CN100550336C - Be used to suppress the device and method of the thermal induction campaign of workpiece - Google Patents
Be used to suppress the device and method of the thermal induction campaign of workpiece Download PDFInfo
- Publication number
- CN100550336C CN100550336C CNB2004800380132A CN200480038013A CN100550336C CN 100550336 C CN100550336 C CN 100550336C CN B2004800380132 A CNB2004800380132 A CN B2004800380132A CN 200480038013 A CN200480038013 A CN 200480038013A CN 100550336 C CN100550336 C CN 100550336C
- Authority
- CN
- China
- Prior art keywords
- workpiece
- damping
- distance
- damping piece
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 66
- 230000006698 induction Effects 0.000 title claims abstract description 43
- 238000013016 damping Methods 0.000 claims abstract description 403
- 230000033001 locomotion Effects 0.000 claims abstract description 63
- 238000010438 heat treatment Methods 0.000 claims abstract description 26
- 230000000284 resting effect Effects 0.000 claims abstract description 21
- 230000008485 antagonism Effects 0.000 claims abstract description 7
- 230000000994 depressogenic effect Effects 0.000 claims description 29
- 238000001816 cooling Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 26
- 230000005855 radiation Effects 0.000 claims description 23
- 239000010453 quartz Substances 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 238000012423 maintenance Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 12
- 230000008859 change Effects 0.000 claims description 8
- 230000001105 regulatory effect Effects 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 84
- 230000000694 effects Effects 0.000 description 23
- 230000002829 reductive effect Effects 0.000 description 16
- 230000008878 coupling Effects 0.000 description 14
- 238000010168 coupling process Methods 0.000 description 14
- 238000005859 coupling reaction Methods 0.000 description 14
- 230000017525 heat dissipation Effects 0.000 description 10
- 230000035882 stress Effects 0.000 description 10
- 230000001808 coupling effect Effects 0.000 description 9
- 238000000137 annealing Methods 0.000 description 7
- 230000009467 reduction Effects 0.000 description 7
- 206010044565 Tremor Diseases 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000007717 exclusion Effects 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000006386 neutralization reaction Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000002301 combined effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000036962 time dependent Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Automatic Assembly (AREA)
Abstract
The present invention relates to be used to suppress the devices and methods therefor of workpiece thermal induction campaign.A kind of device comprises the workpiece heating system, and this workpiece heating system is configured to the motion of thermal induction workpiece; And this device also comprises damping piece, and this damping piece and workpiece are spaced apart and are configured to apply damping force to prevent the motion of described workpiece.This damping piece can and the resting position of workpiece separate enough little and make the distance of motion of the gas pressure antagonism workpiece between damping piece and the workpiece.This distance is preferably adjustable.
Description
The cross reference of related application
The application requires No. 60/568,685, the U.S. Patent application of on May 7th, 2004 application and the priority of No. 10/742,575, the U.S. Patent application applied on December 19th, 2003.
Technical field
The present invention relates to be used to suppress the method and the device of the thermal induction campaign of workpiece.
Background technology
There are many application to relate to the thermal induction campaign of workpiece.For example, in the manufacturing of the semiconductor chip of for example microprocessor etc., workpiece generally includes semiconductor wafer, and it is supported in the hot processing chamber to anneal or other heat treatment.U.S. Patent application 10/742, No. 575 (publication number US2004/0178553A1) discussed the example that is used for heat treatment technics that described semiconductor wafer is annealed, wherein, wafer is at first preheated a medium temperature, then top or device side surface are heated to annealing temperature apace.The initial stage that preheats with compare by the heat conducting time of wafer the speed of carrying out obviously slowly many, and this preheats the stage and can realize by dorsal part or the base side with arc lamp irradiation wafer, thereby heats this wafer with the temperature rate that for example is lower than 400 ℃/second.The follow-up surperficial heating period with compare carry out faster by the heat conducting time of wafer, make that only device side surface is heated to final annealing temperature, and the major part of this wafer still approaches medium temperature.Described surperficial heating can be by realizing under the high power irradiance flash that device side surface is exposed to a photoflash lamp or one group of photoflash lamp that wherein, the duration of this flash of light is quite short, for example 1 millisecond.Then, the colder part of this wafer is convenient to the surface of quick cooling device side as heat abstractor.
Described method for annealing comprises that the equipment side with wafer is heated to a temperature that roughly is higher than the wafer main body apace, and this makes equipment side compare with speed thermal expansion faster with the other parts of this wafer.The inventor of present inventor and above-mentioned U. S. application recognizes, according to the temperature extent (it is tending towards causing " thermal flexure ") between the temperature of the temperature of equipment side and wafer main body, normal smooth wafer self-deformation becomes a thermal deformation shape.According to this size and the speed of equipment side heating period, this thermal deformation shape can be domeshape, and swell fast with respect to its fringe region at the center of wafer.Thermal flexure can make that also (for example curl sharp in the outside 1～2cm) of 30cm wafer, thereby the thermal deformation shape also can be FRISBEE for the periphery of workpiece or edge downwards
TMUFO-like.Although depend on the physical parameter of in question thermal cycle, in fact, have been found that in some applications the curling effect in the workpiece periphery described later is often more remarkable than the domeshape bending generally of aforesaid workpiece.This thermal deformation shape has been represented the minimum stress configuration of wafer, the i.e. configuration of the thermal stress that temperature gradient produced between minimum wafer equipment side and the wafer main body.Yet, because the equipment side of wafer heats at a terrific speed (for example in 1 millisecond flash of light process, more faster than heat conduction common in the wafer), the very fast appearance of the distortion meeting of wafer makes edge supporting pin of supporting wafers in chamber of wafer apply a big downward power.Because traditional supporting pin generally is a rigidity, thereby the interaction force that is produced between the edge of pin and wafer may damage wafer.Such power may also make wafer move straight up from supporting pin, when wafer to falling back and during impacting pin, this can further cause damage to wafer.And because conventional support pins is not designed to bear such power, pin is fracture easily, thereby produces that wafer is fallen in the chamber and the consequence that is damaged or destroys.In addition,, be applied to each regional initial velocity of wafer and make wafer surpass minimum stress shape and then the vibration or the vibration of balance easily, and produce extra stress and may damage wafer because described thermal flexure occurs fast.
Above-mentioned U. S. application has disclosed the several different methods that overcomes such rough sledding open US 2004/0178553A1 number, by workpiece is reduced its internal stress so that its mode that can move supports under the influence of the thermal stress that is produced, thereby reduce wafer damage or damaged possibility.Also disclosed the method that suppresses wafer vibration or vibration, yet, because vibration may damage or destroy wafer easily like this, depend on the surrounding environment in the particular anneal method of being discussed, also expect to have further braking measure.
Aforementioned method for annealing is included in the stage of preheating at a kind of version that proposes recently replaces arc lamp with hot plate.The heating period of follow-up device side surface adopts one group of photoflash lamp to produce the high power irradiance flash.Wafer is being kept closely contacting with hot plate by vacuum cup, and this vacuum cup comprises that passing gas passage that this hot plate limits or passage and one sends the pump of passage with gas pump, produces vacuum in order to nestle up wafer backside in passage below.In the heating period that preheats stage and follow-up device side surface, the vacuum in the path is closely inhaled wafer effectively and is leaned against the hot plate surface.Yet this vacuum cup has stoped wafer in the thermal flexure of the heating period of device side surface, has stoped self the distortion of wafer for the internal stress that reduces himself thus.Thereby wafer is damaged easily, particularly if the amplitude of " jump " (being the difference between medium temperature and the final equipment side temperature) is more all the more so.Thereby the contraction method effect of described inhibition movement of wafers or vibration is undesirable.
Thereby, the method for the thermal induction campaign of the improved inhibition workpiece of needs.
Summary of the invention
The present invention is devoted to the demand, according to an aspect of the present invention, provides a kind of device that is used to suppress the thermal induction campaign of workpiece.This device comprises the workpiece heating system, and it is configured to the motion of thermal induction workpiece.This device also comprises a damping piece, this damping piece and workpiece separate and are configured to apply damping force to prevent the motion of workpiece, wherein, the resting position of described damping piece and workpiece separates enough little and makes the gas pressure between damping piece and the workpiece resist the distance of the motion of workpiece, and the resting position of described damping sheet and described wafer separates the distance less than 3mm.
Advantageously, when damping piece and workpiece separate, can avoid the direct mechanical contact between damping piece and the workpiece, thereby reduce the possibility that workpiece destroys or damages.
This damping piece preferably and the resting position of workpiece (rest position) separate one enough little and make the distance of motion of the gas pressure antagonism workpiece between damping piece and the workpiece.For example, if this workpiece is the semiconductor wafer that is supported on one section small distance place, damping piece top, irradiance flash can make the middle section protuberance and away from damping piece upwards fast of wafer.This makes and forms a low pressure zone in the slit between wafer and the damping piece.Thereby, producing pressure reduction between the lower pressure in the slit of the higher ambient pressure of wafer top and wafer below, it is tending towards resisting moving upward of wafer.Conversely, if the middle section of wafer is to falling back and surpassing its smooth equilbrium position, then this makes the pressure that forms the ambient pressure that is higher than the wafer top in the slit between wafer and the damping piece, makes when the wafer vibration or when vibrating, this pressure reduction resists the motion of wafer constantly.Thereby the motion and the vibration of wafer are prevented, and need not might cause between wafer and the damping piece actual contact of damage.
