TWI486671B - Active array substrate and fabricating method thereof - Google Patents
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本發明是有關於一種主動陣列基板及其製造方法,且特別是有關於一種防止水氣傳導至主動區域的主動陣列基板及其製造方法。The present invention relates to an active array substrate and a method of fabricating the same, and more particularly to an active array substrate that prevents moisture from being conducted to an active region and a method of fabricating the same.
液晶(liquid crystal,LC)顯示面板一般為主動陣列基板及對向基板組立而成,為了使液晶顯示面板中的液晶可以順利轉動,液晶一般會與主動陣列基板呈現一預設角度。因此,會在主動陣列基板上配置一配向膜(alignment layer),以使液晶與主動陣列基板呈現此預設角度。並且,配向膜通常會覆蓋整個主動陣列基板,以致於液晶顯示面板在組立封裝之後,液晶顯示面板外的水氣可能會經由配向膜傳導至液晶顯示面板內部。當水氣傳導至液晶顯示面板的主動區域時,主動區域上的液晶的光學特性會受水氣的影響,以致於影響液晶顯示面板的顯示效果。The liquid crystal (LC) display panel is generally formed by the active array substrate and the opposite substrate. In order to enable the liquid crystal in the liquid crystal display panel to rotate smoothly, the liquid crystal generally presents a predetermined angle with the active array substrate. Therefore, an alignment layer is disposed on the active array substrate to cause the liquid crystal and the active array substrate to exhibit the preset angle. Moreover, the alignment film usually covers the entire active array substrate, so that after the liquid crystal display panel is assembled, the moisture outside the liquid crystal display panel may be conducted to the inside of the liquid crystal display panel via the alignment film. When the water vapor is conducted to the active region of the liquid crystal display panel, the optical properties of the liquid crystal on the active region may be affected by moisture, so as to affect the display effect of the liquid crystal display panel.
本發明提供一種主動陣列基板,可防止水氣透過配向膜傳導至主動區域。The present invention provides an active array substrate that prevents moisture from passing through the alignment film to the active region.
本發明提出一種主動陣列基板,包括一基板、一導電層及一配向膜。基板具有一主動區域、一無配向區域及一框膠區域,其中無配向區域圍繞主動區域,框膠區域圍繞 主動區域及無配向區域。導電層配置於基板上,且形成一溝槽,其中溝槽對應無配向區的部分填滿一第一疏離材質,且第一疏離材質經一表面處理。配向膜配置於導電層上非對應無配向區域的部分,且配向膜由一配向膜溶液所形成,其中配向膜溶液與經表面處理的第一疏離材質相互排斥。The invention provides an active array substrate comprising a substrate, a conductive layer and an alignment film. The substrate has an active area, an unaligned area and a sealant area, wherein the unaligned area surrounds the active area, and the sealant area surrounds Active area and unaligned area. The conductive layer is disposed on the substrate, and a trench is formed, wherein a portion of the trench corresponding to the unaligned region is filled with a first alien material, and the first hydrophobic material is processed by a surface. The alignment film is disposed on a portion of the conductive layer that is not corresponding to the non-alignment region, and the alignment film is formed by an alignment film solution, wherein the alignment film solution and the surface treated first hydrophobic material mutually repel each other.
在本發明之一實施例中,基板更包括一低配向區域,圍繞主動區域及無配向區域,且與框膠區域重疊,溝槽對應低配向區域的部分填滿一第二疏離材質。配向膜溶液於經表面處理的第二疏離材質的接觸角小於配向膜溶液於經表面處理的第一疏離材質接觸角。In an embodiment of the invention, the substrate further includes a low alignment region surrounding the active region and the non-alignment region, and overlapping with the sealant region, and the portion of the trench corresponding to the low alignment region is filled with a second alien material. The contact angle of the alignment film solution to the surface treated second hydrophobic material is smaller than the contact angle of the alignment film solution to the surface treated first hydrophobic material.
