TWI487145B - Light emitting diode device for a pico projection system - Google Patents

Description

Light-emitting diode device for a miniature projection system

The present invention relates to a light-emitting diode device, and more particularly to a light-emitting diode device that can be applied to a micro-projection system, thereby making the micro-projection system more compact.

In response to the current trend of thin and light demand for electronic products in the market, traditional projectors have begun to develop toward miniaturization. The use requirements of the Pico Projector are set to be portable, not only for portable pico projectors, but also for various existing electronic products, such as built-in mobile phones, multimedia players, and individuals. Digital Personal Assistant (PDA), notebook computers, etc., to expand the functional diversity of electronic products.

Based on the compact and lightweight requirements of the structure and the optical brightness performance, the current micro-projector uses the light-emitting diodes of red, green and blue light as the light source to directly project the three-color light to the digital micro-mirror device (Digital Micromirro Device, DMD) for imaging. Therefore, compared with the general projector, the micro projector eliminates other optical components such as color filters, greatly reduces the volume, reduces the manufacturing cost, and has a long service life due to various characteristics of the light-emitting diode. , the color range of performance and other advantages.

However, in the pico projectors currently used in electronic products, they are limited by the light-emitting diode device, and the volume is slightly too large and cumbersome, and the power load is also insufficient.

In summary, the development of a light-emitting diode device that is more suitable for use in a micro projector and has a certain luminous efficiency, color performance and application flexibility is an urgent need in the industry.

An object of the present invention is to provide a light-emitting diode device for a micro-projection system, which has a light and thin volume, and can provide good brightness and color performance, and is convenient for use in a micro-projection system that can be carried around.

To achieve the above objective, the present invention discloses a light emitting diode device for a micro projection system, comprising a bottom substrate, an anode portion, at least one cathode portion, and at least one light emitting diode (LED) wafer. And a light transmissive element. The anode portion and the at least one cathode portion are disposed on the bottom substrate, and at least one LED chip is disposed on the anode portion and electrically connected to the anode portion and the at least one cathode portion, and the light transmitting member covers the bottom substrate to define a cavity.

In order to achieve the above object, the present invention further discloses a light emitting diode device for a micro projection system, comprising a bottom substrate, an anode portion, at least one cathode portion, at least one LED chip, a surrounding substrate, and a light transmitting component. . The anode portion and the at least one cathode portion are disposed on the bottom substrate, and at least one LED chip is disposed on the anode portion and electrically connected to the anode portion and the at least one cathode portion, and the surrounding substrate has a surrounding portion and a hollow portion, and the transparent member It is directly covered on the surrounding substrate, and the cavity is defined by the hollow portion.

The above objects, technical features and advantages will be more apparent from the following description.

The illuminating diode device of the present invention will be explained below by way of examples. However, the description of the embodiments is merely illustrative of the invention and is not intended to limit the invention. It should be noted that in the following embodiments, in the following embodiments and drawings, components that are not directly related to the present invention have been omitted and are not shown; and the dimensions and relative positions of the components in the drawings are It is only used to illustrate and understand, not to limit the actual proportion and size.

As shown in FIGS. 1A to 1C, the first embodiment of the present invention is a light emitting diode (LED) device 1 for a micro projection system, and the light emitting diode device 1 includes a The bottom substrate 101, an anode portion 103, two cathode portions 105, a light emitting diode wafer 107, a surrounding substrate 109, and a light transmitting member 111. Since the light-emitting diode device 1 of the present embodiment has only a single light-emitting diode wafer 107, it can also be called a single-crystal light-emitting diode device.

As shown, the anode portion 103 and the two cathode portions 105 are both disposed on the base substrate 101. The light-emitting diode wafer 107 is disposed on the anode portion 103, and the light-emitting diode wafer 107 and the anode portion 103 and one of the cathode portions 105 are electrically connected by wires, respectively. The surrounding substrate 109 has a surrounding portion 109a and a hollow portion 109b. The light transmitting member 111 directly covers the surrounding portion 109a of the surrounding substrate 109, and defines a cavity with the hollow portion 109b.

