TWI476858B - Methods and systems for supporting a workpiece and for heat-treating the workpiece - Google Patents

Methods and systems for supporting a workpiece and for heat-treating the workpiece Download PDF

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TWI476858B
TWI476858B TW093113931A TW93113931A TWI476858B TW I476858 B TWI476858 B TW I476858B TW 093113931 A TW093113931 A TW 093113931A TW 93113931 A TW93113931 A TW 93113931A TW I476858 B TWI476858 B TW I476858B
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workpiece
support
support members
engaging
support member
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TW093113931A
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TW200527576A (en
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David Malcolm Camm
Guillaume Sempere
Ljubomir Kaludjercic
Gregory Stuart
Mladen Bumbulovic
Tim Tran
Sergiy Dets
Tony Komasa
Marc Rudolph
Joseph Cibere
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Mattson Tech Inc
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Description

用於支撐工件及用於熱處理該工件的方法及系統Method and system for supporting a workpiece and for heat treating the workpiece 相關申請案的交互參照Cross-references to related applications

本申請案係主張於2002年12月20日提出申請之美國專利申請案序號第60/434,670號以及於2003年5月8日提出申請之美國專利申請案序號第60/468,659號之優先權的利益,該等申請案係被加入本文以作為參考。The present application claims priority to U.S. Patent Application Serial No. 60/434,670, filed on Dec. Benefits, these applications are incorporated herein by reference.

本發明係相關於用於支撐一個工件的方法及裝置,且亦相關於用於熱處理一個工件的方法及裝置。The present invention relates to methods and apparatus for supporting a workpiece and to methods and apparatus for heat treating a workpiece.

許多應用係需要一個工件被支撐著。舉例來說,在像是微處理器之半導體晶片的製造之中,工件一般包括有一個半導體晶圓,而該半導體晶圓必須被支撐在一個處理容室之中,用於退火或是其他的熱處理程序。該晶圓一般在該容室之中是被複數個支撐栓釘(一般是石英)所支撐著,或是替代地是被一個防護環(一般是以一種相似於晶圓本身的半導體材料所形成的)所支撐著。由於介於該等支撐栓釘之間或是該防護環的物理接觸可能會造成在熱處理期間在晶圓之中的熱梯度,從而傷害到晶圓的結晶體晶格或是在晶圓之中的裝置、在許多典型系統之中的栓釘或是防護環只會在晶圓之不會被用來製造半導體晶片的外部邊緣處(在一個狹窄“排除區域”或是廢棄區域的邊界之內)接觸該晶圓。該排除區域係從晶圓的外部周為邊緣處向 內而徑向地延伸只有一段小距離(例如,3 mm)。然而,在至少一些傳統式系統之中的支撐栓釘會在除了排除區域之外的位置處接觸晶圓。舉例來說,一種傳統式系統係使用在一個與晶圓中心相距大約晶圓之半徑之三分之二的距離處接觸該晶圓的接觸栓釘。因此,雖然使用排出區域來支撐該晶圓對於許多應用來說是有利的,其並不是被視為必要的。Many applications require a workpiece to be supported. For example, in the fabrication of semiconductor wafers such as microprocessors, the workpiece typically includes a semiconductor wafer that must be supported in a processing chamber for annealing or other Heat treatment procedure. The wafer is typically supported by a plurality of support studs (typically quartz) in the chamber, or alternatively by a guard ring (generally formed of a semiconductor material similar to the wafer itself) Supported by). The physical contact between the support studs or the guard ring may cause a thermal gradient in the wafer during the heat treatment, thereby damaging the crystal lattice of the wafer or in the wafer. The device, the stud or guard ring in many typical systems will only be at the outer edge of the wafer that will not be used to fabricate the semiconductor wafer (within a narrow "excluded area" or within the boundaries of the abandoned area) Contact the wafer. The exclusion zone is from the outer periphery of the wafer to the edge It extends radially inwardly for only a small distance (for example, 3 mm). However, the support pegs in at least some conventional systems will contact the wafer at locations other than the exclusion zone. For example, a conventional system uses a contact stud that contacts the wafer at a distance of approximately two-thirds of the radius of the wafer from the center of the wafer. Thus, while the use of a discharge region to support the wafer is advantageous for many applications, it is not considered necessary.

裝置的尺寸及半導體晶片之性能要求的需求係變得越來越嚴苛,且結果是出現新的熱處理方法,並且現存的熱處理方法係被修改,用以嘗試著滿足這些相關的要求。然而,支撐晶圓的傳統式方法對於這些出現之熱處理方法的某些特定應用來說可能不再是適當的。The requirements for device size and performance requirements for semiconductor wafers are becoming more stringent, and as a result new heat treatment methods have emerged, and existing heat treatment methods have been modified to attempt to meet these related requirements. However, conventional methods of supporting wafers may no longer be appropriate for some specific applications of these emerging heat treatment methods.

此等出現的熱處理方法的例子係被揭示於在2003年7月15日授與Camm等人之共同擁有的美國第6,594,446號專利及在2002年8月1日被出版為美國第2002/0102098號出版品之共同擁有的美國序號第10/005,186號專利申請案之中,二者皆被加入於本文之中作為參考。一個此種方法係牽涉到以一個速率將晶圓預先加熱到一個中間溫度,而該速率係慢於一個通過該晶圓的熱傳導時間,使得整個晶圓可以相當均勻地被加熱到該中間溫度。這種預先加熱的階段可以藉著以一個弧光燈照射該晶圓的背側或是基材側邊而被達成,用以將該晶圓以一個猛烈的速率(例如,像是每秒100℃到每秒400℃)加熱。接著該預先加熱階段之後,晶圓的頂側或是裝置側邊係被快速地加熱到一個 實質上較高的退火溫度(以一個比通過該晶圓的熱傳導還要快得多的速率),使得只有該晶圓的頂側表面區域會被加熱到最後的退火溫度,而大部份的晶圓則仍維持接近相當較冷的中間溫度。這種情況可以藉著在一段相當短的期間(例如,一毫秒的大小)將該頂側表面區域暴露到一個來自於一個閃光燈的高功率閃光而被達成。較冷的大部份晶圓因此係如同一個吸熱器般地作用,用以幫助該頂側表面的快速冷卻。Examples of such emerging heat treatment methods are disclosed in U.S. Patent No. 6,594,446 issued to Camm et al. on Jul. 15, 2003, and issued to U.S. Patent No. 2002/0102098 on August 1, 2002. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; One such method involves preheating the wafer to an intermediate temperature at a rate that is slower than a thermal conduction time through the wafer such that the entire wafer can be heated to the intermediate temperature fairly uniformly. This preheating phase can be achieved by illuminating the back side of the wafer or the side of the substrate with an arc lamp to bring the wafer at a violent rate (eg, like 100 ° C per second). Heat to 400 ° C per second). After the preheating phase, the top side of the wafer or the side of the device is rapidly heated to a A substantially higher annealing temperature (at a much faster rate than heat transfer through the wafer) such that only the top side surface area of the wafer is heated to the final annealing temperature, while most The wafer is still maintained close to a relatively cold intermediate temperature. This can be achieved by exposing the top side surface area to a high power flash from a flash for a relatively short period of time (e.g., one millisecond). Most of the colder wafers act like a heat sink to aid in the rapid cooling of the top side surface.

不需要牽涉到任何預先加熱階段的其他退火方法係包括有使用例如是激發器雷射或是一種微波脈衝來快速地將晶圓的裝置側邊表面加熱到該退火溫度,而大部份的晶圓則保持在一個遠低得多的溫度。此種方法的一種變型係牽涉到將一個雷射線掃描橫越通過該工件的表面,用以快速地加熱該工件被該雷射線在其掃描時所涵蓋的區域。Other annealing methods that do not involve any pre-heating stages include the use of, for example, an exciter laser or a microwave pulse to rapidly heat the side surfaces of the wafer to the annealing temperature, while most of the crystals The circle is kept at a much lower temperature. A variation of this method involves scanning a beam of ray across the surface of the workpiece to rapidly heat the area of the workpiece covered by the Ray Ray as it is scanned.

然而,本案的發明人已經發現到的是,此種退火方法的某些特定實施方式可能會引起在先前尚未被發現到或是查知到的特殊問題以及困難。尤其是,如在本文中所詳細討論的是,本案的發明人已經發現到的是,傳統式的支撐一個工件的方法對於這些退火方法的某些應用來說可能不是適當的。However, the inventors of the present invention have discovered that certain specific embodiments of such annealing methods may cause particular problems and difficulties that have not previously been discovered or are known. In particular, as discussed in detail herein, the inventors of the present invention have discovered that conventional methods of supporting a workpiece may not be appropriate for certain applications of these annealing methods.

據此,係存在有對於用於支撐一個工件之一種改良式方法及系統的需要。亦存在的是對於一種熱處理一個工件之改良式方法的需要,該方法係有助於對附在本文中所討論到的困難。Accordingly, there is a need for an improved method and system for supporting a workpiece. There is also a need for an improved method of heat treating a workpiece that is useful for the difficulties discussed herein.

像是那些在上文中提到的退火方法(其係牽涉到將晶圓的裝置側邊快速地加熱到一個實質上比大部份晶圓更高的溫度)會導致該裝置側邊以一個較晶圓其他部份更大的速率熱膨脹。本案的發明人已經發現到的是,根據晶圓之裝置側邊的溫度與大部份晶圓的溫度之間的溫差大小,這種情況可能傾向於導致“熱壓彎(thermal bowing)”,藉以一般是平面的晶圓會將其本身變形成一種圓頂形狀,且該晶圓的中心係傾向於相對於其邊緣區域快速地上升。該圓頂形狀係代表了該晶圓的一種最小應力結構,將來自於晶圓的裝置側邊與大部份晶圓之間的溫度梯度所產生的熱應力減小到最小的程度。然而,由於該晶圓的裝置側邊是極為快速地被加熱(例如,在1毫秒閃光的時間,遠快於在該晶圓中典型的熱傳導時間),該晶圓的變形可能會足夠快速地發生,使得該晶圓的邊緣會施加一個很大的向下作用力於將該晶圓支撐在容室之中的支撐栓釘上。因為傳統式的支撐栓釘一般是剛性的,在該等栓釘與晶圓的邊緣之間所產生的反作用力可能會傷害該晶圓。此等作用力也可能會造成該晶圓將其本身從該等支撐栓釘處垂直而向上地投擲出來,而當該晶圓向下落回並且撞擊到該等栓釘時可能會造成對於該晶圓的進一步傷害。而且,因為傳統式的支撐栓釘並沒有被設計成可以抵抗此等作用力,它們係容易於破裂,而所具有的結果是該晶圓會在該容室之中掉 落並且被損傷或是被毀壞。除此之外,由於此種熱彎壓發生得非常迅速,一開始被賦予到該晶圓各種區域的速度係傾向於導致該晶圓超越均衡之最小應力的圓頂形狀並且擺動或是震動,而產生額外的應力並且可能會對晶圓造成傷害。Such as the annealing methods mentioned above (which involve rapidly heating the sides of the wafer to a temperature that is substantially higher than most wafers), resulting in a side of the device The other parts of the wafer are thermally expanded at a greater rate. The inventors of the present invention have discovered that depending on the temperature difference between the temperature of the side of the device on the wafer and the temperature of most of the wafer, this situation may tend to result in "thermal bowing". The generally planar wafer deforms itself into a dome shape, and the centerline of the wafer tends to rise rapidly relative to its edge region. The dome shape represents a minimum stress structure of the wafer that minimizes thermal stresses from temperature gradients between the device side of the wafer and most of the wafer. However, since the device side of the wafer is heated very quickly (eg, at 1 millisecond flash time, much faster than the typical thermal conduction time in the wafer), the wafer may be deformed quickly enough. This occurs so that the edge of the wafer exerts a large downward force on the support peg that supports the wafer in the chamber. Because conventional support studs are generally rigid, the reaction forces generated between the studs and the edges of the wafer can damage the wafer. Such forces may also cause the wafer to be thrown vertically upward from the support studs, and may cause damage to the wafer as it falls back and strikes the studs Further damage. Moreover, because conventional support studs are not designed to withstand such forces, they are susceptible to cracking, with the result that the wafer will fall out of the chamber. Fall and be damaged or destroyed. In addition, since such hot bending occurs very rapidly, the speeds initially imparted to various regions of the wafer tend to cause the wafer to exceed the equilibrium minimum stress dome shape and oscillate or vibrate. It creates additional stress and can cause damage to the wafer.

工件的此種由熱引起之運動(熱引動)的大小係傾向於與溫度暴增(亦即,介於該晶圓作為整體地被加熱到的中間溫度與只有該裝置側邊以更要快速地多的速度被加熱到的後來溫度之間的溫度差異)的大小成比例地增加。因此,使用剛性之固定式支撐栓釘或是防護環的傳統式支撐系統的使用會將非吾人所希望的限制強加在可以在沒有傷害或是破壞該晶圓之情況下而達成之溫度暴增的大小上。The magnitude of such heat-induced motion (thermal priming) of the workpiece tends to increase with temperature (i.e., the intermediate temperature at which the wafer is heated as a whole and only the side of the device is faster. The speed at which the ground speed is heated is proportional to the temperature difference between the subsequent temperatures. Therefore, the use of a conventional support system that uses a rigid fixed support stud or guard ring imposes a limit that is not desired on the temperature that can be achieved without harm or damage to the wafer. On the size.

根據本發明的一個第一方面,本發明係藉著提供一種支撐一個工件的方法而滿足了以上的需求。該方法包括有在容許該工件之由熱所引起的運動時,支撐該工件。有利的是,藉著容許由熱所引起的運動而不是嘗試著去防止該運動,該工件係被容許自然地變形成為一種應力最小的形狀,從而減少在該工件之中的應力。在同時,藉著繼續支撐著該工件,同時容許此種由熱所引起的運動,該工件係可以被保持在一個所希望的區域之中。According to a first aspect of the invention, the invention satisfies the above needs by providing a method of supporting a workpiece. The method includes supporting the workpiece while allowing motion of the workpiece caused by heat. Advantageously, by allowing motion caused by heat rather than attempting to prevent the motion, the workpiece is allowed to naturally deform into a least stressful shape, thereby reducing stress in the workpiece. At the same time, the workpiece can be held in a desired area by continuing to support the workpiece while allowing such motion caused by heat.

支撐作用可以包括有將一個支撐構件的一個可以移動之銜接部位與該工件銜接,該銜接部位為可以移動的,用以在支撐該工件時,容許該工件之由熱所引起的運動。The supporting action may include engaging a movable engagement portion of a support member with the workpiece, the engagement portion being movable to permit movement of the workpiece caused by heat when supporting the workpiece.

在本發明的一個重要應用之中,該工件係包括有一個 半導體晶圓。因此,銜接作用可以包括有將該可以移動之銜接部位與該工件銜接,用以在支撐該工件時,容許該工件之由熱所引起的運動。In an important application of the invention, the workpiece system includes a Semiconductor wafers. Thus, the engagement may include engaging the movable engagement portion with the workpiece to permit movement of the workpiece caused by heat when supporting the workpiece.

該方法可以包括有自動地容許該銜接部位反應於該工件之由熱所引起的運動而進行運動。The method can include exercising to automatically permit movement of the engagement site in response to heat caused by the workpiece.

容許該由熱所引起的運動可以包括有容許該銜接部位的運動將在該工件之中的應力減小到最少的程度,同時在該由熱所引起的運動期間支撐著該工件。Allowing the motion caused by heat may include the extent to which the movement of the engagement portion is allowed to minimize stress within the workpiece while supporting the workpiece during the motion caused by the heat.

容許該由熱所引起的運動可以包括有容許該工件之外部區域的運動,同時將該工件的質量中心保持在一個所希求的範圍之內。保持該質量中心可以包括有將該工件之質量中心的運動減小到最小的程度。Allowing the movement caused by heat may include allowing movement of the outer region of the workpiece while maintaining the center of mass of the workpiece within a desired range. Maintaining the center of mass can include the extent to which the motion of the center of mass of the workpiece is minimized.

容許該工件之由熱所引起的運動可以包括有容許該工件的熱壓彎。替代地,這種情況可以包括有例如是容許該工件的熱彎曲。Allowing the motion of the workpiece to be caused by heat may include allowing for hot bending of the workpiece. Alternatively, this may include, for example, allowing thermal bending of the workpiece.

銜接程序可以包括有與當做銜接部位(一個剛性而可以移動之支撐構件的一個部位)的工件相銜接。The engagement procedure can include engaging a workpiece that is a joint (a portion of a rigid, movable support member).

該支撐構件可以是可撓性的並且可以具有一個限制部位以及一個位受限制的部位,在這種情況中,銜接作用可以包括有將該位受限制的部位與該工件相銜接。The support member may be flexible and may have a restraining portion and a positionally constrained portion, in which case the engaging action may include engaging the portion where the position is restricted with the workpiece.

銜接程序可以包括有彈性地將該支撐構件之可以移動的銜接部位與該工件相銜接。在此種實施例之中,有利的是,當該工件的熱壓彎發生時,該工件的外部邊緣可以向下壓在彈性地銜接之可以移動的銜接部位上,導致該銜接 部位與該工件的邊緣向下移動,以及用以在該工件朝向其原始形狀恢復時彈性地使該銜接部位與該工件的外部邊緣一起回原處升起。此種彈性的支撐係容許該工件可以進行熱壓彎,藉以減少其內部應力,同時減少或是消除在該壓彎運動的開始時晶圓將其自身從該銜接部位處向上發射。The engagement procedure can include resiliently engaging the movable engagement portion of the support member with the workpiece. In such an embodiment, it is advantageous that when the hot bending of the workpiece occurs, the outer edge of the workpiece can be pressed down onto the elastically engageable movable joint, resulting in the engagement. The portion moves downwardly from the edge of the workpiece and is used to resiliently raise the engagement portion back together with the outer edge of the workpiece as the workpiece returns to its original shape. Such an elastic support allows the workpiece to be hot-bent, thereby reducing its internal stress while reducing or eliminating the upward launch of the wafer from the joint at the beginning of the press-bending motion.

銜接程序可以包括有將複數個支撐構件的複數個各自之可以移動的部位與該工件相銜接。舉例來說,銜接程序可以包括有將至少三個支撐構件的至少三個各自之可以移動的部位與該工件相銜接。同樣地,銜接程序可以包括有將至少四個支撐構件的至少四個各自之可以移動的部位與該工件相銜接。The docking program can include engaging a plurality of respective movable portions of the plurality of support members with the workpiece. For example, the articulating procedure can include engaging at least three respective movable portions of the at least three support members with the workpiece. Likewise, the docking procedure can include engaging at least four respective movable portions of the at least four support members with the workpiece.

該方法更可以包括有壓制該工件的震動。壓制程序可以包括有壓制該工件之至少一種自然的震動模式。這個程序可以包括有壓制該工件之一個第二自然震動模式,或是可以包括有壓制例如是該工件之一個第一自然震動模式。The method may further include vibrating the workpiece. The pressing process can include at least one natural vibration mode that suppresses the workpiece. The program may include a second natural vibration mode for pressing the workpiece, or may include pressing a first natural vibration mode such as the workpiece.

壓制程序可以包括有吸收來自於該工件的動能。The pressing process can include absorbing kinetic energy from the workpiece.

銜接程序可以包括有將該複數的支撐栓釘之複數個各自之尖端與該工件相銜接。這個程序可以包括有將該等支撐栓釘的尖端與該工件的一個外部周圍相銜接。在此種情況之中,該方法更可以包括有自動地容許該等支撐栓釘的尖端反應該工件之外部周圍區域之由熱所引起的運動而進行運動。The engagement procedure can include engaging a plurality of respective tips of the plurality of support pegs with the workpiece. This procedure may include engaging the tips of the support studs with an outer periphery of the workpiece. In such a case, the method may further include moving automatically by allowing the tips of the support studs to react with heat induced motion of the outer peripheral region of the workpiece.

銜接程序可以包括有將每個可以移動的銜接部位與該工件彈性地銜接。這個程序可以包括有將一個作用力應用 到每個支撐構件,用以致使每個銜接部位係傾向於在工件進行由熱所引起的運動期間保持住與該工件的接觸。The articulating procedure can include elastically engaging each of the movable engagement locations with the workpiece. This app can include the application of a force Each of the support members is adapted to cause each of the engagement portions to tend to maintain contact with the workpiece during the movement of the workpiece caused by heat.

應用一個作用力的程序可以包括有將一個力矩應用到每個支撐構件。應用一個力矩的程序可以包括有在一個位於每個支撐構件上的位置處應用一個向上的作用力,而該位置係被差置於該支撐構件的一個樞轉點與該銜接部位之間。替代地,應用一個力矩的程序可以包括有在一個位於每個支撐構件上的位置處應用一個向上的作用力,而使得該支撐構件的一個樞轉點係被差置在該位置與該銜接部位之間。A procedure for applying a force may include applying a moment to each of the support members. The procedure for applying a moment may include applying an upward force at a position on each of the support members, the position being placed between a pivot point of the support member and the engagement portion. Alternatively, the procedure for applying a moment may include applying an upward force at a position on each of the support members such that a pivot point of the support member is differentially placed at the position and the engagement portion between.

應用一個作用力的程序可以包括有應用第一作用力及第二作用力,用以將第一及第二相反力矩應用在每個支撐構件上,該第二力矩係作用以藉著其一個平衡位置的支撐構件來對抗過度的移動(overshooting)。The application of a force program may include applying a first force and a second force for applying the first and second opposing moments to each of the support members, the second moment acting to balance by one of the forces The support member of the position is opposed to excessive overshooting.

應用一個作用力的程序可以包括有應用一個彈簧作用力。這個程序可以包括有藉著一個被連接到每個支撐構件的彈簧來應用該作用力。舉例來說,這個程序可以包括有藉著一個被連接到每個支撐構件之固定大小作用力的彈簧來應用一個固定大小的作用力。A program that applies a force can include applying a spring force. This procedure may include applying the force by a spring that is coupled to each of the support members. For example, the program can include applying a fixed amount of force by a fixed amount of force coupled to each of the support members.

銜接的程序可以包括有將該工件與複數個各自之支撐栓釘的複數個尖端銜接起來,該等支撐栓釘係包括有對於至少一些發光波長來說為可以穿透的材料,而該工件可以藉著該等發光波長被照射加熱。因此,舉例來說,銜接的程序可以包括有將該工件與複數個各自之支撐栓釘的複數 個尖端銜接起來,該等支撐栓釘係包括有在光學上可以穿透的材料。The engrafting procedure can include engaging the workpiece with a plurality of tips of a plurality of respective support pegs, the support pegs comprising a material that is permeable to at least some of the illuminating wavelengths, and the workpiece can The light is irradiated and heated by the light-emitting wavelengths. Thus, for example, the articulating procedure can include a plurality of the workpiece and a plurality of respective support pegs The tips are joined together and the support studs comprise an optically permeable material.

銜接的程序可以包括有將該工件與複數個各自之支撐栓釘的複數個尖端銜接起來,該等支撐栓釘係包括有石英。替代地,該等支撐栓釘可以包括有藍寶石、或是可以包括有金屬。舉例來說,該等支撐栓釘可以包括有鎢。The engrafting procedure can include engaging the workpiece with a plurality of tips of a plurality of respective support studs, the support studs comprising quartz. Alternatively, the support studs may include sapphire or may include metal. For example, the support studs can include tungsten.

銜接的程序可以包括有將該工件與複數個各自之支撐栓釘的複數個塗層尖端銜接起來。舉例來說,這個程序可以包括有將該工件與複數個各自之鎢的支撐栓釘的複數個氮化鎢塗層之尖端銜接起來。替代地,該等尖端可以例如是以碳化鎢塗層。The articulating procedure can include engaging a plurality of coating tips that machine the workpiece with a plurality of respective support pegs. For example, the program can include a plurality of tips of a plurality of tungsten nitride coatings that bond the workpiece to a plurality of respective tungsten support pegs. Alternatively, the tips can be coated, for example, with a tungsten carbide.

銜接的程序可以包括有將該工件與複數個各自之支撐栓釘的複數個以平滑表面處理的尖端銜接起來。有利的是,此種平滑表面處理的尖端係傾向於減少介於該等支撐栓釘與該工件之間的摩擦。此係因此會減少刮傷該工件的可能性,藉以防止該工件之微粒物質的污染,或是該工件之表面之非所欲的粗糙。減少摩擦也可以幫助減少在該工件之中的應力。此種平滑表面處理的尖端可以包括有例如是熔化、拋光、或是塗層的尖端。The articulating procedure can include engaging a plurality of smooth surface treated tips of the workpiece with a plurality of respective support pegs. Advantageously, such a smooth surface treated tip tends to reduce friction between the support studs and the workpiece. This therefore reduces the likelihood of scratching the workpiece, thereby preventing contamination of the particulate matter of the workpiece or undesired roughness of the surface of the workpiece. Reducing friction can also help reduce stress in the workpiece. Such smooth surface treated tips may include tips that are, for example, melted, polished, or coated.

該方法更可以包括有反應於該工件之以熱引動的運動來移動該可以移動的銜接部位。移動該可以移動的銜接部位的程序可以包括有移動該等支撐構件。者個程序可以包括有,對於每個銜接構件,將一種電流應用到一個被連接到該支撐構件的致動器。應用一個電流的程序可以包括有 將一個電流應用到一個被連接到該支撐構件的聲音線圈致動器。替代地,這個程序可以包括有將一個電流應用到被連接到該支撐構件的一個壓電致動器或是一個線性伺服致動器。The method may further include moving the movable engagement portion in response to the thermally actuated motion of the workpiece. The process of moving the movable engagement portion may include moving the support members. A program may include, for each of the engagement members, applying a current to an actuator that is coupled to the support member. A program that applies a current can include A current is applied to a voice coil actuator that is coupled to the support member. Alternatively, the program can include applying a current to a piezoelectric actuator or a linear servo actuator that is coupled to the support member.

這個方法更可以包括有將該致動器之一個可以移動的構件的線性運動轉移成該支撐構件的一個拱形運動。The method may further include transferring a linear motion of the movable member of the actuator to an arched motion of the support member.

移動的程序可以包括有調整複數個支撐構件的位置,用以將介於該工件的重量與一個被複數個支撐構件之複數個銜接部位所應用到該工件之向上作用力之間的差異減少到最小的程度。有利的是,在此等實施例之中,由支撐構件提供到該工件的向上作用力係差不多足以平衡向下作用在該工件上的重力,但是卻並非明顯地較大。此係進一步地減少該工件將自己投擲出去的傾向。The moving program may include adjusting a position of the plurality of support members to reduce a difference between a weight between the workpiece and an upward force applied to the workpiece by a plurality of joint portions of the plurality of support members to The minimum extent. Advantageously, in these embodiments, the upward force provided by the support member to the workpiece is substantially sufficient to balance the gravitational force acting downwardly on the workpiece, but is not significantly larger. This system further reduces the tendency of the workpiece to throw itself out.

移動的程序可以包括有調整支撐構件的位置,用以將該工件之重量與一個被支撐構件之銜接部位所應用到該工件之向上作用力之間的一個差異保持在一個所希望的範圍之內。The moving program may include a position to adjust the support member to maintain a difference between the weight of the workpiece and the upward force applied to the workpiece by the engagement portion of the supported member within a desired range .

反應於該以熱引動之運動來移動該等銜接部位的程序可以包括有反應於該以熱引動之運動的一個預測數值來移動該等支撐構件。The process of reacting the thermally coupled movements to move the engagement locations can include moving the support members in response to the predicted value of the motion of the thermal actuation.

替代地,反應於該以熱引動之運動來移動該等銜接部位的程序可以包括有反應於該以熱引動之運動的一個被偵測出來的參數來移動該等支撐構件。Alternatively, the process of reacting the thermally coupled movements to move the engagement locations can include moving the support members in response to the detected parameters of the thermally actuated motion.

因此,該方法更可以包括有偵測該工件之以熱引動的 運動。偵測的程序可以包括有,在複數個致動器中的每個致動器中(每個致動器係分別被連接到複數個支撐構件中的其中之一)偵測出從一個作用力所產生的一個電流,其中,該作用力係藉著該工件的運動而被應用到該支撐構件的銜接部位。Therefore, the method may further comprise detecting the workpiece to be thermally actuated. motion. The detecting program may include detecting, from each of the plurality of actuators (each actuator is connected to one of the plurality of support members) An electric current is generated, wherein the force is applied to the joint portion of the support member by the movement of the workpiece.

移動該銜接部位的程序可以包括有將一個電流應用到每個致動器。The procedure for moving the interface can include applying a current to each actuator.

偵測該電流的程序可以包括有偵測出在複數個聲音線圈致動器中的每個致動器之中的電流,而每個致動器係分別被連接到其中一個支撐構件,並且移動該銜接部位的程序可以包括有將電流應用到該等聲音線圈致動器。The program for detecting the current may include detecting a current among each of the plurality of voice coil actuators, and each actuator is connected to one of the support members, respectively, and moving The program of the engagement portion can include applying a current to the acoustic coil actuators.

對於每個致動器來說,偵測該電流的程序可以包括有偵測出該電流距離一個所希望之電流標準的一個誤差,並且,對於每個支撐構件來說,移動該銜接部位的程序可以包括有調整該支撐構件的一個位置,用以將該誤差減少到最小的程度。偵測出該誤差的程序可以包括有在一個處於與致動器連通之中的處理器電路中偵測出該誤差。For each actuator, the procedure for detecting the current may include an error that detects the current distance from a desired current standard, and for each support member, the procedure for moving the joint portion A position to adjust the support member can be included to reduce the error to a minimum. The process of detecting the error can include detecting the error in a processor circuit in communication with the actuator.

銜接的程序可以包括有將複數個第一支撐構件的複數個各個可以移動之第一銜接部位與該工件的一個下方表面銜接起來,以及將複數個第二支撐構件的複數個第二銜接部位與該工件的一個上方表面銜接起來。這個程序可以包括有銜接複數個第一及複數個第二銜接部位與該工件的下方及上方表面在該工件的一個外部周圍區域處銜接起來。The joining process may include connecting a plurality of each movable first engaging portion of the plurality of first supporting members with a lower surface of the workpiece, and connecting the plurality of second connecting portions of the plurality of second supporting members with An upper surface of the workpiece is joined. The program can include engaging a plurality of first and plural second engagement locations with the lower and upper surfaces of the workpiece at an outer peripheral region of the workpiece.

移動的程序可以包括有移動該等銜接部位,用以將被 應用在該工件與該等銜接部位之間的作用力減小到最小的程度。舉例來說,移動的程序可以包括有移動與該工件之一個下方表面相銜接之複數個第一支撐構件的複數個各個第一銜接部位,用以將介於該工件的一個重量與一個作用力之間的誤差減小到最小的程度,其中,該作用力係被應用在複數個第一銜接部位與該工件之間。同樣的,移動的程序可以包括有移動與該工件之一個上方表面相銜接之複數個第二支撐構件的複數個各個第二銜接部位,用以將一個被應用在介於該工件與該等複數個第二銜接部位之間的作用力減小到最小的程度。The moving program may include moving the joints to be used The force applied between the workpiece and the joints is minimized. For example, the moving program can include a plurality of respective first engagement portions that move a plurality of first support members that engage a lower surface of the workpiece for placing a weight and a force between the workpieces The error between them is reduced to a minimum extent, wherein the force is applied between the plurality of first engagement locations and the workpiece. Similarly, the moving program can include a plurality of respective second engagement portions that move a plurality of second support members that engage an upper surface of the workpiece to apply one between the workpiece and the plurality of The force between the second articulating sites is reduced to a minimum.

如果有需要的話,可以使用一個組合的被動/主動支撐方法。舉例來說,銜接的程序可以包括有將該等支撐構件的銜接部位與該工件彈性地銜接起來,並且移動的程序可以包括有反應於以熱引動的運動來移動該等支撐構件。彈性地銜接的程序可以包括有在該等支撐構件的各個樞轉點附近將力矩應用到該等支撐構件,用以造成該等銜接部位係傾向於維持與該工件的接觸,並且移動的程序可以包括有移動該等支撐構件的樞轉點。應用力矩的程序可以包括有將彈性作用力在除了支撐構件之樞轉點之外的位置處應用到該等支撐構件,並且移動的程序可以包括有將電流應用到複數個被連接到複數個支撐構件的致動器,用以移動該等支撐構件。該等複數個支撐構件可以包括有複數個可撓曲的支撐構件,每個可撓曲的支撐構件皆具有一個限制部位以及一個非限制部位。在此種情況之中,彈性地銜 接的程序可以包括有將該等支撐構件的非限制部位與該工件銜接起來,並且移動的程序可以包括有移動該等支撐構件的限制部位。移動的程序可以包括有將電流應用到被連接到複數個限制部位的複數個致動器。A combined passive/active support method can be used if needed. For example, the articulating procedure can include elastically engaging the engagement locations of the support members with the workpiece, and the moving program can include moving the support members in response to the thermally actuated motion. The resiliently coupled procedure can include applying a moment to the support members adjacent the respective pivot points of the support members to cause the engagement portions to tend to maintain contact with the workpiece, and the moving program can A pivot point that moves the support members is included. The program for applying the moment may include applying the elastic force to the support members at a position other than the pivot point of the support member, and the moving program may include applying a current to the plurality of supports connected to the plurality of supports Actuators of the members for moving the support members. The plurality of support members can include a plurality of flexible support members, each flexible support member having a restraining portion and an unrestricted portion. In this case, the elastic title The procedural process can include engaging non-limiting portions of the support members with the workpiece, and the moving program can include a restriction to move the support members. The moving program can include applying a current to a plurality of actuators connected to a plurality of restriction sites.

更加概略地說,該等複數個支撐構件可以包括有複數個可撓曲的支撐構件,每個可撓曲的支撐構件皆具有一個非限制部位以及一個限制部位,並且銜接該等複數個可以移動之銜接部位的程序可以包括有將該等可撓曲支撐構件的非限制部位與該工件銜接起來。More generally, the plurality of support members can include a plurality of flexible support members, each flexible support member having an unrestricted portion and a restraining portion, and the plurality of movable members can be moved The procedure for engaging the joint portion may include engaging the non-restricted portions of the flexible support members with the workpiece.

該等複數個可撓曲的支撐構件可以包括有複數個纖維,並且銜接的程序可以包括有將該等纖維的非限制部位與該工件銜接起來,舉例來說,該等可撓曲的支撐構件可以包括有像是石英纖維或是藍寶石纖維的光學纖維。The plurality of flexible support members can include a plurality of fibers, and the joining process can include engaging non-limiting portions of the fibers with the workpiece, for example, the flexible support members Optical fibers such as quartz or sapphire fibers may be included.

該方法更可以包括有限制住該等可撓曲支撐構件的每個限制部位。The method may further include limiting each of the restraining portions of the flexible support members.

限制的程序可以包括有限制住位於複數個限制器之中的限制部位,該等限制器係被配置在該工件的一個外部周圍附近。The restricted procedure can include restricting a restriction located in the plurality of limiters that are disposed adjacent an outer circumference of the workpiece.

該等複數個限制器可以由數目少於可撓曲支撐構件之數目的限制器構成,並且限制的程序可以包括有在每個限制器之中限制住多於一個的可撓曲支撐構件。這個程序可以包括有,在每個限制器之中,以大體上彼此平行之方式限制住多於一個的可撓曲支撐構件。替代的方式是,這個程序可以包括有以大體上彼此分散的方式限制住該等多於 一個的可撓曲支撐構件。The plurality of limiters may be constructed of a number of limiters that are less than the number of flexible support members, and the restricted procedure may include having more than one flexible support member confined within each limiter. This procedure may include, among each of the restrictors, confining more than one flexible support member in a manner generally parallel to each other. Alternatively, the program may include limiting the amount more than one another in a manner that is substantially dispersed from each other. A flexible support member.

替代的方式是,該等複數個限制器可以由數目相同於可撓曲支撐構件之數目的限制器構成,在這種情況中,限制的程序可以包括有將每個被限制的部位限制在其中一個各自對應的限制器之中。Alternatively, the plurality of limiters may be comprised of a limiter having the same number as the number of flexible support members, in which case the limiting procedure may include limiting each restricted portion therein. One of the corresponding limiters.

銜接的程序可以包括有將一個作用力應用到該等限制器,用以使得每個位受到限制的部位在該工件之以熱引動的運動期間傾向於與該工件保持接觸。應用一個作用力的程序可以包括有應用一個力矩。這個程序可以包括有應用一個彈簧作用力。The articulating procedure can include applying a force to the limiters such that the portion of each bit that is constrained tends to remain in contact with the workpiece during the thermally actuated motion of the workpiece. A procedure that applies a force can include applying a torque. This procedure can include the application of a spring force.

銜接的程序可以包括有將每個銜接部位以一個相對於該工件之一個平面為10度到80度的角度與該工件的一個下方表面銜接起來。更加特別的是,這個程序可以包括有一個相對於該工件之一個平面為15度到35度的角度。又更加特別的是,這個程序可以包括有一個相對於該工件之一個平面為25度的角度。The articulating procedure can include engaging each of the engagement locations with a lower surface of the workpiece at an angle of 10 to 80 degrees relative to a plane of the workpiece. More specifically, the program can include an angle of 15 to 35 degrees with respect to a plane of the workpiece. More specifically, the program can include an angle of 25 degrees with respect to a plane of the workpiece.

每個可撓曲支撐構件可以包括有在其一個端部處的限制部位,並且限制的程序可以包括有限制該限制部位,用以導致未限制的部位可以朝向該工件的一個中央區域向內地延伸。Each flexible support member can include a restriction at one end thereof, and the limiting procedure can include limiting the restriction to cause the unrestricted portion to extend inwardly toward a central region of the workpiece .

每個未限制部位的一個內部尖端可以向內延伸而經過該工件的一個外部邊緣,並且銜接的程序可以包括有以該工件的外部邊緣銜接一個沿著未限制部位而介於限制部位與內部尖端之間的中間點。An inner tip of each unrestricted portion may extend inwardly past an outer edge of the workpiece, and the process of engaging may include engaging an outer edge of the workpiece along an unrestricted portion and between the restricted portion and the inner tip The middle point between.

限制的程序可以包括有將該等限制部位限制在一個包圍著該工件之一個工件平面板件之中。限制的程序可以包括有夾制的程序。The restricted procedure may include limiting the restricted portion to a workpiece planar panel surrounding the workpiece. Restricted programs can include programs that are clipped.

限制每個限制部位的程序可以包括有將限制部位附加到該工件平面板件,且該未限制部位係朝向該工件通過一個被界定在該板件之中的工件支撐開孔而向內延伸。The procedure for limiting each restriction may include attaching a restriction to the workpiece planar panel and the unrestricted portion extends inwardly toward the workpiece through a workpiece support aperture defined in the panel.

限制的程序可以包括有將限制部位限制在一個大體上水平的方向之中,用以導致未限制部位在向下下垂時,會朝向該工件的中央區域大體上水平而向內地延伸。The limiting procedure can include limiting the restriction to a generally horizontal orientation to cause the unconstrained portion to extend generally horizontally inwardly toward the central region of the workpiece when sagged downwardly.

銜接的程序可以包括有將未限制部位與該工件的一個外部邊緣銜接起來。這個程序可以包括有以一個相對於該工件之一個平面而小於大約10度的角度將未限制部位與該工件的一個外部邊緣銜接起來。The articulating procedure can include engaging the unconstrained portion with an outer edge of the workpiece. The program can include engaging the unconstrained portion with an outer edge of the workpiece at an angle of less than about 10 degrees relative to a plane of the workpiece.

複數個可撓曲支撐構件可以包括有複數個長形的可撓曲支撐構件。該等複數個長形可撓曲支撐構件可以包括有至少20個長形的可撓曲支撐構件,並且限制的程序可以包括有將至少20個長形可撓曲支撐構件中的每一個限制在該工件的平面板件之中。同樣的,該等複數個長形可撓曲支撐構件可以包括有至少50個長形的可撓曲支撐構件,並且限制的程序可以包括有將該等至少50個長形可撓曲支撐構件中的每一個限制在該工件的平面板件之中。The plurality of flexible support members can include a plurality of elongate flexible support members. The plurality of elongate flexible support members can include at least 20 elongate flexible support members, and the limiting procedure can include limiting each of the at least 20 elongate flexible support members to Among the flat plates of the workpiece. Likewise, the plurality of elongate flexible support members can include at least 50 elongate flexible support members, and the limiting procedure can include the at least 50 elongate flexible support members Each of them is limited to the planar panel of the workpiece.

每個可撓曲支撐構件可以包括有位於該支撐構件之相對端部處的第一及第二限制部位,該等相對端部係在其間界定出未限制部位,並且限制的程序可以包括有以分隔開 的關係限制住該等第一及第二限制部位,用以導致限制部位以一個位於其間的一個彎曲路徑之間延伸。Each of the flexible support members can include first and second restriction locations at opposite ends of the support member, the opposite ends defining an unrestricted portion therebetween, and the limiting procedure can include Separate The relationship limits the first and second restriction locations to cause the restriction to extend between a curved path therebetween.

限制的程序可以包括有限制該等第一及第二限制部位,用以導致未限制部位向上且向內地從第一限制部位朝向工件沿著該彎曲的路徑延伸而到達與該工件接觸的一個區域,並且從該接觸的區域處向下且向外地延伸到該第二限制部位。The limiting program may include limiting the first and second restriction portions to cause the unrestricted portion to extend upwardly and inwardly from the first restriction portion toward the workpiece along the curved path to reach an area in contact with the workpiece And extending downward and outward from the area of the contact to the second restriction.

限制的程序可以包括有限制該第一限制部位及該第二限制部位,用以導致未限制部位沿著該彎曲路徑延伸,而使得一個對於位於該接觸區域之未限制部位的切線係大體上平行於一個對於該工件位於該接觸區域附近之一個外部周圍的切線。The limiting procedure can include limiting the first restriction portion and the second restriction portion to cause the unrestricted portion to extend along the curved path such that a tangent to the unconstrained portion of the contact region is substantially parallel A tangent to an outer portion of the workpiece that is located adjacent the contact area.

替代的方式是,限制的程序可以包括有限制該等第一及第二限制部位,用以導致未限制部位可以沿著該彎曲路徑延伸,而使得一個對於位於接觸區域處之未限制部位的切線可以朝向該工件中心徑向地向內延伸。Alternatively, the limiting procedure may include limiting the first and second restriction locations to cause the unrestricted portion to extend along the curved path such that a tangent to the unconstrained portion at the contact area It may extend radially inward toward the center of the workpiece.

進一步的替代方式是,限制的程序可以包括有限制住該等第一限制部位以及第二限制部位,用以導致未限制部位可以沿著該彎曲路徑延伸,用以形成一個大體上環形的第一路徑片段、一個大體上環形的第二路徑片段以及一個大體上環形的第三路徑片段,該第一路徑片段係從位於該工件的一個平面下方的第一限制部位處延伸並且在該工件的一個下方表面處接觸該工件,該第二路徑片段係延伸於該工件的一個外部邊緣與一個工件平面板件的一個內部邊 緣之間,該第三路徑片段係延伸於該工件的平面上方並且在該工件的一個上方表面處接觸該工件,該彎曲路徑係在該第二限制部位處終止。In a further alternative, the limiting procedure may include limiting the first restriction portion and the second restriction portion to cause the unrestricted portion to extend along the curved path to form a substantially annular first a path segment, a substantially annular second path segment, and a substantially annular third path segment extending from a first restriction located below a plane of the workpiece and at the workpiece Contacting the workpiece at a lower surface, the second path segment extending from an outer edge of the workpiece and an inner edge of a workpiece planar panel Between the edges, the third path segment extends above the plane of the workpiece and contacts the workpiece at an upper surface of the workpiece, the curved path terminating at the second restriction.

該方法更包括有縮回第二限制部位,用以將該大體上環形的第三路徑片段移出一個被界定在該工件之上方表面上方的體積。The method further includes retracting the second restriction to move the substantially annular third path segment out of a volume defined above the upper surface of the workpiece.

限制的程序可以包括有附加第一及第二限制部位,用以防止限制部位的運動。The restricted procedure may include additional first and second restriction locations to prevent movement of the restriction.

限制的程序可以包括有以可以縮回的方式限制住第一及第二限制部位至少其中之一。該方法更可以包括有縮回第一及第二限制部位的至少其中之一,用以有效率地縮短未限制部位。相反地,該方法更可以包括有延伸第一及第二限制部位的至少其中之一,用以有效率地加長未限制部位。The restricted procedure can include limiting at least one of the first and second restriction locations in a retractable manner. The method may further include retracting at least one of the first and second restriction portions to effectively shorten the unrestricted portion. Conversely, the method may further include extending at least one of the first and second restriction sites to effectively lengthen the unrestricted portion.

該等複數個可撓曲支撐構件可以包括有第一及第二複數個可撓曲支撐構件,並且銜接該等複數個可以移動之銜接部位的程序可以包括有將第一複數個可撓曲支撐構件的未限制部位與該工件的一個下方表面銜接起來,以及將第二複數個可撓曲支撐構件的未限制部位與該工件的一個上方表面銜接起來。The plurality of flexible support members can include first and second plurality of flexible support members, and the program for engaging the plurality of movable engagement portions can include the first plurality of flexible supports An unrestricted portion of the member engages a lower surface of the workpiece and an unrestricted portion of the second plurality of flexible support members engages an upper surface of the workpiece.

該方法更可以包括有側向地支撐該工件。側向支撐的程序可以包括有將複數個側向支撐構件分別定位在相對於該工件之一個外部邊緣的個別位置處。定位的程序可以包括有彈性地銜接該等複數個側向支撐構件與該工件的外部 邊緣。The method may further include laterally supporting the workpiece. The lateral support procedure can include positioning a plurality of lateral support members at respective locations relative to an outer edge of the workpiece. The positioning procedure can include elastically engaging the plurality of lateral support members and the exterior of the workpiece edge.

定位的程序可以包括有將複數個可撓曲纖維定位在個別的位置處。這個程序可以包括有將該等可撓曲纖維定位在一個大致上與該工件的一個平面成直角的角度。The positioning procedure can include positioning a plurality of flexible fibers at individual locations. This procedure may include positioning the flexible fibers at an angle substantially at right angles to a plane of the workpiece.

銜接及側向支撐的程序可以包括有銜接一個支撐構件的一個垂直支撐銜接部位與該工件的一個下方表面,並且銜接該支撐構件的一個側向支撐銜接部位與該工件的一個外部邊緣。The process of engaging and laterally supporting may include a vertical support engagement portion that engages a support member and a lower surface of the workpiece, and a lateral support engagement portion of the support member that engages an outer edge of the workpiece.

銜接及側向支撐的程序可以包括有分別銜接複數個支撐構件之各自的複數個垂直及側向支撐銜接部位與該工件。銜接及側向支撐的程序可以包括有彈性地銜接該等垂直及側向支撐銜接部位與該工件。銜接及側向支撐的程序可以包括有如同該等垂直及側向支撐銜接部位地銜接可撓曲的銜接部位。銜接及側向支撐的程序可以包括有如同該等垂直及側向支撐銜接部位地將該工件與第一及第二纖維銜接起來。The process of articulating and laterally supporting can include a plurality of respective vertical and lateral support engagement locations respectively engaging a plurality of support members with the workpiece. The procedures of articulating and laterally supporting can include resiliently engaging the vertical and lateral support engagement locations with the workpiece. The procedures for articulation and lateral support can include engaging flexing engagement sites as the vertical and lateral support engagement locations. The process of engaging and laterally supporting can include engaging the workpiece with the first and second fibers as the vertical and lateral support engaging portions.

定位的程序可以包括有定位複數個光學纖維。同樣地,定位的程序可以包括有定位複數個例如是石英纖維或是藍寶石纖維。The positioning procedure can include positioning a plurality of optical fibers. Likewise, the positioning procedure can include positioning a plurality of, for example, quartz or sapphire fibers.

根據本發明的另一個概念,所提供的是一種工件之熱處理的方法。該方法係包括有相對於大部份的工件加熱該工件的一個表面,用以產生該工件之以熱引動的運動。加熱的程序可以包括有照射該工件的該表面。照射的程序可以包括有照射該表面一段短於該工件之一段熱傳導時間的 時間,用以將該表面加熱到一個高於的大部份工件之溫度的溫度。照射的程序可以包括有照射該表面一段少於例如是大約1毫秒的時間。According to another concept of the invention, a method of heat treatment of a workpiece is provided. The method includes heating a surface of the workpiece relative to a majority of the workpiece to produce a thermally actuated motion of the workpiece. The heating procedure can include illuminating the surface of the workpiece. The program of illuminating can include illuminating the surface for a period of time shorter than a portion of the workpiece for heat conduction time Time to heat the surface to a temperature above the temperature of most of the workpiece. The procedure of illuminating can include illuminating the surface for a period of time less than, for example, about 1 millisecond.

照射的程序可以包括有照射該工件之該表面一段少於該工件之熱傳導時間的第一時間,用以將該表面加熱到一個大於大部份工件之溫度的中間溫度。照射的程序可以包括有照射該表面一段少於該工件之熱傳導時間的第二時間,用以將該表面加熱到一個大於該中間溫度的溫度,其中,該第二時間係在接著該第一時間的一個間隔時間之內開始,其係足以容許至少一些工件的熱壓彎。有利的是,此種方法係傾向於減少從該第一時間期間的照射所產生之工件的初始熱壓彎大小,並且在第二時間期間的後續照射可以幫助壓制該工件的震動。The process of illuminating can include a first time that the surface of the workpiece is illuminated for less than a thermal conduction time of the workpiece to heat the surface to an intermediate temperature greater than the temperature of the majority of the workpiece. The illuminating process can include a second time of illuminating the surface for less than a thermal conduction time of the workpiece to heat the surface to a temperature greater than the intermediate temperature, wherein the second time is subsequent to the first time It begins within an interval, which is sufficient to allow for hot bending of at least some of the workpieces. Advantageously, such a method tends to reduce the initial hot bend size of the workpiece resulting from the illumination during the first time period, and subsequent illumination during the second time can help suppress the vibration of the workpiece.

照射的程序可以包括有在該第二時間期間將比第一時間期間更多的輻射能量施加到該工件的表面。The program of illumination can include having more radiant energy applied to the surface of the workpiece during the second time than during the first time period.

照射的程序可以包括有接著該第一時間期間的結尾之後的7毫秒之內開始該第二時間的期間。The program of illumination may include a period of starting the second time within 7 milliseconds following the end of the first time period.

照射的程序可以包括有連續地照射該工件的表面一段間隔時間,該間隔時間係較短於工件的熱傳導時間並且係足夠長以容許該工件至少產生一些熱壓彎。連續照射的程序可以包括有在該間隔時間期間改變照射的強度。改變的程序可以包括有在該間隔時間的一個較後部份期間而不是在該間隔時間的一個較早部份期間以一個較大的強度照射該表面。有利的是,此種方法係傾向於減少該工件之熱壓 彎大小並且壓制住該工件的後續震動。The process of illuminating can include intermittently illuminating the surface of the workpiece for an interval that is shorter than the thermal conduction time of the workpiece and is sufficiently long to allow the workpiece to produce at least some hot bending. The procedure of continuous illumination can include varying the intensity of the illumination during the interval. The altered program can include illuminating the surface with a greater intensity during a later portion of the interval rather than during an earlier portion of the interval. Advantageously, this method tends to reduce the hot pressing of the workpiece. The bend is sized and the subsequent shock of the workpiece is suppressed.