Described workpiece can comprise semiconductor wafer, and damping piece can comprise the damping sheet that separates with this wafer.For example, this damping sheet can separate the distance of one section 1mm magnitude with the resting position of wafer.More specifically, this damping sheet can separate one section with the resting position of wafer greater than 1.5mm and/or less than the distance of 3mm.For example, relating under atmospheric pressure in the specific implementations of handling wafer, damping sheet can and the resting position of wafer separate one section distance between 1.5mm and 3mm.
This device can also comprise and being configured to the support system of wafer support above damping sheet.Alternatively, this device can comprise and being configured to the support system of wafer support below damping sheet.
Perhaps, as another optional mode, this damping piece can comprise first and second damping pieces, and this device can also comprise be configured to wafer support above first damping piece, second damping piece below support system.
This damping sheet can comprise the annular recess that is limited in its surface.This annular recess can be configured in the thermal induction curly course outward flange of wafer is contained in wherein.Such depressed part workpiece therein is that semiconductor wafer and thermal induction campaign comprise that in the execution mode that the outer peripheral thermal induction of wafer curls be very favourable.According to the mode of workpiece support, described depressed part is also favourable in other embodiments.
The workpiece heating system can comprise: the system that preheats that is configured to this workpiece is preheated a medium temperature; And, be configured to only the surf zone of workpiece is heated to above the temperature required surface heating system of this medium temperature.If like this, preheat system and surface heating system and all can comprise corresponding irradiation system.For example, the system of preheating can comprise a DC arc lamp, and surface heating system can comprise that at least one is configured to workpiece is exposed to the irradiance flash device of irradiance flash.This irradiance flash device for example can comprise photoflash lamp or microwave pulse generator.Damping piece can be placed between described at least one irradiance flash device and the described workpiece and can see through the irradiance flash of some wavelength at least.
This damping piece can comprise window.This window for example can comprise quartz window.
This device can also comprise temperature control system, and this temperature control system is configured to control the temperature of described window.
This device can also comprise auxiliary heater, and this auxiliary heater is configured near the outer regions of workpiece to the auxiliary heat energy of damping piece supply.This auxiliary heater can comprise near the resistance heater that is arranged on the workpiece outer regions.Alternatively, this auxiliary heater can comprise near the workpiece outer regions with workpiece central authorities near the material of damping piece compare and have the more material of large radiation coefficient.
This irradiation system can also be included in the stage of preheating before irradiance flash the pre-warmed system that preheats of workpiece.
Distance between damping piece and the workpiece can be adjustable, to regulate damping force.For example, the distance between damping piece and the workpiece can be regulated between first distance and second distance, and wherein this first distance adopted in the stage that preheats, and this second distance adopts in the stage less than this first distance and in irradiance flash and kinetic damping after this.This first distance can be 2mm at least.As another example, first distance can be the 1cm magnitude.Advantageously, because the second distance that first distance of using in the stage that preheats was used greater than irradiance flash and follow-up kinetic damping stage is reduced in the thermal coupling effect that preheats the stage.Second distance can be enough little and makes gas pressure between damping piece and the workpiece resists workpiece at irradiance flash and kinetic damping in the stage motion.For example, this second distance is about 1mm.As another example, second distance is about 1.5mm.Except first and second distances, this distance also can further be adjusted to the 3rd distance greater than this second distance, adopts in its follow-up cooling stage after the accompany movement damping stage.Advantageously, because the second distance that the 3rd distance that cooling stage uses was used greater than irradiance flash and kinetic damping stage, the thermal coupling effect of cooling stage is also reduced.For example, the 3rd distance can be 2mm at least.Thereby, advantageously, just as discussed herein, such controllability reduced to preheat and follow-up cooling stage in workpiece and the thermal coupling effect between the damping piece, make damping piece can suppress the thermal induction campaign of workpiece in the stage simultaneously at irradiance flash and follow-up kinetic damping.
This damping piece can be configured to apply a damping force that spatially changes.For example, damping piece can comprise the flat board that wherein defines a plurality of depressed parts, so that little away from the damping force in the zone of depressed part at the damping force ratio of each depressed part near zone.
This damping piece can comprise electrostatic chuck, and this electrostatic chuck configuration becomes the motion in response to workpiece that electrostatic force is applied on the workpiece.This device can also comprise and being configured in order to detect the detection of motion device of this workpiece.
This electrostatic chuck can comprise a plurality of variable electrostatic force generators.Optionally control each generator, before the thermal induction campaign of workpiece, workpiece static is deformed into required distortion.
According to a further aspect in the invention, provide a kind of device, it comprises the device of the motion that is used for the thermal induction workpiece and is used to apply the device of damping force with the motion of preventing workpiece, and this device and described workpiece that is used to apply damping force separates.
According to a further aspect in the invention, a kind of method is provided, it comprises the motion of thermal induction workpiece and applies the motion that damping force is prevented this workpiece by the damping piece that separates with workpiece, wherein, the described damping force that applies comprises making between damping piece and the workpiece and keeps enough little and make the gas pressure between this damping piece and the workpiece resist the distance of the motion of workpiece, and described distance is less than 3mm.
Apply damping force and can comprise that the distance that keeps between damping piece and the workpiece is very little, make the gas pressure between damping piece and the workpiece resist the motion of workpiece.
This workpiece can comprise semiconductor wafer, and this damping piece can comprise the damping sheet that separates with this wafer.
Described maintenance can comprise damping sheet is remained on and the resting position of the wafer distance at a distance of the 1mm magnitude.For example, this can comprise with damping sheet remain on the resting position of wafer at a distance of distance greater than 1.5mm, perhaps can comprise damping sheet is remained on resting position with wafer at a distance of the distance less than 3mm.Thereby, this can comprise damping sheet remained on and the resting position of wafer at a distance of the distance between 1.5～3mm.
Described maintenance can comprise wafer support above damping sheet, maybe can comprise wafer support below damping sheet.
This damping piece can comprise first and second damping pieces, this moment described maintenance can comprise with wafer support above first damping piece, second damping piece below.
The outward flange that this method can also be included in the thermal induction motion process wafer is contained in the annular recess that is defined in the damping sheet surface.
The thermal induction campaign can comprise this workpiece of irradiation.This can comprise workpiece is exposed under the irradiance flash that this irradiance flash for example can be produced by photoflash lamp or microwave pulse generator.This damping piece can see through the irradiance flash of some wavelength at least, and irradiation can comprise and at least some irradiance flash are passed damping piece and is incident upon on the workpiece.
This damping piece can comprise for example window of quartz window, and this method can also comprise the temperature of controlling this window.
Described method can also be included near the to the auxiliary heat energy of damping piece supply of described workpiece outer regions.This can comprise that near the resistance heater to being arranged on the workpiece outer regions is provided with electric current.Alternatively, this can comprise that near the material to being positioned at the described workpiece outer regions carries out irradiation, and the radiation coefficient of the material at this place is greater than near the radiation factor of the material of the damping piece the workpiece central authorities.
Described method can also be included in the stage of preheating and before irradiance flash workpiece be preheated.
Described method can comprise the distance of regulating between damping piece and the workpiece.This can be included in the stage of preheating makes between damping piece and the workpiece and to keep first distance and to make between damping piece and the workpiece in irradiance flash and kinetic damping stage after this keeping second distance.Keeping first distance can be included in the stage of preheating makes and keeps the distance of 2mm at least between damping piece and the workpiece.Keep second distance to comprise keeping one enough little and make the gas pressure between damping piece and the workpiece resist the distance of the motion of workpiece in the stage at irradiance flash and kinetic damping.This can be included in irradiance flash and the kinetic damping stage makes the distance that keeps being about 1mm between damping piece and the workpiece.Alternatively, this can be included in irradiance flash and kinetic damping stage and make the distance that keeps being about 1.5mm between damping piece and the workpiece.This method can also be included in and make the 3rd distance that keeps between damping piece and the workpiece greater than second distance in the accompany movement damping stage follow-up cooling stage afterwards.Keeping the 3rd distance can be included in cooling stage makes and keeps the distance of 2mm at least between damping piece and the workpiece.Advantageously, because first distance and the 3rd distance reduced in the thermal coupling effect that preheats stage and cooling stage greater than second distance, taken into account damping piece simultaneously at irradiance flash and kinetic damping suitable kinetic damping in the stage.
Applying damping force can comprise and apply spatially the damping force that changes.For example, damping piece can comprise the flat board that wherein defines a plurality of depressed parts, so that the damping force that produces because of gas pressure change compares little away from the depressed part zone at each depressed part near zone.
Apply damping force and can comprise that the motion in response to workpiece changes the power that applies by electrostatic chuck.This method can comprise the motion that detects workpiece.This electrostatic chuck can comprise a plurality of variable electrostatic force generators, and also can comprise and optionally control the electrostatic force generator and before the thermal induction campaign of workpiece workpiece static is deformed into required shape.
Read the following description of specific implementations of the present invention in conjunction with the drawings, those of ordinary skills will be apparent from others of the present invention and feature.
