TWI474925B - Resin sealing sheet and solar cell module - Google Patents

Resin sealing sheet and solar cell module Download PDF

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TWI474925B
TWI474925B TW100130458A TW100130458A TWI474925B TW I474925 B TWI474925 B TW I474925B TW 100130458 A TW100130458 A TW 100130458A TW 100130458 A TW100130458 A TW 100130458A TW I474925 B TWI474925 B TW I474925B
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resin
sealing sheet
resin sealing
mass
copolymer
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TW201309475A (en
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Mitsuyoshi Itada
Masahiko Kawashima
Satoshi Matsunaga
Eri Yamamoto
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Asahi Kasei E Materials Corp
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Description

樹脂密封片及太陽能電池模組Resin sealing sheet and solar battery module

本發明係關於樹脂密封片及使用該樹脂密封片之太陽能電池模組。The present invention relates to a resin sealing sheet and a solar battery module using the same.

近年來因全球暖化現象使得環保意識提高,而不產生二氧化碳氣體等溫室氣體之新能源系統受到關注。藉由太陽能電池發電之能源不會產生二氧化碳氣體等。因此作為綠色能源而備受矚目,而進行產業用及家庭用能源之研究開發。In recent years, new energy systems that raise environmental awareness due to global warming and do not generate greenhouse gases such as carbon dioxide have attracted attention. The energy generated by solar cells does not generate carbon dioxide gas or the like. Therefore, it is attracting attention as a green energy source, and research and development of industrial and household energy are carried out.

太陽能電池的代表例可例舉:使用單晶、多晶矽電池(結晶系矽電池)者,使用非晶矽(amorphous silicon)、化合物半導體者(薄膜系電池)等。太陽能電池多長時間在屋外曝於風雨下使用,將發電部分以玻璃板及背板(back sheet)等貼合而模組化,而防止水份由外部侵入,藉此以圖保護發電部分及防止漏電等。Representative examples of the solar cell include those using a single crystal or a polycrystalline germanium battery (crystalline silicon battery), and an amorphous silicon or a compound semiconductor (thin film battery). How long does the solar cell be exposed to the wind and rain outside the house, and the power generation part is laminated with a glass plate and a back sheet to form a module, and the water is prevented from intruding from the outside, thereby protecting the power generation portion and Prevent leakage and so on.

保護發電部分之構件係為了確保發電所需的光穿透,而在光入射側之構件中使用透明玻璃及透明樹脂。在相反側(背側)的構件使用稱為背板之鋁箔、聚氟乙烯樹脂(PVF)、聚對苯二甲酸乙二酯(PET)及二氧化矽等經障壁塗膜(barrier coat)加工之積層片。接著以樹脂密封片夾住發電元件,復以玻璃及背板覆蓋於外部,且藉由實施熱處理以熔融樹脂密封片,使整體一體化密封(模組化)。The member for protecting the power generation portion is a transparent glass and a transparent resin for the member on the light incident side in order to ensure light penetration required for power generation. The member on the opposite side (back side) is processed by a barrier coat such as aluminum foil, polyvinyl fluoride resin (PVF), polyethylene terephthalate (PET), and cerium oxide called a back sheet. Layered sheets. Then, the power-generating element is sandwiched by the resin sealing sheet, and the glass and the back sheet are covered with the outer surface, and the resin sealing sheet is melted by performing heat treatment to integrally seal (modulate) the whole.

上述樹脂密封片係要求以下(1)至(3)之特性。即(1)與玻璃、發電元件、背板之接著性良好、(2)防止在高溫狀態中,樹脂密封片熔融造成發電元件流動之性質(耐潛變性(creep resistance))、(3)不阻礙太陽光入射之透明性。The above resin sealing sheet requires the following characteristics (1) to (3). That is, (1) good adhesion to glass, power generation element, and back sheet, and (2) prevention of melting of the resin sealing sheet in the high temperature state, causing the power generation element to flow (creep resistance), (3) not Blocks the transparency of sunlight incident.

由此等觀點來看,樹脂密封片係於乙烯-醋酸乙烯酯共聚物(EVA)中調合對抗紫外線劣化之紫外線吸收劑、用以提升與玻璃之接著性之偶合劑(coupling agent)、交聯用之有機過氧化物等添加劑,且藉由壓延機(calender)成形及T模頭鑄型(T-die cast)而製膜。此外,鑒於需長時間曝曬於太陽光下,為謀求防止因樹脂劣化而造成光學特性降低,而調合耐光劑等各種添加劑。From such a viewpoint, the resin sealing sheet is blended with an ultraviolet absorber which is resistant to ultraviolet rays in an ethylene-vinyl acetate copolymer (EVA), a coupling agent for improving adhesion to glass, and cross-linking. An additive such as an organic peroxide is used, and a film is formed by calender molding and T-die casting. In addition, in view of the need to expose to sunlight for a long period of time, various additives such as a light stabilizer are blended in order to prevent deterioration of optical characteristics due to deterioration of the resin.

如上述以樹脂密封片而將太陽能電池模組化之方法,可舉出使用專用之太陽能電池真空積層機(vacuum laminator)等之方法。具體來說可舉出以下方法:以玻璃/樹脂密封片/結晶系矽電池等發電元件/樹脂密封片/背板之順序疊合,經過以樹脂熔融溫度以上(EVA之情形係150℃左右之溫度條件)的溫度預熱之步驟及壓機(press)步驟,而將樹脂密封片熔融而貼合。As a method of molding a solar cell with a resin sealing sheet as described above, a method using a dedicated solar cell vacuum laminator or the like can be mentioned. Specifically, a method in which a power generating element such as a glass/resin sealing sheet/crystalline enamel battery/resin sealing sheet/backing plate is laminated in the order of resin melting temperature or higher (in the case of EVA, about 150° C.) The temperature preheating step and the press step are performed, and the resin sealing sheet is melted and bonded.

上述方法中,首先於預熱步驟將樹脂密封片之樹脂熔融,且於壓機步驟將接觸熔融樹脂之構件與熔融樹脂密合,且經真空積層。此積層步驟中,(i)將樹脂密封片所含有之交聯劑(例如有機過氧化物)熱分解且促進EVA之交聯後,(ii)使其與樹脂密封片所含之偶合劑接觸之構件共價鍵結。藉此而實現提升彼此之接著性,且防止在高溫狀態中,因樹脂密封片熔融而造成之發電元件流動(耐潛變性),玻璃、發電元件及背板之優異接著性。In the above method, the resin of the resin sealing sheet is first melted in the preheating step, and the member in contact with the molten resin is adhered to the molten resin in a press step, and laminated by vacuum. In the laminating step, (i) thermally decomposing a crosslinking agent (for example, an organic peroxide) contained in the resin sealing sheet and promoting crosslinking of the EVA, (ii) contacting the coupling agent contained in the resin sealing sheet. The components are covalently bonded. Thereby, the adhesion between the two is improved, and the power generation element is prevented from flowing (durability resistance) due to melting of the resin sealing sheet in a high temperature state, and the glass, the power generating element, and the back sheet are excellent in adhesion.

