TWI483260B - Appratus and method for burning-in ssd products - Google Patents

Description

Solid state hard disk pre-burning device and method

The present invention relates to a test technology for a solid state hard disk, and more particularly to a pre-burning device and method for a solid state hard disk.

Among various electronic products such as personal computers, business computers, and notebook computers, Solid State Disk (SSD) has the advantages of miniaturization, light weight, and fast read and write operations compared with traditional magnetic hard disks. It is used in portable electronic products such as smart phones and tablets, and its application fields are not limited. Most of the components in the SSD are semiconductor components such as controllers and non-volatile memory to replace the traditional drive machinery and disk.

However, even if the initial inspection of the semiconductor element is acceptable, it has an early vulnerability and is not durable. In order to eliminate these early and fragile semiconductor components, it is found in volatile memory such as DRAM (Dynamic Random Access Memory). "burn-in" concept and technology, but the current "burn-in" implementation of DRAM is carried out in the semiconductor packaging stage (ie, small package components after DRAM die is encapsulated by a die-cast compound), dedicated DRAM The pre-burning board is provided with hundreds of package sockets, for example, 360. The DRAM semiconductor package is combined in the package housing by the mechanical arm of the upper and lower board, and the DRAM pre-burning board is fed. In the pre-baking furnace, a mount check program is performed at normal temperature to confirm whether the DRAM semiconductor package and the DRAM pre-burning board are well combined, and under the condition of continuous power supply, the program principle of the upper board test is through data connection. Whether the foot determination data can be correctly written and read. When it is determined that the whole number has passed, the pre-burning which can be warmed up and lowered is performed.

In contrast, the solid state hard disk itself is a small electronic system, which already contains controllers and passive components, and the type of memory is also different. The read and write control of the controller has different technical secrets depending on the design manufacturer (know) -How), the read and write operations of non-volatile memory in the solid state hard disk cannot be controlled by the external pre-burning system, so the conventional DRAM pre-burning board cannot be directly and simply transferred to the pre-burning use as a solid-state hard disk. In order to eliminate the early fragile solid state hard disk, it is known to combine the solid state hard disk with the motherboard-based analog test system for simulation test. However, since the motherboard is combined with various electronic components such as a central processing unit, a DRAM, a graphics processor, etc., the entire analog test system cannot be installed in the pre-fired furnace, or the electronic components combined on the main board are easily damaged by burn-in. Moreover, once there is damage or bad signal, it will not be possible to judge the failure of the solid state hard disk or the failure of the electronic component from the motherboard. Therefore, the analog test system can only perform long-term operation by adjusting the voltage at normal temperature. The simulation test lasted for more than a week.

In order to solve the above problems, the main object of the present invention is a pre-burning device and method for a solid-state hard disk, which can self-burn according to a plurality of solid-state hard disks of different specifications, and pre-removing the early fragile solid state in a faster manner. Hard drive.

The second object of the present invention is a pre-burning device and method for a solid-state hard disk, whereby a solid-state hard disk can be placed in a pre-fired furnace for pre-burning, and then various simulated environmental tests conforming to client requirements are performed.

The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. The invention discloses a pre-burning device and a method for a solid-state hard disk. The pre-burning device is mainly a pre-burning plate, and the pre-burning plate comprises a circuit board main body, a plurality of contact fingers, a plurality of first hard disk sockets, and A plurality of second hard disk sockets. The circuit board main system has a power line, a ground bus line and a plurality of detecting lines, and one surface of the main body of the board is planned with a plurality of component mounting areas. The contact fingers are disposed on the same side of the main body of the circuit board. The first hard disk sockets are horizontally disposed on one side of the component mounting areas, and each of the first hard disk sockets has a first power pin, a second power pin, and a plurality of first ground contacts. foot. The second hard disk sockets are horizontally disposed on the other side of the component mounting areas, and each of the second hard disk sockets has a third power pin, a fourth power pin, and a plurality of second grounds. Pin. The power supply line is connected to the power supply terminal of the contact finger to the first power pin of the first hard disk socket and the third power pin of the second hard disk socket, the ground bus line Connecting the grounding terminals of the contact fingers to the first grounding pins of the first hard disk sockets and the second grounding pins of the second hard disk sockets, the detecting lines connecting the contact fingers The signal terminal is connected to the third power pin of the first hard disk socket and the fourth power pin of the second hard disk socket.