照射的程序可以包括有以一個閃光燈照射該表面。The procedure of illuminating can include illuminating the surface with a flashlight.

有利的是,藉著採用本案發明人之研究結果的優點,根據表面加熱行程的快速程度,此種熱處理方法可以用來減少熱應力並且壓制住在該工件之中的震動,該工件的熱壓彎可以減弱其本身所增加的溫度。舉例來說,在一個特殊情況之中,其中,在第一時間期間的照射係藉著在大約1毫秒之持續期間的加熱閃光而達成,被照射之表面的一個尖峰溫度粗略地係與該閃光(t=1ms)的結束時,發生。然而,在該時刻,晶圓僅才剛開始發生熱壓彎,並且因此僅會達到其最大熱壓彎振幅的一個相當小的百分比。該最大熱壓彎的振幅並不會被達成,直到差不多4毫秒之後,而在此時,該晶圓已經超越其平衡形狀。在一個短時間之後(大約在t=6ms時),該晶圓仍然是被顯著地壓彎,但是會以非常大的恢復速度恢復到其扁平位置。根據本發明之前述概念的一個實施例,晶圓的裝置側邊係會遭受到一個第二次照射閃光,該照射的時間係被安排成使得從該第二次照射閃光所產生的熱壓彎會在該晶圓已經從第一次閃光的產生熱壓彎並且正在朝向其扁平位置恢復時,發生。因為該晶圓已經由於第一次閃光而被熱壓彎了,第二次閃光所產生之熱壓彎所製造出來之在該晶圓中的應力係被減小。從第二次閃光所產生的熱壓彎也會在一個方向之中作用,該方向係相反於當該晶圓嘗試著朝向其扁平位置恢復時該晶圓所存在的恢復速度。據此,從第二次閃光所產 生的熱壓彎係傾向於壓制住來自於第一次閃光的殘餘震動。快速而連續發生之二個此種閃光加熱階段的結合係容許可以達到較高的尖峰溫度,同時減少在該晶圓之中的殘餘震動。交替地使用連續的照射也可以提供相似的優點。Advantageously, by virtue of the advantages of the findings of the inventor of the present invention, such a heat treatment method can be used to reduce thermal stress and suppress vibrations in the workpiece, depending on the speed of the surface heating stroke, the hot pressing of the workpiece The bend can weaken the temperature it adds itself. For example, in a special case where illumination during the first time is achieved by a heated flash for a duration of about 1 millisecond, a peak temperature of the illuminated surface is roughly associated with the flash Occurs at the end of (t=1ms). However, at this point in time, the wafer is only beginning to undergo hot bending, and therefore only reaches a relatively small percentage of its maximum hot bending amplitude. The amplitude of the maximum hot bend is not achieved until after about 4 milliseconds, at which point the wafer has exceeded its equilibrium shape. After a short time (approximately t = 6 ms), the wafer is still significantly bent, but will return to its flat position at a very large recovery rate. According to an embodiment of the foregoing concept of the present invention, the device side of the wafer is subjected to a second illumination flash, the timing of the illumination being arranged such that the hot press generated from the second illumination flash This occurs when the wafer has been hot rolled from the first flash and is recovering toward its flat position. Since the wafer has been hot-bent due to the first flash, the stress generated in the wafer by the hot press generated by the second flash is reduced. The hot bend resulting from the second flash also acts in one direction, which is opposite to the recovery speed of the wafer when the wafer attempts to recover toward its flat position. According to this, from the second flash The raw hot bending system tends to suppress the residual vibration from the first flash. The combination of two such flash heating stages that occur quickly and continuously allows for higher peak temperatures to be achieved while reducing residual vibrations in the wafer. Alternate use of continuous illumination can also provide similar advantages.

此種熱處理的方法也可以與本文所描述的支撐方法及系統結合在一起來使用,或者如果有需要時也可以分開來使用。This method of heat treatment can also be used in conjunction with the support methods and systems described herein, or can be used separately if desired.

根據本發明的另外一個概念,所提供的是一種用於支撐工件的裝置。該裝置包括有一個支撐系統,該系統係被建構成用來支撐工件時,容許該工件之以熱引動的運動。範例性支撐系統的許多個元件係被描述於以下本發明之示範性實施例的詳細說明之中。According to another aspect of the invention, there is provided an apparatus for supporting a workpiece. The apparatus includes a support system that is configured to allow for thermally induced motion of the workpiece when the workpiece is constructed to support the workpiece. Many of the elements of the exemplary support system are described in the following detailed description of exemplary embodiments of the invention.

根據本發明的另外一個概念,所提供的是一種用於支撐工件的裝置。該裝置係包括有用於支撐該工件的機構,以及用於在該工件正在被支撐時,容許該工件之以熱引動之運動的機構。According to another aspect of the invention, there is provided an apparatus for supporting a workpiece. The apparatus includes a mechanism for supporting the workpiece and a mechanism for permitting thermal motion of the workpiece while the workpiece is being supported.

根據本發明的另外一個概念,所提供的是一種電腦可讀取之媒體儲存指令編碼,其係用於指示一個處理器電路來控制一個工件支撐系統,用以在一個工件正在被該系統支撐時,容許該工件之以熱引動的運動。該指令編碼可以包括有用於引導該處理器電路的編碼,用以使得與該工件銜接之支撐系統之一個支撐構件的一個可以移動之銜接部位可以反應於該工件之以熱引動的運動而產生運動。In accordance with another aspect of the present invention, a computer readable media storage instruction code is provided for instructing a processor circuit to control a workpiece support system for use when a workpiece is being supported by the system. Allows the workpiece to be thermally actuated. The command code can include code for directing the processor circuit such that a movable engagement portion of a support member of the support system engaged with the workpiece can be moved in response to the thermally actuated motion of the workpiece .

根據本發明的另外一個概念,所提供的是一種體現於 至少一其中一個通信媒體或是一個載波之中的訊號,該訊號包括有用於指示一個處理器電路來控制一個工件支撐系統的編碼片段,用以在一個工件正在被該系統支撐時,容許該工件之以熱引動的運動。該編碼片段可以包括有用於引導該處理器電路的編碼片段,用以使得與該工件銜接之支撐系統之一個支撐構件的一個可以移動之銜接部位可以反應於該工件之以熱引動的運動而產生運動。According to another concept of the present invention, what is provided is a At least one of the communication media or a signal in a carrier, the signal including a code segment for indicating a processor circuit to control a workpiece support system for permitting the workpiece while it is being supported by the system The heat-induced movement. The code segment can include a coded segment for directing the processor circuit such that a movable engagement portion of a support member of the support system engaged with the workpiece can be generated in response to the thermally actuated motion of the workpiece motion.

根據本發明的另外一個概念,所提供的是一個包括有編碼機構的電腦程式,當該編碼機構藉著一個處理器電路的控制而被執行時係會控制一個工件支撐系統來實行本文所描述的方法。同樣地,根據本發明的另外一個概念,所提供的是一個位於一個帶有編碼之載體上的電腦程式,當該編碼被一個處理器電路所執行時係會控制該工件支撐系統來實行本文所描述的方法。According to another aspect of the present invention, there is provided a computer program including an encoding mechanism that, when executed by the control of a processor circuit, controls a workpiece support system to perform the methods described herein. method. Similarly, in accordance with another aspect of the present invention, a computer program is provided on a carrier with an encoding that controls the workpiece support system to perform the document when executed by a processor circuit. The method described.

在檢閱與隨附圖式結合在一起之本發明的特殊實施例之以下的說明之後,本發明的其他概念及特徵對於那些熟習該項技術的人士來說將會變得更加清楚。Other concepts and features of the present invention will become more apparent to those skilled in the art of the <RTIgt;

參照圖1至圖4,根據本發明一個第一實施例之一個用於支撐一個工件的裝置係整體地被顯示在圖1之中。在這個實施例之中,該裝置係包括有一個支撐系統20,該支撐系統係被建構成用以支撐一個工件24,同時容許該工件之以熱引動的運動。Referring to Figures 1 through 4, a device for supporting a workpiece in accordance with a first embodiment of the present invention is shown in its entirety in Figure 1. In this embodiment, the apparatus includes a support system 20 that is configured to support a workpiece 24 while permitting thermally induced motion of the workpiece.

在這個實施例之中,該支撐系統20包括有一個整體地以元件符號21表示的支撐裝置。更加特別的是,在這個實施例之中,該支撐裝置21包括有一個可以與該工件24相銜接的支撐構件22。又更加特別的是,在這個實施例之中,該支撐構件22具有一個顯示在圖3之中之可以移動的銜接部位52,該銜接部位52可以與該工件24相銜接並且可以移動,用以在支撐該工件時,容許該工件產生以熱引動的運動。In this embodiment, the support system 20 includes a support device, generally indicated by the reference numeral 21. More particularly, in this embodiment, the support device 21 includes a support member 22 that can engage the workpiece 24. Still more particularly, in this embodiment, the support member 22 has a movable engagement portion 52, shown in FIG. 3, which can be engaged with the workpiece 24 and movable for use. When the workpiece is supported, the workpiece is allowed to generate a motion that is thermally induced.

在這個實施例之中,該支撐構件22之可以移動的銜接部位52係包括有該支撐構件的一個尖端。在這個實施例之中,如將於下文中詳細描述的,該支撐構件22為剛性的,並且該可以移動的銜接部位52可以藉著可以樞轉地移動之支撐構件22的功效而被移動。然而,替代的方式是,可以移動的銜接部位52可以用其他的方式(例如,像是那些與本文所描述之進一步實施例相關而描述的方式)移動。In this embodiment, the movable engagement portion 52 of the support member 22 includes a tip end of the support member. In this embodiment, as will be described in detail below, the support member 22 is rigid and the movable engagement portion 52 can be moved by the effectiveness of the pivotally movable support member 22. Alternatively, however, the moveable engagement locations 52 can be moved in other ways (e.g., as described in relation to the further embodiments described herein).

在這個實施例之中,該工件24包括有一個半導體晶圓,並且可以移動的銜接部位52可以與該半導體晶圓銜接,用以在支撐該晶圓時,容許該晶圓產生以熱引動的運動。更加特別的是,在這個實施例之中,該半導體晶圓具有一個頂側或是裝置側邊26以及一個背側或是基材側邊28。In this embodiment, the workpiece 24 includes a semiconductor wafer, and the movable engagement portion 52 can be coupled to the semiconductor wafer for allowing the wafer to be thermally induced while supporting the wafer. motion. More particularly, in this embodiment, the semiconductor wafer has a top side or device side 26 and a back side or substrate side 28 .

在目前的實施例之中,該支撐系統20包括有複數個個別之支撐構件22的複數個可以移動的銜接部位52。更加 特別的是,在這個實施例之中,該工件24(亦即,該半導體晶圓)係藉著該支撐裝置21以及藉著例如是以元件參考符號32及34顯示之複數個相似的支撐裝置(未顯示於圖1之中)支撐在一個工件平面板件30之中。較佳的是,該等複數個可以移動的銜接部位包括有至少三個之個別的支撐構件之至少三個可以移動的銜接部位,用以提供工件的穩定支撐作用。甚至更佳的是,該等複數個銜接部位係包括有至少四個之個別的支撐構件之至少四個可以移動的銜接部位,使得即使其中一個支撐構件毀壞、不然就是無法適當地作用時也可以保持該工件的穩定支撐作用。In the present embodiment, the support system 20 includes a plurality of movable engagement locations 52 having a plurality of individual support members 22. more In particular, in this embodiment, the workpiece 24 (i.e., the semiconductor wafer) is supported by the support device 21 and by a plurality of similar support devices, such as by component reference numerals 32 and 34. (not shown in Figure 1) is supported in a workpiece planar panel 30. Preferably, the plurality of movable engagement locations comprise at least three movable engagement locations of at least three individual support members for providing stable support of the workpiece. Even more preferably, the plurality of engagement locations comprise at least four movable engagement locations of at least four individual support members such that even if one of the support members is destroyed, otherwise it may not function properly Maintain a stable support of the workpiece.

然而,在同時,雖然較多數目的支撐構件可以增加穩定性,將可以移動之銜接部位的總質量減小到最小程度係為所希求者。在這個方面,在目前的實施例之中(其中工件係包括有會承受使用一種高強度照射閃光之熱加工處理的半導體晶圓),該支撐系統係被設計成用以容許該晶圓可以自由地移動,並且因此減少在閃光期間的晶圓應力,同時在該閃光之後第二次地緩和震動。未了達到這個目的,所欲者為從在該晶圓上的支撐構件處將反作用力減小到最小的程度。在這個實施例之中,這個目的係藉著使用具有被最小化質量的可移動銜接部位而達成,而在其他的實施例之中,反作用力可以用其他的方式被最小化,例如,像是藉著主動地移動該等支撐構件。At the same time, however, while a greater number of support members may increase stability, it is desirable to minimize the total mass of the movable joint portion. In this respect, in the present embodiment (where the workpiece comprises a semiconductor wafer that would withstand the thermal processing using a high intensity illumination flash), the support system is designed to allow the wafer to be free. The ground moves, and thus reduces the wafer stress during the flash, while at the same time mitigating the shock for the second time after the flash. To achieve this goal, the desired one is to minimize the reaction force from the support member on the wafer. In this embodiment, this object is achieved by using a movable engagement site having a minimized mass, while in other embodiments, the reaction force can be minimized in other ways, such as, for example, By actively moving the support members.

在這個實施例之中,每個支撐構件22都包括有一個支撐栓釘。因此,在這個實施例之中,該等複數個支撐構件 22的複數個可移動銜接部位52係包含有複數個個別之支撐栓釘的複數個尖端。In this embodiment, each support member 22 includes a support stud. Thus, in this embodiment, the plurality of support members The plurality of movable articulating portions 52 of 22 are comprised of a plurality of tips of a plurality of individual support pegs.

在這個實施例之中,該等複數個支撐栓釘包括有對於至少某些發光波長為透明的材料,藉著該材料,該工件24係能夠被輻照加熱。因此,在這個實施例之中,該等複數個支撐栓釘係包括有光學透明的材料。更加特別的是,在這個實施例之中,該等支撐栓釘係包括有石英支撐栓釘。在這個方面,對於目前實施例(其中,該工件是一個要藉著照射而被加熱的半導體晶圓)的支撐栓釘來說,由於石英的低熱傳導性、其透明度、其非污染的本質、其良好的熱穩定性以及其剛性,石英是一種尤其適合的材料。替代的是,對於相似的應用來說,其他的材料也有可能是適合的,並且該等支撐栓釘可以替代地包括有例如藍寶石、亞硝酸矽、碳化矽。替代的方式是,根據在手邊之應用的需求,可以用其他材料來替代。In this embodiment, the plurality of support pegs comprise a material that is transparent to at least some of the illumination wavelengths by which the workpiece 24 is capable of being heated by irradiation. Thus, in this embodiment, the plurality of support studs comprise an optically clear material. More particularly, in this embodiment, the support studs include quartz support pegs. In this respect, for the support pegs of the current embodiment in which the workpiece is a semiconductor wafer to be heated by irradiation, due to the low thermal conductivity of quartz, its transparency, its non-polluting nature, Its good thermal stability and its rigidity, quartz is a particularly suitable material. Alternatively, other materials may be suitable for similar applications, and the support studs may alternatively include, for example, sapphire, yttrium nitrite, tantalum carbide. Alternatively, other materials can be substituted depending on the needs of the application at hand.

在這個實施例之中,支撐構件22的每個可移動銜接部位52係可以彈性地與該工件24相銜接。 了達成這個目的,在這個實施例之中,該支撐系統20更包括有複數個處於與複數個支撐構件22相連通的作用力應用器,以將作用力運用到支撐構件,用以在工件之以熱引動的運動期間致使每個銜接部位52係傾向於與該工件24相接觸。更加特別的是,如將會更加詳細地在下文中討論的,每個作用力應用器都包括有一個被連接到各自之一個支撐構件22的彈簧48。In this embodiment, each of the movable engagement portions 52 of the support member 22 is resiliently engageable with the workpiece 24. To achieve this goal, in this embodiment, the support system 20 further includes a plurality of force application devices in communication with the plurality of support members 22 to apply the force to the support members for use in the workpiece. Each of the engagement locations 52 tends to contact the workpiece 24 during the thermally actuated motion. More specifically, as will be discussed in greater detail below, each of the force applications includes a spring 48 that is coupled to a respective one of the support members 22.

了達到這個目的,在這個實施例之中,該工件平面板件30係被連接到該支撐裝置21的一個支撐構件殼體36,而支撐構件22則樞轉地被連接到該支撐構件殼體36。該工件平面板件30也被連接到一個彈簧組件38,該彈航組件係包括有該彈簧48,而該支撐構件22係被連接到該彈簧。To achieve this, in this embodiment, the workpiece planar panel 30 is coupled to a support member housing 36 of the support device 21, and the support member 22 is pivotally coupled to the support member housing. 36. The workpiece planar panel 30 is also coupled to a spring assembly 38 that includes the spring 48 and the support member 22 is coupled to the spring.

參照圖3,支撐裝置21係更加詳細地被顯示出來。在這個實施例之中,支撐構件22係樞轉地被連接到支撐構件殼體36。 了要達到這個目的,一個樞轉栓釘40(其在這個實施例之中係包括有一個不銹鋼合板栓釘)係被連接到該支撐構件殼體36的相對內部壁部,並且係延伸通過一個形成在該支撐構件22之一個端部之中的洞孔中。Referring to Figure 3, the support device 21 is shown in more detail. In this embodiment, the support member 22 is pivotally coupled to the support member housing 36. To achieve this, a pivot stud 40 (which in this embodiment includes a stainless steel peg stud) is attached to the opposite inner wall of the support member housing 36 and extends through a A hole is formed in one of the ends of the support member 22.

在這個實施例之中,該彈簧組件38包括有一個彈簧滾筒42,在這個實施例之中,該彈簧滾筒包括有鐵氟龍。替代的方式是,例如像是不銹鋼的其他材料也可以取代。該彈簧滾筒42係被包覆在一個彈簧滾筒殼體44之內,並且係被一個彈簧支架托座46裝設到該工件平面板件30。彈簧滾筒42係被用來裝設該彈簧48,而在這個實施例之中,彈簧滾筒42包括有一個固定作用力的彈簧。In this embodiment, the spring assembly 38 includes a spring roller 42 which, in this embodiment, includes Teflon. Alternatively, other materials such as stainless steel may be substituted. The spring roller 42 is wrapped within a spring roller housing 44 and is attached to the workpiece planar plate member 30 by a spring holder bracket 46. A spring roller 42 is used to mount the spring 48, and in this embodiment, the spring roller 42 includes a spring that has a fixed force.

在這個實施例之中,該作用力應用器、或是更加特別的,被連接到該支撐構件22的彈簧48係作用如同一個力矩應用器。 了要達成這個目的,在這個實施例之中,彈簧48係被連接到一個環節50,該環節50在這個實施例之中係以不銹鋼組成。該環節50係在一個支撐構件上的位 置處樞轉地被連接到該支撐構件22,其中,該支撐構件係插置於該支撐構件22之一個樞轉點(位於該樞轉栓釘40的位置處)與支撐構件22接觸到工件24處的銜接部位52之間。因此,該力矩應用器(或更特別的是該彈簧48)係將一個向上作用力運用在該環節50被連接到該支撐構件22的位置處。由彈簧48提供的固定作用力(以及由相似於支撐裝置21之其他支撐裝置的恆力彈簧提供的作用力)係被選擇,使得藉著支撐構件被應用到工件之累積的固定向上作用力可以平衡在該工件上之重力的向下作用力。In this embodiment, the force applicator, or more particularly the spring 48 coupled to the support member 22, functions as a torque applicator. To accomplish this, in this embodiment, the spring 48 is coupled to a link 50 which in this embodiment is comprised of stainless steel. The link 50 is on a support member The support member is pivotally coupled to the support member 22, wherein the support member is inserted into a pivot point of the support member 22 (at the position of the pivot stud 40) to contact the support member 22 to the workpiece Between the junctions 52 at 24. Thus, the torque applicator (or more particularly the spring 48) applies an upward force at the location where the link 50 is coupled to the support member 22. The fixed force provided by the spring 48 (and the force provided by a constant force spring similar to the other support means of the support means 21) is selected such that the cumulative fixed upward force applied to the workpiece by the support member can be A downward force that balances the gravity on the workpiece.

在這個實施例之中,支撐構件22的可以移動的銜接部位52(其在在這個實施例之中係包括有該等支撐栓釘的尖端)會接觸到工件24的下方側邊或是基材側邊28,用以支撐該工件。更加特別的是,在這個實施例之中,該等支撐栓釘的尖端係可以與工件的一個外部周圍區域相銜接,或是更加特別的是會與沒有被用來製造半導體晶片的一個外部“排除區域”或是廢棄區域相接觸。在這個實施例之中,該工件24是一個半徑為150 mm的半導體矽晶圓,並且該外部排除區域係從該工件的外部邊緣處徑向而向內地延伸了3 mm(也就是,r=147 mm到r=150 mm)。因此,支撐構件22之可以移動的銜接部位52與該工件之基材側邊28之間的物理接觸程度可能會導致潛在的有害效果,像是在熱處理期間之高度局部化的溫度梯度,此種局部化的溫度梯度係不太可能會傷害到形成在該裝置側邊26上的裝置。In this embodiment, the movable engagement portion 52 of the support member 22, which in this embodiment includes the tips of the support pegs, contacts the underside of the workpiece 24 or the substrate. Side 28 is for supporting the workpiece. More particularly, in this embodiment, the tips of the support studs can be engaged with an outer peripheral region of the workpiece, or more particularly with an exterior that is not used to fabricate a semiconductor wafer. Exclusion area" or contact with abandoned area. In this embodiment, the workpiece 24 is a semiconductor germanium wafer having a radius of 150 mm and the outer exclusion region extends radially and inwardly from the outer edge of the workpiece by 3 mm (i.e., r = 147 mm to r = 150 mm). Thus, the degree of physical contact between the movable engagement portion 52 of the support member 22 and the substrate side 28 of the workpiece may result in potentially deleterious effects, such as highly localized temperature gradients during heat treatment. A localized temperature gradient is less likely to damage the device formed on the side 26 of the device.

參照圖4,在這個實施例之中,支撐裝置21以及其他相似的支撐裝置(像是示範性的支撐裝置32及34)係被用來在支撐在位於一個熱處理容室60之內的工件24。更加特別的是,在這個實施例之中,該容室60係相似於一個被揭示於先前所提到之美國公告第US2002/0102098號專利申請案之中的熱處理容室,其係用於該工件24之裝置側邊26的熱退火加工。在這個實施例之中,該工件平面板件30(包括該支撐裝置21以及相似的支撐裝置32及34)係被裝設在該容室60的一個中間區域之中。Referring to Figure 4, in this embodiment, support means 21 and other similar support means (such as exemplary support means 32 and 34) are used to support workpiece 24 located within a heat treatment chamber 60. . More particularly, in this embodiment, the chamber 60 is similar to a heat treatment chamber disclosed in the aforementioned U.S. Patent Application Publication No. US2002/0102098, which is incorporated herein by reference. Thermal annealing of the device side 26 of the workpiece 24. In this embodiment, the workpiece planar panel 30 (including the support means 21 and similar support means 32 and 34) is mounted in an intermediate region of the chamber 60.

在這個實施例之中,該熱處理容室60係包括有一個加熱系統,該加熱系統係被建構成用以相對於大部份的工件來加熱該工件24的一個表面,用以產生該工件之以熱引動的運動。更加特別的是,在這個實施例之中,該加熱系統包括有一個照射系統,該照射系統係被建構成用以輻照工件的表面。在這個實施例之中,該照射系統包括有一個預先加熱裝置62以及一個加熱裝置64。In this embodiment, the heat treatment chamber 60 includes a heating system configured to heat a surface of the workpiece 24 relative to a majority of the workpiece for producing the workpiece. Heat-induced movement. More particularly, in this embodiment, the heating system includes an illumination system that is constructed to surface the workpiece. In this embodiment, the illumination system includes a preheating device 62 and a heating device 64.

該預先加熱裝置62(其係包括有例如是一個弧光燈或是一個陣列的弧光燈)係經由一個水冷式石英窗口63照射工件,用以在一個低於通過該工件之熱傳導時間的速率將該工件預先加熱到一個中間溫度,而使得整個工件是相當均勻地被加熱該中間溫度。舉例來說,該預先加熱裝置可以在一個250℃/秒到400℃/秒的速率將該工件預先加熱到一個600℃到1250℃的中間溫度(這些速率及溫度僅是說明性的例子)。The preheating device 62 (which includes, for example, an arc lamp or an array of arc lamps) illuminates the workpiece via a water-cooled quartz window 63 for use at a rate lower than the heat transfer time through the workpiece The workpiece is preheated to an intermediate temperature such that the entire workpiece is heated fairly uniformly to the intermediate temperature. For example, the preheating device can preheat the workpiece to an intermediate temperature of 600 ° C to 1250 ° C at a rate of 250 ° C / sec to 400 ° C / sec (these rates and temperatures are merely illustrative examples).

以下的預先加熱階段、照射裝置、或是更加特別地是該加熱裝置64係被建構成用以照射表面(在這個情況中為裝置側邊26)一段較短於該工件24之一個熱傳導時間的時間,用以將該表面加熱到一個大於大部份工件的溫度。換句話說,該加熱裝置64係被用來以一個較一個通過該晶圓的熱傳導時間快很多的速率將該工件的裝置側邊26快速地加熱到一個實質上較高於退火的溫度,使得只有該工件的頂部側邊的表面區域會被加熱到最後的退火溫度,而大部份的工件係保持為接近相對地較冷的中間溫度。該最後的退火溫度可以包括有一個較高溫度,其係在1050℃到一個接近矽的熔點溫度(例如,像是1410℃)之溫度範圍之中。The following preheating stage, illumination means, or more particularly the heating means 64 is constructed to illuminate the surface (in this case the side 26 of the apparatus) for a period shorter than one of the heat transfer times of the workpiece 24. Time to heat the surface to a temperature greater than most of the workpiece. In other words, the heating device 64 is used to rapidly heat the device side 26 of the workpiece to a temperature substantially higher than the annealing rate at a much faster rate of heat transfer through the wafer. Only the surface area of the top side of the workpiece will be heated to the final annealing temperature, while the majority of the workpiece will remain close to the relatively cold intermediate temperature. The final annealing temperature can include a higher temperature which is in the range of 1050 ° C to a temperature near the melting point of the crucible (e.g., 1410 ° C).

了達到這個目的,在這個實施例之中,該照射系統(或更加特別的是其加熱裝置加熱裝置64)係包括有一個閃光燈,該閃光燈可以操作以藉著一個高動力的閃光經由一個第二水冷式石英窗口65來照射裝置側邊26,其中,該高動力閃光具有一個相當短的持續時間(其較佳的為大約例如是1毫秒或更少的程度),用以在一個超過105 ℃/sec的速率加熱該裝置側邊26。更加特別的是,在這個實施例之中,該閃光燈包括有一個液體冷卻式的弧光燈。又更加特別的是,該閃光等包括有一個雙重水壁的弧光燈,其係相似於被揭示在授與Parfeniuk等人之共同擁有的美國第6,621,199號專利之中的弧光燈,如同在前文所提到之美國第2002/0102098號專利申請案所描述的,該弧光 燈係被建構成當作一個閃光燈。因為由附在裝置側邊26上的閃光燈產生之一毫秒的閃光係發生得比該工件的熱傳導時間(一般是10到15毫秒)要更快地多,該裝置側邊26會被加熱到最後的退火溫度,而大部份的工件則實質上仍保持在中間溫度。較冷的大部份晶圓接著係作用如同一個散熱器,用以促進該裝置側邊之表面的快速冷卻。替代的方式是,可以用其他類型的加熱裝置(例如,像是一陣列的閃光燈)來替代。To achieve this, in this embodiment, the illumination system (or more particularly its heating device heating device 64) includes a flash that is operable to pass a second through a high powered flash A water-cooled quartz window 65 illuminates the side 26 of the device, wherein the high-powered flash has a relatively short duration (which is preferably about 1 millisecond or less, for example) for more than 10 5 The device side 26 is heated at a rate of ° C/sec. More particularly, in this embodiment, the flash lamp includes a liquid cooled arc lamp. More particularly, the flash or the like includes an arc lamp having a double water wall, which is similar to the arc lamp disclosed in U.S. Patent No. 6,621,199, the entire disclosure of which is assigned to The arc lamp is constructed as a flash lamp as described in U.S. Patent Application Serial No. 2002/0102098. Since one millisecond of flash produced by the flash attached to the side 26 of the device occurs more quickly than the heat transfer time of the workpiece (typically 10 to 15 milliseconds), the side 26 of the device is heated to the end. The annealing temperature, while most of the workpiece remains substantially at the intermediate temperature. Most of the cooler wafers act as a heat sink to promote rapid cooling of the surface of the device. Alternatively, other types of heating devices (e.g., like an array of flash lamps) can be used instead.

根據閃光短暫的持續時間,以及介於大部份工件的中間溫度與只有該裝置側邊26被加熱到的最後退火溫度之間的差異,如同在前文中所描述的,該工件24可能會經歷到快速的熱壓彎。有利的是,在目前的實施例之中,該支撐系統20係被建構成可以在容許工件產生熱壓彎時,支撐該工件24,或是更加特別的是,用以自動地容許支撐栓釘的尖端反應於該工件之外部周圍區域之以熱引動的運動而產生運動。因此,與傳統的系統(其中,該晶圓之邊緣的向下熱壓彎運動可能傾向於破壞該等支撐栓釘或是將晶圓從該等支撐栓釘處垂直而向上地發射出去)相反的是,在目前的實施例之中,如果該工件24反應於由該加熱裝置64所產生的一個加熱閃光而發生熱壓彎的話,藉著支撐構件22被連接到其上之彈簧48的功效,該等支撐構件22之可以移動的銜接部位52係可以相應於此種以熱引動的運動而自動移動。因此,如果快速的熱壓彎發生的話,工件的外部邊緣以及該等支撐構件(亦即,支撐裝置21 的支撐構件22以及相似之支撐裝置的支撐構件)係會被容許進行向下的移動,藉以防止該等支撐構件由於該等支撐構件與該工件之間之降低的反作用力而破壞,並且也可以防止工件將其本身向上方發射出去。在後者的情況中,可以移動之銜接部位52的彈性向下可移動性係容許該工件的外部區域的向下運動,同時將工件的質量中心保持在一個所希望的範圍之內,或是更加特別的是,同時將該工件的質量中心的運動減少到最小的程度。(替代的是,其他範圍之質量中心的運動對於某些應用來說是可以容許的或是所希求的。)除此之外,因為工件一開始變形成一種圓頂的形狀係將在工件之中的應力減小到最小的程度,用以容許此種以熱引動的運動以及變形之該等銜接部位的可移動性係作用以將工件之中的應力減小到最小的程度,而在同時於該以熱引動的運動期間支撐該工件。如同先前在本文中注意的,該熱壓彎係傾向於夠快速地發生,而使得該工件會超出其平衡的形狀,並且因而係傾向於在該平衡形狀附近震動或是震盪。因此,當工件的外部邊緣開始向上移回並且工件的質量中心開始向下方移回時,由固定作用力的彈簧48應用到支撐構件22的向上作用力會將該支撐構件向上拉回,而容易於保持與該工件的外部邊緣的接觸。當該工件繼續震動時,工件的外部邊緣係被容許在傾向於保持與支撐構件22(以及相似的支撐構件)之接觸時,可以向上以及向下移動,直到震動平息為止。因此,該等支撐構件22之彈簧驅動的向上及向下運動係容許工件 的外部邊緣進行向上及向下的運動,同時將該工件之質量中心的運動減少到最小的程度以及將工件之中的應力減少到最小的程度。Depending on the short duration of the flash, and the difference between the intermediate temperature of most of the workpiece and the final annealing temperature to which only the side 26 of the device is heated, as described above, the workpiece 24 may experience To a quick hot bend. Advantageously, in the present embodiment, the support system 20 is constructed to support the workpiece 24 when the workpiece is allowed to undergo hot bending, or, more particularly, to automatically allow the support stud The tip of the reaction reacts with the heat-induced motion of the outer peripheral region of the workpiece to produce motion. Thus, contrary to conventional systems in which the downward hot-bending motion of the edge of the wafer may tend to damage the support studs or to lift the wafer vertically upwards from the support studs, In the present embodiment, the effect of the spring 48 to which the support member 22 is attached is effected if the workpiece 24 reacts with a heated flash generated by the heating device 64. The movable engagement portion 52 of the support members 22 can be automatically moved in response to such thermally actuated motion. Therefore, if a rapid hot bending occurs, the outer edge of the workpiece and the supporting members (ie, the support device 21) Support members 22 and support members of similar support means) are allowed to move downwards, thereby preventing the support members from being broken due to the reduced reaction between the support members and the workpiece, and also Prevent the workpiece from launching itself upwards. In the latter case, the elastic downward mobility of the movable engagement portion 52 allows for downward movement of the outer region of the workpiece while maintaining the center of mass of the workpiece within a desired range, or more In particular, the movement of the center of mass of the workpiece is simultaneously minimized. (Alternatively, the motion of other ranges of mass centers is acceptable or desirable for some applications.) In addition, because the workpiece initially becomes a shape of a dome, it will be in the workpiece. The stress in the reduction is minimized to allow such heat-actuated motion and the mobility of the joints to deform to minimize the stress in the workpiece while at the same time The workpiece is supported during the thermally actuated motion. As previously noted herein, the hot press bending tends to occur quickly enough that the workpiece will exceed its balanced shape and thus tend to vibrate or oscillate near the equilibrium shape. Therefore, when the outer edge of the workpiece begins to move back upward and the center of mass of the workpiece begins to move back downward, the upward force applied by the fixed force spring 48 to the support member 22 pulls the support member back up, which is easy To maintain contact with the outer edge of the workpiece. As the workpiece continues to vibrate, the outer edge of the workpiece is allowed to move up and down as it tends to remain in contact with the support member 22 (and a similar support member) until the shock subsides. Therefore, the spring-driven upward and downward movement of the support members 22 allows the workpiece The outer edge performs upward and downward movement while minimizing the motion of the center of mass of the workpiece and minimizing stress in the workpiece.

參照圖5,根據本發明之一個第二實施例的一個支撐裝置係整體地以元件參考符號80表示。在這個實施例之中,該支撐裝置80包括有一個支撐構件82,其係相似於本說明書先前所討論的支撐構件。在這個實施例之中,該支撐構件82係被裝設到一個位在一個樞轉點84處的支撐構件殼體(未顯示於圖中),用於繞著該樞轉點的樞轉運動。如同先前的實施例,該支撐裝置80包括有一個與支撐構件82相連通而用以將一個作用力應用到該支撐構件的作用力應用器(或是更加特別的是包括有一個包含有一個彈簧86的力矩應用器),用以導致一個銜接部位88可以容易於在其以熱引動的運動期間保持與該工件相接觸。然而,在目前的實施例之中,力矩應用器係被建構成用以在支撐構件82上的一個位置處應用一個向下作用力,使得該支撐構件82的樞轉點84會被插置在該位置與銜接部位88之間。更加特別的是,在這個實施例之中,樞轉點84係被插置在一個其中支撐構件82被連接到彈簧86的位置點與一個該支撐構件的銜接部位88與工件24之間接觸點之間。因此,與圖3所示的結構所不同的是,在目前的實施例之中,彈簧86(其在這個實施例中包括有一個固定作用力的彈簧)係在該支撐構件82的一個端部上應用了一個向下作用力,以便於提供一個力矩,該力矩係抵消由 工件24的重量在該支撐構件82的銜接部位88上所應用的力矩。Referring to Figure 5, a support device in accordance with a second embodiment of the present invention is generally indicated by reference numeral 80. In this embodiment, the support device 80 includes a support member 82 that is similar to the support members previously discussed herein. In this embodiment, the support member 82 is mounted to a support member housing (not shown) at a pivot point 84 for pivotal movement about the pivot point. . As with the previous embodiment, the support device 80 includes a force applicator in communication with the support member 82 for applying a force to the support member (or more particularly including a spring included) The torque applicator of 86) is used to cause an engagement portion 88 to be easily held in contact with the workpiece during its thermally actuated motion. However, in the present embodiment, the torque applicator is constructed to apply a downward force at a location on the support member 82 such that the pivot point 84 of the support member 82 is inserted This position is between the engagement point 88. More specifically, in this embodiment, the pivot point 84 is interposed between a point in which the support member 82 is coupled to the spring 86 and a point of contact between the engagement portion 88 of the support member and the workpiece 24. between. Therefore, unlike the structure shown in Fig. 3, in the present embodiment, the spring 86 (which in this embodiment includes a spring having a fixed force) is attached to one end of the support member 82. Applying a downward force to provide a moment that is offset by The moment at which the weight of the workpiece 24 is applied to the engagement portion 88 of the support member 82.

參照圖6,一個根據本發明之第三實施例之用於支撐工件的系統係整體地以元件參考符號100表示。該系統100包括有一個支撐裝置102,其係被建構成用以支撐工件24,同時容許該工件發生熱壓彎或是其他以熱引動的運動。Referring to Figure 6, a system for supporting a workpiece in accordance with a third embodiment of the present invention is generally indicated by reference numeral 100. The system 100 includes a support device 102 that is configured to support the workpiece 24 while permitting hot bending or other thermally induced motion of the workpiece.

在這個實施例之中,該支撐裝置102包括有一個具有一個可以與該工件24銜接的可以移動之銜接部位的支撐構件104。在目前的實施例之中,該可以移動的銜接部位係包括有該支撐構件104的一個尖端。如在下文描述的,該支撐構件104是剛性的,並且該可以移動的銜接部位可以藉著支撐構件104當作一個可以被移動之整體的功效而可以移動。In this embodiment, the support device 102 includes a support member 104 having a movable engagement portion engageable with the workpiece 24. In the current embodiment, the movable engagement portion includes a tip end of the support member 104. As described below, the support member 104 is rigid and the movable engagement portion can be moved by the support member 104 as a function that can be moved as a whole.

在目前的實施例之中,支撐構件104可以與位於工件之基材側邊28之外部周圍處的排除區域相銜接。因為相似於與本發明第一實施例有關的那些討論相同的原因,該支撐構件104包括有一個石英栓釘。替代的方式是,可以用其他的材料來替代。In the present embodiment, the support member 104 can interface with a exclusion zone located around the exterior of the substrate side 28 of the workpiece. The support member 104 includes a quartz stud because it is similar to those discussed in connection with the first embodiment of the present invention. Alternatively, other materials can be substituted.

在這個實施例之中,該系統100更包括有複數個相似於該支撐構件104的支撐構件,例如,像是支撐構件108。較佳的是,該系統100包括有至少三個此種支撐構件,用於穩定地支撐工件。理想的方式是,提供有四個或更多個支撐構件,使得即使其中一個支撐構件破壞,不然 就是無法適當地作用時仍然能夠保持該工件的穩定支撐。In this embodiment, the system 100 further includes a plurality of support members similar to the support member 104, such as, for example, the support member 108. Preferably, the system 100 includes at least three such support members for stably supporting the workpiece. Ideally, four or more support members are provided so that even if one of the support members is broken, otherwise It is still able to maintain a stable support of the workpiece when it is not functioning properly.

在這個實施例之中,該系統100包括有一個支撐構件運動系統,其係被建構成用以反應於該工件24之以熱引動的運動來移動複數個支撐構件104之可以移動的銜接部位。更加特別的是,在這個實施例(其中該等支撐構件104為剛性的)之中,該系統係被建構成藉著移動支撐構件104本身來移動該等銜接部位。又更加特別的是,在這個實施例之中,該支撐構件運動系統包括有用於每個支撐構件104的一個個別的致動器106,其係被連接到該支撐構件104,用於控制該支撐構件104的運動。In this embodiment, the system 100 includes a support member motion system that is configured to move the movable engagement portion of the plurality of support members 104 in response to the thermally actuated motion of the workpiece 24. More particularly, in this embodiment, wherein the support members 104 are rigid, the system is constructed to move the engagement locations by moving the support members 104 themselves. Still more particularly, in this embodiment, the support member motion system includes an individual actuator 106 for each support member 104 that is coupled to the support member 104 for controlling the support Movement of member 104.

因此,在這個實施例之中,該系統100包括有複數個相似於致動器106的致動器(未顯示於圖中),用於致動各個支撐構件。藉著一個如在圖6之中以元件參考符號表示110的裝設托架,每個致動器106係被裝設到工件平面表面30的一個上方表面。支撐構件104係延伸通過一個洞孔112而進入致動器106,該洞孔係被界定成穿過該工件平面表面30。Thus, in this embodiment, the system 100 includes a plurality of actuators (not shown) similar to the actuators 106 for actuating the various support members. Each of the actuators 106 is attached to an upper surface of the workpiece plane surface 30 by means of a mounting bracket, designated by the reference numeral 110 in FIG. The support member 104 extends through a bore 112 into the actuator 106, which is defined to pass through the workpiece planar surface 30.

參照圖6及圖7,一個示範性的致動器106係被更加詳細地顯示於圖7之中。在這個實施例之中,致動器106係包括有一個聲音線圈致動器,其係被連接到該支撐構建該支撐構件104。更加特別的是,在這個實施例之中,致動器106包括有一個被裝設到該托架110的固定構件120、以及一個相對於該固定構件而移動的移動構件122。該固定構件120係會產生一個通過該移動構件122的磁場。 為了達到這個目的,在目前的實施例之中,該固定構件120包括有一個永久磁鐵124及一個強力磁性構件126。在這個實施例之中,該移動構件122包括有一個電纜線圈128。該致動器106更包括有一個動力供應單元130,其係可以操作以將一個電壓應用在該電纜線圈128的相對端部之間,藉以在該線圈中產生一個電流。將可以察知的是,在該移動構件122之線圈中產生該電流的結果是,由該固定構件120所產生的磁場會於一個根據該電流之方向的方向中在該移動構件122上施加一個作用力。被施加之作用力的大小係直接與在線圈128中的電流大小成正比。Referring to Figures 6 and 7, an exemplary actuator 106 is shown in more detail in Figure 7. In this embodiment, the actuator 106 includes a voice coil actuator that is coupled to the support to construct the support member 104. More specifically, in this embodiment, the actuator 106 includes a stationary member 120 that is mounted to the bracket 110, and a moving member 122 that moves relative to the stationary member. The stationary member 120 produces a magnetic field that passes through the moving member 122. To achieve this, in the present embodiment, the fixing member 120 includes a permanent magnet 124 and a strong magnetic member 126. In this embodiment, the moving member 122 includes a cable coil 128. The actuator 106 further includes a power supply unit 130 operable to apply a voltage between opposite ends of the cable coil 128 to generate a current in the coil. It will be appreciated that as a result of the current being generated in the coil of the moving member 122, the magnetic field generated by the stationary member 120 exerts an effect on the moving member 122 in a direction according to the direction of the current. force. The magnitude of the applied force is directly proportional to the magnitude of the current in coil 128.

在目前的實施例之中,致動器106的移動構件122係被連接到支撐構件104。因此,由該支撐構件104施加在該工件24之基材側邊28外部邊緣上之向上支撐作用力的大小可以藉著控制該控制器106之線圈128中的電流而被控制住。In the current embodiment, the moving member 122 of the actuator 106 is coupled to the support member 104. Thus, the amount of upward support force exerted by the support member 104 on the outer edge of the substrate side 28 of the workpiece 24 can be controlled by controlling the current in the coil 128 of the controller 106.

在這個實施例之中,支撐構件運動系統包括有至少一個控制器,其係被建構成用來將一個電流應用到每個致動器來移動每個支撐構件,藉以移動其可以移動的銜接部位。更加特別的是,在這個實施例之中,該至少一個控制器係包括有複數個控制器,每個控制器係處於與複數個致動器106之各自的其中之一相連通。又更加特別的是,在這個實施例之中,每個控制器係包括有一個組合的偵測器/控制器132,其係作用如同一個用於偵測出該工件之以熱引動之運動的偵測器。在這個實施例之中,該偵測器/控 制器132係處於與致動器106之動力供應單元130及線圈128的連通之中。因此,在這個實施例之中,偵測器/控制器係會藉著偵測出一個在該線圈128中的一個電流來偵測出該工件之以熱引動的運動,並且相反的,該控制器係藉著控制該動力供應單元130來移動該支撐構件104,用以將一個電流應用到該線圈128。In this embodiment, the support member motion system includes at least one controller configured to apply a current to each actuator to move each of the support members to move the movable engagement portion thereof. . More particularly, in this embodiment, the at least one controller includes a plurality of controllers, each controller being in communication with one of a respective one of the plurality of actuators 106. Still more particularly, in this embodiment, each controller includes a combined detector/controller 132 that functions as a thermally actuated motion for detecting the workpiece. Detector. In this embodiment, the detector/control The controller 132 is in communication with the power supply unit 130 and the coil 128 of the actuator 106. Thus, in this embodiment, the detector/controller detects the thermally actuated motion of the workpiece by detecting a current in the coil 128 and, conversely, the control The support member 104 is moved by controlling the power supply unit 130 to apply a current to the coil 128.

在目前的實施例之中,每個偵測器/控制器132都包括有一個處理器單元。更加特別的是,在這個實施例之中,每個偵測器/控制器都包括有一個數位訊號處理器(DSP)。替代地,該偵測器/控制器132可以包括有一個微控制器或是一個相似的裝置(例如,帶有或不帶有一個中央處理單元(CPU))。替代地,可以用其他類型的偵測器或控制器來替代,並且偵測及控制功能可以藉著相同或是不同的元件來進行。更加概括地說,在這個說明書之中(包括申請專利範圍),用詞“控制器”、“偵測器”及“處理器電路”是要用來廣泛地涵蓋任何類型之能夠進行本文所描述之功能或是同等功能的裝置或是組合裝置,包括(非限制性的)例如是其他類型的微處理器、微控制器、其他積體電路、其他類型的電路或組合電路、邏輯閘或是行列閘、或是任何種類的可程式裝置,其係例如是單獨地、或是與其他座落在相同位置處的此等裝置或是彼此距離圓遠地彼此組合在一起。額外類型的控制器、偵測器以及微處理器電路對於一般熟習該項技藝的人士在檢閱笨說明書之後將會變得明白,並且任何此等其他類型的控制 器、偵測器及微處理器電路的替代物可以被視為並未背離如同由隨附之申請專利範圍所界定之本發明的範疇。In the current embodiment, each detector/controller 132 includes a processor unit. More specifically, in this embodiment, each detector/controller includes a digital signal processor (DSP). Alternatively, the detector/controller 132 can include a microcontroller or a similar device (e.g., with or without a central processing unit (CPU)). Alternatively, other types of detectors or controllers can be used instead, and the detection and control functions can be performed by the same or different components. More generally, in this specification (including the scope of patent application), the words "controller", "detector" and "processor circuit" are used to cover a broad range of any type that can be described herein. Functional or equivalent device or combination, including (but not limited to) other types of microprocessors, microcontrollers, other integrated circuits, other types of circuits or combination circuits, logic gates, or Row gates, or any kind of programmable device, for example, are individually or in combination with other devices seated at the same location or are remotely combined with one another. Additional types of controllers, detectors, and microprocessor circuits will become apparent to those of ordinary skill in the art after reviewing stupid specifications, and any such other types of controls The singularity of the invention, the detector and the microprocessor circuit can be considered to be without departing from the scope of the invention as defined by the appended claims.

在目前的實施例之中,偵測器/控制器132係包括有一個程式記憶體134,其係作用如同一個用於儲存用於指示該偵測器/控制器132之指令編碼的電腦可讀取媒體,用於進行各種本文所描述的功能。將可以察知的是,該程式記憶體134僅是此種電腦可讀取媒體的一個例子。替代地,此等指令編碼可以被提供在一個不同的媒體上,像是一個光碟、一個軟磁片、一個硬碟驅動器、一個唯讀記憶體、或是一個快閃記憶體(僅以這些為例)。替代的方式是,在不仰賴本地記憶體來提供此等電腦數據訊號形式之指令編碼的情況下,此等指令編碼可以如同被嵌入於載波或是被嵌入於一個通訊或傳輸媒體(像是一個區域網路或是一個廣域網路(例如,像是網際網路))的訊號編碼區段地被提供,並且可以從遠端裝置被接收。In the present embodiment, the detector/controller 132 includes a program memory 134 that functions as a computer readable medium for storing instruction codes for the detector/controller 132. Take media for a variety of functions described in this article. It will be appreciated that the program memory 134 is only one example of such a computer readable medium. Alternatively, the instruction codes can be provided on a different medium, such as a compact disc, a soft magnetic disk, a hard disk drive, a read-only memory, or a flash memory (only these are examples). ). Alternatively, in the case of relying on local memory to provide instruction code in the form of such computer data signals, such instruction codes may be embedded in a carrier or embedded in a communication or transmission medium (like a A signal code segment of a regional network or a wide area network (e.g., like the Internet) is provided and can be received from a remote device.

參照圖4、圖6及圖7,複數個相似於圖6所示之支撐裝置的支撐裝置可以替代圖4之中所示之位於該熱處理容室60之內的支撐裝置21、32及34。一般來說,在這個實施例之中,支撐構件運動系統係被建構成用來移動該等支撐構件104的銜接部位,用以將被應用在工件24與銜接部位之間的應力減小到最小的程度,如同更詳細地討論於下文之中者。Referring to Figures 4, 6, and 7, a plurality of support means similar to the support means shown in Figure 6 can be substituted for the support means 21, 32 and 34 located within the heat treatment chamber 60 shown in Figure 4 . Generally, in this embodiment, the support member motion system is constructed to engage the engagement portions of the support members 104 to minimize stress applied between the workpiece 24 and the engagement portion. The extent of this is discussed in more detail below.

在該預先加熱階段期間(在該期間,工件24的基材側邊28係被該預先加熱裝置62照射,用以將該工件加熱到 所希望的中間溫度),該偵測器/控制器132係控制著動力供應單元130來控制被應用到線圈128之引線的電壓,用以產生一個具有所希望之大小而可以在線圈128之中流動的固定電流,藉以將一個對應之固定的向上作用力應用在該移動構件122上,並且因此應用在該支撐構件104上,而該支撐構件104係轉而將該向上作用力應用到工件24之基材側邊28的外部邊緣。所希望的電流大小係被選擇,使得被支撐構件104(及被其他支撐裝置的相似支撐構件)應用到該工件的固定向上作用力可以精確地平衡作用在該工件24上之向下的重力。During the preheating phase (during which time the substrate side 28 of the workpiece 24 is illuminated by the preheating device 62 to heat the workpiece to The desired intermediate temperature), the detector/controller 132 controls the power supply unit 130 to control the voltage applied to the leads of the coil 128 to produce a desired size that can be in the coil 128. a fixed current flowing, whereby a corresponding fixed upward force is applied to the moving member 122 and thus applied to the support member 104, and the support member 104 is rotated to apply the upward force to the workpiece 24. The outer edge of the substrate side 28 is. The desired current magnitude is selected such that the fixed upward force applied to the workpiece by the support member 104 (and similar support members of other support means) can accurately balance the downward gravitational force acting on the workpiece 24.

