TWI476661B - Sensor structure of touch panel and fabrication method thereof - Google Patents

Description

Sensing element structure of touch panel and manufacturing method thereof

The present invention relates to a sensing element structure of a touch panel and a manufacturing method thereof, and more particularly to a sensing element structure of a touch panel using an embossment structure and a conductive material having transparent characteristics as a sensing unit. Its production method.

In today's various types of consumer electronics, portable electronic products such as tablet computers, mobile phones and video players have widely used touch panels instead of traditional keyboards to communicate as human-machine data. Interface to save the size of electronic products.

Conventional touch panels mainly use transparent metal oxide materials to fabricate sensing elements. Among them, materials such as indium tin oxide are most commonly used at present. However, the transmittance, sheet resistance, and hue problem of transparent metal oxide materials are affected by the thickness of the film layer, for example, if the film layer is increased in order to lower the surface resistance value. The thickness, then the penetration rate of indium tin oxide is lowered, so in the case of using a conventional transparent metal oxide material as a sensing element, it is difficult to balance the transparency and electrical performance of the touch panel. In addition, indium tin oxide is a brittle material, and if it is applied to a soft touch panel, cracking easily occurs and the touch failure occurs. Therefore, it is conventional to further improve the fabrication of sensing elements using transparent metal oxide materials.

One of the objects of the present invention is to provide a embossed structure and a guide with transparent properties. The sensing element structure made of the electric material can effectively improve the above-mentioned problems of the transparency and electrical performance of the touch panel due to the sensing material of the sensing element.

To achieve the above objective, the present invention provides a sensing element structure of a touch panel. The sensing element structure includes a plurality of first sensing series disposed on a first surface of the first substrate along a first direction. Each of the first sensing series includes a plurality of first sensing units and a plurality of first trenches, wherein the first sensing units are adjacent to each other along the first direction, and each of the first sensing units respectively includes The first embossed structure and a first conductive material are disposed in the accommodating space of the first embossed structure. Each of the first trenches is disposed between any two adjacent first sensing units of the same first sensing series, so that the accommodating spaces of any two adjacent first embossed structures are respectively provided by the first The grooves are connected. Moreover, the first conductive material is further disposed in the first trench to electrically connect the first sensing units of the same first sensing series to each other.

In order to achieve the above object, the present invention further provides a method for fabricating a sensing element structure of a touch panel, comprising providing a first substrate having a first surface disposed oppositely, and then forming a plurality of first embossed structures on the first surface And a plurality of first trenches, wherein the first embossed structures are arranged in an array and have an accommodating space, and each of the first trenches is disposed between the first embossed structures arranged adjacently along the first direction, To connect the first embossed structures. Then, the first conductive material is filled in the accommodating space of the first embossed structure and the first trench. Forming a sealing layer on the surface of the first embossed structure to seal the first conductive material in the accommodating space and the first trench.

Since the present invention utilizes the embossed structure and the conductive material to fabricate the sensing element structure of the touch panel, the transparency and electrical performance can be simultaneously considered, and the embossed structure and the conductive material can adapt to the curved or soft environment, and thus the present invention The sensing element structure can be applied to a soft touch panel, which can greatly improve the problem that the conventional metal oxide material is brittle due to brittle characteristics.