The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures.

In the foregoing pre-burning device for a solid-state hard disk, each of the first hard disk sockets may further have a plurality of first signal pins, and each of the second hard disk sockets may further have a plurality of second signal pins. The first signal pins and the second signal pins are empty positions.

In the foregoing pre-burning device for a solid-state hard disk, the pre-burning plate may further include a plurality of jumpers disposed between the power supply line and the power supply terminals of the contact fingers for switching different operations. Voltage.

In the foregoing solid state hard disk pre-burning device, the pre-burning plate may further comprise a plurality of program cards coupled to the circuit board main body.

In the foregoing solid state hard disk pre-burning device, the first hard disk sockets may be SATA sockets, the second hard disk sockets may be m-SATA sockets, and the second hard disk sockets and the The ratio of the number of the first hard disk sockets is a positive integer not less than two.

The embodiments of the present invention will be described in detail below with reference to the accompanying drawings in which FIG. The components and combinations related to this case, the components shown in the figure are not drawn in proportion to the actual number, shape and size of the actual implementation. Some size ratios are proportional to other related sizes or have been exaggerated or simplified to provide clearer description of. The actual number, shape and size ratio of the implementation is an optional design, and the detailed component layout may be more complicated.

According to a preferred embodiment of the present invention, a pre-burning device for a solid-state hard disk is mainly a pre-burning plate 100. The schematic diagram of FIG. 1 and the block diagram of FIG. 2 and FIG. 3 correspond to different examples. A schematic diagram of the local line connection of the solid state hard disk to be tested. The pre-burning plate 100 includes a circuit board main body 110, a plurality of contact fingers 120, a plurality of first hard disk sockets 130, and a plurality of second hard disk sockets 140.

The circuit board main body 110 can be a printed circuit board, or can be a ceramic circuit board for carrying a plurality of solid hard disks to be tested and loaded in a pre-burning furnace. As shown in FIG. 3, the circuit board main body 110 has a power supply line 111, a ground bus line 112, and a plurality of detection lines 113. One of the surface of the circuit board main body 110 is planned with a plurality of component mounting areas 114 as a mounting area of the solid-state hard disk to be tested, and the so-called "component mounting area" is to cover only the size of a single maximum solid-state hard disk to be tested. When the solid hard disk to be tested in which the first hard disk socket 130 is combined is the largest size, only one first hard disk socket 130 can be disposed in each component mounting area 114; in other words, the component mounting areas 114 and the The first hard disk sockets 130 are in a number corresponding. The contact fingers 120 are disposed on the same side of the circuit board body 110 for bonding to the test circuit of the pre-fired furnace. The power supply line 111 is a conductive path for supplying current from the contact fingers 120 to the component mounting areas 114; the ground bus line 112 is used to derive electrostatic currents of the component mounting areas 114 and The contact lines are connected to the grounded conductive paths. The detecting lines 113 are used to detect the presence or absence of the bonding elements in the component mounting regions 114 to cause current to flow from the component mounting regions 114 to the contact fingers 120. path.

The first hard disk sockets 130 are horizontally disposed on one side of the component mounting areas 114, and the second hard disk sockets 140 are horizontally disposed on the other side of the component mounting areas 114. The so-called "horizontal setting" means that the hard disk socket is flat on the surface of the circuit board main body 110, so that the solid hard disk to be tested can be laterally coupled to the hard disk socket in a non-upright manner.