因此,在後續的加熱階段期間(在該期間,工件的裝置側邊26係被暴露於一個來自於加熱裝置64之高動力的照射閃光,用以將該裝置側邊加熱到較高之所希望的溫度,同時大部份的工件係保持在較冷的中間溫度),該工件24可能會再次經歷快速的熱壓彎,如在先前描述於本文中者(根據閃光的短暫持續時間,以及介於大部份工件的中間溫度與只有該裝置側邊26所被加熱到之最後退火溫度之間的差異大小)。假設此種快速熱壓彎發生的話,當該工件一開始快速變形時,該工件24的外部邊緣將會突然地在支撐構件104的銜接部位上(以及在其他支撐裝置之相似支撐構件的銜接部位上)應用一個顯著的向下作用力。將可以察知的是,這個突發的向下作用力係包括有在線圈128中之電流中的一個對應之突然增量。因此, 了要偵測出在目前之實施例中之工件24的以熱引動的運動, 每個偵測器/控制器132係被建構成用以偵測出在其各個致動器106中之一個電流,而該電流係為從一個藉著工件之以熱引動的運動應用到各個支撐構件104之銜接部位的作用力所產生的。更加特別的是,該偵測器/控制器132係被建構成用以偵測出在線圈128之電流的一個誤差。Thus, during the subsequent heating phase (during which time the device side 26 of the workpiece is exposed to a high-powered illumination flash from the heating device 64, the desired side of the device is heated to a higher level. The temperature, while most of the workpiece is maintained at a cooler intermediate temperature, the workpiece 24 may again experience rapid hot bending, as previously described in this paper (according to the short duration of the flash, and The difference between the intermediate temperature of most of the workpieces and only the final annealing temperature to which the device side 26 is heated. Assuming that such rapid hot bending occurs, when the workpiece begins to deform rapidly, the outer edge of the workpiece 24 will suddenly abut at the joint of the support member 104 (and at the joint of similar support members of other support devices). Top) Apply a significant downward force. It will be appreciated that this sudden downward force includes a corresponding sudden increase in current in coil 128. Therefore, to detect the heat-induced motion of the workpiece 24 in the present embodiment, Each detector/controller 132 is configured to detect a current in its respective actuator 106 that is applied to each support from a thermally actuated motion by the workpiece. The force generated by the joint of the member 104 is generated. More specifically, the detector/controller 132 is constructed to detect an error in the current at the coil 128.

以上述的方式檢測以熱引動的運動時,偵測器/控制器132係被建構成用以調整其各自之支撐構件104的位置,用以將在該工該工件24的重量與被該等支撐構件之銜接部位所施加到該工件的一個向上作用力之間的一個差異保持在所希望的範圍之內。更加特別的是,偵測器/控制器132係被建構成用來將這個差異減小到最小的程度。為了達成這個目的,在目前的實施例之中,當檢測前文所描述之在線圈128中之電流層中由以熱引動之運動所產生的誤差時,該偵測器/控制器132係被建構成用以控制該致動器106來調整被運用到該線圈128之引線的電壓,以便於導致在該線圈中的實際電流可以恢復到所希望的大小,藉以減小由該支撐構件104應用到工件24的向上作用力,使得該支撐構件104可以繼續抵消只有在工件上的向下重力,並且不會抵消由一開始的熱變形所應用之另外的向下作用力或是工件的熱壓彎。因此,有效率的方式是,該支撐構件104將會被降下,用以容許工件24的邊緣可以在其剛開始發生熱壓彎時會突然地向下移動。如先前在本文中注意到的是,該熱壓彎係傾向於以足夠快的速度發生,使得工件會突射出其平衡的形狀,並且因此係傾向於對 著其平衡形狀進行震動或是震盪。因此,當該工件的外部邊緣開始向上移回並且該工件的中心開始向下往回行進時,偵測器/控制器132會繼續將所希望大小的電流應用到該支撐構件104(對應一個精確地平衡在該支撐構件上之工件重量的向上作用力),但是由於工件之邊緣的向上熱壓彎運動,這個向上的作用力係不再被由該工件應用到支撐構件的向下作用力所抵消,且結果是該支撐構件104會藉著該工件的邊緣上升。同樣的,當工件之下一個循環的震動運動開始並且工件的邊緣開始再次向下移動時,由該工件的邊緣應用到支撐構件104的向下作用力係會再一次超過由該支撐構件104所應用的向上作用力(包括在該線圈128中之電流的一個改變),並且該偵測器/控制器132會快速地控制動力供應單元130來調整在該線圈之中的實際電流,使得支撐構件104應用到工件的向上作用力只會抵消掉重力,藉以容許該支撐構件104可以在由工件邊緣之向下熱壓彎運動所運用的額外作用力之影響之下降低。當工件繼續震動時,工件的外部邊緣係被容許可以向上及向下移動,同時係傾向於保持與該支撐構件104(以及相似的支撐構件)的接觸,直到震動平息下來為止。When the thermally actuated motion is detected in the manner described above, the detector/controller 132 is configured to adjust the position of its respective support member 104 for the weight of the workpiece 24 to be used in the work. A difference between an upward force applied to the workpiece by the engagement portion of the support member remains within the desired range. More specifically, the detector/controller 132 is constructed to minimize this difference. In order to achieve this, in the present embodiment, the detector/controller 132 is constructed when detecting the error caused by the motion of the heat priming in the current layer described in the coil 128 as described above. The voltage is configured to control the actuator 106 to adjust the voltage applied to the leads of the coil 128 so as to cause the actual current in the coil to be restored to a desired size, thereby reducing application by the support member 104. The upward force of the workpiece 24 allows the support member 104 to continue to counteract only the downward gravitational force on the workpiece and does not counteract the additional downward force applied by the initial thermal deformation or the hot bending of the workpiece. . Therefore, in an efficient manner, the support member 104 will be lowered to allow the edge of the workpiece 24 to suddenly move downward when it is just beginning to undergo a hot press. As previously noted in the text, the hot bending system tends to occur at a sufficiently fast rate that the workpiece will protrude out of its balanced shape and therefore tend to Its balanced shape is used to vibrate or oscillate. Thus, as the outer edge of the workpiece begins to move back upward and the center of the workpiece begins to travel back down, the detector/controller 132 will continue to apply a desired amount of current to the support member 104 (corresponding to an exact Earthly balancing the upward force of the workpiece on the support member), but due to the upward hot bending motion of the edge of the workpiece, this upward force is no longer applied by the downward force of the workpiece to the support member. Offset, and as a result, the support member 104 will rise by the edge of the workpiece. Similarly, when a cyclical vibration motion of the workpiece begins and the edge of the workpiece begins to move downward again, the downward force applied by the edge of the workpiece to the support member 104 will again exceed that of the support member 104. The applied upward force (including a change in current in the coil 128), and the detector/controller 132 will quickly control the power supply unit 130 to adjust the actual current in the coil such that the support member The upward force applied to the workpiece by 104 only counteracts gravity, thereby allowing the support member 104 to be reduced under the influence of the additional force applied by the downward hot bending motion of the edge of the workpiece. As the workpiece continues to vibrate, the outer edge of the workpiece is allowed to move up and down while tending to remain in contact with the support member 104 (and similar support members) until the shock subsides.

替代地,該致動器106可以包括有不同類型的致動器。舉例來說,該致動器106可以包括有一個直線伺服致動器。或者,另一種替代方式是,該致動器106可以包括有一個壓電致動器。在這個方面,壓電致動器由於其快速的反應時間(一般為至少快速如10-5 秒)、精確的移動以及 顯著之可獲致的作用力而可能是有利的。然而,大部份現存的壓電致動器在其可以獲致的運動範圍為有限的,並且因為這個原因對於某些應用來說可能是不適合的。Alternatively, the actuator 106 can include different types of actuators. For example, the actuator 106 can include a linear servo actuator. Alternatively, the actuator 106 can include a piezoelectric actuator. In this respect, piezoelectric actuators may be advantageous due to their fast reaction time (generally at least as fast as 10 - 5 seconds), precise movement, and significant achievable forces. However, the range of motion that most existing piezoelectric actuators can achieve is limited, and for this reason may not be suitable for some applications.

替代的方式是,可以用其他類型的致動器來取代該致動器106。Alternatively, the actuator 106 can be replaced with other types of actuators.

在前述的實施例中,支撐構件運動系統係被建構成用以反應於工件之以熱引動運動的一個被偵測到的參數(亦即,在該線圈128中之電流中所偵測到的改變,其係為起因於以熱引動之運動所產生之被工件應用到支撐構件104之作用力的改變所產生的)來移動支撐構件。替代地,如果有需要的話,該運動系統可以被建構成用以反應於該以熱引動之運動的一個預測數值來移動該支撐構件。此等預測的數值可以憑經驗經由例如觀察相似工件的熱處理而獲得。同樣的,將可以察知到的是,在沒有對於每個致動器106使用一個個別偵測器/控制器132的情況下,如果需要的話,對於某些或所有的致動器106來說,可以為了偵測及控制的用途而使用一個單獨的偵測器/控制器132。In the foregoing embodiments, the support member motion system is constructed to reflect a detected parameter of the workpiece for thermal kinetic motion (i.e., detected in the current in the coil 128). The change is caused by a change in the force applied to the support member 104 by the motion of the heat-induced movement to move the support member. Alternatively, the motion system can be configured to move the support member in response to the predicted value of the motion of the heat priming if desired. These predicted values can be obtained empirically via, for example, heat treatment to observe similar workpieces. Likewise, it will be appreciated that in the event that an individual detector/controller 132 is not used for each actuator 106, for some or all of the actuators 106, if desired, A separate detector/controller 132 can be used for detection and control purposes.

回到參照圖6,該致動器106的移動構件122並不需要被直接連接到支撐構件104。舉例來說,該致動器106可以被間接地連接到該支撐構件104。在這方面,將可以察知到的是,工件24之外部邊緣的熱壓彎運動並不會遵循著一個垂直的直線,而是會更近似一個弧線。據此,該工件之外部邊緣的運動也會具有一個水平的分量。舉例來說,對於某些應用來說,將該工件之外部邊緣的向下運動 以及該工件之中心的向上運動納入考慮,可以預期的是該工件的外部邊緣係會向內而水平地前進一個一毫米大小的距離。因此,如果該支撐構件104被水平地固定的話,那麼有效的方式是,該支撐構件的尖端接觸到工件之外步邊緣區域的位置點將會進一步朝向該工件的邊緣向外滑行。這個向內的水平前進距離典型上係小於工件之外部排除區域的徑向寬度,並且因此,藉著在一開始將支撐構件104比預期之工件在壓彎期間的水平向內前進更向內地定位在該排除區域內,可以維持介於該工件與該支撐構件之間的接觸,而不會使得工件的邊緣比該等支撐構件的尖端更向內前進並且經由介於該等支撐構件之間的空間落下。不過,該工件之外部排除區域之此種橫越該等支撐構件的滑行對於某些應用來說可能是非所希求者。舉例來說,此種滑行可能會刮傷工件的表面,從而產生微粒的污染,並且會非所希求地使該工件的表面粗糙化。Referring back to Figure 6, the moving member 122 of the actuator 106 need not be directly coupled to the support member 104. For example, the actuator 106 can be indirectly coupled to the support member 104. In this regard, it will be appreciated that the hot-bending motion of the outer edge of the workpiece 24 does not follow a vertical line, but rather approximates an arc. Accordingly, the motion of the outer edge of the workpiece also has a horizontal component. For example, for some applications, the downward movement of the outer edge of the workpiece As well as the upward movement of the center of the workpiece, it is contemplated that the outer edge of the workpiece will advance inwardly and horizontally by a distance of one millimeter. Therefore, if the support member 104 is horizontally fixed, it is effective that the point at which the tip end of the support member contacts the step edge region outside the workpiece will further slide outward toward the edge of the workpiece. This inward horizontal advancement distance is typically less than the radial extent of the outer exclusion zone of the workpiece and, therefore, is positioned more inwardly by inwardly advancing the support member 104 in a horizontally inward direction than the intended workpiece during compression. In the exclusion zone, contact between the workpiece and the support member can be maintained without causing the edges of the workpiece to advance more inwardly than the tips of the support members and via between the support members The space is falling. However, such gliding across the support members of the outer exclusion zone of the workpiece may be undesirable for certain applications. For example, such gliding may scratch the surface of the workpiece, thereby causing contamination of the particles, and may undesirably roughen the surface of the workpiece.

據此,如果有需要的話,在沒有將該等支撐構件104直接連接到該致動器106之移動構件122的情況下,該移動構件可以經由一個運動轉換裝置(用於將該移動構件的垂直運動轉換成該支撐構件104的一種具有垂直及水平分量的運動)被連接到該支撐構件104。Accordingly, if there is no need to connect the support members 104 directly to the moving member 122 of the actuator 106, the moving member can be via a motion conversion device (for vertical movement of the moving member) The movement is converted into a motion of the support member 104 having a vertical and horizontal component) to which the support member 104 is attached.

舉例來說,參照圖8及圖9,根據本發明之一個第四實施例的致動器係整體地以元件參考符號200顯示出來。該致動器200係相似於圖7所示的致動器106,並且係包括有移動構件122以及固定構件120。然而,在這個實施 例之中,該移動構件122並沒有被直接到該支撐構件104,反而是被連接到一個運動轉換器202。在這個實施例之中,該運動轉換器202係被建構成用來將該致動器106之一個可以移動構件的一種直線運動(或更加特別的是該移動構件122的一種直線運動)轉換成該支撐構件104的一種拱形運動。為了要達成這個目的,在目前的實施例中,該運動轉換器202係包括有一個第一連接器臂部208,而該致動器200的移動構件122係剛性地被連接到該第一連接器臂部208。該運動轉換器更包括有一個第二連接器臂部210,而該第一連接器臂部208係樞轉地被連接到該第二連接器臂部210。該第二連接器臂部210係樞轉地被連接到一個位於一個第一可自由移動樞轉點212處的第一剛性桿件214。該第一剛性桿件214係剛性地延伸於一個第二可自由移動樞轉點215與一個第一固定樞轉點216之間。在這個實施例之中,第一可自由移動樞轉點212係被配置在一個沿著第一剛性桿件214的位置處,而該位置係比第二可自由移動樞轉點215更接近第一固定樞轉點216。第一剛性桿件214係樞轉地被連接到一個位於第二可自由移動樞轉點215處之修改的支撐構件204。該第一固定樞轉點216係被連接到一個殼體(未顯示於圖中),用以防止在該第一固定樞轉點216之任何空間尺寸中的平移運動或是位移,同時容許該第一剛性桿件214繞著第一固定樞轉點216的旋轉(並且因此,容許第一可自由移動樞轉點212及第二可自由移動樞轉點215的旋轉)。該運動轉換 器更包括有一個第一剛性桿件218,其係樞轉地被連接到該第一固定樞轉點216以及一個第二固定樞轉點220,而該第二固定樞轉點220亦被固鎖,用以防止第二固定樞轉點220的轉換運動或位移。該運動轉換器202亦包括有一個第三剛性桿件222,其係將第二固定樞轉點220連接到一個沿著支撐構件204配置的第三可自由移動樞轉點224。因此,致動器200之移動構件122的任何垂直直線運動係導致第一及第二可自由移動樞轉點212及215會分別在繞著第一固定樞轉點216定心之各自的拱形路徑中移動,並且同樣的會導致該支撐構件204之的第三可自由移動樞轉點224會在一個繞著第二固定樞轉點220定心的拱形路徑中移動。因此,該致動器200之移動構件122的垂直直線運動係會導致該支撐構件204的一個支撐尖端228沿著一個圖9所示的拱形路徑230移動。除此之外,由於第一可自由移動樞轉點212沿著第一剛性桿件214的位置(最接近第一固定樞轉點216),移動構件122之一個相當小量的向下直線運動係被有效率地放大成該支撐構件204沿著該拱形路徑230之一個較大量的向下拱形運動。For example, referring to Figures 8 and 9, an actuator in accordance with a fourth embodiment of the present invention is shown generally as component reference numeral 200. The actuator 200 is similar to the actuator 106 shown in FIG. 7, and includes a moving member 122 and a fixing member 120. However, in this implementation In the example, the moving member 122 is not directly connected to the support member 104, but instead is connected to a motion converter 202. In this embodiment, the motion converter 202 is constructed to convert a linear motion of a movable member of the actuator 106 (or more specifically a linear motion of the moving member 122) into An arched motion of the support member 104. In order to achieve this, in the present embodiment, the motion converter 202 includes a first connector arm 208, and the moving member 122 of the actuator 200 is rigidly coupled to the first connection. Arm 208. The motion converter further includes a second connector arm 210, and the first connector arm 208 is pivotally coupled to the second connector arm 210. The second connector arm 210 is pivotally coupled to a first rigid member 214 at a first freely moveable pivot point 212. The first rigid rod member 214 extends rigidly between a second freely movable pivot point 215 and a first fixed pivot point 216. In this embodiment, the first freely moveable pivot point 212 is disposed at a position along the first rigid rod 214 that is closer to the second freely moveable pivot point 215 A fixed pivot point 216. The first rigid member 214 is pivotally coupled to a modified support member 204 at a second freely movable pivot point 215. The first fixed pivot point 216 is coupled to a housing (not shown) for preventing translational movement or displacement in any spatial dimension of the first fixed pivot point 216 while permitting The rotation of the first rigid lever 214 about the first fixed pivot point 216 (and, thus, the rotation of the first freely moveable pivot point 212 and the second freely moveable pivot point 215). The motion conversion The device further includes a first rigid rod member 218 that is pivotally coupled to the first fixed pivot point 216 and a second fixed pivot point 220, and the second fixed pivot point 220 is also secured A lock is used to prevent switching movement or displacement of the second fixed pivot point 220. The motion converter 202 also includes a third rigid lever member 222 that connects the second fixed pivot point 220 to a third freely moveable pivot point 224 disposed along the support member 204. Thus, any vertical linear motion of the moving member 122 of the actuator 200 results in the respective arches of the first and second freely movable pivot points 212 and 215 that are centered about the first fixed pivot point 216, respectively. The path moves and likewise causes the third freely moveable pivot point 224 of the support member 204 to move in an arcuate path centered about the second fixed pivot point 220. Thus, the vertical linear motion of the moving member 122 of the actuator 200 causes a support tip 228 of the support member 204 to move along an arcuate path 230 as shown in FIG. In addition, a relatively small amount of downward linear motion of the moving member 122 due to the position of the first freely moveable pivot point 212 along the first rigid rod member 214 (closest to the first fixed pivot point 216) The system member is efficiently enlarged to a greater amount of downward arching motion of the support member 204 along the arcuate path 230.

了要清楚的說明,圖9所示之各種元件的尺寸並沒有按照比例,而是被誇大。這些元件的實施尺寸將會改變,用以致使該支撐構件204之尖端228所追蹤的拱形路徑230會與該工件24之外部邊緣在熱壓彎期間所預期的路徑一致。替代的,如果有需要的話可以用任何其他適當類型的運動轉換器來替代。It is to be clearly understood that the dimensions of the various elements shown in Figure 9 are not to scale and are exaggerated. The implementation dimensions of these components will vary to cause the arcuate path 230 tracked by the tip 228 of the support member 204 to coincide with the path expected by the outer edge of the workpiece 24 during hot bending. Alternatively, any other suitable type of motion converter can be substituted if needed.

參照圖5至圖7以及圖10至圖12,一個根據本發明之第五實施例之用於支撐一個工件的系統係整體地以元件參考符號300表示。在這個實施例之中,複數的支撐構件的每個複數的可以移動之銜接部位係可以用一種相似於圖5所示的方式彈性地與該工件銜接。而且在這個實施例中,一個相似於圖6及圖7所示的支撐構件運動系統係被建構成用來反應於該工件24以熱引動的運動來移動複數的支撐構件。Referring to Figures 5 through 7 and Figures 10 through 12, a system for supporting a workpiece in accordance with a fifth embodiment of the present invention is generally indicated by reference numeral 300. In this embodiment, each of the plurality of movable engagement portions of the plurality of support members can be resiliently engaged with the workpiece in a manner similar to that shown in FIG. Also in this embodiment, a support member motion system similar to that shown in Figures 6 and 7 is constructed to react to the workpiece 24 to move a plurality of support members in a thermally actuated motion.

更加特別的是,在這個實施例之中,該系統300包括有複數的支撐裝置,包括有一個圖10所示的第一支撐裝置302,其係相似於圖5所示的支撐裝置80。因此,每個支撐裝置302都包括有一個具有一個樞轉點306的支撐構件304,而支撐構件304係可以繞著該樞轉點306進行樞轉。一個各自的彈簧308係被連接到在除了其樞轉點306之外的一個位置處的每個支撐構件304。更加特別的是,在這個實施例之中,樞轉點306係被插置於一個位置點(該支撐構件304被連接到該彈簧308處)與該支撐構件接觸工件24的一個銜接部位(一個尖端)之間。因此,如同圖5所示的構造,在目前的實施例之中,該彈簧308(其在這個實施例之中係包括有一個固定作用力的彈簧)係作用如同一個力矩應用器,其係被建構成將一個力矩應用到繞著其樞轉點306的支撐構件304,用以使得該銜接部位310傾向於保持與該工件的接觸。為了要達到這個目的,該彈簧308係在支撐構件304的一個端部上應用了一個 向下作用力,用以提供一個抵消藉由該工件24的重量應用在該支撐構件304之銜接部位(尖端)310上之一個力矩的力矩。More particularly, in this embodiment, the system 300 includes a plurality of support devices including a first support device 302 as shown in FIG. 10, which is similar to the support device 80 illustrated in FIG. Thus, each support device 302 includes a support member 304 having a pivot point 306 about which the support member 304 can pivot. A respective spring 308 is attached to each of the support members 304 at a location other than its pivot point 306. More particularly, in this embodiment, the pivot point 306 is inserted into a position point (the support member 304 is coupled to the spring 308) and the support member contacts an engagement portion of the workpiece 24 (a Between the tip). Thus, like the configuration shown in Figure 5, in the present embodiment, the spring 308 (which in this embodiment includes a spring with a fixed force) acts like a torque applicator, which is The construction applies a moment to the support member 304 about its pivot point 306 such that the engagement portion 310 tends to remain in contact with the workpiece. In order to achieve this, the spring 308 is attached to one end of the support member 304. The downward force is used to provide a moment that counteracts a moment applied to the engagement portion (tip) 310 of the support member 304 by the weight of the workpiece 24.

參照圖4及圖10至圖12,在目前的實施例之中,該支撐構件運動系統係被建構成用來移動該等支撐構件304的樞轉點306。在這個方面,在目前的實施例中,樞轉點306並不是被固定在相對於容室60之其他部份的空間中,而是被連接到一個致動器320。該連接可以是直接的、或替代的方式是可以是間接的(例如,該樞轉點306可以由一個被裝設在一個殼體312之相對壁部之間的樞轉桿件來提供,並且一個直接的連接可以藉著將樞轉桿件連接到該致動器來提供,或者替代地,一個間接的連接可以藉著將該殼體連接到該致動器320來達成)。該致動器320可以包括有一個像是本文先前所描述的聲音線圈致動器,或是替代地,可以包括有任何其他適當類型的致動器。在這個實施例之中,該運動系統係被建構成用來將電流應用到每個致動器320,用以移動被連接於其上的支撐構件304,從而移動支撐構件的樞轉點306。為了達成這個目的,在這個實施例之中,該致動器320係與加熱裝置64同步化,使得幾乎是與由加熱裝置64所產生的突然加熱閃光所產生之工件24之熱壓彎運動的開始同時地,該致動器320會將整個支撐裝置302向下移動,從而導致該支撐構件304也會與該工件24之外部邊緣的初始向下熱壓彎運動同時地向下移動,但是不會發生支撐構件304對著樞轉點 306進行任何顯著的樞轉。支撐裝置302之向下運動的大小可以相應於例如是該工件24之以熱引動運動的一個預測數值而被預先設定。在這個實施例之中,該致動器320係包括有一個相似於在前文中對於圖7所討論的偵測器/控制器(未顯示於圖中),其係可以被用來偵測工件之以熱引動的運動。因此,如果有需要的話,此種同步化及預測可以被省略,並且致動器並且致動器320及支撐裝置302的初始向下運動可以反應於以熱引動之運動的偵測而被起始及控制。圖11係顯示出該支撐裝置302在這個由致動器320所導致的這個初始運動之後的構造。在這個運動以後,如圖12所示,由於該工件24之外部邊緣的向下熱壓彎運動係持續進行,此種樞轉運動係以一種相似於圖5所示之實施例的方式受到固定作用力彈簧308的抵抗。由於該工件的外部邊緣係在該工件震動時開始恢復上升,如果有需要的話,該致動器同樣地可能會產生整個支撐裝置302的一個向上的運動。因此,在目前的實施例中,支撐構件304的向上及向下運動係以一種部份被動的方式由該彈簧308來提供,並且以一種部份主動的方式由該致動器320提供。替代地,如果需要的話,可以用其他類型的混合主動/被動支撐系統來替代。同樣的,也可以使用本文先前所描述的運動轉換器,使得由藉由該致動器320所產生之樞轉點306的運動會遵循一個拱形路徑,該拱形路徑係對應該工件之外部邊緣在熱壓彎期間所預期的路徑。Referring to Figures 4 and 10 through 12, in the present embodiment, the support member motion system is constructed to pivot point 306 for moving the support members 304. In this regard, in the present embodiment, the pivot point 306 is not fixed in the space relative to the other portions of the chamber 60, but is coupled to an actuator 320. The connection may be direct or alternatively may be indirect (eg, the pivot point 306 may be provided by a pivoting member that is mounted between opposing walls of a housing 312, and A direct connection may be provided by connecting the pivoting member to the actuator, or alternatively, an indirect connection may be achieved by attaching the housing to the actuator 320). The actuator 320 can include a voice coil actuator such as that previously described herein, or alternatively, can include any other suitable type of actuator. In this embodiment, the motion system is configured to apply a current to each actuator 320 for moving the support member 304 coupled thereto, thereby moving the pivot point 306 of the support member. In order to achieve this, in this embodiment, the actuator 320 is synchronized with the heating means 64 such that it is almost in the hot-bending motion of the workpiece 24 produced by the sudden heating of the flash produced by the heating means 64. Simultaneously, the actuator 320 will move the entire support device 302 downward, causing the support member 304 to also move downward simultaneously with the initial downward hot bending motion of the outer edge of the workpiece 24, but not Will occur with the support member 304 facing the pivot point 306 performs any significant pivoting. The magnitude of the downward movement of the support device 302 can be predetermined in response to, for example, a predicted value of the workpiece 24 that is thermally actuated. In this embodiment, the actuator 320 includes a detector/controller (not shown) similar to that discussed above with respect to FIG. 7, which can be used to detect workpieces. The heat-induced movement. Thus, such synchronization and prediction can be omitted if desired, and the initial downward movement of the actuator and actuator 320 and support device 302 can be initiated in response to detection of thermal motion. And control. Figure 11 shows the construction of the support device 302 after this initial movement caused by the actuator 320. After this movement, as shown in Fig. 12, since the downward hot bending motion of the outer edge of the workpiece 24 continues, the pivoting motion is fixed in a manner similar to the embodiment shown in Fig. 5. The resistance of the force spring 308. Since the outer edge of the workpiece begins to rise as the workpiece vibrates, the actuator may likewise produce an upward movement of the entire support device 302, if desired. Thus, in the present embodiment, the upward and downward movement of the support member 304 is provided by the spring 308 in a partially passive manner and is provided by the actuator 320 in a partially active manner. Alternatively, other types of hybrid active/passive support systems can be substituted if desired. Similarly, the motion converter previously described herein can also be used such that the motion of the pivot point 306 produced by the actuator 320 follows an arcuate path that corresponds to the outer edge of the workpiece. The path expected during hot bending.

參照圖6、圖13及圖14,根據本發明之第六實施例之 用於支撐一個工件的系統係整體地以元件參考符號400顯示在圖13之中。在這個實施例之中,該系統400包括有第一複數的各自支撐構件之第一複數的可移動銜接部位,其係可以與該工件24的一個下方表面相銜接,並且該系統也包括有第二複數的各自支撐構件之第二複數的可移動銜接部位,其係可以與該工件的一個上方表面相銜接。在這個實施例中,第一及第二複數個銜接部位係可以分別與該工件的下方及上方表面在該工件的一個外部周圍區域處相銜接,而該外部周圍區域在這個實施例中是該工件的外部排除區域。Referring to Figures 6, 13 and 14, in accordance with a sixth embodiment of the present invention The system for supporting a workpiece is shown generally in Figure 13 by reference numeral 400. In this embodiment, the system 400 includes a first plurality of movable engagement portions of a first plurality of respective support members that are engageable with a lower surface of the workpiece 24, and the system also includes A second plurality of movable engagement portions of the respective plurality of respective support members are engageable with an upper surface of the workpiece. In this embodiment, the first and second plurality of engaging portions are respectively engageable with the lower and upper surfaces of the workpiece at an outer peripheral region of the workpiece, and the outer peripheral region is in this embodiment The external exclusion area of the workpiece.

更加特別的是,在這個實施例中,每個第一複數個支撐構件都包括有一個第一支撐裝置402的一個支撐構件404,該第一支撐構件係稍微相似於圖6所示的支撐裝置102,並且因此係包括有一個致動器406。在這個實施例中,每個第二複數個支撐構件都包括有一個壓制裝置410的一個壓制構件414,其係依次包括有一個致動器416。在這個實施例中,該壓制構件414及該壓制裝置410係稍微相似於圖6所示之支撐構件104及支撐裝置102,但是係被建構成用來藉著接觸工件的裝置側邊26而在工件的外部排除區域中銜接工件。然而,在這個實施例中,致動器406及416係被一個控制器420所控制住,該控制器係與在每個致動器之中的作用力偵測器(未顯示於圖中)相連通。該控制器420係接收來自於該作用力偵測器的訊號,該訊號係代表工件24在熱壓彎或是其他以熱引動之運動 期間應用到支撐構件404及壓制構件414的作用力。反應於此種作用力偵測訊號,該控制器420係調整支撐構件404及壓制構件414的相對位置以及/或所應用的作用力,用以例如是如圖14所示地在熱壓彎以及所產生之工件的震動期間將支撐構件及壓制構件保持在與工件的外部排除區域的接觸之中。More particularly, in this embodiment, each of the first plurality of support members includes a support member 404 having a first support member 402 that is somewhat similar to the support device illustrated in FIG. 102, and thus includes an actuator 406. In this embodiment, each of the second plurality of support members includes a pressing member 414 having a pressing device 410, which in turn includes an actuator 416. In this embodiment, the pressing member 414 and the pressing device 410 are somewhat similar to the support member 104 and the support device 102 shown in FIG. 6, but are constructed to be used to contact the workpiece side 26 of the workpiece. The workpiece is joined in the external exclusion area of the workpiece. However, in this embodiment, actuators 406 and 416 are controlled by a controller 420 that is coupled to a force detector (not shown) in each actuator. Connected. The controller 420 receives a signal from the force detector, the signal representing the workpiece 24 being hot pressed or otherwise thermally actuated. The force applied to the support member 404 and the pressing member 414 during the period. In response to such a force detection signal, the controller 420 adjusts the relative position of the support member 404 and the pressing member 414 and/or the applied force for, for example, hot bending as shown in FIG. The support member and the pressing member are held in contact with the outer exclusion region of the workpiece during the vibration of the produced workpiece.

了要達到這個目的,該控制器420係被建構成用來移動支撐構件404的第一複數個銜接部位,用以藉著一個相似於在上文中參照圖6至圖9所討論的方式將介於工件重量與一個作用力(該作用力係被應用在第一複數個銜接部位與該工件之間)之間的一個差異減小到最小的程度。同樣的,該控制器420係被建構成用來移動壓制構件414的第二複數個銜接部位,用以將一個被應用在該工件與第二複數個銜接部位之間的作用力減小到最小的程度。後者的最小化係與前者相似,除了在壓制構件414的情況中,所希望之在致動器之線圈中的電流位準係相應於被應用在壓制構件414與工件之間的零作用力,然而,在支撐構件404的情況中,所希望之在致動器之線圈中的電流位準係相應於一個重力,亦即,在支撐構件404上之工件的重量。該控制器420係偵測出這些所希望之電流位準的誤差,並且控制供應到該等致動器406及416的電壓來移動支撐構件404及壓制構件414,用以將在該等致動器之線圈中的電流位準分別恢復到其所希望的位準。理想的方式是,作用力偵測器及控制器420應該是受到保護的,以便於將 將任何電子干擾或是噪音減小到最小的程度,其中,電子干擾及噪音可能是由電容器組或是其他被用來提供加熱裝置64動力以產生閃光(用以將工件的裝置側邊26加熱到其最後的退火溫度)的脈衝動力供應源的突然卸載所產生的。除了在本文先前所討論之以這種方式支撐工件的優點之外,在控制器方向下之壓制構件414及致動器416的作用係有助於壓制該工件的震動,藉以減少可能從此種震動產生之對於工件之傷害的可能性。如果希望的話,像是本文先前所描述的運動轉換器也可以被使用於支撐構件及壓制構件。To achieve this, the controller 420 is constructed to move the first plurality of engagement locations of the support member 404 for introduction by a method similar to that discussed above with reference to Figures 6-9. A difference between the weight of the workpiece and a force that is applied between the first plurality of engagement locations and the workpiece is minimized. Similarly, the controller 420 is constructed to move a second plurality of engagement locations of the pressing member 414 to minimize a force applied between the workpiece and the second plurality of engagement locations. Degree. The latter is similar to the former, except in the case of the pressing member 414, it is desirable that the current level in the coil of the actuator corresponds to the zero force applied between the pressing member 414 and the workpiece, However, in the case of the support member 404, it is desirable that the current level in the coil of the actuator corresponds to one gravity, i.e., the weight of the workpiece on the support member 404. The controller 420 detects errors in the desired current levels and controls the voltage supplied to the actuators 406 and 416 to move the support member 404 and the pressing member 414 for actuation. The current levels in the coils of the device are restored to their desired levels, respectively. Ideally, the force detector and controller 420 should be protected so that Minimize any electrical interference or noise, where electronic interference and noise may be used by a capacitor bank or other device to provide power to the heating device 64 to produce a flash (to heat the device side 26 of the workpiece) A sudden unloading of the pulsed power supply to its final annealing temperature). In addition to the advantages of supporting the workpiece in this manner as previously discussed herein, the action of the pressing member 414 and the actuator 416 in the direction of the controller helps to suppress the vibration of the workpiece, thereby reducing the likelihood of such vibration. The possibility of damage to the workpiece. If desired, a motion converter such as that previously described herein can also be used for the support member and the pressing member.

參照圖1至圖5以及圖15,根據本發明之第七實施例的一個支撐裝置係整體地以元件參考符號500顯示在圖15之中。該支撐裝置500在某些方面係相似於圖5所示的支撐裝置80,並且因此係包括有一個相似於支撐構件82、樞轉地被裝設到一個位於一個樞轉軸504處之支撐構件殼體503的支撐構件502,用於對著該樞轉軸進行樞轉。該殼體503可以包括有一個圖1至圖4所示的工件平面板件30,或是替代地,如果有需要的話,可以例如是包括有像是圖1所示之殼體36的一個獨立殼體。該樞轉軸504係被插置於一個位置點505與一個接觸位置點之間,支撐構件支撐構件502係在該位置點505處被連接到一個彈簧506(在這個實施例中,該彈簧係包括有一個固定作用力彈簧),並且該接觸位置點係介於該支撐構件的一個尖端508與該工件24之間。 了要達成這種樞轉連接,支撐構 件502(其在這個實施例之中係包括有一個石英栓釘)係被剛性地連接到一個外殼510,其係因此在樞轉軸504處被樞轉地連接到位於該外殼之相對側邊上的第一及第二裝設構件(其中一個裝設構件係以512顯示出來),每個裝設構件係剛性地被固定到殼體503。Referring to Figures 1 through 5 and Figure 15, a support device in accordance with a seventh embodiment of the present invention is shown generally in Figure 15 by reference numeral 500. The support device 500 is similar in some respects to the support device 80 shown in Figure 5 and thus includes a support member shell that is pivotally mounted to a support member member 504 at a pivot axis 504 similar to the support member 82. The support member 502 of the body 503 is configured to pivot against the pivot shaft. The housing 503 can include a workpiece planar panel 30 as shown in Figures 1 through 4, or alternatively, if desired, can include, for example, an independent housing 36 as shown in Figure 1. case. The pivot axis 504 is interposed between a position point 505 and a contact position point at which the support member support member 502 is coupled to a spring 506 (in this embodiment, the spring system includes There is a fixed force spring) and the point of contact is between a tip 508 of the support member and the workpiece 24. To achieve this pivotal connection, support structure Member 502, which in this embodiment includes a quartz stud, is rigidly coupled to a housing 510 that is thus pivotally coupled to opposite sides of the housing at pivot axis 504 The first and second mounting members (one of which is shown at 512) are rigidly secured to the housing 503.

如同圖1到圖3所示的實施例,目前之實施例的支撐裝置500係包括有一個作用力應用器,其係與支撐構件502相連通以將一個作用力應用到該支撐構件,用以導致該支撐構件502的銜接部位會傾向於在工件的熱引動運動期間保持與該工件接觸。然而,在這個實施例之中,該作用力應用器包括有被建構成用來將第一及第二相對力矩應用到支撐構件502的第一及第二力矩應用器,第二力矩係作用以藉著該支撐構件502對抗其一個平衡位置的超過。更加特別的是,在這個實施例中,該第一力矩應用器係包括有彈簧506,該彈簧係應用一個力矩(在一個如圖15所示的順時針方向之中),且該力矩係傾向於抵消一個由工件24的重量應用在支撐構件502之尖端508上的相反力矩。在這個實施例之中,第二力矩應用器包括有一個第二彈簧包括有一個第二彈簧520,該彈簧在這個實施例之中係被連接到位於遠離或是相對於支撐構件502之尖端508之一個端部處的支撐裝置500。在這個實施例之中,第二彈簧520係包括有一個可撓曲的長形金屬構件,其係在一個遠離工件24的方向之中從支撐裝置500處延伸出來。當該工件24是靜止的並且該支撐裝置是處於平衡狀態時 ,該第二彈簧520的一個遠端係保持於一個剛性擋止522的接觸,其中,該剛性擋止係從殼體503的一個下方表面處向上突伸。在運作期間,當該工件24的外部邊緣剛開始發生向下的熱彎壓時,支撐構件502係會相對於殼體503而樞轉(在一個圖15所示的逆時針方向中),並且據此,第二彈簧520的遠端係沿著一個逆時針方向的拱形路徑向上升高而遠離擋止522。數毫秒之後,當該工件24的外部邊緣快速地向上震盪恢復時,被第一彈簧506應用到支撐裝置500的作用力係會導致該支撐構件502在一個順時針方向中樞轉,直到第二彈簧520接觸到擋止522並且如同支撐構件超出其平衡的角位置般地彎曲為止,從而將一個逆時針方向的力矩應用到支撐裝置,用以導致該支撐裝置易於朝向其平衡角度恢復。將可以察知的是,在這個實施例中的擋止522係防止該支撐裝置500在順時針方向中旋轉地太遠而通過其平衡的角位置。有利的方式是,因為第二彈簧520是以一種彈性的方式銜接擋止522而達成這個目的,在其他的情況下將會發生的有害效果(像是將會從一個介於支撐裝置之一個剛性部位與擋止之間的突然碰撞所產生的微粒污染)將會被減少到最小的程度或是被避免。As with the embodiment shown in Figures 1 through 3, the support device 500 of the present embodiment includes a force application that communicates with the support member 502 to apply a force to the support member for The engagement portion that causes the support member 502 will tend to remain in contact with the workpiece during the thermal priming motion of the workpiece. However, in this embodiment, the force application includes first and second torque applicators configured to apply the first and second relative moments to the support member 502, the second moment acting The support member 502 is opposed to an excess of its equilibrium position. More particularly, in this embodiment, the first moment applicator includes a spring 506 that applies a moment (in a clockwise direction as shown in FIG. 15) and the torque tends to be The opposite moment applied to the tip end 508 of the support member 502 by the weight of the workpiece 24 is counteracted. In this embodiment, the second moment applicator includes a second spring including a second spring 520 that, in this embodiment, is coupled to a tip 508 that is remote or relative to the support member 502. A support device 500 at one end. In this embodiment, the second spring 520 includes a flexible elongate metal member that extends from the support device 500 in a direction away from the workpiece 24. When the workpiece 24 is stationary and the support device is in equilibrium A distal end of the second spring 520 is held in contact with a rigid stop 522 that projects upwardly from a lower surface of the housing 503. During operation, when the outer edge of the workpiece 24 begins to undergo a downward thermal bending, the support member 502 pivots relative to the housing 503 (in a counterclockwise direction as shown in Figure 15), and Accordingly, the distal end of the second spring 520 is raised upwardly away from the stop 522 along an arcuate path in a counterclockwise direction. After a few milliseconds, when the outer edge of the workpiece 24 is rapidly oscillated upwardly, the force applied by the first spring 506 to the support device 500 causes the support member 502 to pivot in a clockwise direction until the second spring 520 contacts stop 522 and bends as the support member exceeds its balanced angular position, thereby applying a counterclockwise moment to the support device to cause the support device to recover toward its equilibrium angle. It will be appreciated that the stop 522 in this embodiment prevents the support device 500 from rotating too far in the clockwise direction through its balanced angular position. Advantageously, because the second spring 520 engages the stop 522 in an elastic manner for this purpose, in other cases the detrimental effect (such as would be from a rigidity between the support devices) The particulate contamination caused by a sudden collision between the part and the stop will be reduced to a minimum or avoided.

參照圖16,根據本發明之第八實施例的一個支撐裝置係整體地以元件參考符號600顯示出來。在這個實施例之中,該支撐裝置600包括有複數個整體地以元件參考符號602表示的可撓曲支撐構件。在目前的實施例之中,每個 可撓曲支撐構件602都具有一個像是以元件參考符號604表示的限制部位以及一個像是以元件參考符號606表示的未限制部位。在這個實施例之中,每個支撐構件602的可移動銜接部位係包括有該未限制部位606。Referring to Figure 16, a support device in accordance with an eighth embodiment of the present invention is shown generally as component reference numeral 600. In this embodiment, the support device 600 includes a plurality of flexible support members, generally indicated by reference numeral 602. In the current embodiment, each The flexible support members 602 each have a restricted portion, such as indicated by reference numeral 604, and an unrestricted portion, such as indicated by reference numeral 606. In this embodiment, the movable engagement portion of each support member 602 includes the unrestricted portion 606.

在目前的實施例之中,每個可撓曲支撐構件602係包括有一個可撓曲纖維。更加特別的是,在這個實施例之中,每個可撓曲纖維係包括有一個光學纖維。又更加特別的是,在目前的實施例之中,每個可撓曲纖維係包括有一個石英的光學纖維。在目前的實施例之中,雖然某些光學纖維對於某些應用來說可能是非所希望地為易碎的,光學纖維係由於它們為普遍可獲得性、低成本及適當的機械性質而被選擇。然而,替代的方式是,可以用其他類型的纖維來取代。舉例來說(非限制性的),可以用以藍寶石組成的纖維、以非結晶石英覆蓋的水晶石英、碳化矽、碳纖維、其中有金屬的石英、玻璃、或是其中有金屬的玻璃來替代。舉例來說,藍寶石纖維典型上具有比石英更大的強度,並且對於像是目前之實施例的實施例來說是有利的,其中,如將於下文中更加詳細描述的,纖維的外部包覆係已經被移除,不然就是不存在。更大體地說,可以用其他類型的可撓曲支撐構件來取代。較佳的是,對於本實施例的用途來說,適當之可撓曲支撐構件應該是非污染的、可撓曲的、低質量的、並且應該持有適度的溫度存活能力,用以承受本文所描述的熱循環。In the current embodiment, each flexible support member 602 includes a flexible fiber. More particularly, in this embodiment, each of the flexible fiber systems includes an optical fiber. Still more particularly, in the current embodiment, each of the flexible fiber systems comprises an optical fiber having a quartz. In the current embodiment, although certain optical fibers may be undesirably fragile for certain applications, optical fibers are selected for their general availability, low cost, and appropriate mechanical properties. . Alternatively, however, other types of fibers can be substituted. By way of example and not limitation, fibers made of sapphire, quartz crystals covered with amorphous quartz, tantalum carbide, carbon fibers, quartz with metal, glass, or glass with metal therein may be used instead. For example, sapphire fibers typically have greater strength than quartz and are advantageous for embodiments like the present embodiments, wherein the outer cladding of the fibers, as will be described in more detail below, The system has been removed, otherwise it does not exist. More specifically, other types of flexible support members can be substituted. Preferably, for the use of the present embodiment, the appropriate flexible support member should be non-contaminating, flexible, low quality, and should have moderate temperature survivability to withstand the purposes of this document. Describe the thermal cycle.

將可以察知的是,光學纖維一般是帶有一個外部的鋁 塗層或是包覆而銷售的。因此,為了防止鋁的包覆接觸到並且污染工件,在目前的實施例之中,鋁塗層已經以化學的方式從可撓曲支撐構件602之未限制部位的遠端處(“遠端”係表示遠離外殼610)被移除。更加特別的是,在這個實施例之中,鋁的包覆係已經從每個未限制部位606的遠端處沿著一段2 mm的長度被去除。每個未限制部位606之未被包覆的遠端較佳的是具有一個光滑的表面,例如,像是在下文中參照圖37所討論的光滑表面。It will be appreciated that optical fibers are generally provided with an external aluminum The coating is either sold or coated. Thus, in order to prevent the coating of aluminum from contacting and contaminating the workpiece, in the present embodiment, the aluminum coating has been chemically extracted from the distal end of the unconstrained portion of the flexible support member 602 ("remote" It is indicated that it is removed away from the outer casing 610). More particularly, in this embodiment, the cladding of aluminum has been removed from the distal end of each unrestricted portion 606 along a length of 2 mm. The uncoated distal end of each unrestricted portion 606 preferably has a smooth surface, such as, for example, a smooth surface as discussed below with reference to FIG.

參照圖16,在這個實施例之中,支撐構件600包括有至少一個限制器,其係被建構成用來限制可撓曲支撐構件602的限制部位604。更加特別的是,在這個實施例之中,至少一個限制器係包括有該支撐構件600的一個外殼610。在這個實施例之中,每個限制部位604都包括有一個10 mm的長度,並且係被限制或是固鎖在位於該外殼610內的適當位置中。而且,在這個實施例之中,每個未限制部位都包括有一個17 mm的長度,該長度的15 mm係為鋁的包覆,並且其餘的2 mm係為沒有包覆的遠端。每個未限制部位606係從外殼606處延伸出來,使得每個未限制部位606之沒有包覆的遠端都會在工件的外部排除區域中銜接該工件24。而且,在這個實施例之中,每個可撓曲支撐構件602都具有一個小於2 mm的直徑。然而,替代的方式是,可以在一個特別的實施例之中以其他的尺寸或是尺寸組合來替代。大體地說,該尺寸將會被選擇以提供所希望的可撓性的平衡以及夠快的反應時間。在這個 方面,較大的直徑一般係傾向於增加支撐構件的硬度。增長支撐構件的未限制部位對於減少其硬度係為有用的,並且係因此容許較厚的直徑,然而,這個方法係傾向於減慢支撐構件之固定的反應時間,其在本實施例之中也是非所希求者。也為所希求的是將可撓曲支撐構件的質量減小到最小的程度。因此,在像是本實施例的實施例之中(其中,該工件是一個預計會經歷到快速熱壓彎及震動的半導體晶圓),該直徑將會是夠小的,並且未限制部位的長度係會夠長,用以提供所希求的彈性或是可撓性,同時,該長度也應該夠短而可以提供一個快速的反應時間,用以容許該可撓曲的支撐構件可以在一個1毫秒或是更少的時間規模上反應工件的運動,而在同時可以藉著最小質量的未限制部位來達成這些目標。Referring to Figure 16, in this embodiment, the support member 600 includes at least one restrictor that is configured to limit the restriction portion 604 of the flexible support member 602. More particularly, in this embodiment, at least one of the limiters includes a housing 610 having the support member 600. In this embodiment, each of the restriction portions 604 includes a length of 10 mm and is restrained or locked in place within the outer casing 610. Moreover, in this embodiment, each unrestricted portion includes a length of 17 mm, the length of which is 15 mm of aluminum, and the remaining 2 mm is the uncoated distal end. Each unrestricted portion 606 extends from the outer casing 606 such that the uncoated distal end of each unrestricted portion 606 engages the workpiece 24 in an outer exclusion region of the workpiece. Moreover, in this embodiment, each of the flexible support members 602 has a diameter of less than 2 mm. Alternatively, however, other sizes or combinations of sizes may be substituted in a particular embodiment. In general, this size will be chosen to provide the desired balance of flexibility and fast enough reaction time. at this In contrast, larger diameters generally tend to increase the stiffness of the support member. Increasing the unrestricted portion of the support member is useful for reducing its hardness and thus allowing for a thicker diameter, however, this method tends to slow the fixed reaction time of the support member, which in this embodiment also Right and wrong. It is also desirable to minimize the quality of the flexible support member. Thus, in an embodiment like this embodiment (where the workpiece is a semiconductor wafer that is expected to experience rapid hot bending and vibration), the diameter will be small enough and unconstrained The length will be long enough to provide the desired elasticity or flexibility, and the length should be short enough to provide a fast reaction time to allow the flexible support member to be in a 1 The motion of the workpiece is reflected on a scale of milliseconds or less, while at the same time these goals can be achieved by the unrestricted parts of the smallest mass.

一般來說,一個支撐構件的振動頻率係與其物理尺寸及質量有關,如下所示者: In general, the vibration frequency of a support member is related to its physical size and quality, as shown below:

其中,E=楊式模數[N/m2 ]I=支撐構件之剖面的慣性面積[m4 ]t=支撐構件的長度[m]μ=支撐構件之每單位長度的質量[kg/m]A=係數(對於震動模式2,A=3.52;對於模式2,A=22.0;對於模式3,A=61.7等等)Wherein E = Young's modulus [N / m 2 ] I = inertial area of the section of the support member [m 4 ] t = length of the support member [m] μ = mass per unit length of the support member [kg / m] A = coefficient (for vibration mode 2, A = 3.52; for mode 2, A = 22.0; for mode 3, A = 61.7, etc.)