100‧‧‧Sensor component structure basic unit

110‧‧‧Sensor component structure

112, 112', 112", 112" '‧‧‧ first substrate

112a, 112a', 112a", 112a" '‧‧‧ first surface of the first substrate

112b, 112b'‧‧‧ second surface of the first substrate

114‧‧‧First sensing unit

116‧‧‧First embossed structure

116a‧‧‧ accommodating space

118‧‧‧First conductive material

120‧‧‧ embossed material layer

120a‧‧‧ raised part

120b‧‧‧flat part

122‧‧‧First trench

124‧‧‧First sealing layer

126‧‧‧ recess

128, 128a, 128b, 128c‧‧‧ first sensing series

130‧‧‧First wire structure

130a‧‧ Wide wire section

130b‧‧‧fine wire section

132‧‧‧Rolling Roller

136‧‧‧Adhesive layer

138‧‧‧protection layer

140, 218‧‧‧Second conductive material

142‧‧‧Signal Sensing Area

144‧‧‧ Peripheral area

200‧‧‧Basic unit of sensing component structure

212‧‧‧second substrate

212a‧‧‧ First surface of the second substrate

214‧‧‧Second sensing unit

216‧‧‧Second embossed structure

216a‧‧‧ accommodating space

220‧‧‧ embossed material layer

222‧‧‧Second trench

224‧‧‧Second sealing layer

226‧‧‧ recess

228, 228a, 228b, 228c‧‧‧ second sensing series

230‧‧‧Second wire structure

240‧‧‧ Conductive bridging elements

242‧‧‧through holes

600, 700, 800, 900‧‧‧Sensor component structure / touch panel

610‧‧‧Signal Sensing Area

612‧‧‧ Peripheral area

H‧‧‧ embossed structure depth

Y‧‧‧First direction

X‧‧‧second direction

1 is a top plan view showing a first embodiment of a sensing element structure of a touch panel of the present invention.

Fig. 2 is a cross-sectional view showing the structure of the sensing element of the touch panel shown in Fig. 1 along a tangent line 2-2'.

Fig. 3 is a schematic view showing the process of the structure of the sensing element of the present invention.

4 is a top plan view showing a second embodiment of a sensing element structure including the touch panel of the present invention.

Fig. 5 is a cross-sectional view showing the structure of the sensing element of the touch panel shown in Fig. 4 along the tangential line 5-5'.

Figure 6 is a top plan view showing a third embodiment of a sensing element structure including the touch panel of the present invention.

Fig. 7A is a cross-sectional view showing the structure of the sensing element of the touch panel shown in Fig. 6 along a tangent line 7-7'.

Fig. 7B is a schematic cross-sectional view showing a first modified embodiment of the structure of the sensing element shown in Fig. 7A.

Fig. 7C is a schematic cross-sectional view showing a second modified embodiment of the structure of the sensing element shown in Fig. 7A.

Fig. 7D is a schematic cross-sectional view showing a third modified embodiment of the structure of the sensing element shown in Fig. 7A.

Figure 8 is a top plan view showing a fourth embodiment of a sensing element structure including the touch panel of the present invention.

Fig. 9 is a cross-sectional view showing the structure of the sensing element of the touch panel shown in Fig. 8 along a tangential line 9-9'.

FIG. 10 is a top plan view showing a fifth embodiment of a sensing element structure including the touch panel of the present invention.

Figure 11 is a cross-sectional view showing the structure of the sensing element of the touch panel shown in Figure 10 along the tangential line 11-11'.

Figure 12 is a schematic view showing a modified embodiment of the sensing unit pattern of the present invention.

Please refer to FIG. 1 and FIG. 2 , wherein FIG. 1 is a top view of the first embodiment of the sensing element structure of the touch panel of the present invention, and FIG. 2 is a sensing diagram of the touch panel shown in FIG. 1 . A schematic cross-sectional view of the component structure along the tangent 2-2'. In Figures 1 and 2, the sensing element structure 110 has a first sensing series 128 in a single direction, for example comprising a plurality of first sensing series 128a, 128b, 128c, all along a first direction Y Extend the arrangement. Each of the first sensing series 128 includes a plurality of first sensing units 114 respectively adjacent to each other along the first direction Y, disposed on the first surface 112a of the first substrate 112, and each first The sensing unit 114 includes a first embossed structure 116 and a first conductive material 118, respectively. Each of the first embossed structures 116 includes an accommodating space 116a, and the first conductive material 118 is received in the accommodating space 116a of the first embossed structure 116. The first sensing series 128 further includes a plurality of first trenches 122 respectively disposed between any two adjacent sensing units 114 of the same first sensing series 128, such that any two adjacent ones The accommodating space 116a of the embossed structure 116 can communicate with each other through the first trenches 122; that is, the first embossed structures 116 have a semi-open shape and are connected to each other by the first trenches 122. The first conductive material 118 is disposed in the first trench 122, and thus, in the first conductive material 118 and the first trench 122 in each of the first sensing units 114 in the same first sensing series 128. The first conductive materials 118 are in fluid communication and electrically connected or electrically connected to each other. It should be noted that in FIG. 1 , although only three first sensing series 128a, 128b, 128c and three sensing units 114 are representatively represented, in fact, the first sensing element structure 110 The number of sensed series 128 and the number of first sensing units 114 and first trenches 122 included in each first sensing series 128 are not limited to those shown in FIG.