As shown in FIGS. 3 and 4, each of the first hard disk sockets 130 has a first power pin 131, a second power pin 132, and a plurality of first ground pins 133. In this embodiment, the functions of the pins P1, P2, P7, and P8 of the functions V33_1, V33_2, V5_1, and V5_2 in FIG. 4 are set as the first power pin 131, and the functions are respectively V33_3 and V5_3. Bits P3 and P9 can be used as the second power pin 132, and the flags are SGND_1, SGND_2, SGND_3, GND_1, GND_2, GND_3, GND_4, GND_5, and two P_GND pins S1, S4, P4, P5, P6, P10, P12, G1, G2, etc. can be used as the first ground pin 133. In this embodiment, each of the first hard disk sockets 130 can further have a plurality of first signal pins 134, and the first signal pins 134 are empty feet, that is, during the self-burning process, It is necessary to detect the reading and writing of the data of the solid state hard disk to be tested. For example, the functions of the RXP, RXN, TXN, TXP, and RSV pins S2, S3, S5, S6, and P11 in FIG. 4 can be set as the first signal pins 134.

As shown in FIGS. 3 and 5, each of the second hard disk sockets 140 has a third power pin 141, a fourth power pin 142, and a plurality of second ground pins 143. In this embodiment, the functions of the first three +3VS_HDD pins 1, 16, 17 and the like can be set as the third power pin 141, and the functions of the last +3VS_HDD pin 18 can be used as The fourth power pin 142 is labeled as five GND, and two P_GND pins 7, 8, 11, 12, 15, G1, G2, etc. can be used as the second ground pin 143. In this embodiment, each of the second hard disk sockets 140 can further have a plurality of second signal pins 144, and the second signal pins 144 are empty feet, that is, during the self-burning process, It is necessary to detect the reading and writing of the data of the solid state hard disk to be tested. For example, the functions of the SATA_RXP, SATA_RXN, SATA_TXN, and SATA_TXP pins 9, 10, 13, 14 and the like in the fifth figure can be set as the second signal pins 144.

In this embodiment, the first hard disk sockets 130 can be SATA sockets, and the second hard disk sockets 140 can be m-SATA sockets, such that the unit sizes of the first hard disk sockets 130 are larger than the The unit size of the second hard disk sockets 140, and the ratio of the number of the second hard disk sockets 140 to the first hard disk sockets 130 is not less than a positive integer of two. For example, as shown in FIG. 1, when one first hard disk socket 130 can be installed in each component mounting area 114, two or more second hard can be installed in each component mounting area 114. Disc socket 140. When the component mounting area 114 is a matrix of 3 times 6 and a total of 18, the total number of the first hard disk sockets 130 is 18, and the total number of the second hard disk sockets 140 is 36, and the second hard The number ratio of the disk sockets 140 to the first hard disk sockets 130 is two.

As shown in FIG. 6A, in each component mounting area, a first solid state hard disk 200 to be tested can be horizontally plugged into one of the first hard disk sockets 130, wherein the first solid state hard disk 200 has a plurality of Non-volatile memory 210, controller (not shown) and passive component 230; or, non-simultaneously, as shown in FIG. 6B, one or more to be tested in each component mounting area The second solid state hard disk 300 can be horizontally plugged into the corresponding second hard disk socket 140, wherein the second solid state hard disk 300 has a plurality of non-volatile memory 310, a controller 320 and a passive component 330. The first solid state hard disk 200 and the second solid state hard disks 300 are solid state hard disks of different specifications, such as 2.5" SATA SSD and m-SATA SSD.

The power supply line 111 connects the power supply terminal 120A of the contact fingers 120 to the first power pin 131 of the first hard disk socket 130 and the third power pin 141 to the second hard disk sockets 140. The grounding bus line 112 connects the grounding terminal 120B of the contact fingers 120 to the first grounding pins 133 of the first hard disk sockets 130 and the second grounding pins to the second hard disk sockets 140. 143. The detecting lines 113 are connected to the signal terminals 120C of the contact fingers 120 to the third power pins 141 of the first hard disk sockets 130 and the fourth power pins to the second hard disk sockets 140. Feet 142. Therefore, the power supply of the same voltage on the pre-burning board 100 can be shared by all of the first hard disk sockets 130 and the second hard disk sockets 140. Each of the first hard disk sockets 130 can be connected to a dedicated numbered signal terminal 120C, and each of the second hard disk sockets 140 can also be connected to a dedicated numbered signal terminal 120C, wherein The serial number of the signal terminals 120C of the specification solid state hard disk may be overlapped. For example, the contact fingers 120 in this embodiment can be configured with 36 dedicated numbered signal terminals 120C, respectively corresponding to the second hard disk sockets 140, and the number of the first hard disk sockets 130 is the second The number of the hard disk sockets 140 is one-half, and the signal terminals 120C that can select the singular or double number are respectively corresponding to the first hard disk sockets 130. That is, the detecting line 113 connecting the first hard disk sockets 130 and the detecting line 113 connecting the second hard disk sockets 140 may be partially connected in parallel, because the same piece of pre-burning board does not combine the two specifications at the same time. The solid state hard disk to be tested, so the design does not affect the operation of the upper board detection.