專利文獻1中揭示一種太陽能電池密封用薄片,其由乙烯系共聚物樹脂所製成且輻射線交聯至一定程度之膠化率(gel fraction)。此外,專利文獻2中揭示一種太陽能電池密封用薄片,其由調合矽烷偶合劑之乙烯系共聚物樹脂所製成。Patent Document 1 discloses a sheet for solar cell encapsulation which is made of a vinyl-based copolymer resin and which is crosslinked by radiation to a certain degree of gel fraction. Further, Patent Document 2 discloses a sheet for solar cell encapsulation which is made of a vinyl-based copolymer resin in which a decane coupling agent is blended.

[先前技術文獻][Previous Technical Literature]

[專利文獻][Patent Literature]

[專利文獻1]日本特開2010-031232號公報[Patent Document 1] Japanese Patent Laid-Open Publication No. 2010-031232

[專利文獻2]日本特開2005-019975號公報[Patent Document 2] Japanese Patent Laid-Open Publication No. 2005-019975

但是,因為近年要求太陽能電池模組電力之高輸出化,而藉由加厚連接結晶系矽電池等發電元件之連接線(tab wire)等金屬連結線以減少電力損失,而以對應此減少電力損失模組的要求之觀點來看,有關於樹脂密封片於凹凸大之發電元件間隙之填覆性尚有改善的餘地。以往為了提升上述之耐潛變性而進行將樹脂密封片膠化(gelling)等,但若進行膠化,則會有在太陽能電池模組化時熱流動性變差,以及模組化後伴隨膠化而產生裂解氣之問題。因此無法得到充分之間隙填覆性。在具有用厚金屬線連結的凹凸大之發電元件的太陽能電池之情形,此問題更為顯著。However, in recent years, it is required to increase the power output of the solar cell module, and to reduce the power loss by thickening a metal connecting wire such as a tab wire connecting power generating elements such as a crystallization battery, and to reduce the power. From the viewpoint of the requirements of the loss module, there is room for improvement in the filling property of the resin sealing sheet in the gap of the power generating element having a large unevenness. In the past, in order to improve the above-mentioned resistance to latent deformation, the resin sealing sheet is gelled, etc., but if gelled, the thermal fluidity deteriorates when the solar cell is modularized, and the gel is accompanied by the module. The problem of cracking gas is generated. Therefore, sufficient gap filling property cannot be obtained. This problem is more remarkable in the case of a solar cell having a large-concave power generating element connected by a thick metal wire.

從發電效率的觀點來看,太陽能電池密封材較佳為無色透明者,而交聯構造及膠化率會對其造成影響。因以往交聯構造及膠化率主要係為了改善間隙填覆性及耐潛變性而設計,故事實上對於透明性及色差的安定性並無充分檢討。From the viewpoint of power generation efficiency, the solar cell sealing material is preferably colorless and transparent, and the crosslinked structure and gelation rate may affect it. Since the cross-linking structure and the gelation rate are mainly designed to improve the gap filling property and the latent denaturation resistance, the stability of transparency and chromatic aberration has not been fully reviewed.

本發明係鑑於上述情事而研究者,主要目的係提供間隙填覆性與耐潛變性優異,且透明性與色差的安定性優異之樹脂密封片。The present invention has been made in view of the above circumstances, and a main object of the present invention is to provide a resin sealing sheet which is excellent in gap-filling property and latent resistance, and which is excellent in transparency and chromatic aberration stability.

本發明者們為解決上述問題而銳意研究之結果,發現以含有特定密度的聚乙烯系樹脂且不含交聯劑,且控制特定物性之樹脂密封片,可實現間隙填覆性與耐潛變性優異,且透明性與色差的安定性優異之樹脂密封片。As a result of intensive research to solve the above problems, the present inventors have found that a resin sealing sheet containing a polyethylene resin having a specific density and containing no crosslinking agent and controlling specific physical properties can achieve gap filling property and resistance to latent denaturation. A resin sealing sheet which is excellent in transparency and excellent in stability of chromatic aberration.

即本發明係如以下所述:That is, the present invention is as follows:

[1].一種樹脂密封片,其含有密度0.860至0.910g/cm3 之聚乙烯系樹脂,且不含交聯劑,在150℃之溫度下懸掛時收縮率為0至25%,且膠化率為0質量%以上且未滿1質量%。[1] A resin sealing sheet comprising a polyethylene resin having a density of 0.860 to 0.910 g/cm 3 and containing no crosslinking agent, and having a shrinkage ratio of 0 to 25% when suspended at a temperature of 150 ° C, and a glue The chemical conversion rate is 0% by mass or more and less than 1% by mass.

[2].一種樹脂密封片,其含有密度0.860至0.910g/cm3 之聚乙烯系樹脂,且不含交聯劑,慕尼黏度(Mooney viscosity)為70至90M。[2] A resin sealing sheet comprising a polyethylene-based resin having a density of 0.860 to 0.910 g/cm 3 and containing no crosslinking agent, and a Mooney viscosity of 70 to 90 M.

[3].一種樹脂密封片,其含有密度0.860至0.910g/cm3 之聚乙烯系樹脂,且不含交聯劑,且滿足下述(1)及(2)之條件[3] A resin sealing sheet comprising a polyethylene resin having a density of 0.860 to 0.910 g/cm 3 and containing no crosslinking agent, and satisfying the conditions (1) and (2) below.

(1)藉由測定150至250℃之熔融黏彈性而算出之活化能(activation energy)為75至90kJ/mol。(1) The activation energy calculated by measuring the melt viscoelasticity of 150 to 250 ° C is 75 to 90 kJ/mol.

(2) 於150℃下,以1rad/秒所測定之儲存模數(G’)為6,000至12,000Pa。(2) The storage modulus (G') measured at 1 rad/sec at 150 ° C was 6,000 to 12,000 Pa.

[4]. 如[1]至[3]任一項所述之樹脂密封片,其係經施加有交聯處理。[4] The resin sealing sheet according to any one of [1] to [3] which is subjected to a crosslinking treatment.

[5]. 如[4]所述之樹脂密封片,其中,前述交聯處理係以照射電離輻射線而實施。[5] The resin sealing sheet according to [4], wherein the crosslinking treatment is performed by irradiating ionizing radiation.

[6]. 如[5]所述之樹脂密封片,其中,前述照射電離輻射線之電離輻射線照射量係30kGy以上60kGy以下。[6] The resin sealing sheet according to [5], wherein the ionizing radiation irradiation amount of the irradiated ionizing radiation is 30 kGy or more and 60 kGy or less.

[7]. 一種太陽能電池模組,其具有:透光性絕緣基板、相對向於前述透光性絕緣基板而配置之背面絕緣基板、配置於前述透光性絕緣基板與前述背面絕緣基板間之發電元件、及密封前述發電元件之[1]至[6]任一項所述之樹脂密封片。[7] A solar cell module comprising: a translucent insulating substrate; a back insulating substrate disposed opposite to the translucent insulating substrate; and disposed between the translucent insulating substrate and the back insulating substrate A power-generating element, and a resin sealing sheet according to any one of [1] to [6], wherein the power generating element is sealed.

[8]. 如[7]所述之太陽能電池模組,其中,前述太陽能電池模組所含之前述樹脂密封片之膠化率為0質量%以上且未滿1質量%。[8] The solar cell module according to the above [7], wherein the resin sealing sheet contained in the solar cell module has a gelation ratio of 0% by mass or more and less than 1% by mass.