因此,前述的關係及觀察可以被用來幫助對於一個給 定的應用選擇支撐構件所希求的長度及直徑。Therefore, the aforementioned relationships and observations can be used to help give The desired application selects the length and diameter desired by the support member.

參照圖15、圖16及圖19,在這個實施例之中,顯示於圖16及圖19中的支撐裝置600係稍微類似於圖15中所示的支撐裝置500,最顯著的差異為以可撓曲的支撐構件602(在這個實施例中為可撓曲的石英纖維)去取代剛性的支撐構件502。因此,本實施例係包括有複數個作用力應用器,其係被建構成用來將作用力應用到複數個支撐裝置600,用以致使每個未限制部位606皆傾向於在工件的熱引動運動期間保持與該工件24的接觸。特加特別的是,該等作用力應用器係包含有力矩應用器,或是更加特別的是包含有彈簧506及520。Referring to Figures 15, 16 and 19, in this embodiment, the support device 600 shown in Figures 16 and 19 is slightly similar to the support device 500 shown in Figure 15, with the most significant difference being The deflected support member 602 (which in this embodiment is a flexible quartz fiber) replaces the rigid support member 502. Accordingly, the present embodiment includes a plurality of force applications that are configured to apply force to a plurality of support devices 600 to cause each unrestricted portion 606 to tend to be thermally induced on the workpiece. Contact with the workpiece 24 is maintained during the movement. In particular, the force application devices include a torque application or, more particularly, springs 506 and 520.

在這個實施例之中,一個支撐系統包括有相似於支撐裝置600的複數個支撐裝置,其等係被配置在工件24之外部周圍附近的各種間隔處。因此,在這個實施例之中,該至少一個限制器係包括有被配置在該工件之外部周圍附近的複數個限制器,亦即,各自之支撐裝置600的複數個外殼610。如同可以從圖16清楚地看出的是,在這個實施例之中,複數個限制器係由少於可撓曲支撐構件之數目的限制器構成,並且每個限制器係被建構成用來限制多於一個可撓曲支撐構件,例如,像是圖16所示的一組六個支撐構件602。更加特別的是,在這個實施例中,每個限制器(亦即,每個外殼610)係被建構成用來限制多於一個之整體上彼此平行的可撓曲支撐構件。In this embodiment, a support system includes a plurality of support devices similar to support device 600 that are disposed at various intervals near the exterior of the workpiece 24. Thus, in this embodiment, the at least one restrictor includes a plurality of restrictors disposed adjacent the outer periphery of the workpiece, that is, a plurality of outer casings 610 of the respective support devices 600. As can be clearly seen from Fig. 16, in this embodiment, a plurality of limiters are constructed of limiters that are less than the number of flexible support members, and each limiter is constructed to be used More than one flexible support member is constrained, such as, for example, a set of six support members 602 as shown in FIG. More particularly, in this embodiment, each restrictor (i.e., each outer casing 610) is constructed to limit more than one flexible support member that is generally parallel to each other.

參照圖16及圖17,一個根據本發明第九實施例的支 撐裝置係整體地以元件參考符號650被顯示於圖17之中。該支撐裝置650整體上係相似於支撐裝置600,並且包括有整體地以元件參考符號652表示的複數個可撓曲支撐構件,每個可撓曲支撐構件都具有一個像是元件參考符號654所示的限制部位,一個像是元件參考符號656所示的未限制部位。每個限制部位係被限制或鎖定在限制器之中的適當位置中,或者更加特別的是,在一個外殼660之內。如同在先前的實施例之中,每個限制器皆限制了多於一個的可撓曲支撐構件652。然而在這個實施例之中,每個限制器係被建構成用以限制住該多於一個之大體上彼此分散的可撓曲支撐構件。因此,在這個實施例之中,該可撓曲支撐構件652並非大體上平行的,而是以一種分散的方式從該外殼660處朝向該工件24延伸。在圖17所示的實施例之中,該可撓曲支撐構件大體上係為平直的(但是可以包括有彎曲的端部區域,如更加詳細地參照圖20所討論者),並且從該外殼660處沿著向外分散的路徑延伸。16 and 17, a branch according to a ninth embodiment of the present invention The struts are integrally shown in Figure 17 with reference numeral 650. The support device 650 is generally similar to the support device 600 and includes a plurality of flexible support members, generally indicated by reference numeral 652, each of which has an element reference numeral 654. The restricted portion shown is an unrestricted portion as shown by reference numeral 656. Each restriction is limited or locked in place in the limiter or, more particularly, within a housing 660. As in the previous embodiment, each limiter limits more than one flexible support member 652. In this embodiment, however, each of the restrictors is constructed to limit the more than one flexible support member that is generally dispersed relative to one another. Thus, in this embodiment, the flexible support members 652 are not substantially parallel, but extend from the outer casing 660 toward the workpiece 24 in a dispersed manner. In the embodiment illustrated in Figure 17, the flexible support member is generally straight (but may include a curved end region, as discussed in more detail with respect to Figure 20), and from The outer casing 660 extends along an outwardly dispersed path.

參照圖17及圖18,替代的方式是,如果有需要的話,該可撓曲支撐構件可以藉著沿著各自的彎曲路徑而分散。舉例來說,根據本發明之第十實施例的一個支撐裝置係整體地以元件參考符號680顯示在圖18之中。該支撐裝置680大體上係相似於支撐裝置650,並且係包括有整體地以元件參考符號682顯示的複數個可撓曲支撐構件,每個可撓曲支撐構件皆包括有像是以元件參考符號684顯示的一個限制部位,以及像是以元件參考符號686顯示的一 個未限制部位。每個限制部位係被限制或鎖定在一個外殼690內的一個適當位置之中。然而,在這個實施例之中,該可撓曲支撐構件682係從該外殼690處朝向該工件24沿著各自的分散彎曲路徑延伸。為了達成這個目的,該複數個可撓曲支撐構件682可以被預先加熱且彎曲成所希求的曲率。Referring to Figures 17 and 18, in the alternative, the flexible support members can be dispersed by respective curved paths if desired. For example, a support device in accordance with a tenth embodiment of the present invention is shown generally in FIG. 18 with reference numeral 680. The support device 680 is generally similar to the support device 650 and includes a plurality of flexible support members integrally shown with reference numeral 682, each of which includes an image reference symbol 684 shows a restricted portion, and one like the component reference symbol 686 Unrestricted parts. Each restriction is limited or locked in a suitable position within a housing 690. However, in this embodiment, the flexible support member 682 extends from the outer casing 690 toward the workpiece 24 along respective discrete curved paths. To accomplish this, the plurality of flexible support members 682 can be preheated and bent to the desired curvature.

如同一個進一步的替代方式,如果需要的話,每個限制器可以限制住只有一個單獨而各自對應的其中一個可撓曲支撐構件之一個限制部位。此外,一般來說,該支撐裝置600的可撓曲支撐構件602可以被使用在本發明的其他實施例之中,例如,像是本文描述的任何其他實施例。As a further alternative, each limiter can limit one restriction to only one of the respective one of the respective flexible support members, if desired. Moreover, in general, the flexible support member 602 of the support device 600 can be used in other embodiments of the invention, such as, for example, any other embodiment described herein.

像是圖17及圖18所示的實施例係傾向於容許工件的接觸點分部較為寬廣,並且可以減少陰影效果。Embodiments such as those shown in Figs. 17 and 18 tend to allow the contact point division of the workpiece to be wider and to reduce the shadow effect.

參照圖16至圖19,在上述的實施例之中,一個用於彈性地支撐該工件的支撐系統係包括有複數個相似於支撐裝置600的支撐裝置(或者替代的方式是,支撐裝置650或680),該等支撐裝置係被配置在工件之外部邊緣周圍的各種角位置處。雖然三個、或甚至是二個的此等支撐裝置對於某些應用來說已足夠,此種系統較佳地係包括有四個或更多個此種支撐裝置,用以在其中一個支撐裝置可能無法適當地之稱工件的情況下提供適度的支撐穩定性。16 to 19, in the above embodiment, a support system for elastically supporting the workpiece includes a plurality of support devices similar to the support device 600 (or alternatively, the support device 650 or 680) The support devices are disposed at various angular positions around the outer edge of the workpiece. While three, or even two, of these support devices are sufficient for some applications, such systems preferably include four or more such support devices for one of the support devices Moderate support stability may not be provided where the workpiece may not be properly referred to.

參照圖19,在這個實施例之中,可撓曲支撐構件602(或者替代的方式是,支撐構件652或682)係以一個相對於該工件之平面成大約25o 的角度銜接工件的外部排除 區域。替代的方式是,可以用其他的角度來替代。Referring to Figure 19, in this embodiment, the flexible support member 602 (or alternatively, the support member 652 or 682) is externally attached to the workpiece at an angle of about 25 o with respect to the plane of the workpiece. region. Alternatively, it can be replaced with other angles.

替代的方式是,參照圖20,在本發明的第十一實施例之中,該可撓曲支撐構件602(或者替代的方式是,支撐構件652或682)可以用更加陡峭的角度來銜接工件的外部排除區域,例如,像是介於可撓曲支撐構件602的未限制部位606與圖20所示之工件24之間的銜接角度。如果使用此種較陡峭的銜接角度的話,每個可撓曲支撐構件602的未限制部位606較佳地係具有一個彎曲的端部區域620,用於銜接工件24的外部排除區域。此種曲率可以例如是藉著預先加熱該可撓曲支撐構件並且在其被加熱時以機械的方式彎曲該端部區域620而達成。該端部區域620的區域係用作藉著該端部區域620將工件之基材側邊的刮傷減少到最小的程度,否則刮傷可能會在工件的熱壓彎與震動期間發生。Alternatively, referring to Fig. 20, in an eleventh embodiment of the invention, the flexible support member 602 (or alternatively, the support member 652 or 682) can engage the workpiece with a steeper angle The outer exclusion zone, for example, is the angle of engagement between the unconstrained portion 606 of the flexible support member 602 and the workpiece 24 shown in FIG. If such a steeper engagement angle is used, the unrestricted portion 606 of each flexible support member 602 preferably has a curved end region 620 for engaging the outer exclusion region of the workpiece 24. Such curvature can be achieved, for example, by preheating the flexible support member and mechanically bending the end region 620 as it is heated. The area of the end region 620 serves to minimize scratching of the side edges of the workpiece by the end region 620, which would otherwise occur during hot bending and shaking of the workpiece.

雖然前述的實施例描述了支撐裝置600(或是支撐裝置650或680)的可撓曲支撐構件602(或者,替代的方式是,支撐構件652或682)係與一個或多個彈簧(例如,像是圖15及圖19所示的彈簧506及520)一起使用;替代的方式是,在一些實施例之中,由該可撓曲支撐構件602(或是支撐構件652或682)所提供的可撓曲性將足以彈性地支撐該工件,而不需要任何此種彈簧或其他的彈性或可撓曲元件。因此,在此種實施例之中,該外殼610的位置及定向可以是固定的,並且只有可撓曲支撐構件的未限制部位可以移動。Although the foregoing embodiments describe the flexible support member 602 of the support device 600 (or the support device 650 or 680) (or, alternatively, the support member 652 or 682) is coupled to one or more springs (eg, Used together with springs 506 and 520) as shown in Figures 15 and 19; alternatively, in some embodiments, provided by the flexible support member 602 (or support member 652 or 682) The flexibility will be sufficient to elastically support the workpiece without the need for any such springs or other resilient or flexible elements. Thus, in such an embodiment, the position and orientation of the outer casing 610 can be fixed and only the unrestricted portions of the flexible support member can be moved.

舉例來說,參照圖21,一個根據本發明之第十二實施例之用於支撐該工件24的支撐系統係整體地以元件參考符號700顯示。在這個實施例之中,該支撐系統700包括有例如像是那些以元件參考符號702、704、706及708顯示之複數個支撐裝置701,該等支撐裝置係被配置在一個工件平面板件710之一個內部工件支撐開孔周圍的各種間隔處。在目前的實施例之中,該支撐裝置702及其他的相似支撐裝置係從該工件平面板件710的一個下方區域處向內且向上延伸,用以彈性地銜接工件24之基材側邊28的外部排除區域。For example, referring to FIG. 21, a support system for supporting the workpiece 24 in accordance with a twelfth embodiment of the present invention is generally indicated by reference numeral 700. In this embodiment, the support system 700 includes a plurality of support devices 701, such as those shown with reference numerals 702, 704, 706, and 708, which are disposed on a workpiece planar panel 710. An internal workpiece supports various spacings around the opening. In the present embodiment, the support device 702 and other similar support devices extend inwardly and upwardly from a lower region of the workpiece planar panel 710 for resiliently engaging the substrate side 28 of the workpiece 24. External exclusion area.

參照圖21及圖22,該支撐裝置702係更加詳細地顯示在圖22之中。在這個實施例之中,支撐裝置702係包括有一個可撓曲支撐構件712,該支撐在構在這個實施例之中係包括有一個石英光學纖維,然而,如先前在本文中所討論的,替代的方式是可以用其他適當的可撓曲支撐構件來替代。在目前的實施例之中,該可撓曲支撐構件712係被部份地被限制在一個包覆層714之內,該包覆層在這個實施例之中是鋁的包覆層,其中該石英纖維係為在商業上銷售者。該鋁的包覆層已經以化學的方式從可撓曲支撐構件712的一個未包附的端部區域716處移除,且該端部區域716係遠離工件平面板件710(工件24的近側),使得石英纖維被暴露出來或是未包覆的端部區域716係會接觸工件24之基材側邊28的外部排除區域。如在前文中參照先前實施例所討論的,在目前的實施例之中,可撓曲支 撐構件712的端部區域716係為彎曲的,用以將在工件之以熱引動的壓彎及震動運動期間被可撓曲支撐構件造成之工件之基材側邊28的刮傷減少到最小的程度。在這個實施例之中,鋁的包覆層係被緊密地固定在一個外殼718之內,其在這個實施例之中係包括有一個不銹鋼管件。該外殼718係被緊密地固定在工件平面板件710之內。Referring to Figures 21 and 22, the support device 702 is shown in more detail in Figure 22. In this embodiment, the support device 702 includes a flexible support member 712 that includes a quartz optical fiber in this embodiment, however, as previously discussed herein, Alternatively, other suitable flexible support members can be substituted. In the present embodiment, the flexible support member 712 is partially confined within a cladding layer 714, which in this embodiment is a cladding layer of aluminum, wherein Quartz fiber is a commercial seller. The aluminum cladding has been chemically removed from an unenclosed end region 716 of the flexible support member 712, and the end region 716 is remote from the workpiece planar panel 710 (near workpiece 24) The side regions 716 are such that the exposed or uncoated end regions of the quartz fibers contact the outer exclusion regions of the substrate side edges 28 of the workpiece 24. As discussed above with reference to previous embodiments, in the current embodiment, the flexible branch The end region 716 of the brace member 712 is curved to minimize scratching of the substrate side 28 of the workpiece caused by the deflectable support member during the thermally induced bending and vibrating motion of the workpiece. Degree. In this embodiment, the aluminum cladding is tightly secured within a housing 718, which in this embodiment includes a stainless steel tube. The outer casing 718 is tightly secured within the workpiece planar panel 710.

在這個實施例之中,該可撓曲支撐構件712的長度為27 mm,其一個在該工件平面板件710近側而具有10 mm長度的端部區域係被包裝在該包覆層714及該外殼718二者之內,一個長度為13 mm的中間區域係只有被包裝在該包覆層714之內,並且在該工件平面末端而長度為4 mm的端部區域716係被暴露出來,沒有被外殼也沒有被包覆層包圍。在目前的實施例之中,外殼718及包覆層714係從工件平面板件710以一個與垂直距離35o 的角度(或是相對於工件平面55o )延伸出來,然而這個角度主要是為了方便而被選擇來將工件平面板件所需要的修改減少到最小的程度。替代的角度係在下文中更加詳細地討論。此外,大體地說,如果有需要的話,可以用其他組合的尺寸、角度、或是構造來取代。In this embodiment, the flexible support member 712 has a length of 27 mm, and an end region having a length of 10 mm proximal to the workpiece planar panel 710 is packaged in the cladding layer 714 and Within the outer casing 718, an intermediate portion having a length of 13 mm is only packaged within the cladding layer 714, and an end region 716 having a length of 4 mm at the end of the workpiece plane is exposed. Not surrounded by the outer casing and not covered by the cladding. In the present embodiment, the outer casing 718 and the cladding 714 extend from the workpiece planar plate 710 at an angle of 35 o from the vertical distance (or 55 o relative to the workpiece plane), however this angle is primarily for Conveniently selected to minimize the required modifications to the workpiece flat panel. Alternative angles are discussed in more detail below. In addition, in general, other combinations of sizes, angles, or configurations can be substituted if needed.

參照圖21及圖22,在這個實施例之中,該支撐系統700包括有像是圖21及圖22之中所示之支撐裝置702的複數個支撐裝置,其係被配置在該工件平面板件周圍的各種位置處。更加特別的是。在目前的實施例之中,工件支撐系統700係包括有16個此種支撐裝置,其係被配置成 緊密分隔的八對裝置,每對裝置係以45o 的間隔對稱地被配置在該工件24周圍附近。在這個方面,除此之外,此等支撐裝置之在每個角位置處以緊密分隔的成對安置係有效地提供了一種後援,使得如果該對支撐裝置的其中一個支撐裝置無法如所希望地運作時,該對支撐裝置中的另一個支撐裝置大體上將可以適度地將該工件支撐在該角位置處,藉以防止該工件掉落或是被傷害。Referring to Figures 21 and 22, in this embodiment, the support system 700 includes a plurality of support means, such as the support means 702 shown in Figures 21 and 22, which are disposed on the workpiece flat panel. Various locations around the pieces. More special. In the present embodiment, the workpiece support system 700 includes 16 such support devices configured as closely spaced eight pairs of devices, each pair being symmetrically disposed at the workpiece at 45 o intervals. Around 24 around. In this respect, in addition to this, the support devices are effectively provided with a tightly spaced pair of placements at each angular position so that if one of the support devices of the pair of support devices fails as desired In operation, the other of the pair of support devices will generally support the workpiece at the angular position in a modest manner to prevent the workpiece from falling or being damaged.

然而,替代的方式是,可以提供其他數目及角度構造的支撐裝置。一般來說,對於相似於目前之實施例的實施例來說,較佳的是此等支撐裝置之數目及位置的選擇係所希求的被引導,用以將該支撐裝置的質量減小到最小的程度,而在同時提供適當數量的此種支撐裝置,用以在本文所描述之整個以熱引動的壓彎以及震動運動期間支撐該工件。Alternatively, however, other numbers and angles of support means can be provided. In general, for embodiments similar to the prior embodiments, it is preferred that the number and location of such support devices are selected to be directed to minimize the quality of the support device. To the extent that an appropriate number of such support means are provided at the same time to support the workpiece during the entire heat-induced compression and vibration motions described herein.

舉例來說,仍然參照圖21及圖22,在一個相似而適用於處理例如是200 mm直徑晶圓的替代實施例之中,一個修改的工件支撐系統700係包括有六個此種支撐裝置702,其係被配置成緊密分隔的三對支撐裝置,每對支撐裝置係在工件24周圍以120o 的間隔對稱地配置。同樣地,在又另一個適用於處理例如是300 mm直徑之晶圓的替代實施例之中,一個修改的工件支撐系統700係包括有八個此種支撐裝置702,該等支撐裝置係被配置成緊密分隔的四對支撐裝置,每對支撐裝置係在工件24周圍以90o 的間隔對稱地配置。這些替代實施例的支撐裝置702係相似 於圖22所示者,然而在這些替代的實施例中,被暴露出來或是沒有包覆的端部區域716具有2 mm的長度。在這個方面,長度縮短的未包覆端部區域716已經被發現能夠降低纖維破裂的可能性。在這些實施例之中,如在下文中與圖37相關的描述,被縮短的未包覆端部區域716係具有平滑表面的尖端。For example, still referring to FIGS. 21 and 22, in an alternative embodiment suitable for processing, for example, a 200 mm diameter wafer, a modified workpiece support system 700 includes six such support devices 702. It is configured as three pairs of support devices that are closely spaced, each pair of support devices being symmetrically disposed around the workpiece 24 at 120 o intervals. Similarly, in yet another alternative embodiment suitable for processing wafers such as 300 mm diameter, a modified workpiece support system 700 includes eight such support devices 702, which are configured Four pairs of support devices are closely spaced, each pair of support devices being symmetrically disposed around the workpiece 24 at 90 o intervals. The support device 702 of these alternative embodiments is similar to that shown in Figure 22, however in these alternative embodiments, the end regions 716 that are exposed or uncoated have a length of 2 mm. In this regard, the shortened uncoated end region 716 has been found to reduce the likelihood of fiber breakage. Among these embodiments, as described below in connection with FIG. 37, the shortened uncoated end region 716 has a pointed end with a smooth surface.

而且,在這些替代的實施例之中,該支撐裝置702相對於工件24之平面的銜接角度已經被改變了。在這些實施例之中,每個銜接部位都可以用一個10o 到80o 的角度相對於該工件的平面與該工件24的下方表面相銜接。更加特別的是,在這些實施例之中,該角度為15至35度。又更加特別的是,在這些替代的實施例之中,該角度為25度。在這個方面,雖然所需要之角度的選擇可能會因為應用的不同而有所改變,已經被發現到的是,對於某些半導體晶圓的應用來說,一個陡峭的銜接角度(例如,像是80o 到90o )係會增加鑿挖到晶圓的可能性並且傷害到該支撐構件或是該晶圓,然而,平淺的角度(例如,像是0o 到10o )係會增加可撓曲支撐構件712破裂的可能性。因此,對於某些應用來說,一個在10o 到80o 之範圍中之相對於該工件平面的銜接角度將會是較佳的;一個15o 到35o 的銜接角度將會是更為較佳的;對於某些應用來說,一個25o 的銜接角度將會是又更為較佳的。然而,替代的方式是,可以用其他的角度來替代。Moreover, among these alternative embodiments, the angle of engagement of the support device 702 relative to the plane of the workpiece 24 has been altered. In these embodiments, each of the engagement locations can engage the lower surface of the workpiece 24 at an angle of 10 o to 80 o relative to the plane of the workpiece. More particularly, in these embodiments, the angle is 15 to 35 degrees. Still more particularly, among these alternative embodiments, the angle is 25 degrees. In this respect, although the choice of angles required may vary from application to application, it has been found that for certain semiconductor wafer applications, a steep junction angle (eg, like 80 o to 90 o ) will increase the possibility of staking into the wafer and damage the support member or the wafer. However, the shallow angle (for example, 0 o to 10 o ) will increase. The possibility of the flexure support member 712 breaking. Therefore, for some applications, a joint angle relative to the plane of the workpiece in the range of 10 o to 80 o would be preferred; a 15 o to 35 o joint angle would be more Good; for some applications, a 25 o convergence angle will be even better. However, the alternative is that it can be replaced with other angles.

在所有的此等實施例之中,對於該可撓曲支撐構件 712之未被包圍的部位(亦即,可撓曲支撐構件712延伸於該外殼718之外的部位)來說,較佳的是其長度與使用在一個給定系統中之其他可撓曲支撐構件的未包覆部位完全相同,用以保持每個支撐構件之一致的可撓曲性。由於相似的原因,較佳的是可以精確地控制未包覆之端部區域716的長度,用於一致的可撓曲性及破裂抵抗性。同樣的,較佳的方式是,每個支撐裝置702市以相同的角度銜接該該工件24。In all of these embodiments, for the flexible support member The unenclosed portion of 712 (i.e., the portion of the flexible support member 712 that extends beyond the outer casing 718) is preferably of a length and other flexible support for use in a given system. The uncoated portions of the members are identical to maintain consistent flexibility of each of the support members. For similar reasons, it is preferred to accurately control the length of the uncoated end region 716 for consistent flexibility and fracture resistance. Similarly, preferably, each support device 702 is coupled to the workpiece 24 at the same angle.

此外,整體來說,可以用其他適當的構造及尺寸(不管是對稱且一致的,或者是其他的情形)來替代。Moreover, in general, other suitable configurations and sizes (whether symmetrical and consistent, or other situations) may be substituted.

參照圖23及圖24,根據本發明之第十三實施例之用於支撐該工件24的一個支撐系統係整體地以元件參考符號800顯示在圖23之中。在這個實施例之中,該支撐系統800係包括有複數個支撐裝置802(例如,像是那些以元件參考符號804、806及808所示者),該等支撐裝置係在不同的間隔處被配置在一個工件平面板件810的內部工件支撐開孔周圍。在目前的實施例之中,該等支撐裝置802係從該工件平面板件810的一個下方區域處向內且向上地延伸,用以銜接該工件24之基材側邊28的外部排除區域。然而,與前一個顯示於圖21及圖22之中的實施例所不同的是,在顯示於圖23及圖24中的實施例之中,每個支撐裝置皆包括有一個可撓曲彎曲支撐構件,其係可以與該工件的排除區域彈性地銜接。Referring to Figures 23 and 24, a support system for supporting the workpiece 24 in accordance with a thirteenth embodiment of the present invention is shown generally in Figure 23 by reference numeral 800. In this embodiment, the support system 800 includes a plurality of support devices 802 (e.g., such as those shown with reference numerals 804, 806, and 808) that are attached at different intervals. Disposed around the inner workpiece support opening of a workpiece planar panel 810. In the present embodiment, the support means 802 extend inwardly and upwardly from a lower region of the workpiece planar panel 810 for engaging an outer exclusion region of the substrate side 28 of the workpiece 24. However, unlike the previous embodiment shown in Figures 21 and 22, in the embodiment shown in Figures 23 and 24, each support device includes a flexible bending support. A member that is resiliently engageable with the exclusion region of the workpiece.

在這個方面,參照圖24,該支撐裝置804係更加詳細 地被顯示出來。在這個實施例之中,該支撐裝置804係包括有一個可撓曲的彎曲支撐構件812,其在這個實施例之中係包括有一個光學的石英纖維,然而,替代的方式是,可以用其他類型的可撓曲支撐構件來替代。在這個實施例之中,該可撓曲彎曲支撐構件812係包括有分隔開的第一及第二限制部位,且一個未限制部位係在一個彎曲路徑之中延伸於該等限制部位之間。更加特別的是,在這個實施例之中,該第一限制部位係包括有一個第一端部區域815,該未限制部位係包括有一個中間區域816,並且該第二限制部位係包括有一個第二端部區域817。該第一及該第二限制部位係因此位於支撐構件812的相對端部處,並且將未限制部位界定於其間。該第一及該第二限制部位(或更加特別的是,第一及第二端部區域815及817)係被附加到該工件平面板件810,用以防止限制部位的運動。在這個實施例之中,該可撓曲的彎曲支撐構件812係被部份地限制在一個包覆層814之內,其在這個實施例之中是其中的石英纖維為在商業上所銷售者的鋁的包覆層。該鋁的包覆層已經從該可撓曲彎曲支撐構件812的中間區域816處以化學的方式移除,使得石英纖維之暴露出來的中間區域816係會接觸到該工件24之基材側邊28的外部排除區域。In this respect, referring to Figure 24, the support device 804 is more detailed. The ground is displayed. In this embodiment, the support device 804 includes a flexible curved support member 812, which in this embodiment includes an optical quartz fiber, however, alternatively, other A type of flexible support member is substituted. In this embodiment, the flexible curved support member 812 includes spaced apart first and second restraining portions, and an unrestricted portion extends between the restricted portions in a curved path. . More particularly, in this embodiment, the first restriction portion includes a first end region 815, the unrestricted portion includes an intermediate region 816, and the second restriction portion includes a Second end region 817. The first and second restriction locations are thus located at opposite ends of the support member 812 and define an unrestricted portion therebetween. The first and second restriction locations (or more particularly, the first and second end regions 815 and 817) are attached to the workpiece planar panel 810 to prevent movement of the restriction. In this embodiment, the flexible curved support member 812 is partially confined within a cladding layer 814, which in this embodiment is a commercially available quartz fiber. A coating of aluminum. The aluminum cladding has been chemically removed from the intermediate region 816 of the flexible curved support member 812 such that the exposed intermediate region 816 of the quartz fibers contacts the substrate side 28 of the workpiece 24. External exclusion area.

在這個實施例之中,該系統800係包括有第一及第二限制器,該等限制器係被建構成用以限制住處於分隔關係之中的第一及第二限制部位(亦即,第一及第二端部區域 815及817),用以致使未限制部位(亦即,該中間區域816)在一個介於其間的彎曲路徑中延伸。更加特別的是,在這個實施例之中,第一及第二限制器係包括有第一及第二外殼818及819。在該第一端部區域815處,包圍著可撓曲彎曲支撐構件812的鋁的包覆層814係被緊密地固定在該第一外殼818之內,該第一外殼在這個實施例之中係包括一個不銹鋼管件。同樣的,在這個實施例之中,在該第二端部區域817處,包圍著可撓曲彎曲支撐構件812的鋁的包覆層814係緊密地被固定在該第二外殼819之內,該第二外殼係包括有一個相似的不銹鋼管件。該等外殼818及819係被穩固地固定在該工件平面板件810之內。In this embodiment, the system 800 includes first and second limiters configured to limit the first and second restriction locations in the separation relationship (ie, First and second end regions 815 and 817) are used to cause the unrestricted portion (i.e., the intermediate portion 816) to extend in a curved path therebetween. More particularly, in this embodiment, the first and second limiters include first and second outer casings 818 and 819. At the first end region 815, an aluminum cladding 814 surrounding the flexible curved support member 812 is tightly secured within the first outer casing 818, which in this embodiment It consists of a stainless steel pipe. Similarly, in this embodiment, at the second end region 817, the aluminum cladding 814 surrounding the flexible curved support member 812 is tightly secured within the second outer casing 819. The second outer casing includes a similar stainless steel tubular member. The outer casings 818 and 819 are securely secured within the workpiece planar panel 810.

參照圖22及圖24,在這個實施例之中,每個外殼818及819係相似於圖22所示的外殼718,並且係同樣地被固定到該工件平面板件。然而,在這個實施例之中,第一及第二限制器(該等限制器在這個實施例之中係包括有外殼818及819)係被建構成用以限制第一及第二限制部位(亦即,第一及第二端部區域815及817),用以導致該未限制部位(該中間區域816)可以沿著該彎曲路徑從第一限制部位處朝向該工件24向上且向內地延伸到一個與其接觸的一個區域,並且從該接觸區域處向下且向外地延伸到該第二限制部位處。更加特別的是,可撓曲彎曲支撐構件812並沒有直線地朝向該工件向內且向上延伸,反而是該可撓曲彎曲支撐構件812會從在第一端部區域815的外殼818及包覆層814處突伸出來,並且沿著一個差不多為 拱形的路徑朝向該工件24向內且向上延伸,使得該中間區域816的一個中心係會接觸並且支撐該工件24之基材側邊28的外部排除區域。該可撓曲彎曲支撐構件812係因此會繼續從其中心處沿著該拱形路徑向下且向外地延伸到該第二端部區域817處,其中,包圍端部區域817的包覆層814係被固定在該外殼819之內。在接觸該工件的中間區域的中心處,一個與未限制部位正切的切線(亦即,一個中間區域816之在其中心處的切線)實質上係平行於一個對於該工件24在接觸區域的附近之一個外部邊緣的切線。在這個實施例之中,如同圖22中所示的實施例,可撓曲彎曲支撐構件812之拱形路徑的角度係與垂直方向成大約35o ,然而再次地,這個角度是因為方便而被選擇者,用以將對於一個現存之工件平面板件的修改減少到最小的程度。替代的方式是,可以用其他的角度及構造來取代。在示範性的實施例之中,該可撓曲支撐構件812可以在外殼818內從第一端部區域815處延伸一個10到20 mm的長度,並且可以在該包覆層814之內延伸了另一個在該外殼之外之20到40 mm的長度,並且可以在其一個中央區域處(可撓曲支撐構件812係在該處接觸工件24)延伸另一個未包覆之2到4 mm的長度。該可撓曲支撐構件可以接著在該包覆層814之內朝向該第二端部區域817延伸另一個20到40 mm的長度,並且在該外殼819之內延伸另一個10到22 mm的長度。該可撓曲支撐構件可直徑可以例如是0.5到2 mm。如果希望的話,替代的方式是 ,可以用其他的長度及直徑來取代。如果有需要的話,在另外的相似實施例之中,像是那些其中可撓曲支撐構件812包括有一種像是藍寶石之材料的實施例之中,該包覆層814可以被整個省略。Referring to Figures 22 and 24, in this embodiment, each of the outer casings 818 and 819 is similar to the outer casing 718 shown in Figure 22 and is similarly secured to the workpiece planar panel. However, in this embodiment, the first and second limiters (which in this embodiment include housings 818 and 819) are constructed to limit the first and second restriction locations ( That is, the first and second end regions 815 and 817) are configured to cause the unrestricted portion (the intermediate region 816) to extend upwardly and inwardly from the first restriction portion toward the workpiece 24 along the curved path. To an area in contact therewith and extending downwardly and outwardly from the contact area to the second restriction. More particularly, the flexible curved support member 812 does not extend linearly inwardly and upwardly toward the workpiece, but rather the flexible curved support member 812 will be wrapped from the outer casing 818 and the first end region 815. The layer 814 protrudes and extends inwardly and upwardly toward the workpiece 24 along a substantially arcuate path such that a center of the intermediate portion 816 contacts and supports the substrate side 28 of the workpiece 24. External exclusion area. The flexible curved support member 812 will thus continue to extend downwardly and outwardly from the center thereof along the arcuate path to the second end region 817, wherein the cladding 814 surrounding the end region 817 It is fixed within the outer casing 819. At the center of the intermediate region in contact with the workpiece, a tangent to the unconstrained portion (i.e., a tangent at the center of an intermediate region 816) is substantially parallel to a vicinity of the contact region for the workpiece 24. The tangent of an outer edge. In this embodiment, as with the embodiment shown in Fig. 22, the angle of the arcuate path of the flexible curved support member 812 is about 35 o from the vertical, however again, this angle is facilitated by The selector is used to minimize modifications to an existing workpiece flat panel. Alternatively, it can be replaced with other angles and configurations. In an exemplary embodiment, the flexible support member 812 can extend a length of 10 to 20 mm from the first end region 815 within the outer casing 818 and can extend within the cladding 814 The other is 20 to 40 mm in length outside the casing and can extend another uncovered 2 to 4 mm at one of its central regions (where the flexible support member 812 is in contact with the workpiece 24) length. The flexible support member can then extend within the cladding layer 814 toward the second end region 817 for another length of 20 to 40 mm and extend another length of 10 to 22 mm within the outer casing 819. . The flexible support member may have a diameter of, for example, 0.5 to 2 mm. If desired, the alternative is to replace it with other lengths and diameters. If desired, among other similar embodiments, such as those in which the flexible support member 812 includes a material such as sapphire, the cover layer 814 can be omitted entirely.

在這個實施例之中,複數個支撐裝置802係包括有至少四個此種相似於支撐裝置804的支撐裝置,用以在該等支撐裝置破掉、不然就是故障的情況中提供適度的穩定支撐。更加特別的是,在這個實施例之中,該等複數個支撐裝置802係包括有20個此種支撐裝置。然而,如果有需要的話,替代的方式是,可以用其他數目的支撐裝置來替代。In this embodiment, the plurality of support devices 802 includes at least four such support devices similar to the support device 804 for providing moderately stable support in the event that the support devices are broken or otherwise faulty. . More particularly, in this embodiment, the plurality of support devices 802 includes 20 such support devices. However, if desired, an alternative would be to replace it with a different number of support devices.

參照圖25到圖30,一個根據本發明之第十四實施例之用於支撐工件24的支撐系統係整體地以元件參考符號900顯示出來。在這個實施例之中,該支撐系統900係包括有整體地以元件參考符號902顯示出來的複數個可撓曲支撐構件。在目前的實施例之中,每個可撓曲支撐構件902都包括有一個可以彈性地與該工件銜接的可撓曲纖維。更加特別的是,如同在先前的實施例之中,在目前的實施例中,每個可撓曲纖維皆包括有一個石英光學纖維,然而如同本文其他部份所討論的,替代的方式是,藍寶石或其他類型的纖維,或者更加概括地說,可以用其他類型的可撓曲支撐構件來替代。較佳地,對於目前實施例的用途來說,替代性的可撓曲支撐構件應該是非污染的、可撓曲的、低質量的、並且應該持有適度的溫度存活能力,用以 抵抗本文所描述的熱循環。Referring to Figures 25 through 30, a support system for supporting a workpiece 24 in accordance with a fourteenth embodiment of the present invention is generally indicated by reference numeral 900. In this embodiment, the support system 900 includes a plurality of flexible support members that are integrally shown with reference numeral 902. In the current embodiment, each of the flexible support members 902 includes a flexible fiber that is resiliently engageable with the workpiece. More particularly, as in the prior embodiments, in the current embodiment, each of the flexible fibers includes a quartz optical fiber, although as discussed elsewhere herein, an alternative is Sapphire or other types of fibers, or more generally, other types of flexible support members can be substituted. Preferably, for the use of the current embodiment, the alternative flexible support member should be non-contaminating, flexible, low quality, and should hold moderate temperature survivability for Resist the thermal cycle described herein.

參照圖28及圖30,一個示範性的可撓曲支撐構件係整體地以元件參考符號903被顯示在圖28之中。 了較容易顯示,只有該示範性的支撐構件被描述,應該要了解的是其餘的可撓曲支撐構件902係為類似者。在這個實施例之中,該可撓曲支撐構件903具有一個限制部位904及一個未限制部位906。更加特別的是,在目前的實施例之中,該可撓曲支撐構件903包括有在其一個端部處的限制部位904,並且該未限制部位906係從該限制部位904處朝向該工件24的一個中央區域向內延伸。Referring to Figures 28 and 30, an exemplary flexible support member is shown generally in Figure 28 with reference numeral 903. It is easier to display, only the exemplary support member is described, it should be understood that the remaining flexible support members 902 are similar. In this embodiment, the flexible support member 903 has a restriction portion 904 and an unrestricted portion 906. More particularly, in the present embodiment, the flexible support member 903 includes a restriction 904 at one end thereof, and the unrestricted portion 906 is directed from the restriction portion 904 toward the workpiece 24. A central area extends inward.

在這個實施例之中,該可撓曲支撐構件903係包括有一個纖維907。在目前的實施例之中,該可撓曲纖維907的一部份長度係被包覆在一個外部包覆層908之內,在這個實施例中外部包覆層908是一個在商業上與纖維907一起銷售的鋁的塗層。在這個方面, 了要防止鋁的包覆接觸並且污染到工件,在目前的實施例之中,該鋁的塗層已經以化學的方式從可撓曲支撐構件903之未限制部位906的一段長度處移除。更加特別的是,在這個實施例之中,該可撓曲支撐構件903具有一個65 mm的長度,並且該鋁的包覆或塗層已經從其長度最靠進內部的40 mm處以化學的方式去除。In this embodiment, the flexible support member 903 includes a fiber 907. In the present embodiment, a portion of the length of the flexible fiber 907 is wrapped within an outer cladding 908, which in this embodiment is a commercially available fiber. A coating of aluminum sold together in 907. In this aspect, to prevent the coating of aluminum from contacting and contaminating the workpiece, in the present embodiment, the coating of aluminum has been chemically derived from a length of the unrestricted portion 906 of the flexible support member 903. Removed. More particularly, in this embodiment, the flexible support member 903 has a length of 65 mm and the coating or coating of the aluminum has been chemically placed from its length up to 40 mm inside. Remove.

替代的方式是,可以根據該可撓曲支撐構件902所需要的可撓性及質量用其他適合的長度來替代。舉例來說,在一些實施例之中(像是其中支撐構件包括有藍寶石的實 施例)鋁的塗層或包覆層可以整個被省略。Alternatively, other suitable lengths may be substituted depending on the flexibility and quality desired for the flexible support member 902. For example, in some embodiments (such as where the support member includes sapphire The coating or coating of aluminum can be omitted entirely.

在這個實施例之中,該支撐系統900係包括有至少一個用於限制該限制部位904的限制器。在目前的實施例之中,該至少一個限制器係包括有一個工件平面板件920。更加特別的是,在這個實施例之中,該至少一個限制器係包括有複數個被界定在工件平面板件之內的夾具,用於夾持複數個可撓曲支撐構件902的限制部位。再更加特別的是,在目前的實施例之中,每個限制部位904係被限制或鎖定在位於一個夾具內的適當位置之中,該夾具係整體地以元件參考符號910顯示在圖28及圖30之中。在這個實施例之中,該夾具910包括有一個上方夾持構件912以及一個下方夾持構件914。更加特別的是,在目前的實施例之中,該上方夾持構件912具有一個大體上平面的下方表面,並且該下方夾持構件914具有一個被界定在其上方表面之中的V形凹槽或通道916,其係沿著該下方夾持構件914的長度延伸。該V形凹槽916的尺寸係被選擇而使得該可撓曲支撐構件903可以被插入該V形凹槽916之中,使得當該上方夾持構件912的下方表面被壓扺著下方夾持構件914的上方表面時,外部的包覆層908會被緊貼地固定在該上方夾持構件912的下方表面與V形凹槽916的二個表面之間,藉以防止可撓曲支撐構件903被固定在該夾具910之內的部位會相對於該夾具進行運動。該夾具910係被定向成使得該V形凹槽916(以及因此該可撓曲支撐構件903)會徑向而向內地指向工件24的中心。In this embodiment, the support system 900 includes at least one limiter for restricting the restriction site 904. In the current embodiment, the at least one limiter includes a workpiece planar panel 920. More particularly, in this embodiment, the at least one restrictor includes a plurality of clamps defined within the workpiece planar panel for holding the restriction of the plurality of flexible support members 902. Still more particularly, in the present embodiment, each of the restraining portions 904 is constrained or locked in position within a fixture that is generally indicated by reference numeral 910 in FIG. In Figure 30. In this embodiment, the clamp 910 includes an upper clamping member 912 and a lower clamping member 914. More particularly, in the present embodiment, the upper clamping member 912 has a generally planar lower surface and the lower clamping member 914 has a V-shaped groove defined in its upper surface. Or a channel 916 that extends along the length of the lower clamping member 914. The size of the V-shaped groove 916 is selected such that the flexible support member 903 can be inserted into the V-shaped groove 916 such that when the lower surface of the upper clamping member 912 is pressed against the lower surface When the upper surface of the member 914 is applied, the outer covering layer 908 is tightly fixed between the lower surface of the upper holding member 912 and the two surfaces of the V-shaped groove 916, thereby preventing the flexible supporting member 903. The portion that is fixed within the jig 910 moves relative to the jig. The clamp 910 is oriented such that the V-shaped groove 916 (and thus the flexible support member 903) will be directed radially inward toward the center of the workpiece 24.

在這個實施例之中,複數個像是以元件參考符號910表示的夾具係被一個上方夾持環以及一個帶有複數個被界定於其中之V形凹槽的下方夾持環所限定住,該上方夾持環係有效率地作用如同複數個上方夾持構件912,並且該下方夾持環係有效率地作用如同複數個下方夾持構件914。上方及下方夾持環係徑向地向內延伸一個大約10 mm的長度,其中,每個可撓曲支撐構件902的限制部位904係被緊貼地固定在該長度之中。替代的方式是,如果有需要的話可以用其他的限制長度來替代。In this embodiment, the plurality of images are represented by element reference symbol 910 and are bounded by an upper clamping ring and a lower clamping ring with a plurality of V-shaped grooves defined therein. The upper clamping ring acts as a plurality of upper clamping members 912, and the lower clamping ring acts as a plurality of lower clamping members 914. The upper and lower clamping rings extend radially inwardly for a length of about 10 mm, wherein the restraining portion 904 of each flexible support member 902 is snugly secured within the length. Alternatively, other limited lengths can be substituted if needed.

參照圖28及圖29,在這個實施例之中,該工件平面板件920界定了在其一個內部表面中的複數個工件支撐開孔,並且該限制部位904係被附加到該工件平面板件920,且該等未限制部位906係朝向該工件向內地延伸穿過該等工件支撐開孔。更加特別的是,在這個實施例之中,每個工件支撐開孔係包括有一個垂直狹長孔918,其係被界定在該工件平面板件920的內部表面之中。因此,在這個實施例之中,可撓曲支撐構件903的未限制部位906係朝向工件24的中心向內突伸而穿過該垂直狹長孔918,該狹長孔係容許可撓曲支撐構件903的未限制部位906可以相對於該工件平面板件920向尚且向下移動。在這個實施例之中,每個未限制部位906的一個內部尖端924係會向內通過該該工件24的一個外部邊緣922,使得該內部尖端924會位於與工件的中心相距的一個比工件的外部邊緣922更小的徑向距離處。更加特別的是,在這個實施例之 中,該內部尖端924係比工件的外部邊緣922更向內延伸大約10mm,然而,替代的方式是可以用其他的長度關係來取代。因此,在這個實施例之中,支撐構件903的銜接部位係包括有一個沿著介於該限制部位904與該內部尖端924之間之未限制部位906的中間點926。該未限制部位906(或更加特別的是沿著該部位的中間點926)係可以與工件的外部邊緣922相銜接,用以接觸並且支撐工件。Referring to Figures 28 and 29, in this embodiment, the workpiece planar panel 920 defines a plurality of workpiece support apertures in one of its interior surfaces, and the restriction portion 904 is attached to the workpiece planar panel 920, and the unrestricted portions 906 extend inwardly through the workpiece support openings toward the workpiece. More particularly, in this embodiment, each of the workpiece support apertures includes a vertical elongated aperture 918 that is defined within the interior surface of the workpiece planar panel 920. Thus, in this embodiment, the unrestricted portion 906 of the flexible support member 903 projects inwardly toward the center of the workpiece 24 through the vertical elongated aperture 918, which allows the flexible support member 903 The unrestricted portion 906 can be moved still downward relative to the workpiece planar panel 920. In this embodiment, an inner tip 924 of each unrestricted portion 906 will pass inwardly through an outer edge 922 of the workpiece 24 such that the inner tip 924 will be located at a distance from the center of the workpiece. The outer edge 922 is at a smaller radial distance. More specifically, in this embodiment The inner tip 924 extends approximately 10 mm more inward than the outer edge 922 of the workpiece, however, alternative ways may be substituted with other length relationships. Thus, in this embodiment, the engagement portion of the support member 903 includes an intermediate point 926 along the unconstrained portion 906 between the restriction portion 904 and the inner tip 924. The unrestricted portion 906 (or more particularly the intermediate point 926 along the portion) can engage the outer edge 922 of the workpiece to contact and support the workpiece.

在這個實施例之中,該工件平面板件920係被建構成用以在一個大體上水平的方向中限制住該限制部位904,用以致使該未限制部位906在向下彎為時,可以朝向該工件24的中心區域大體上水平而向內地延伸。在這個方面中,由於工件的外部邊緣922在該中間點926上施加之重力的向下作用力,該可撓曲支撐構件903會向下彎曲,使得可撓曲支撐構件的內部尖端924可以在該工件24的平面下方被垂直地位移一個“下垂位移”的距離。In this embodiment, the workpiece planar panel 920 is configured to confine the restriction portion 904 in a generally horizontal orientation to cause the unrestricted portion 906 to be bent downwardly. The central region facing the workpiece 24 extends generally horizontally and inwardly. In this aspect, due to the downward force of gravity exerted by the outer edge 922 of the workpiece on the intermediate point 926, the flexible support member 903 can be bent downward such that the inner tip 924 of the flexible support member can The plane below the workpiece 24 is vertically displaced by a "sag displacement" distance.

仍然參照圖28及圖29,在這個實施例之中,複數個可撓曲支撐構件902包括有至少20個長形的可撓曲支撐構件。更加特別的是,該等複數個支撐構件902係包括有至少50個此種支撐構件。又更加特別的是,在這個實施例之中,該等複數個支撐構件902係包括有大約60個相似於示範性支撐構件903示範性的可撓曲支撐構件,其等係被配置在一個內部工件支撐開孔周圍的大約等距的間隔處,該內部工件支撐開孔係被界定在該工件平面板件920之中。在這個實施例之中(其中,該工件是一個半導體晶 圓,並且該可撓曲支撐構件902為如上文所述的光學纖維),“下垂的位移”典型上為從大約3 mm到大約5 mm的範圍。因此,在目前的實施例之中,該等未限制部位906係以向下相對於該工件之平面的一個小於大約10度的角度與該工件24的外部邊緣922銜接。替代的方式是,根據待處理的特殊應用,其他的下垂距離及角度可以是可容忍的或是所希求的。Still referring to Figures 28 and 29, in this embodiment, the plurality of flexible support members 902 includes at least 20 elongate flexible support members. More particularly, the plurality of support members 902 includes at least 50 such support members. Still more particularly, in this embodiment, the plurality of support members 902 includes about 60 exemplary flexible support members similar to the exemplary support members 903, which are arranged in an interior. At approximately equidistant spacing around the workpiece support apertures, the inner workpiece support apertures are defined within the workpiece planar panel 920. In this embodiment (wherein the workpiece is a semiconductor crystal Round, and the flexible support member 902 is an optical fiber as described above, the "sagging displacement" is typically in the range of from about 3 mm to about 5 mm. Thus, in the present embodiment, the unrestricted portions 906 are engaged with the outer edge 922 of the workpiece 24 at an angle of less than about 10 degrees downward relative to the plane of the workpiece. Alternatively, depending on the particular application to be processed, other sag distances and angles may be tolerable or desirable.

典型地,在圖28及圖29中所示的說明性實施例之中,每個可撓曲支撐構件902皆具有一個介於大約0.4 mm至2 mm之間的直徑。然而,如與其他實施例一起討論的,替代的方式是,可以用其他的尺寸來取代,選擇用於一個給定應用的長度及直徑來提供所希求的彈性及快速反應時間。Typically, in the illustrative embodiment shown in Figures 28 and 29, each of the flexible support members 902 has a diameter of between about 0.4 mm and 2 mm. However, as discussed with other embodiments, alternatives may be substituted with other dimensions, selected for the length and diameter of a given application to provide the desired flexibility and fast response time.

參照圖20及圖28,如果需要的話,圖28中所示之可撓曲支撐構件903的內部尖端924可以被提供有一個相似於圖20之彎曲端部區域620的彎曲的端部區域,用以在以熱引動的壓彎或震動期間將抵抗工件24之基材側邊28的可能的刮傷效果減少到最小的程度。Referring to Figures 20 and 28, if desired, the inner tip 924 of the flexible support member 903 shown in Figure 28 can be provided with a curved end region similar to the curved end region 620 of Figure 20, The possible scratching effect against the substrate side 28 of the workpiece 24 during minimization of the heat-induced bending or shock is minimized.