In this embodiment, each of the light-emitting diode devices 1 includes only one light-emitting diode wafer 107. In order to obtain a good quality of the projection light source, a plurality of the light-emitting diode devices 1 of the present embodiment can be combined. For example, in the micro-projection system, three light-emitting diode devices of the present embodiment can be used, and the light-emitting diode devices respectively include light-emitting diode chips of three primary colors of red light, green light and blue light. In addition, the number of light-emitting diode devices can also be adjusted according to demand.

1D is a top view of another embodiment of the light-emitting diode device of the first embodiment of the present invention. In the present embodiment, the LED device 1' further includes a Zener diode 113, so that the LED device 1' can be used. The circuit is regulated. Zener diode 113 series It is placed on the anode portion 103 of the light-emitting diode device 1', and is electrically connected to one of the two cathode portions 105 by a lead. In this embodiment, the voltage regulation of the single light-emitting diode chip is performed by a single Zener diode 113, but the invention is not limited thereto. In the light-emitting diode device 1' of the present embodiment, the remaining components are the same as those of the light-emitting diode device 1 of the first embodiment, and therefore will not be further described herein.

2 is a top view of a light-emitting diode device according to a second embodiment of the present invention. The light-emitting diode device 2 of the present embodiment is similar to the light-emitting diode device 1 of the first embodiment, and the difference is only in the electrode portion. In the present embodiment, the light-emitting diode device 2 includes only one anode portion 201 and one cathode portion 203.

As shown in FIG. 3A to FIG. 3C, the third embodiment of the present invention is also a light-emitting diode device 3 for a micro-projection system. The light-emitting diode device 3 includes a bottom substrate 301 and an anode portion. 303, two cathode portions 305, two light emitting diode wafers 307, a surrounding substrate 309, and a light transmitting element 311, and the two cathode portions 305 are electrically connected to the two light emitting diode wafers 307, respectively. Since the light-emitting diode device 3 of the present embodiment has two light-emitting diode wafers 307, it can also be called a double-crystal light-emitting diode device. The component relationship of this embodiment is also as described in the first embodiment, so it is not emphasized here.

In the present embodiment, each of the light-emitting diode devices 3 includes two light-emitting diode wafers 307. In order to obtain a good quality of the projection light source, a plurality of the light-emitting diode devices 3 of the present embodiment can be combined. For example, in the micro-projection system, three light-emitting diode devices of the present embodiment can be used, and the light-emitting diode devices respectively include red and green light, green light, and blue light, blue light, and red light. Polar body wafer. Those skilled in the art can also push LED combinations of other colors. For example, each LED device can include a light-emitting diode chip of the same color, for example, red light, green light, and Blu-ray. In addition, the number of light-emitting diode devices can also meet the demand And adjust.

3D is a top view of another embodiment of the light-emitting diode device of the third embodiment of the present invention. In the present embodiment, the LED device 3' further includes a Zener diode 313, so that the circuit of the LED device 3' is stabilized. Pressure. The Zener diodes 313 are disposed on the anode portion 303 of the LED device 3', and are electrically connected to the adjacent cathode portions 305 by wires, respectively. In this embodiment, two Zener diodes 313 are respectively used for voltage regulation of two LED chips; based on the foregoing, only a single Zener diode can be used for illumination. The voltage regulation action of the diode chip. In the light-emitting diode device 3' of the present embodiment, the remaining components are the same as those of the light-emitting diode device 3 of the third embodiment, and therefore will not be further described herein.

4A is a top view of a light-emitting diode device according to a fourth embodiment of the present invention. The light-emitting diode device 4 of the present embodiment is similar to the light-emitting diode device 3 of the third embodiment, and the difference is only in the electrode portion. External design, those skilled in the art should be able to easily push other appearances.