As can be seen from FIG. 2, the first embossed structure 116 is composed of the embossed material layer 120, wherein the embossed material layer 120 is disposed on the first surface 112a of the first substrate 112, and has a flat portion 120b and a protrusion. In the portion 120a, the adjacent convex portion 120a surrounds the flat portion 120b of the cup wall, forming an accommodating space 116a, and the accommodating space 116a is only in the first groove 122. The junction has an opening such that the first electrically conductive material 118 received therein can flow through the first first relief structure 116 via the first trench 122. In addition, the sensing element structure 110 further includes a first sealing layer 124 disposed on the surface of the embossing material layer 120, covering the surfaces of each of the first embossed structures 116 and the first trenches 122, and accommodating the space 116a with the first A first electrically conductive material 118 within the trench 122 is sealed in each of the first sensing series 128. In this embodiment, the first conductive material 118 may comprise any combination of conductive materials having transparent properties, such as comprising silver nanowires, nano metal particles or nano. The solution of the graphite material or the like, the combination of the above-mentioned conductive nano material and the solvent may have a transparent property or a high light transmittance through the human eye through a certain ratio or condition. The entire first conductive material 118 located in the first sensing series 128 can be made conductive by the nano silver wire, the nano metal particles or the nano graphite dispersed in the first conductive material 118. Each of the first sensing units 114 in the sensing series 128 is electrically connected to each other. For example, the depth H of the accommodating space 116a of the first embossed structure 116 of the present embodiment is about 15 to 30 micrometers, but not limited thereto; the first conductive material 118 in each of the first embossed structures 116 The filling space 116a may be completely filled or may not be completely filled. For example, the filling height of the first conductive material 118 in the accommodating space 116a may be less than or equal to about 1 micrometer, but not limited thereto.

The sensing element structure 110 of the touch panel of the present invention may further include a plurality of first wire structures 130 respectively disposed at one or both ends of each of the first sensing series 128. For example, FIG. 1 depicts the first The wire structures 130 are respectively disposed in a first sensing series 128 and are disposed on the lower side or the upper side of the first sensing series 128, that is, the upper side and the lower side of the first sensing series 128 are respectively connected. A first wire structure 130, wherein the first wire structure 130 is in contact with the first conductive material 118 of the corresponding first sensing series 128 to be electrically connected to the first sensing series 128. In other embodiments, one of the first sensing series 128 can be connected to a first wire structure 130 on only one side. The first wire structure 130 preferably comprises a metal material or a combination of conductive materials having transparent properties, such as silver, which can be formed on the first surface 112a of the first substrate 112 by screen printing, but not To this end, for example, the first wire structure 130 can also be fabricated using a yellow light process or an ink printing (Ink-jet printing) technique. In order to achieve contact between the first conductive structure 118 and the corresponding first conductive material 118 of the first sensing series 128, the thickness of the first conductive structure 130 is preferably greater than the height of the first embossed structure 116, for example, may be equal to or Greater than the sum of the height of the first relief structure 116 and the thickness of the first sealing layer 124. Furthermore, at the junction with the first sensing series 128, the first wire structure 130 may have a wide wire portion 130a having a width approximately the same as the width of the accommodating space 116a, and the wide wire portion 130a is embossed with the embossed material. The raised portions 120a of the layer 120 meet and surround the first conductive material 118. Each of the first wire structures 130 further includes a thin wire portion 130b respectively connected to the corresponding wide wire portion 130a, and the thin wire portion 130b can be electrically connected to other wires or signal reading elements of the outside to The signal sensed by a sensing unit 114 is transmitted. Therefore, in the sensing element structure 110 of the present invention, the portion in which the first sensing series 128 is disposed can be regarded as the signal sensing region 142 which is approximately the same as the region covered by the first sealing layer 124, and the first substrate The area that is not covered by the first sealing layer 124 can be considered as the peripheral line area 144, that is, the area in which the first wire structure 130 is disposed. The number and shape of the first wire structures 130 corresponding to the first sensing series 128 are not limited to the embodiment. For example, in other embodiments, one first sensing series 128 can simultaneously correspond to two A wire structure 130 is respectively located at both ends of the first sensing series 128.