參照圖31,一個根據本發明之第十五實施例之用於支撐一個工件的支撐系統係整體地以元件參考符號1000顯示。在這個實施例之中,該支撐系統1000係被建構成用以壓制住該工件的震動,或者更加特別的是用以壓制住至少該工件之至少一種自然的震動模式,其在這個實施例之中係包括有工件的第一及第二自然震動模式。為了要達成 這個目的,該支撐系統1000係包括有整體地以元件參考符號1002及1004顯示的第一及第二支撐裝置。該等支撐裝置1002及1004係分別包括有各自的可撓曲支撐構件1006及1008,該等支撐構件在這個實施例之中包括有石英纖維。更加特別的是,在這個實施例之中,該等石英纖維為光學的石英纖維,其係已經從該鋁的包覆層處以化學的方式被去除,並且具有大約100微米的直徑。Referring to Figure 31, a support system for supporting a workpiece in accordance with a fifteenth embodiment of the present invention is generally indicated by reference numeral 1000. In this embodiment, the support system 1000 is constructed to suppress the vibration of the workpiece, or more particularly to suppress at least one natural vibration mode of the workpiece, in this embodiment. The middle system includes first and second natural vibration modes of the workpiece. In order to achieve For this purpose, the support system 1000 includes first and second support means integrally shown with reference numerals 1002 and 1004. The support devices 1002 and 1004 each include respective flexible support members 1006 and 1008, which in this embodiment include quartz fibers. More particularly, in this embodiment, the quartz fibers are optical quartz fibers that have been chemically removed from the cladding of the aluminum and have a diameter of about 100 microns.

替代的方式是,如同與先前的實施例一起討論的,其他類型的纖維,或更概括地說,可以用其他適合類型的可撓曲支撐構件來替代。Alternatively, as with the previous embodiments, other types of fibers, or more generally, other suitable types of flexible support members may be substituted.

在這個實施例之中,每個可撓曲支撐構件1006及1008皆具有第一及第二分隔限制部位,且一個未限制部位係在一個彎曲路徑之中延伸於該等限制部位之間。更加特別的是,可撓曲支撐構件1006的第一及第二限制部位分別包括有一個固定端部1010以及一個可調整端部1014,並且同樣地,可撓曲支撐構件1008的第一及第二限制部位分別包括有一個固定端部1012及一個可調整端部1016。該可撓曲支撐構件1006的固定端部1010係被接附到一個在該工件附近、在該工件24之平面正下方的工件平面板件1018,並且同樣的,該可撓曲支撐構件1008的固定端部1012係被接附到在該工件之平面正下方的工件平面板件。因此,該工件平面板件1018係作用如同一個用於限制可撓曲支撐構件1006及1008之固定端部1010及1012的第一限制器。In this embodiment, each of the flexible support members 1006 and 1008 has first and second separation restriction portions, and an unrestricted portion extends between the restriction portions in a curved path. More particularly, the first and second restriction portions of the flexible support member 1006 include a fixed end portion 1010 and an adjustable end portion 1014, respectively, and likewise, the first and the first of the flexible support member 1008 The two restriction portions respectively include a fixed end portion 1012 and an adjustable end portion 1016. The fixed end 1010 of the flexible support member 1006 is attached to a workpiece planar panel 1018 adjacent the workpiece, directly below the plane of the workpiece 24, and likewise, the flexible support member 1008 The fixed end 1012 is attached to a workpiece planar panel directly below the plane of the workpiece. Thus, the workpiece planar panel 1018 acts as a first restrictor for limiting the fixed ends 1010 and 1012 of the flexible support members 1006 and 1008.

在這個實施例之中,每個支撐構件的未限制部位係會沿著介於限制部位之間的彎曲路徑延伸,使得在一個與該工件接觸之區域處的未限制部位的一個切線會朝向該工件的中心徑向地向內延伸。舉例來說,在這個實施例之中,該可撓曲支撐構件1006係從其固定端部1010處(在一個如圖31所示的逆時針方向中)沿著一個大體上環圈形路徑延伸,並且接觸且支撐著在該工件之外部排除區域附近的工件24之基材側邊28。該可撓曲支撐構件1006係繼續沿著該環圈形路徑從與該工件的接觸點處、環繞(逆時針方向)並且經由一個被界定在該工件平面板件之下方表面中的開孔1020重新進入工件平面板件1018。可撓曲支撐構件1006的可調整端部1014係會進入並且被緊固在一個長度控制器1022之內,該長度控制器係作用如同一個第二限制器,用於限制可撓曲支撐構件1006的可調整端部1014。In this embodiment, the unrestricted portion of each of the support members extends along a curved path between the restriction portions such that a tangent to the unrestricted portion at a region in contact with the workpiece faces the The center of the workpiece extends radially inward. For example, in this embodiment, the flexible support member 1006 extends from its fixed end 1010 (in a counterclockwise direction as shown in FIG. 31) along a generally annular path. And contacting and supporting the substrate side 28 of the workpiece 24 adjacent the outer exclusion zone of the workpiece. The flexible support member 1006 continues along the loop path from a point of contact with the workpiece, circumferentially (counterclockwise) and via an opening 1020 defined in a lower surface of the workpiece planar panel Re-enter the workpiece planar panel 1018. The adjustable end 1014 of the flexible support member 1006 will enter and be secured within a length controller 1022 that acts as a second limiter for limiting the flexible support member 1006 Adjustable end 1014.

在這個方面,在目前的實施例之中,每個可撓曲支撐構件1006及1008之第一及第二限制部位的至少其中之一係以可以縮回的方式被限制住。因此,在目前的實施例之中,該系統1000係包括有長度控制器1022,在這個實施例之中該長度控制器包括有一個機械縮回器,並且係以可縮回的方式限制可撓曲支撐構件1006的第二限制部位(亦即,可調整的端部1014)。該縮回器係被建構成用以縮回該第二限制部位,用以有效地縮短未限制部位,並且相反地,其係被建構成用以延伸該第二限制部位,用以有效 地加長該未限制部位。在目前的實施例之中,該長度控制器1022係可以從一個該工件平面板件1018係被座落於其中的處理容室外部而被遙控,用以加長或縮短該可撓曲支撐構件1006的有效長度,藉以改變環圈狀路徑的形狀及尺寸,其中,該可撓曲支撐構件係在該路徑中延伸以彈性地支撐該工件。In this aspect, in the current embodiment, at least one of the first and second restriction portions of each of the flexible support members 1006 and 1008 is restrained in a retractable manner. Thus, in the present embodiment, the system 1000 includes a length controller 1022 that, in this embodiment, includes a mechanical retractor and is retractably restrained in a retractable manner. The second restriction portion of the curved support member 1006 (ie, the adjustable end portion 1014). The retractor is configured to retract the second restriction portion for effectively shortening the unrestricted portion, and conversely, is configured to extend the second restriction portion for effective The ground is lengthened by the unrestricted portion. In the present embodiment, the length controller 1022 can be remotely controlled from one of the processing chambers in which the workpiece planar panel 1018 is seated to lengthen or shorten the flexible support member 1006. The effective length is thereby varied to change the shape and size of the loop-like path, wherein the flexible support member extends in the path to elastically support the workpiece.

同樣地,在這個實施例中,該可撓曲支撐構件1008係從其固定端部1012處沿著一個大體上環圈形的路徑(在一個如圖31所示的逆時針方向中)延伸、接觸在工件之外部排除區域附近之該工件24的裝置側邊26,並且繼續(順時針)沿著該環圈形路徑以再次經由一個被界定在該工件平面板件之一個上方表面中的開孔1024進入該工件平面板件1018。與長度控制器1022相同的是,可撓曲支撐構件1008的可調整端部1016係進入並且被緊固在一個長度控制器1026之中。在這個實施例之中,該長度控制器1026係可以從一個該工件平面板件1018係被座落於其中的處理容室外部而被遙控,用以縮回該可撓曲支撐構件1008之一個足夠的長度用以將該可撓曲支撐構件1008完全地移出一個被界定在工件24之平面上方的一個圓柱形體積之外,藉以容許該工件24可以被降低而進入要被該第一可撓曲支撐裝置1002支撐著的位置之中,或是當熱處理完成時被舉回而離開定位。 了要熱處理,該長度控制器1026可以被遙控以延伸該可撓曲支撐構件1008的一個足夠的長度,使得可撓曲支撐構件1008的環圈形路徑 係會接觸在該外部排除區域處之工件的裝置側邊26。Likewise, in this embodiment, the flexible support member 1008 extends from its fixed end 1012 along a generally toroidal path (in a counterclockwise direction as shown in Figure 31). The device side 26 of the workpiece 24 is disposed adjacent the outer portion of the workpiece and continues (clockwise) along the loop path to again pass through an opening defined in an upper surface of the workpiece planar panel 1024 enters the workpiece planar panel 1018. As with length controller 1022, adjustable end 1016 of flexible support member 1008 is accessed and secured within a length controller 1026. In this embodiment, the length controller 1026 can be remotely controlled from a processing compartment outside which the workpiece planar panel 1018 is seated to retract one of the flexible support members 1008. Sufficient length to completely move the flexible support member 1008 out of a cylindrical volume defined above the plane of the workpiece 24, thereby allowing the workpiece 24 to be lowered into the first flexible The position in which the curved support device 1002 is supported, or lifted back when the heat treatment is completed, leaves the position. To heat treat, the length controller 1026 can be remotely controlled to extend a sufficient length of the flexible support member 1008 such that the loop path of the deflectable support member 1008 The device side 26 of the workpiece at the outer exclusion zone is contacted.

大體地說,可撓曲支撐構件1006及1008之大體為環圈形路徑的有效直徑係取決於為了該等支撐構件所選擇的材料,以及取決於預期之工件運動的範圍。舉例來說,對於某些實施例來說,該等大體為環圈形路徑的有效直徑可以是介於大約30 mm與100 mm之間,然而替代的方式是,可以用其他的有效直徑來代替。In general, the effective diameter of the generally flexible path of the flexible support members 1006 and 1008 depends on the material selected for the support members and on the range of motion of the workpiece desired. For example, for some embodiments, the effective diameter of the generally looped path may be between about 30 mm and 100 mm, but instead, other effective diameters may be substituted .

在這個實施例之中, 了要支撐工件24用於此種熱處理,該支撐系統1000係包括有複數個與支撐裝置1002相同的下方支撐裝置,以及複數個與支撐裝置1004相同的上方支撐裝置,其等係被配置在該工件平面板件1018之周圍的各種間隔處。因此,該系統1000係包括有第一及第二複數的長形可撓曲支撐構件。該第一複數個可撓曲支撐構件的未限制部位可以與該工件的下方表面相銜接,並且該第二複數個可撓曲支撐構件的未限制部位可以與工件24的上方表相銜接。In this embodiment, the workpiece 24 is to be supported for such heat treatment. The support system 1000 includes a plurality of lower support devices identical to the support device 1002, and a plurality of upper support devices identical to the support device 1004. They are arranged at various intervals around the workpiece planar panel 1018. Accordingly, the system 1000 includes elongated first and second plurality of flexible support members. The unconstrained portions of the first plurality of flexible support members can engage the lower surface of the workpiece, and the unconstrained portions of the second plurality of flexible support members can engage the upper surface of the workpiece 24.

該等上方支撐裝置係作用以在本文所描述的熱循環期間強化穩定性並且壓制工件24的震動。舉例來說,在這個實施例之中,第一及第二支撐裝置1002及1004係會合作以至少部份地壓制住工件24之第一及第二自然震動模式。The upper support means act to enhance stability during the thermal cycle described herein and to compress the vibration of the workpiece 24. For example, in this embodiment, the first and second support devices 1002 and 1004 cooperate to at least partially compress the first and second natural vibration modes of the workpiece 24.

如果需要的話,替代的方式是,對於某些應用來說,可以省略該支撐裝置1004及其他的相似支撐裝置,留下要被支撐裝置1002以及其他下方支撐裝置支撐的工件。Alternatively, if desired, the support device 1004 and other similar support devices may be omitted, leaving the workpiece to be supported by the support device 1002 and other underlying support devices.

參照圖32及圖33,一個根據本發明之一個第十六實施例之用於支撐一個工件的支撐系統係整體地以元件參考符號1200顯示出來。在這個實施例之中,該支撐系統1200係包括有一個側向支撐構件,其係被建構成用以側向地支撐該工件24。更加特別的是,在這個實施例之中,該系統1200係包括有一個側向支撐裝置1202,用於將彈性的側向支撐作用提供到該工件24。在這個方面,將可以察知的是在某些情況中,例如由於反應閃光而非均勻地加熱該工件的裝置側邊26,或是由於例如像是那些之前在本文中描述的各種(垂直)支撐裝置之非均勻的反應,本文所描述的熱循環可能會傾向於產生非對稱的工件的熱壓彎或震動運動。此種非對稱的運動可以包括有工件24相對於一個工件平面板件(例如,像是那些以元件參考符號1204所顯示者)的側向運動。在目前的實施例(其中該工件24是一個半導體晶圓)之中,如果此種側向運動產生了一個介於該工件24與該工件平面板件1204(其在這個實施例之中為鋁)之間的一個碰撞,此種碰撞的效應可能會包括有微粒的污染或是其他對於該工件24的物理性傷害。Referring to Figures 32 and 33, a support system for supporting a workpiece in accordance with a sixteenth embodiment of the present invention is generally indicated by reference numeral 1200. In this embodiment, the support system 1200 includes a lateral support member that is configured to laterally support the workpiece 24. More particularly, in this embodiment, the system 1200 includes a lateral support device 1202 for providing resilient lateral support to the workpiece 24. In this respect, it will be appreciated that in some cases, for example, due to the reaction flash rather than uniformly heating the device side 26 of the workpiece, or due to, for example, various (vertical) supports such as those previously described herein. The non-uniform reaction of the device, the thermal cycling described herein may tend to produce hot bending or vibrational motion of the asymmetric workpiece. Such asymmetrical motion may include lateral movement of the workpiece 24 relative to a workpiece planar panel (e.g., such as those shown by the component reference numeral 1204). In the present embodiment (where the workpiece 24 is a semiconductor wafer), if such lateral motion creates a workpiece 24 and the workpiece planar plate member 1204 (which in this embodiment is aluminum) A collision between the effects of such collisions may include contamination of the particles or other physical damage to the workpiece 24.

據此,為了防止此等碰撞,在這個實施例之中,該側向支撐裝置1202係包括有一個被建構成用以側向地支撐該工件24的側向支撐構件1206。更加特別的是,在這個實施例之中,該支撐構件1206係包括有複數個側向支撐構件(例如,像是那些以元件參考符號1208、1210及1212顯示在圖33之中者),該等支撐構件係位於相對於 該工件24之一個外部邊緣之各自的位置處。在這個實施例之中,每個支撐構件係可以彈性地與該工件的外部邊緣相銜接。更加特別的是,在這個實施例之中,每個側向支撐構件皆包括有一個可撓曲纖維,其在目前的實施例之中係包括有一個光學纖維。再更加特別的是,在目前的實施例之中,每個支撐構件皆包括有一個石英纖維。替代的方式是,如同與先前的實施例一起討論的,可以用藍寶石纖維、其他纖維、其他類型的可撓曲支撐構件、或更加概括地說、其他類型的側向支撐構件來替代。Accordingly, to prevent such collisions, in this embodiment, the lateral support device 1202 includes a lateral support member 1206 that is configured to laterally support the workpiece 24. More particularly, in this embodiment, the support member 1206 includes a plurality of lateral support members (e.g., such as those shown in Figure 33 with reference numerals 1208, 1210, and 1212). The support member is located relative to The respective outer edges of the workpiece 24 are at respective locations. In this embodiment, each of the support members is resiliently engageable with the outer edge of the workpiece. More particularly, in this embodiment, each of the lateral support members includes a flexible fiber which, in the present embodiment, includes an optical fiber. Even more particularly, in the current embodiment, each support member includes a quartz fiber. Alternatively, as discussed with the previous embodiments, sapphire fibers, other fibers, other types of flexible support members, or, more generally, other types of lateral support members may be substituted.

回來參照圖32,在這個實施例之中,該側向支撐構件1206係被連接到一個定位器1214,該定位器在這個實施例之中係包括有一個鋁的塊體。該定位器1214係被連接到該工件平面板件1204,並且延伸得夠遠而進入被界定在該工件平面板件之中的工件支撐開孔,用以將該側向支撐構件1206定位在接近工件24的外部邊緣處。在目前的實施例之中,該側向支撐構件1206及相似的支撐構件(其在這個實施例之中係包括有可撓曲纖維)係被定位在一個實質上正向於該工件24之一個平面的角度處。Referring back to Figure 32, in this embodiment, the lateral support members 1206 are coupled to a locator 1214, which in this embodiment includes an aluminum block. The locator 1214 is coupled to the workpiece planar panel 1204 and extends far enough to enter a workpiece support aperture defined in the workpiece planar panel for positioning the lateral support member 1206 in proximity. At the outer edge of the workpiece 24. In the present embodiment, the lateral support members 1206 and similar support members (which in this embodiment include flexible fibers) are positioned in a substantially positive one of the workpieces 24. The angle of the plane.

在這個實施例(其中,該側向支撐構件係包括有光學的石英纖維s)之中,通常是與光學的石英纖維一起販售之鋁的塗層或包覆層已經以化學的方式被除去,使得至少該等側向支撐構件1208、1210及1212之可能會進入於該工件24之接觸中的部位為暴露出來的石英,並且因此為非污染者。在目前的實施例之中,在熱處理期間,該工件 係會接觸該等石英纖維的大部份長度(除了被緊固於該定位器1214之內的長度片段之外),並且因此,在這個實施例之中,鋁的塗層或是包覆係已經從該等纖維的整個長度處被移除(如果有需要的話,該鋁的包覆可以沿著被固定在定位器1214之內的長度片段被保留)。替代的方式是,其他一般不會與任何此種鋁的塗層一起販售的材料(例如,像是藍寶石)可以被用來取代石英纖維。In this embodiment, wherein the lateral support members comprise optical quartz fibers s, the coating or coating of aluminum, typically sold with optical quartz fibers, has been chemically removed. At least the portions of the lateral support members 1208, 1210, and 1212 that may enter the contact of the workpiece 24 are exposed quartz and are therefore non-polluters. In the current embodiment, the workpiece is during the heat treatment Will contact most of the length of the quartz fibers (except for the length segments that are fastened within the locator 1214), and thus, in this embodiment, the aluminum coating or cladding system The entire length of the fibers has been removed (if desired, the aluminum cladding can be retained along the length segments that are secured within the locator 1214). Alternatively, other materials that are generally not sold with any such aluminum coating (eg, such as sapphire) can be used in place of quartz fibers.

在相似於圖32及圖33所示的示範性實施例之中,該側向支撐構件以及其他相似的側向支撐構件可以具有大約20至40 mm的長度(不包括被緊固在該定位器1214之內的部位),並且可以具有例如是0.5至2 mm的直徑。替代的方式是,對於一個給定的應用來說,可以用其他適合的尺寸來取代。In an exemplary embodiment similar to that shown in Figures 32 and 33, the lateral support members and other similar lateral support members may have a length of about 20 to 40 mm (not including being fastened to the positioner) The portion within 1214) and may have a diameter of, for example, 0.5 to 2 mm. Alternatively, for a given application, it can be replaced with other suitable sizes.

在這個實施例之中,該支撐系統1200係包括有複數個相似於側向支撐裝置1202的側向支撐裝置,該等側向支撐裝置係被定位在被界定在該工件平面板件1204之中之工件支撐開孔周圍的各種間隔處。舉例來說,該系統1200可以包括有介於4個與20個之間的此種側向支撐裝置,雖然替代的方式是,可以用其他的數目來替代。此等側向支撐裝置可以與垂直的支撐裝置(例如,像是本文所描述之任何其他的支撐裝置)一起使用。In this embodiment, the support system 1200 includes a plurality of lateral support devices similar to the lateral support devices 1202, the lateral support devices being positioned within the workpiece planar panel 1204. The workpiece supports various spaces around the opening. For example, the system 1200 can include between 4 and 20 such lateral support devices, although alternatives can be substituted with other numbers. These lateral support devices can be used with vertical support devices such as, for example, any of the other support devices described herein.

替代的方式是,在另一個示範性實施例之中,可以提供一個有點類似於圖32及圖33所示之支撐系統的側向支撐系統,其中,一個或多個剛性的支撐構件可以取代側向 支撐構件1206。舉例來說,一個或多個剛性的石英栓釘可以替代該可撓曲支撐構件。此等實施例係足以控制工件的側向運動,然而,根據當工件與該或該等支撐構件碰撞時前者相對於後者的側向動量,此等實施例也可能會產生對於工件24的傷害或工件的破裂。Alternatively, in another exemplary embodiment, a lateral support system somewhat similar to the support system illustrated in Figures 32 and 33 may be provided, wherein one or more rigid support members may be substituted for the side to Support member 1206. For example, one or more rigid quartz pegs can be substituted for the flexible support member. Such embodiments are sufficient to control the lateral movement of the workpiece, however, depending on the lateral momentum of the former relative to the latter when the workpiece collides with the or the support members, such embodiments may also cause damage to the workpiece 24 or The rupture of the workpiece.

如果需要的話,可以藉著一個單一的支撐裝置來提供此種側向及垂直的支撐,而不是提供個別的側向及垂直支撐裝置。舉例來說,參照圖21、圖22及圖34,一個根據本發明之第十七實施例之用於支撐一個工件的支撐系統係整體地以元件參考符號1300顯示於圖34之中。在這個實施例之中,該支撐系統1300係包括有一個支撐構件,該支撐構件係作用如同一個垂直及側向支撐構件,並且係包括有一個可以與工件24之一個下方表面相銜接的可移動垂直支撐銜接部位、以及一個可以與該工件之一個外部邊緣相銜接的側向支撐銜接部位。更加特別的是,在這個實施例之中,支撐構件係包括有一個支撐裝置1302,其係為在圖22中顯示之支撐裝置702的一個修正版本。在這個實施例之中,該支撐裝置1302的可移動垂直支撐銜接部位係包括有包括包覆層714及外殼718的可撓曲支撐構件712,而該可撓曲支撐構件係在外殼之內被固定到該工件平面板件710。該支撐裝置1302的側向支撐銜接部位係包括有一個第二可撓曲支撐構件1304。在這個實施例之中,第二可撓曲支撐構件1304係相似於第一可撓曲支撐構件712,並且因此也包括有一個光學的石英纖維,然而,如 果有需要的話,如同先前在本文中所討論的替代方式是,可以用其他類型的纖維、或更加概括地其他類型的可撓曲支撐構件來取代。藉著它們之可撓曲性的功效,在目前的實施例之中,該等垂直及側向支撐銜接部位係可以彈性地與該工件相銜接。Instead of providing individual lateral and vertical support, a single support device can be provided if desired. For example, referring to Figures 21, 22 and 34, a support system for supporting a workpiece in accordance with a seventeenth embodiment of the present invention is shown generally in Figure 34 by reference numeral 1300. In this embodiment, the support system 1300 includes a support member that functions as a vertical and lateral support member and includes a movable member that is engageable with a lower surface of the workpiece 24. The vertical support engagement portion and a lateral support engagement portion engageable with an outer edge of the workpiece. More particularly, in this embodiment, the support member includes a support device 1302 that is a modified version of the support device 702 shown in FIG. In this embodiment, the movable vertical support engagement portion of the support device 1302 includes a flexible support member 712 including a cover layer 714 and a housing 718, and the flexible support member is within the outer casing Fixed to the workpiece planar panel 710. The lateral support engagement portion of the support device 1302 includes a second flexible support member 1304. In this embodiment, the second flexible support member 1304 is similar to the first flexible support member 712 and thus also includes an optical quartz fiber, however, such as If desired, as previously discussed herein, alternatives may be substituted with other types of fibers, or more generally other types of flexible support members. By virtue of their flexible nature, in the present embodiment, the vertical and lateral support engaging portions are resiliently engageable with the workpiece.

在這個實施例之中,該第二可撓曲支撐構件1304具有一個小於該第一可撓曲支撐構件712的直徑。更加特別的是,在這個實施例之中,該第二可撓曲支撐構件1304具有一個大約為0.5 mm的直徑,然而該第一可撓曲支撐構件712具有一個大約為4 mm的直徑。然而,如果有需要的話,替代的方式是,可以用其他適當的尺寸來代替。In this embodiment, the second flexible support member 1304 has a smaller diameter than the first flexible support member 712. More particularly, in this embodiment, the second flexible support member 1304 has a diameter of approximately 0.5 mm, however the first flexible support member 712 has a diameter of approximately 4 mm. However, if desired, the alternative is to replace it with other suitable sizes.

在這個實施例之中,該第二可撓曲支撐構件1304係包括有一個外部包覆層1306,其在這個實施例之中是一個在商業上與光學的石英纖維一起銷售的鋁的塗層。在這個實施例之中,該鋁的塗層已經以化學的方式從至少該第二可撓曲支撐構件1304可能會進入與該工件24接觸之中的部位處去除,用以工件避免工件的污染。在這個實施例及相似的示範性實施例之中,該第二可撓曲支撐構件1304在該包覆層1306之內延伸了一個10至20 mm的長度,並且在該包覆層之外未包覆地延伸了另一個20至40 mm的長度,然而如果有需要的話,替代的方式是,可以用其他適當的長度來替代。In this embodiment, the second flexible support member 1304 includes an outer cladding 1306, which in this embodiment is a coating of aluminum commercially sold with optical quartz fibers. . In this embodiment, the coating of aluminum has been chemically removed from at least the portion of the second flexible support member 1304 that may come into contact with the workpiece 24 for the workpiece to avoid contamination of the workpiece. . In this and similar exemplary embodiments, the second flexible support member 1304 extends a length of 10 to 20 mm within the cladding layer 1306 and is not outside the cladding layer. The cover extends another length of 20 to 40 mm, although alternatives can be substituted with other suitable lengths if desired.

在目前的實施例之中,該第二可撓曲支撐構件1304係被一個軸環1308固定到該第一可撓曲支撐構件712。該軸 環1308可以包括有例如是不銹鋼或是鈦,然而替代的方式是可以用其他的適當材料來代替。In the present embodiment, the second flexible support member 1304 is secured to the first flexible support member 712 by a collar 1308. The axis Ring 1308 may comprise, for example, stainless steel or titanium, although alternatives may be substituted with other suitable materials.

然而,替代的方式是,該第二可撓曲支撐構件1304可以用任何其他適合的方式被連接到該支撐裝置1302的其他部位。Alternatively, however, the second flexible support member 1304 can be coupled to other portions of the support device 1302 in any other suitable manner.

如果需要的話,該支撐裝置1302可以包括有一個縮回器1310,其係被連接到第二可撓曲支撐構件1304的一個部位來將該第二可撓曲支撐構件1304朝向工件平面板件710縮回,用以容許工件24的插入或移除。替代的方式是,該第二可撓曲支撐構件1304可以被預先加熱並且被朝向工件平面板件710被預先彎回,用以避免對於此種縮回器的需求。或者,如同另一個替代的方式,如果有需要的話,此種預先加熱及預先彎曲可以與一個在一個給定實施例之中的縮回器組合在一起。If desired, the support device 1302 can include a retractor 1310 that is coupled to a portion of the second flexible support member 1304 to direct the second flexible support member 1304 toward the workpiece planar panel 710. Retracted to allow insertion or removal of the workpiece 24. Alternatively, the second flexible support member 1304 can be preheated and pre-bent back toward the workpiece planar panel 710 to avoid the need for such a retractor. Alternatively, as another alternative, such preheating and pre-bending may be combined with a retractor in a given embodiment, if desired.

在目前的實施例之中,如同藉著在圖21之中顯示的實施例,該支撐系統1300包括有複數個相似於圖34所示之支撐裝置1302的支撐裝置,該等支撐裝置係被配置在圍繞著被界定於工件平面板件710之中之內部工件支撐開孔周圍的間隔處。因此,該系統1300係包括有複數個支撐構件,包括有可以與該工件銜接的複數個垂直及側向支撐銜接部位。In the present embodiment, as with the embodiment shown in Figure 21, the support system 1300 includes a plurality of support devices similar to the support device 1302 shown in Figure 34, which are configured At intervals around the inner workpiece support opening defined in the workpiece planar panel 710. Accordingly, the system 1300 includes a plurality of support members including a plurality of vertical and lateral support engagement locations engageable with the workpiece.

參照圖35,如同一個進一步例子之組合的側向及垂直支撐裝置,一個根據本發明之第十八實施例之用於支撐一個工件的支撐系統係整體地以元件參考符號1400顯示。 在這個實施例之中,該支撐系統1400係包括有一個支撐裝置1402。在目前的實施例之中,該支撐裝置1402包括有一個可撓曲支撐構件1404,其在這個實施例之中係包括有一個光學的石英纖維。替代的方式是,如同與先前的實施例一起討論的,可以用其他類型的纖維、或更加概括地,其他類型的可撓曲支撐構件來替代。Referring to Fig. 35, a support system for supporting a workpiece in accordance with an eighteenth embodiment of the present invention is generally indicated by reference numeral 1400, as a combination of lateral and vertical support means of a further example. In this embodiment, the support system 1400 includes a support device 1402. In the present embodiment, the support device 1402 includes a flexible support member 1404 that, in this embodiment, includes an optical quartz fiber. Alternatively, as with the previous embodiments, other types of fibers, or more generally, other types of flexible support members may be substituted.

在這個實施例之中,該可撓曲支撐構件1404係包括有第一及第二分隔限制部位,且一個未限制部位係在一個彎曲路徑之中延伸於該等限制部位之間。更加特別的是,在這個實施例之中,第一及第二限制部位係包括有一個固定端部1406以及一個可調整端部1408。一個工件平面板件1410係作用如同一個用於限制該第一限制部位(亦即,固定端部1406)的第一限制器,其在這個實施例之中係在工件24的附近區域(該工件24之平面的正下方)中被接附到工件平面板件1410。In this embodiment, the flexible support member 1404 includes first and second separation limiting portions, and an unrestricted portion extends between the restricted portions in a curved path. More particularly, in this embodiment, the first and second restriction portions include a fixed end portion 1406 and an adjustable end portion 1408. A workpiece planar plate member 1410 acts as a first limiter for limiting the first restriction portion (i.e., the fixed end portion 1406), which in this embodiment is in the vicinity of the workpiece 24 (the workpiece The workpiece is directly attached to the workpiece plane plate 1410.

在這個實施例之中,該支撐構件1404的未限制部位延伸係沿著介於限制部位之間的彎曲路徑延伸,用以形成一個從工件24之一個平面下方的第一限制部位處延伸並且在該工件的一個下方表面處接觸該工件的第一大體上環圈形路徑片段1412、一個在該工件24的一個外部邊緣與工件平面板件1410之一個內部邊緣之間延伸的第二大體上環圈形路徑片段1414、以及一個在工件的平面上方並且在該工件的一個上方表面處接觸該工件、接觸在第二限制部位處結束之彎曲路徑的第三大體上環圈形路徑片段1416。 更加特別的是,在這個實施例之中,該可撓曲支撐構件1404係從其固定端部1406沿著該第一大體上環圈形路徑片段1412(在一個如圖35所示的順時針方向中)在該工件的平面下方延伸、接觸並且支撐在該工件之外部排除區域附近之該工件24的基材側邊28。該可撓曲支撐構件1404接著係繼續延伸(順時針)通過被界定在工件24的外部邊緣與工件平面板件1410之一個最內部部位之間的第二大體上環圈形路徑片段。該可撓曲支撐構件1404接著繼續延伸(順時針)通過延伸在該工件之平面上方的第三大體上環圈形路徑片段1416、經由一個被界定在工件平面板件之上方表面中的一個開孔1422再次進入該工件平面板件。可撓曲支撐構件1404的可調整端部1408係進入並且被固定在一個第二限制器之中,該第二限制器在這個實施例之中係包括有一個長度控制器1424,其係相似於顯示於圖31之中所示的長度控制器1022及1026。因此,由於該可撓曲支撐構件1404的構造、及尤其是該等大體上環圈形路徑片段1412、1414及1416,該可撓曲支撐構件1404係提供了對於工件24的垂直及側向的彈性支撐。除此之外,可撓曲支撐構件1404的這種構造也會部份地壓制該工件24的第一及第二自然震動模式。In this embodiment, the unrestricted portion of the support member 1404 extends along a curved path between the restriction portions to form a first restriction from below a plane of the workpiece 24 and A first substantially loop-shaped path segment 1412 contacting the workpiece at a lower surface of the workpiece, a second substantially annular shape extending between an outer edge of the workpiece 24 and an inner edge of the workpiece planar panel 1410 A path segment 1414, and a third substantially loop-shaped path segment 1416 that contacts the workpiece at a plane above the workpiece and at an upper surface of the workpiece, contacting a curved path that ends at the second restriction. More particularly, in this embodiment, the flexible support member 1404 is from its fixed end 1406 along the first generally looped path segment 1412 (in a clockwise direction as shown in Figure 35). Medium) extending below the plane of the workpiece, contacting and supporting the substrate side 28 of the workpiece 24 adjacent the outer exclusion region of the workpiece. The flexible support member 1404 then continues to extend (clockwise) through a second substantially loop-shaped path segment defined between the outer edge of the workpiece 24 and an innermost portion of the workpiece planar panel 1410. The flexible support member 1404 then continues to extend (clockwise) through a third generally loop-shaped path segment 1416 extending over the plane of the workpiece, via an opening defined in the upper surface of the workpiece planar panel The 1422 re-enters the workpiece flat panel. The adjustable end 1408 of the flexible support member 1404 is accessed and secured within a second limiter, which in this embodiment includes a length controller 1424 that is similar to The length controllers 1022 and 1026 shown in FIG. 31 are shown. Thus, due to the configuration of the flexible support member 1404, and particularly the substantially annular path segments 1412, 1414, and 1416, the flexible support member 1404 provides vertical and lateral resiliency to the workpiece 24. support. In addition to this, such a configuration of the flexible support member 1404 will also partially compress the first and second natural vibration modes of the workpiece 24.

在目前的實施例之中,該第二限制器(或尤其是長度控制器1424)係作用如同一個被建構成用以縮回該第二限制部位的縮回器,用以將第三大體上環圈形路徑片段1416移出一個被界定在該工件之上方表面上方的體積。在這個 方面,該長度控制器1424可以從一個工件平面板件1410被座落於其中的處理容室外側被遙控,用以加長或縮短該可撓曲支撐構件1404的有效長度,藉以改變環圈形路徑的形狀及尺寸,其中,其係延伸以彈性地支撐該工件。尤其是,對於一些應用來說,所希求的是能夠充分地縮回該可撓曲支撐構件1404,使得該第三環圈形路徑片段可以完全從該工件24之平面上方的體積抽出,用以容許該工件可以被插入用於熱處理的容室或是當熱處理完成時移走。In the present embodiment, the second limiter (or particularly the length controller 1424) acts as a retractor configured to retract the second restriction to provide a third substantially annular The loop path segment 1416 removes a volume defined above the upper surface of the workpiece. at this In one aspect, the length controller 1424 can be remotely controlled from the side of the processing chamber in which the workpiece planar panel 1410 is seated to lengthen or shorten the effective length of the flexible support member 1404 to thereby change the loop path. The shape and size, wherein the system extends to elastically support the workpiece. In particular, for some applications, it is desirable to be able to fully retract the flexible support member 1404 such that the third loop-shaped path segment can be fully withdrawn from the volume above the plane of the workpiece 24 for The workpiece is allowed to be inserted into the chamber for heat treatment or removed when the heat treatment is completed.

在這個實施例之中,該支撐系統1400包括有複數個與支撐裝置1402相同的支撐裝置,該等支撐裝置係被配置在被界定在該工件平面板件1410中之工件支撐開孔之周圍的各種間隔處。舉例來說,在相似於圖35所示之實施例的示範性實施例之中,該支撐系統可以包括有介於4到20個的此種支撐裝置,並且此等裝置的可撓曲支撐構件可以具有在0.5至2 mm之範圍內的直徑以及在50 mm至300 mm之範圍內的長度。如果有需要的話,替代的方式是,可以用其他數目的支撐裝置可以可撓曲支撐構件的尺寸來取代。In this embodiment, the support system 1400 includes a plurality of support devices identical to the support device 1402, the support devices being disposed about the workpiece support opening defined in the workpiece planar plate member 1410. Various intervals. For example, in an exemplary embodiment similar to the embodiment illustrated in Figure 35, the support system can include between 4 and 20 such support devices, and the flexible support members of such devices It may have a diameter in the range of 0.5 to 2 mm and a length in the range of 50 mm to 300 mm. Alternatively, if desired, other numbers of support means can be substituted for the size of the flexible support member.

如果需要的話,由可撓曲支撐構件1404所界定之第二大體上環圈造型的路徑片段1414可以被接附到該工件平面板件1410,用於額外的穩定性。替代的方式是,如果有需要的話,可以省略此種接附。If desired, a second substantially loop-shaped path segment 1414 defined by the flexible support member 1404 can be attached to the workpiece planar panel 1410 for additional stability. Alternatively, this attachment can be omitted if needed.

參照圖4及圖36,根據本發明之第十九實施例的一個熱處理容室係整體地以元件參考符號1500被顯示在圖36 之中。該容室1500係相似於被顯示在圖4之中的容室60,但是已經被修改為包括有一個附加的石英窗口1510,該石英窗口係被裝設在該工件24之裝置側邊26上方並且緊密地接近該裝置側邊。更加特別的是,在這個實施例之中,該窗口1510係被裝設在該工件24之平面上方大約1 cm處,然而替代的方式是其可以被裝設在距離該工件的其他距離處,且對於目前的實施例來說,一個介於1到10 cm的距離是較佳的。該窗口1510較佳地係被冷卻,並且在這個實施例之中是以氣體冷卻,然而替代的方式是可以根據用於加熱或是測量用途的傳送所需要之窗口的波長、藉著水或其他適當的液體來冷卻。當該工件24經歷到藉由一種如上文所描述之加熱閃光所導致的熱壓彎時,介於該工件24與該窗口1510之間的處理氣體的壓力係提供了對於工件之垂直運動的阻力。因此,如先前在本文中所描述地與支撐構件之可移動銜接部位結合在一起的是,在該工件24與該窗口1510之間的附加氣體壓力係用來對抗該工件24的垂直運動,藉以能夠容易地將該工件之質量中心的運動減少到最小的程度。而一個附帶的優點是,在閃光發生之前將工件加熱到一個中間溫度的預先加熱階段期間,該窗口1510亦傾向於減少來自於工件之裝置側邊的熱對流損失,產生改良的溫度非均勻性。Referring to Figures 4 and 36, a heat treatment chamber according to a nineteenth embodiment of the present invention is integrally shown with reference numeral 1500 in Figure 36. Among them. The chamber 1500 is similar to the chamber 60 shown in FIG. 4, but has been modified to include an additional quartz window 1510 that is mounted over the device side 26 of the workpiece 24. And close to the side of the device. More particularly, in this embodiment, the window 1510 is mounted about 1 cm above the plane of the workpiece 24, but alternatively it can be mounted at other distances from the workpiece. And for the current embodiment, a distance of between 1 and 10 cm is preferred. The window 1510 is preferably cooled and, in this embodiment, cooled by gas, but alternatively the wavelength of the window required by the transfer for heating or measuring purposes, by water or other Proper liquid to cool. When the workpiece 24 experiences a hot press caused by a heated flash as described above, the pressure of the process gas between the workpiece 24 and the window 1510 provides resistance to vertical movement of the workpiece. . Thus, as previously described herein, in conjunction with the movable engagement portion of the support member, additional gas pressure between the workpiece 24 and the window 1510 is used to counteract vertical movement of the workpiece 24, thereby The movement of the center of mass of the workpiece can be easily reduced to a minimum. An additional advantage is that during the preheating phase of heating the workpiece to an intermediate temperature prior to flashing, the window 1510 also tends to reduce heat convection losses from the sides of the device, resulting in improved temperature non-uniformity. .

替代的方式是,相似的效果可以在沒有窗口1510的情況之下、藉著將現有的窗口65移動到更接近該工件24的裝置側邊26處而獲致。Alternatively, a similar effect can be achieved by moving the existing window 65 to the side 26 of the device closer to the workpiece 24 without the window 1510.

如果需要的話,該等複數個支撐構件之該等複數個可移動銜接部位可以包括有複數個各自之支撐栓釘之複數個光滑表面的尖端。If desired, the plurality of movable engagement locations of the plurality of support members can include a plurality of tips of a plurality of smooth surfaces of the respective support pegs.

舉例來說,參照圖37,一個根據本發明之第二十實施例的支撐裝置係整體地以元件參考符號1600表示。在這個實施例之中,該支撐裝置1600包括有一個具有一個光滑表面尖端1610的支撐構件1608。更加特別的是,在目前的實施例之中,該光滑表面的尖端1610球形的造型或是半球形,然而替代的方式是,可以用其他的光滑表面來替代。此等光滑表面的尖端係傾向於減少工件24的摩擦及刮傷。在這個方面,該支撐構件與該工件之下方表面之間的刮傷可能會導致非所希望的微粒污染,並且也可能會非所希望地使工件的下方表面變得粗糙。將摩擦作用力減小到最少的程度不僅對於從負載的位置點降低應力、用以減少或防止在介於支撐構件與工件之間之接觸點附近區域的局部應力及刮傷來說為所希求者,其對於在如本文所描述之熱處理期間降低工件所承受的總應力來說亦為所希求者。For example, referring to FIG. 37, a support device in accordance with a twentieth embodiment of the present invention is generally indicated by reference numeral 1600. In this embodiment, the support device 1600 includes a support member 1608 having a smooth surface tip 1610. More particularly, in the present embodiment, the pointed end 1610 of the smooth surface is spherical or hemispherical, but alternatively, other smooth surfaces may be substituted. The tips of such smooth surfaces tend to reduce friction and scratching of the workpiece 24. In this aspect, scratches between the support member and the lower surface of the workpiece may result in undesirable particulate contamination and may also undesirably roughen the underlying surface of the workpiece. Reducing the frictional force to a minimum is not only for reducing the stress from the position of the load, but also for reducing or preventing local stress and scratches in the vicinity of the contact point between the support member and the workpiece. It is also desirable for reducing the total stress experienced by the workpiece during the heat treatment as described herein.

在這個實施例之中,該支撐構件1608是以石英製造的,或者更加特別的是一種相似於那些在上文中與本發明的實施例所一起討論光學的石英纖維。再更加特別的是,在目前的實施例之中,該支撐構件1608之光滑表面的尖端1610係藉著使用雷射來熔化該支撐構件的尖端、藉以再該尖端冷卻時形成一種球體造型的尖端而形成的。已經被發 現到的是,此種方法會產生一種較一般的切割及拋光方法更為光滑的表面。In this embodiment, the support member 1608 is fabricated from quartz or, more particularly, a quartz fiber similar to those discussed above in connection with embodiments of the present invention. Still more particularly, in the present embodiment, the tip end 1610 of the smooth surface of the support member 1608 is formed by melting a tip of the support member by using a laser, thereby forming a spherical shaped tip when the tip is cooled. And formed. Has been sent It is now known that this method produces a smoother surface than the usual cutting and polishing methods.

參照圖16及圖37,在其中纖維係被包覆的實施例之中,例如,像是圖16所示之每個可撓曲支撐構件602之未限制部位606的鋁的包覆,該鋁的包覆較佳地是在雷射熔化以形成光滑表面的尖端1610之前就從該尖端處被去除。舉例來說,在形成光滑表面的尖端之前,該包覆可以用化學的方式從該纖維在該尖端附近中的一個2 mm長度處被去除。Referring to Figures 16 and 37, in an embodiment in which the fiber system is coated, for example, an aluminum coating such as the unrestricted portion 606 of each of the flexible support members 602 shown in Figure 16, the aluminum The cladding is preferably removed from the tip before the laser melts to form a smooth surface tip 1610. For example, the coating can be chemically removed from the fiber at a length of 2 mm in the vicinity of the tip prior to forming the tip of the smooth surface.

替代的方式是,該支撐構件1608可以用其他材料製造,例如,像是藍寶石或任何先前在本文中描述的材料。Alternatively, the support member 1608 can be fabricated from other materials, such as, for example, sapphire or any of the materials previously described herein.

或者,另一種替代方式是,該支撐構件1608可以包括有金屬。舉例來說,該支撐構件1608可以包括有一個包括有鎢的支撐栓釘,並且至少該支撐栓釘的尖端可以具有一個外部塗層,用以減少摩擦及刮傷。該外部塗層可以包括有例如是氮化鎢或是碳化鎢,然而也可以用其他類型的塗層來取代。或者,進一步的替代方式省略掉此等塗層。 了要在沒有塗層的情況下達到所希求的光滑表面的尖端1610,該支撐構件1608的尖端可以用一種相似於在本文中與石英支撐構件一起討論的方式被雷射熔化以形成一個球的形狀。替代的方式是,也可以用其他達成所希求之光滑表面尖端1610的方式來替代。Alternatively, as an alternative, the support member 1608 can comprise a metal. For example, the support member 1608 can include a support stud that includes tungsten, and at least the tip of the support stud can have an outer coating to reduce friction and scratches. The outer coating may comprise, for example, tungsten nitride or tungsten carbide, although other types of coatings may be substituted. Alternatively, further alternatives omit such coatings. To reach the desired smooth surface tip 1610 without a coating, the tip of the support member 1608 can be laser melted to form a ball in a manner similar to that discussed herein with the quartz support member. shape. Alternatively, other ways of achieving the desired smooth surface tip 1610 can be substituted.

此種光滑表面的支撐構件1608可以被使用在或取代支撐栓釘或是在本發明之其他實施例中的支撐構件。Such a smooth surface support member 1608 can be used in place of or in place of a support stud or a support member in other embodiments of the invention.

參照圖20及圖38,一個根據本發明一個第二十一實施例的支撐裝置係整體地以元件參考符號1700顯示在圖38之中。該支撐裝置1700係相似於圖20所示的實施例。然而,在這個實施例之中,一個修改的支撐構件1702並不會在工件的外部排除區域處銜接工件24,而是會在一個更向內的區域(亦即,在一個除了排除區域之外之距離該工件中心的較小徑向距離處)處銜接該工件。在這個實施例之中,該工件係被複數個相似的支撐構件所支撐著,該等支撐構件的可移動銜接部位係在各種角度間隔於距離該工件中心一個共同的徑向距離處銜接該工件的下方表面。Referring to Figures 20 and 38, a support apparatus in accordance with a twenty-first embodiment of the present invention is shown generally in Figure 38 by reference numeral 1700. The support device 1700 is similar to the embodiment shown in FIG. However, in this embodiment, a modified support member 1702 does not engage the workpiece 24 at the outer exclusion zone of the workpiece, but rather in a more inward region (i.e., in addition to the exclusion zone). The workpiece is joined at a small radial distance from the center of the workpiece. In this embodiment, the workpiece is supported by a plurality of similar support members, the movable engagement portions of the support members being joined to each other at various angular intervals from a common radial distance from the center of the workpiece. The lower surface.

在這個方面,支撐構件之可移動銜接部位銜接該工件的位置可以根據所考慮之特殊應用、所討論之支撐構件之可獲得的彈性或是軟性、以及在最小化晶圓之垂直發射與壓制從閃光產生之工件較大規模的震動模式之間所希求的平衡而改變。舉例來說,在一些實施例之中,該等支撐栓釘可以被定位在一個具晶圓之中心的平衡徑向距離處,使得熱壓彎會在平衡的徑向距離的外側處產生一個晶圓之外部部位的向下動量,其係傾向於平衡晶圓之中心區域的向上動量,使得晶圓不會將其自身從該等支撐栓釘處向上發射。如同一個說明性的例子,在一個實施例中,其中的工件包括有一個具有150 mm之半徑的矽的半導體晶圓,並且具有軸對稱的自然震動模式:頻率大約為113 Hz(模式1)、476 Hz(模式2)、以及1007 Hz(模式3),將用於支撐構件之可移動銜接部位之銜接的徑向距離r 設定成 等於大約104 mm,該實施例係將工件將其自身向上方發射的傾向減小到最小的程度。然而,這個定位亦傾向於激發晶圓的第二自然震動模式,而該模式係根據裝置側邊溫度激增的大小及快速的程度而可能傾向於傷害或甚至粉碎該工件。因此,雖然對於其中可移動銜接部位足夠“柔軟”(亦即,提供一個足夠低的抵抗作用力並且具有足夠大的運動範圍)以降低第二自然震動模式之刺激的一些應用來說是此種構造可以接受的,對於其中該可移動銜接部位為較不“柔軟”的實施例來說,此種構造可能是較為非需求者。在比較上,將可移動的銜接部位定位在該外部排除區域處典型上係傾向於產生較不刺激之較高規模的震動模式,但是也會產生工件外部排除區域以及該等支撐構件之可移動銜接部位的較大初使向下運動,而此係傾向於增加被應用在該工件與該等支撐構件之間的作用力,並且可能會使得工件的質量中心產生較大的垂直運動。對於許多應用來說,將支撐構件的銜接部位與該工件在一個徑向距離處(在將垂直發射減小到最小程度之平衡距離與外部排除區域之間的某處)銜接在一起將會是可以接受的。In this aspect, the position at which the movable engagement portion of the support member engages the workpiece can be based on the particular application being considered, the available elasticity or softness of the support member in question, and minimizing the vertical emission and suppression of the wafer. The balance between the large-scale vibration modes of the workpiece produced by the flash changes. For example, in some embodiments, the support studs can be positioned at an equilibrium radial distance from the center of the wafer such that the hot press bend produces a crystal at the outer side of the balanced radial distance. The downward momentum of the outer portion of the circle tends to balance the upward momentum of the central region of the wafer such that the wafer does not launch itself upward from the support studs. As an illustrative example, in one embodiment, the workpiece includes a semiconductor wafer having a radius of 150 mm and has an axisymmetric natural vibration mode: a frequency of approximately 113 Hz (mode 1), 476 Hz (mode 2), and 1007 Hz (mode 3), the radial distance r for the engagement of the movable engagement portion of the support member is set equal to about 104 mm. This embodiment places the workpiece upwardly above itself. The tendency to launch is reduced to a minimum. However, this positioning also tends to excite the second natural vibration mode of the wafer, which may tend to harm or even smash the workpiece depending on the magnitude and rapidity of the temperature rise of the side of the device. Thus, although for some applications where the movable engagement portion is sufficiently "soft" (i.e., provides a sufficiently low resistance and has a sufficiently large range of motion) to reduce the stimulation of the second natural vibration mode, The construction is acceptable, and for embodiments in which the movable engagement portion is less "soft", such a configuration may be less desirable. In comparison, positioning the movable engagement portion at the outer exclusion region tends to produce a less stimulating higher-scale vibration mode, but also produces an external exclusion region of the workpiece and the movable member. The larger initial position of the joint portion moves downward, and this tends to increase the force applied between the workpiece and the support members, and may cause a large vertical motion of the center of mass of the workpiece. For many applications, joining the joint of the support member to the workpiece at a radial distance (somewhere between the equilibrium distance that minimizes vertical emissions to the outer exclusion zone) will be acceptable.

