TWI487067B - Reinforced substrate and method for fabricating the same - Google Patents

Description

Strengthened substrate and method of manufacturing same

The present invention relates to a substrate and a method of fabricating the same, and more particularly to a reinforced substrate and a method of fabricating the same.

Today, display panels are widely used, and many display panels are used in various portable electronic products such as personal digital assistants (PDAs), mobile phones, and tablet PCs. Since these portable electronic products are often provided with a touch function and are easily dropped during carrying or use, the substrate strength of the display panel particularly needs to be strengthened.

In the prior art, a method of manufacturing a reinforced substrate is as follows: First, the mother board is first cut into a plurality of small substrates. Next, the edge substrate is subjected to an edge grinding step. Then, the small substrate is subjected to a strengthening processing step to form a reinforcing substrate. After that, these reinforced substrates are separately processed (for example, a touch panel or a black matrix process, etc.). However, this method is complicated, time consuming, and costly.

Another method of manufacturing the reinforced substrate is as follows: First, the mother board is subjected to a strengthening processing step to form a reinforced mother board. Then, the strengthening mother board is subjected to a subsequent process (for example, a touch panel or a black matrix process, etc.). Thereafter, the reinforcing mother board is subjected to a cutting step to form a reinforcing substrate. However, in the process of cutting the strengthened mother board, the strength of the strengthened mother board in the dicing area is high, so that the strengthening mother board is prone to cracking and cracking during the cutting process, which leads to a decrease in the yield of the strengthened substrate. In view of the above, how to develop a reinforced substrate process with higher yield and lower cost is one of the goals that developers are trying to achieve.

The present invention provides a method of manufacturing a reinforced substrate, which can improve the yield of the reinforced substrate and effectively reduce the manufacturing cost.

The present invention provides a reinforced substrate which has a high yield and a low manufacturing cost.

The invention provides a method for manufacturing a strengthened substrate, comprising: providing a mother board having a dicing area; forming a barrier layer in the dicing area of the mother board; and using the barrier layer as a reinforcing barrier layer to strengthen the mother board The processing step forms a strengthening mother board; the cutting step of the reinforcing mother board is subjected to a cutting step to form a plurality of reinforcing substrates; and an edge grinding step is performed on the edges of the reinforcing substrate.

The present invention provides a reinforced substrate, including a substrate. The substrate has an upper surface, a lower surface, and a plurality of side surfaces, and the edge of the substrate has a scribe line region. The substrate has a first strengthening region, a second strengthening region and an unreinforced region. The first strengthening region extends from the upper surface to the inside of the substrate, and the second strengthening region extends from the lower surface to the inside of the substrate, and the unreinforced region is located. Cutting the road area and side surfaces.

Based on the above, in the method for manufacturing a reinforced substrate of the present invention, by forming a barrier layer in the dicing area of the mother board before performing the reinforced processing step, the dicing area in the reinforcing mother board is easier to cut, and further Effectively increase the yield of the reinforced substrate and reduce its manufacturing cost.

The above described features and advantages of the present invention will be more apparent from the following description.

1 to FIG. 6 are schematic diagrams showing a manufacturing process of a reinforced substrate according to an embodiment of the present invention. Referring to FIG. 1, a motherboard 100 is first provided, and the motherboard 100 has a dicing area 102. In the present embodiment, the mother board 100 has an upper surface S ₁ and a lower surface S ₂ , and the scribe line area 102 may include a first scribe line area 102a and a second scribe line area 102b, which are respectively located on the upper surface S ₁ and the lower surface S ₂ . Wherein, the first scribe line region 102a corresponds to the second scribe line region 102b, and preferably the first scribe line region 102a is substantially aligned with the second scribe line region 102b.

In the present embodiment, the pattern of the cutting zone 102 (the first cutting zone 102a, the second cutting zone 102b) can be appropriately designed according to the shape of the effective zone 104. For example, when the shape of the effective area 104 is a rectangle, the pattern of the cutting area 102 (the first cutting path area 102a and the second cutting path area 102b) may be a pattern formed by a plurality of elongated staggered arrangements, such as This is shown in Figure 1, but the invention is not limited thereto.

