to the moving direction V2 of the relative displacement again, for example. It is said that the moving direction V1 of the relative displacement is perpendicular to the moving direction V2 of the relative displacement again. It is to be noted that the dotted line pattern of Fig. 4 represents the position of the shadow mask unit 130 at each plating process.

Fig. 5 is a top view showing a coating process according to an embodiment of the present invention. Further, in an embodiment, as shown in FIG. 5, when the coating process is performed, the shadow mask unit 130 and the substrate 110 may only partially overlap, and the shadow mask unit 130 may move toward the directions V3, V4. It is to be noted that the dotted line pattern of Fig. 5 represents the position of the shadow mask unit 130 at each plating process.

It can be seen from the foregoing that the coating method of the present embodiment achieves full-plate coating by relatively displacing the shadow mask unit 130 and the substrate 110. Therefore, the shadow mask unit 130 having a smaller size can be used (less than the size of the substrate 110). As a mask, it is possible to avoid the problems caused by the increase in the size of the mask, thereby increasing the ease of the process and greatly reducing the manufacturing cost.

6A to 6C are top views of a coating process according to an embodiment of the present invention. 7A to 7C are cross-sectional views taken along line I-I' of Figs. 6A to 6C, respectively. It should be noted that the component structure, material, and the like used in the present embodiment are similar to those of the above-described first to third embodiments, and therefore, the structure and material of similar components will not be described herein.

Referring to FIGS. 6A and 7A simultaneously, a substrate 110 and a coating source 120 are provided opposite to the substrate 110. A shadow mask unit 130 is provided between the substrate 110 and the coating source 120, and the shadow mask unit 130 corresponds to one of the first regions A1 of the substrate 110.

Then, using the shadow mask unit 130 as a mask, a coating process is performed by the coating source 120 to form a patterned plating film 142 on the first region A1 exposed by the opening pattern 132 of the shadow mask unit 130 (eg, Figure 6B and Figure 7B).

Then, referring to FIG. 6B and FIG. 7B simultaneously, in the case where the shadow mask unit 130 is fixed in position, the substrate 110 is moved such that the displaced shadow mask unit 130 corresponds to a second area A2 of the substrate 110.

In addition, in one embodiment, the shadow mask unit 130 is located on one surface 112 of the substrate 110, and the moving direction of the substrate 110 (such as the moving direction V1 shown in FIG. 7B) is parallel to any direction of the surface 112. .

Then, using the shadow mask unit 130 as a mask, a coating process is performed by the coating source 120 to form a patterned plating film 144 on the second region A2 exposed by the opening pattern 132 (as shown in FIG. 6C and FIG. 7C). Shown).

Thereafter, as shown in FIG. 6C and FIG. 7C, the foregoing process steps (including sequentially moving the substrate 110 and performing the coating process) may be repeated one or more times to form one or more patterning on the substrate 110. Coating 148.

Figure 8 is a top plan view showing a coating process of another embodiment of the present invention. In an embodiment, as shown in FIG. 8, in the case where the shadow mask unit 130 is fixed in position, the substrate 110 can be moved in any direction, for example, in the directions V5, V6 to form a suitable pattern on the substrate 110. Coating. It should be noted that the dotted line frame illustrated in FIG. 8 is the position where the substrate 110 is displaced in the directions V5 and V6.

In summary, the coating method of the present invention achieves full-plate coating by relatively displacing the shadow mask unit and the substrate, so that a shadow mask unit having a small size can be used as a mask, thereby avoiding the conventional knowledge. Various problems arising from the increase in the size of the mask increase the ease of the process and greatly reduce the manufacturing cost.

The present invention has been disclosed in the above preferred embodiments, and is not intended to limit the scope of the present invention. Any one of ordinary skill in the art can make a few changes without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.