本發明亦提出一種主動陣列基板的製造方法,包括下列步驟。配置一導電層於一基板上,其中基板具有一主動區域、一無配向區域及一框膠區域,無配向區域圍繞主動區域,框膠區域圍繞主動區域及無配向區域。於導電層形成一溝槽。在溝槽對應無配向區域的部分填滿一第一疏離材質。對第一疏離材質進行一表面處理。配置一配向膜溶液於導電層上以於導電層上非對應無配向區域的部分形成一配向膜,其中配向膜溶液與經表面處理的第一疏離材質相互排斥。The invention also proposes a method for manufacturing an active array substrate, comprising the following steps. A conductive layer is disposed on a substrate, wherein the substrate has an active region, an unaligned region and a sealant region, the unaligned region surrounds the active region, and the sealant region surrounds the active region and the unaligned region. A trench is formed in the conductive layer. A portion of the groove corresponding to the unaligned region is filled with a first alien material. A surface treatment is performed on the first sparse material. An alignment film solution is disposed on the conductive layer to form an alignment film on the portion of the conductive layer that is not corresponding to the non-alignment region, wherein the alignment film solution and the surface treated first hydrophobic material mutually repel each other.
在本發明之一實施例中,經表面處理後的第一疏離材質與配向膜溶液的接觸角大於120度。In one embodiment of the invention, the contact angle of the surface treated first hydrophobic material to the alignment film solution is greater than 120 degrees.
在本發明之一實施例中,第一疏離材質為包含醇官能基的材質。In one embodiment of the invention, the first hydrophobic material is a material comprising an alcohol functional group.
在本發明之一實施例中,表面處理為第一疏離材質與一化學物質化學反應後於第一疏離材質的表面形成多個長碳鏈以降低配向膜溶液於第一疏離材質的附著性。In one embodiment of the present invention, the surface treatment is such that the first hydrophobic material chemically reacts with a chemical substance to form a plurality of long carbon chains on the surface of the first hydrophobic material to reduce the adhesion of the alignment film solution to the first hydrophobic material.
在本發明之一實施例中,化學物質為矽烷、酸類化學物質及醇類化學物質的其中之一。In one embodiment of the invention, the chemical is one of decane, an acid chemical, and an alcohol chemical.
在本發明之一實施例中,主動陣列基板的製造方法更包括:在溝槽對應基板的一低配向區域的部分填滿一第二疏離材質,其中低配向區域圍繞主動區域及無配向區域,且與框膠區域重疊;對第一疏離材質經一表面處理,其中配向膜溶液於經表面處理的第二疏離材質的接觸角小於配向膜溶液於經表面處理的第一疏離材質接觸角。In an embodiment of the present invention, the method for manufacturing the active array substrate further includes: filling a portion of a low alignment region of the corresponding substrate of the trench with a second detached material, wherein the low alignment region surrounds the active region and the unaligned region. And overlapping with the sealant region; the first sparse material is subjected to a surface treatment, wherein the contact angle of the alignment film solution to the surface treated second sparse material is smaller than the contact lens solution at the surface treated first sparse material contact angle.
在本發明之一實施例中,配向膜溶液利用旋轉塗佈法配置於導電層上。In one embodiment of the invention, the alignment film solution is disposed on the conductive layer by spin coating.
基於上述,本發明實施例的主動陣列基板及其製造方法,其於導電層的溝槽對應無配向區域的部分填滿經表面處理的第一疏離材質,以使配向膜無法形成於基板的無配向區域。藉此,圍繞基板的主動區域的無配向區域可防止水氣透過配向膜所傳遞至主動區域,以避免水氣影響主動區域的光學特性。Based on the above, the active array substrate and the method for fabricating the same according to the embodiments of the present invention, wherein the portion of the conductive layer corresponding to the unaligned region fills the surface-treated first hydrophobic material so that the alignment film cannot be formed on the substrate. Alignment area. Thereby, the unaligned region surrounding the active region of the substrate prevents moisture from being transmitted to the active region through the alignment film to prevent the moisture from affecting the optical characteristics of the active region.