Please refer to FIG. 3, which is a schematic diagram of a process for fabricating a sensing element structure in a roll-to-roll manner. The sensing element structure 110 of the present invention can be fabricated in a roll-to-roll manner. First, as in step 502, the first substrate 112 is provided, and then the embossed material layer 120 is formed on the first surface 112a of the first substrate 112 by, for example, coating or otherwise, and then embossed in the process step 504. The first embossed structure 116 and the first trenches 122 (not shown in FIG. 3) arranged in an array are embossed on the surface of the embossed material layer 120 by the embossing roller 132, and then, as shown in the process step 506, Forming a first conductive material 118 in the first embossed structure 116 between the first embossed structure 116 of the first sensing unit 114 and any two adjacent first sensing units 114 on the first substrate 112 to form The first sense train 128. Then, as in step 508, to A sealing layer 124 seals the first embossed structure 116 filled with the first conductive material 118 and the first trench 122, thereby completing the fabrication of the basic components of the sensing element structure 110 of the touch substrate of the present invention. It should be noted that when filling the first conductive material 118, the first conductive material 118 may be in a fluid state due to the inclusion of a solvent, and the first conductive material 118 may be baked before or after sealing to evaporate or cure the solvent. The first conductive material 118 is cured by, for example, heating or irradiating the first conductive material 118 with ultraviolet light. In different embodiments, the first conductive material 118 itself may also be a transparent fluid. After filling the first embossed structure 116, it is not evaporated or cured, and the first conductive material 118 is present in a fluid state on the embossed structure. 116 inside. Then, according to the required size of the touch panel, the entire first substrate 112 can be cut into a plurality of pieces by cutting or the like to form a plurality of sensing element structures 110. In addition, the first wire structure 130 may be formed on the surface of the first substrate 112 before or after the first substrate 112 is cut to be in contact with the corresponding first sensing series 128.

Please refer to FIG. 1 and FIG. 2 at the same time. In the process step 504, when the first embossed structure 116 and the first trench 122 are embossed on the surface of the embossed material layer 120 by the embossing roller 132, At the same time, a plurality of closed recesses 126 are formed on the first substrate 112 between the adjacent first sensing series 128, which are formed by the closed convex portion 120a and the flat portion 120b. In this embodiment, the concave portion is concave. No additional material needs to be filled in the pocket 126, but in the sealing process of the process step 508, the first sealing layer 124 will simultaneously seal the recess 126. It should be noted that the design of the sensing element structure 110 of the present invention between the first sensing series 128 is not limited to the above. For example, in other embodiments, the recess 126 may also be electrically conductive. The material, such as in process step 506, injects second conductive material 140 into recess 126, wherein first conductive material 118 and second conductive material 140 may be the same or different materials. The first conductive material 118 and the second conductive material 140 of the recess 126 and the accommodating space 116a are then simultaneously sealed in the process step 508. In still other embodiments, a transparent electrically non-conductive fluid or other material may be injected into the pocket 126 to seal against the pressure on both sides of the raised portion 120a. In still another embodiment, the embossing roller 132 having a embossing different from the first embodiment may be used to emboss the surface of the embossed material layer 120 with only the first embossed structure 116 and the first The trenches 122, but without the pattern of recesses 126, i.e., the embossed material layer 120 between adjacent first sensed series 128, are raised portions 120a.

The sensing element structure of the touch panel of the present invention is not limited to the above embodiment. Hereinafter, the sensing element structure of the touch panel of the other preferred embodiments of the present invention and a manufacturing method thereof will be sequentially described, and in order to facilitate comparison of the differences of the embodiments and simplify the description, the following embodiments are used. The same reference numerals are given to the same elements, and the differences between the embodiments are mainly described, and the repeated parts are not described again.

Please refer to FIG. 4 and FIG. 5 , FIG. 4 is a schematic top view of a second embodiment of a sensing element structure including the touch panel of the present invention, and FIG. 5 is a sensing of the touch panel shown in FIG. 4 . A schematic cross-sectional view of the component structure along the tangent 5-5'. If the sensing element structure 110 of the present invention shown in FIGS. 1 and 2 is used as the basic unit of the sensing element structure, in this embodiment, the sensing element structure 600 of the touch panel of the present invention may include two The basic units of the sensing element structures 110 are overlapped with each other in different directions to form sensing series extending in the Y direction and the X direction, respectively. For convenience of distinction, the following embodiments include a basic unit including a sensing element structure extending along a first direction Y, indicated by reference numeral 100, and a basic unit including a sensing element structure extending along a second direction X. Indicated by reference numeral 200, the same parts of the sensing element structure basic unit 100 as the first embodiment will not be described again. In this embodiment, the sensing element structure basic unit 100 is disposed on the first surface 112a' of the first substrate 112', and the structure of the sensing element structure basic unit 200 is similar to the sensing element structure basic unit 100. On the second surface 112b' of the first substrate 112', wherein the first surface 112a' and the second surface 112b' are disposed opposite to each other in parallel.