[9]. 一種樹脂密封片之製造方法,其具有以30kGy以上60kGy以下之電離輻射線照射薄片之步驟,此薄片含有密度0.860至0.910g/cm3 之聚乙烯系樹脂,且不含交聯劑。[9]. A method of producing a resin sealing sheet, comprising the step of irradiating a sheet with ionizing radiation of 30 kGy or more and 60 kGy or less, the sheet containing a polyethylene resin having a density of 0.860 to 0.910 g/cm 3 and containing no crosslinking Agent.

根據本發明可提供間隙填覆性與耐潛變性優異,且透明性與色差的安定性優異之樹脂密封片。According to the present invention, it is possible to provide a resin sealing sheet which is excellent in gap filling property and latent resistance, and excellent in transparency and chromatic aberration stability.

以下詳細說明實施本發明之型態(以下簡稱為「本實施型態」)。以下本實施型態係為了說明本發明而例示,但並不代表本發明受限於以下內容。本發明可於其要旨之範圍內適宜變化而實施。此外,圖式中,上下左右之位置關係只要無特別註明,即依據圖式所示之位置關係。並且圖式之尺寸比例並不受限於圖示之比例。Hereinafter, the mode for carrying out the invention (hereinafter simply referred to as "this embodiment") will be described in detail. The following embodiments are illustrative for the purpose of illustrating the invention, but are not intended to limit the invention. The present invention can be carried out with appropriate modifications within the scope of the gist of the invention. In addition, in the drawings, the positional relationship of the up, down, left, and right directions is based on the positional relationship shown in the drawing unless otherwise specified. And the dimensional ratio of the drawings is not limited to the ratios shown in the drawings.

<樹脂密封片><Resin sealing sheet>

本實施型態之樹脂密封片之第一型態係含有密度0.860至0.910g/cm3 之聚乙烯系樹脂,且不含交聯劑,在150℃溫度下懸掛時收縮率(以下稱為「懸掛收縮率」)為0至25%,且膠化率為0質量%以上且未滿1質量%之樹脂密封片。The first type of the resin sealing sheet of the present embodiment contains a polyethylene resin having a density of 0.860 to 0.910 g/cm 3 and does not contain a crosslinking agent, and shrinkage at a temperature of 150 ° C (hereinafter referred to as " The resin sealing sheet having a suspension shrinkage ratio of 0 to 25% and a gelation ratio of 0% by mass or more and less than 1% by mass.

在150℃之溫度下懸掛薄片時之收縮率(以下稱為「懸掛收縮率」)之下限值為0%以上即可,較佳為1%以上。懸掛收縮率之上限值為25%以下即可,較佳為15%以下。懸掛收縮率可藉由後述實施例所記載之方法測定。The lower limit of the shrinkage ratio (hereinafter referred to as "suspension shrinkage ratio") when the sheet is suspended at a temperature of 150 ° C is 0% or more, preferably 1% or more. The upper limit of the suspension shrinkage ratio may be 25% or less, preferably 15% or less. The suspension shrinkage ratio can be measured by the method described in the examples below.

此外,由熱鬆弛(thermal relaxation)而造成之分子運動,使得樹脂密封片中之殘留應力釋出,而產生懸吊所致之收縮。因此,可藉由調整後面詳述之聚乙烯系樹脂等的樹脂成分之分子量與分支構造(交聯密度等),而控制懸掛收縮率。分支構造的分支程度高且由熱鬆弛而造成之分子運動受到抑制時,例如若藉由高電離輻射線照射量之電離輻射線照射分子量高之聚乙烯系樹脂而進行交聯處理,可降低懸掛收縮率。相反的,分支構造的分支程度低且由熱鬆弛而造成之分子運動難以抑制時,例如若藉由低電離輻射線量之電離輻射線照射分子量低之聚乙烯系樹脂而進行交聯處理,可提高懸掛收縮率。In addition, the molecular motion caused by thermal relaxation causes the residual stress in the resin sealing sheet to be released, resulting in shrinkage due to suspension. Therefore, the suspension shrinkage ratio can be controlled by adjusting the molecular weight of the resin component such as the polyethylene resin and the branched structure (crosslinking density). When the degree of branching of the branched structure is high and the molecular motion caused by thermal relaxation is suppressed, for example, if the polyethylene resin having a high molecular weight is irradiated by the ionizing radiation having a high ionizing radiation irradiation amount, the crosslinking treatment can be performed, thereby reducing the suspension. Shrinkage. On the other hand, when the degree of branching of the branched structure is low and the molecular motion caused by thermal relaxation is difficult to suppress, for example, if the polyethylene resin having a low molecular weight is irradiated by the ionizing radiation having a low ionizing radiation amount, the crosslinking treatment can be improved. Suspension shrinkage rate.

本實施型態之樹脂密封片係施以膠化率0質量%以上且未滿1質量%之交聯處理。以耐潛變性的觀點來看,膠化率的下限值為0質量%以上即可,較佳為0.2質量%以上。以間隙填覆性,尤其是填覆以厚金屬連結線連結的凹凸大之發電元件間隙的觀點來看,膠化率的上限值為未滿1質量%即可,較佳為0.8質量%以下。膠化率可藉由後述實施例所記載之方法測定。The resin sealing sheet of the present embodiment is subjected to a crosslinking treatment in which the gelation ratio is 0% by mass or more and less than 1% by mass. The lower limit of the gelation ratio may be 0% by mass or more, and preferably 0.2% by mass or more, from the viewpoint of resistance to latent denaturation. The upper limit of the gelation ratio may be less than 1% by mass, and preferably 0.8% by mass, from the viewpoint of the gap filling property, in particular, the filling of the gap between the power generating elements having large irregularities connected by the thick metal connecting wires. the following. The gelation rate can be measured by the method described in the examples below.

此外,可藉由調整後面詳述之聚乙烯系樹脂等的樹脂成分之分子量與分支構造(交聯密度等),而控制膠化率。例如若藉由高電離輻射線照射量之電離輻射線照射分子量高之聚乙烯系樹脂而進行交聯處理,可提高膠化率。相反的,若藉由低電離輻射線量之電離輻射線照射分子量低之聚乙烯系樹脂而進行交聯處理,可降低膠化率。In addition, the gelation ratio can be controlled by adjusting the molecular weight of the resin component such as the polyethylene resin and the branched structure (crosslinking density, etc.) which will be described later. For example, if a polyethylene resin having a high molecular weight is irradiated by ionizing radiation having a high ionizing radiation irradiation amount and cross-linking treatment is performed, the gelation rate can be increased. On the other hand, if the polyethylene resin having a low molecular weight is irradiated by ionizing radiation having a low ionizing radiation amount to carry out a crosslinking treatment, the gelation rate can be lowered.