在目前的實施例之中,該修改的支撐構件1702係以一種透明材料形成,用以將在該工件上的陰影效果減少到最小的程度。更加特別的是,在這個實施例之中,該透明材料是石英。替代的方式是,可以用其他材料來替代。在這個實施例之中,該修改之支撐構件1702的尺寸也被減小,用以進一步減少任何剩餘的陰影效果,並且亦用以減少 其質量。In the present embodiment, the modified support member 1702 is formed from a transparent material to minimize shadowing effects on the workpiece. More particularly, in this embodiment, the transparent material is quartz. Alternatively, other materials can be substituted. In this embodiment, the size of the modified support member 1702 is also reduced to further reduce any remaining shadow effects and also to reduce Its quality.

雖然熱“壓彎”及相關的震盪或是震動為在上文中與以上本發明之實施例一起描述之以熱引動運動的主要來源,替代的方式是,可以運用本發明的其他實施例來對付其他類型之以熱引動的運動。舉例來說,該以熱引動的運動可以包括有熱彎曲,並且該支撐系統可以被建構成用以支撐該工件,同時容許工件的熱彎曲。While thermal "bending" and associated oscillations or shocks are the primary source of thermal kinetic motion described above in connection with the above-described embodiments of the present invention, alternative embodiments may be utilized to address other embodiments of the present invention. Other types of heat-induced movements. For example, the thermally actuated motion can include thermal bending, and the support system can be constructed to support the workpiece while permitting thermal bending of the workpiece.

在這個方面,一項在最近提出的熱處理方法係牽涉到藉著機械式夾具、靜電或真空墊塊、或是同等的握持裝置穩固地將一個基材保持在一個階台處。一種連續的波動電磁輻射源係與聚焦的光學儀器一起使用,用以在該基材的一個上方表面上產生一個輻射線。一個平移機械裝置係接著被用來將該階台以及該輻射源相對於彼此移動,用以導致該輻射線會掃描橫越過該基材的上方表面。然而,使用機械式夾具或是其他此種握持裝置來穩固地將該基材保持在該階台處係防止了該基材之以熱引動的彎曲。在沒有此種夾持作用的情況下,該基材將傾向於沿著該輻射線產生熱的彎曲,以便於將其本身的內部應力減少到最小的程度。藉著防止基材彎曲,使用此種夾具或是緊握裝置係會導致在基材中之熱應力的增加,從而增加對於基材之傷害或是基材破裂的可能性。In this regard, a recently proposed heat treatment method involves firmly holding a substrate at a step by mechanical clamps, electrostatic or vacuum pads, or equivalent gripping means. A continuous wave of electromagnetic radiation is used with a focused optical instrument to create a radiant line on an upper surface of the substrate. A translational mechanism is then used to move the stage and the source of radiation relative to each other to cause the radiation to scan across the upper surface of the substrate. However, the use of a mechanical clamp or other such holding device to securely hold the substrate at the stage prevents hot-induced bending of the substrate. Without such clamping, the substrate will tend to create a hot bend along the radiant line in order to minimize its own internal stresses. By preventing the substrate from being bent, the use of such a jig or gripping device results in an increase in thermal stress in the substrate, thereby increasing the risk of damage to the substrate or the breakage of the substrate.

因此,根據本發明的另一個實施例,包含有可以移動以容許該工件進行以熱引動運動之可移動銜接部位的支撐構件(例如,像是在上文中與本發明之實施例一起描述的 支撐構件)可以替代在先前所提出之用於這種特殊熱處理方法的機械式夾具或是其他握持裝置。Thus, in accordance with another embodiment of the present invention, a support member is provided that includes a movable engagement portion that can be moved to permit the workpiece to undergo thermal kinetic motion (e.g., as described above in connection with embodiments of the present invention) The support member) can be substituted for the mechanical clamp or other holding device previously proposed for this particular heat treatment method.

舉例來說,回來參照圖13及圖14,可以提供像是圖13所示之支撐裝置402的支撐裝置,用以容許工件產生以熱引動的彎曲,藉以當工件被有效率地被輻射線掃描時減少在該工件中的內部應力。如果有需要的話,為了要保持工件的未加熱部位的平坦,直到其被輻射線加熱加熱為止,該控制器420可以被預先施以程式設計,用以將支撐構件404及壓制構件414保持在固定的位置之中,直到輻射線已經通過其中支撐構件404及壓制構件414係銜接該工件24的位置處為止,並且用以在此之後容許該工件24之以熱引動的彎曲。因此,工件24尚未被加熱之相對為“冷”的部位係被保持平坦,以用於後續藉著輻射線的加熱,而在同時,在該工件24中的應力係藉著容許該工件已經被加熱之部位產生以熱引動的運動而被減少到最小的程度。然而,替代的方式是,將可以察知到的是,雖然將該工件之未加熱部位保持平坦直到該部位已經被輻射線加熱為止可能是所希求者(以便於在該照射源與該工件被輻射線加熱的部位之間維持一個固定的角度及距離),在一些其中此種控制器420的預先程式設計可以被省略的應用之中其係可以被省略掉。更加概括地說,可以用其他類型之支撐構件的其他可移動銜接部位來替代。For example, referring back to Figures 13 and 14, a support device such as the support device 402 shown in Figure 13 can be provided to allow the workpiece to be thermally indexed so that the workpiece is efficiently scanned by radiation. Reduce internal stresses in the workpiece. If necessary, in order to keep the unheated portion of the workpiece flat until it is heated by the radiation, the controller 420 can be pre-programmed to hold the support member 404 and the pressing member 414 at a fixed position. Among the positions, until the radiation has passed through the position where the support member 404 and the pressing member 414 are engaged with the workpiece 24, and is used to allow the heat-induced bending of the workpiece 24 thereafter. Thus, the relatively "cold" portion of the workpiece 24 that has not been heated is held flat for subsequent heating by the radiation, while at the same time the stress in the workpiece 24 is allowed to be The heated portion is produced to the extent that it is minimized by heat-induced motion. Alternatively, however, it will be appreciated that although the unheated portion of the workpiece is held flat until the portion has been heated by the radiation, it may be desirable (in order to be irradiated at the source and the workpiece) A fixed angle and distance is maintained between the portions of the wire heating, and some of the applications in which the pre-programming of such a controller 420 can be omitted may be omitted. More generally, other movable engagement locations of other types of support members can be substituted.

替代的方式是,可以用其他類型之支撐構件的其他類型的殼移動銜接部位來替代。Alternatively, other types of shell moving engagement locations of other types of support members can be substituted.

將可以察知的是,在前述的實施例中,各種支撐系統係被建構成用以吸收來自於工件的動能。舉例來說,在上文描述的可撓曲支撐構件的實施例之中,當該工件的外部區域在熱壓彎期間一開始向下移動,藉以向下推動支撐構件的銜接部位並且因此彎曲該等支撐構件時,該工件的至少其中一些動能係至少暫時地被支撐構件吸收,並且被儲存成在其中的位能。It will be appreciated that in the foregoing embodiments, various support systems are constructed to absorb kinetic energy from the workpiece. For example, in the embodiment of the flexible support member described above, when the outer region of the workpiece begins to move downward during the hot bending, thereby pushing the engagement portion of the support member downward and thus bending When the support member is equal, at least some of the kinetic energy of the workpiece is at least temporarily absorbed by the support member and stored as potential energy therein.

回到參照圖4,也可以使用一種根據發明之進一步實施例之熱處理一個工件的方法,其較佳地是(雖然為非必要者)與本文所揭示之本發明的其他實施例一起使用。該方法係包括有在一段時間週期中照射該工件的一個表面,其中,該時間週期的持續時間係少於該工件的熱傳導時間並且係足以容許工件產生至少一些熱壓彎,用以將該表面加熱到一個大於大部份工件之溫度的所希望的溫度。更加特別的是,在這個實施例之中,該方法係包括有照射該工件的表面一段少於工件之熱傳導時間的第一時間週期,用以將該表面加熱到一個中間溫度,該中間溫度係大於大部份工件的溫度。該方法因此係包括有照射該工件的表面一段少於工件之熱傳導時間的第二時間週期,用以將該表面加熱到所希望的溫度。該第二時間週期係在一個第一時間週期之後的一個間隔之內開始進行,其係足以容許該工件產生至少一些熱壓彎。Referring back to Figure 4, a method of heat treating a workpiece in accordance with a further embodiment of the invention may also be used, preferably (although not necessarily) for use with other embodiments of the invention disclosed herein. The method includes a surface that illuminates the workpiece over a period of time, wherein the duration of the time period is less than the heat transfer time of the workpiece and is sufficient to allow the workpiece to produce at least some hot bends for the surface Heat to a desired temperature greater than the temperature of most of the workpiece. More particularly, in this embodiment, the method includes a first time period having a surface that illuminates the workpiece for less than a heat transfer time of the workpiece for heating the surface to an intermediate temperature, the intermediate temperature system Greater than the temperature of most workpieces. The method thus includes a second period of time that illuminates the surface of the workpiece for less than a thermal conduction time of the workpiece to heat the surface to a desired temperature. The second time period begins within an interval after a first time period that is sufficient to allow the workpiece to produce at least some hot bends.

又更加特別的是,在目前的實施例之中,該加熱裝置64(其在目前的實施例之中係包括有一個閃光)係被用來 在該第一時間週期及該第二時間週期期間照射工件24之裝置側邊26的表面。在這個實施例之中,工件24的熱傳導時間係在10到15毫秒的規模,第一時間週期係在1毫秒的規模,並且該第二時間週期也是在1毫秒的規模。在該第一時間週期(在第二時間週期開始進行之前)之後的間隔係在數毫秒的規模。Still more particularly, in the present embodiment, the heating device 64 (which includes a flash in the current embodiment) is used The surface of the device side 26 of the workpiece 24 is illuminated during the first time period and the second time period. In this embodiment, the heat transfer time of the workpiece 24 is on the scale of 10 to 15 milliseconds, the first time period is on the scale of 1 millisecond, and the second time period is also on the scale of 1 millisecond. The interval after the first time period (before the start of the second time period) is on the scale of a few milliseconds.

而且,在這個實施例之中,該照射系統(或更加特別的是,包括有閃光燈的加熱裝置64)係被建構成用來在第二時間週期期間將比在第一時間週期期間還要更多的輻射能賦予到該工件的表面,並且亦被建構成用以在第一時間週期的結束之後的數毫秒之內開始第二時間週期。因此,舉例來說,該加熱裝置64可以照射工件的裝置側邊26,用以在一個一毫秒的第一時間週期期間將大約10 J/cm2 的能量傳送到該裝置側邊,接著在後續之數毫秒的間隔期間沒有將能量傳送到該裝置側邊,並且然後在一個1毫秒的第二時間週期期間照射該裝置側邊,用以將大約20 J/cm2 的能量傳送到該裝置側邊。Moreover, in this embodiment, the illumination system (or more particularly, the heating device 64 including the flash lamp) is constructed to be used during the second time period more than during the first time period. A plurality of radiant energy is imparted to the surface of the workpiece and is also constructed to begin a second time period within a few milliseconds after the end of the first time period. Thus, for example, the heating device 64 can illuminate the device side 26 of the workpiece for transferring approximately 10 J/cm 2 of energy to the side of the device during a first time period of one millisecond, followed by No energy is delivered to the side of the device during the interval of a few milliseconds, and then the side of the device is illuminated during a second time period of 1 millisecond to transfer approximately 20 J/cm 2 of energy to the device side side.

在這個實施例之中,就在以加熱裝置64照射該裝置側邊26之前,該工件24係被預先加熱裝置62預先加熱,其係照射該基材側邊28以將該工件24預先加熱到一個中間溫度。這種預先加熱係以一個較工件之熱傳導時間更緩慢的速率發生,例如,像是100℃/s至400℃/s。該第一時間週期(在此期間該裝置側邊26係首先被加熱裝置64照射)係在一旦達到該中間溫度時就開始。In this embodiment, the workpiece 24 is preheated by the preheating device 62 prior to illuminating the device side 26 with the heating device 64, which illuminates the substrate side 28 to preheat the workpiece 24 to An intermediate temperature. This preheating occurs at a rate that is slower than the heat transfer time of the workpiece, for example, from 100 ° C / s to 400 ° C / s. The first time period during which the device side 26 is first illuminated by the heating device 64 begins when the intermediate temperature is reached.

如同在前文中已經注意到的,此等方法可以用來減少熱應力並且壓制在該工件中的震動。在這個實施例之中,在該裝置側邊26於持續時間為大約1毫秒的第一時間週期期間藉著該加熱裝置64的照射之後,該裝置側邊26係會在大約與該閃光(t=1ms)結束時,達到一個第一峰值溫度。在同時,該工件24才剛開始發生熱的壓彎,並且因此只會達到其最大熱壓彎振幅的一個相當小的比例。直到數毫秒之後才會達到該最大熱壓彎振幅,在此同時,該工件已經超出其平衡的形狀。大約在一毫秒之後,該工件24仍然是顯著地被壓彎,但是係正在以顯著的恢復速度朝向其平坦位置恢復。該加熱裝置64係在持續時間為大約1毫秒的第二時間週期期間使工件24的裝置側邊26遭受到一個第二照射閃光。介於第一段與第二段時間之間的間隔(亦即,介於第一與第二加熱閃光之間)係被選擇,使得從第二照射閃光產生的熱壓彎會在該工件已經從第一閃光被熱壓彎並且正在朝向其平坦位置處恢復時發生。因為該晶圓已經由於第一閃光而產生熱壓彎,從第二閃光產生之熱壓彎所製造出來之在該工件中的應力係被減少。從第二閃光產生的熱壓彎亦會在一個方向中作用,該方向係相反於當工件嘗試著朝向其平坦位置恢復時該工件所具有的恢復速度。據此,從第二閃光產生的熱壓彎係傾向於壓制來自於第一閃光的殘留震動。快速連續之二個此種閃光加熱階段的組合係容許了可以達成較高峰值的裝置側邊溫度,同時壓制住在該工件中的殘餘震動。As noted in the foregoing, these methods can be used to reduce thermal stress and suppress vibrations in the workpiece. In this embodiment, after the device side 26 is illuminated by the heating device 64 during a first time period of duration of about 1 millisecond, the device side 26 will be approximately with the flash (t At the end of =1 ms), a first peak temperature is reached. At the same time, the workpiece 24 is just beginning to undergo hot bending and therefore only reaches a relatively small proportion of its maximum hot bending amplitude. The maximum hot bending amplitude is not reached until a few milliseconds, while the workpiece has exceeded its balanced shape. After about one millisecond, the workpiece 24 is still significantly bent, but the system is recovering toward its flat position at a significant recovery speed. The heating device 64 subjects the device side 26 of the workpiece 24 to a second illumination flash during a second time period of duration of about 1 millisecond. The interval between the first segment and the second segment of time (ie, between the first and second heated flashes) is selected such that the hot press resulting from the second illumination flash will have been on the workpiece Occurs when the first flash is hot pressed and is recovering toward its flat position. Since the wafer has been hot-bent due to the first flash, the stress in the workpiece produced by the hot press generated by the second flash is reduced. The hot press resulting from the second flash also acts in one direction, which is opposite to the recovery speed of the workpiece as it attempts to recover toward its flat position. Accordingly, the hot press bending system generated from the second flash tends to suppress residual vibration from the first flash. The combination of two such flash heating stages in rapid succession allows the side temperature of the device to achieve a higher peak while suppressing residual vibrations in the workpiece.

替代的方式是,可以用其他的照射動力及持續期間來替代。Alternatively, other illumination energies and durations can be used instead.

舉例來說,在沒有以一系列的二個或更多個短暫分隔的照射閃光照射該裝置側邊26的情況下,該照射系統可以被建構成用以連續地輻射工件之裝置側邊的表面一段間隔,該間隔係短於工件的熱傳導時間並且係夠長以容許該工件的至少一些熱壓彎。更加特別的是,該加熱裝置64可以被操作以將該裝置側邊26暴露到一個連續的照射脈衝波,該脈衝波的持續期間係較工件的熱傳導時間短10到15毫秒,但是其係夠長以容許該工件的至少一些熱壓彎。此種脈衝波可以延長超過數毫秒,例如,像是大約6毫秒。如果需要的話,該照射系統可以被建構成用來在該間隔期間改變一個照射的強度。舉例來說,此係可以包括有例如在脈衝波之較後部份的持續時間期間比在脈衝波之較前部份的持續時間期間以一個較大的強度照射該表面。因此,該脈衝波可以被塑造成用來在脈衝波之較後部份的持續時間期間會比在脈衝波之較前部份的持續時間期間將更多的能量傳送到該工件的表面。For example, where the device side 26 is not illuminated with a series of two or more briefly separated illumination flashes, the illumination system can be constructed to continuously radiate the surface of the device side of the workpiece. The interval is shorter than the heat transfer time of the workpiece and is long enough to allow at least some of the workpiece to be hot pressed. More particularly, the heating device 64 can be operated to expose the device side 26 to a continuous illumination pulse having a duration that is 10 to 15 milliseconds shorter than the heat transfer time of the workpiece, but which is sufficient Long to allow at least some hot bending of the workpiece. Such a pulse wave can be extended by more than a few milliseconds, for example, like about 6 milliseconds. If desired, the illumination system can be constructed to vary the intensity of an illumination during the interval. For example, the system can include, for example, illuminating the surface with a greater intensity during the duration of the latter portion of the pulse wave than during the duration of the earlier portion of the pulse wave. Thus, the pulse wave can be shaped to transfer more energy to the surface of the workpiece during the duration of the latter portion of the pulse wave than during the duration of the earlier portion of the pulse wave.

進一步的替代方案Further alternatives

雖然在上文中已經描述了許多具體的實施例及替代方案,替代的方式是可以提供本文所揭示之各種概念及特徵的其他組合。舉例來說,雖然使用像是光學石英纖維的可撓曲支撐構件已經在根本上與被動式機械支撐系統一起被描述,替代的方式是,此種可撓曲支撐構件也可以與主動 式支撐系統以起被提供,例如,像是那些顯示於圖6至圖14之中者。在這種情況之中,複數個支撐構件可以包括有複數個可撓曲支撐構件,每個支撐構間皆具有如同在上文中與例如是圖16一起描述的一個限制部位以及一個未限制部位,並且可移動的銜接部位可以包括有該等未限制部位。在這種情況之中,一個如同在上文中與例如是圖6一起描述的支撐構件運動系統(其可以包括有被連接到複數個限制部位的複數個致動器)可以被建構成用來移動支撐構件的限制部位。揭示於本說明書之中的這些及其他組合的特徵對於一般熟習該項技藝的人士來說在探討此說明書之後將會變得更加明白,並且不應該被視為偏離本發明的範疇。While a number of specific embodiments and alternatives have been described hereinabove, alternatives are possible to provide various combinations of the various concepts and features disclosed herein. For example, although the use of flexible support members such as optical quartz fibers has been described fundamentally with passive mechanical support systems, an alternative is that such flexible support members can also be active Support systems are provided, for example, such as those shown in Figures 6-14. In this case, the plurality of support members may include a plurality of flexible support members, each support structure having a restriction portion and an unrestricted portion as described above with respect to, for example, FIG. And the movable engagement portion can include the unrestricted portions. In this case, a support member motion system (which may include a plurality of actuators connected to a plurality of restriction portions) as described above with respect to, for example, FIG. 6 may be constructed to move A restricted part of the support member. The features of these and other combinations disclosed in the specification will become more apparent to those skilled in the art and

在某些實施例之中,將可以察知的是,某些可撓曲支撐構件可能會在工件24上產生部份的陰影。這可能會在此等陰影的附近區域中產生工件的非均勻性加熱。為了要消除或降低這個困難性,如果有需要的話,使用光學纖維作為可撓曲支撐構件可能是有利的,用以將另外的照射從一個或多個照射來源(未顯示於圖中)經由該等纖維本身傳送到該工件,用以進一步地在此等陰影的附近中照射該工件,從而減少在該工件上之輻照場的非均勻性。In some embodiments, it will be appreciated that certain flexible support members may create partial shadows on the workpiece 24. This may result in non-uniform heating of the workpiece in the vicinity of such shadows. In order to eliminate or reduce this difficulty, it may be advantageous to use optical fibers as flexible support members if needed to pass additional illumination from one or more sources of illumination (not shown). The fibers themselves are delivered to the workpiece to further illuminate the workpiece in the vicinity of such shadows, thereby reducing the non-uniformity of the irradiation field on the workpiece.

此外,大體地說,雖然本發明的特定實施例已經被描述且被顯示出來,此等實施例應該被視為只有是本發明的例證,並且並不是要被理解為將本發明限制成如同根據本發明隨附之申請專利範圍。In addition, although the specific embodiments of the present invention have been described and illustrated, the embodiments are to be considered as illustrative only and are not to be construed as limiting The scope of the patent application accompanying the invention.

20‧‧‧支撐系統20‧‧‧Support system

21‧‧‧支撐裝置21‧‧‧Support device

22‧‧‧支撐構件22‧‧‧Support members

24‧‧‧工件24‧‧‧Workpiece

26‧‧‧裝置側邊26‧‧‧ Side of the device

28‧‧‧基材側邊28‧‧‧The side of the substrate

30‧‧‧工件平面板件30‧‧‧Working plane plate

32‧‧‧支撐裝置32‧‧‧Support device

34‧‧‧支撐裝置34‧‧‧Support device

36‧‧‧支撐構件殼體36‧‧‧Support member housing

38‧‧‧彈簧組件38‧‧‧Spring assembly

40‧‧‧樞轉栓釘40‧‧‧ pivot pegs

42‧‧‧彈簧滾筒42‧‧‧Spring Roller

44‧‧‧彈簧滾筒殼體44‧‧‧Spring roller housing

46‧‧‧彈簧支架托座46‧‧‧Spring bracket bracket

48‧‧‧彈簧48‧‧‧ Spring

50‧‧‧環節50‧‧‧ links

52‧‧‧銜接部位52‧‧‧Connecting parts

60‧‧‧熱處理容室60‧‧‧heat treatment chamber

62‧‧‧預先加熱裝置62‧‧‧Preheating device

63‧‧‧水冷式石英窗口63‧‧‧Water-cooled quartz window

64‧‧‧加熱裝置64‧‧‧heating device

65‧‧‧第二水冷式石英窗口65‧‧‧Second water-cooled quartz window

80‧‧‧支撐裝置80‧‧‧Support device

82‧‧‧支撐構件82‧‧‧Support members

84‧‧‧樞轉點84‧‧‧ pivot point

86‧‧‧彈簧86‧‧‧ Spring

88‧‧‧銜接部位88‧‧‧Connecting parts

100‧‧‧支撐工件的系統100‧‧‧System for supporting workpieces

102‧‧‧支撐裝置102‧‧‧Support device

104‧‧‧支撐構件104‧‧‧Support members

106‧‧‧致動器106‧‧‧Actuator

108‧‧‧支撐構件108‧‧‧Support members

110‧‧‧托架110‧‧‧ bracket

112‧‧‧洞孔112‧‧‧ hole

120‧‧‧固定構件120‧‧‧Fixed components

122‧‧‧移動構件122‧‧‧moving components

124‧‧‧永久磁鐵124‧‧‧ permanent magnet

126‧‧‧強力磁性構件126‧‧‧Strong magnetic components

128‧‧‧電纜線圈128‧‧‧ cable coil

130‧‧‧動力供應單元130‧‧‧Power supply unit

132‧‧‧偵測器/控制器132‧‧‧Detector/Controller

134‧‧‧程式記憶體134‧‧‧Program memory

200‧‧‧致動器200‧‧‧ actuator

202‧‧‧運動轉換器202‧‧‧Sports Converter

204‧‧‧支撐構件204‧‧‧Support members

208‧‧‧第一連接器臂部208‧‧‧First connector arm

210‧‧‧第二連接器臂部210‧‧‧Second connector arm

212‧‧‧第一可自由移動樞轉點212‧‧‧The first freely movable pivot point

214‧‧‧第一剛性桿件214‧‧‧First rigid rod

215‧‧‧第二可自由移動樞轉點215‧‧‧Second freely moveable pivot point

216‧‧‧第一固定樞轉點216‧‧‧First fixed pivot point

218‧‧‧第一剛性桿件218‧‧‧First rigid rod

220‧‧‧第二固定樞轉點220‧‧‧Second fixed pivot point

222‧‧‧第三剛性桿件222‧‧‧ Third rigid rod

224‧‧‧第三可自由移動樞轉點224‧‧‧ Third freely movable pivot point

228‧‧‧支撐尖端228‧‧‧Support tip

230‧‧‧拱形路徑230‧‧‧ arched path

300‧‧‧用於支撐工件的系統300‧‧‧System for supporting workpieces

302‧‧‧第一支撐裝置302‧‧‧First support device

304‧‧‧支撐構件304‧‧‧Support members

306‧‧‧樞轉點306‧‧‧ pivot point

308‧‧‧彈簧308‧‧ ‧ spring

310‧‧‧銜接部位310‧‧‧Connecting parts

312‧‧‧殼體312‧‧‧Shell

320‧‧‧致動器320‧‧‧Actuator

400‧‧‧用於支撐工件的系統400‧‧‧System for supporting workpieces

402‧‧‧第一支撐裝置402‧‧‧First support device

404‧‧‧支撐構件404‧‧‧Support members

406‧‧‧致動器406‧‧‧Actuator

410‧‧‧壓制裝置410‧‧‧Compression device

414‧‧‧壓制構件414‧‧‧Compressed components

416‧‧‧致動器416‧‧‧ actuator

420‧‧‧控制器420‧‧‧ Controller

500‧‧‧支撐裝置500‧‧‧Support device

502‧‧‧支撐構件502‧‧‧Support members

503‧‧‧支撐構件殼體503‧‧‧Support member housing

504‧‧‧樞轉軸504‧‧‧ pivot shaft

505‧‧‧位置點505‧‧‧Location

506‧‧‧彈簧506‧‧ ‧ spring

508‧‧‧尖端508‧‧‧ cutting-edge

510‧‧‧外殼510‧‧‧ Shell

512‧‧‧裝設構件512‧‧‧Installation components

520‧‧‧第二彈簧520‧‧‧Second spring

522‧‧‧剛性擋止522‧‧‧Rigid stop

600‧‧‧支撐裝置600‧‧‧Support device

602‧‧‧可撓曲支撐構件602‧‧‧Flexible support members

604‧‧‧限制部位604‧‧‧Restricted parts

606‧‧‧未限制部位606‧‧‧Unrestricted parts

610‧‧‧外殼610‧‧‧ Shell

620‧‧‧端部區域620‧‧‧End area

650‧‧‧支撐裝置650‧‧‧Support device

652‧‧‧可撓曲支撐構件652‧‧‧Flexible support members

654‧‧‧限制部位654‧‧‧Restricted parts

656‧‧‧未限制部位656‧‧‧Unrestricted parts

660‧‧‧外殼660‧‧‧Shell

680‧‧‧支撐裝置680‧‧‧Support device

682‧‧‧可撓曲支撐構件682‧‧‧Flexible support members

684‧‧‧限制部位684‧‧‧Restricted parts

686‧‧‧未限制部位686‧‧‧Unrestricted parts

690‧‧‧外殼690‧‧‧Shell

700‧‧‧支撐系統700‧‧‧Support system

701‧‧‧支撐裝置701‧‧‧Support device

702‧‧‧支撐裝置702‧‧‧Support device

704‧‧‧支撐裝置704‧‧‧Support device

706‧‧‧支撐裝置706‧‧‧Support device

708‧‧‧支撐裝置708‧‧‧Support device

710‧‧‧工件平面板件710‧‧‧Working plane plate

712‧‧‧可撓曲支撐構件712‧‧‧Flexible support members

714‧‧‧包覆層714‧‧‧Cladding

716‧‧‧端部區域716‧‧‧End area

718‧‧‧外殼718‧‧‧Shell

800‧‧‧支撐系統800‧‧‧Support system

802‧‧‧支撐裝置802‧‧‧Support device

804‧‧‧支撐裝置804‧‧‧Support device

806‧‧‧支撐裝置806‧‧‧Support device

808‧‧‧支撐裝置808‧‧‧Support device

810‧‧‧工件平面板件810‧‧‧Working plane plate

812‧‧‧支撐構件812‧‧‧Support members

815‧‧‧第一端部區域815‧‧‧First end area

814‧‧‧包覆層814‧‧‧Cladding

816‧‧‧中間區域816‧‧‧ intermediate area

817‧‧‧第二端部區域817‧‧‧Second end area

818‧‧‧第一外殼818‧‧‧ first shell

819‧‧‧第二外殼819‧‧‧ second casing

900‧‧‧支撐系統900‧‧‧Support system

902‧‧‧可撓曲支撐構件902‧‧‧Flexible support members

903‧‧‧可撓曲支撐構件903‧‧‧Flexible support members

904‧‧‧限制部位904‧‧‧Restricted parts

906‧‧‧未限制部位906‧‧‧Unrestricted parts

907‧‧‧纖維907‧‧‧ fiber

908‧‧‧外部包覆層908‧‧‧External cladding

920‧‧‧工件平面板件920‧‧‧Working plane plate

910‧‧‧夾具910‧‧‧ fixture

912‧‧‧上方夾持構件912‧‧‧Upper clamping member

914‧‧‧下方夾持構件914‧‧‧Bottom clamping member

916‧‧‧V形凹槽或通道916‧‧‧V-shaped grooves or channels

918‧‧‧垂直狹長孔918‧‧‧Vertical narrow holes

920‧‧‧工件平面板件920‧‧‧Working plane plate

922‧‧‧外部邊緣922‧‧‧External edge

924‧‧‧內部尖端924‧‧‧Internal tip

926‧‧‧中間點926‧‧‧ intermediate point

1000‧‧‧支撐系統1000‧‧‧Support system

1002‧‧‧第一支撐裝置1002‧‧‧First support device

1004‧‧‧第二支撐裝置1004‧‧‧second support device

1006‧‧‧可撓曲支撐構件1006‧‧‧Flexible support members

1008‧‧‧可撓曲支撐構件1008‧‧‧Flexible support members

1010‧‧‧固定端部1010‧‧‧Fixed end

1012‧‧‧固定端部1012‧‧‧Fixed end

1014‧‧‧可調整端部1014‧‧‧Adjustable end

1016‧‧‧可調整端部1016‧‧‧Adjustable end

1018‧‧‧工件平面板件1018‧‧‧Working plane plate

1020‧‧‧開孔1020‧‧‧Opening

1022‧‧‧長度控制器1022‧‧‧ Length controller

1024‧‧‧開孔1024‧‧‧ openings

1026‧‧‧長度控制器1026‧‧‧Length controller

1200‧‧‧支撐系統1200‧‧‧Support system

1202‧‧‧側向支撐裝置1202‧‧‧ lateral support device

1204‧‧‧工件平面板件1204‧‧‧Working plane plate

1206‧‧‧側向支撐構件1206‧‧‧ lateral support members

1208‧‧‧側向支撐構件1208‧‧‧ lateral support members

1210‧‧‧側向支撐構件1210‧‧‧ lateral support members

1212‧‧‧側向支撐構件1212‧‧‧ Lateral support members

1214‧‧‧定位器1214‧‧‧Locator

1300‧‧‧支撐系統1300‧‧‧Support system

1302‧‧‧支撐裝置1302‧‧‧Support device

1304‧‧‧第二可撓曲支撐構件1304‧‧‧Second flexible support member

1306‧‧‧外部包覆層1306‧‧‧External coating

1308‧‧‧軸環1308‧‧‧ collar

1400‧‧‧支撐系統1400‧‧‧Support system

1402‧‧‧支撐裝置1402‧‧‧Support device

1404‧‧‧可撓曲支撐構件1404‧‧‧Flexible support members

1406‧‧‧固定端部1406‧‧‧Fixed end

1408‧‧‧可調整端部1408‧‧‧Adjustable end

1410‧‧‧工件平面板件1410‧‧‧Working plane plate

1412‧‧‧大體上環圈形路徑片段1412‧‧‧Generally looped path segments

1414‧‧‧第二大體上環圈形路徑片段1414‧‧‧Second substantially circular path segment

1416‧‧‧第三大體上環圈形路徑片段1416‧‧‧ Third substantially circular path segment

1422‧‧‧開孔1422‧‧‧Opening

1424‧‧‧長度控制器1424‧‧‧ Length controller

1500‧‧‧熱處理容室1500‧‧‧heat treatment room

1510‧‧‧石英窗口1510‧‧‧Quartz window

1600‧‧‧支撐裝置1600‧‧‧Support device

1608‧‧‧支撐構件1608‧‧‧Support members

1610‧‧‧光滑表面尖端1610‧‧‧Smooth surface tip

1700‧‧‧支撐裝置1700‧‧‧Support device

1702‧‧‧支撐構件1702‧‧‧Support members

圖式部分Schema part

圖式係描繪出本發明的實施例。The drawings depict embodiments of the invention.

圖1為根據本發之第一實施例之一個工件以及一個用於支撐該工件之裝置的上方立體視圖;圖2為一個彈簧磁鼓以及圖1所示之裝置之一個支撐裝置的一個支撐構件的下方立體視圖;圖3為圖1及圖2所示之支撐裝置的剖面視圖;圖4為圖1至圖3所示之工件的剖面視圖,該工件係被複數個圖1至圖3所示之支撐裝置支撐在一個熱處理容室之中;圖5為根據本發之第二實施例之一個工件以及一個用於支撐該工件之裝置的部份側視圖;圖6為根據本發之第三實施例之一個用於支撐一個工件之裝置的下方立體視圖,該裝置係包括有一個可以與一個工件銜接的支撐構件以及一個與該支撐構件協作的致動器;圖7為一個聲音線圈致動器的簡化剖面視圖,該致動器係用於與圖6所示的支撐構件協作;圖8為根據本發之第四實施例之一個用於支撐一個工件之裝置的簡化側視圖,該裝置係包括有一個致動器的一個移動構件,其係與一個運動轉移器協作,用以將一個拱形運動施加在如圖6所示的支撐構件; 圖9為圖8所示之移動構件、運動轉移器以及支撐構件處於一個第二位置之中的簡化側視圖;圖10至圖12為根據本發明之一個第五實施例之一個用於支撐一個工件的裝置之簡化的部份側視圖;圖13至圖14為根據本發明之一個第六實施例之一個用於支撐一個工件的裝置之簡化的部份側視圖;圖15為根據本發明之一個第七實施例之一個用於支撐一個工件的裝置之支撐裝置之簡化的部份側視圖;圖16為根據本發明之一個第八實施例之一個用於支撐一個工件的裝置之一個支撐裝置的部份仰視圖;圖17為根據本發明之一個第九實施例之一個用於支撐一個工件的裝置之一個支撐裝置的部份仰視圖;圖18為根據本發明之一個第十實施例之一個用於支撐一個工件的裝置之一個支撐裝置的部份仰視圖;圖19為圖16所示之支撐裝置的側視圖;圖20為根據本發明之一個第十一實施例之一個用於支撐一個工件的裝置之一個支撐裝置的部份側視圖;圖21為根據本發明之一個第十二實施例之一個工件以及一個用於支撐該工件的裝置之一個支撐裝置的部份仰視圖;圖22為圖21所示之支撐裝置的剖面視圖;圖23為根據本發明之一個第十三實施例之一個工件以及一個用於支撐該工件的裝置之一個支撐系統的立體視圖; 圖24為圖23所示之支撐系統的一個支撐裝置的部份仰視圖;圖25為根據本發明之一個第十四實施例之一個工件以及一個用於支撐該工件的支撐系統的俯視圖;圖26為圖25所示之工件以及支撐系統的頂部立體視圖;圖27為圖25所示之工件以及支撐系統的剖面視圖;圖28為圖27所示之工件以及支撐系統的詳細剖面視圖;圖29為圖25所示之工件以及支撐系統的仰視圖;圖30為圖25至圖29所示之支撐系統的一個支撐構件夾具的後視圖;圖31為根據本發明之一個第十五實施例之一個用於支撐工件的裝置之一個支撐系統的部份剖面視圖;圖32為根據本發明之一個第十六實施例之一個用於支撐工件的裝置之一個支撐系統的部份剖面視圖;圖33為圖32所示之支撐系統的一個側向支撐裝置之前視圖,其中,該側向支撐裝置係處於一個從一個工件平面板件開孔的一個中心處徑向而向外的方向之中;圖34為根據本發明之一個第十七實施例之一個用於支撐工件的裝置之一個支撐裝置的部份剖面視圖;圖35為根據本發明之一個第十八實施例之一個用於支撐工件的裝置之一個支撐系統的部份剖面視圖;圖36為圖1至圖3所示之工件的剖面視圖,該工件係 被複數個圖1至圖3所示的支撐裝置支撐在一個熱處理容室之中,而該容室係根據本發明的一個第十九實施例而被修改;圖37為根據本發明之一個第二十實施例之一個用於支撐工件的裝置之一個支撐構件的側視圖;以及圖38為根據本發明之一個第二十一實施例之一個用於支撐工件的裝置之一個支撐裝置的部份側視圖。1 is a top perspective view of a workpiece according to a first embodiment of the present invention and a device for supporting the workpiece; FIG. 2 is a support member of a spring drum and a support device of the apparatus shown in FIG. 3 is a cross-sectional view of the supporting device shown in FIGS. 1 and 2; and FIG. 4 is a cross-sectional view of the workpiece shown in FIGS. 1 to 3, the workpiece is a plurality of FIGS. 1 to 3 The support device is supported in a heat treatment chamber; FIG. 5 is a partial side view of a workpiece according to a second embodiment of the present invention and a device for supporting the workpiece; FIG. 6 is a A lower perspective view of a device for supporting a workpiece, the device comprising a support member engageable with a workpiece and an actuator cooperating with the support member; FIG. 7 is a sound coil A simplified cross-sectional view of the actuator for cooperating with the support member illustrated in FIG. 6; FIG. 8 is a simplified side elevational view of a device for supporting a workpiece in accordance with a fourth embodiment of the present invention, Device Included is a moving member having an actuator that cooperates with a motion shifter for applying an arching motion to the support member as shown in FIG. 6; Figure 9 is a simplified side elevational view of the moving member, motion shifter and support member of Figure 8 in a second position; Figures 10 through 12 are one for supporting a fifth embodiment in accordance with the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 13 to FIG. 14 are simplified partial side views of a device for supporting a workpiece in accordance with a sixth embodiment of the present invention; FIG. 15 is a view of a device according to the present invention; A simplified partial side view of a support device for a device for supporting a workpiece of a seventh embodiment; FIG. 16 is a support device for a device for supporting a workpiece according to an eighth embodiment of the present invention; Figure 17 is a partial bottom plan view of a support device for supporting a workpiece according to a ninth embodiment of the present invention; Figure 18 is a tenth embodiment of the present invention A partial bottom view of a support device for a device for supporting a workpiece; FIG. 19 is a side view of the support device shown in FIG. 16; and FIG. 20 is an eleventh embodiment of the present invention. Partial side view of a support device for a device for supporting a workpiece; Figure 21 is a portion of a support device for a workpiece according to a twelfth embodiment of the present invention and a device for supporting the workpiece Figure 22 is a cross-sectional view of the support device of Figure 21; Figure 23 is a perspective view of a workpiece according to a thirteenth embodiment of the present invention and a support system for supporting the workpiece; Figure 24 is a partial bottom plan view of a support device of the support system shown in Figure 23; Figure 25 is a plan view of a workpiece according to a fourteenth embodiment of the present invention and a support system for supporting the workpiece; 26 is a top perspective view of the workpiece and the support system shown in FIG. 25; FIG. 27 is a cross-sectional view of the workpiece and the support system shown in FIG. 25; FIG. 28 is a detailed sectional view of the workpiece and the support system shown in FIG. 29 is a bottom view of the workpiece and the support system shown in FIG. 25; FIG. 30 is a rear view of a support member jig of the support system shown in FIGS. 25 to 29; FIG. 31 is a fifteenth embodiment according to the present invention. A partial cross-sectional view of a support system for a device for supporting a workpiece; FIG. 32 is a partial cross-sectional view of a support system of a device for supporting a workpiece in accordance with a sixteenth embodiment of the present invention; 33 is a front view of a lateral support device of the support system shown in Fig. 32, wherein the lateral support means is in a radial direction from a center of the opening of a workpiece plane plate member. Figure 34 is a partial cross-sectional view of a support device for a device for supporting a workpiece in accordance with a seventeenth embodiment of the present invention; and Figure 35 is an eighteenth embodiment of the present invention. A partial cross-sectional view of a support system for a device for supporting a workpiece; and FIG. 36 is a cross-sectional view of the workpiece shown in FIGS. 1 to 3, the workpiece system The plurality of support devices shown in FIGS. 1 to 3 are supported in a heat treatment chamber which is modified in accordance with a nineteenth embodiment of the present invention; FIG. 37 is a first embodiment of the present invention. A side view of a support member of a device for supporting a workpiece of a twenty embodiment; and FIG. 38 is a portion of a support device of a device for supporting a workpiece according to a twenty-first embodiment of the present invention Side view.

20‧‧‧支撐系統20‧‧‧Support system

21‧‧‧支撐裝置21‧‧‧Support device

22‧‧‧支撐構件22‧‧‧Support members

24‧‧‧工件24‧‧‧Workpiece

28‧‧‧基材側邊28‧‧‧The side of the substrate

30‧‧‧工件平面板件30‧‧‧Working plane plate

36‧‧‧支撐構件殼體36‧‧‧Support member housing

Claims (317)

