TWI488237B - - Google Patents

Info

Publication number
TWI488237B
TWI488237B TW101143726A TW101143726A TWI488237B TW I488237 B TWI488237 B TW I488237B TW 101143726 A TW101143726 A TW 101143726A TW 101143726 A TW101143726 A TW 101143726A TW I488237 B TWI488237 B TW I488237B
Authority
TW
Taiwan
Application number
TW101143726A
Other languages
Chinese (zh)
Other versions
TW201332013A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW201332013A publication Critical patent/TW201332013A/zh
Application granted granted Critical
Publication of TWI488237B publication Critical patent/TWI488237B/zh

Links

TW101143726A 2011-12-28 2012-11-22 一種減少晶片背面生成聚合物的聚焦環 TW201332013A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110448622.7A CN103187232B (zh) 2011-12-28 2011-12-28 一种减少晶片背面生成聚合物的聚焦环

Publications (2)

Publication Number Publication Date
TW201332013A TW201332013A (zh) 2013-08-01
TWI488237B true TWI488237B (enExample) 2015-06-11

Family

ID=48678343

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101143726A TW201332013A (zh) 2011-12-28 2012-11-22 一種減少晶片背面生成聚合物的聚焦環

Country Status (2)

Country Link
CN (1) CN103187232B (enExample)
TW (1) TW201332013A (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102136790B1 (ko) * 2013-11-15 2020-07-23 삼성디스플레이 주식회사 플렉서블 디스플레이 장치와, 이의 제조 방법
CN104008946B (zh) * 2014-06-12 2016-09-07 上海华力微电子有限公司 铝刻蚀工艺用聚焦环、铝刻蚀工艺
CN109423606A (zh) * 2017-08-24 2019-03-05 中微半导体设备(上海)有限公司 聚焦环及其耐腐蚀防护方法
JP7370228B2 (ja) * 2019-11-22 2023-10-27 東京エレクトロン株式会社 プラズマ処理装置
CN113097038B (zh) * 2021-02-25 2022-07-15 长江存储科技有限责任公司 刻蚀装置
US20250357171A1 (en) * 2022-06-08 2025-11-20 Lam Research Corporation Chucking system with silane coupling agent

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200416801A (en) * 2003-01-07 2004-09-01 Tokyo Electron Ltd Plasma processing apparatus and focus ring
TW200829720A (en) * 2006-10-06 2008-07-16 Asahi Tech Co Ltd Corrosion-resisting member and method for making the same
US20110126984A1 (en) * 2009-12-01 2011-06-02 Lam Research Corporation Edge ring assembly for plasma etching chambers

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6464843B1 (en) * 1998-03-31 2002-10-15 Lam Research Corporation Contamination controlling method and apparatus for a plasma processing chamber
US20070032081A1 (en) * 2005-08-08 2007-02-08 Jeremy Chang Edge ring assembly with dielectric spacer ring
CN101552182B (zh) * 2008-03-31 2010-11-03 北京北方微电子基地设备工艺研究中心有限责任公司 一种用于半导体制造工艺中的边缘环机构

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200416801A (en) * 2003-01-07 2004-09-01 Tokyo Electron Ltd Plasma processing apparatus and focus ring
TW200829720A (en) * 2006-10-06 2008-07-16 Asahi Tech Co Ltd Corrosion-resisting member and method for making the same
US20110126984A1 (en) * 2009-12-01 2011-06-02 Lam Research Corporation Edge ring assembly for plasma etching chambers

Also Published As

Publication number Publication date
TW201332013A (zh) 2013-08-01
CN103187232A (zh) 2013-07-03
CN103187232B (zh) 2015-09-16

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