In the present embodiment, the width of the scribe line region 102 can be appropriately adjusted according to the arrangement of the active area 104 on the motherboard 100 and the process window of the cutting step. For example, the width W of the first scribe line region 102a and the second scribe line region 102b may be between 50 and 400 microns.

The material of the mother board 100 of the present embodiment is, for example, glass. However, the present invention is not limited thereto. In other embodiments, the material of the mother board 100 may be quartz, germanium or other suitable materials.

Next, referring to FIG. 2, a barrier layer 106 is formed in the scribe line region 102 of the motherboard 100. In the present embodiment, the mother board 100 has an upper surface S ₁ and a lower surface S ₂ , and the barrier layer 106 includes a first barrier layer 106a and a second barrier layer 106b, which are respectively formed on the first secant of the upper surface S _{1 On} the second chute region 102b of the upper and lower surfaces S2 of the region 102a, as shown in FIG. However, the present invention is not limited thereto, in other embodiments, barrier layer 106 may be formed only on the upper surface S ₁ of the first cutting region 102a or lower surface S ₂ of the second cutting channel region 102b.

In the present embodiment, the function of the barrier layer 106 (the first barrier layer 106a and the second barrier layer 106b) is as a strengthening barrier layer so as to be located in the barrier layer 106 (the first barrier layer 106a and the second barrier layer 106b) The lower part of the motherboard 100 is not easily strengthened. In this embodiment, the material of the barrier layer 106 (the first barrier layer 106a and the second barrier layer 106b) may include a metal material, a dielectric material, or an organic polymer material. For example, the material of the barrier layer 106 (the first barrier layer 106a and the second barrier layer 106b) may include molybdenum (Mo), molybdenum tungsten (MoW), aluminum (Al), aluminum telluride (AlNd), titanium ( Ti), SiOx, SiNx or photoresist.

It should be noted that, in this embodiment, the materials of the first barrier layer 106a and the second barrier layer 106b may be the same or different. The material of the barrier layer 106 can be appropriately selected in conjunction with the subsequent process to be performed. For example, when the subsequent process to be performed is a black matrix fabrication process, the material of the barrier layer 106 may be selected from the same material as the black matrix, such as a metal material or a light-shielding resin or a combination of the materials. In this way, the black matrix and the barrier layer can be simultaneously formed, and the process is simplified.

In the present embodiment, the method of forming the barrier layer 106 (the first barrier layer 106a and the second barrier layer 106b) may include performing a printing process, an attaching process, an exposure process, an etching process, or a combination thereof. For example, when the material of the first barrier layer 106a is a metal material (for example, molybdenum) and the material of the second barrier layer 106b is a photosensitive organic polymer material (for example, a photoresist), the method of forming the barrier layer 106 is, for example, the following 7A to 7E are schematic cross-sectional views showing a process of fabricating a barrier layer according to an embodiment of the present invention. Referring to FIG. 7A, a metal material layer 105a is _first formed on the upper surface S1 of the mother board 100. Referring to Figure 7B, then the surface of the motherboard 100 S ₂ forming a photosensitive organic polymer material layer 105b. Referring to FIG. 7C, the metal material layer 105a is then patterned to form a first barrier layer 106a on the first scribe region 102a. Referring to FIG. 7D and FIG. 7E, the photosensitive organic polymer material layer 105b is then patterned by using the first barrier layer 106a as an exposure mask to form a second barrier layer 106b on the second scribe region 102b. However, the present invention is not limited thereto. In other embodiments, when the material of the first barrier layer 106a is a metal material (for example, molybdenum), and the material of the second barrier layer 106b is a dielectric material (for example, tantalum nitride), the formation is performed. The method of the barrier layer 106 is as follows: FIG. 8A to FIG. 8E are schematic cross-sectional views showing a process of fabricating a barrier layer according to an embodiment of the present invention. Referring to FIG. 8A, a metal material layer 105a is _first formed on the upper surface S1 of the mother board 100. Referring to FIGS. 8A and 8B, the metal material layer 105a is then patterned to form a first barrier layer 106a on the first scribe region 102a. Referring to Figure 8C, is then formed in the dielectric material layer 105b surface of the motherboard 100 S ₂ '. Then, a photosensitive organic polymer material layer 105b'-1 is formed on the dielectric material layer 105b'. Referring to FIG. 8D, the photosensitive organic polymer material layer 105b'-1 is then patterned using the first barrier layer 106a as an exposure mask. Referring to FIG. 8D and FIG. 8E, the patterned photosensitive organic polymer material layer 105b'-1 is then used as an etch mask patterned dielectric material layer 105b' to form a second barrier layer 106b.