The sensing element structure base unit 200 includes a plurality of second sensing series 228 extending along the second direction X and arranged in parallel with each other, wherein the second direction X intersects the first direction Y, for example, the two are perpendicular to each other. Figure 4 is represented by three second sensing series 228a, 228b, 228c. Each of the second sensing series 228 includes a plurality of second sensing units 214 electrically connected to each other and adjacent to each other along the second direction X. Each of the second sensing units 214 includes a second embossed structure 216 and a second conductive material 218, wherein the second embossed structure 216 is formed by the embossed material layer 220, and the second conductive material 218 is disposed at the second The embossed structure 216 is within the accommodating space 216a. Each of the second sensing series 228 further includes a plurality of second trenches 222 disposed between adjacent two second sensing units 214 of the same second sensing series 228 such that the second embossed structures 216 The accommodation space 216a is in communication. As can be seen from FIGS. 4 and 5, the first sensing unit 114 and the second sensing unit 214 are offset from each other in a direction perpendicular to the first surface 112a of the first substrate 112' without overlapping, but A trench 122 and a second trench 222 are partially overlapped in a direction perpendicular to the first surface 112a'.

The sensing element structure base unit 200 further includes a second sealing layer 224 covering the surface of the second embossing structure 216 to seal the second conductive material 218 in the accommodating space 216a and the second trench 222. In addition, the sensing element structure base unit 200 may further include a plurality of second wire structures 230 respectively disposed at one end of each of the second sensing series 228 and the second conductive portion of the corresponding second sensing series 228. The material 218 is in contact to electrically connect to the second sensing series 228. In addition, the recess 226 between the second sensing series 228 may not be filled with any material, or may be filled with a transparent non-conductive material or a second conductive material 218, or may be made when the second embossed structure 216 is fabricated. No pockets 226 are formed between the two sensing trains 228.

Since the sensing element structure 600 of the present embodiment includes the first sensing series 128 and the second sensing series 228 that intersect each other perpendicularly and the corresponding first and second wire structures 130 and 230, the present invention senses The component structure 600 can also be regarded as a touch panel capable of providing a complete touch function, wherein the portion including the first sensing series 128 and the second sensing series 228 is regarded as the signal sensing area 610, and the first is set. Portions of the wire structure 130 and the second wire structure 230 are considered to be peripheral line regions 612. The touch position of the user can be calculated by the first sensing series 128 and the second sensing series 228 in the Y and X directions. In different embodiments, the two sides of the first sensing series 128 are respectively The two first wire structures 130 are connected to each other, and the two second wire structures 230 are respectively connected to the two sides of the second sensing line 228, for example, but not limited thereto. As can be seen from the above, the sensing element structure 600 of the present embodiment utilizes the sensing element structure basic units 100, 200 which are perpendicular to the opposite surfaces of the first substrate 112 to provide sensing functions in the X direction and the Y direction. Similar to the previous embodiment, the sensing element structure 600 can be fabricated by a roll-to-roll method. For example, the sensing element structure basic unit 100 is first fabricated on the first surface 112a' of the first substrate 112' by the process flow of FIG. The sensing element structure base unit 200 is then fabricated on the second surface 112b' of the first substrate 112' in a similar process, and then the first substrate 112' is cut to a desired size as needed.

Please refer to FIG. 6 and FIG. 7A. FIG. 6 is a top view of a third embodiment of a sensing element structure including the touch panel of the present invention, and FIG. 7A is a sensing of the touch panel shown in FIG. A schematic cross-sectional view of the component structure along the tangent 7-7'. The sensing element structure 700 of the present embodiment is different from the previous embodiment in that the sensing element structure basic unit 100 and the sensing element structure basic unit 200 are respectively fabricated on different substrates, for example, the sensing element structure basic unit 100 is firstly used. On the first surface 112a of the first substrate 112, the sensing element structure basic unit 200 is formed on the first surface 212a of the second substrate 212, and then the second substrate 212 is fixed to the first surface by an adhesive layer 136. The substrate 112 is opposite to the second surface 112b of the first surface 112a, wherein the first sensing series 128 and the second sensing series 228 respectively extend along the first direction Y and the second direction X perpendicular to each other, and The adhesive layer 136 is a transparent material and may comprise a transparent material such as a solid or liquid optical adhesive (OCA). Thereby, the touch panel constructed by the sensing element structure 700 of the third embodiment of the present invention is completed.