Fig. 4B is a top plan view showing another embodiment of the light emitting diode device of the fourth embodiment of the present invention. In the present embodiment, the LED device 4' further includes a Zener diode 413, so that the circuit of the LED device 4' is stabilized. Pressure. The Zener diodes 413 are disposed on the anode portion 403 of the light-emitting diode device 4', and are electrically connected to the adjacent cathode portions 405 by wires, respectively. In this embodiment, two Zener diodes 413 are respectively used for voltage regulation of two LED chips; as described above, only a single Zener diode can be used for illumination. The voltage regulation action of the diode chip. In the light-emitting diode device 4' of the present embodiment, the remaining components are the same as the light-emitting diode of the fourth embodiment. The device 4 is the same, so it will not be described here.

5 is a top view of a light-emitting diode device according to a fifth embodiment of the present invention. Similarly, the light-emitting diode device 5 of the present embodiment is similar to the light-emitting diode device 3 of the third embodiment, and the difference is only The design of the electrode portion is external, and those skilled in the art can easily push other appearances.

As shown in FIGS. 6A to 6C, the sixth embodiment of the present invention is also a light-emitting diode device 6 for a micro-projection system. The LED device 6 includes a bottom substrate 601, an anode portion 603, four cathode portions 605, a three-emitting diode wafer 607, a surrounding substrate 609, and a light transmissive element 611. The three light emitting diode wafers 607 are respectively associated with Three of the cathode portions 605 are electrically connected. Since the light-emitting diode device 6 of the present embodiment has three light-emitting diode wafers 607, it can also be called a three-crystal light-emitting diode device. The component relationship of this embodiment is also as described in the first embodiment, so it will not be repeated here.

In the present embodiment, each of the light-emitting diode devices 6 includes a three-emitting diode wafer 607. In order to obtain a good quality of the projection light source, a plurality of the light-emitting diode devices 6 of the present embodiment can be combined. For example, at least one of the light-emitting diode devices of the present embodiment can be used in a micro-projection system, and the light-emitting diode device includes a light-emitting diode chip of three primary colors of red, green, and blue light, that is, a single The light-emitting diode device provides light of the three primary colors. Those skilled in the art can also push LED combinations of other colors. For example, each LED device can include a light-emitting diode chip of the same color, for example, red light, green light, and Blu-ray. In addition, the number of light-emitting diode devices can also be adjusted according to demand.

Fig. 6D is a top view showing another embodiment of the light-emitting diode device of the sixth embodiment of the present invention. When the application is considered, there may be a problem that the operating current is too high. Therefore, in this embodiment, the LED device 6' further includes a Zener diode 613, thereby The circuit of the light-emitting diode device 6' is regulated. The Zener diode 613 is disposed on the anode portion 603 of the light-emitting diode device 6', and is electrically connected to the cathode portion 605 which is not electrically connected to the light-emitting diode wafer 607. In this embodiment, only a single Zener diode 613 is used as the voltage regulation of the three-emitting diode 607; based on the foregoing, two or three Zener diodes may be used to emit light. The regulation of the polar body chip. In the light-emitting diode device 6' of the present embodiment, the remaining components are the same as those of the light-emitting diode device 6 of the sixth embodiment, and therefore will not be further described herein.

7A is a top view of a light-emitting diode device according to a seventh embodiment of the present invention. The light-emitting diode device 7 of the present embodiment is similar to the light-emitting diode device 6 of the sixth embodiment, and the difference is only in the electrode portion. External design, those skilled in the art should be able to easily push other appearances.

Fig. 7B is a top view showing another embodiment of the light emitting diode device of the seventh embodiment of the present invention. In the present embodiment, the LED device 7' further includes a Zener diode 713, so that the circuit of the LED device 7' is stabilized. Pressure. The Zener diodes 713 are disposed on the anode portion 703 of the light-emitting diode device 7', and are electrically connected to the adjacent cathode portions 705 by wires, respectively. In this embodiment, the two Zener diodes 713 are used as the voltage regulator of the three-emitting diode chip; based on the foregoing, a single or three Zener diodes may be used for the light-emitting diode. The voltage regulation action of the body wafer. In the light-emitting diode device 7' of the present embodiment, the remaining components are the same as those of the light-emitting diode device 7 of the seventh embodiment, and therefore will not be further described herein.