Next, referring to Fig. 3, the barrier layer 106 is used as a barrier layer to strengthen the mother substrate 100 to form a reinforcing mother substrate 100'. In this embodiment, the intensive processing step includes a chemical strengthening treatment. For example, this chemical strengthening treatment can be an ion exchange process. Specifically, when the material of the mother board 100 is soda glass, the mother board 100 can be immersed in a potassium nitrate molten salt to make sodium having a small atomic radius in the mother board 100 (soda glass). The ion is replaced by a potassium ion having a larger atomic radius in a potassium nitrate molten salt. After the potassium ions having a large atomic radius enter the mother substrate 100 (soda glass), they are mutually compressed on the surface of the mother substrate 100 (soda glass), thereby causing a compression stress on the surface of the mother substrate 100 (soda glass), thereby The mother board 100 (soda glass) is reinforced. However, the invention is not limited thereto, and in other embodiments, the intensive processing step may be other suitable methods.

It should be particularly noted that, in the reinforced processing step of the embodiment, the region not covered by the barrier layer 106, that is, the active region 104, may be appropriately strengthened, and the dicing region covered by the barrier layer 106 102 is not easily strengthened. In other words, the scribe line region 102 covered by the barrier layer 106 has a lower strength, making the scribe line region 102 easier to cut.

Next, referring to Fig. 4, in the present embodiment, after the strengthening mother substrate 100' is formed, an element layer 108 may be further formed in the active region 104 in the reinforcing mother substrate 100'. The component layer 108 can be a black matrix layer, a touch panel wiring layer, a thin film transistor layer, or other component layer to be formed.

Next, referring to Fig. 5, a dicing step 102 of the reinforcing mother board 100' is performed to form a plurality of reinforcing substrates 100A. In the present embodiment, a scribe break method using a diamond or a superhard alloy wheel chip, a dicer cutting method using a diamond grinding wheel, or a thunder can be used. The laser cutting method is used to perform the cutting step, but the invention is not limited thereto.

It is worth mentioning that in other embodiments, a step of removing the barrier layer 106 may be further included before the cutting step. For example, when the material of the barrier layer 106 is an organic polymer material (for example, a photoresist), a step of removing the barrier layer 106 may be performed after forming the reinforcing mother substrate 100'. However, it is not limited thereto, and the materials listed in the present invention or any materials that can be used for the barrier layer can be determined according to the needs of the designer.

9 is a schematic cross-sectional view of a reinforced substrate according to an embodiment of the present invention. Referring to FIG. 9 , the reinforced substrate 100A of the present embodiment may include a substrate 100 a having an upper surface P ₁ , a lower surface P _{2 ,} and a plurality of side surfaces P ₃ , and the edge of the substrate 100 a has a cutout region 102 ′. . The substrate 100a has a first strengthening region R ₁ , a second strengthening region R ₂ and an unreinforced region R ₃ . The first strengthening region R ₁ extends from the upper surface P ₁ to the inside of the substrate _{100 a} , and the second strengthening region R ₂ The lower surface P ₂ extends toward the inside of the substrate 100a, and the unreinforced region R ₃ is located at the scribe line region 102' and the side surface P ₃ .

In the present embodiment, the width W' of the scribe line region 102' at the edge of the substrate 100a is, for example, 25 to 200 μm. The thickness D of the substrate 100a is, for example, 0.3 to 6.0 cm, and the depth d at which the substrate 100a is strengthened is, for example, 10 to 100 μm. The material of the substrate 100a of the present embodiment is, for example, glass. However, the present invention is not limited thereto. In other embodiments, the material of the substrate 100a may be quartz, germanium or other suitable materials.