本實施型態之樹脂密封片之第二型態係含有密度0.860至0.910g/cm3 之聚乙烯系樹脂,且不含交聯劑,慕尼黏度為70至90M之樹脂密封片。此樹脂密封片之慕尼黏度為70至90M即可,較佳為75至85M,更佳為78至82M。慕尼黏度係高溫流動時的黏度,可作為依據樹脂的交聯構造之分子運動之容易度的指標。藉由使慕尼黏度為70M以上,則可抑制流動性且提升耐潛變性,藉由使其在90M以下,則可提升間隙埋覆性。The second form of the resin sealing sheet of the present embodiment contains a polyethylene resin having a density of 0.860 to 0.910 g/cm 3 and a resin sealing sheet having a crosslinking agent and a Mui viscosity of 70 to 90 M. The resin sealing sheet may have a Mui viscosity of 70 to 90 M, preferably 75 to 85 M, more preferably 78 to 82 M. The viscosity of the Mooney viscosity at high temperature can be used as an index of the ease of molecular motion in accordance with the crosslinked structure of the resin. When the Mooney viscosity is 70 M or more, the fluidity can be suppressed and the creep resistance can be improved, and when it is 90 M or less, the gap embedding property can be improved.

此外,可藉由調整後面詳述之聚乙烯系樹脂等的樹脂成分之分子量與分支構造(交聯密度等),而控制慕尼黏度。例如若藉由高電離輻射線量之電離輻射線照射分子量高之聚乙烯系樹脂而進行交聯處理,可提高慕尼黏度。相反的,若藉由低電離輻射線量之電離輻射線照射分子量低之聚乙烯系樹脂而進行交聯處理,可降低慕尼黏度。In addition, the Mooney viscosity can be controlled by adjusting the molecular weight of the resin component such as a polyethylene resin and the branched structure (crosslinking density, etc.) which will be described later. For example, if the polyethylene resin having a high molecular weight is irradiated by ionizing radiation having a high ionizing radiation amount to carry out a crosslinking treatment, the Mooney viscosity can be improved. Conversely, if the polyethylene resin having a low molecular weight is irradiated by ionizing radiation having a low ionizing radiation amount to carry out a crosslinking treatment, the Mooney viscosity can be lowered.

本實施型態之樹脂密封片之第三型態係含有密度0.860至0.910g/cm3 之聚乙烯系樹脂,且不含交聯劑,且滿足下述(1)及(2)之條件的樹脂密封片。The third type of the resin sealing sheet of the present embodiment contains a polyethylene resin having a density of 0.860 to 0.910 g/cm 3 and does not contain a crosslinking agent, and satisfies the conditions of the following (1) and (2). Resin sealing sheet.

(1) 藉由測定150至250℃之熔融黏彈性而算出之活化能(activation energy)為75至90kJ/mol。(1) The activation energy calculated by measuring the melt viscoelasticity of 150 to 250 ° C is 75 to 90 kJ/mol.

(2) 於150℃下,以1rad/秒所測定之儲存模數(G’)為6,000至12,000Pa。(2) The storage modulus (G') measured at 1 rad/sec at 150 ° C was 6,000 to 12,000 Pa.

活化能及儲存模數(G’),係可作為依據樹脂的交聯構造之分子運動容易度的指標,而此樹脂的交聯構造的樹脂膠化率僅有極小差別。藉由使活化能為75kJ/mol以上,則可抑制流動性並再提升耐潛變性,藉由使活化能為90kJ/mol以上,則可再提升間隙填覆性。接著,藉由使活化能及儲存模數(G’)兩者在上述範圍中,則可再提升耐潛變性與間隙填覆性之平衡性。The activation energy and the storage modulus (G') can be used as an index of the ease of molecular motion in accordance with the crosslinked structure of the resin, and the resin gelation ratio of the crosslinked structure of the resin is only slightly different. When the activation energy is 75 kJ/mol or more, the fluidity can be suppressed and the latent denaturation resistance can be further enhanced, and by setting the activation energy to 90 kJ/mol or more, the gap filling property can be further improved. Then, by making both the activation energy and the storage modulus (G') in the above range, the balance between the latent resistance and the gap filling property can be further improved.

第三型態中,活化能可為75至90kJ/mol,更佳為78至88kJ/mol,又更佳為80至85kJ/mol。儲存模數(G’)可為6,000至12,000Pa,又更佳為7,000至10,000Pa。In the third form, the activation energy may be from 75 to 90 kJ/mol, more preferably from 78 to 88 kJ/mol, still more preferably from 80 to 85 kJ/mol. The storage modulus (G') may be 6,000 to 12,000 Pa, and more preferably 7,000 to 10,000 Pa.

此外,活化能會受高分子鏈的分子運動的容易度影響。因此,可藉由調整後面詳述之聚乙烯系樹脂等的樹脂成分之分子量與分支構造(交聯密度等),而控制活化能。例如若藉由高電子射線照射量之電離輻射線照射分子量高之聚乙烯系樹脂而進行交聯處理,可提高活化能。相反的,若藉由低電子射線照射量之電離輻射線照射分子量低之聚乙烯系樹脂而進行交聯處理,可降低活化能。In addition, the activation energy is affected by the ease of molecular motion of the polymer chain. Therefore, the activation energy can be controlled by adjusting the molecular weight of the resin component such as the polyethylene resin and the branched structure (crosslinking density, etc.) which will be described later. For example, when a polyethylene-based resin having a high molecular weight is irradiated by ionizing radiation having a high electron beam irradiation amount and subjected to a crosslinking treatment, the activation energy can be improved. On the other hand, if the polyethylene resin having a low molecular weight is irradiated by ionizing radiation having a low electron beam irradiation amount to carry out a crosslinking treatment, the activation energy can be lowered.

此外,儲存模數(G’)會受高分子鏈的分子運動的容易度影響。因此,可藉由調整後面詳述之聚乙烯系樹脂等的樹脂成分之分子量與分支構造(交聯密度等),而控制儲存模數(G’)。例如若藉由高電子射線照射量之電離輻射線照射分子量高之聚乙烯系樹脂而進行交聯處理,可提高儲存模數(G’)。相反的,若藉由低電子射線照射量之電離輻射線照射分子量低之聚乙烯系樹脂而進行交聯處理,可降低儲存模數(G’)。In addition, the storage modulus (G') is affected by the ease of molecular motion of the polymer chain. Therefore, the storage modulus (G') can be controlled by adjusting the molecular weight of the resin component such as the polyethylene resin and the branched structure (crosslinking density). For example, when a polyethylene resin having a high molecular weight is irradiated by ionizing radiation having a high electron beam irradiation amount to carry out a crosslinking treatment, the storage modulus (G') can be improved. On the other hand, if the polyethylene resin having a low molecular weight is irradiated by the ionizing radiation having a low electron beam irradiation amount and the crosslinking treatment is carried out, the storage modulus (G') can be lowered.

縱使樹脂密封片具有後述單層構造或多層構造之任一構造,除非特別註明,否則上述之懸掛收縮率、膠化率、慕尼黏度、活化能及儲存模數(G’)等各物性值皆代表樹脂密封片整體平均值。可藉由上述物性值在上述範圍中,使樹脂密封片具有以下性能:沒有間隙地密封發電元件及配線等被密封物之間的高低差之性能(間隙填覆性)與耐潛變性優異,且透明性與色差安定性亦優異。Even if the resin sealing sheet has any one of a single layer structure or a multilayer structure which will be described later, unless otherwise specified, the above-mentioned suspension shrinkage ratio, gelation ratio, Mooney viscosity, activation energy, and storage modulus (G') are various physical properties. Both represent the overall average of the resin sealing sheets. In the above-described range, the resin sealing sheet has the following properties: the performance (gap-filling property) and the resistance to latent denaturation which are excellent in sealing the gap between the power-generating element and the sealed object such as the wiring without gaps. And transparency and color stability are also excellent.