Further, as shown in FIGS. 1 and 2, more specifically, the burn-in board 100 further includes a plurality of jumpers 150 disposed between the power line 111 and the power supply terminals 120A of the contact fingers 120. Used to switch between different working voltages. As shown in FIG. 2, in a specific configuration, the jumpers 150 are connected to the corresponding power lines 111, for example, the power lines 111 that are connected in series to the corresponding row of the contact fingers 120. In addition, in the foregoing solid state hard disk pre-burning device, the pre-burning plate 100 may further include a plurality of program cards 160 coupled to the circuit board main body 110. The program card 160 is used to adjust the channels of the burn-in board 100, for example, the driving of the jumpers 150 can be included to apply different pre-burning furnaces to perform self-burning operations.

The present invention further discloses a method for pre-burning a solid state hard disk using the pre-burning plate 100, which mainly comprises the steps as shown in FIG. 7, which are respectively step 1 of "providing a pre-burning plate" and "component upper plate" Step 2, Step 3 of "Furning in the Furnace", Step 4 of "Upper Board Detection", and Step 5 of "Self-burning". Wherein, in step 1, the above-mentioned pre-burning plate 100 is provided.

Step 2 performs a component upper board step of laterally bonding a plurality of first solid state hard disks 200 to the first hard disk sockets 130 for mounting on the component mounting areas 114. Since the first solid state hard disks 200 are coupled to the pre-burning plate 100 in a horizontal manner, the height of the plate loading on the pre-burning plate 100 can be reduced, so that more pre-fired furnaces 400 can be placed in a pre-burning furnace 400. Burn the board (as shown in Figure 8). Since the pre-burning plate 100 is compatible, a plurality of second solid-state hard disks 300 can be laterally bonded to the second hard disk sockets 140 in different self-burning processes.

Then, a furnace loading step 3 is performed to accommodate the pre-burning plate 100 in a pre-burning furnace 400 and the connection between the pre-burning plate 100 and the pre-burning furnace 400 is made by the connection of the contact fingers 120. Transfer current. Since the first solid state hard disks 200 have the characteristics of power interconnection, the power supply terminals 120A, the power supply lines 111, and the first hard disk sockets 130 of the contact fingers 120 passing through the pre-burning plate 100 A power pin 131 applies an operating voltage to a portion of the power pins of the first solid state hard disks 200. If the combination is good, the remaining power pins of the first solid state disks 200 can pass through the power pins. The second power pin 132 of the first hard disk socket 130, the corresponding detection line 113 to the corresponding number of the signal terminals 120C of the contact fingers 120 of the pre-burning plate 100, and a feedback voltage is detected. If the detected voltage is 0, it means that the corresponding solid-state hard disk 200 of the corresponding number is not well combined.

Then, an upper board detecting step 4 is performed, and the preheating furnace 400 supplies an operating voltage to the first power pin 131 of the first hard disk sockets 130 via the power supply terminals 120A of the contact fingers 120, and through the The signal terminal 120C of the contact finger 120 senses the feedback voltage of the third power pin 141 of the first hard disk socket 130 to confirm whether the first solid state hard disks 200 are well coupled to the pre-burning plate 100.