Furthermore, the reinforced substrate 100A of the present embodiment may further include a barrier layer 106 located in the scribe lane region 102'. More specifically, the substrate 100A of the present embodiment to strengthen the embodiment may include a first barrier layer 106a and the second barrier layer 106b, which are located at the surface of _{P. 1} on the substrate P and the lower surface 100a _2, as shown in Fig. However, the present invention is not limited thereto, and in another embodiment, the reinforcing substrate 100A can include only the lower surface 100a of the substrate P on the first barrier layer _{106a. 1} or a surface 100a of the substrate P ₂ of the second barrier layer 106b, As shown in Figures 10 and 11 . In yet another embodiment, the reinforcement substrate 100A may also not include the barrier layer 106, as shown in FIG.

In this embodiment, the material of the barrier layer may include a metal material, a dielectric material, or an organic polymer material. The materials of the first barrier layer 106a and the second barrier layer 106b may be the same or different.

In addition, the reinforcing substrate 100A of the present embodiment may further include an element layer 108. The element layer 108 may be located on the upper surface P ₁ , the lower surface P ₂ or the upper surface P ₁ and the lower surface P ₂ of the reinforcing substrate 100A. In more detail, the element layer 108 may be located above the first strengthening region R ₁ , the second strengthening region R ₂ or the first strengthening region R ₁ and the second strengthening region R ₂ . For example, component layer 108 (eg, a black matrix layer) may be located on first enhancement region R ₁ and another component layer 108 (eg, a touch panel wiring layer) may be located on second enhancement region R ₂ . However, the invention is not limited thereto.

Next, referring to FIG. 6, after the reinforced substrate 100A is completed, an edge grinding step is performed on the edge of the reinforced substrate 100A. For example, it is preferable that the first barrier layer 106a, the second barrier layer 106b, and a portion of the substrate 100a between the first barrier layer 106a and the second barrier layer 106b in the bonding substrate 100A are completely removed. . In this way, in addition to the partial grinding of the surface of the substrate 100a which is not reinforced, the crack in the reinforcing substrate 100A, for example, caused by the cutting step can be simultaneously removed, thereby allowing the edge grinding step to be performed. The strength of the reinforced substrate 100A is optimized, but the invention is not limited thereto. In this embodiment, the edge grinding step is, for example, a mechanical grinding step or other suitable grinding step. .

FIG. 13 is a cross-sectional view showing the substrate 100A after the edge grinding step according to an embodiment of the present invention. As is clear from FIG. 13, in the present embodiment, the reinforced substrate 100A after the edge grinding step has a first barrier layer 106a, a second barrier layer 106b, and a first barrier layer 106a and a second barrier. A portion of the substrate 100a between the layers 106b is abraded, leaving only the substrate 100a corresponding to the active region 104 and the component layer 108 thereon. It is worth mentioning that this strengthening of the edge-grinding step of the substrate surface 100A on which P ₁ P ₂ and the lower surface of the reinforced region R is still having a first region and a second reinforcing R _{2 1,} such that this edge-grinding step The reinforcing substrate 100A is preferably of strong strength.

In summary, in the manufacturing method of the reinforced substrate of the present invention, the dicing area in the reinforcing mother board is easier to cut by forming a barrier layer in the scribe line area of the mother board before performing the reinforced processing step. , thereby increasing the yield of the reinforced substrate and effectively reducing the manufacturing cost thereof. In addition, the strength of the strengthened substrate after the edge grinding step can be further improved by the edge grinding step.

100. . . motherboard

100’. . . Reinforced motherboard

100A. . . Reinforced substrate

100a. . . Substrate

102, 102a, 102b. . . Cutting road area

104. . . Effective area

105a. . . Metal material layer

105b, 105b’-1. . . Photosensitive organic polymer material layer

105b'‧‧‧ dielectric material layer

106, 106a, 106b‧‧‧ barrier

108‧‧‧Component layer

W, W’‧‧‧Width

D‧‧‧thickness

D‧‧‧depth

S ₁ , S ₂ , P ₁ , P ₂ ‧‧‧ surface

R ₁ , R ₂ , R ₃ ‧‧‧ areas

1 to FIG. 6 are schematic diagrams showing a manufacturing process of a reinforced substrate according to an embodiment of the present invention.