110. . . Substrate

112. . . surface

120. . . Coating source

130. . . Shadow mask unit

132. . . Opening pattern

132a. . . Opening

134. . . Metal film

136. . . frame

142, 144, 144a, 146, 148. . . Patterned coating

A1. . . First area

A2. . . Second area

A3. . . Third area

L1, L2. . . length

V1, V2, V3, V4, V5, V6. . . Direction of movement

W1, W2. . . width

1A to 1D are top views of a coating process according to an embodiment of the present invention.

2A to 2D are cross-sectional views taken along line I-I' of Figs. 1A to 1D, respectively.

FIG. 3A is a top view showing a coating process according to another embodiment of the present invention.

Fig. 3B is a cross-sectional view along line I-I' of Fig. 3A.

4 is a top view of a coating process according to still another embodiment of the present invention.

Fig. 5 is a top view showing a coating process according to an embodiment of the present invention.

6A to 6C are top views of a coating process according to an embodiment of the present invention.

7A to 7C are cross-sectional views taken along line I-I' of Figs. 6A to 6C, respectively.

Figure 8 is a top plan view showing a coating process of another embodiment of the present invention.

110. . . Substrate

130. . . Shadow mask unit

142. . . Patterned coating

A1. . . First area

A2. . . Second area

V1. . . Direction of movement

Claims (14)

A method of coating, comprising: providing a substrate, and a coating source opposite to the substrate, providing a shadow mask unit between the substrate and the coating source and corresponding to a first region of the substrate, wherein the shadow mask The screen unit has an opening pattern; the shadow mask unit is used as a mask, and the first coating process is performed by using the coating source to form a first patterned coating on the first region exposed by the opening pattern; Disposing the shadow mask unit and the substrate relative to each other such that the displaced shadow mask unit corresponds to a second region of the substrate, the second region partially overlapping or separated from the first region; And using the shadow mask unit as a mask, using the coating source to perform a second coating process to form a second patterned coating on the second region exposed by the opening pattern, wherein the shadow mask is formed The step of relative displacement between the unit and the substrate includes: moving the shadow mask unit when the position of the substrate is fixed; or moving the substrate when the position of the shadow mask unit is fixed The method of coating according to claim 1, wherein the step of relatively displacing the shadow mask unit with the substrate comprises moving the shadow mask unit when the position of the substrate is fixed. The method of coating according to claim 2, wherein the step of relatively displacing the shadow mask unit with the substrate further comprises: moving the coating source to align the shadow mask unit. A method of coating as described in claim 2, wherein The shadow mask unit is located on a surface of the substrate, and the moving direction of the shadow mask unit is parallel to any direction of the surface. The method of coating according to claim 1, wherein the step of relatively displacing the shadow mask unit with the substrate comprises moving the substrate when the position of the shadow mask unit is fixed. The method of coating according to claim 5, wherein the shadow mask unit is located on a surface of the substrate, and the moving direction of the substrate is parallel to any direction of the surface. The method of coating according to claim 1, wherein the first patterned coating and the second patterned coating are separated from each other or partially overlap each other. The method of coating according to claim 1, further comprising: re-displace the shadow mask unit and the substrate again, so that the shadow mask unit after the displacement is corresponding to the first of the substrate a third region, the third region partially overlapping or separating from the first region and the second region; and using the shadow mask unit as a mask, using the coating source to perform a third coating process for the opening A third patterned coating is formed on the third region exposed by the pattern. The method of coating according to claim 8, wherein the width of the shadow mask unit is greater than or equal to the width of the substrate, and the direction of the relative displacement is parallel to the direction of the relative displacement. The method of coating according to claim 8, wherein the shadow mask unit has a width smaller than a width of the substrate, and the shadow mask The length of the curtain unit is less than the length of the substrate, wherein the direction of the relative displacement is not parallel to the direction of the relative displacement. The method of coating according to claim 10, wherein the direction of the relative displacement is perpendicular to the direction of the relative displacement. The method of coating according to claim 1, wherein the first coating process and the second coating process are vapor deposition processes. The method of coating according to claim 1, wherein the material of the first patterned coating and the second patterned coating comprises an electroluminescent material. The method of coating according to claim 1, wherein the area of the shadow mask unit is smaller than the area of the substrate.