Then, a self-burning step 5 is performed to continuously supply the operating voltage to the first power pin 131 of the first hard disk sockets 130 via the power supply terminals 120A of the contact fingers 120 at a predetermined temperature and a predetermined time. The self-burning conditions described above can be set at temperatures ranging from minus 10 degrees Celsius to 95 degrees Celsius. The self-burning time can range from 8 hours to 48 hours. The input voltage can vary depending on the specifications of the solid state hard disk to be tested. Set between 3.3V and 5V. In the self-burning process, only the corresponding working voltage needs to be provided, and the controller in the solid state hard disk to be tested can be driven to perform self-test (Build In Self-Test, BIST). In the self-burning process, it is not necessary to read the data in the solid state hard disk to be tested.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. Any simple modifications, equivalent changes and modifications made without departing from the technical scope of the present invention are still within the technical scope of the present invention.

1. . . Provide a pre-burning plate

2. . . Component board

3. . . Furnace loading

4. . . Upper board detection

5. . . Self-burning

100. . . Burnt plate

110. . . Board body

111. . . Power line

112. . . Ground bus line

113. . . Detection line

114. . . Component mounting area

120. . . Contact finger

120A. . . Power supply terminal

120B. . . Ground terminal

120C. . . Signal terminal

130. . . First hard disk socket

131. . . First power pin

132. . . Second power pin

133. . . First grounding pin

134. . . First signal pin

140. . . Second hard disk socket

141. . . Third power pin

142. . . Fourth power pin

143. . . Second grounding pin

144. . . Second signal pin

150. . . Jumper

160. . . Program card

200. . . First solid state hard drive

210. . . Memory

230. . . Passive component

300. . . Second solid state hard drive

310. . . Memory

320. . . Controller

330. . . Passive component

400. . . Pre-burning furnace

1 is a schematic view of a pre-burning plate of a pre-burning device for a solid-state hard disk according to a preferred embodiment of the present invention.

2 is a block diagram showing the structure of a pre-burning plate of a pre-burning device for a solid-state hard disk according to a preferred embodiment of the present invention.

FIG. 3 is a schematic diagram showing the local circuit connection of the pre-burning device of the solid-state hard disk corresponding to different solid-state disks to be tested according to a preferred embodiment of the present invention.

Figure 4 is a schematic view showing the pin of the first hard disk socket of the pre-burning plate of the solid state hard disk pre-burning device according to a preferred embodiment of the present invention.

Figure 5 is a schematic view showing the pin of the second hard disk socket of the pre-burning plate of the solid state hard disk pre-burning device according to a preferred embodiment of the present invention.

6A and 6B: According to a preferred embodiment of the present invention, the component mounting area of the pre-burning plate of the solid state hard disk pre-burning device can be mounted with a schematic diagram of a solid hard disk to be tested of different specifications. (In the same component mounting area, Figure 6A shows that a first solid-state hard disk can be combined, and Figure 6B shows that two second solid-state hard disks can be combined)

Figure 7 is a flow chart showing a method of calcining a solid state hard disk according to a preferred embodiment of the present invention.

Figure 8 is a schematic view showing a plurality of pre-fired plates housed in a pre-fired furnace according to a preferred embodiment of the present invention.

111. . . Power line

112. . . Ground bus line

113. . . Detection line

120. . . Contact finger

120A. . . Power supply terminal

120B. . . Ground terminal

120C. . . Signal terminal

130. . . First hard disk socket

140. . . Second hard disk socket

Claims (10)