接著,藉由滿足上述第一型態、第二型態及第三型態所說明有關各物性的條件而可發揮更優異的效果。例如藉由使其為以下所示之構成而可發揮更優異的效果。Then, by satisfying the conditions of the respective physical properties by satisfying the first type, the second type, and the third type, it is possible to exhibit more excellent effects. For example, it is possible to exhibit a more excellent effect by the configuration shown below.

例如將第一型態與第二型態組合者,可舉出滿足含有密度0.860至0.910g/cm3 之聚乙烯系樹脂,且不含交聯劑,並滿足下述條件(a)與(b)之樹脂密封片。For example, a combination of the first type and the second type may be a polyethylene-based resin satisfying a density of 0.860 to 0.910 g/cm 3 and containing no crosslinking agent, and satisfying the following conditions (a) and ( b) The resin sealing sheet.

(a)在150℃的溫度下懸掛薄片時,收縮率為0至25%,且膠化率為0質量%以上且未滿1質量%。(a) When the sheet was hung at a temperature of 150 ° C, the shrinkage ratio was 0 to 25%, and the gelation ratio was 0% by mass or more and less than 1% by mass.

(b)慕尼黏度為70至90M。(b) Mooney viscosity is 70 to 90M.

例如將第二型態與第三型態組合者,可舉出滿足含有密度0.860至0.910g/cm3 之聚乙烯系樹脂,且不含交聯劑,並滿足下述條件(b)、(c)及(d)之樹脂密封片。For example, a combination of the second type and the third type may be a polyethylene-based resin satisfying a density of 0.860 to 0.910 g/cm 3 and containing no crosslinking agent, and satisfying the following conditions (b), ( The resin sealing sheets of c) and (d).

(b)慕尼黏度為70至90M。(b) Mooney viscosity is 70 to 90M.

(c)藉由測定150至250℃之熔融黏彈性而算出之活化能為75至90kJ/mol。(c) The activation energy calculated by measuring the melt viscoelasticity of 150 to 250 ° C is 75 to 90 kJ/mol.

(d)於150℃下,以1rad/秒所測定之儲存模數(G’)為6,000至12,000Pa。(d) The storage modulus (G') measured at 1 rad/sec at 150 ° C was 6,000 to 12,000 Pa.

例如將第一型態、第二型態及第三型態組合者,可舉出滿足含有密度0.860至0.910g/cm3 之聚乙烯系樹脂,且不含交聯劑,並滿足下述條件(a)至(d)之樹脂密封片。For example, a combination of the first type, the second type, and the third type may be a polyethylene-based resin that satisfies a density of 0.860 to 0.910 g/cm 3 and does not contain a crosslinking agent, and satisfies the following conditions. The resin sealing sheets of (a) to (d).

(a)在150℃的溫度下懸掛薄片時,收縮率為0至25%,且膠化率為0質量%以上且未滿1質量%。(a) When the sheet was hung at a temperature of 150 ° C, the shrinkage ratio was 0 to 25%, and the gelation ratio was 0% by mass or more and less than 1% by mass.

(b)慕尼黏度為70至90M。(b) Mooney viscosity is 70 to 90M.

(c)藉由測定150至250℃之熔融黏彈性而算出之活化能為75至90kJ/mol。(c) The activation energy calculated by measuring the melt viscoelasticity of 150 to 250 ° C is 75 to 90 kJ/mol.

(d)於150℃下,以1rad/秒所測定之儲存模數(G’)為6,000至12,000Pa。(d) The storage modulus (G') measured at 1 rad/sec at 150 ° C was 6,000 to 12,000 Pa.

本實施型態中,較佳為將樹脂密封片施以交聯處理。藉由施以交聯處理,可高精度控制上述物性。本實施型態中「交聯處理」係指將構成樹脂的高分子,至少一部份以物理的或化學的方式交聯之狀態。In the present embodiment, it is preferred to subject the resin sealing sheet to a crosslinking treatment. By performing the crosslinking treatment, the above physical properties can be controlled with high precision. In the present embodiment, "crosslinking treatment" means a state in which at least a part of the polymer constituting the resin is physically or chemically crosslinked.

因本實施型態之樹脂密封片不含交聯劑,故可省略熱硬化(thennal curing)步驟。此外,因可緩和製造薄片時溫度的限制,故在薄片製膜時及後述之壓印(emboss)加工時可將薄片溫度設定在高溫。其結果可提升製膜速度及壓印加工速度,有利於生產性。復藉由作為交聯劑所使用之有機過氧化物之熱分解等,而可抑制氣體的產生,故而可抑制真空泵等裝置類之腐蝕傷害及油污等。此外,本實施型態中「不含有交聯劑」之意思包括實質上不含有交聯劑者,亦包括無積極添加交聯劑者。Since the resin sealing sheet of the present embodiment does not contain a crosslinking agent, the heat curing step can be omitted. Further, since the temperature limitation during the production of the sheet can be alleviated, the sheet temperature can be set to a high temperature at the time of sheet film formation and emboss processing to be described later. As a result, the film forming speed and the imprint processing speed can be improved, which is advantageous for productivity. By the thermal decomposition of the organic peroxide used as the crosslinking agent, the generation of gas can be suppressed, and corrosion damage, oil stain, and the like of the vacuum pump and the like can be suppressed. Further, the meaning of "there is no crosslinking agent" in the present embodiment includes those which do not substantially contain a crosslinking agent, and those which do not contain a positive crosslinking agent.

本實施型態之樹脂密封片之交聯處理較佳為藉由照射電離輻射線進行。本實施型態所使用之電離輻射線可例舉:α射線、β射線、γ射線、中子射線、電子射線等。藉由調整此等電離輻射線之照射強度(加速電壓)與照射密度而可調整電子射線照射量,可高精度控制薄片厚度方向之懸掛收縮率、膠化率、慕尼黏度、活化能及儲存模數(G’)。藉由調整照射強度(加速電壓),可控制電子於薄片厚度方向之到達深度,藉由調整照射密度,可控制薄片每單位面積所照射之電子量的多寡。可對應施以交聯處理之樹脂,而適宜地調節電離輻射線之加速電壓,雖電離輻射線之照射量因所使用之樹脂而異,但由使樹脂密封片整體均一地交聯之觀點來看,一般較佳為3kGy至100kGy。更佳為30kGy至60kGy,又更佳為40kGy至50kGy。此外,加速電壓較佳為250kV至2000kV,更佳為500kV至1000kV。The crosslinking treatment of the resin sealing sheet of the present embodiment is preferably carried out by irradiating ionizing radiation. The ionizing radiation used in the present embodiment may, for example, be α-ray, β-ray, γ-ray, neutron beam, electron beam or the like. The electron beam irradiation amount can be adjusted by adjusting the irradiation intensity (acceleration voltage) and the irradiation density of the ionizing radiation, and the suspension shrinkage rate, the gelation rate, the Mooney viscosity, the activation energy, and the storage in the thickness direction of the sheet can be controlled with high precision. Modulus (G'). By adjusting the irradiation intensity (acceleration voltage), the depth of arrival of electrons in the thickness direction of the sheet can be controlled, and by adjusting the irradiation density, the amount of electrons irradiated per unit area of the sheet can be controlled. The accelerating voltage of the ionizing radiation can be appropriately adjusted in accordance with the resin to which the crosslinking treatment is applied, and the irradiation amount of the ionizing radiation varies depending on the resin to be used, but the resin sealing sheet is uniformly crosslinked uniformly. Look, it is generally preferred to be 3kGy to 100kGy. More preferably, it is 30 kGy to 60 kGy, and more preferably 40 kGy to 50 kGy. Further, the accelerating voltage is preferably from 250 kV to 2000 kV, more preferably from 500 kV to 1000 kV.