一種用於支撐一個半導體工件的裝置,該裝置係包含有:一個加熱系統,該加熱系統係被建構成用以藉著加熱該工件相對於大部份工件的一個表面,而產生該半導體工件之以熱引動的運動,其中,該加熱系統係包含有一個照射系統,其係被建構成用以照射該工件的表面一段短於工件之熱傳導時間的時間,用以將該表面加熱到一個溫度,該溫度係大於大部份之工件的溫度,以造成工件的以熱引動的運動,其中該以熱引動的運動包含工件的外部邊緣區域和工件中央相對於彼此的垂直運動;及一個支撐系統,該支撐系統係被建構成在支撐著該工件時,容許該工件進行該以熱引動的運動,其中,前述的支撐系統包含有一個具有一個可移動銜接部位的支撐構件,其中該可移動銜接部位建構成與該工件相銜接,且與工件銜接時可響應於包含工件的外部邊緣區域和工件中央相對於彼此的垂直運動的以熱引動的運動而移動。 A device for supporting a semiconductor workpiece, the device comprising: a heating system configured to generate a semiconductor workpiece by heating a surface of the workpiece relative to a majority of the workpiece a thermally actuated motion, wherein the heating system includes an illumination system configured to illuminate a surface of the workpiece for a period of time shorter than a heat transfer time of the workpiece to heat the surface to a temperature, The temperature is greater than the temperature of the majority of the workpiece to cause a thermally actuated motion of the workpiece, wherein the thermally actuated motion comprises an outer edge region of the workpiece and a vertical movement of the center of the workpiece relative to each other; and a support system, The support system is configured to allow the workpiece to perform the heat-induced movement while supporting the workpiece, wherein the support system includes a support member having a movable engagement portion, wherein the movable engagement portion The construct is engaged with the workpiece and is responsive to the outer edge region containing the workpiece when engaged with the workpiece Center of the workpiece relative to one another thermally priming of vertical movement is moved. 如申請專利範圍第1項所述的裝置,其中,該工件係包含有一個半導體晶圓,並且其中,該可移動銜接部位係可以與該半導體晶圓相銜接,用以在支撐著工件時,容許該工件的以熱引動的運動。 The device of claim 1, wherein the workpiece comprises a semiconductor wafer, and wherein the movable engaging portion is engageable with the semiconductor wafer for supporting the workpiece. The heat-induced movement of the workpiece is allowed. 如申請專利範圍第1項所述的裝置,其中,該銜接部位係可以反應於該工件之以熱引動的運動而自動移動。 The device of claim 1, wherein the engagement portion is automatically movable in response to the thermally actuated motion of the workpiece. 如申請專利範圍第1項所述的裝置,其中,該銜接 部位係可以移動以在該以熱引動之運動期間在支撐著工件時,將在工件中的應力減小到最小的程度。 The device of claim 1, wherein the connection The portion can be moved to minimize stress in the workpiece while supporting the workpiece during the thermally actuated motion. 如申請專利範圍第1項所述的裝置,其中,該支撐系統係被建構成用以在將工件的質量中心保持在一個所希求之範圍中時,容許該工件之外部區域的運動。 The apparatus of claim 1, wherein the support system is configured to permit movement of an outer region of the workpiece while maintaining a center of mass of the workpiece in a desired range. 如申請專利範圍第5項所述的裝置,其中,該支撐系統係被建構成用以在將工件之質量中心的運動減小到最小的程度。 The apparatus of claim 5, wherein the support system is constructed to minimize the movement of the center of mass of the workpiece. 如申請專利範圍第1項所述的裝置,其中,該支撐系統係被建構成用以在容許該工件之熱壓彎時,支撐著該工件。 The device of claim 1, wherein the support system is configured to support the workpiece while permitting hot bending of the workpiece. 如申請專利範圍第1項所述的裝置,其中,該支撐系統係被建構成用以在容許該工件之熱彎折時,支撐著該工件。 The device of claim 1, wherein the support system is configured to support the workpiece while permitting thermal bending of the workpiece. 如申請專利範圍第1項所述的裝置,其中,該支撐構件係包含有一個剛性可移動的支撐構件。 The device of claim 1, wherein the support member comprises a rigid movable support member. 如申請專利範圍第1項所述的裝置,其中,該支撐構件係為可撓曲的並且具有一個限制部位及一個未限制部位,並且其中,該可移動的銜接部位係包含有該未限制部位。 The device of claim 1, wherein the support member is flexible and has a restriction portion and an unrestricted portion, and wherein the movable engagement portion includes the unrestricted portion . 如申請專利範圍第1項所述的裝置,其中,該支撐構件之可移動的銜接部位係可以彈性地與該工件銜接。 The device of claim 1, wherein the movable engagement portion of the support member is resiliently engageable with the workpiece. 如申請專利範圍第1項所述的裝置,其中,該支撐構件的銜接部位係包含有複數個各自之支撐構件之複數 個可以移動的銜接部位。 The device of claim 1, wherein the connecting portion of the supporting member comprises a plurality of respective supporting members. A movable joint. 如申請專利範圍第12項所述的裝置,其中,複數個各自之支撐構件之複數個可以移動的銜接部位包含有至少三個各自之支撐構件的至少三個可移動銜接部位。 The device of claim 12, wherein the plurality of movable attachment portions of the plurality of respective support members comprise at least three movable engagement portions of at least three respective support members. 如申請專利範圍第12項所述的裝置,其中,複數個各自之支撐構件之複數個可以移動的銜接部位包含有至少四個各自之支撐構件的至少四個可移動銜接部位。 The device of claim 12, wherein the plurality of movable support portions of the plurality of respective support members comprise at least four movable engagement portions of at least four respective support members. 如申請專利範圍第1項所述的裝置,其中,該支撐系統係被建構成用以壓制工件的震動。 The device of claim 1, wherein the support system is constructed to suppress vibration of the workpiece. 如申請專利範圍第15項所述的裝置,其中,該支撐系統係被建構成用以壓制工件之至少一個自然震動的模式。 The device of claim 15, wherein the support system is constructed to modulate at least one natural vibration of the workpiece. 如申請專利範圍第16項所述的裝置,其中,該支撐系統係被建構成用以壓制工件之一個第二自然震動的模式。 The device of claim 16, wherein the support system is constructed to suppress a second natural vibration of the workpiece. 如申請專利範圍第16項所述的裝置,其中,該支撐系統係被建構成用以壓制工件之一個第一自然震動的模式。 The device of claim 16, wherein the support system is constructed to suppress a first natural vibration of the workpiece. 如申請專利範圍第15項所述的裝置,其中,該支撐系統係被建構成用以吸收來自於工件的動能。 The device of claim 15 wherein the support system is constructed to absorb kinetic energy from the workpiece. 如申請專利範圍第12項所述的裝置,其中,複數個支撐構件之複數個可以移動的銜接部位係包含有複數個各自之支撐栓釘的複數個尖端。 The device of claim 12, wherein the plurality of movable attachment portions of the plurality of support members comprise a plurality of tips of a plurality of respective support pegs. 如申請專利範圍第20項所述的裝置,其中,該等 栓釘的尖端係可以與該工件的外部周圍區域相銜接。 The device of claim 20, wherein the The tip end of the stud can engage the outer peripheral region of the workpiece. 如申請專利範圍第21項所述的裝置,其中,該支撐系統係被建構成用以自動地容許該等支撐栓釘之尖端可以反應於該工件之外部周圍區域之以熱引動的運動而進行運動。 The device of claim 21, wherein the support system is configured to automatically allow the tips of the support pegs to react with the thermally actuated motion of the outer peripheral region of the workpiece. motion. 如申請專利範圍第12項所述的裝置,其中,每個複數個可移動銜接部位係彈性地與該工件相銜接。 The device of claim 12, wherein each of the plurality of movable engagement portions elastically engages the workpiece. 如申請專利範圍第23項所述的裝置,其更包含有複數個作用力應用器,該等作用力應用器係與複數個支撐構件相連通以將作用力應用到該等支撐構件,用以導致每個銜接部位在該工件之以熱引動之運動期間傾向於保持與該工件相接觸。 The device of claim 23, further comprising a plurality of force application devices, wherein the force application device is in communication with the plurality of support members to apply a force to the support members for As a result, each of the engagement portions tends to remain in contact with the workpiece during the thermally actuated motion of the workpiece. 如申請專利範圍第24項所述的裝置,其中,每個作用力應用器係包含有一個力矩應用器。 The device of claim 24, wherein each of the force application devices comprises a torque applicator. 如申請專利範圍第25項所述的裝置,其中,該力矩應用器係被建構成用以將一個向上作用力應用在一個位置處,該位置係位於支撐構件上而插置於該支撐構件之一個樞轉點與該銜接部位之間。 The device of claim 25, wherein the torque applicator is configured to apply an upward force at a position on the support member and inserted into the support member. A pivot point is between the joint and the joint. 如申請專利範圍第25項所述的裝置,其中,該力矩應用器係被建構成用以將一個向下作用力應用在一個位於支撐構件上的位置處,使得該支撐構件的一個樞轉點係被插置在該位置與該銜接部位之間。 The device of claim 25, wherein the torque applicator is constructed to apply a downward force to a position on the support member such that a pivot point of the support member It is inserted between this position and the joint. 如申請專利範圍第24項所述的裝置,其中,每個作用力應用器皆包含有第一及第二力矩應用器,該等力矩 應用器係被建構成用以將第一及第二相對力矩應用到每個支撐構件,該第二力矩係作用以對抗該支撐構件超過其一個平衡位置。 The device of claim 24, wherein each of the force application devices includes first and second torque applicators, the torques The applicator is configured to apply first and second relative moments to each of the support members, the second moment acting against the support member beyond one of its equilibrium positions. 如申請專利範圍第24項所述的裝置,其中,每個作用力應用器皆包含有一個被連接到該支撐構件的彈簧。 The device of claim 24, wherein each of the force application devices includes a spring coupled to the support member. 如申請專利範圍第29項所述的裝置,其中,該彈簧包含有一個固定作用力彈簧。 The device of claim 29, wherein the spring comprises a fixed force spring. 如申請專利範圍第20項所述的裝置,其中,複數個支撐栓釘係包含有對於至少一些照射波長來說為透明的材料,其中,該工件係能夠藉著該等照射波長而被照射加熱。 The device of claim 20, wherein the plurality of support studs comprise a material that is transparent to at least some of the illumination wavelengths, wherein the workpiece is capable of being illuminated by the illumination wavelengths . 如申請專利範圍第20項所述的裝置,其中,複數個支撐栓釘係包含有光學的透明材料。 The device of claim 20, wherein the plurality of support studs comprise an optically transparent material. 如申請專利範圍第20項所述的裝置,其中,複數個支撐栓釘係包含有石英。 The device of claim 20, wherein the plurality of support studs comprise quartz. 如申請專利範圍第20項所述的裝置,其中,複數個支撐栓釘係包含有藍寶石。 The device of claim 20, wherein the plurality of support studs comprise sapphire. 如申請專利範圍第20項所述的裝置,其中,複數個支撐栓釘係包含有金屬。 The device of claim 20, wherein the plurality of support studs comprise metal. 如申請專利範圍第20項所述的裝置,其中,複數個支撐栓釘係包含有鎢。 The device of claim 20, wherein the plurality of support studs comprise tungsten. 如申請專利範圍第20項所述的裝置,其中,複數個各自之支撐栓釘的複數個尖端係具有一個外部塗層。 The device of claim 20, wherein the plurality of tips of the respective plurality of support pegs have an outer coating. 如申請專利範圍第37項所述的裝置,其中,該外 部塗層係包含有氮化鎢。 The device of claim 37, wherein the device The partial coating layer contains tungsten nitride. 如申請專利範圍第37項所述的裝置,其中,該外部塗層係包含有碳化鎢。 The device of claim 37, wherein the outer coating comprises tungsten carbide. 如申請專利範圍第12項所述的裝置,其中,複數個支撐構件的複數個可以移動之銜接部位係包含有複數個各自之支撐栓釘的複數個表面光滑的尖端。 The device of claim 12, wherein the plurality of movable attachment portions of the plurality of support members comprise a plurality of smooth tips having a plurality of respective support pegs. 如申請專利範圍第12項所述的裝置,其更包含有一個支撐構件運動系統,其係被建構成用以反應於該工件之以熱引動的運動來移動該等可以移動的銜接部位。 The device of claim 12, further comprising a support member motion system configured to move the moveable engagement locations in response to the thermally actuated motion of the workpiece. 如申請專利範圍第41項所述的裝置,其中,該支撐構件運動系統係被建構成用以反應於該工件之以熱引動的運動來移動該等支撐構件。 The device of claim 41, wherein the support member motion system is configured to move the support members in response to the thermally actuated motion of the workpiece. 如申請專利範圍第42項所述的裝置,其中,對於每個支撐構件來說,該支撐構件運動系統包含有被連接到該支撐構件之一個各自的致動器。 The device of claim 42, wherein for each support member, the support member motion system includes a respective actuator coupled to the support member. 如申請專利範圍第43項所述的裝置,其中,該支撐構件運動系統係被建構成用以應用一個電流到每個致動器,用以移動每個支撐構件。 The device of claim 43, wherein the support member motion system is constructed to apply a current to each actuator for moving each of the support members. 如申請專利範圍第43項所述的裝置,其中,每個致動器係包含有一個聲音線圈致動器,其係被連接到該支撐構件。 The device of claim 43, wherein each actuator comprises a voice coil actuator coupled to the support member. 如申請專利範圍第43項所述的裝置,其中,每個致動器係包含有一個壓電致動器,其係被連接到該支撐構件。 The device of claim 43, wherein each actuator comprises a piezoelectric actuator that is coupled to the support member. 如申請專利範圍第43項所述的裝置,其中,每個致動器係包含有一個線性伺服致動器,其係被連接到該支撐構件。 The device of claim 43, wherein each actuator comprises a linear servo actuator coupled to the support member. 如申請專利範圍第43項所述的裝置,其中,對於每個致動器來說,該支撐構件運動系統更包含有一個運動轉換器,其係被建構成用以將該致動器之一個可以移動構件的一個直線運動轉換成該支撐構件的一個拱形運動。 The device of claim 43, wherein, for each actuator, the support member motion system further comprises a motion converter constructed to constitute one of the actuators A linear motion of the movable member is converted into an arched motion of the support member. 如申請專利範圍第42項所述的裝置,其中,該運動器統包含有至少一個控制器,其係被建構成用以調整複數個支撐構件的位置,用以將該工件之一個重量與一個向上作用力之間的一個差異減小到最小的程度,其中,該項上作用力係被複數個支撐構件的複數個銜接部位應用到該工件。 The device of claim 42, wherein the motion device comprises at least one controller configured to adjust a position of the plurality of support members for weighting one of the workpieces A difference between the upward forces is reduced to a minimum extent, wherein the upper force is applied to the workpiece by a plurality of joint locations of the plurality of support members. 如申請專利範圍第42項所述的裝置,其中,該運動器統包含有至少一個控制器,其係被建構成用以調整支撐構件的位置,用以將該工件之一個重量與一個向上作用力之間的一個差異保持在一個所希求的範圍之內,其中,該向上作用力係被該等支撐構件的銜接部位應用到工件。 The device of claim 42, wherein the motion device comprises at least one controller configured to adjust a position of the support member for applying one weight and one upward of the workpiece A difference between the forces is maintained within a desired range, wherein the upward force is applied to the workpiece by the interface of the support members. 如申請專利範圍第41項所述的裝置,其中,該運動系統係被建構成用以反應於該以熱引動之運動的一個預測數值來移動該等支撐構件。 The apparatus of claim 41, wherein the motion system is configured to move the support members in response to the predicted value of the motion of the heat priming. 如申請專利範圍第41項所述的裝置,其中,該運動系統係被建構成用以反應於該以熱引動之運動的一個偵測參數來移動該等支撐構件。 The device of claim 41, wherein the motion system is configured to move the support members in response to the detecting parameter of the thermally actuated motion. 如申請專利範圍第41項所述的裝置,其更包含有至少一個偵測器,該偵測器係被建構成用以偵測出該工件之以熱引動的運動。 The device of claim 41, further comprising at least one detector configured to detect a thermally actuated motion of the workpiece. 如申請專利範圍第53項所述的裝置,其中,該運動系統係包含有複數個致動器,每個致動器係被連接到複數個支撐構件中之各自的一個支撐構件,並且其中,該至少一個偵測器係被建構成用以在每個複數的致動器中偵測出一個從一個作用力所產生的電流,該作用力係藉著該工件的運動被應用到各自之支撐構件的銜接部位。 The device of claim 53, wherein the motion system comprises a plurality of actuators, each actuator being connected to a respective one of the plurality of support members, and wherein The at least one detector is configured to detect a current generated from a force in each of the plurality of actuators, the force being applied to the respective support by the motion of the workpiece The joint of the component. 如申請專利範圍第54項所述的裝置,其更包含有至少一個控制器,其係被建構成用以將一個電流應用到每個致動器,用以移動該等銜接部位。 The device of claim 54, further comprising at least one controller configured to apply a current to each of the actuators for moving the engagement locations. 如申請專利範圍第55項所述的裝置,其中,該等複數個致動器係包含有複數個聲音線圈致動器。 The device of claim 55, wherein the plurality of actuators comprise a plurality of voice coil actuators. 如申請專利範圍第54項所述的裝置,其中,對於每個致動器來說,該至少一個偵測器係被建構成用以偵測出該電流與一個所希求電流位準的一個誤差,並且該至少一個控制器係被建構成用以控制該致動器來調整支撐構件的一個位置,以便於將該誤差減小到最小的程度。 The device of claim 54, wherein, for each actuator, the at least one detector is configured to detect an error between the current and a desired current level. And the at least one controller is configured to control the actuator to adjust a position of the support member to facilitate minimizing the error. 如申請專利範圍第54項所述的裝置,其中,該至少一個偵測器係包含有至少一個與該等致動器相連通的處理器電路。 The device of claim 54, wherein the at least one detector comprises at least one processor circuit in communication with the actuators. 如申請專利範圍第58項所述的裝置,其中,該至少一個偵測器係包含有複數個處理器電路,每個處理器電 路係分別與該等複數個致動器之各自的其中之一相連通。 The device of claim 58, wherein the at least one detector comprises a plurality of processor circuits, each processor The circuitry is in communication with one of the respective plurality of actuators. 如申請專利範圍第55項所述的裝置,其中,該至少一個控制器係包含有至少一個與該等致動器相連通的處理器電路。 The device of claim 55, wherein the at least one controller comprises at least one processor circuit in communication with the actuators. 如申請專利範圍第60項所述的裝置,其中,該至少一個控制器係包含有複數個處理器電路,每個處理器電路係分別與該等複數個致動器之各自的其中之一相連通。 The device of claim 60, wherein the at least one controller comprises a plurality of processor circuits, each processor circuit being respectively associated with one of each of the plurality of actuators through. 如申請專利範圍第55項所述的裝置,其中,該至少一個控制器係包含有至少一個偵測器。 The device of claim 55, wherein the at least one controller comprises at least one detector. 如申請專利範圍第12項所述的裝置,其中,該複數個支撐構件的複數個可移動銜接部位係包含有第一複數個各自之支撐構件的第一複數個可移動銜接部位、以及第二複數個各自之支撐構件的第二複數個可移動銜接部位,該等第一複數個可移動銜接部位係可以與該工件的一個下方表面相銜接,並且該等第二複數個可移動銜接部位係可以與該工件的一個上方表面相銜接。 The device of claim 12, wherein the plurality of movable engagement portions of the plurality of support members comprise a first plurality of movable engagement portions of the first plurality of respective support members, and a second a second plurality of movable engagement portions of the plurality of respective support members, the first plurality of movable engagement portions being engageable with a lower surface of the workpiece, and the second plurality of movable engagement portions It can be engaged with an upper surface of the workpiece. 如申請專利範圍第63項所述的裝置,其中,該等第一及第二複數的銜接部位係分別可以與該工件的下方表面及上方表面在該工件的一個外部周圍區域處相銜接。 The device of claim 63, wherein the first and second plurality of engaging portions are respectively engageable with an underlying surface and an upper surface of the workpiece at an outer peripheral region of the workpiece. 如申請專利範圍第41項所述的裝置,其中,該運動系統係被建構成用來移動該等銜接部位,用以將應用在該工件與該等銜接部位之間的作用力減小到最小的程度。 The device of claim 41, wherein the motion system is configured to move the engagement portions to minimize a force applied between the workpiece and the engagement portions. Degree. 如申請專利範圍第65項所述的裝置,其中,該等複數的支撐構件之複數的銜接部位係包含有第一複數之各 自之支撐構件的第一複數的可移動銜接部位,該等第一複數的可移動銜接部位係可以與該工件的一個下方表面相銜接,並且其中,該運動系統係被建構成用來移動第一複數的銜接部位,用以將一個介於該工件之一個重量與一個作用力之間的差異減小到最小的程度,其中,該作用力係被應用在第一複數銜接部位與該工件之間。 The device of claim 65, wherein the plurality of connecting members of the plurality of supporting members comprise the first plurality From the first plurality of movable engagement portions of the support member, the first plurality of movable engagement portions are engageable with a lower surface of the workpiece, and wherein the motion system is constructed to move a plurality of joints for minimizing a difference between a weight and a force of the workpiece, wherein the force is applied to the first plurality of joints and the workpiece between. 如申請專利範圍第66項所述的裝置,其中,該等複數的支撐構件之複數的銜接部位係更包含有第二複數之各自之支撐構件的第二複數的可移動銜接部位,該等第二複數的可移動銜接部位係可以與該工件的一個上方表面相銜接,並且其中,該運動系統係被建構成用來移動第二複數的銜接部位,用以將應用在該工件與該等第二複數的銜接部位之間的作用力減小到最小的程度。 The device of claim 66, wherein the plurality of engaging portions of the plurality of supporting members further comprise a second plurality of movable engaging portions of the second plurality of respective supporting members, the The second plurality of movable engagement portions are engageable with an upper surface of the workpiece, and wherein the motion system is configured to move the second plurality of engagement portions for application to the workpiece and the The force between the two complex joints is reduced to a minimum. 如申請專利範圍第41項所述的裝置,其中,複數的可移動銜接部位中的每一個銜接部位係可以彈性地與該工件相銜接,並且其中,該運動系統係被建構成用以反應於該以熱引動的運動來移動複數的支撐構件。 The device of claim 41, wherein each of the plurality of movable engagement portions is resiliently engageable with the workpiece, and wherein the motion system is configured to react to The thermally actuated motion moves the plurality of support members. 如申請專利範圍第68項所述的裝置,其更包含有複數的力矩應用器,該等力矩應用器係被建構成用以將力矩對著支撐構件之各自的樞轉點應用到該等支撐構件,用以導致該等銜接部位會傾向於保持與該工件的接觸,並且其中,該運動系統係被建構成用來移動該等支撐構件的樞轉點。 The device of claim 68, further comprising a plurality of torque applicators configured to apply a moment to a respective pivot point of the support member to the support The members are configured to cause the engagement locations to tend to remain in contact with the workpiece, and wherein the motion system is configured to pivot points for moving the support members. 如申請專利範圍第69項所述的裝置,其中,該等 複數的力矩應用器包含有複數的彈簧,該等彈簧係在除了支撐構件之樞轉點之外的位置處被連接到該等支撐構件,並且其中,該運動系統係被建構成用以將電流應用到被連接到複數個支撐構件之複數個致動器,用以移動該等支撐構件。 The device of claim 69, wherein the The plurality of torque applicators include a plurality of springs that are coupled to the support members at locations other than pivot points of the support members, and wherein the motion system is configured to conduct current Applying to a plurality of actuators connected to a plurality of support members for moving the support members. 如申請專利範圍第68項所述的裝置,其中,該等複數的支撐構件係包含有複數的可撓曲支撐構件,每個可撓曲支撐構件都具有一個限制部位及一個未限制部位;其中,該等未限制部位係可以彈性地與該工件相銜接;並且其中,該運動系統係被建構成用來移動該等支撐構件的限制部位。 The device of claim 68, wherein the plurality of support members comprise a plurality of flexible support members, each of the flexible support members having a restriction portion and an unrestricted portion; The unrestricted portions are resiliently engageable with the workpiece; and wherein the kinematic system is constructed to define a restriction for moving the support members. 如申請專利範圍第71項所述的裝置,其中,複數的致動器係被連接到複數的限制部位。 The device of claim 71, wherein the plurality of actuators are connected to a plurality of restriction sites. 如申請專利範圍第68項所述的裝置,其更包含有一個偵測器,該偵測器係被建構成用以偵測出該工件之以熱引動的運動。 The device of claim 68, further comprising a detector configured to detect a thermally actuated motion of the workpiece. 如申請專利範圍第12項所述的裝置,其中,該等複數的支撐構件係包含有複數的可撓曲支撐構件,每個可撓曲支撐構件都具有一個限制部位及一個未限制部位;並且其中,該等可移動的銜接部位係包含有該等可撓曲支撐構件的未限制部位。 The device of claim 12, wherein the plurality of support members comprise a plurality of flexible support members, each of the flexible support members having a restriction portion and an unrestricted portion; Wherein the movable engagement locations comprise unrestricted portions of the flexible support members. 如申請專利範圍第74項所述的裝置,其中,該等複數的支撐構件係包含有複數的纖維。 The device of claim 74, wherein the plurality of support members comprise a plurality of fibers. 如申請專利範圍第75項所述的裝置,其中,該複 數的纖維係包含有複數的光學纖維。 The device of claim 75, wherein the The number of fibers is comprised of a plurality of optical fibers. 如申請專利範圍第75項所述的裝置,其中,該複數的纖維係包含有複數的石英纖維。 The device of claim 75, wherein the plurality of fibers comprise a plurality of quartz fibers. 如申請專利範圍第75項所述的裝置,其中,該複數的纖維係包含有複數的藍寶石纖維。 The device of claim 75, wherein the plurality of fibers comprise a plurality of sapphire fibers. 如申請專利範圍第74項所述的裝置,其更包含有至少一個限制器,該限制器係被建構成用以限制該等可撓曲支撐構件的限制部位。 The device of claim 74, further comprising at least one limiter configured to limit a restriction of the flexible support members. 如申請專利範圍第79項所述的裝置,其中,該至少一個限制器係包含有複數的限制器,該等限制器係被配置在該工件的一個外部周圍附近。 The device of claim 79, wherein the at least one limiter comprises a plurality of limiters disposed adjacent an outer periphery of the workpiece. 如申請專利範圍第80項所述的裝置,其中,該等複數的限制器係由數目少於該等可撓曲支撐構件的限制器所組成的,並且其中,每個限制器係被建構成用來限制多於一個的可撓曲支撐構件。 The device of claim 80, wherein the plurality of limiters are comprised of a limiter having fewer than the plurality of flexible support members, and wherein each limiter is constructed Used to limit more than one flexible support member. 如申請專利範圍第81項所述的裝置,其中,每個限制器係被建構成用以限制多於一個之整體上彼此平行的可撓曲支撐構件。 The device of claim 81, wherein each of the limiters is configured to limit more than one flexible support member that is generally parallel to each other. 如申請專利範圍第81項所述的裝置,其中,每個限制器係被建構成用來限制多於一個之整體上彼此分歧的可撓曲支撐構件。 The device of claim 81, wherein each of the restrictors is configured to limit more than one flexible support member that is generally divergent from each other. 如申請專利範圍第80項所述的裝置,其中,該等複數的限制器係由數目與該等可撓曲支撐構件相同的限制器所組成的,並且其中,每個限制器係被建構成用來限制 對應其中一個限制部位之各自的可撓曲支撐構件。 The device of claim 80, wherein the plurality of limiters are comprised of the same number of limiters as the flexible support members, and wherein each limiter is constructed Used to limit Corresponding to each of the flexible support members of one of the restriction portions. 如申請專利範圍第80項所述的裝置,其更包含有複數的作用力應用器,該等作用力應用器係被建構成用來將作用力應用到複數的限制器,用以導致每個未限制部位係傾向於在該工件的以熱引動之運動期間保持與該工件的接觸。 The device of claim 80, further comprising a plurality of force application devices configured to apply a force to the plurality of limiters to cause each The unrestricted portion tends to maintain contact with the workpiece during the thermally actuated motion of the workpiece. 如申請專利範圍第85項所述的裝置,其中,該等複數的作用力應用器係包含有複數的力矩應用器。 The device of claim 85, wherein the plurality of force application devices comprise a plurality of torque applicators. 如申請專利範圍第85項所述的裝置,其中,複數的作用力應用器係包含有複數的彈簧。 The device of claim 85, wherein the plurality of force applications comprise a plurality of springs. 如申請專利範圍第74項所述的裝置,其中,每個銜接部位係可以與該工件的一個下方部位係以相對於該工件之一個平面成一個10到80度的角度相銜接。 The device of claim 74, wherein each of the engaging portions is engageable with a lower portion of the workpiece at an angle of 10 to 80 degrees with respect to a plane of the workpiece. 如申請專利範圍第74項所述的裝置,其中,每個銜接部位係可以與該工件的一個下方部位係以相對於該工件之一個平面成一個15到35度的角度相銜接。 The device of claim 74, wherein each of the engaging portions is engageable with a lower portion of the workpiece at an angle of 15 to 35 degrees with respect to a plane of the workpiece. 如申請專利範圍第74項所述的裝置,其中,每個銜接部位係可以與該工件的一個下方部位係以相對於該工件之一個平面成一個25度的角度相銜接。 The device of claim 74, wherein each of the engaging portions is engageable with a lower portion of the workpiece at an angle of 25 degrees with respect to a plane of the workpiece. 如申請專利範圍第79項所述的裝置,其中,每個可撓曲的支撐構件係包含有在其一個端部處的限制部位,並且其中,該未限制部位係從該限制部位處朝向該工件的一個中央區域相內地延伸。 The device of claim 79, wherein each of the flexible support members includes a restriction at one end thereof, and wherein the unrestricted portion faces the restriction portion A central region of the workpiece extends in phase. 如申請專利範圍第91項所述的裝置,其中,每個 未限制部位的一個內部尖端係向內延伸而通過該工件的一個外部邊緣,並且其中,該銜接部位係包含有一個沿著該未限制部位而介於該限制部位與該內部尖端之間的中間點,該中間點係可以與工件的外部邊緣相銜接。 Such as the device described in claim 91, wherein each An inner tip of the unrestricted portion extends inwardly through an outer edge of the workpiece, and wherein the engagement portion includes an intermediate portion between the restriction portion and the inner tip along the unrestricted portion Point, the intermediate point can be engaged with the outer edge of the workpiece. 如申請專利範圍第79項所述的裝置,其中,該至少一個限制器係包含有一個包圍該工件的工件平面板件。 The apparatus of claim 79, wherein the at least one limiter comprises a workpiece planar panel surrounding the workpiece. 如申請專利範圍第93項所述的裝置,其中,該限制器包含有至少一個用於夾住該限制部位的夾具。 The device of claim 93, wherein the limiter comprises at least one clamp for clamping the restriction. 如申請專利範圍第93項所述的裝置,其中,該工件平面板件係界定了位於其一個內部表面中之複數的工件支撐開孔,並且其中,該等限制部位係藉著未限制部位被附加到該工件平面板件,而該等未限制部位係朝向該工件向內延伸而通過該等工件支撐開孔。 The device of claim 93, wherein the workpiece planar panel defines a plurality of workpiece support openings in an interior surface thereof, and wherein the restriction portions are Attached to the workpiece planar panel, the unrestricted portions extend inwardly toward the workpiece to support the apertures through the workpieces. 如申請專利範圍第93項所述的裝置,其中,該工件平面板件係被建構成用以將該等限制部位限制在一個大體上水平的方向之中,用以導致該等未限制部位會朝向該工件的中央區域大體上水平而向內地延伸,且同時向下彎垂。 The device of claim 93, wherein the workpiece flat panel is constructed to limit the restricted portions to a substantially horizontal direction for causing the unrestricted portions to be The central region facing the workpiece extends generally horizontally and inwardly while simultaneously downwardly. 如申請專利範圍第96項所述的裝置,其中,該等未限制部位可以與工件的一個外部邊緣相銜接。 The device of claim 96, wherein the unrestricted portions are engageable with an outer edge of the workpiece. 如申請專利範圍第97項所述的裝置,其中,該等未限制部位可以與該工件的外部邊緣以一個向下相對於該工件之一個平面之大約小於10度的角度相銜接。 The device of claim 97, wherein the unrestricted portions are engageable with an outer edge of the workpiece at an angle of less than about 10 degrees downward relative to a plane of the workpiece. 如申請專利範圍第93項所述的裝置,其中,該等 複數的可撓曲支撐構件係包含有複數的長形可撓曲支撐構件。 The device of claim 93, wherein the The plurality of flexible support members comprise a plurality of elongate flexible support members. 如申請專利範圍第99項所述的裝置,其中,該複數的長形可撓曲支撐構件係包含有至少20個長形可撓曲支撐構件。 The device of claim 99, wherein the plurality of elongate flexible support members comprise at least 20 elongate flexible support members. 如申請專利範圍第99項所述的裝置,其中,該複數的長形可撓曲支撐構件係包含有至少50個長形可撓曲支撐構件。 The device of claim 99, wherein the plurality of elongate flexible support members comprise at least 50 elongate flexible support members. 如申請專利範圍第74項所述的裝置,其中,每個可撓曲支撐構件係包含有第一及第二分隔的限制部位,且該未限制部位係在一個介於該等限制部位之間的彎曲路徑中延伸。 The device of claim 74, wherein each flexible support member comprises a first and a second spaced restriction portion, and the unrestricted portion is between the restriction portions The curved path extends. 如申請專利範圍第79項所述的裝置,其中,每個可撓曲支撐構件皆包含有在該支撐構件之相對端部處的第一及第二限制部位,且該等相對端部係在其間界定該未限制部位,並且其中,該至少一個限制器係包含有第一及第二限制器,該等限制器係被建構成用來以分隔開的關係限制第一及第二限制部位,用以導致該未限制部位在一個介於該等限制部位之間的彎曲路徑中延伸。 The device of claim 79, wherein each of the flexible support members includes first and second restriction portions at opposite ends of the support member, and the opposite ends are attached Delimiting the unrestricted portion therebetween, and wherein the at least one restrictor comprises first and second restrictors configured to limit the first and second restricted portions in a spaced apart relationship And to cause the unrestricted portion to extend in a curved path between the restricted portions. 如申請專利範圍第102項所述的裝置,其中,該未限制部位係沿著彎曲路徑從第一限制部位向上且向內地朝向該工件延伸到與其接觸的一個區域,並且用以從該接觸區域向下且向外地延伸到該第二限制部位。 The device of claim 102, wherein the unrestricted portion extends upwardly and inwardly from the first restriction portion along the curved path toward the workpiece to an area in contact therewith and is used to contact the contact region Extending downward and outward to the second restriction site. 如申請專利範圍第104項所述的裝置,其中,該 未限制部位係沿著彎曲路徑延伸,使得在該接觸區域處之該未限制部位的一個切線係實質上平行於在該接觸區域附近中該工件之一個外部周圍的一個切線。 The device of claim 104, wherein the The unrestricted portion extends along the curved path such that a tangent to the unconstrained portion at the contact region is substantially parallel to a tangent to an outer periphery of the workpiece in the vicinity of the contact region. 如申請專利範圍第104項所述的裝置,其中,該未限制部位係沿著彎曲路徑延伸,使得在該接觸區域處之該未限制部位的一個切線係徑向而向內地朝向該工件的一個中心延伸。 The device of claim 104, wherein the unrestricted portion extends along a curved path such that a tangent to the unconstrained portion at the contact region is radially and inward toward the workpiece The center extends. 如申請專利範圍第102項所述的裝置,其中,該未限制部位係沿著彎曲路徑延伸,用以形成一個第一大體上環圈形路徑片段、一個第二大體上環圈形路徑片段以及一個第三大體上環圈形路徑片段;該第一大體上環圈形路徑片段係在該工件的一個平面下方從該第一限制部位處延伸並且在工件的一個下方表面處接觸該工件;該第二大體上環圈形路徑片段係在該工件的一個外部邊緣與一個工件平面板件之一個內部邊緣之間延伸;該第三大體上環圈形路徑片段係延伸於該工件的平面上方並且係在該工件的一個上方表面處接觸該工件,該彎曲路徑係終止於該第二限制部位處。 The device of claim 102, wherein the unrestricted portion extends along a curved path to form a first substantially loop-shaped path segment, a second substantially loop-shaped path segment, and a first a substantially substantially loop-shaped path segment; the first substantially loop-shaped path segment extending from the first restriction portion below a plane of the workpiece and contacting the workpiece at a lower surface of the workpiece; the second substantially loop A loop-shaped path segment extends between an outer edge of the workpiece and an inner edge of a workpiece planar panel; the third substantially loop-shaped path segment extends above the plane of the workpiece and is attached to one of the workpieces The workpiece is contacted at the upper surface, and the curved path terminates at the second restriction. 如申請專利範圍第107項所述的裝置,其更包含有一個縮回器,該縮回器係被建構成用以縮回該第二限制部位,用以移動該第三大體上環圈形路徑片段離開一個被界定在該工件之上方表面上方的體積。 The device of claim 107, further comprising a retractor configured to retract the second restriction portion for moving the third substantially annular path The segment leaves a volume defined above the upper surface of the workpiece. 如申請專利範圍第102項所述的裝置,其中,該第一及該第二限制部位係被固定到一個工件平面板件,用 以防止該等限制部位的運動。 The device of claim 102, wherein the first and the second restriction portions are fixed to a workpiece flat plate member. To prevent the movement of these restricted parts. 如申請專利範圍第102項所述的裝置,其中,至少該第一及該第二限制部位的其中之一係以可以縮回的方式被限制住。 The device of claim 102, wherein at least one of the first and second restriction sites is restrained in a retractable manner. 如申請專利範圍第110項所述的裝置,其更包含有一個縮回器,該縮回器係被建構成用以縮回至少該第一及該第二限制部位的其中之一,用以有效率地增長該未限制部位。 The device of claim 110, further comprising a retractor configured to retract at least one of the first and second restriction portions for The unrestricted portion is efficiently grown. 如申請專利範圍第110項所述的裝置,其更包含有一個縮回器,該縮回器係被建構成用以縮回至少該第一及該第二限制部位的其中之一,用以有效率地增長該未限制部位。 The device of claim 110, further comprising a retractor configured to retract at least one of the first and second restriction portions for The unrestricted portion is efficiently grown. 如申請專利範圍第74項所述的裝置,其中,該複數的可撓曲支撐構件係包含有第一及第二複數的長形可撓曲支撐構件,其中,該第一複數的可撓曲支撐構件的未限制部位係可以與該工件的一個下方表面相銜接,並且其中,該第二複數的可撓曲支撐構件的未限制部位係可以與該工件的一個上方表面相銜接。 The device of claim 74, wherein the plurality of flexible support members comprise first and second plurality of elongate flexible support members, wherein the first plurality of flexible members The unrestricted portion of the support member can engage a lower surface of the workpiece, and wherein the unconstrained portion of the second plurality of flexible support members can engage an upper surface of the workpiece. 如申請專利範圍第1項所述的裝置,其更包含有一個側向支撐構件,其係被建構成用以側向地支撐工件。 The device of claim 1, further comprising a lateral support member configured to laterally support the workpiece. 如申請專利範圍第114項所述的裝置,其中,該側向支撐構件係包含有位於相對於該工件之一個外部邊緣的各個位置處之複數的側向支撐構件。 The device of claim 114, wherein the lateral support member comprises a plurality of lateral support members at various locations relative to an outer edge of the workpiece. 如申請專利範圍第115項所述的裝置,其中,該 複數的側向支撐構件中的每個支撐構件係可以彈性地與該工件的外部邊緣相銜接。 The device of claim 115, wherein the device Each of the plurality of lateral support members can resiliently engage the outer edge of the workpiece. 如申請專利範圍第115項所述的裝置,其中,該複數的側向支撐構件係包含有複數的可撓曲纖維。 The device of claim 115, wherein the plurality of lateral support members comprise a plurality of flexible fibers. 如申請專利範圍第117項所述的裝置,其中,該等可撓曲纖維係被定位在一個實質上正向於該工件之一個平面的角度處。 The device of claim 117, wherein the flexible fiber systems are positioned at an angle substantially normal to a plane of the workpiece. 如申請專利範圍第114項所述的裝置,其中,該支撐構件係包含有該側向支撐構件,並且其中,該支撐構件係包含有一個可以與該工件的一個下方表面相銜接之可移動的垂直銜接部位、以及一個可以與該工件的一個外部邊緣相銜接之側向支撐銜接部位。 The device of claim 114, wherein the support member comprises the lateral support member, and wherein the support member comprises a movable member engageable with a lower surface of the workpiece A vertical engagement portion and a lateral support engagement portion engageable with an outer edge of the workpiece. 如申請專利範圍第119項所述的裝置,其中,該支撐構件係包含有複數的支撐構件,該等複數的支撐構件係包含有可以與該工件相銜接之複數的垂直及側向支撐銜接部位。 The device of claim 119, wherein the support member comprises a plurality of support members, the plurality of support members comprising a plurality of vertical and lateral support joints engageable with the workpiece . 如申請專利範圍第119項所述的裝置,其中,該等垂直及側向支撐銜接部位係可以彈性地與該工件相銜接。 The device of claim 119, wherein the vertical and lateral support engaging portions are resiliently engageable with the workpiece. 如申請專利範圍第119項所述的裝置,其中,該等垂直及側向支撐銜接部位係為可撓曲的。 The device of claim 119, wherein the vertical and lateral support engaging portions are flexible. 如申請專利範圍第122項所述的裝置,其中,該等垂直及側向支撐銜接部位係包含有第一及第二纖維。 The device of claim 122, wherein the vertical and lateral support engaging portions comprise first and second fibers. 如申請專利範圍第117項所述的裝置,其中,該 等纖維係包含有光學纖維。 The device of claim 117, wherein the device The fiber system contains optical fibers. 如申請專利範圍第117項所述的裝置,其中,該等纖維係包含有石英纖維。 The device of claim 117, wherein the fibers comprise quartz fibers. 如申請專利範圍第117項所述的裝置,其中,該等纖維係包含有藍寶石纖維。 The device of claim 117, wherein the fibers comprise sapphire fibers. 如申請專利範圍第1項所述的裝置,其中,該照射系統係被建構成用來照射該表面一段少於大約1毫秒的時間。 The device of claim 1, wherein the illumination system is configured to illuminate the surface for a period of less than about 1 millisecond. 如申請專利範圍第1項所述的裝置,其中,該照射系統係被建構成用來:該照射系統係被建構成用來照射該工件之表面一段短於工件之熱傳導時間的第一時間週期,用以將該表面加熱到一個中間溫度,該中間溫度係大於大部份之工件的溫度;以及該照射系統係被建構成用來照射該表面一段短於工件之熱傳導時間的第二時間週期,用以將該表面加熱到一個大於該中間溫度的所希求的溫度,其中,該第二時間週期係在該第一時間週期之後的一個間隔之內開始,其係足以容許該工件之至少一些熱壓彎。 The apparatus of claim 1, wherein the illumination system is configured to: the illumination system is configured to illuminate a surface of the workpiece for a first time period shorter than a heat conduction time of the workpiece Heating the surface to an intermediate temperature that is greater than a temperature of a majority of the workpiece; and the illumination system is configured to illuminate the surface for a second time period that is shorter than the heat transfer time of the workpiece Heating the surface to a desired temperature greater than the intermediate temperature, wherein the second time period begins within an interval after the first time period, which is sufficient to allow at least some of the workpiece Hot bending. 如申請專利範圍第128項所述的裝置,其中,該照射系統係被建構成用以在該第二時間週期期間將比在第一時間週期期間更多的能量施加到該工件的表面。 The device of claim 128, wherein the illumination system is configured to apply more energy to the surface of the workpiece during the second time period than during the first time period. 如申請專利範圍第128項所述的裝置,其中,該照射系統係被建構成用以在該第一時間週期的結束之後的 數毫秒內開始進行該第二時間週期。 The device of claim 128, wherein the illumination system is constructed to be after the end of the first time period The second time period begins within a few milliseconds. 如申請專利範圍第1項所述的裝置,其中,該照射系統係被建構成用以在一個間隔中連續地照射該工件的表面,該間隔係短於該工件的熱傳導時間,並且係夠長以容許該工件的至少一些熱壓彎。 The apparatus of claim 1, wherein the illumination system is configured to continuously illuminate a surface of the workpiece in an interval that is shorter than a heat conduction time of the workpiece and is long enough To allow at least some hot bending of the workpiece. 如申請專利範圍第1項所述的裝置,其中,該照射系統係被建構成用以在該間隔期間改變照射的強度。 The device of claim 1, wherein the illumination system is configured to vary the intensity of the illumination during the interval. 如申請專利範圍第132項所述的裝置,其中,該照射系統係被建構成用以在該間隔的一個較後部份期間將比在該間隔的一個較前部份期間用一個更大的強度照射該表面。 The device of claim 132, wherein the illumination system is configured to use a larger period during a later portion of the interval than during a earlier portion of the interval The surface is illuminated by intensity. 如申請專利範圍第1項所述的裝置,其中,該照射系統係包含有一個閃光燈。 The device of claim 1, wherein the illumination system comprises a flash. 如申請專利範圍第134項所述的裝置,其中,該閃光燈係包含有一個液體冷卻的弧光燈。 The device of claim 134, wherein the flash unit comprises a liquid cooled arc lamp. 如申請專利範圍第134項所述的裝置,其中,該閃光燈係包含有一個水壁式的弧光燈。 The device of claim 134, wherein the flash unit comprises a water wall type arc lamp. 如申請專利範圍第136項所述的裝置,其中,該水壁式弧光燈係包含有一個雙重水壁式弧光燈。 The device of claim 136, wherein the water wall arc lamp comprises a double water wall arc lamp. 如申請專利範圍第1項、及第3項至第137項其中任一項所述的裝置,其中,該工件包含有一個半導體晶圓,並且其中,該支撐系統係被建構成用以在容許該晶圓之以熱運動時,支撐該晶圓。 The apparatus of any one of claims 1 to 3, wherein the workpiece comprises a semiconductor wafer, and wherein the support system is constructed to allow The wafer is supported by the wafer during thermal motion. 一種支撐半導體工件的方法,該方法包含有以下 的步驟:藉著相對於大部份的工件加熱該工件的一個表面,用以造成該半導體工件之以熱引動的運動,其中,加熱的步驟包含照射該工件的該表面一段時間,該時間係短於該工件的一個熱傳導時間,用以將該工件加熱到一個溫度,該溫度係大於大部份工件的一個溫度,且其中造成該以熱引動的運動的步驟包含造成工件的外部邊緣區域與工件中央相對於彼此的垂直運動;及在支撐工件時,容許該工件之該以熱引動的運動,其中,該支撐的步驟係包含有將一個支撐構件的一個可移動銜接部位與該工件相銜接,前述的銜接部位係可在與工件銜接時響應於包含工件的外部邊緣區域與工件中央相對於彼此的垂直運動的以熱引動的運動而移動。 A method of supporting a semiconductor workpiece, the method comprising the following a step of heating a surface of the workpiece by heat relative to a majority of the workpiece to cause a thermally actuated motion of the semiconductor workpiece, wherein the step of heating includes illuminating the surface of the workpiece for a period of time a heat conduction time shorter than the workpiece for heating the workpiece to a temperature greater than a temperature of a majority of the workpiece, and wherein the step of causing the thermally induced motion comprises causing an outer edge region of the workpiece Vertical movement of the center of the workpiece relative to each other; and permitting the thermally actuated movement of the workpiece when supporting the workpiece, wherein the step of supporting includes engaging a movable engagement portion of a support member with the workpiece The aforementioned engagement portion is movable in response to a thermally actuated motion comprising a vertical movement of the outer edge region of the workpiece and the center of the workpiece relative to each other when engaged with the workpiece. 如申請專利範圍第139項所述的方法,其中,該銜接的步驟係包含有將該支撐構件之可移動銜接部位與一個半導體晶圓相銜接,前述的銜接部位係可以被移動,用以在支撐該晶圓時,容許該晶圓之以熱引動的運動。 The method of claim 139, wherein the step of engaging comprises engaging the movable engaging portion of the supporting member with a semiconductor wafer, and the engaging portion can be moved to When the wafer is supported, the movement of the wafer is allowed to be thermally induced. 如申請專利範圍第139項所述的方法,其更包含有反應於該工件之以熱引動的運動而自動地容許該銜接部位的運動。 The method of claim 139, further comprising the act of thermally urging the workpiece to automatically permit movement of the engagement portion. 如申請專利範圍第139項所述的方法,其中,容許以熱引動之運動的步驟係包含有容許該銜接部位的運動,用以在該以熱引動之運動期間,在支撐著該工件時,將在該工件中的應力減小到最小的程度。 The method of claim 139, wherein the step of permitting the movement of the heat priming comprises allowing movement of the engagement portion for supporting the workpiece during the movement of the heat priming, The stress in the workpiece is reduced to a minimum. 如申請專利範圍第139項所述的方法,其中,容許以熱引動之運動的步驟係包含有在將該工件之一個質量中心保持在一個所希求範圍之中時,該工件之外部區域的運動。 The method of claim 139, wherein the step of permitting the motion of the heat priming comprises the movement of the outer region of the workpiece while maintaining a center of mass of the workpiece within a desired range . 如申請專利範圍第143項所述的方法,其中,保持的步驟係包含有將該工件之質量中心的運動減少到最小的程度。 The method of claim 143, wherein the maintaining step comprises reducing the movement of the center of mass of the workpiece to a minimum. 如申請專利範圍第139項所述的方法,其中,容許的步驟係包含有容許該工件的熱壓彎。 The method of claim 139, wherein the permissible step comprises thermally pressing the workpiece. 如申請專利範圍第139項所述的方法,其中,容許的步驟係包含有容許該工件的熱彎曲。 The method of claim 139, wherein the permissible step comprises allowing thermal bending of the workpiece. 如申請專利範圍第139項所述的方法,其中,銜接的步驟係包含有將該工件當作該銜接部位與一個剛性可移動之支撐構件的一個部位相銜接。 The method of claim 139, wherein the step of engaging comprises engaging the workpiece as the engagement portion with a portion of a rigidly movable support member. 如申請專利範圍第139項所述的方法,其中,該支撐構件是可撓曲的並且具有一個限制部位以及一個未限制部位,並且其中,銜接的步驟係包含有將該未限制部位與該工件相銜接。 The method of claim 139, wherein the support member is flexible and has a restriction portion and an unrestricted portion, and wherein the step of engaging includes the unrestricted portion and the workpiece Connected. 如申請專利範圍第139項所述的方法,其中,銜接的步驟係包含有將該支撐構件的可移動銜接部位與該工件相銜接。 The method of claim 139, wherein the step of engaging comprises engaging the movable engagement portion of the support member with the workpiece. 如申請專利範圍第139項所述的方法,其中,銜接的步驟係包含有將複數個各自之支撐構件的複數個可移動銜接部位與該工件相銜接。 The method of claim 139, wherein the step of engaging comprises engaging a plurality of movable engagement portions of the plurality of respective support members with the workpiece. 如申請專利範圍第150項所述的方法,其中,銜接的步驟係包含有將至少三個各自之支撐構件的至少三個可移動銜接部位與該工件相銜接。 The method of claim 150, wherein the step of engaging comprises engaging at least three movable engagement portions of at least three respective support members with the workpiece. 如申請專利範圍第150項所述的方法,其中,銜接的步驟係包含有將至少四個各自之支撐構件的至少四個可移動銜接部位與該工件相銜接。 The method of claim 150, wherein the step of engaging comprises engaging at least four movable engagement portions of at least four respective support members with the workpiece. 如申請專利範圍第139項所述的方法,其更包含有壓制該工件的震動的步驟。 The method of claim 139, further comprising the step of suppressing vibration of the workpiece. 如申請專利範圍第153項所述的方法,其中,壓制的步驟係包含有壓制該工件之自然震動模式的至少其中之一。 The method of claim 153, wherein the step of pressing comprises at least one of a natural vibration mode of pressing the workpiece. 如申請專利範圍第154項所述的方法,其中,壓制的步驟係包含有壓制該工件的一個第二自然震動模式。 The method of claim 154, wherein the step of pressing comprises a second natural vibration mode of pressing the workpiece. 如申請專利範圍第154項所述的方法,其中,壓制的步驟係包含有壓制該工件的一個第一自然震動模式。 The method of claim 154, wherein the step of pressing comprises a first natural vibration mode of pressing the workpiece. 如申請專利範圍第153項所述的方法,其中,壓制的步驟係包含有從該工件吸收動能。 The method of claim 153, wherein the step of pressing comprises absorbing kinetic energy from the workpiece. 如申請專利範圍第150項所述的方法,其中,銜接的步驟係包含有將複數個各自之支撐栓釘的複數個尖端與該工件相銜接。 The method of claim 150, wherein the step of engaging comprises engaging a plurality of tips of the plurality of respective support pegs with the workpiece. 如申請專利範圍第158項所述的方法,其中,銜接的步驟係包含有將該等支撐栓釘的尖端與該工件之一個外部周圍區域相銜接。 The method of claim 158, wherein the step of engaging comprises engaging a tip end of the support stud with an outer peripheral region of the workpiece. 如申請專利範圍第159項所述的方法,其更包含 有反應於該工件之外部周圍區域之以熱引動的運動而自動地容許該等支撐栓釘之尖端的運動。 For example, the method described in claim 159 of the patent scope further includes The movement of the tips of the support pegs is automatically allowed in response to the thermally actuated motion of the outer peripheral region of the workpiece. 如申請專利範圍第150項所述的方法,其中,銜接的步驟係包含有將每個可移動的銜接部位彈性地與該工件相銜接。 The method of claim 150, wherein the step of engaging comprises elastically engaging each of the movable engagement portions with the workpiece. 如申請專利範圍第161項所述的方法,其中,彈性地銜接的步驟係包含有將一個作用力應用到該等支撐構件,用以導致每個銜接部位皆傾向於在該工件之以熱引動的運動期間保持與該工件的接觸。 The method of claim 161, wherein the step of elastically engaging comprises applying a force to the support members to cause each of the engagement portions to tend to be thermally actuated on the workpiece. The contact with the workpiece is maintained during the movement. 如申請專利範圍第162項所述的方法,其中,應用一個作用力的步驟係包含有將一個力矩應用到每個支撐構件。 The method of claim 162, wherein the step of applying a force comprises applying a moment to each of the support members. 如申請專利範圍第163項所述的方法,其中,應用一個力矩的步驟係包含有在每個支撐構件上的一個位置處應用一個向上作用力,而該支撐構件係被插置在該支撐構件的一個樞轉點與該銜接部位之間。 The method of claim 163, wherein the step of applying a moment comprises applying an upward force at a position on each of the support members, and the support member is interposed in the support member A pivot point is between the hinged portion. 如申請專利範圍第163項所述的方法,其中,應用一個力矩的步驟係包含有在每個支撐構件上的一個位置處應用一個向下作用力,使得該支撐構件的一個樞轉點係被插置在位置與該銜接部位之間。 The method of claim 163, wherein the step of applying a moment comprises applying a downward force at a position on each of the support members such that a pivot point of the support member is Inserted between the position and the joint. 如申請專利範圍第162項所述的方法,其中,應用一個作用力的步驟係包含有應用第一及第二作用力,用以將第一及第二相對的力矩應用到每個支撐構件,該第二力矩係作用以藉著該支撐構件對抗支撐構件的一個平衡位 置。 The method of claim 162, wherein the step of applying a force comprises applying the first and second forces to apply the first and second relative moments to each of the support members, The second moment acts to counter a balance of the support member by the support member Set. 如申請專利範圍第162項所述的方法,其中,應用一個作用力的步驟係包含有應用一個彈簧作用力。 The method of claim 162, wherein the step of applying a force comprises applying a spring force. 如申請專利範圍第167項所述的方法,其中,應用該彈簧作用力的步驟係包含有藉著一個被連接到每個支撐構件的彈簧應用該作用力。 The method of claim 167, wherein the step of applying the spring force comprises applying the force by a spring coupled to each of the support members. 