It should be noted that, although the second sensing series 228 in the embodiment is disposed on the first surface 212a of the first substrate 112 opposite to the second substrate 212, the sensing element structure base unit 100 and the first substrate are The relative positions of the 112 and the adhesive layer 136 and the relative positions of the sensing element structure base unit 200, the second substrate 212, and the adhesive layer 136 are not limited to those shown in FIG. 7, for example, When the sensing element structure base unit 100, 200 is fixed, the sensing element structure basic unit 200 or 100 may be turned upside down, for example, the second sensing series 228 is located between the second substrate 212 and the adhesive layer 136, or The first sensing series 128 is located between the first substrate 112 and the adhesive layer 136. Please refer to FIG. 7B , FIG. 7C and FIG. 7D , and FIG. 7B to FIG. 7D are respectively a first variation embodiment, a second variation embodiment and a third variation embodiment of the sensing element structure shown in FIG. 7A . Schematic diagram of the structure. As shown in FIG. 7B, the first variation embodiment is different from the third embodiment of the present invention shown in FIG. 7A in that the sensing element structure basic unit 200 is upside down, even if the second sensing series is The second embossed structure 216 and the second conductive material 218 are disposed between the second substrate 212 and the adhesive layer 136; the second variation shown in FIG. 7C differs from the seventh embodiment in that the sensing element has a basic structure. The unit 100 is placed upside down, even if the first embossed structure 116 and the first conductive material 118 are disposed between the first substrate 112 and the adhesive layer 136; and the third variation embodiment and the seventh embodiment shown in FIG. 7D The difference is that the sensing element structure basic units 100 and 200 are both upside down.

Please refer to FIG. 8 and FIG. 9 , FIG. 8 is a schematic top view of a fourth embodiment of a sensing element structure including the touch panel of the present invention, and FIG. 9 is a sensing element of the touch panel shown in FIG. 8 . A schematic cross-sectional view of the structure along the tangential line 9-9'. The difference between the sensing element structure 800 of the present embodiment and the third embodiment is that the second substrate 212 and the adhesive layer 136 in FIG. 7 are replaced by a protective layer 138 of a transparent material. Therefore, the process may include forming a flat protective layer 138 on the surface of the first sealing layer 124 after the sensing element structure basic unit 100 is formed on the first surface 112a of the first substrate 112", completely covering the sensing element. The surface and sides of the basic unit 100 are structured, and then the sensing element structure basic unit 200 is fabricated in a roll-to-roll manner, for example, on the surface of the protective layer 138 opposite to the sensing element structure base unit 100. Therefore, the first sensing series 128 and the second sensing series 228 of the embodiment are disposed on the first surface 112a'' of the first substrate 112'' sequentially from bottom to top.

Please refer to FIG. 10 and FIG. 11 , and FIG. 10 is a sensing method including the touch panel of the present invention. A top view of a fifth embodiment of the device structure, and FIG. 11 is a cross-sectional view of the sensing element structure of the touch panel shown in FIG. 10 along a tangential line 11-11'. The first sensing unit 114, the first trench 122, and the second sensing unit 214 of the sensing device structure 900 of the fifth embodiment of the present invention are directly fabricated on the first surface 112a"' of the first substrate 112"' The first sensing unit 114 and the second sensing unit 214 are misaligned with each other and arranged in a matrix. The embossed material layer 120 simultaneously constitutes the first embossed structure 116, the first trench 122, and the second embossed structure 216, and thus the first sensing series 128a, 128b, 128c have a structure similar to that of FIG. 1, but A second trench is not disposed between the adjacent second emboss structures 216, and thus the second conductive material 218 of each of the second sensing units 214 is sealed within each of the second emboss structures 216. The sensing element structure 900 of the present embodiment further includes a plurality of conductive bridging elements 240 disposed between any two adjacent sensing units 214 of the same second sensing series 228, as compared with the previous embodiments. The conductive bridging element 240 is in contact with the second conductive material 118 of the second sensing unit 214 through the through hole 242 of the first sealing layer 124 for electrically connecting the adjacent second sensing unit 214 so that The second sensing units 214 of the same second sensing series 228 are electrically connected to each other. Accordingly, each of the second sensing series 228 is comprised of a plurality of second sensing units 214 and a plurality of conductive bridging elements 240, and FIG. 10 is illustrated with three second sensing series 228a, 228b, 228c. It should be noted that although the second sensing series 228 is interleaved with the first sensing series 128 on the first surface 112a"' of the first substrate 112"', the conductive bridging element 240 is disposed across The first trench 122 is above, and thus is not electrically connected to the first sensing series 128. The conductive bridging element 240 is formed by performing a laser perforation or etching process to form a plurality of through holes 242 in the first sealing layer 124 after forming the first sealing layer 124, and then performing a screen printing process. The through hole 242 forms a conductive bridging element 240 with the surface of the first sealing layer 124. In addition, the sensing device structure 900 of the present embodiment may further include a protective layer 138 disposed on the surface of the first sealing layer 124 and the conductive bridging element 240, covering the second sensing series 228 and the first sensing series 128 to provide protection. .