為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1為依據本發明一實施例的主動陣列基板的結構示 意圖。請參照圖1,在本實施例中,主動陣列基板100包括基板110、導電層120及配向膜130。基板具有主動區域111、無配向區域113及框膠區域115,其中無配向區域113圍繞主動區域111,框膠區域115圍繞該主動區域111及無配向區域113。並且,主動區域111可以是形成畫素結構(未繪示)的區域,而框膠區域115在此為配置框膠10的區域。1 is a structural diagram of an active array substrate according to an embodiment of the invention. intention. Referring to FIG. 1 , in the embodiment, the active array substrate 100 includes a substrate 110 , a conductive layer 120 , and an alignment film 130 . The substrate has an active area 111, an unaligned area 113 and a sealant area 115, wherein the unaligned area 113 surrounds the active area 111, and the sealant area 115 surrounds the active area 111 and the unaligned area 113. Moreover, the active area 111 may be an area forming a pixel structure (not shown), and the glue area 115 is here an area where the sealant 10 is disposed.
導電層120配置於基板110上,且對應無配向區域113形成溝槽121,亦即溝槽121整個對應無配向區域113,其中溝槽121中填滿第一疏離材質123。並且,第一疏離材質123經表面處理後會與形成配向膜130的配向膜溶液相互排斥,亦即配向膜130的配向膜溶液不易附著於經表面處理後的第一疏離材質123的表面。進一步來說,經表面處理後的第一疏離材質123的表面與配向膜130的配向膜溶液的接觸角為大於120度。The conductive layer 120 is disposed on the substrate 110, and the trench 121 is formed corresponding to the unaligned region 113, that is, the trench 121 is entirely corresponding to the unaligned region 113, wherein the trench 121 is filled with the first stripping material 123. Further, after the surface treatment, the first delamination material 123 repels the alignment film solution forming the alignment film 130, that is, the alignment film solution of the alignment film 130 is less likely to adhere to the surface of the surface-treated first detachment material 123. Further, the contact angle of the surface of the surface-treated first hydrophobic material 123 with the alignment film solution of the alignment film 130 is greater than 120 degrees.
在本實施例中,配向膜130的配向膜溶液利用旋轉塗佈法配置於導電層120上。由於配向膜130的配向膜溶液不易附著於經表面處理後的第一疏離材質123的表面,因此在旋轉塗佈的過程中,配向膜130的配向膜溶液不會停留於第一疏離材質123的表面(即無配向區域113),以致於配向膜130不會形成於導電層120上對應無配向區域113的部分,亦即配向膜130會配置於導電層120上非對應無配向區域113的部分。In the present embodiment, the alignment film solution of the alignment film 130 is disposed on the conductive layer 120 by a spin coating method. Since the alignment film solution of the alignment film 130 is less likely to adhere to the surface of the surface-treated first detached material 123, the alignment film solution of the alignment film 130 does not stay at the first detachment material 123 during spin coating. The surface (ie, the non-alignment region 113) is such that the alignment film 130 is not formed on the portion of the conductive layer 120 corresponding to the unaligned region 113, that is, the alignment film 130 is disposed on the portion of the conductive layer 120 that is not corresponding to the unaligned region 113. .
一般而言,配向膜130在固化後仍會傳遞水氣,而本 發明實施例的無配向區域113不會形成配向膜130,因此可阻斷水氣的傳導。並且,由於無配向區域113圍繞主動區域111,因此可來防止水氣傳導至主動區域111,以避免水氣影響了主動區域111的光學特性。In general, the alignment film 130 still transmits moisture after curing, and The non-alignment region 113 of the embodiment of the invention does not form the alignment film 130, so that the conduction of moisture can be blocked. Moreover, since the unaligned region 113 surrounds the active region 111, moisture can be prevented from being conducted to the active region 111 to prevent the moisture from affecting the optical characteristics of the active region 111.