如申請專利範圍第167項所述的方法,其中,應用該彈簧作用力的步驟係包含有藉著一個被連接到每個支撐構件的固定作用力彈簧應用一個固定作用力。 The method of claim 167, wherein the step of applying the spring force comprises applying a fixed force by a fixed force spring coupled to each of the support members. 如申請專利範圍第158項所述的方法,其中,銜接的步驟係包含有將複數個各自之支撐栓釘的複數個尖端與該工件相銜接,而該等支撐栓釘係包含有對於至少一些照射波長來說為透明的材料,而該工件係能夠藉著該等照射波長而照射加熱。 The method of claim 158, wherein the step of engaging comprises engaging a plurality of tips of the plurality of respective support pegs with the workpiece, and the supporting studs are included for at least some The material is transparent to the wavelength of the illumination, and the workpiece is capable of being irradiated with heat by the illumination wavelengths. 如申請專利範圍第158項所述的方法,其中,銜接的步驟係包含有將複數個各自之支撐栓釘的複數個尖端與該工件相銜接,而該等支撐栓釘係包含有光學透明的材料。 The method of claim 158, wherein the step of engaging comprises engaging a plurality of tips of the plurality of respective support pegs with the workpiece, and the support studs comprise optically transparent material. 如申請專利範圍第158項所述的方法,其中,銜接的步驟係包含有將複數個各自之支撐栓釘的複數個尖端與該工件相銜接,而該等支撐栓釘係包含有石英。 The method of claim 158, wherein the step of engaging comprises engaging a plurality of tips of the plurality of respective support pegs with the workpiece, and the support studs comprise quartz. 如申請專利範圍第158項所述的方法,其中,銜接的步驟係包含有將複數個各自之支撐栓釘的複數個尖端與該工件相銜接,而該等支撐栓釘係包含有藍寶石。 The method of claim 158, wherein the step of engaging comprises engaging a plurality of tips of the plurality of respective support pegs with the workpiece, and the support studs comprise sapphire. 如申請專利範圍第158項所述的方法,其中,銜接的步驟係包含有將複數個各自之支撐栓釘的複數個尖端與該工件相銜接,而該等支撐栓釘係包含有金屬。 The method of claim 158, wherein the step of engaging comprises engaging a plurality of tips of the plurality of respective support pegs with the workpiece, and the support studs comprise metal. 如申請專利範圍第158項所述的方法,其中,銜接的步驟係包含有將複數個各自之支撐栓釘的複數個尖端與該工件相銜接,而該等支撐栓釘係包含有鎢。 The method of claim 158, wherein the step of engaging comprises engaging a plurality of tips of the plurality of respective support pegs with the workpiece, and the support studs comprise tungsten. 如申請專利範圍第158項所述的方法,其中,銜接的步驟係包含有將複數個各自之支撐栓釘的複數個被塗層尖端與該工件相銜接。 The method of claim 158, wherein the step of engaging comprises engaging a plurality of coated tips of the plurality of respective support pegs with the workpiece. 如申請專利範圍第176項所述的方法,其中,銜接的步驟係包含有將複數個各自之鎢的支撐栓釘的複數個氮化鎢塗層之尖端與該工件相銜接。 The method of claim 176, wherein the step of engaging comprises engaging a tip of a plurality of tungsten nitride coatings of a plurality of respective tungsten support studs with the workpiece. 如申請專利範圍第176項所述的方法,其中,銜接的步驟係包含有將複數個各自之鎢的支撐栓釘的複數個碳化鎢塗層之尖端與該工件相銜接。 The method of claim 176, wherein the step of engaging comprises engaging a tip of a plurality of tungsten carbide coatings of a plurality of respective tungsten support studs with the workpiece. 如申請專利範圍第150項所述的方法,其中,銜接的步驟係包含有將複數個各自之支撐栓釘的複數個平滑表面之尖端與該工件相銜接。 The method of claim 150, wherein the step of engaging comprises engaging a tip of the plurality of smooth surfaces of the plurality of respective support pegs with the workpiece. 如申請專利範圍第150項所述的方法,其更包含有反應於該工件之以熱引動的運動來移動該等可移動的銜接部位。 The method of claim 150, further comprising moving the movable engagement portion in response to the thermally actuated motion of the workpiece. 如申請專利範圍第180項所述的方法,其中,移動該等可移動銜接部位的步驟包含有移動該等支撐構件。 The method of claim 180, wherein the step of moving the movable engagement locations comprises moving the support members. 如申請專利範圍第181項所述的方法,其中,移 動該等支撐構件的步驟係包含有對於每個支撐構件來說,將一個電流應用到一個被連接到該支撐構件的致動器。 For example, the method described in claim 181, wherein The step of moving the support members includes applying, for each support member, a current to an actuator connected to the support member. 如申請專利範圍第182項所述的方法,其中,應用一個電流的步驟係包含有將一個電流應用到一個被連接到該支撐構件的聲音線圈致動器。 The method of claim 182, wherein the step of applying a current comprises applying a current to a voice coil actuator connected to the support member. 如申請專利範圍第182項所述的方法,其中,應用一個電流的步驟係包含有將一個電流應用到一個被連接到該支撐構件的壓電致動器。 The method of claim 182, wherein the step of applying a current comprises applying a current to a piezoelectric actuator connected to the support member. 如申請專利範圍第182項所述的方法,其中,應用一個電流的步驟係包含有將一個電流應用到一個被連接到該支撐構件的線性伺服致動器。 The method of claim 182, wherein the step of applying a current comprises applying a current to a linear servo actuator coupled to the support member. 如申請專利範圍第182項所述的方法,其更包含有將該致動器之一個可移動構件的線性運動轉換成該支撐構件的一個拱形運動。 The method of claim 182, further comprising converting an linear motion of a movable member of the actuator into an arched motion of the support member. 如申請專利範圍第181項所述的方法,其中,移動的步驟係包含有調整該複數個支撐構件的位置,用以將介於該工件之一個重量與一個向上作用力之間的一個差異減小到最小的程度,其中,該向上作用力係藉著複數個支撐構件的複數個銜接部位被應用到該工件。 The method of claim 181, wherein the moving step comprises adjusting a position of the plurality of support members to reduce a difference between a weight of the workpiece and an upward force. To a minimum extent, wherein the upward force is applied to the workpiece by a plurality of joint locations of the plurality of support members. 如申請專利範圍第181項所述的方法,其中,移動的步驟係包含有調整該複數個支撐構件的位置,用以將介於該工件之一個重量與一個向上作用力之間的一個差異保持在所希求的範圍之內,其中,該向上作用力係藉著該等支撐構件的銜接部位被應用到該工件。 The method of claim 181, wherein the moving step comprises adjusting a position of the plurality of support members to maintain a difference between a weight of the workpiece and an upward force Within the desired range, wherein the upward force is applied to the workpiece by the joint of the support members. 如申請專利範圍第180項所述的方法,其中,反應於以熱引動的運動來移動該等銜接部位的步驟係包含有反應於該以熱引動之運動的一個預定數值來移動該等支撐構件。 The method of claim 180, wherein the step of reacting the thermally coupled movements to move the engagement sites comprises moving the support members in response to the predetermined value of the motion of the thermal actuation. . 如申請專利範圍第180項所述的方法,其中,反應於以熱引動的運動來移動該等銜接部位的步驟係包含有反應於該以熱引動之運動的一個臂偵測到的參數來移動該等支撐構件。 The method of claim 180, wherein the step of reacting the thermally coupled movements to move the engagement sites comprises moving the parameters detected by the one arm of the thermally actuated motion to move The support members. 如申請專利範圍第180項所述的方法,其更包含有偵測出該件之以熱引動的運動。 The method of claim 180, further comprising detecting the thermally actuated motion of the member. 如申請專利範圍第191項所述的方法,其中,偵測的步驟係包含有,在每個複數個致動器(每個致動器係被連接到複數的支撐構件中的各自其中之一)之中,偵測出從一個藉著工件的運動而被應用到該支撐構件之銜接部位的作用力所產生的一個電流。 The method of claim 191, wherein the detecting step comprises: at each of the plurality of actuators (each actuator is connected to one of a plurality of support members) Among them, a current generated by a force applied to the joint portion of the support member by the movement of the workpiece is detected. 如申請專利範圍第192項所述的方法,其中,移動該等銜接部位的步驟係包含有將一個電流應用到每個致動器。 The method of claim 192, wherein the step of moving the joints comprises applying a current to each of the actuators. 如申請專利範圍第192項所述的方法,其中,偵測該電流的步驟係包含有偵測出在每個複數個聲音線圈致動器(每個致動器係被連接到各自的其中一個支撐構件)之中的電流,並且其中,移動該等銜接部位的步驟係包含有將電流應用到該等聲音線圈致動器。 The method of claim 192, wherein the step of detecting the current comprises detecting at each of the plurality of voice coil actuators (each actuator is connected to one of the respective ones) The current in the support member), and wherein the step of moving the engagement locations includes applying a current to the acoustic coil actuators. 如申請專利範圍第192項所述的方法,其中,偵 測出電流的步驟係包含有,對於每個致動器來說,偵測出該電流與一個所希求之電流位準的誤差,並且其中,移動該銜接部位的步驟係包含有,對於每個支撐構件來說,調整該支撐構件的一個位置,用以將該誤差減小到最小的程度。 For example, the method described in claim 192, wherein The step of measuring the current includes, for each actuator, detecting an error of the current and a desired current level, and wherein the step of moving the joint portion includes, for each For the support member, a position of the support member is adjusted to minimize this error. 如申請專利範圍第195項所述的方法,其中,偵測該誤差的步驟係包含有偵測出在一個與該致動器相連通之處理器電路處的誤差。 The method of claim 195, wherein the step of detecting the error comprises detecting an error at a processor circuit in communication with the actuator. 如申請專利範圍第150項所述的方法,其中,銜接的步驟係包含有將第一複數個各自之支撐構件的第一複數個可移動銜接部位與該工件的一個下方表面相銜接、以及將第二複數個支撐構件的第二複數個銜接部位與該工件的一個上方表面相銜接。 The method of claim 150, wherein the step of engaging comprises engaging a first plurality of movable engagement portions of the first plurality of respective support members with a lower surface of the workpiece, and A second plurality of engagement locations of the second plurality of support members engage the upper surface of the workpiece. 如申請專利範圍第197項所述的方法,其中,銜接的步驟係包含有將該第一及該第二複數個銜接部位與該工件的下方及上方表面在該工件的一個外部周圍區域處相銜接。 The method of claim 197, wherein the step of engaging comprises: locating the first and second plurality of engagement portions with an underside and an upper surface of the workpiece at an outer peripheral region of the workpiece Connect. 如申請專利範圍第180項所述的方法,其中,移動的步驟係包含有移動該等銜接部位,用以將被應用在該工件與該等銜接部位之間的作用力減小到最小的程度。 The method of claim 180, wherein the moving step comprises moving the engaging portions to minimize the force applied between the workpiece and the engaging portions. . 如申請專利範圍第199項所述的方法,其中,移動的步驟係包含有移動與該工件之一個下方表面相銜接之第一複數個各自之支撐構件的第一複數個銜接部位,用以將一個介於該工件的一個重量與一個作用力之間的差異減 小到最小的程度,而該作用力係被應用在該第一複數個銜接部位與該工件之間。 The method of claim 199, wherein the moving step comprises: a first plurality of engaging portions that move a first plurality of respective supporting members that are coupled to a lower surface of the workpiece for a difference between a weight and a force between the workpiece minus To a minimum extent, the force is applied between the first plurality of joints and the workpiece. 如申請專利範圍第200項所述的方法,其中,移動的步驟係包含有移動與該工件之一個下方表面相銜接之第一複數個各自之支撐構件的第一複數個銜接部位,用以將一個被應用在該工件與該第二複數個銜接部位之間的作用力減小到最小的程度。 The method of claim 200, wherein the moving step comprises a first plurality of engaging portions that move a first plurality of respective support members that engage a lower surface of the workpiece for A force applied between the workpiece and the second plurality of engaging portions is minimized. 如申請專利範圍第180項所述的方法,其中,銜接的步驟係包含有將支撐構件的銜接部位與該工件彈性地相銜接,以及其中,移動的步驟係包含有反應於該以熱引動的運動來移動該等支撐構件。 The method of claim 180, wherein the step of engaging comprises elastically engaging the joint portion of the support member with the workpiece, and wherein the step of moving comprises reacting to the heat urging Move to move the support members. 如申請專利範圍第202所述的方法,其中,彈性地銜接的步驟係包含有繞著支撐構件的各個樞轉點將力矩應用到該等支撐構件,用以導致該等銜接部位傾向於保持與該工件的接觸,並且其中,移動的步驟係包含有移動該等支撐構件的樞轉點。 The method of claim 202, wherein the step of elastically engaging includes applying a moment to each of the pivoting points of the support member to cause the coupling portions to tend to remain The contact of the workpiece, and wherein the step of moving includes pivoting points that move the support members. 如申請專利範圍第203項所述的方法,其中,應用力矩的步驟係包含有在除了該等支撐構件之樞轉點的位置之外將彈簧作用力應用到該等支撐構件,並且其中,移動的步驟係包含有將電流應用到被連接到複數個支撐構件的複數個致動器,用以移動該等支撐構件。 The method of claim 203, wherein the step of applying a moment comprises applying a spring force to the support members at positions other than the pivot points of the support members, and wherein The steps include applying a current to a plurality of actuators coupled to the plurality of support members for moving the support members. 如申請專利範圍第202項所述的方法,其中,該複數個支撐構件係包含有複數個可撓曲支撐構件,每個可撓曲支撐構件皆具有一個限制部位及一個未限制部位;其 中,彈性地銜接的步驟係包含有將該等可撓曲支撐構件之未限制部位與該工件彈性地相銜接;以及其中,移動的步驟係包含有移動該等支撐構件的限制部位。 The method of claim 202, wherein the plurality of support members comprise a plurality of flexible support members, each of the flexible support members having a restriction portion and an unrestricted portion; The step of elastically engaging includes elastically engaging the unrestricted portions of the flexible support members with the workpiece; and wherein the step of moving includes restricting portions for moving the support members. 如申請專利範圍第205項所述的方法,其中,移動的步驟係包含有將電流應用到被連接到複數個限制部位的複數個致動器。 The method of claim 205, wherein the step of moving comprises applying a current to a plurality of actuators connected to the plurality of restriction sites. 如申請專利範圍第202項所述的方法,其更包含有偵測出該工件之以熱引動的運動。 The method of claim 202, further comprising detecting the thermally actuated motion of the workpiece. 如申請專利範圍第150項所述的方法,其中,該複數個支撐構件係包含有複數個可撓曲支撐構件,每個可撓曲支撐構件皆具有一個限制部位及一個未限制部位;以及其中,銜接該複數個可移動銜接部位的步驟係包含有將該等可撓曲支撐構件之未限制部位與該工件相銜接。 The method of claim 150, wherein the plurality of support members comprise a plurality of flexible support members, each of the flexible support members having a restriction portion and an unrestricted portion; The step of engaging the plurality of movable engagement locations includes engaging an unrestricted portion of the flexible support members with the workpiece. 如申請專利範圍第208項所述的方法,其中,該複數個可撓曲支撐構件係包含有複數的纖維,以及其中,銜接的步驟係包含有將該等纖維的未限制部位與該工件相銜接。 The method of claim 208, wherein the plurality of flexible support members comprise a plurality of fibers, and wherein the step of engaging comprises unrestricted portions of the fibers with the workpiece Connect. 如申請專利範圍第208項所述的方法,其中,該複數個可撓曲支撐構件係包含有複數的光學纖維,以及其中,銜接的步驟係包含有將該等光學纖維的未限制部位與該工件相銜接。 The method of claim 208, wherein the plurality of flexible support members comprise a plurality of optical fibers, and wherein the step of engaging comprises unrestricted portions of the optical fibers The workpieces are connected. 如申請專利範圍第208項所述的方法,其中,該複數個可撓曲支撐構件係包含有複數的石英纖維,以及其中,銜接的步驟係包含有將該等石英纖維的未限制部位與 該工件相銜接。 The method of claim 208, wherein the plurality of flexible support members comprise a plurality of quartz fibers, and wherein the step of engaging comprises unrestricted portions of the quartz fibers The workpieces are connected. 如申請專利範圍第208項所述的方法,其中,該複數個可撓曲支撐構件係包含有複數的藍寶石纖維,以及其中,銜接的步驟係包含有將該等藍寶石纖維的未限制部位與該工件相銜接。 The method of claim 208, wherein the plurality of flexible support members comprise a plurality of sapphire fibers, and wherein the step of engaging comprises unrestricted portions of the sapphire fibers The workpieces are connected. 如申請專利範圍第208項所述的方法,其更包含有限制該等可撓曲支撐構件的每個限制部位。 The method of claim 208, further comprising limiting each of the restricted portions of the flexible support members. 如申請專利範圍第213項所述的方法,其中,限制的步驟係包含有將位於被配置在該工件之一個外部周圍附近之複數個限制器之中的限制部位限制住。 The method of claim 213, wherein the limiting step comprises limiting a restriction located in a plurality of limiters disposed adjacent an outer periphery of the workpiece. 如申請專利範圍第214項所述的方法,其中,該複數個限制器係由較該等可撓曲支撐構件之數目還要少的限制器所組成的,並且其中,限制的步驟係包含有將在每個限制器之中之多於一個的可撓曲支撐構件限制住。 The method of claim 214, wherein the plurality of limiters are comprised of fewer limiters than the number of the flexible support members, and wherein the limiting steps include More than one flexible support member within each limiter is restrained. 如申請專利範圍第215項所述的方法,其中,限制的步驟係包含有,在每個限制器之中,將大體上為彼此平行之多於一個的可撓曲支撐構件限制住。 The method of claim 215, wherein the step of limiting comprises, in each of the restrictors, confining more than one flexible support member that is substantially parallel to each other. 如申請專利範圍第215項所述的方法,其中,限制的步驟係包含有,在每個限制器之中,將大體上為彼此分散之多於一個的可撓曲支撐構件限制住。 The method of claim 215, wherein the step of limiting comprises, in each of the restrictors, confining more than one flexible support member that is substantially dispersed from each other. 如申請專利範圍第214項所述的方法,其中,該複數個限制器係由與該等可撓曲支撐構件之數目相同的限制器所組成的,並且其中,限制的步驟係包含有將在一個各自對應之其中一個限制器的限制部位限制住。 The method of claim 214, wherein the plurality of limiters are comprised of the same number of limiters as the flexible support members, and wherein the limiting step comprises A limit of one of the respective limiters is limited. 如申請專利範圍第214項所述的方法,其中,銜接的步驟係包含有將一個作用力應用到每個限制器,用以導致每個未限制部位係傾向於在該工件之以熱引動之運動期間保持與該工件的接觸。 The method of claim 214, wherein the step of engaging comprises applying a force to each of the limiters to cause each unrestricted portion to tend to be thermally actuated in the workpiece. The contact with the workpiece is maintained during the movement. 如申請專利範圍第219項所述的方法,其中,應用一個作用力的步驟係包含有應用一個力矩。 The method of claim 219, wherein the step of applying a force comprises applying a moment. 如申請專利範圍第219項所述的方法,其中,應用一個作用力的步驟係包含有應用一個彈性作用力。 The method of claim 219, wherein the step of applying a force comprises applying an elastic force. 如申請專利範圍第208項所述的方法,其中,銜接的步驟係包含有將每個銜接部位與該工件的一個下方表面以一個相對於該工件之一個平面成10到80度的角度相銜接。 The method of claim 208, wherein the step of engaging comprises engaging each of the engaging portions with an undersurface of the workpiece at an angle of 10 to 80 degrees with respect to a plane of the workpiece. . 如申請專利範圍第208項所述的方法,其中,銜接的步驟係包含有將每個銜接部位與該工件的一個下方表面以一個相對於該工件之一個平面成15到35度的角度相銜接。 The method of claim 208, wherein the step of engaging comprises engaging each of the engaging portions with an undersurface of the workpiece at an angle of 15 to 35 degrees with respect to a plane of the workpiece. . 如申請專利範圍第208項所述的方法,其中,銜接的步驟係包含有將每個銜接部位與該工件的一個下方表面以一個相對於該工件之一個平面成25度的角度相銜接。 The method of claim 208, wherein the step of engaging comprises engaging each of the engaging portions with an undersurface of the workpiece at an angle of 25 degrees with respect to a plane of the workpiece. 如申請專利範圍第213項所述的方法,其中,每個可撓曲支撐構件係包含有在其一個端部處的限制部位,並且其中,限制的步驟係包含有限制住該限制部位,用以導致該未限制部位會朝向該工件的一個中央區域向內地延 伸。 The method of claim 213, wherein each flexible support member comprises a restriction at one end thereof, and wherein the step of limiting comprises limiting the restriction portion, So that the unrestricted portion will be extended inward toward a central region of the workpiece Stretch. 如申請專利範圍第225項所述的方法,其中,每個未限制部位的一個內部尖端係會向內延伸經過該工件的一個外部邊緣,並且其中,銜接的步驟係包含有將一個沿著該未限制部位而介於該限制部位與該內部尖端之間的一個中間點與該工件的外部邊緣相銜接。 The method of claim 225, wherein an inner tip of each unrestricted portion extends inwardly past an outer edge of the workpiece, and wherein the step of engaging includes one along the An unconstrained portion and an intermediate point between the restricted portion and the inner tip engages the outer edge of the workpiece. 如申請專利範圍第213項所述的方法,其中,限制的步驟係包含有將該等限制部位限制在一個包圍該工件之工件平面板件之中。 The method of claim 213, wherein the limiting step comprises limiting the restricted portions to a workpiece planar panel surrounding the workpiece. 如申請專利範圍第227項所述的方法,其中,限制的步驟係包含有夾持的步驟。 The method of claim 227, wherein the step of limiting comprises the step of clamping. 如申請專利範圍第227項所述的方法,其中,限制每個限制部位的步驟係包含有將該限制部位附加到該工件平面板件,且該未限制部位係朝向工件向內延伸而通過一個被界定在該板件之中的工件支撐開孔。 The method of claim 227, wherein the step of limiting each of the restriction portions includes attaching the restriction portion to the workpiece planar plate member, and the unrestricted portion extends inwardly toward the workpiece through a A workpiece defined in the panel supports the opening. 如申請專利範圍第227項所述的方法,其中,限制的步驟係包含有將該等限制部位限制在一個大體上水平的方向之中,用以導致該等未限制部位會朝向該工件的中央部位處水平而向內地延伸,同時向下方彎垂。 The method of claim 227, wherein the limiting step comprises limiting the restricted portions to a substantially horizontal direction to cause the unrestricted portions to face the center of the workpiece The part extends horizontally and inward while being bent downward. 如申請專利範圍第230項所述的方法,其中,銜接的步驟係包含有將該等未限制部位與該工件的一個外部邊緣相銜接。 The method of claim 230, wherein the step of engaging comprises engaging the unconstrained portions with an outer edge of the workpiece. 如申請專利範圍第231項所述的方法,其中,銜接的步驟係包含有將該等未銜接部位與該工件的一個外部 邊緣以一個向下相對於該工件之一個平面成小於大約10度的角度相銜接。 The method of claim 231, wherein the step of engaging includes the unjoined portion and an outer portion of the workpiece The edges engage at an angle that is less than about 10 degrees downward relative to a plane of the workpiece. 如申請專利範圍第227項所述的方法,其中,該複數個可撓曲支撐構件係包含有複數個長形的可撓曲支撐構件。 The method of claim 227, wherein the plurality of flexible support members comprise a plurality of elongate flexible support members. 如申請專利範圍第233項所述的方法,其中,該複數個長形可撓曲支撐構件係包含有至少二十個長形可撓曲支撐構件,並且其中,限制的步驟係包含有將每個至少二十個長形可撓曲支撐構件限制在該工件平面板件之中。 The method of claim 233, wherein the plurality of elongate flexible support members comprise at least twenty elongate flexible support members, and wherein the step of limiting comprises At least twenty elongated flexible support members are constrained within the workpiece planar panel. 如申請專利範圍第233項所述的方法,其中,該複數個長形可撓曲支撐構件係包含有至少五十個長形可撓曲支撐構件,並且其中,限制的步驟係包含有將每個至少五十個長形可撓曲支撐構件限制在該工件平面板件之中。 The method of claim 233, wherein the plurality of elongate flexible support members comprise at least fifty elongate flexible support members, and wherein the step of limiting comprises At least fifty elongated flexible support members are constrained within the workpiece planar panel. 如申請專利範圍第213項所述的方法,其中,每個可撓曲支撐構件係包含有位在該支撐構件之相對端部處的第一及第二限制部位,而將等相對端部係將該未限制部位限制於其間,並且其中,限制的步驟係包含有將第一及第二限制部位以分隔開的關係限制住,用以導致該未限制部位可以在一個介於其間的彎曲路徑中延伸。 The method of claim 213, wherein each of the flexible support members comprises first and second restriction portions located at opposite ends of the support member, and the opposite end portions are Limiting the unrestricted portion therebetween, and wherein the limiting step includes limiting the first and second restriction portions in a spaced apart relationship to cause the unrestricted portion to be bent therebetween Extend in the path. 如申請專利範圍第236項所述的方法,其中,限制的步驟係包含有限制住第一及第二限制部位,用以導致該未限制部位會沿著該彎曲路徑從該第一限制部位處向上且向外地朝向該工件延伸到一個與該工件的接觸區域,並且從該接觸區域處向下且向外地延伸到該第二限制部位。 The method of claim 236, wherein the limiting step comprises limiting the first and second restriction portions to cause the unrestricted portion to follow the curved path from the first restriction portion The workpiece extends upwardly and outwardly toward the workpiece to a contact area with the workpiece and extends downwardly and outwardly from the contact area to the second restriction. 如申請專利範圍第237項所述的方法,其中,限制的步驟係包含有限制住第一及第二限制部位,用以導致該未限制部位會沿著該彎曲路徑延伸,使得該未限制部位在該接觸區域處的一個切線係大體上平行於該工件在該接觸區域附近中的一個外部周圍的一個切線。 The method of claim 237, wherein the limiting step comprises limiting the first and second restriction portions to cause the unrestricted portion to extend along the curved path such that the unrestricted portion A tangent at the contact area is substantially parallel to a tangent to the workpiece about an outer portion of the vicinity of the contact area. 如申請專利範圍第237項所述的方法,其中,限制的步驟係包含有限制住第一及第二限制部位,用以導致該未限制部位會沿著該彎曲路徑延伸,使得該未限制部位在該接觸區域處的一個切線會朝向該工件的一個中心徑向地向內延伸。 The method of claim 237, wherein the limiting step comprises limiting the first and second restriction portions to cause the unrestricted portion to extend along the curved path such that the unrestricted portion A tangent at the contact area will extend radially inward toward a center of the workpiece. 如申請專利範圍第236項所述的方法,其中,限制的步驟係包含有限制住第一及第二限制部位,用以導致該未限制部位會沿著該彎曲路徑延伸,用以形成一個從該工件之一個平面下方的第一限制部位處延伸並且在該工件的一個下方表面處接觸該工件的第一大體上環圈形路徑片段、一個在該工件的一個外部邊緣與一個工件平面板件之一個內部邊緣之間延伸的第二大體上環圈形路徑片段、以及一個在工件的平面上方並且在該工件的一個上方表面處接觸該工件的第三大體上環圈形路徑片段,該彎曲路徑係在該第二限制部位處結束。 The method of claim 236, wherein the limiting step comprises limiting the first and second restriction portions to cause the unrestricted portion to extend along the curved path to form a slave a first substantially annular path segment extending below a plane of the workpiece and contacting the workpiece at a lower surface of the workpiece, an outer edge of the workpiece and a workpiece planar panel a second substantially loop-shaped path segment extending between the inner edges, and a third substantially loop-shaped path segment above the plane of the workpiece and contacting the workpiece at an upper surface of the workpiece, the curved path being The second restriction site ends. 如申請專利範圍第240項所述的方法,其更包含有縮回該第二限制部位,用以將該第三大體上環圈形路徑片段移出一個被界定在該工件之上方表面上方的體積。 The method of claim 240, further comprising retracting the second restriction to move the third substantially annular path segment out of a volume defined above the upper surface of the workpiece. 如申請專利範圍第236項所述的方法,其中,限 制的步驟係包含有將第一及第二限制部位固定住,用以防止該等限制部位的運動。 For example, the method described in claim 236, wherein The steps of the system include securing the first and second restriction portions to prevent movement of the restriction portions. 如申請專利範圍第236項所述的方法,其中,限制的步驟係包含有以可以縮回的方式限制住第一及第二限制部位的至少其中之一。 The method of claim 236, wherein the limiting step comprises limiting at least one of the first and second restriction sites in a retractable manner. 如申請專利範圍第243項所述的方法,其更包含有縮回第一及第二限制部位的至少其中之一,用以有效率地縮短該未限制部位。 The method of claim 243, further comprising retracting at least one of the first and second restriction portions to effectively shorten the unrestricted portion. 如申請專利範圍第243項所述的方法,其更包含有延伸第一及第二限制部位的至少其中之一,用以有效率地加長該未限制部位。 The method of claim 243, further comprising extending at least one of the first and second restriction sites to effectively lengthen the unrestricted portion. 如申請專利範圍第208項所述的方法,其中,該複數的可撓曲支撐構件係包含有第一及第二複數的可撓曲支撐構件,並且其中,銜接該複數的可移動銜接部位的步驟係包含有將第一複數的可撓曲支撐構件之未限制部位與該工件的一個下方表面相銜接、以及將第二複數的可撓曲支撐構件之未限制部位與該工件的一個上方表面相銜接。 The method of claim 208, wherein the plurality of flexible support members comprise first and second plurality of flexible support members, and wherein engaging the plurality of movable engagement portions The step includes engaging an unconstrained portion of the first plurality of flexible support members with a lower surface of the workpiece, and unlimiting portions of the second plurality of flexible support members with an upper surface of the workpiece Connected. 如申請專利範圍第139項所述的方法,其更包含有側向地支撐該工件。 The method of claim 139, further comprising supporting the workpiece laterally. 如申請專利範圍第247項所述的方法,其中,側向地支撐的步驟係包含有將複數的側向支撐構件定位在各自之相對於該工件之一個外部邊緣的位置處。 The method of claim 247, wherein the step of laterally supporting includes positioning a plurality of lateral support members at respective locations relative to an outer edge of the workpiece. 如申請專利範圍第248項所述的方法,其中,定位的步驟係包含有將該複數的側向支撐構件與該工件的外 部邊緣彈性地相銜接。 The method of claim 248, wherein the step of positioning includes the plurality of lateral support members and the outer portion of the workpiece The edges of the parts are elastically joined. 如申請專利範圍第248項所述的方法,其中,定位的步驟係包含有將複數的可撓曲纖維定位在各自的位置之中。 The method of claim 248, wherein the step of positioning comprises positioning a plurality of flexible fibers in respective positions. 如申請專利範圍第250項所述的方法,其中,定位的步驟係包含有將該等可撓曲纖維定位在一個角度處,而該角度係實質上正向於該工件的一個平面。 The method of claim 250, wherein the step of positioning comprises positioning the flexible fibers at an angle that is substantially positive toward a plane of the workpiece. 如申請專利範圍第247項所述的方法,其中,銜接及側向支撐的步驟係包含有將一個支撐構件的一個垂直支撐銜接部位與該工件的一個下方表面相銜接,以及將該支撐構件的一個側向支撐銜接部位與該工件的一個外部邊緣相銜接。 The method of claim 247, wherein the step of engaging and laterally supporting includes engaging a vertical support engagement portion of a support member with a lower surface of the workpiece, and the support member A lateral support engagement portion engages an outer edge of the workpiece. 如申請專利範圍第252項所述的方法,其中,銜接及側向支撐的步驟係包含有將複數個各自之支撐構件的複數個垂直及側向支撐銜接部位與該工件相銜接。 The method of claim 252, wherein the step of engaging and laterally supporting includes engaging a plurality of vertical and lateral support engaging portions of the plurality of respective support members with the workpiece. 如申請專利範圍第252項所述的方法,其中,銜接及側向支撐的步驟係包含有將該等垂直及側向支撐銜接部位與該工件彈性地相銜接。 The method of claim 252, wherein the step of engaging and laterally supporting includes elastically engaging the vertical and lateral support engaging portions with the workpiece. 如申請專利範圍第252項所述的方法,其中,銜接及側向支撐的步驟係包含有銜接當作該等垂直及側向支撐銜接部位的可撓性銜接部位。 The method of claim 252, wherein the step of engaging and laterally supporting comprises engaging a flexible engagement portion that serves as the vertical and lateral support interface. 如申請專利範圍第255項所述的方法,其中,銜接及側向支撐的步驟係包含有將當作該等垂直及側向支撐銜接部位的第一及第二纖維與該工件相銜接。 The method of claim 255, wherein the step of engaging and laterally supporting includes engaging the first and second fibers that are to serve as the vertical and lateral support engaging portions with the workpiece. 如申請專利範圍第250項所述的方法,其中,定位的步驟係包含有定位複數個光學纖維。 The method of claim 250, wherein the step of positioning comprises positioning a plurality of optical fibers. 如申請專利範圍第250項所述的方法,其中,定位的步驟係包含有定位複數的石英纖維。 The method of claim 250, wherein the step of positioning comprises positioning a plurality of quartz fibers. 如申請專利範圍第250項所述的方法,其中,定位的步驟係包含有定位複數的藍寶石纖維。 The method of claim 250, wherein the step of positioning comprises locating a plurality of sapphire fibers. 如申請專利範圍第139項所述的方法,其中,照射的步驟係包含有照射該表面一段短於大約1毫秒的時間。 The method of claim 139, wherein the step of illuminating comprises illuminating the surface for a period of time shorter than about 1 millisecond. 如申請專利範圍第139項所述的方法,其中,照射的步驟係包含有:照射該工件的表面一段第一時間,該第一時間係短於該工件的熱傳導時間,用以將該表面加熱到一個中間溫度,該中間溫度係大於大部份工件的溫度;以及照射該工件的表面一段第二時間,該第二時間係短於該工件的熱傳導時間,用以將該表面加熱到大於該中間溫度之所希求的溫度,其中,該第二時間係在該第一時間之後的一個間隔之內開始,其係足以容許該工件的至少一些熱壓彎。 The method of claim 139, wherein the step of irradiating comprises: illuminating the surface of the workpiece for a first time, the first time being shorter than the heat conduction time of the workpiece for heating the surface At an intermediate temperature, the intermediate temperature is greater than the temperature of the majority of the workpiece; and illuminating the surface of the workpiece for a second time, the second time being shorter than the heat transfer time of the workpiece for heating the surface to be greater than The desired temperature of the intermediate temperature, wherein the second time begins within an interval after the first time, which is sufficient to permit at least some hot bending of the workpiece. 如申請專利範圍第261項所述的方法,其中,照射的步驟係包含有在該段第二時間期間將比在該段第一時間期間更多的輻射能量施加到該工件的表面。 The method of claim 261, wherein the step of illuminating comprises applying more radiant energy to the surface of the workpiece during the second time of the segment than during the first time of the segment. 如申請專利範圍第261項所述的方法,其中,照 射的步驟係包含有在該段第一時間之結束之後的數毫秒之內開始該段第二時間。 For example, the method described in claim 261, wherein The step of shooting includes starting the second time of the segment within a few milliseconds after the end of the first time of the segment. 如申請專利範圍第139項所述的方法,其中,照射的步驟係包含有連續地照射該工件的表面一段間隔,該間隔係短於該工件的一個熱傳導時間,並且係足夠長以容許該工件的至少一些熱壓彎。 The method of claim 139, wherein the step of irradiating comprises a step of continuously illuminating the surface of the workpiece, the interval being shorter than a heat conduction time of the workpiece, and being sufficiently long to allow the workpiece At least some of the hot bends. 如申請專利範圍第139項所述的方法,其中,連續地照射的步驟係包含有在該間隔期間改變照射的一個強度。 The method of claim 139, wherein the step of continuously irradiating comprises varying an intensity of the illumination during the interval. 如申請專利範圍第265項所述的方法,其中,改變的步驟係包含有在該間隔的一個較後部份期間將比在該間隔的一個較前部份期間更強大的強度照射該表面。 The method of claim 265, wherein the changing step comprises illuminating the surface during a later portion of the interval that is more intense than during a earlier portion of the interval. 如申請專利範圍第139項所述的方法,其中,照射的步驟係包含有藉著一個閃光燈來照射該表面。 The method of claim 139, wherein the step of illuminating comprises illuminating the surface by means of a flash lamp. 如申請專利範圍第139項、及第141項至第267項其中任一項所述的方法,其中,支撐同時,容許的步驟係包含有在容許一個半導體晶圓之以熱運動時,支撐著該半導體晶圓。 The method of any one of claim 139, wherein the supporting, at the same time, the permissible step comprises supporting the thermal movement of a semiconductor wafer. The semiconductor wafer. 一種用於支撐一個半導體工件的裝置,該裝置係包含有:產生機構,用以藉著相對於大部份的工件來加熱該工件之一個表面來產生該工件之以熱引動的運動,其中,該產生機構包含用於照射該工件之該表面一段時間的照射機構,而該時間係短於該工件的一個熱傳導時間,用以將工 件加熱到一個溫度,該溫度係大於大部份工件的一個溫度,且其中該以熱引動的運動包含工件的外部邊緣區域和工件中央相對於彼此的垂直運動;支撐機構,用以支撐該工件,該支撐機構可與工件銜接;以及容許機構,用以在該工件被支撐時,容許該工件進行該以熱引動的運動,其中該容許機構包含機構,其用於容許支撐機構響應於包含工件的外部邊緣區域和工件中央相對於彼此的垂直運動的以熱引動的運動而移動,同時該支撐機構與工件銜接。 A device for supporting a semiconductor workpiece, the device comprising: a generating mechanism for generating a heat-induced motion of the workpiece by heating a surface of the workpiece relative to a majority of the workpiece, wherein The generating mechanism includes an illumination mechanism for illuminating the surface of the workpiece for a period of time, and the time is shorter than a heat conduction time of the workpiece for The piece is heated to a temperature which is greater than a temperature of a majority of the workpiece, and wherein the thermally actuated motion comprises an outer edge region of the workpiece and a vertical movement of the center of the workpiece relative to each other; a support mechanism for supporting the workpiece The support mechanism is engageable with the workpiece; and an admissive mechanism for allowing the workpiece to perform the thermally actuated motion when the workpiece is supported, wherein the permissive mechanism includes a mechanism for allowing the support mechanism to respond to the included workpiece The outer edge region and the vertical movement of the workpiece relative to each other move with a thermally actuated motion while the support mechanism engages the workpiece. 如申請專利範圍第269項所述的裝置,其中,該支撐機構以及該容許機構係分別包含有用於支撐一個半導體晶圓的機構,以及用於在該晶圓正在被支撐時,容許該晶圓之以熱引動之運動的機構。 The device of claim 269, wherein the supporting mechanism and the allowing mechanism respectively comprise a mechanism for supporting a semiconductor wafer, and for allowing the wafer while the wafer is being supported The mechanism of heat-induced movement. 如申請專利範圍第269項所述的裝置,其中,該容許機構係包含有用於自動地容許該支撐機構反應於該工件之以熱引動之運動而產生運動的自動容許機構。 The device of claim 269, wherein the permissive mechanism comprises an automatic admissibility mechanism for automatically allowing the support mechanism to react to the workpiece by thermal motion. 如申請專利範圍第269項所述的裝置,其中,該容許機構係包含有容許該支撐機構的運動的機構,用以在該以熱引動之運動期間,在支撐著工件時,將該工件之中的應力減小到最小的程度。 The device of claim 269, wherein the allowing mechanism comprises a mechanism for allowing movement of the supporting mechanism for supporting the workpiece during the movement of the heat priming The stress in is reduced to a minimum. 如申請專利範圍第269項所述的裝置,其中,該容許機構係包含有用於容許該工件一之外部區域的運動,同時將該工件的一個質量中心保持在一個所希求的範圍之 內的機構。 The device of claim 269, wherein the permissive mechanism includes motion for permitting an outer region of the workpiece while maintaining a center of mass of the workpiece within a desired range The institution inside. 如申請專利範圍第273項所述的裝置,其中,該容許機構係包含有用於將該工件之質量中心的運動減少到最小程度的最小化機構。 The device of claim 273, wherein the permissive mechanism comprises a minimization mechanism for minimizing motion of the center of mass of the workpiece. 如申請專利範圍第269項所述的裝置,其中,該容許機構係包含有用於容許該工件之熱壓彎的機構。 The device of claim 269, wherein the permitting mechanism comprises a mechanism for permitting hot bending of the workpiece. 如申請專利範圍第269項所述的裝置,其中,該容許機構係包含有用於容許該工件之熱彎曲的機構。 The device of claim 269, wherein the permitting mechanism comprises a mechanism for permitting thermal bending of the workpiece. 如申請專利範圍第269項所述的裝置,其更包含有用於壓制該工件之震動的壓制機構。 The apparatus of claim 269, further comprising a pressing mechanism for suppressing vibration of the workpiece. 如申請專利範圍第277項所述的裝置,其中,該壓制機構係包含有用於從該工件吸收動能的吸收機構。 The device of claim 277, wherein the pressing mechanism comprises an absorbing mechanism for absorbing kinetic energy from the workpiece. 如申請專利範圍第269項所述的裝置,其更包含有用於將一個作用力應用到該用於支撐機構的作用力應用機構,用以導致該支撐機構係傾向於在該工件之以熱引動的運動期間保持與該工件接觸。 The device of claim 269, further comprising a force application mechanism for applying a force to the support mechanism to cause the support mechanism to tend to be thermally actuated on the workpiece Keep in contact with the workpiece during the movement. 如申請專利範圍第279項所述的裝置,其中,該作用力應用機構係包含有用於將一個力矩應用到該支撐機構的力矩應用機構。 The device of claim 279, wherein the force application mechanism includes a torque application mechanism for applying a torque to the support mechanism. 如申請專利範圍第279項所述的裝置,其中,該作用力應用機構係包含有用於應用一個第一作用力的第一作用力應用機構以及用於應用一個第二作用力的第二作用力應用機構,用以將相對的第一及第二力矩應用到該支撐機構,該第二力矩係作用以其一個平衡位置的支撐機構來 對抗過度的移動。 The device of claim 279, wherein the force application mechanism comprises a first force application mechanism for applying a first force and a second force for applying a second force. An application mechanism for applying opposing first and second moments to the support mechanism, the second moment acting as a support mechanism at one of its equilibrium positions Fight against excessive movement. 如申請專利範圍第279項所述的裝置,其中,該作用力應用機構係包含有用於應用一個固定作用力的固定作用力應用機構。 The device of claim 279, wherein the force application mechanism comprises a fixed force application mechanism for applying a fixed force. 如申請專利範圍第279項所述的裝置,其中,該支撐機構係包含有用於傳送至少一些照射波長的傳送機構,而該工件係藉著該等照射波長而可以被照射加熱。 The device of claim 279, wherein the support mechanism comprises a transport mechanism for transmitting at least some of the illumination wavelengths, and the workpiece is illuminable by illumination by the illumination wavelengths. 如申請專利範圍第279項所述的裝置,其中,該支撐機構係包含有用於減少介於該支撐機構與該工件之間之摩擦力的摩擦力減少機構。 The device of claim 279, wherein the support mechanism includes a friction reducing mechanism for reducing friction between the support mechanism and the workpiece. 如申請專利範圍第269項所述的裝置,其更包含有用於反應於該工件之以熱引動的運動而移動該支撐機構的移動機構。 The apparatus of claim 269, further comprising a moving mechanism for moving the support mechanism in response to the thermally actuated motion of the workpiece. 如申請專利範圍第285項所述的裝置,其更包含有用於將該移動機構的一個可移動構件之線性運動轉換成該支撐機構的一個拱形運動的轉換機構。 The apparatus of claim 285, further comprising a conversion mechanism for converting linear motion of a movable member of the moving mechanism into an arched motion of the support mechanism. 如申請專利範圍第285項所述的裝置,其中,該移動機構係包含有用於調整該支撐機構之位置的調整機構,用以將一個介於該工件的一個重量與一個向上作用力之間的差異減小到最小的程度,而該向上作用力係被該支撐機構應用到該工件。 The device of claim 285, wherein the moving mechanism includes an adjustment mechanism for adjusting a position of the support mechanism for placing a weight between the workpiece and an upward force The difference is reduced to a minimum extent, and the upward force is applied to the workpiece by the support mechanism. 如申請專利範圍第285項所述的裝置,其中,該移動機構係包含有用於調整該支撐機構之位置的調整機構,用以將一個介於該工件的一個重量與一個向上作用力之 間的差異保持在所希望的範圍之內,而該向上作用力係被該支撐機構應用到該工件。 The device of claim 285, wherein the moving mechanism includes an adjustment mechanism for adjusting a position of the support mechanism for placing a weight between the workpiece and an upward force The difference between the two is maintained within the desired range, and the upward force is applied to the workpiece by the support mechanism. 如申請專利範圍第285項所述的裝置,其更包含有用於偵測出該工件之以熱引動的運動的偵測機構。 The device of claim 285, further comprising a detection mechanism for detecting a thermally actuated motion of the workpiece. 如申請專利範圍第269項所述的裝置,其中,該支撐機構係包含有用於支撐該工件的第一支撐機構以及用於支撐該工件的第二支撐機構,該第一支撐機構係可以與該工件的一個下方表面相銜接,並且,該第二支撐機構係可以與該工件的一個上方表面相銜接。 The device of claim 269, wherein the support mechanism comprises a first support mechanism for supporting the workpiece and a second support mechanism for supporting the workpiece, the first support mechanism being A lower surface of the workpiece is engaged, and the second support mechanism is engageable with an upper surface of the workpiece. 如申請專利範圍第290項所述的裝置,其中,該第一及第二支撐機構係可以與該工件的下方及上方表面在該工件的一個外部周圍區域處相銜接。 The apparatus of claim 290, wherein the first and second support mechanisms are engageable with an underside and an upper surface of the workpiece at an outer peripheral region of the workpiece. 如申請專利範圍第285項所述的裝置,其中,該移動機構係包含有用於將被應用在該工件與移動機構之間之作用力減小到最小程度的最小化機構。 The device of claim 285, wherein the moving mechanism includes a minimization mechanism for minimizing the force applied between the workpiece and the moving mechanism. 如申請專利範圍第292項所述的裝置,其中,該最小化機構係包含有用於將一個介於該工件的一個重量與一個作用力之間的差異減小到最小程度的機構,而該作用力係被應用在該支撐機構與該工件之間。 The device of claim 292, wherein the minimization mechanism includes a mechanism for minimizing a difference between a weight and a force between the workpiece, and the function A force is applied between the support mechanism and the workpiece. 如申請專利範圍第285項所述的裝置,其中,該支撐機構係包含有用於彈性地支撐該工件的彈性支撐機構。 The device of claim 285, wherein the support mechanism comprises an elastic support mechanism for elastically supporting the workpiece. 如申請專利範圍第294項所述的裝置,其中,該容許機構係包含有用於將力矩對著該支撐機構的各個樞轉 點應用到該支撐機構的力矩應用機構,用以導致該支撐機構係傾向於保持與該工件的接觸,並且其中,該移動機構係包含有用於移動該支撐機構的樞轉點之機構。 The device of claim 294, wherein the permissive mechanism comprises a pivoting member for biasing the support mechanism A point is applied to the torque application of the support mechanism to cause the support mechanism to tend to remain in contact with the workpiece, and wherein the movement mechanism includes a mechanism for moving the pivot point of the support mechanism. 如申請專利範圍第294項所述的裝置,其更包含有用於偵測出該工件之以熱引動之運動的偵測機構。 The device of claim 294, further comprising a detecting mechanism for detecting the movement of the workpiece by heat. 如申請專利範圍第269項所述的裝置,其中,該支撐機構係包含有用於支撐的可撓曲支撐機構。 The device of claim 269, wherein the support mechanism comprises a flexible support mechanism for support. 如申請專利範圍第297項所述的裝置,其更包含有用於限制該支撐機構的限制機構。 The device of claim 297, further comprising a restriction mechanism for restricting the support mechanism. 如申請專利範圍第297項所述的裝置,其中,該容許機構係包含有用於將一個作用力應用到該可撓曲支撐機構的作用力應用機構,用以導致該支撐機構在該工件之以熱引動的運動期間係傾向於保持與該工件的接觸。 The device of claim 297, wherein the allowing mechanism comprises a force applying mechanism for applying a force to the flexible supporting mechanism to cause the supporting mechanism to be in the workpiece During the heat-induced motion, it tends to remain in contact with the workpiece. 如申請專利範圍第299項所述的裝置,其中,該作用力應用機構係包含有用於應用一個力矩的力矩應用機構。 The device of claim 299, wherein the force application mechanism comprises a torque application mechanism for applying a torque. 如申請專利範圍第297項所述的裝置,其中,該支撐機構係可以與該工件的一個下方表面以一個相對於該工件之一個平面成10到80度之角度相銜接。 The apparatus of claim 297, wherein the support mechanism is engageable with an undersurface of the workpiece at an angle of 10 to 80 degrees with respect to a plane of the workpiece. 如申請專利範圍第297項所述的裝置,其中,該支撐機構係可以與該工件的一個下方表面以一個相對於該工件之一個平面成15到35度之角度相銜接。 The apparatus of claim 297, wherein the support mechanism is engageable with an undersurface of the workpiece at an angle of 15 to 35 degrees with respect to a plane of the workpiece. 如申請專利範圍第298項所述的裝置,其中,該限制機構係包含有用於夾持該支稱機構的夾持機構。 The device of claim 298, wherein the restriction mechanism comprises a clamping mechanism for clamping the singular mechanism. 如申請專利範圍第298項所述的裝置,其中,該限制機構係包含有用於將該支撐機構附加到一個工件平面板件的附加機構。 The device of claim 298, wherein the restriction mechanism includes an additional mechanism for attaching the support mechanism to a workpiece planar panel. 如申請專利範圍第290項所述的裝置,其更包含有用於縮回第二支撐機構,用以將該第二支撐機構移動而離開一個體積的縮回機構,該體積係被界定在該工件的上方表面上方。 The device of claim 290, further comprising a retracting mechanism for retracting the second supporting mechanism for moving the second supporting mechanism away from a volume, the volume is defined in the workpiece Above the upper surface. 如申請專利範圍第297項所述的裝置,其更包含有用於縮回該可撓曲支撐機構的縮回機構。 The device of claim 297, further comprising a retracting mechanism for retracting the flexible support mechanism. 如申請專利範圍第269項所述的裝置,其更包含有用於側向地支撐該工件的側向支撐機構。 The device of claim 269, further comprising a lateral support mechanism for laterally supporting the workpiece. 如申請專利範圍第307項所述的裝置,其中,該側向支撐機構係可以與該工件的一個外部邊緣相銜接。 The device of claim 307, wherein the lateral support mechanism is engageable with an outer edge of the workpiece. 如申請專利範圍第308項所述的裝置,其中,該側向支撐機構係為可撓曲的。 The device of claim 308, wherein the lateral support mechanism is flexible. 如申請專利範圍第269項所述的裝置,其中,該照射機構係包含有:用於照射該工件的表面一段第一時間,以及用於照射該工件的表面一段第二時間的機構,該第一時間係短於該工件的熱傳導時間,用以將該表面加熱到一個中間溫度,該中間溫度係大於大部份工件的溫度,該第二時間係短於該工件的熱傳導時間,用以將該表面加熱到大於該中間溫度之所希求的溫度,其中,該機構係包含有用於在該第一時間之後的一個間隔之內開始該第二時間的開始機構,其 係足以容許該工件的至少一些熱壓彎。 The device of claim 269, wherein the illuminating mechanism comprises: a surface for illuminating the surface of the workpiece for a first time, and a mechanism for illuminating the surface of the workpiece for a second time, the One time is shorter than the heat conduction time of the workpiece for heating the surface to an intermediate temperature which is greater than the temperature of the majority of the workpiece, the second time being shorter than the heat conduction time of the workpiece for The surface is heated to a temperature greater than the intermediate temperature, wherein the mechanism includes a starting mechanism for starting the second time within an interval after the first time, It is sufficient to allow at least some of the hot bending of the workpiece. 如申請專利範圍第269項所述的裝置,其中,該照射機構係包含有用於連續地照射該工件的表面一段間隔的連續照射機構,而該間隔係短於該工件的一個熱傳導時間,並且係足夠長以容許該工件的至少一些熱壓彎。 The device of claim 269, wherein the illumination mechanism comprises a continuous illumination mechanism for continuously illuminating a surface of the workpiece, the interval being shorter than a heat conduction time of the workpiece, and Long enough to allow at least some hot bending of the workpiece. 如申請專利範圍第311項所述的裝置,其中,該連續照射機構係包含有用於在該間隔期間改變照射的一個強度之改變機構。 The device of claim 311, wherein the continuous illumination mechanism comprises a change mechanism for changing the intensity of the illumination during the interval. 如申請專利範圍第312項所述的裝置,其中,該改變機構係包含有用於致使該表面會在該間隔的一個較後部份期間比在該間隔的一個較前部份期間以更強大的強度被照射的致使機構。 The device of claim 312, wherein the changing mechanism comprises means for causing the surface to be more powerful during a later portion of the interval than during a earlier portion of the interval The intensity is illuminated by the causing mechanism. 如申請專利範圍第269項及第271項至第313項其中任一項所述的裝置,其中,該支撐機構以及該容許機構分別包含有用於支撐一個半導體晶圓的機構,以及用於在該晶圓被支撐時,容許該晶圓之以熱引動的運動的機構。 The apparatus of any one of claims 269, wherein the support mechanism and the permitting mechanism respectively comprise a mechanism for supporting a semiconductor wafer, and A mechanism that allows thermal excitation of the wafer when the wafer is supported. 一種非短暫(non-transitory)之電腦可讀取之媒體,其係儲存指令編碼,該指令編碼係用於指示一個處理器電路,用以控制一個加熱系統及一個工件支撐系統,來導致申請專利範圍第139項所述之方法可以執行。 A non-transitory computer readable medium storing a command code for indicating a processor circuit for controlling a heating system and a workpiece support system to cause a patent application The method described in the scope of item 139 can be performed. 如申請專利範圍第315項所述的媒體,其更包含有用於指示一個處理器電路的指令編碼,用以控制該工件支撐系統來執行申請專利範圍第180項所述之方法。 The medium of claim 315, further comprising an instruction code for indicating a processor circuit for controlling the workpiece support system to perform the method of claim 180. 如申請專利範圍第315項所述的媒體,其更包含有指令編碼,用以指示該處理器電路控制該工件支撐系統,用以實行申請專利範圍第139項至第267項其中任一項所述的方法。The medium of claim 315, further comprising an instruction code for instructing the processor circuit to control the workpiece support system for implementing any one of claims 139 to 267 of the patent application scope. The method described.
TW093113931A 2003-12-19 2004-05-18 Methods and systems for supporting a workpiece and for heat-treating the workpiece TWI476858B (en)

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TW488009B (en) * 2000-01-28 2002-05-21 Steag Rtp Systems Gmbh Heat treatment device for substrate
US20020102098A1 (en) * 2000-12-04 2002-08-01 Camm David Malcolm Heat-treating methods and systems

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW488009B (en) * 2000-01-28 2002-05-21 Steag Rtp Systems Gmbh Heat treatment device for substrate
US20020102098A1 (en) * 2000-12-04 2002-08-01 Camm David Malcolm Heat-treating methods and systems

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