It should be noted that the embossed structures of the present invention are not limited to the diamond shape disclosed in the foregoing embodiments. In order to increase the sensitivity of the lateral capacitance to improve the performance of the touch panel, various sensations may be added. The lateral projection area of the measuring unit, for example, complicates the pattern of each sensing unit to increase its circumference, thereby increasing the projected area of the lateral capacitance. Please refer to FIG. 12, which shows a schematic diagram of a variation of the sensing unit pattern. Compared with Fig. 1, each of the first embossed structures 116 of the modified embodiment shown in Fig. 12 has a snowflake-like pattern, which greatly increases the lateral projection area of the first sensing unit 114 due to the curved shape.

In summary, the sensing series in the sensing element structure of the touch panel of the present invention mainly uses a conductive material having transparent properties such as nano silver wire, nano metal particles or nano graphite material as electricity. The element is shaped and the embossed structure and the sealing layer are used to define the shape and position of each sensing series. Since the above conductive material has good transmittance and low color shifting characteristics, it can also provide a good electrical effect, so that high transmittance, low surface resistance and low color shift can be achieved, and the nano silver wire is contained. The cost of a transparent conductive material such as a nano metal particle or a nano graphite material is also lower than that of a conventional metal oxide material. Therefore, the present invention can reduce the manufacturing cost of the touch panel. Furthermore, since the design of the embossed structure can be applied to a flexible display panel, the structure of the present invention can also be applied to a flexible touch panel, thereby effectively avoiding the problem of brittle cracking due to high brittleness of indium tin oxide. In addition, the structure of the present invention can be fabricated by a roll-to-roll method, and the shape and density of the embossed structure can be adjusted as needed, and the sensing series can be continuously produced in a large amount, thereby avoiding the use of the yellow light process in the conventional structure, thereby effectively Production capacity and cost reduction. On the other hand, the wire structure of the peripheral circuit area can also be produced by a screen printing process, which has high flexibility adjustment and customary capability. For example, a wire structure can be respectively disposed on both sides or one side of each sensing series, and the same is One of the advantages of the invention.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

110‧‧‧Sensor component structure

112‧‧‧First substrate

112a‧‧‧ First surface of the first substrate

114‧‧‧First sensing unit

116‧‧‧First embossed structure

116a‧‧‧ accommodating space

118‧‧‧First conductive material

120‧‧‧ embossed material layer

122‧‧‧First trench

124‧‧‧First sealing layer

126‧‧‧ recess

128, 128a, 128b, 128c‧‧‧ first sensing series

130‧‧‧First wire structure

130a‧‧ Wide wire section

130b‧‧‧fine wire section

140‧‧‧Second conductive material

142‧‧‧Signal Sensing Area

144‧‧‧ Peripheral area

Claims (19)