在本發明實施例中,上述表面處理可以是第一疏離材質123與化學物質進行化學反應後於第一疏離材質123的表面形成多個長碳鏈,以降低配向膜130的配向膜溶液於第一疏離材質123的表面與附著性。並且,第一疏離材質123可以是包含醇官能基(-OH)的材質,例如二氧化矽(SiO2 )或氧化鋁(Al2 O3 ),而表面處理所使用的化學物質可以是矽烷、酸類化學物質及醇類化學物質的其中之一。In the embodiment of the present invention, the surface treatment may be that the first hydrophobic material 123 chemically reacts with the chemical substance to form a plurality of long carbon chains on the surface of the first hydrophobic material 123 to reduce the alignment film solution of the alignment film 130. A surface and adhesion of the material 123 is separated. Moreover, the first hydrophobic material 123 may be a material containing an alcohol functional group (-OH), such as cerium oxide (SiO 2 ) or aluminum oxide (Al 2 O 3 ), and the chemical used in the surface treatment may be decane, One of acid chemicals and alcohol chemicals.
圖2A至圖2D為依據本發明一實施例的主動陣列基板的製造流程圖。請參照圖2A至圖2D,主動陣列基板100可利用圖2A至圖2D所示實施例來製造,但本發明實施例不以此為限。請參照圖2A,在本實施例中,會先配置導電層220於基板210上,其中基板210具有主動區域211、無配向區域213及框膠區域215,並且無配向區域213圍繞主動區域211,框膠區域215圍繞主動區域211及無配向區域213。並且,導電層220會對應無配向區域213形成溝槽221。2A-2D are flow diagrams showing the fabrication of an active array substrate in accordance with an embodiment of the present invention. Referring to FIG. 2A to FIG. 2D, the active array substrate 100 can be manufactured by using the embodiment shown in FIG. 2A to FIG. 2D, but the embodiment of the present invention is not limited thereto. Referring to FIG. 2A , in the embodiment, the conductive layer 220 is disposed on the substrate 210 , wherein the substrate 210 has an active region 211 , an unaligned region 213 , and a sealant region 215 , and the unaligned region 213 surrounds the active region 211 . The sealant region 215 surrounds the active region 211 and the unaligned region 213. Moreover, the conductive layer 220 forms the trench 221 corresponding to the unaligned region 213.
請參照圖2B至2D,在本實施例中,在溝槽221中填滿第一疏離材質223,並且對第一疏離材質223進行表面處理以形成多個長碳鏈KC。換言之,若第一疏離材質223為包含醇官能基(-OH)的材質,則與第一疏離材質223 進行化學反應以形成長碳鏈KC的化學物質可以為矽烷(silane)、酸類化學物質及醇類化學物質的其中之一。Referring to FIGS. 2B to 2D, in the present embodiment, the first detachment material 223 is filled in the trench 221, and the first detached material 223 is surface-treated to form a plurality of long carbon chains KC. In other words, if the first detached material 223 is a material containing an alcohol functional group (-OH), then the first detached material 223 The chemical substance that undergoes a chemical reaction to form a long carbon chain KC may be one of silane, an acid chemical, and an alcohol chemical.
接著,由於第一疏離材質223表面形成多個長碳鏈KC,因此配向膜230的配向膜溶液難以附著於第一疏離材質223表面上,藉此可降低配向膜230的配向膜溶液於第一疏離材質223的附著性,等同於配向膜230的配向膜溶液與經表面處理的第一疏離材質223相互排斥。因此,在透過旋轉塗佈配置配向膜230的配向膜溶液於導電層220上的過程中,配向膜230的配向膜溶液不會停留於第一疏離材質223的表面,因此配向膜230會形成於導電層220上非對應無配向區域213的部分。Then, since a plurality of long carbon chains KC are formed on the surface of the first sparse material 223, the alignment film solution of the alignment film 230 is hard to adhere to the surface of the first sparse material 223, whereby the alignment film solution of the alignment film 230 can be lowered first. The adhesion of the delamination material 223 is equivalent to the alignment film solution of the alignment film 230 and the surface-treated first detachment material 223 mutually repelling each other. Therefore, during the process of disposing the alignment film solution of the alignment film 230 on the conductive layer 220 by spin coating, the alignment film solution of the alignment film 230 does not stay on the surface of the first delamination material 223, so the alignment film 230 is formed on The portion of the conductive layer 220 that does not correspond to the unaligned region 213.