有關藉由本實施型態之樹脂密封片所得之作用效果並未十分明瞭,但可推測如下。The effects obtained by the resin sealing sheet of this embodiment are not fully understood, but it is presumed as follows.

首先,考慮間隙填覆性與耐潛變性為互償(trade-off)之關係,故難以兼顧。但因本實施型態之樹脂密封片不含有機過氧化物等交聯劑,故可抑制由交聯劑所產生之極性基等,故考慮是間隙填覆性與耐潛變性是否可兼顧。尤其是因不使用交聯劑而進行交聯處理,故可排除交聯劑及自由基起始劑等之不良影響,藉此可僅以源自樹脂成分之化學構造而構成樹脂成分之分子間交聯,故推測間隙填覆性與耐潛變性之兼顧性可更為優異。復因藉由電離輻射線照射而進行交聯處理,推測間隙填覆性與耐潛變性之兼顧性可更為優異。First, considering the relationship between the gap filling property and the latent resistance to the trade-off, it is difficult to balance. However, since the resin sealing sheet of the present embodiment does not contain a crosslinking agent such as an organic peroxide, the polar group generated by the crosslinking agent can be suppressed, and it is considered whether the gap filling property and the latent resistance can be balanced. In particular, since the crosslinking treatment is carried out without using a crosslinking agent, the adverse effects of the crosslinking agent and the radical initiator can be eliminated, whereby the intermolecular structure of the resin component can be formed only by the chemical structure derived from the resin component. Cross-linking, it is presumed that the balance between gap filling property and latent resistance can be more excellent. The complex cause is crosslinked by irradiation with ionizing radiation, and it is presumed that the compatibility between the gap filling property and the latent resistance is more excellent.

若更具體的說明,使用有機過氧化物等交聯劑之以往技術中,藉由交聯劑及自由基起始劑之解離反應所產生之自由基種(例如R-O‧等)亦利用於樹脂成分之交聯反應(參考下述式)。其結果使來源為交聯劑及自由基起始劑之自由基種與樹脂反應,而形成交聯構造,因此在分子間交聯中含有交聯劑及自由基起始劑之末端基(例如-OR等),而被認為會對間隙填覆性與耐潛變性造成不良影響。More specifically, in the prior art using a crosslinking agent such as an organic peroxide, a radical species (for example, RO‧, etc.) generated by a dissociation reaction of a crosslinking agent and a radical initiator is also used in the resin. Cross-linking reaction of the components (refer to the following formula). As a result, the radical species derived from the crosslinking agent and the radical initiator are reacted with the resin to form a crosslinked structure, and thus the terminal group of the crosslinking agent and the radical initiator is contained in the intermolecular crosslinking (for example) -OR, etc., which is considered to have an adverse effect on gap filling and resistance to latent denaturation.

R-O-O-R→R-O‧+‧O-RR-O-O-R→R-O‧+‧O-R

但本實施型態之樹脂密封片中,交聯反應係利用聚乙烯系樹脂等重複單元所含之[-(CH2 )-]的氫原子經電解解離所生成之[H‧](參考下述式)。其結果,因僅源自樹脂成分之自由基種與交聯反應有關,故分子間交聯僅由源自樹脂成分之化學構造所構成,而認為間隙填覆性與耐潛變性之兼顧性可更為優異(但本實施型態之作用等並不限於此)。However, in the resin sealing sheet of the present embodiment, the crosslinking reaction is carried out by electrolytic dissociation of a hydrogen atom of [-(CH 2 )-] contained in a repeating unit such as a polyethylene resin (refer to the following). Said). As a result, since the radical species derived only from the resin component are related to the crosslinking reaction, the intermolecular crosslinking is composed only of the chemical structure derived from the resin component, and the gap filling property and the latent denaturation resistance are considered to be compatible. It is more excellent (but the effect of the present embodiment and the like is not limited to this).

-CH2 -CH2 -CH2 -CH2 -→H‧+-CH2 -C‧H-CH2 -CH2 --CH 2 -CH 2 -CH 2 -CH 2 -→H‧+-CH 2 -C‧H-CH 2 -CH 2 -

此外,因熱處理而使樹脂密封片中之樹脂成分結晶化,而引起光學散射,產生霧度(haze)惡化,色差不安定之問題。但本實施型態之樹脂密封片中藉由照射電離輻射線而實施交聯處理,而可於樹脂成分之分子鏈上,因立體上的理由等而被認為是困難之位置(例如三級碳上)產生不具有極性基之交聯點。藉此,認為因加熱所致之結晶化所造成之分子運動受到抑制,可有效率的抑制霧度惡化,並可維持色差安定性(但本實施型態之作用等並不限於此)。Further, the resin component in the resin sealing sheet is crystallized by heat treatment to cause optical scattering, which causes a problem that the haze is deteriorated and the chromatic aberration is unstable. However, in the resin sealing sheet of the present embodiment, the crosslinking treatment is carried out by irradiating the ionizing radiation, and it can be considered as a difficult position (for example, tertiary carbon) on the molecular chain of the resin component for steric reasons or the like. Upper) produces a crosslinking point that does not have a polar group. By this, it is considered that the molecular motion caused by the crystallization by heating is suppressed, the haze deterioration can be effectively suppressed, and the chromatic aberration stability can be maintained (however, the effects of the present embodiment and the like are not limited thereto).

復過去藉由照射電離輻射使樹脂中之氫原子脫離,而產生共軛雙鍵,因為此共軛雙鍵發揮作為發色團(chromophor)之功能,而有增大色差之問題。但本實施型態之樹脂密封片中,藉由將電離輻射線照射量調節至特定範圍內,而可在適當的色差範圍設計樹脂密封片。此外,令人驚訝的是,本實施型態之樹脂密封片可抑制因加熱處理所致之熱劣化而引起之色差增大。其理由並不確定,此認為是因交聯反應未使用有機過氧化物,而沒有生成由過氧化物造成之極性基(羥基、羰基、過氧基、環氧基),故可維持聚乙烯系樹脂等之類的聚乙烯系樹脂本來所具有之高耐候性及耐熱性(但本實施型態之作用等並不限於此)。In the past, the hydrogen atom in the resin is detached by irradiation of ionizing radiation to generate a conjugated double bond, because this conjugated double bond functions as a chromophor and has a problem of increasing chromatic aberration. However, in the resin sealing sheet of the present embodiment, the resin sealing sheet can be designed in an appropriate color difference range by adjusting the irradiation amount of the ionizing radiation to a specific range. Further, it is surprising that the resin sealing sheet of the present embodiment can suppress an increase in chromatic aberration caused by thermal deterioration due to heat treatment. The reason for this is not certain. It is considered that the crosslinking reaction does not use an organic peroxide, and does not form a polar group (hydroxyl group, carbonyl group, peroxy group, or epoxy group) caused by a peroxide, so that the polyethylene can be maintained. The polyethylene-based resin such as a resin or the like has high weather resistance and heat resistance (however, the effects of the present embodiment and the like are not limited thereto).