The sensing component structure of the touch panel includes: a plurality of first sensing series disposed on a first surface of a first substrate along a first direction, each of the first sensing series comprising: The plurality of first sensing units are adjacent to each other along the first direction, wherein each of the first sensing units comprises: a first embossment structure having an accommodating space; and a first conductive material And accommodating the accommodating space of the first embossed structure; the plurality of first trenches are respectively disposed between the first sensing units adjacent to any two of the first sensing series The accommodating spaces of the first embossed structures adjacent to each other are communicated by the first trenches, and the first conductive material is further disposed in the first trenches to The first sensing units are electrically connected to each other; the plurality of second sensing series are respectively disposed along a second direction, wherein the second direction intersects the first direction, and each of the second sensing strings The column includes a plurality of second sensing units electrically connected to each other, adjacent to each other along the second direction, Each of the second sensing units includes: a second embossed structure having an accommodating space; and a second conductive material received in the accommodating space of the second embossed structure; and a plurality of The second wire structure is respectively located at one end of each of the second sensing series, and is in contact with the second conductive material in the second sensing series to electrically connect the second sensing series. The sensing element structure of claim 1, further comprising a first sealing layer covering the surface of the first embossed structures. The sensing element structure of claim 1, wherein the first conductive material comprises a silver nanowire, a nano metal particle or a nano graphite material. The sensing element structure of claim 1, further comprising a plurality of first wire structures respectively located at one end of each of the first sensing series, and the first conductive material of the first sensing series The contacts are electrically connected to the first sensing series. The sensing element structure of claim 1, wherein each of the second sensing series further comprises a plurality of second trenches disposed on any two of the second sensing series adjacent to the second Between the embossed structures, the accommodating spaces of the second embossed structures are in communication, and the second conductive materials are further disposed in the second trenches. The sensing element structure of claim 5, wherein the second sensing series is disposed on a second surface of the first substrate, wherein the second surface of the first substrate and the first surface system Relative settings. The sensing element structure of claim 5, further comprising: a second substrate disposed on the first substrate opposite to the second surface of the first surface, and the second sensing series is disposed on The second substrate; and an adhesive layer disposed between the first substrate and the second substrate. The sensing element structure of claim 5, wherein the first sensing series and the second sensing series are sequentially disposed from bottom to top on the first surface of the first substrate . The sensing element structure of claim 8, further comprising a protective layer disposed on the first sensing series, and the second sensing series is disposed on a surface of the protective layer. The sensing element structure of claim 1, further comprising a plurality of conductive bridging elements disposed between the second sensing units adjacent to any two of the second sensing series for electrically connecting Adjacent to the second sensing units, such that the second sensing units of the same second sensing series are electrically connected to each other A sexual connection, wherein each of the conductive bridging elements is not connected to the first sensing series. The sensing element structure of claim 10, wherein the second sensing series are interleaved with the first sensing series on the first surface of the first substrate. The sensing element structure of claim 11, further comprising a protective layer covering the second sensing series and the first sensing series. The sensing element structure of claim 1, further comprising a second sealing layer covering the surface of the second sensing series. A method for fabricating a sensing component of a touch panel includes: providing a first substrate having a first surface; forming a plurality of first embossed structures and a plurality of first trenches on the first surface, wherein The first embossed structures are arranged in an array and each have an accommodating space, and each of the first trenches is disposed between the first embossed structures adjacently arranged along a first direction to communicate The first embossed structures; the first accommodating spaces of the first embossed structures and the first trenches are filled with a first conductive material; and a seal is formed on the surfaces of the first embossed structures a layer, the first conductive material is sealed in the first accommodating space and the first trenches; and a plurality of second embossed structures are formed on the first surface, wherein the second embossed structures are in an array Aligning and respectively having an accommodating space; filling the second conductive material in the accommodating spaces of the second embossed structures; forming a plurality of through holes in the sealing layer; and performing a screen printing process to Forming a plurality of bridging elements on the sealing layer, wherein each Meet The components are disposed between the second embossed structures adjacently arranged along a second direction, and electrically connected to the second conductive material in the second embossed structures by the through holes respectively And wherein the second direction intersects the first direction. The method of fabricating the sensing element structure of claim 14, wherein the step of forming the first embossed structure, filling the first conductive material, and sealing the first conductive material utilizes a roll-to-roll (roll- To-roll) The process is completed. The method for fabricating the sensing device structure of claim 14, further comprising forming a plurality of first wire structures on the first surface of the first substrate to electrically connect the first embossed structures, respectively. The first conductive material within one. The method of fabricating the sensing element structure of claim 16, wherein the forming the first wire structure comprises performing a screen printing process. The method of fabricating the sensing element structure of claim 14, wherein the first conductive material comprises nano silver wire, nano metal particles or nano graphite material. The method of fabricating the sensing device structure of claim 14, wherein the step of filling the first accommodating space of the first embossed structure with the first conductive material comprises: The first accommodating spaces of the first embossed structures and the first conductive material filled with the fluid state in the first trenches; and the first conductive material in the fluid state are subjected to a curing process.