圖3為依據本發明另一實施例的主動陣列基板的結構示意圖。請參照圖1及圖3,其相同或相似結構使用相同或相似標號。在本實施例中,主動陣列基板300大致相同於主動陣列基板100,其不同之處在於導電層120的溝槽121a同時對應基板110的無配向區域113及低配向區域310。低配向區域310圍繞主動區域111及無配向區域113,且與框膠區域115重疊。並且溝槽121a中對應低配向區域310的部分填滿第二疏離材質320。3 is a schematic structural view of an active array substrate according to another embodiment of the present invention. 1 and 3, the same or similar reference numerals are used for the same or similar structures. In the present embodiment, the active array substrate 300 is substantially the same as the active array substrate 100 except that the trenches 121a of the conductive layer 120 simultaneously correspond to the unaligned regions 113 and the low alignment regions 310 of the substrate 110. The low alignment region 310 surrounds the active region 111 and the unaligned region 113 and overlaps the sealant region 115. And a portion of the trench 121a corresponding to the low alignment region 310 is filled with the second sparse material 320.
在本實施例中,第二疏離材質320可以相同或不同於第一疏離材質123,此可依據本領域通常知識者而變。並且,在進行表面處理後,配向膜溶液附著於第二疏離材質320的表面的附著度高於第一疏離材質123,亦即配向膜120的配向膜溶液於經表面處理的第二疏離材質320的接 觸角小於配向膜120的配向膜溶液於經表面處理的第一疏離材質123的接觸角。藉此,框膠10可附著第二疏離材質320的表面上,以進一步降低水氣傳遞至主動區域111的可能。In this embodiment, the second alienation material 320 may be the same or different from the first alienation material 123, which may vary according to those of ordinary skill in the art. Moreover, after the surface treatment, the adhesion of the alignment film solution to the surface of the second detachment material 320 is higher than that of the first detachment material 123, that is, the alignment film solution of the alignment film 120 is applied to the surface treated second detachment material 320. Connection The antenna angle is smaller than the contact angle of the alignment film solution of the alignment film 120 to the surface-treated first hydrophobic material 123. Thereby, the sealant 10 can be attached to the surface of the second hydrophobic material 320 to further reduce the possibility of moisture transfer to the active region 111.
在本發明一實施例中,第二疏離材質320可相同於第一疏離材質123,此時第二疏離材質320的表面處理所使用者的化學材質、化學材質的濃度或表面處理的時間會不同於第一疏離材質123。In an embodiment of the present invention, the second detachment material 320 may be the same as the first detachment material 123. At this time, the surface of the second detachment material 320 may have different chemical materials, chemical materials, or surface treatment time. The first alienation material 123.