接著說明有關可用於本實施型態之樹脂密封片之材料。Next, a material relating to the resin sealing sheet which can be used in the present embodiment will be described.

本實施型態之樹脂密封片含有密度為0.860至0.910g/cm3 以下之聚乙烯系樹脂。聚乙烯系樹脂係表示乙烯同元聚合物,或是乙烯與一種或兩種以上之其他單體的共聚物。藉由使用密度為0.910g/cm3 以下之聚乙烯樹脂,可大幅提升熱積層時之間隙填覆性及透明性(尤其是全光穿透率)。從提升浸射光穿透率使霧度提高之觀點來看,密度的下限值為0.860g/cm3 以上,較佳為0.880g/cm3 以上,更佳為0.890g/cm3 以上。從進一步改善透明性之觀點來看,更佳為對低密度聚乙烯系樹脂並用高密度聚乙烯系樹脂等不同種類之樹脂。更具體來說,對低密度聚乙烯系樹脂,更佳為以1至50質量%之比例添加高密度聚乙烯系樹脂。The resin sealing sheet of this embodiment contains a polyethylene resin having a density of 0.860 to 0.910 g/cm 3 or less. The polyethylene resin means an ethylene homopolymer or a copolymer of ethylene and one or more other monomers. By using a polyethylene resin having a density of 0.910 g/cm 3 or less, the gap filling property and transparency (especially the total light transmittance) at the time of heat lamination can be greatly improved. Light emitted from the lift dip transmittance haze increase of the viewpoint, the lower limit of density was 0.860g / cm 3 or more, preferably 0.880g / cm 3 or more, more preferably 0.890g / cm 3 or more. From the viewpoint of further improving the transparency, it is more preferable to use a different type of resin such as a high-density polyethylene resin in combination with a low-density polyethylene-based resin. More specifically, it is more preferable to add a high-density polyethylene-based resin to the low-density polyethylene-based resin in a ratio of from 1 to 50% by mass.

聚乙烯樹脂更佳為鏈狀低密度聚乙烯。藉由使用鏈狀低密度聚乙烯而可更加抑制極性,亦可得更優異之絕緣性。復水蒸氣障壁性優異,即使在高溫高濕下也可確實的密封被密封物。尤其是施以交聯處理時,此優點更為顯著。The polyethylene resin is more preferably a chain-shaped low-density polyethylene. By using a chain-shaped low-density polyethylene, the polarity can be further suppressed, and more excellent insulation properties can be obtained. The re-water vapor barrier property is excellent, and the sealed object can be reliably sealed even under high temperature and high humidity. This advantage is especially pronounced when cross-linking is applied.

從樹脂密封片之加工性及熱積層的適宜性來看,鏈狀低密度聚乙烯的熔點較佳為在110℃以下。此外,以JIS K 7210為基準所測定之熔融流動速率(MFR;190℃,2.16kg)較佳為0.5至30g/10分鐘,更佳為0.8至30g/10分鐘,又更佳為1.0至25g/10分鐘。The melting point of the chain-shaped low-density polyethylene is preferably 110 ° C or less from the viewpoint of the processability of the resin sealing sheet and the suitability of the heat-storing layer. Further, the melt flow rate (MFR; 190 ° C, 2.16 kg) measured on the basis of JIS K 7210 is preferably from 0.5 to 30 g/10 min, more preferably from 0.8 to 30 g/10 min, still more preferably from 1.0 to 25 g. /10 minutes.

鏈狀低密度聚乙烯可使用單點(single-site)系觸媒、多位點(multi-site)系觸媒等公知之觸媒而聚合。在此之中,以可抑制低分子成分之含量,且可高效率地合成低密度樹脂的觀點來看,較佳為使用單點系觸媒進行聚合。單點系觸媒並無特別限定,可使用公知者。例如可舉出具有環戊二烯之金屬錯合物。此等可使用市售品。The chain-shaped low-density polyethylene can be polymerized using a known catalyst such as a single-site catalyst or a multi-site catalyst. Among them, from the viewpoint of suppressing the content of the low molecular component and efficiently synthesizing the low-density resin, it is preferred to carry out the polymerization using a single-point catalyst. The single-point catalyst is not particularly limited, and a known one can be used. For example, a metal complex having cyclopentadiene can be mentioned. These can be used as a commercial item.

樹脂密封片可由含有除了密度為0.860至0.910g/cm3 之聚乙烯系樹脂以外的其他樹脂之樹脂組成物所構成。此時樹脂組成物整體中,其他樹脂含有率較佳為在10質量%以下,更佳為在5質量%以下,又更佳為在3質量%以下。The resin sealing sheet may be composed of a resin composition containing a resin other than a polyethylene resin having a density of 0.860 to 0.910 g/cm 3 . In the entire resin composition, the other resin content is preferably 10% by mass or less, more preferably 5% by mass or less, and still more preferably 3% by mass or less.

其他樹脂熔點較佳為在100℃以下,更佳為在80℃以下,又更佳為在75℃以下。藉此可賦予樹脂密封片充分的熱流動性。樹脂密封片所含之樹脂組成物含有複數樹脂時,樹脂組成物整體的熔點更佳為在100℃以下。熔點可由後述實施例所記載之方法測定。The melting point of the other resin is preferably 100 ° C or lower, more preferably 80 ° C or lower, still more preferably 75 ° C or lower. Thereby, sufficient heat fluidity of the resin sealing sheet can be imparted. When the resin composition contained in the resin sealing sheet contains a plurality of resins, the melting point of the entire resin composition is preferably 100 ° C or lower. The melting point can be measured by the method described in the examples below.

其他樹脂例如可舉出由以下所成群組中所選出之任一種:乙烯-醋酸乙烯共聚物、乙烯-脂肪族不飽和羧酸共聚物、乙烯-脂肪族不飽和羧酸酯共聚物、乙烯-醋酸乙烯共聚物皂化物(soponified metter)、乙烯-醋酸乙烯-丙烯酸酯共聚物皂化物及聚烯烴系樹脂。此等可單獨使用一種,也可兩種以上並用。The other resin may, for example, be any one selected from the group consisting of ethylene-vinyl acetate copolymer, ethylene-aliphatic unsaturated carboxylic acid copolymer, ethylene-aliphatic unsaturated carboxylic acid ester copolymer, and ethylene. a vinyl acetate copolymer saponified product, an ethylene-vinyl acetate-acrylate copolymer saponified product, and a polyolefin-based resin. These may be used alone or in combination of two or more.