As shown in FIG. 8A to FIG. 8C, the eighth embodiment of the present invention is also a light-emitting diode device 8 for a micro-projection system. The LED device 8 includes a bottom substrate 801 and an anode portion 803. Four cathode portions 805, four light emitting diode wafers 807, A four-cavity portion 805 is electrically connected to the four-light-emitting diode wafer 807, respectively, around the substrate 809 and a light-transmitting member 811. Since the light-emitting diode device 8 of the present embodiment has four light-emitting diode chips 807, it can also be called a four-crystal light-emitting diode device. The component relationship of this embodiment is also as described in the first embodiment, and therefore will not be described again. The four light emitting diode (LED) wafers 807 can be a red LED chip, a two green LED chip, and a blue LED chip.

Fig. 8D is a top view showing another embodiment of the light-emitting diode device of the eighth embodiment of the present invention. In the embodiment, the LED device 8' further includes a four-nano diode 813, so that the circuit of the LED device 8' is stabilized. Pressure. The Zener diodes 813 are disposed on the anode portion 803 of the LED device 8', and are electrically connected to the adjacent cathode portions 805 by wires, respectively. In this embodiment, four Zener diodes 813 are respectively used for voltage regulation of four LED chips; based on the foregoing, a single or other number of Zener diodes may also be used. Thereby, the voltage regulation action of the light emitting diode chip is performed. In the light-emitting diode device 8' of the present embodiment, the remaining components are the same as those of the light-emitting diode device 8 of the eighth embodiment, and thus will not be further described herein.

9 is a top view of a light-emitting diode device according to a ninth embodiment of the present invention. The light-emitting diode device 9 of the present embodiment is similar to the light-emitting diode device 8 of the eighth embodiment, and the difference is only in the electrode portion. External design, those skilled in the art should be able to easily push other appearances.

In each of the above embodiments and embodiments, the light transmissive element is a glass, especially a light resistant refractive glass. In other implementations, the light transmissive element can also be an optically designed lens; in practical applications, the micro projection system does not need to be covered. A clear glass or lens can also be covered with a simple lens for shipment. Furthermore, the above-described light-emitting diode devices each have a surrounding substrate, and may be omitted in practical applications.

As described in the preceding paragraph, those skilled in the art can separately push: as shown in the cross-sectional view of FIG. 10A, a flat glass with light refraction and a light-emitting diode device 10a surrounding the substrate; a section as shown in FIG. 10B The figure shows a light-emitting diode device 10b that is resistant to light-refracting and does not have a surrounding substrate; as shown in the cross-sectional view of FIG. 11A, a convex lens is used and has a light-emitting diode device 11a surrounding the substrate; As shown in the cross-sectional view of Fig. 11B, a convex lens is used and the light-emitting diode device 11b surrounding the substrate is not provided.

In addition, in each of the above embodiments and embodiments, the surrounding substrate is a low temperature co-fired ceramic (LTCC), and the bottom substrate is an aluminum nitride (AlN), and the aluminum nitride is A very small number of non-metallic solids with high thermal conductivity and electrical insulation are a good ceramic substrate material. Since the ceramic substrate is used for both the surrounding substrate and the bottom substrate, heat dissipation is good, and since the operating current of the application end of the light-emitting diode device is not high, there is no problem in heat dissipation.

In addition, a positioning hole for alignment of the production line machine is arranged on the surrounding substrate, and the alignment hole can be designed according to the characteristics of the production line machine, thereby manufacturing and assembling the LED device more preferably. The accuracy.

Furthermore, in the present invention, in consideration of the tin area of the electrode portion at the module end, in the light-emitting diode device of the present invention, the area of the electrode portion of the back surface is designed to the maximum under the conditions of the existing process fabrication, and The heat dissipating electrode portion and the anode portion are shared to promote heat dissipation of the light emitting diode chip.

