TWI484570B - - Google Patents
Info
- Publication number
- TWI484570B TWI484570B TW101139048A TW101139048A TWI484570B TW I484570 B TWI484570 B TW I484570B TW 101139048 A TW101139048 A TW 101139048A TW 101139048 A TW101139048 A TW 101139048A TW I484570 B TWI484570 B TW I484570B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101139048A TW201417195A (zh) | 2012-10-23 | 2012-10-23 | 圓形式晶粒置放方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101139048A TW201417195A (zh) | 2012-10-23 | 2012-10-23 | 圓形式晶粒置放方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201417195A TW201417195A (zh) | 2014-05-01 |
| TWI484570B true TWI484570B (enExample) | 2015-05-11 |
Family
ID=51293918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101139048A TW201417195A (zh) | 2012-10-23 | 2012-10-23 | 圓形式晶粒置放方法 |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201417195A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114972317B (zh) * | 2022-06-22 | 2024-04-05 | 合肥工业大学 | 一种方形晶粒放置规划方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1361023A2 (en) * | 2002-05-07 | 2003-11-12 | Applied Materials, Inc. | Polishing articles for electrochemical mechanical polishing of substrates |
| US6838753B2 (en) * | 2001-12-21 | 2005-01-04 | Samsung Techwin Co., Ltd. | Lead-frame strip and method of manufacturing semiconductor packages using the same |
| TWI263289B (en) * | 2002-02-15 | 2006-10-01 | Freescale Semiconductor Inc | Process and apparatus for disengaging semiconductor die from an adhesive film |
| TWI290363B (en) * | 2002-05-17 | 2007-11-21 | Gsi Lumonics Corp | Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein |
| US7911068B2 (en) * | 2006-07-11 | 2011-03-22 | Infineon Technologies Ag | Component and method for producing a component |
-
2012
- 2012-10-23 TW TW101139048A patent/TW201417195A/zh not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6838753B2 (en) * | 2001-12-21 | 2005-01-04 | Samsung Techwin Co., Ltd. | Lead-frame strip and method of manufacturing semiconductor packages using the same |
| TWI263289B (en) * | 2002-02-15 | 2006-10-01 | Freescale Semiconductor Inc | Process and apparatus for disengaging semiconductor die from an adhesive film |
| EP1361023A2 (en) * | 2002-05-07 | 2003-11-12 | Applied Materials, Inc. | Polishing articles for electrochemical mechanical polishing of substrates |
| TWI290363B (en) * | 2002-05-17 | 2007-11-21 | Gsi Lumonics Corp | Method and system for marking a workpiece such as a semiconductor wafer and laser marker for use therein |
| US7911068B2 (en) * | 2006-07-11 | 2011-03-22 | Infineon Technologies Ag | Component and method for producing a component |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201417195A (zh) | 2014-05-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |