TWI484528B - - Google Patents
Info
- Publication number
- TWI484528B TWI484528B TW101151268A TW101151268A TWI484528B TW I484528 B TWI484528 B TW I484528B TW 101151268 A TW101151268 A TW 101151268A TW 101151268 A TW101151268 A TW 101151268A TW I484528 B TWI484528 B TW I484528B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100812363A CN103327723A (en) | 2012-03-23 | 2012-03-23 | Capacity coupling plasma reactor and control method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201351469A TW201351469A (en) | 2013-12-16 |
| TWI484528B true TWI484528B (en) | 2015-05-11 |
Family
ID=49196165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101151268A TW201351469A (en) | 2012-03-23 | 2012-12-28 | Capacitive coupling plasma reactor and control method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103327723A (en) |
| TW (1) | TW201351469A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI728516B (en) * | 2018-10-18 | 2021-05-21 | 北京北方華創微電子裝備有限公司 | Method for controlling radio frequency source |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7018288B2 (en) * | 2017-10-10 | 2022-02-10 | 東京エレクトロン株式会社 | Film formation method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200839829A (en) * | 2007-03-21 | 2008-10-01 | Advanced Micro Fab Equip Inc | Capacitance-coupled plasma chamber, structure and manufacturing method of gas distribution head, refurbishment and reuse method thereof |
| US20090284156A1 (en) * | 2008-05-14 | 2009-11-19 | Applied Materials, Inc. | Method and apparatus for pulsed plasma processing using a time resolved tuning scheme for rf power delivery |
| US20100319851A1 (en) * | 2005-10-20 | 2010-12-23 | Buchberger Jr Douglas A | Plasma reactor with feed forward thermal control system using a thermal model for accommodating rf power changes or wafer temperature changes |
| CN101736326B (en) * | 2008-11-26 | 2011-08-10 | 中微半导体设备(上海)有限公司 | Capacitively coupled plasma processing reactor |
| TW201130031A (en) * | 2009-10-26 | 2011-09-01 | Applied Materials Inc | Dual mode inductively coupled plasma reactor with adjustable phase coil assembly |
| US20110217806A1 (en) * | 2008-10-01 | 2011-09-08 | Oerlikon Solar Ag, Truebbach | Radiofrequency plasma reactor and method for manufacturing vacuum process treated substrates |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3832934B2 (en) * | 1997-07-18 | 2006-10-11 | 株式会社アルバック | Reactive ion etching system |
| TW507256B (en) * | 2000-03-13 | 2002-10-21 | Mitsubishi Heavy Ind Ltd | Discharge plasma generating method, discharge plasma generating apparatus, semiconductor device fabrication method, and semiconductor device fabrication apparatus |
| JP3751909B2 (en) * | 2002-07-01 | 2006-03-08 | 独立行政法人科学技術振興機構 | Plasma apparatus and plasma processing substrate |
| JP3776856B2 (en) * | 2002-09-13 | 2006-05-17 | 株式会社日立ハイテクノロジーズ | Plasma processing apparatus and plasma processing method |
| FR2895169B1 (en) * | 2005-12-15 | 2008-08-01 | Renault Sas | OPTIMIZING THE EXCITATION FREQUENCY OF A RESONATOR |
| KR20080111801A (en) * | 2007-06-20 | 2008-12-24 | 삼성전자주식회사 | Plasma processing apparatus and method thereof |
| JP5496568B2 (en) * | 2009-08-04 | 2014-05-21 | 東京エレクトロン株式会社 | Plasma processing apparatus and plasma processing method |
| CN101789362B (en) * | 2010-02-05 | 2011-10-05 | 中微半导体设备(上海)有限公司 | Plasma processing device and processing method thereof |
-
2012
- 2012-03-23 CN CN2012100812363A patent/CN103327723A/en active Pending
- 2012-12-28 TW TW101151268A patent/TW201351469A/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100319851A1 (en) * | 2005-10-20 | 2010-12-23 | Buchberger Jr Douglas A | Plasma reactor with feed forward thermal control system using a thermal model for accommodating rf power changes or wafer temperature changes |
| TW200839829A (en) * | 2007-03-21 | 2008-10-01 | Advanced Micro Fab Equip Inc | Capacitance-coupled plasma chamber, structure and manufacturing method of gas distribution head, refurbishment and reuse method thereof |
| US20090284156A1 (en) * | 2008-05-14 | 2009-11-19 | Applied Materials, Inc. | Method and apparatus for pulsed plasma processing using a time resolved tuning scheme for rf power delivery |
| US20110217806A1 (en) * | 2008-10-01 | 2011-09-08 | Oerlikon Solar Ag, Truebbach | Radiofrequency plasma reactor and method for manufacturing vacuum process treated substrates |
| CN101736326B (en) * | 2008-11-26 | 2011-08-10 | 中微半导体设备(上海)有限公司 | Capacitively coupled plasma processing reactor |
| TW201130031A (en) * | 2009-10-26 | 2011-09-01 | Applied Materials Inc | Dual mode inductively coupled plasma reactor with adjustable phase coil assembly |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI728516B (en) * | 2018-10-18 | 2021-05-21 | 北京北方華創微電子裝備有限公司 | Method for controlling radio frequency source |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201351469A (en) | 2013-12-16 |
| CN103327723A (en) | 2013-09-25 |