The LED chip of the invention can adopt vertical wafer or water according to application requirements Flat wafer. In addition, the electrode type of the LED chip is not limited. When the two electrodes of the LED chip are respectively located at the bottom, the two electrodes of each LED chip can be substantially opposite to the anode portion and the corresponding cathode portion. Contacting, thereby achieving electrical connection; and when the two electrode systems of the LED chip are respectively located at the top, the two electrodes of each LED chip can be electrically connected to the anode portion and the corresponding cathode portion through the wire bonding respectively .

For the micro-projection system, the smaller the pitch of the wafer in the package, the better. In order to meet the limits of the substrate process and the die bonding machine, the present invention has a new design of the electrode portion, except that there is no problem in the substrate process. In addition, it can also respond to the limits of the die bonding machine and the error of the machine. In addition, for the component quality, the common anode design of the present invention is easy to detect, which provides a more reliable guarantee of shipping quality.

To integrate a micro-projection system into a mobile phone, the micro-projection system must be at least 6 cc in volume and less than 7 mm in total thickness. The LED device package is designed to match the size of the wafer and the process, and is thin-oriented with the micro-projection system. The substrate is designed to be the smallest size that can tolerate the above problems, and the width is only 3.6mm. It is conducive to the miniaturization of the projection system, and will occupy the size advantage in the thin mobile phone and other electronic products market in the future.

The biggest feature of this substrate is the design of the electrode part of the die bonding area. Since the micro-projection system is based on a small screen, and the magnified image is a large screen, the amount of defects that can be tolerated inside the micro-projection system is extremely low, and according to the formula of the etendue (Etendue=A×Ω), The main focus of the light source design in the micro-projection system is the light-emitting area and the angle of illumination.

In order to reduce the light-emitting area, the wafer pitch of the light-emitting diode must be reduced. That is, the smaller the pitch of the wafer is, the better the efficiency of the microprojection system is. Therefore, the present invention designs the solid crystal region as a large-area anode portion (ie, a common anode) capable of accommodating a plurality of light-emitting diode chips, but not directly The area is divided into several anode sections. Therefore, within the allowable range of the capacity of the production machine (the error of the machine is about ±40μm), the wafer pitch can be greatly reduced (<0.07mm), which can increase the output efficiency of the micro-projection system and better meet the customer's requirements. Application requirements. At present, the functional area of the substrate has been reduced to the limit of the process capability, and as the future process progresses, the size of the light-emitting diode device of the present invention is further reduced.

For different micro-projection systems and their internal optical path design, the light-emitting diode device of the present invention has a single crystal, two crystal, three crystal and four crystal package forms respectively, and can be designed into three or two for the optical path design. An optical path, for the design and manufacture of micro-projection systems, the design scheme and material selection are more diverse, and there is no need to cooperate with the light path design micro-projection system of the light-emitting diode device, and the most suitable matching can be found from the needs of the micro-projection system. combination.

Furthermore, the color of the LED chip and the package of the LED device can be matched with the requirements. It is well known that those skilled in the art can easily push various combinations, so the arrangement and color of the LED chip are easily The embodiments and aspects provided above are not limited, and may be, for example, single crystal + two crystal, three single crystals, etc., in order to meet the light source requirements of the micro projection system. The matching or arrangement of the wafers in the package of each LED device is selected according to requirements, and the matching elasticity is high.

The package of the light-emitting diode device of the invention does not need to be filled, but directly covers a piece of anti-light-refracting glass, thereby effectively reducing the refraction of light, so that the light-emitting diode device becomes a light source instead of a light source, maintaining the original poly Light effect; therefore, in mass production A lot of cost and man-hours are reduced; in addition, if the lens is replaced, the internal unfilled package can also be used to ensure high reliability.

As described in the above paragraph, the light-emitting diode device of the present invention has various package forms. In view of the size requirements of today's miniature projection systems, the secondary optics are directly designed on the package, so that the LED device can be directly optically designed in addition to the light source. Therefore, it can be matched with lenses of different angles and shapes, and the packaging method is very flexible, which is different from the flexibility of the conventional LED device in the package, which can reduce the effort on the optical design and process of the micro-projection system. .

The embodiments described above are only intended to illustrate the embodiments of the present invention, and to explain the technical features of the present invention, and are not intended to limit the scope of the present invention. Any changes or equivalents that can be easily made by those skilled in the art are within the scope of the invention, and the scope of the invention should be determined by the scope of the claims.

1‧‧‧Lighting diode device

1'‧‧‧Lighting diode device

101‧‧‧Bottom substrate

103‧‧‧Anode

105‧‧‧Cathode

107‧‧‧Light Emitting Diode Wafer

109‧‧‧ surrounding substrate

109a‧‧‧ Surrounding

109b‧‧‧ Hollow

111‧‧‧Lighting element

113‧‧‧Zina diode

2‧‧‧Lighting diode device

201‧‧‧Anode

203‧‧‧ Cathode

3‧‧‧Lighting diode device

3'‧‧‧Lighting diode device

301‧‧‧Bottom substrate

303‧‧‧Anode

305‧‧‧ Cathode

307‧‧‧Light Emitter Wafer

309‧‧‧ surrounding substrate

311‧‧‧Lighting components

313‧‧‧Zina diode

4‧‧‧Lighting diode device

4'‧‧‧Lighting diode device

403‧‧‧Anode

405‧‧‧ Cathode

413‧‧‧Zina diode

5‧‧‧Lighting diode device

6‧‧‧Lighting diode device

6'‧‧‧Lighting diode device

601‧‧‧ bottom substrate

603‧‧‧Anode

605‧‧‧Cathode

607‧‧‧Light Emitter Wafer

609‧‧‧round substrate

611‧‧‧Lighting components

613‧‧ ‧ Zener diode

7‧‧‧Lighting diode device

7'‧‧‧Lighting diode device

703‧‧‧Anode

705‧‧‧ Cathode

713‧‧‧Zina diode

8‧‧‧Lighting diode device

8'‧‧‧Lighting diode device

801‧‧‧Bottom substrate

803‧‧‧Anode

805‧‧‧Cathode

807‧‧‧Light Emitter Wafer

809‧‧‧ surrounding substrate

811‧‧‧Lighting components

813‧‧‧Zina diode

9‧‧‧Lighting diode device

10a‧‧‧Lighting diode device

10b‧‧‧Lighting diode device

11a‧‧‧Lighting diode device

11b‧‧‧Lighting diode device

1A is a top view of a light emitting diode device according to a first embodiment of the present invention; FIG. 1B is a perspective view of a light emitting diode device according to a first embodiment of the present invention; and FIG. 1C is a light emitting device according to a first embodiment of the present invention; 1D is a top view of another embodiment of a light-emitting diode device according to a first embodiment of the present invention; and FIG. 2 is a top view of a light-emitting diode device according to a second embodiment of the present invention; 3A is a top view of a light-emitting diode device according to a third embodiment of the present invention; FIG. 3B is a perspective view of a light-emitting diode device according to a third embodiment of the present invention; and FIG. 3C is a light-emitting diode according to a third embodiment of the present invention; A cross-sectional view of a polar device; a third embodiment is another embodiment of a light-emitting diode device according to a third embodiment of the present invention 4A is a top view of a light-emitting diode device according to a fourth embodiment of the present invention; FIG. 4B is a top view of another embodiment of the light-emitting diode device according to the fourth embodiment of the present invention; Figure 6 is a top view of a light-emitting diode device according to a fifth embodiment of the present invention; Figure 6A is a top view of a light-emitting diode device according to a sixth embodiment of the present invention; and Figure 6B is a light-emitting diode of a sixth embodiment of the present invention; FIG. 6C is a cross-sectional view of a light-emitting diode device according to a sixth embodiment of the present invention; FIG. 6D is a top view of another embodiment of the light-emitting diode device of the sixth embodiment of the present invention; Figure 7 is a top view of a light-emitting diode device according to a seventh embodiment of the present invention; Figure 7B is a top view of another embodiment of the light-emitting diode device of the seventh embodiment of the present invention; FIG. 8B is a perspective view of a light-emitting diode device according to an eighth embodiment of the present invention; FIG. 8C is a cross-sectional view of a light-emitting diode device according to an eighth embodiment of the present invention; Figure 1 is another embodiment of the light-emitting diode device of the eighth embodiment of the present invention FIG. 9 is a top view of a light-emitting diode device according to a ninth embodiment of the present invention; FIG. 10A is a cross-sectional view showing an application aspect of the light-emitting diode device of the present invention; FIG. 10B is a view A cross-sectional view showing another application aspect of the light-emitting diode device; FIG. 11A is a cross-sectional view showing another application aspect of the light-emitting diode device of the present invention; and FIG. 11B is a light-emitting diode device of the present invention. Another cross-sectional view of the application.