Description of drawings
In the accompanying drawing of explaining embodiments of the present invention,
Fig. 1 is the cross-sectional view of device that is used to suppress workpiece thermal induction campaign according to first embodiment of the invention;
Fig. 2 is the cross-sectional view of damping piece shown in Fig. 1 and workpiece;
Fig. 3 is the cross-sectional view of device that is used to suppress workpiece thermal induction campaign according to second embodiment of the invention;
Fig. 4 is the cross-sectional view of device that is used to suppress workpiece thermal induction campaign according to third embodiment of the invention;
Fig. 5 is according to the damping piece of four embodiment of the invention and the cross-sectional view of workpiece;
Fig. 6 is the cross-sectional view of damping piece, workpiece and workpiece plane according to fifth embodiment of the invention;
Fig. 7 is the cross-sectional view of damping piece, workpiece and workpiece plane according to sixth embodiment of the invention;
Fig. 8 is the cross-sectional view of damping piece, workpiece and workpiece plane according to seventh embodiment of the invention;
Fig. 9 is the vertical view according to the damping piece of eighth embodiment of the invention;
Figure 10 is according to the damping piece of ninth embodiment of the invention and the cross-sectional view of workpiece.
Embodiment
With reference to Fig. 1 and 2, illustrate with 100 generally according to the device that is used to suppress workpiece thermal induction campaign of first embodiment of the invention.In this execution mode, device 100 comprises that generally with the workpiece heating system shown in 102, it is configured to the motion of thermal induction workpiece 104, and this realizes by in the mode of this motion of thermal induction workpiece being heat-treated in this execution mode.In this execution mode, device 100 also comprises damping piece 106, and itself and workpiece 104 are spaced apart and are configured to apply the motion that a damping force is prevented workpiece.
In this execution mode, heating system 102 comprises: preheat system, it is configured to workpiece and is heated to a medium temperature; And surface heating system, it only is configured to surf zone with workpiece and is heated to a preferred temperature that is higher than medium temperature.In this execution mode, each preheats system and surface heating system all comprises corresponding irradiation system.More specifically, in this execution mode, this preheats system and comprises DC arc lamp 108, and surface heating system comprises at least one irradiance flash device, and this irradiance flash device is configured to workpiece 104 is exposed under the irradiance flash.More specifically, in this execution mode, irradiance flash device comprises photoflash lamp 110, and this photoflash lamp is configured to produce the irradiance flash that mainly is made of visible wavelength and infrared wavelength.Alternatively, irradiance flash device can comprise microwave pulse generator, and this generator is configured in order to produce the main irradiance flash that is made of microwave wavelength.More generally, can other suitable system that preheats and surface heating system substitute.
In this execution mode, workpiece 104 comprises semiconductor wafer, and damping piece 106 comprises the damping sheet that is spaced apart with this wafer.In this execution mode, damping piece 106 places between arc lamp 108 and the workpiece 104.In this execution mode, damping piece comprises a window.More specifically, in this execution mode, this damping piece comprises a quartz window.More specifically, in this execution mode, that this damping piece comprises is ultrapure, high-quality, non-Exposure to Sunlight type quartz, yet alternatively, can other suitable material substitution.In this execution mode, damping piece 106 can see through the most of wavelength that is produced by arc lamp 108 or photoflash lamp 110.
In this execution mode, arc lamp 108 and photoflash lamp 110 comprise the high density arc lamp by the Mattson Technology Canada Inc. manufacturing of Vancouver, CAN, the U.S. Patent application 10/777 of on February 12nd, 2004 application for example, No. 995 or United States Patent (USP) 6,621, No. 199 described.In this execution mode, arc lamp 108 is used for workpiece 104 is preheated a medium temperature, and its mode is dorsal part or the substrate side 112 with speed irradiation this workpiece slower than workpiece heat conduction time.In this execution mode, arc lamp 108 preheats the medium temperature of expecting with the speed between 100～400 ℃/second with workpiece, and the intermediate temperature range of this expectation is 600～1250 ℃, but these are exemplary example; Alternatively, can other preheat speed and medium temperature and substitute.
When workpiece 104 reached this medium temperature, arc lamp 108 was stopped using, and used photoflash lamp 110 to produce the high intensity radiation flash of light on the equipment side 114 of workpiece 104.The duration ratio of irradiance flash is by workpiece 104 heat conducting time much shorters (heat conduction time normally is the magnitude of 10～15ms).Thereby, irradiance flash is heated to higher annealing temperature with equipment side 114 with the speed more faster than the heat conduction time of workpiece 104, thereby just the surf zone of the equipment side of workpiece is heated to the final annealing temperature, and the main body of workpiece is still near relatively low medium temperature.The final annealing temperature can comprise that scope is to the higher temperature near the temperature (for example 1410 ℃) of the fusing point of silicon from 1050 ℃.For reaching this purpose, in the present embodiment, this irradiation system or more particularly be that photoflash lamp 110 is operable as with relatively short high-power flash of duration and comes irradiation apparatus side 114, this duration preferably for example is about 1ms magnitude or littler, thereby to surpass 10
5℃/second speed firing equipment side 114.In this execution mode, take the irradiance flash of short duration of high density and make workpiece 104 be tending towards the Rapid Thermal bending, and since the other parts of equipment side 114 and workpiece in other words main body compare and have bigger thermal expansion, the middle section of this equipment side 114 upwards moves rapidly, and the outward flange of workpiece 104 is tending towards moving downward, and sharply curls thereby make workpiece be slight domeshape and its outward flange.Further, described thermal flexure will occur enough fast, make when workpiece when its initial thermal deformation shape turns back to its smooth equilbrium position, it tends to exceed this equilbrium position and begins and trembles near this position.
As noted above, in this execution mode, damping piece 106 comprises the damping sheet that separates with workpiece 104.More specifically, in this execution mode, the resting position of damping sheet and workpiece (restpostion) separate one enough little and make the distance of motion of the gas pressure antagonism workpiece between damping piece 106 and the workpiece 104.
Consider that thus the spacing between damping piece and workpiece will depend on the size of required damping force usually.In this execution mode, when workpiece 104 is exposed to the flash of light of quick high intensity radiation down and when carrying out initial as mentioned above thermal flexure, the middle section of this equipment side 114 upwards swells apace, workpiece presents initial domeshape and has the outward flange that curls downwards, form low gas pressure zone at the dorsal part 112 of workpiece 104 and the slit between the damping piece 106 120, this gas pressure roughly is lower than the pressure of ambient gas of top of the equipment side 114 of workpiece.This pressure reduction is tending towards on the middle section of workpiece, applies downward damping force mutually on the contrary with its direction of motion.When workpiece returns subsequently and surpass its initial more flat relatively configuration (when central authorities regional when damping piece is bent downwardly), pressure in the slit 120 will be increased to the pressure greater than the pressure of ambient gas of equipment side 114, form pressure reduction, and this pressure reduction is tending towards on the middle section of workpiece, applies damping force upwards mutually on the contrary with its direction of motion.If workpiece trembles near its planar initial position constantly, this pressure reduction damping force of this workpiece motion s that creates antagonism constantly then.The magnitude of this pressure reduction (and the damping force that therefore produces) depends on the size in the slit 120 between workpiece and the damping piece.Less gap area produces big ratio in the slit pressure changes, thereby produces bigger restoring force or damping force.Yet if the slit becomes too small, it is excessive that damping force can become, and the stress that is produced may damage or destroy workpiece.On the contrary, if the slit is too big, then damping force becomes too small and can not press down the motion of workpiece fully.Comprehensive these considerations, in this execution mode, damping sheet 106 separates 1mm magnitude distance with the resting position of workpiece.More specifically, in this execution mode, slit 120 provides optimum damping force greater than 1.5mm and less than 3mm easily because have been found that between the distance between 1.5～3mm in this execution mode.Alternatively, can substitute in other suitable slits, and the structure of the specific device of being discussed and required damping force are also depended in this suitable slit.
In this execution mode, device 100 also comprises first window 116 between the dorsal part 112 that places arc lamp 108 and workpiece 104 and places second window 118 between the equipment side 114 of photoflash lamp 110 and workpiece.In this execution mode, window 116 and 118 and damping piece 106 similar, all can see through most of emittance that arc lamp 108 and photoflash lamp 110 are produced with specific wavelength.More specifically, in this execution mode, window 116 and 118 comprises corresponding water-cooled quartz windows, and what disclose among No. 2002/0102098, itself and the U.S. Patent Application Publication US is similar.In this execution mode, damping piece 106 is cooled off or is subjected to temperature to be controlled, yet, if wish, can provide suitable temperature control system 150.For example, this temperature control system can comprise cooling system, and this cooling system is configured to make suitable cooling fluid (gas or liquid) with overdamp part 106.If need, for economic benefit, damping piece 106 and window 116,118 can use common coolant fluid system; Yet, may depend on measurement or the diagnostic wavelength that in given execution mode, is adopted for the demand of described system.For example, in one embodiment, the thermal radiation of workpiece 104 can be greater than 1.4 μ m, for example measure for the diagnostic wavelength of 1450nm, and window 116 and 118 can be by water-cooled.In this execution mode, water coolant has absorbed arc lamp and photoflash lamp sends roughly all radiation with diagnostic wavelength 1450nm, thereby prevents that thermal-radiating measurement to workpiece is subjected to the influence of the radiation that arc lamp and photoflash lamp send.Therefore, in this execution mode,, then do not wish damping piece 106 to be carried out water-cooled if damping piece places between workpiece and the measuring equipment yet because at workpiece detected or measure before, water coolant will absorb the thermal radiation of workpiece with the diagnostic wavelength of 1450nm.Thereby if need, other the outer suitable cooling fluids that can dewater substitute.Alternatively, except cooling system or outside cooling system, this temperature control system 150 can be configured to damping piece 106 is remained in the temperature or temperature range of required rising.
Still with reference to Fig. 1 and 2, in this execution mode, device 100 also comprises support system, and this support system is configured to workpiece support above damping sheet 106.More specifically, in this execution mode, this support system comprises a plurality of supporting pins, for example among Fig. 2 with 130 and 132 the expression.In this execution mode, that each supporting pin includes is ultrapure, high-quality, non-Exposure to Sunlight type quartz, alternatively, and can other suitable material substitution.In this execution mode, each supporting pin is installed in the damping piece 106, and extends to the degree of depth (being 5mm in this execution mode) of 3mm in the damping piece 106.Each supporting pin has the upper end of the rounding that projects upwards from damping piece 106, reducing to swipe or the possibility of defective work piece 104, and reduces thermo-contact.Supporting pin is higher than the desired height of the height of damping piece 106 upper surfaces corresponding to the slit 120 between damping piece 106 and the workpiece 104, and it is preferably in the scope of 1.5～3mm in this execution mode.
In this execution mode, supporting pin be arranged to the center of damping piece 106 at a distance of a common radial distance, and be positioned at from radially inner position, the neighboring of workpiece 104.Consider that thus in this execution mode, the choice of location of supporting pin becomes two antagonism factors of balance, temperature homogeneity in promptly preheating and the workpiece durability in the irradiance flash.Near outer workpiece exclusion area (exclusion zone), in this periphery, zone, this is tending towards providing the temperature homogeneity of improvement in preheating with described finger setting, but is tending towards increasing the stress on the workpiece in the irradiance flash; On the contrary, though support pin is positioned the durability that motion that further inside place is tending towards the stress by reducing workpiece and reduces its barycenter improves workpiece, it is tending towards reducing the temperature homogeneity in preheating.Supporting pin is suitably located and these factors of balance often depend on according to the circulation of the particular thermal discussed---comprise that it preheats and the rate of heat addition of glistening.In this execution mode, have four pins to be provided with around damping piece 106, and it is apart from the required radial distance in damping piece 106 centers with the interval of 90 degree.Alternatively,---for example 8---of pins that can other number substitute.Perhaps, as another optional form, workpiece 104 can by with above-mentioned U.S. Patent Application Publication US2004/0178553A1 number in the similar support system of arbitrary class support system that discloses be supported in the desired resting position with respect to damping piece.
In this execution mode, damping piece 106 self by (with above-mentioned U.S. Patent Application Publication US2004/0178553A1 number in the various plates that disclose similar) bearing edge 122 that the ring-type of workpiece plane 124 is inwardly outstanding supported, this bearing edge 122 has the cylindrical hole of qualification hollow within it, and damping piece 106 and workpiece 104 are supported on wherein.
During operation, finding that damping piece 106 separates with above-mentioned preferred distance and workpiece 104 makes and is easy to the initial amplitude of thermal induction campaign is reduced about order of magnitude, and makes similarly and be easy to significantly to reduce amplitude or the duration that the follow-up workpiece of irradiance flash and then trembles or vibrates.Thereby, reduce significantly workpiece is caused the possibility of damaging or destroying.
Refer again to Fig. 1, although damping piece 106 has been described as seeing through most of wavelength that irradiation system produces, alternatively, damping piece can be partly or entirely not penetrable.For example, if need, arc lamp or other preheat the top that equipment can move on to the device shown in Fig. 1, near photoflash lamp 110, perhaps photoflash lamp 110 can be used as the equipment of preheating (DC pattern continuously) and is used as irradiance flash device (by making capacitor set discharge, not shown), make workpiece 104 only from top irradiation.Perhaps, as another optional mode, damping piece 106 himself comprises that also can thus serve as the equipment of preheating preheats workpiece to a hot plate.In this execution mode, workpiece or can remain on is higher than hot plate one fixed range place and only preheats by the conduction of installing the environmental gas in 100, perhaps alternatively, can be arranged in the stage of preheating contacts with hot plate, and can above damping piece 106, be raised up to required clearance distance subsequently, with damping thermal induction campaign in the process of irradiance flash in irradiance flash and and then.
With reference to Fig. 3, damping piece 106 needn't one be positioned the below of workpiece 104, but also can be positioned at the top of workpiece if desired.For example, the device of thermal induction campaign that is used for suppressing workpiece according to second embodiment of the invention illustrates with 300 generally at Fig. 3.Device 300 comprises the workpiece plane 302 that improves, and it is used for as the support system that is configured at damping piece supported underneath workpiece.Workpiece plane 302 supports supporting workpiece 104 by using a plurality of flexible quartz fibres, and this quartz fibre supports and for example illustrates with 304, as disclosed in above-mentioned U.S. Patent Application Publication US2004/0178553A1 number.Workpiece plane 302 also comprises the bearing edge that a ring-type is inwardly outstanding, is used for damping piece 106 is supported on desired clearance distance the resting position top of workpiece 104.In this execution mode, because damping piece 106 places between photoflash lamp 110 and the workpiece 104, it can see through certain wavelength, and wherein most of emittance of photoflash lamp 110 produces with this wavelength.
With reference to Fig. 1 and 4, illustrate with 400 generally at Fig. 4 according to the device of thermal induction campaign that is used for suppressing workpiece of third embodiment of the invention.This device 400 comprises workpiece plane 402, and this workpiece plane has the inwardly outstanding bearing edge 404 of following ring-type, be used for with the similar mode of the execution mode supporting damping spare 106 shown in Fig. 1.Yet in this execution mode, device 400 also comprises second damping piece 406, and this second damping piece 406 is supported by outstanding bearing edge 408 in the last annular shape of workpiece plane 402.In this execution mode, the supporting pin that projects upwards from first damping piece 106 is used as support system, and it is configured to workpiece support above first damping piece, below second damping piece.In this execution mode, the slit 120 between workpiece dorsal part 112 and the damping piece 106 is similar to the slit in the aforementioned embodiments, promptly is preferably the magnitude of 1.5～3mm.Similarly, in this execution mode, the equipment side 114 of workpiece also is roughly identical magnitude with slit 420 between second damping piece 406.In this execution mode, wherein workpiece is the semiconductor wafer with equipment side 114, for equipment side 114, does not wish itself and second damping piece, 406 actual contact, because the equipment of described contact on may damage equipment side 114.Thereby if need, slit 420 can be greater than slit 120, or alternatively, slit 120 and 420 all can be slightly larger than the slit of aforementioned embodiments, although this is that its combined effect can obtain enough damping forces because reduced by the damping force that wherein any provided separately.In addition, for the damping force of increase is provided, first damping piece and second damping piece be all near wafer, thereby be tending towards reducing near the gas flux the wafer, and this is tending towards reducing convection current and pollution problem.
With reference to Fig. 1,2 and 5, in Fig. 5, illustrate with 500 generally according to the damping piece of four embodiment of the invention.In this execution mode, damping piece 500 roughly is similar to the damping piece 106 shown in Fig. 2, and can see through most of wavelength that arc lamp 108 and photoflash lamp 110 are produced.Yet in this execution mode, damping piece 500 comprises auxiliary heater 502, and it is configured near the workpiece outer regions to the auxiliary heat energy of damping piece supply.More specifically, in this execution mode, auxiliary heater 502 comprises resistance heater, and this resistance heater is arranged near the workpiece outer regions.Still more specifically, in this execution mode, this resistance heater circular in configuration, and its circumference is greater than the circumference of workpiece 104, and this resistance heater be installed in damping piece 500 the top, be positioned at the outside position of workpiece outer periphery.Consider that thus in this execution mode, the main heating source of damping piece 500 is workpiece 104 self, it is undertaken by the thermal radiation of workpiece and the conduction of the environmental gas in the slit 120.Because geometry is compared with the outer regions of damping piece 500, the center of damping piece 500 has received more heat from these effects.Therefore, the damping piece heart therein becomes hotter, and compares the middle section that is tending towards to workpiece 104 with the outer regions of workpiece and return more heat.In addition, it will be appreciated that because edge effect, workpiece is tending towards radiation in its outer regions than zone in the central and falls more multipotency, this is because in the long-pending cause bigger with the ratio of volume of periphery region surface.In order to compensate these effects, thereby and improve the temperature homogeneity of workpiece, provide electric current by the system controller (not shown) to auxiliary heater 502, make auxiliary heater 502 near the workpiece peripheral edge regions, transmit extra heat to damping piece 500.Be sent to auxiliary heater electric current amount and therefore to be sent to the amount of heat energy of damping piece by auxiliary heater preferably controllable, realize the temperature homogeneity of improving so that flexibility to be provided in different thermal cycles.Thereby by providing auxiliary heat energy to damping piece with controllable mode, the temperature homogeneity of damping piece is improved, thereby reduces damping piece turns back to heat workpiece in mode heterogeneous trend.
Alternatively, except resistance heater, auxiliary heater 502 can comprise the material that radiation coefficient is bigger than near the material of the damping piece the workpiece central authorities near the workpiece periphery.For example, described material can comprise that one deck is similar to the silicon materials of workpiece 104 self material, and it is installed in the ring-type ring of upper surface of damping piece 500.Thereby described material is heated with the speed that holds material greater than damping piece by irradiation system (comprising arc lamp 108 and photoflash lamp 110)---because its radiation coefficient is bigger.Except being heated by irradiation system, described material is also compared the more relative less heat emission of vast scale (because emissivity is higher) from the workpiece absorption with the remainder of damping piece 500.Thereby, in this execution mode, auxiliary heater 502 is tending towards remaining under the temperature that is higher than the damping piece middle section at the material of damping piece perimeter, and is tending towards heat energy quite a lot of or more volume is turned back on the workpiece, thereby compensates aforesaid effect and improve the temperature homogeneity of workpiece.Described material can be suitable for some application scenarios as auxiliary heater, and can be preferably used for other occasion by the flexibility that the controllability of resistance heating is brought.
Although show the discontinuity surface between the remainder of auxiliary heater 502 and damping piece 500 as Fig. 5, alternatively if need, auxiliary heater 502 can be formed within the damping piece 500 self.For example, auxiliary heater 502 can comprise a resistance heater that is formed in the damping piece self.Similarly, in this execution mode, wherein auxiliary heater 502 is compared the bigger material of radiation coefficient comprising near the workpiece periphery with near the material of damping piece workpiece central authorities, and such material is not provided on the outer surface of damping piece, this material can integrally be arranged on the inside of damping piece 500.In this execution mode, the radiation coefficient of material can spatially change in continuous or discrete mode by add suitable alloy (being quartz in this execution mode) in the material of damping piece 500, and produces the configuration of the required radiation coefficient that passes whole damping piece.
If need, stop that equipment 503 can be arranged to be positioned at the vertical top of the radially outer of workpiece periphery, be positioned at the top of auxiliary heater 502.Stop that equipment 503 can comprise reflecting surface, be not subjected to the radiation of the irradiance flash that photoflash lamp 110 produced, and extra thermal radiation is reflected back into workpiece from the fringe region of workpiece with protection auxiliary equipment 502.
With reference to Fig. 1 and 6, in Fig. 6, illustrate with 600 generally according to the workpiece plane of the device of fifth embodiment of the invention.In this execution mode, distance or slit 620 between damping piece 606 and the workpiece 104 are adjustable.In this regard, the controllability in slit is favourable, the damping force that scalable produced (or variation of compensate for ambient pressure) not only, and can handle the thermal coupling problem, and considered preheat, the optimization location of workpiece support in surface heating and the following cooling procedure.
The thermal coupling problem often preheat with follow-up cooling stage in but not be main the concern in the stage in quick irradiance flash.If workpiece 104 is by preheating (as shown in Figure 1) with its dorsal part 112 of arc lamp 108 irradiation, then depend on its pre-warmed speed, dorsal part 112 is tending towards having the temperature that is slightly higher than equipment side 114, thereby, the thermal expansion of dorsal part 112 is greater than the thermal expansion of equipment side 114, make workpiece thermal flexure slightly, the middle section of workpiece is downwards towards 106 motions of relatively cool damping piece.Owing to be inversely proportional to apart from the distance of damping piece by the environmental gas in the slit 120 106 thermal conduction rate and workpiece from the workpiece to the damping piece, the reclinate middle section of workpiece is compared with the perimeter of workpiece with higher speed conduction heat, thereby the middle section of workpiece becomes than its perimeter cold.It will be appreciated that because it produces thermal gradient and stress in workpiece, temperature non is undesirable like this.
On the contrary, if workpiece 104 heats from the top (for example by using the photoflash lamp 110 shown in Fig. 1 to preheat workpiece continuously or with the DC pattern, make the capacitance group discharge in order to flash of light by photoflash lamp 110 then), then the thermal flexure that is produced is tending towards occurring in opposite direction, be that the middle body of workpiece moves upward and slightly away from damping piece, and the motion of the outward flange of workpiece is near damping piece 106.In the case, because accept the irradiation of photoflash lamp 110 in preheating, equipment side 114 dorsal part 112 than workpiece is slightly warm.Because the outward flange of dorsal part 112 moves under this thermal flexure effect and close damping piece 106, thermal conduction rate from the outward flange of dorsal part 112 to damping piece 106 increases, thereby the temperature difference between equipment side and the dorsal part becomes bigger, causes that the thermal flexure effect further increases the weight of.In addition, because outward flange is cool with respect to the remainder of workpiece, so this outward flange is tending towards shrinking, and this forces the further thermal flexure of thermal expansion center of workpiece again.Thereby the workpiece bending is big more, and the heat conduction from the edge of work to the damping piece is big more, and this causes further crooked again and produces bigger heat conduction loss in edge.In the case, heat dissipation may be occurred, and excessive temperature non may be in workpiece, produced.The size that depends on inhomogeneities, these inhomogeneities are understood defective work pieces or even workpiece are ruptured.Also may occur in such thermal coupling and the heat dissipation effect follow-up cooling procedure after irradiance flash.
Found that such thermal coupling and heat dissipation effect take place slowlyer usually.For example, in some specific application, found that such thermal coupling and heat dissipation effect are not 1 * 10
2Occur in the time scale of ms magnitude, but can be 1 * 10
3Take place in the time scale of ms or longer magnitude.Because the workpiece rapid movement of being induced by flash of light itself occurs too soon, to such an extent as to these effects can not occur, consider these effects in the therefore main stage that the preheats neutralization follow-up cooling stage thereafter before irradiance flash.
In order to handle such thermal coupling and heat dissipation problems, in this execution mode, the distance between workpiece 104 shown in Fig. 6 and the damping piece 106 is adjustable.More specifically, in this execution mode, regulate between the second distance that first distance that the distance between damping piece and the workpiece can adopt in the stage that preheats and irradiance flash and kinetic damping stage are after this adopted less than first distance.In this execution mode, first distance is 2mm at least.More specifically, in this execution mode, first distance is about 1cm.Also be in this execution mode, second distance is enough little and make gas pressure between damping piece and the workpiece resists workpiece at irradiance flash and kinetic damping in the stage motion.In this execution mode, second distance is about 1.5mm.Alternatively, for example other distance of about 1mm substitutes.In this execution mode, the distance between damping piece and the workpiece also can be adjusted to the 3rd distance greater than second distance that is adopted in the cooling stage after the accompany movement damping stage.In this execution mode, the 3rd distance is 2mm at least.And, since the 3rd the distance greater than second distance, the thermal coupling effect in the cooling stage between damping piece and the workpiece is also reduced.Consider thus, wish damping piece near workpiece, provide suitable damping force in the process with irradiance flash in the irradiance flash process and and then in irradiance flash and kinetic damping stage, yet, such damping force preheat with cooling stage optional.Therefore, in this execution mode, workpiece 104 preheat with follow-up cooling stage in remain on and irradiance flash the and and then stage of irradiance flash is compared apart from damping piece 606 bigger distances, thereby, preheat with cooling procedure in by reducing to have reduced the thermal coupling effect by the conduction velocity in slit 620.
For reaching this purpose, in this execution mode, workpiece 104 is originally by a plurality of adjustable supports support, and is for example shown with 602 among Fig. 6.In order to regulate the interval between workpiece 104 and the damping piece 606, workpiece plane 600 comprises motor 604, and it is stepper motor in this execution mode.Motor 604 is connected in a three-dimensional (3D) cam 608, and this cam is roughly dish type but has the continually varying height, and this height change scope is the minimum constructive height from the maximum height of cam 608 1 sides to this cam opposite side.The supporting 610 of the EDGE CONTACT of cam 608 and supporting cam wheel driven member 612, this cam follower are connected on adjustable strutting piece 602.Thereby rotatablely moving of motor 604 is converted to the vertical motion of cam follower 612 and the strutting piece 602 thus and the vertical motion of workpiece 104 by cam 608.
Thereby, in this execution mode, comparing with the kinetic damping stage with irradiance flash, workpiece 104 obvious bigger height place above the stage of preheating is supported on damping piece 606 is with the thermal coupling effect in reducing to preheat.More specifically, in this execution mode, workpiece 104 is first distance above the stage of preheating is supported on damping piece, and this first distance is greater than 2mm in this execution mode.Still more specifically, in this execution mode this first apart from the 1cm magnitude.Be close to before the irradiance flash, motor 604 activates and workpiece 104 is reduced to the lower height of damping piece 606 tops---and be second distance, this second distance is the 1.5mm magnitude in this execution mode, to provide required damping force to resist in the flash of light process and to follow hard on thermal induction campaign in the process of flash of light.Specifically, in the process in whole kinetic damping stage, keep second distance, make up to after the flash of light process, having pass by time enough promptly that the workpiece motion s of being induced by flash of light has fully been prevented and do not needed further to prevent.In this execution mode, the kinetic damping stage can continue 1/10th seconds time after flash of light, or even after flash of light, continue one second time, but preferably flash of light afterwards the duration be not more than one second, to prevent excessive thermal coupling effect generation.Last in the kinetic damping stage, motor 604 activates once more, raising three distance of workpiece 104 to the damping piece top, its in this execution mode the 3rd distance with first apart from identical, be the 1cm magnitude.Alternatively, the 3rd distance can be as required and different with first distance.Similarly, first, second and third distance all can change according to the application scenario of being discussed as required continuously or discretely.In this execution mode, the first and the 3rd distance preferably enough prevents excessive thermal coupling and heat dissipation effect greatly, and that second distance is preferably selected to is as much as possible little (thereby maximum kinetic damping power is provided), and is chosen to thus be not more than and prevents workpiece actual collision damping piece or owing to the excessive damping force necessary distance that ruptures.
Advantageously, such method makes and can select support distances, also minimizes the optimal balance of undesirable thermal coupling effect simultaneously so that the obtainable kinetic damping power of maximization to be provided.For example, in this execution mode, do not need kinetic damping in the stage preheating, thus this stage with workpiece support 2mm place at least above damping piece, thereby reduced undesirable thermal coupling and heat dissipation effect.On the contrary, in irradiance flash and kinetic damping stage after this, need strong kinetic damping, but because this duration in stage is short, thermal coupling and heat dissipation effect not main Considerations.Thereby, for flash of light and kinetic damping stage, workpiece is reduced to the distance of damping piece top 1.5mm magnitude, thereby obviously bigger damping force is provided, and prevent the flash of light induced motion of workpiece, and can not experience the rough sledding of thermal coupling or heat dissipation effect.At last,, do not need kinetic damping, get back to above damping piece distance so upwards lift workpiece, thereby prevent excessive thermal coupling and heat dissipation effect greater than 2mm at follow-up cooling stage.Effectively, compare with irradiation and kinetic damping stage workpiece is supported on big distance above the damping piece preheating with cooling stage, thereby make the separation in kinetic damping stage or clearance distance only to select by its desirable kinetic damping effect.Thereby, with between workpiece and damping piece, only adopt the execution mode of single fixed separation distance and compare, the execution mode that has the scalable separating distance like this makes and can use littler separating distance in irradiance flash and kinetic damping stage, thereby produce bigger kinetic damping power in this in stage, and can not experience the excessive thermal coupling that in the execution mode of fixed range, is easy to occur and the rough sledding of runaway effect.
With reference to Fig. 2 and Fig. 6, although workpiece 104 can preheat and the flash of light stage is supported on strutting piece 602 and similarly on the strutting piece, preferably, damping piece 606 comprises a plurality of strutting pieces---for example with the supporting pin shown in 630 and 632, and before being close to irradiance flash, workpiece 104 is reduced in the damping piece support.Supporting pin 630 and 632 roughly is similar to the supporting pin 130 and 132 shown in Fig. 2, yet in this execution mode, supporting pin 630 is different with the position of supporting pin 130 and 132 with 632 position.Can recall, supporting pin 130 becomes with 132 choice of location preheating between the workpiece durability (it wishes that the supporting pin position is further inside, to minimize the motion of workpiece barycenter) of the temperature homogeneity in stage (it wishes that supporting pin is in the workpiece outer edge) after following hard on the flash of light stage with the neutralization of flash of light stage to realize balance.Yet in this execution mode, workpiece 104 by adjustable strutting piece 602 and similar supports support, and is reduced to supporting pin 630 and 632 and similarly be used for flash of light on the pin in preheating process.Thereby in this execution mode, supporting pin 630 and 632 position can only be chosen as the durability maximization that makes in the flash of light and follow hard on workpiece in the process of flash of light.In this execution mode, reach on the similar pin for the ease of workpiece 104 being reduced to supporting pin 630 and 632, in this execution mode, damping piece 606 comprises a plurality of for example with the depressed part shown in 640, so that this adjustable strutting piece 602 can move downward in the plane that enters damping piece 606.
With reference to Fig. 7, illustrate with 700 according to the workpiece plane of sixth embodiment of the invention.In aforementioned embodiments, the slit 720 between workpiece 104 and the improved damping piece 706 is adjustable.For realizing this purpose, workpiece plane 700 comprises actuator 702, and it comprises a controlled linear actuators of two-step in this execution mode.More particularly, this actuator 702 can for example comprise a voice coil actuator or a micro linear (nanomuscle) actuator (shape memory alloy actuator), yet actuator that can other type substitutes.This actuator 702 is communicated with strutting piece 708 by straight-line linkage 704, and it comprises quartz pushrod in this execution mode.This straight-line linkage 704 becomes the approximate horizontal movement conversion of actuator the vertical motion of strutting piece 708 ends.Improved damping piece 706 for example comprises with the supporting pin shown in 730 and 732 and a plurality of for example with the depressed part shown in 740, the supporting pin 630 shown in itself and Fig. 6 and 632 and depressed part 640 similar.
Alternatively, maybe can add ground, the slit between workpiece and the damping piece can be regulated by mobile damping piece.For example, with reference to Fig. 8, illustrate with 800 and 806 respectively generally according to the workpiece plane and the damping piece of seventh embodiment of the invention.Damping piece 806 comprises the quartz plate that is similar to this paper damping piece described above, yet damping piece 806 attachings can vertically move up and down to allow damping piece 806 on the dodge gate (not shown) in this execution mode.Also be in this execution mode, workpiece 104 self is movably because its by a plurality of for example by the supports support shown in 802.In this execution mode, strutting piece 802 comprises a quartz pushrod, and is connected on the solenoid actuator 804 by linking arm 808, can carry out controllable pivoting action around pivotal point 810 to allow strutting piece 802.In this execution mode, damping piece 806 also comprises a plurality of for example with the depressed part shown in 840, and is similar with the depressed part shown in 640 and 740 in itself and Fig. 6 and 7.
Refer again to Fig. 6～8, for example adopting with the movable support member shown in 602,708 and 802 and for example in the execution mode with the combination of securing supports shown in 630,632,730,732,830 and 832, when workpiece 104 is subjected to irradiance flash and is supported on the securing supports simultaneously, preferably, prevent that workpiece 104 actual collision are to movable support member.For realizing this purpose, preferably, the depressed part 640,740 and 840 shown in Fig. 6～8 is enough dark, and is so that movable support member is contained in wherein, concordant or lower slightly with 800 upper surface with workpiece plane 600,700 respectively.Alternatively, this depressed part can pass the vertical slots replacement that workpiece plane limits, and moves down so that movable support member can pass the whole work-piece flat board.
Alternatively, maybe ground can be added,, horizontal retraction member can be provided, before irradiance flash so that movable support member can level outwards be withdrawn if need.In this execution mode, workpiece can be supported in preheating process on the movable support member, then is reduced on the securing supports, and level was outwards withdrawn before movable support member can be close to irradiance flash at this moment.Then, workpiece can be subjected to irradiance flash, and after the thermal induction campaign that is produced had suitably been prevented, described movable support member can extend radially inwardly and engage the lower surface of workpiece and it is lifted away from securing supports.Be close to the movable support member of withdrawing in this way before the irradiance flash, this edge that has prevented workpiece collides movable support member in the thermal flexure process of being induced by flash of light, thereby prevents defective work piece and movable support member.
Although the execution mode of describing in Fig. 6～8 is realized the controllability in the slit between damping piece and the workpiece by use (for example with shown in 602,708 and 802) movable support member and (for example with shown in 630,632,730,732,830 and 832) combination of securing supports, alternatively, can other mode that can realize this controllability substitute.For example, single group slender strutting piece (not shown) can be extended through damping piece self, and it is extensible and retractible, to change the height of workpiece support at the damping piece place.
In addition, if need, can provide the parts (not shown) that workpiece is recentered.In this regard, according to the magnitude of irradiance flash and the slit between workpiece and the damping piece in duration and flash of light stage, workpiece can move horizontally because of flash of light from its original position.If appearing at, this adopt movable support member that first distance (be used to preheat stage) of workpiece from it apart from damping piece moved to its second distance (being used for irradiance flash and kinetic damping stage), then moving horizontally of workpiece can make and engage workpiece again and workpiece is moved to its 3rd distance when (being used for cooling stage) in that movable support member is retracted, and workpiece and movable support member are staggered.Therefore, correctly align with movable support member,, can provide one or more parts (not shown) that workpiece is recentered to allow that it is lifted away from securing supports in order to ensure workpiece.For example, the parts that workpiece is recentered can comprise the quartz pushrod that three or different number are vertically oriented, and after the stage, it radially moves inward and engage the periphery of workpiece and it is recentered from workpiece plane at irradiance flash and kinetic damping.Alternatively, can provide for example above-mentioned U.S. Patent Application Publication US 2004/0178553A1 the good middle lateral support that discloses, workpiece is remained in the required horizontal level scope.If provide, then such lateral support is preferably selected and is configured to avoid and the unsuitable fierce collision of workpiece, to prevent to destroy workpiece.For example, can select the flexible optical fibre lateral support, and this flexible optical fibre lateral support can be spaced apart radially outwardly with the edge of workpiece, however alternatively, can other type and the lateral support of structure substitute.
With reference to Fig. 1 and 9, illustrate with 900 according to the damping piece of eighth embodiment of the invention.In this execution mode, damping piece 900 is roughly similar with the damping piece 106 shown in Fig. 1, and comprises a quartz plate.Yet in this execution mode, damping piece 900 is configured to apply a damping force that spatially changes.For realizing this purpose, in this execution mode, damping piece comprises a flat board, and this flat board has a plurality of qualifications depressed part 904 within it, so that near the damping force each depressed part is than little away from the damping force of depressed part.In this regard, it will be appreciated that, near described depressed part, if workpiece 104 suddenly towards or away from damping piece 900 motion, then the environmental gas that is added in depressed part self has produced the pressure than small scale at the near zone that is close to depressed part and has changed.Thereby for example the depressed part of depressed part 904 can be arranged on the lower slightly any position of required damping force.
Alternatively, can be provided on the space and to change or the alternate manner of time dependent damping force substitutes.For example, in another exemplary execution mode of the present invention, a kind of improved damping piece can comprise electrostatic chuck damping sheet (not shown).Has dielectric materials layer on the upper surface of this damping sheet.More specifically, in this execution mode, dielectric material comprises Al
2O
3, its its have suitable alloy so that it has characteristic of semiconductor (Al for example
2O
3In inject the SiC particulate), yet alternatively, can substitute by other dielectric material.In this execution mode, the electrostatic chuck damping sheet is not penetrable (opaque), and preheating of workpiece can be by being realized by top irradiation workpiece or realizing by making damping sheet self be used as hot plate.The electrostatic chuck damping sheet comprises a plurality of variable electrostatic force generators.More specifically, this forcer comprises a plurality of electrode pairs that are installed in diverse location in the dielectric material, and the voltage of each electrode is separately controllable.Still more specifically, in this execution mode, each electrode pair all is structured as ambipolar Johnson Rahbek electrostatic chuck forcer.Alternatively, can other suitable electrostatic chuck electrode configurations substitute for example ambipolar Coulomb electrostatic chuck configuration.Workpiece 104 is supported on damping piece top by a plurality of from the upwardly extending supporting pin of damping piece, and the downward electrostatic force that is applied on the workpiece by each electrode can be applied to voltage and control separately on the electrode by control.In this execution mode, at least some electrode pairs are arranged to from supporting pin radially inside, and at least some electrode pairs are arranged to from supporting pin radially outward.
Such electrostatic chuck damping piece can advantageously be configured in response to the motion of workpiece electrostatic force is applied on the workpiece.Device according to this execution mode preferably includes the detector that is configured to detect workpiece motion s.Thereby, in preheating, if slight thermal flexure or other distortion occur, then being positioned at workpiece below is raised from the voltage of the damping sheet electrode pair farthest voltage with respect to the electrode pair that is positioned at the nearer part in workpiece below, thereby be easy to make workpiece to flatten and then reduce temperature non, otherwise this temperature non will be by the thermal coupling of the increase between the forefield of the workpiece of damping sheet and distortion and is produced.
Generally speaking, in this execution mode, each variable electrostatic force generator is optionally controllable, to make workpiece static be deformed to desirable shape before workpiece thermal induction campaign.Although in the example of Tao Luning, desirable shape is smooth shape in front, to reduce thermal coupling, alternatively, desirable shape can be an on-plane surface.For example, before being close to flash of light, optionally control electrode to and workpiece predeformation is become required form, the curved shape of central elevation for example, with the stress that reduces to glisten and produce, or alternatively, be the curved shape that the center reduces, the size of the thermal induction campaign that produces to reduce to glisten.
In addition, at flash of light and back to back kinetic damping in the stage after this, when workpiece 104 thermal flexures and when beginning to tremble, the Continuous Selection control electrode is right, when workpiece swells, radially inwardly increase the voltage of electrode pair from supporting pin, provide bigger downward damping force with the workpiece centre, and opposite, when workpiece centre descends, radially outward increase the voltage of electrode pair from supporting pin, so that bigger downward damping force to be provided at the edge of work.Such control can be by realizing in the Control Circulation of a sealing with the computer of workpiece motion s communication detector.
With reference to Fig. 2 and 10, in Figure 10, illustrate with 1000 generally according to the damping piece of ninth embodiment of the invention.In this execution mode, damping piece 1000 comprises one, and it is limited in the surface of damping piece 1000 generally with the annular recess shown in 1004, and annular recess 1004 is configured between thermal induction moving period the outward flange of workpiece 104 is being contained in wherein.In this regard, in this execution mode, the thermal induction campaign of workpiece 104 can comprise that the outer peripheral thermal induction of workpiece curls, and for example the outer regions of workpiece (is sharply curled downwards as outside 1～2cm), as previously mentioned at first.Therefore, annular recess 1004 is used to hold the outward flange that workpiece curls.In this execution mode, damping piece 1000 roughly is similar to the damping piece 106 shown in Fig. 2, includes annular recess 1004 but changed into, and annular recess 1004 is limited in the upper surface 1006 of damping piece 1000.In this execution mode, if such edge curl appears in workpiece 104 outward flanges, then the periphery of workpiece 104 or edge can be crimped onto downwards in the annular recess 1004, and can itself actual collision not take place with damping piece 1000.By stoping this type of actual contact, avoided potential damage to workpiece.In addition, annular recess 1004 makes the spacing between damping piece 1000 and the workpiece 104 or the height in slit 120 be decreased to littler spacing, thus the vibration and the vibration that provide bigger damping force to prevent workpieces in subsequent.
In the version of present embodiment, damping piece can see through radiation and workpiece preheats by passed the damping piece emitted radiation by the equipment of preheating, and can select the physical size of annular recess 1004 and curvature to realize required optical effect.For example, the size of annular recess 1004, shape and other characteristic (for example reflection coefficient, transmission coefficient, radiation coefficient) can be configured to produce the lens effect and the outer regions that extra irradiation is delivered to workpiece, with compensate for edge effects, promptly, owing to having the ratio of bigger surface area with volume, workpiece loses the trend of more heat energy by irradiation near its edge.When size that for this reason designs annular recess 1004 and shape, preferably also consider other relevant heat transfer aspects, for example comprise: the degree of depth of annular recess and the change of structure thereof are to the influence of the thermal conduction rate between the outer regions of damping piece and workpiece.
In this execution mode, annular recess 1004 degree of depth are 1～5mm magnitude, and the distance of radially inwardly extending 1～2cm magnitude from the periphery or the edge of workpiece.Alternatively, can other size substitute, perhaps hold the thermal induction campaign of workpiece or realize required lens effect or both's realization with structure.
More generally, although described and explained specific implementations of the present invention, described execution mode should be considered to just explanation of the invention rather than restriction the present invention, should be according to appended claim to its explanation.
Claims (60)
1. device comprises:
A) workpiece heating system, it is configured to the motion of thermal induction workpiece; With
B) damping piece, itself and workpiece are spaced apart and are configured to apply damping force to prevent the motion of workpiece, wherein, the resting position of described damping piece and workpiece separates enough little and makes the gas pressure between damping piece and the workpiece resist the distance of the motion of workpiece, and the resting position of described damping sheet and described wafer separates the distance less than 3mm.
2. device as claimed in claim 1, wherein, described workpiece comprises semiconductor wafer, and wherein, described damping piece comprises the damping sheet that is spaced apart with this wafer.
3. device as claimed in claim 2, wherein, the resting position of described damping sheet and described wafer separates the distance of 1mm.
4. device as claimed in claim 2, wherein, the resting position of described damping sheet and described wafer separates the distance greater than 1.5mm.
5. device as claimed in claim 2 also comprises being configured to the support system of wafer support above damping sheet.
6. device as claimed in claim 2 also comprises being configured to the support system of wafer support below damping sheet.
7. device as claimed in claim 1, wherein, described damping piece comprises first and second damping pieces, also comprise be configured to wafer support above first damping piece, second damping piece below support system.
8. device as claimed in claim 2, wherein, described damping sheet comprises annular recess, this annular recess is limited in the surface of this damping sheet and is configured at the outward flange that holds wafer between described thermal induction moving period.
9. device as claimed in claim 1, wherein, described workpiece heating system comprises the irradiation system that is configured to the described workpiece of irradiation.
10. device as claimed in claim 9, wherein, described irradiation system comprises at least one irradiance flash device, this irradiance flash device is configured to described workpiece is exposed under the irradiance flash.
11. device as claimed in claim 10, wherein, described irradiance flash device comprises photoflash lamp.
12. device as claimed in claim 10, wherein, described irradiance flash device comprises microwave pulse generator.
13. device as claimed in claim 10, wherein, described damping piece is placed between described at least one irradiance flash device and the described workpiece, and described damping piece can see through the irradiance flash of at least some wavelength.
14. device as claimed in claim 1, wherein, described damping piece comprises window.
15. device as claimed in claim 14, wherein, described damping piece comprises quartz window.
16. device as claimed in claim 1 also comprises auxiliary heater, this auxiliary heater is configured to the auxiliary heat energy of described damping piece supply.
17. device as claimed in claim 16, wherein, described auxiliary heater comprises near the resistance heater the outer regions that is arranged on described workpiece.
18. device as claimed in claim 16, wherein, described auxiliary heater comprise near the outer regions of described workpiece with workpiece central authorities near the material of damping piece compare and have the more material of high radiation coefficient.
19. device as claimed in claim 10, wherein, described irradiation system also comprises the system of preheating, and this preheats system construction and becomes the stage that preheats before described irradiance flash to preheat described workpiece.
20. device as claimed in claim 19, wherein, the distance between described damping piece and the workpiece is adjustable, in order to regulate damping force.
21. device as claimed in claim 19, wherein, distance between described damping piece and the workpiece is adjustable between at least one first distance and a second distance, wherein this first distance is used for the described stage that preheats, and this second distance is less than this first distance and be used for described irradiance flash and after this kinetic damping stage.
22. device as claimed in claim 21, wherein, described first distance is 2mm at least.
23. device as claimed in claim 21, wherein, described second distance is enough little and make gas pressure between described damping piece and the workpiece resists described workpiece at described irradiance flash and kinetic damping in the stage motion.
24. device as claimed in claim 23, wherein, described second distance is about 1mm.
25. device as claimed in claim 23, wherein, described second distance is about 1.5mm.
26. device as claimed in claim 23, wherein, described second distance is less than 2mm.
27. device as claimed in claim 21, wherein, distance between described damping piece and the workpiece is adjustable between described first distance, second distance and the 3rd distance, and the 3rd distance is greater than described second distance and be used to follow in the cooling stage of kinetic damping after the stage.
28. device as claimed in claim 27, wherein, described the 3rd distance is 2mm at least.
29. device as claimed in claim 1, wherein, described damping piece is configured to apply the damping force that spatially changes.
30. device as claimed in claim 29, wherein, described damping piece comprises flat board, is limited with a plurality of depressed parts in this flat board, makes near each depressed part damping force less than the damping force away from the depressed part place.
31. a device comprises:
A) be used for the device of the motion of thermal induction workpiece; With
B) be used to apply the device of damping force with the motion of preventing described workpiece, described device and the described workpiece that is used to apply damping force is spaced apart, wherein, described device that is used to apply damping force and workpiece separate enough little and make the distance of motion of described device that is used to apply damping force and the antagonism of the gas pressure between workpiece workpiece, and described distance is less than 3mm.
32. a method comprises:
A) motion of thermal induction workpiece; With
B) apply damping force to prevent the motion of described workpiece, and a damping piece and described workpiece are spaced apart, wherein, the described damping force that applies comprises making between damping piece and the workpiece and keeps enough little and make the gas pressure between this damping piece and the workpiece resist the distance of the motion of workpiece, and described distance is less than 3mm.
33. method as claimed in claim 32, wherein, described workpiece comprises semiconductor wafer, and described damping piece comprises the damping sheet that is spaced apart with this wafer.
34. method as claimed in claim 33, wherein, described maintenance comprises described damping sheet is remained on and the resting position of the wafer distance at a distance of 1mm.
35. method as claimed in claim 34, wherein said maintenance comprise with described damping sheet remain on the resting position of wafer at a distance of distance greater than 1.5mm.
36. method as claimed in claim 33, wherein, described maintenance comprises wafer support above damping sheet.
37. method as claimed in claim 33, wherein, described maintenance comprises wafer support below damping sheet.
38. method as claimed in claim 32, wherein, described damping piece comprises first and second damping pieces, and described maintenance comprise with wafer support above first damping piece, second damping piece below.
39. method as claimed in claim 33 also is included in the described thermal induction motion process outward flange with wafer and is contained in the annular recess in the surface that is defined in damping sheet.
40. method as claimed in claim 32, wherein, described thermal induction campaign comprises described workpiece is exposed under the irradiance flash.
41. method as claimed in claim 40, wherein, described exposure comprises described workpiece is exposed under the irradiance flash that is produced by photoflash lamp.
42. method as claimed in claim 41, wherein, described exposure comprises described workpiece is exposed under the irradiance flash that is produced by microwave pulse generator.
43. method as claimed in claim 40, wherein, described damping piece can see through the irradiance flash of at least some wavelength, and wherein, described irradiation comprises that passing described damping piece is transmitted into described workpiece with at least some irradiance flash.
44. method as claimed in claim 32, wherein, described damping piece comprises window.
45. method as claimed in claim 44, wherein, described window comprises quartz window.
46. method as claimed in claim 32 also comprises to the auxiliary heat energy of described damping piece supply.
47. method as claimed in claim 46, wherein, described supply comprises near the resistance heater supply of current the outer regions that is arranged on described workpiece.
48. method as claimed in claim 46, wherein, described supply comprises being positioned near the described workpiece outer regions, comparing the material with higher radiation coefficient and carry out irradiation with near the material of damping piece the workpiece central authorities.
49. method as claimed in claim 40, the stage that preheats that also is included in before the described irradiance flash preheats described workpiece.
50. method as claimed in claim 49 also comprises the distance of regulating between described damping piece and the workpiece.
51. method as claimed in claim 49, also being included in the stage of preheating keeps first distance between described damping piece and workpiece, and keeps second distance less than this first distance in irradiance flash and kinetic damping stage after this between described damping piece and workpiece.
52. method as claimed in claim 51, wherein, described maintenance first will remain the distance of 2mm at least apart from being included in the stage of preheating between described damping piece and the workpiece.
53. method as claimed in claim 52, wherein, described maintenance second distance is included in described irradiance flash and kinetic damping stage and remains the distance between described damping piece and the workpiece enough little and make the motion of the gas pressure antagonism workpiece between damping piece and the workpiece.
54. method as claimed in claim 53, wherein, described maintenance second distance is included in irradiance flash and kinetic damping stage and keeps being about the distance of 1mm between described damping piece and workpiece.
55. method as claimed in claim 53, wherein, described maintenance second distance is included in irradiance flash and kinetic damping stage and keeps being about the distance of 1.5mm between described damping piece and workpiece.
56. method as claimed in claim 53, wherein, described maintenance second distance is included in irradiance flash and kinetic damping stage and keeps distance less than about 2mm between described damping piece and workpiece.
57., also be included in the 3rd distance that between described damping piece and workpiece, keeps in the accompany movement damping stage cooling stage afterwards greater than described second distance as the method that claim 51 is stated.
58. method as claimed in claim 57, wherein, described maintenance the 3rd distance is included in cooling stage and keeps the distance of 2mm at least between described damping piece and workpiece.
59. method as claimed in claim 32, wherein said applying comprises and applies spatially the damping force that changes.
60. method as claimed in claim 59, wherein, described damping piece comprises flat board, is limited with a plurality of depressed parts in this flat board, makes near the damping force that is produced by gas pressure change of each depressed part less than the damping force away from the depressed part place.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/742,575 US9627244B2 (en) | 2002-12-20 | 2003-12-19 | Methods and systems for supporting a workpiece and for heat-treating the workpiece |
| US10/742,575 | 2003-12-19 | ||
| US60/568,685 | 2004-05-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1902746A CN1902746A (en) | 2007-01-24 |
| CN100550336C true CN100550336C (en) | 2009-10-14 |
Family
ID=37657599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004800380132A Expired - Fee Related CN100550336C (en) | 2003-12-19 | 2004-12-17 | Be used to suppress the device and method of the thermal induction campaign of workpiece |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN100550336C (en) |
| TW (1) | TWI476858B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102642205B1 (en) * | 2017-10-25 | 2024-02-28 | 액셀리스 테크놀러지스, 인크. | Slow-angle, multi-wavelength, multi-receiver, tunable-sensitivity aligner sensor for semiconductor manufacturing equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10003639C2 (en) * | 2000-01-28 | 2003-06-18 | Steag Rtp Systems Gmbh | Device for the thermal treatment of substrates |
| US6594446B2 (en) * | 2000-12-04 | 2003-07-15 | Vortek Industries Ltd. | Heat-treating methods and systems |
-
2004
- 2004-05-18 TW TW093113931A patent/TWI476858B/en not_active IP Right Cessation
- 2004-12-17 CN CNB2004800380132A patent/CN100550336C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWI476858B (en) | 2015-03-11 |
| TW200527576A (en) | 2005-08-16 |
| CN1902746A (en) | 2007-01-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5630935B2 (en) | Apparatus and apparatus for suppressing thermally induced motion of workpiece | |
| KR101163682B1 (en) | Apparatus and method for supporting a workpiece | |
| JP4643185B2 (en) | Transfer equipment | |
| US9707641B2 (en) | Laser micromachining optical elements in a substrate | |
| US20040105670A1 (en) | Photoirradiation thermal processing apparatus and thermal processing susceptor employed therefor | |
| US8815129B2 (en) | Device and method for forming lens | |
| JP2002026113A5 (en) | ||
| WO2008058397A1 (en) | Systems and methods for supporting a workpiece during heat-treating | |
| CN100550336C (en) | Be used to suppress the device and method of the thermal induction campaign of workpiece | |
| JP6592659B2 (en) | ROLLER PRESSURE DEVICE, IMPRINT DEVICE, AND ROLLER PRESSURE METHOD | |
| JP3456290B2 (en) | Optical element manufacturing method and optical element manufacturing apparatus | |
| US5791895A (en) | Apparatus for thermal treatment of thin film wafer | |
| JP2007188914A (en) | Semiconductor wafer rapid heating device | |
| JP2022137221A (en) | Workpiece dividing device and workpiece dividing method | |
| JP5926142B2 (en) | Apparatus and apparatus for suppressing thermally induced motion of workpiece | |
| WO2012133840A1 (en) | Imprinting device imprinting method, electronic circuit substrate, and electronic device | |
| CN114171384A (en) | Semiconductor annealing apparatus and control method thereof | |
| KR20200056156A (en) | Heat treatment apparatus for metal plate and heat treatment methods using the same | |
| KR101569381B1 (en) | Glass Thermal Transferring Apparatus with Double Heat Reflecting Plate | |
| KR20230148009A (en) | Apparatus for processing substrate | |
| JP2023057607A (en) | Wafer support device and semiconductor manufacturing device | |
| KR102235493B1 (en) | Substrate processing apparatus | |
| JPH10135227A (en) | Heating apparatus for semiconductor manufacturing apparatus | |
| KR101934832B1 (en) | Printing head for hot embossing apparatus | |
| JP2007169125A (en) | Press molding device, press molding method and method for manufacturing glass substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: MATTSON TECH INC. Free format text: FORMER OWNER: MATTSON TECHNOLOGY CANADA INC. Effective date: 20130219 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| C56 | Change in the name or address of the patentee | ||
| CP02 | Change in the address of a patent holder |
Address after: British Columbia Patentee after: Mattson Technology, Inc. Address before: Vancouver, Columbia, United Kingdom, Canada Patentee before: Mattson Technology, Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130219 Address after: California, USA Patentee after: MATTSON TECHNOLOGY, Inc. Address before: British Columbia Patentee before: Mattson Technology, Inc. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181203 Address after: California, USA Co-patentee after: Beijing Yitang Semiconductor Technology Co.,Ltd. Patentee after: MATTSON TECHNOLOGY, Inc. Address before: California, USA Patentee before: MATTSON TECHNOLOGY, Inc. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: California, USA Patentee after: MATTSON TECHNOLOGY, Inc. Patentee after: Beijing Yitang Semiconductor Technology Co.,Ltd. Address before: California, USA Patentee before: MATTSON TECHNOLOGY, Inc. Patentee before: Beijing Yitang Semiconductor Technology Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091014 |