綜上所述,本發明實施例的主動陣列基板及其製造方法,其於導電層的溝槽中填滿經表面處理的第一疏離材質,以使配向膜無法形成於基板的無配向區域。藉此,圍繞基板的主動區域的無配向區域可防止水氣透過配向膜所傳遞至主動區域,以避免水氣影響主動區域的光學特性。並且,可在溝槽中填滿經表面處理的第二疏離材質,以使框膠可附著於經表面處理的第二疏離材質上,藉此進一步降低水氣傳遞至主動區域111的可能。In summary, the active array substrate and the method for fabricating the same according to the embodiments of the present invention fill the trenches of the conductive layer with the surface-treated first hydrophobic material so that the alignment film cannot be formed in the unaligned region of the substrate. Thereby, the unaligned region surrounding the active region of the substrate prevents moisture from being transmitted to the active region through the alignment film to prevent the moisture from affecting the optical characteristics of the active region. Moreover, the surface treated second sparse material may be filled in the trench to allow the sealant to adhere to the surface treated second hydrophobic material, thereby further reducing the possibility of moisture transfer to the active region 111.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
10‧‧‧框膠10‧‧‧Box glue
100、300‧‧‧主動陣列基板100,300‧‧‧Active array substrate
110、210‧‧‧基板110, 210‧‧‧ substrate
111、211‧‧‧主動區域111, 211‧‧‧ active area
113、213‧‧‧無配向區域113, 213‧‧‧ unaligned areas
115、215‧‧‧框膠區域115, 215‧‧ ‧ glue area
120、220‧‧‧導電層120, 220‧‧‧ conductive layer
121、121a、221‧‧‧溝槽121, 121a, 221‧‧‧ trench
123、223‧‧‧第一疏離材質123, 223‧‧‧ first alien material
130、230‧‧‧配向膜130, 230‧‧ ‧ alignment film
310‧‧‧低配向區域310‧‧‧Low alignment area
320‧‧‧第二疏離材質320‧‧‧Second alien material
KC‧‧‧長碳鏈KC‧‧ long carbon chain
圖1為依據本發明一實施例的主動陣列基板的結構示意圖。1 is a schematic structural view of an active array substrate according to an embodiment of the invention.
圖2A至圖2D為依據本發明一實施例的主動陣列基板的製造流程圖2A to 2D are flowcharts showing the manufacture of an active array substrate according to an embodiment of the invention.
圖3為依據本發明另一實施例的主動陣列基板的結構示意圖。3 is a schematic structural view of an active array substrate according to another embodiment of the present invention.
10‧‧‧框膠10‧‧‧Box glue
100‧‧‧主動陣列基板100‧‧‧Active array substrate
110‧‧‧基板110‧‧‧Substrate
111‧‧‧主動區域111‧‧‧Active area
113‧‧‧無配向區域113‧‧‧No alignment area
115‧‧‧框膠區域115‧‧‧Glue area
120‧‧‧導電層120‧‧‧ Conductive layer
121‧‧‧溝槽121‧‧‧ trench
123‧‧‧第一疏離材質123‧‧‧First alien material
130‧‧‧配向膜130‧‧‧Alignment film
Claims (14)
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TW101136011A TWI486671B (en) | 2012-09-28 | 2012-09-28 | Active array substrate and fabricating method thereof |
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TW101136011A TWI486671B (en) | 2012-09-28 | 2012-09-28 | Active array substrate and fabricating method thereof |
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TW201413333A TW201413333A (en) | 2014-04-01 |
TWI486671B true TWI486671B (en) | 2015-06-01 |
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US10538056B2 (en) | 2015-09-11 | 2020-01-21 | Himax Display, Inc. | Assembly structure, method to form assembly structure and method to form close-loop sealant structure |
US10802325B2 (en) * | 2018-11-05 | 2020-10-13 | Himax Display, Inc. | Display panel |
Citations (3)
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US20050001967A1 (en) * | 2003-06-19 | 2005-01-06 | Chae Gee Sung | Liquid crystal display panel and fabricating method thereof |
CN1658050A (en) * | 2005-03-03 | 2005-08-24 | 广辉电子股份有限公司 | Substrate of liquid crystal plane and method for forming polyimide |
TW200717093A (en) * | 2005-10-21 | 2007-05-01 | Nec Lcd Technologies Ltd | Liquid crystal display device and method of manufacturing the same |
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US20050001967A1 (en) * | 2003-06-19 | 2005-01-06 | Chae Gee Sung | Liquid crystal display panel and fabricating method thereof |
CN1658050A (en) * | 2005-03-03 | 2005-08-24 | 广辉电子股份有限公司 | Substrate of liquid crystal plane and method for forming polyimide |
TW200717093A (en) * | 2005-10-21 | 2007-05-01 | Nec Lcd Technologies Ltd | Liquid crystal display device and method of manufacturing the same |
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