1‧‧‧Lighting diode device

101‧‧‧Bottom substrate

103‧‧‧Anode

105‧‧‧Cathode

107‧‧‧Light Emitting Diode Wafer

109‧‧‧ surrounding substrate

109a‧‧‧ Surrounding

109b‧‧‧ Hollow

111‧‧‧Lighting components

Claims (15)

A light emitting diode device for a micro projection system, comprising: a bottom substrate; an anode portion disposed on the bottom substrate; at least one cathode portion disposed on the bottom substrate; and a plurality of light emitting diodes ( a light emitting diode (LED) chip is disposed on the anode portion, the LED chips are electrically connected to the anode portion, and the LED chips are electrically connected to the at least one cathode portion, and the distance between the LED chips is less than a transparent component covering the bottom substrate to define a cavity; and a surrounding substrate having a surrounding portion and a hollow portion, the transparent component directly covering the surrounding substrate, the hollow The cavity defines the cavity, and the cavity is a non-filler. The light-emitting diode device of claim 1, wherein the light-transmitting element is a glass or a lens. The light-emitting diode device of claim 2, wherein the glass is a light-resistant refractive glass. The illuminating diode device of claim 1, further comprising at least one Zener diode. The light emitting diode device of claim 1, wherein the bottom substrate is an aluminum nitride (AlN) substrate. The illuminating diode device of claim 1, wherein the surrounding substrate is a low temperature co-fired ceramic substrate (LTCC, Low Temperature Co-fired). Ceramic). A light emitting diode device for a micro projection system, comprising: a bottom substrate; an anode portion disposed on the bottom substrate; a plurality of cathode portions disposed on the bottom substrate; and a plurality of light emitting diodes ( a light emitting diode (LED) chip is disposed on the anode portion, the LED chips are electrically connected to the anode portion, and each of the LED chips is electrically connected to each of the cathode portions, and the number of the LED chips is The same as the number of the cathode portions; a light transmissive member covering the base substrate to define a cavity; and a surrounding substrate having a surrounding portion and a hollow portion, the light transmitting member directly covering the surrounding The cavity is defined by the hollow portion on the substrate. The illuminating diode device of claim 7, wherein the LED chips are vertical wafers or horizontal wafers. The illuminating diode device of claim 7, wherein the LED chips are one of a red LED chip, a green LED chip, and a blue LED chip. The illuminating diode device of claim 7, wherein the number of the LED chips is two, and the number of the cathode portions is two, and is electrically connected to the two LED chips respectively. The illuminating diode device of claim 10, wherein the two LED chips are a red LED chip and a green LED chip, a red LED chip and a blue LED chip, or a green LED chip. And a blue LED chip. The illuminating diode device of claim 7, wherein the number of the LED chips is three, and the number of the cathode portions is three, and is electrically connected to the three LED chips respectively. The illuminating diode device of claim 12, wherein the three LED chips are a red LED chip, a green LED chip, and a blue LED chip. The illuminating diode device of claim 7, wherein the number of the LED chips is four, and the number of the cathode portions is four, and is electrically connected to the four LED chips. The illuminating diode device of claim 14, wherein the four LED chips are a red LED chip, a two green LED chip, and a blue LED chip.