A pre-burning device for a solid-state hard disk is mainly a pre-burning plate, the pre-burning plate comprises: a circuit board body having a power line, a ground bus line and a plurality of detecting lines, the board One surface of the main body is planned with a plurality of component mounting areas; a plurality of contact fingers are disposed on the same side of the main body of the circuit board; and a plurality of first hard disk sockets are horizontally disposed on one side of the component mounting areas Each first hard disk socket has a first power pin, a second power pin, and a plurality of first ground pins; and a plurality of second hard disk sockets are horizontally disposed on the components. The other side of the area, each of the second hard disk sockets has a third power pin, a fourth power pin, and a plurality of second ground pins; wherein the power circuit is connected to the contact fingers a power supply terminal to the first power pin of the first hard disk socket and a third power pin to the second hard disk socket, the ground bus line connecting the ground terminals of the contact fingers to the first The first connection of a hard disk socket a pin and a second ground pin to the second hard disk socket, the detecting circuit connecting the signal terminal of the contact finger to the third power pin of the first hard disk socket and to the The fourth power pin of the second hard disk socket. According to the pre-burning device of the solid-state hard disk of claim 1, wherein each of the first hard disk sockets further has a plurality of first signal pins, and each of the second hard disk sockets further has a plurality of second signals. The first signal pin and the second signal pins are empty positions. The pre-burning device of the solid-state hard disk according to claim 1, wherein the pre-burning plate further comprises a plurality of jumpers disposed between the power supply line and the power supply terminals of the contact fingers for Switch between different working voltages. The pre-burning device for a solid state hard disk according to claim 1, wherein the pre-burning plate further comprises a plurality of program cards coupled to the main body of the circuit board. According to the pre-burning device of the solid state hard disk of claim 1, wherein the first hard disk sockets are SATA sockets, the second hard disk sockets are m-SATA sockets, and the second hard disks are The ratio of the number of the sockets to the first hard disk sockets is a positive integer not less than two. A method for pre-burning a solid-state hard disk, comprising the steps of: providing a pre-burning board comprising: a circuit board body having a power line, a ground bus line, and a plurality of detecting lines, the main body of the board A surface system is planned with a plurality of component mounting areas; a plurality of contact fingers are disposed on the same side of the main body of the circuit board; and a plurality of first hard disk sockets are horizontally disposed on one side of the component mounting areas. Each of the first hard disk sockets has a first power pin, a second power pin, and a plurality of first ground pins; and a plurality of second hard disk sockets are horizontally disposed in the component mounting areas. On the other side, each of the second hard disk sockets has a third power pin, a fourth power pin, and a plurality of second ground pins; wherein the power circuit is connected to the power terminals of the contact fingers a first power pin of the first hard disk socket and a third power pin to the second hard disk socket, the ground bus line connecting the ground terminals of the contact fingers to the first hard First of the dish socket a grounding pin and a second grounding pin to the second hard disk socket, wherein the detecting circuit is connected to the signal terminal of the contact finger to the third power pin of the first hard disk socket and to the a fourth power supply pin of the second hard disk socket; performing a component upper board step of laterally bonding the plurality of first solid state hard disks to the first hard disk sockets for mounting on the component mounting areas; a furnace loading step of accommodating the pre-burning plate in a pre-burning furnace and connecting the pre-burning plates and the pre-burning furnace by the connection of the contact fingers; performing an upper plate detection a step of providing a working voltage to the first power pins of the first hard disk sockets via the power supply terminals of the contact fingers, and sensing the first hard disk sockets via the signal terminals of the contact fingers a feedback voltage of the third power pin to confirm whether the first solid state hard disks are well bonded to the pre-burning plate; and performing a self-burning step to continue through the contact fingers at a predetermined temperature and a predetermined time The power supply terminal supplies an operating voltage to the first hard disk The first power pin. According to the method of pre-burning a solid state hard disk according to claim 6, wherein each of the first hard disk sockets further has a plurality of first signal pins, and each of the second hard disk sockets further has a plurality of second signals. The first signal pin and the second signal pins are empty positions. The pre-burning method of the solid state hard disk according to claim 6 , wherein the pre-burning plate further comprises a plurality of jumpers disposed between the power supply line and the power supply terminals of the contact fingers for Switch between different working voltages. The method of pre-burning a solid state hard disk according to claim 6 , wherein the pre-burning plate further comprises a plurality of program cards coupled to the main body of the circuit board. The method of pre-burning a solid state hard disk according to claim 6 , wherein the first hard disk sockets are SATA sockets, the second hard disk sockets are m-SATA sockets, and the second hard disks are The ratio of the number of the sockets to the first hard disk sockets is a positive integer not less than two.