7A to 7E and 8A to 8E are schematic diagrams showing a process of fabricating a barrier layer according to an embodiment of the present invention.

9, FIG. 10, FIG. 11, and FIG. 12 are schematic cross-sectional views of a reinforced substrate according to an embodiment of the present invention.

FIG. 13 is a cross-sectional view showing the substrate after the edge grinding step according to an embodiment of the present invention.

100. . . motherboard

100’. . . Reinforced motherboard

102, 102a, 102b. . . Cutting road area

104. . . Effective area

106, 106a, 106b. . . Barrier layer

S ₁ , S ₂ . . . surface

Claims (13)

A method for manufacturing a reinforced substrate, comprising: providing a mother board having a dicing area; forming a barrier layer in the dicing area of the mother board; using the barrier layer as a reinforcing barrier layer The mother board performs a strengthening processing step to form a strengthening mother board; the cutting path area of the strengthening mother board is subjected to a cutting step to form a plurality of reinforcing substrates; and an edge grinding step is performed on the edges of the reinforcing substrates The motherboard has an upper surface and a lower surface, and the barrier layer includes a first barrier layer and a second barrier layer formed on the upper surface and the lower surface, respectively, to form the first barrier layer and The method of the second barrier layer comprises: forming the first barrier layer on the scribe line region of the upper surface of the motherboard; forming a layer of photosensitive organic polymer material on the lower surface of the motherboard; and utilizing The first barrier layer serves as an exposure mask, and the photosensitive organic polymer material layer is subjected to a patterning process to form the second barrier layer. The method of manufacturing a reinforced substrate according to claim 1, wherein the step of removing the barrier layer is further included before the dicing step. The method for manufacturing a reinforced substrate according to the first aspect of the invention, wherein the material of the first barrier layer and the second barrier layer may be the same or different. The method for manufacturing a reinforced substrate according to claim 1, wherein the method of forming the first barrier layer and the second barrier layer further comprises: forming the photosensitive organic polymer material on the lower surface of the motherboard Forming a dielectric material layer on the lower surface of the mother board before the layer; and patterning the dielectric material layer by using the patterned photosensitive organic polymer material layer as an etching mask to form The second barrier layer. The method for manufacturing a reinforced substrate according to claim 1, wherein the material of the barrier layer comprises a metal material, a dielectric material or an organic polymer material. The method of manufacturing a reinforced substrate according to claim 1, wherein the reinforced processing step comprises a chemical strengthening treatment. The method for manufacturing a reinforced substrate according to claim 1, wherein the substrate has a thickness of 0.3 to 6.0 cm, and the substrate is reinforced to a depth of 10 to 100 μm. The method of manufacturing a reinforced substrate according to claim 1, wherein the scribe line region has a width of 50 to 400 μm. A reinforced substrate includes: a substrate having an upper surface, a lower surface, and a plurality of side surfaces, and an edge of the substrate has a scribe line region, wherein the substrate has a first strengthening region and a second strengthening region And an unreinforced region, the first strengthening region extends from the upper surface to the inside of the substrate, the second strengthening region extends from the lower surface to the inside of the substrate, and the unreinforced region is located in the cutting channel region and the Side surfaces; a barrier layer is disposed in the scribe line region, wherein the barrier layer comprises a first barrier layer and a second barrier layer respectively located on the upper surface and the lower surface of the substrate, the first barrier layer and a second layer a barrier layer, the first barrier layer being aligned with the second barrier layer. The reinforced substrate of claim 9, wherein the material of the first barrier layer and the second barrier layer may be the same or different. The reinforced substrate of claim 9, wherein the material of the barrier layer comprises a metal material, a dielectric material or an organic polymer material. The reinforced substrate of claim 9, wherein the substrate has a thickness of 0.3 to 6.0 cm, and the first reinforcement region and the second reinforcement region each have a depth of 10 to 100 μm. The reinforced substrate of claim 9, wherein the scribe line region has a width of 25 to 200 μm.