乙烯-醋酸乙烯共聚物表示由乙烯單體與醋酸乙烯單體共聚合所得之共聚物。從光學特性、接著性及柔軟性的觀點來看,構成乙烯-醋酸乙烯共聚物之全部單體中,醋酸乙烯之比例較佳為10至40質量%,更佳為13至35質量%,又更佳為15至30質量%。由樹脂密封片之加工性的觀點來看,以JIS K 7210為基準所測定之MFR(190℃,2.16kg)較佳為0.3至30g/10分鐘,更佳為0.5至30g/10分鐘,又更佳為0.8至25g/10分鐘。The ethylene-vinyl acetate copolymer means a copolymer obtained by copolymerizing an ethylene monomer with a vinyl acetate monomer. The ratio of vinyl acetate in the entire monomer constituting the ethylene-vinyl acetate copolymer is preferably from 10 to 40% by mass, more preferably from 13 to 35% by mass, from the viewpoints of optical properties, adhesion, and flexibility. More preferably, it is 15 to 30% by mass. From the viewpoint of the processability of the resin sealing sheet, the MFR (190 ° C, 2.16 kg) measured based on JIS K 7210 is preferably from 0.3 to 30 g/10 min, more preferably from 0.5 to 30 g/10 min. More preferably, it is 0.8 to 25 g/10 minutes.

乙烯-脂肪族不飽和羧酸共聚物表示由乙烯單體與脂肪族不飽和羧酸單體共聚合所得之共聚物。脂肪族不飽和羧酸單體可舉出例如丙烯酸、甲基丙烯酸等。共聚物可為三種成分以上之單體共聚合而得之多元共聚物。構成乙烯-脂肪族不飽和羧酸共聚物之全部單體中,脂肪族不飽和羧酸單體之比例較佳為3至35質量%。MFR(190℃,2.16kg)較佳為0.3至30g/10分鐘,更佳為0.5至30g/10分鐘,又更佳為0.8至25g/10分鐘。The ethylene-aliphatic unsaturated carboxylic acid copolymer means a copolymer obtained by copolymerizing an ethylene monomer with an aliphatic unsaturated carboxylic acid monomer. The aliphatic unsaturated carboxylic acid monomer may, for example, be acrylic acid, methacrylic acid or the like. The copolymer may be a multicomponent copolymer obtained by copolymerizing a monomer having three or more components. In all the monomers constituting the ethylene-aliphatic unsaturated carboxylic acid copolymer, the proportion of the aliphatic unsaturated carboxylic acid monomer is preferably from 3 to 35 mass%. The MFR (190 ° C, 2.16 kg) is preferably from 0.3 to 30 g/10 min, more preferably from 0.5 to 30 g/10 min, still more preferably from 0.8 to 25 g/10 min.

乙烯-脂肪族不飽和羧酸酯共聚物表示由乙烯單體與脂肪族不飽和羧酸酯單體共聚合所得之共聚物。脂肪族不飽和羧酸酯單體可舉出例如丙烯酸或甲基丙烯酸與甲醇、乙醇等碳數1至8的醇類所成之酯等。共聚物可為三種成分以上之單體共聚合而得之多元共聚物。構成乙烯-脂肪族不飽和羧酸酯共聚物之全部單體中,脂肪族不飽和羧酸酯之比例較佳為3至35質量%。MFR(190℃,2.16kg)較佳為0.5至30g/10分鐘,更佳為0.8至30g/10分鐘,又更佳為1至25g/10分鐘。The ethylene-aliphatic unsaturated carboxylic acid ester copolymer means a copolymer obtained by copolymerizing an ethylene monomer with an aliphatic unsaturated carboxylic acid ester monomer. The aliphatic unsaturated carboxylic acid ester monomer may, for example, be an ester of acrylic acid or methacrylic acid with an alcohol having 1 to 8 carbon atoms such as methanol or ethanol. The copolymer may be a multicomponent copolymer obtained by copolymerizing a monomer having three or more components. In all of the monomers constituting the ethylene-aliphatic unsaturated carboxylic acid ester copolymer, the proportion of the aliphatic unsaturated carboxylic acid ester is preferably from 3 to 35 mass%. The MFR (190 ° C, 2.16 kg) is preferably from 0.5 to 30 g/10 min, more preferably from 0.8 to 30 g/10 min, still more preferably from 1 to 25 g/10 min.

乙烯-醋酸乙烯共聚物皂化物可舉出例如乙烯-醋酸乙烯共聚物之部分或完全皂化物。乙烯-醋酸乙烯-丙烯酸酯共聚物皂化物可舉出例如乙烯-醋酸乙烯-丙烯酸酯共聚物之部分或完全皂化物。此等皂化物中羥基含量之上限值在樹脂組成物中較佳為10質量%以下,更佳為在5質量%以下,又更佳為在3質量%以下。此外,有關於下限值較佳為在0.1質量%以上。藉由使羥基含量為上述範圍中,可使接著性及相容性更為良好,且可有效抑制所得之樹脂密封片之白濁化。可藉由NMR測定皂化前樹脂與皂化後樹脂(皂化物),而求得醋酸乙烯共聚合比(VA%)、皂化物之皂化度、樹脂組成物中皂化物之含量。The ethylene-vinyl acetate copolymer saponified product may, for example, be a partial or complete saponified product of an ethylene-vinyl acetate copolymer. The ethylene-vinyl acetate-acrylate copolymer saponified product may, for example, be a partial or complete saponified product of an ethylene-vinyl acetate-acrylate copolymer. The upper limit of the hydroxyl group content in the saponified product is preferably 10% by mass or less, more preferably 5% by mass or less, and still more preferably 3% by mass or less. Further, the lower limit is preferably 0.1% by mass or more. When the hydroxyl group content is in the above range, the adhesion and compatibility are further improved, and the whitening of the obtained resin sealing sheet can be effectively suppressed. The saponification resin and the saponified resin (saponified product) can be measured by NMR to determine the vinyl acetate copolymerization ratio (VA%), the degree of saponification of the saponified product, and the content of the saponified product in the resin composition.

從光學特性、接著性及柔軟性的觀點來看,皂化前之乙烯-醋酸乙烯共聚物或乙烯-醋酸乙烯-丙烯酸酯共聚物中,醋酸乙烯的含量較佳為10至40質量%,更佳為13至35質量%,又更佳為15至30質量%。從透明性及接著性的觀點來看,各個皂化物之皂化度較佳為10至70%,更佳為15至65%,又更佳為20至65%。The vinyl acetate-vinyl acetate copolymer or the ethylene-vinyl acetate-acrylate copolymer before saponification preferably has a vinyl acetate content of 10 to 40% by mass, more preferably from the viewpoints of optical properties, adhesion, and flexibility. It is 13 to 35 mass%, and more preferably 15 to 30 mass%. The degree of saponification of each saponified product is preferably from 10 to 70%, more preferably from 15 to 65%, still more preferably from 20 to 65%, from the viewpoints of transparency and adhesion.

皂化法可列舉例如:將乙烯-醋酸乙烯共聚物、乙烯-醋酸乙烯-丙烯酸酯共聚物之粒(pellet)及粉末放入甲醇等低級醇中,使用鹼觸媒皂化之方法、以及將共聚物預先溶解於甲苯、二甲苯、己烷等有機溶媒後,使用少量醇類及鹼觸媒皂化之方法等。此外,可將含有羥基以外的官能基之單體施行接枝共聚合(graft copolymerization)於皂化後之共聚物。在此所例示之皂化物係因側鏈含有羥基,故與皂化前的共聚物相比其接著性可更為提升。藉由調整皂化度可控制透明性及接著性等物性。Examples of the saponification method include a method in which an ethylene-vinyl acetate copolymer, an ethylene-vinyl acetate-acrylate copolymer pellet and a powder are placed in a lower alcohol such as methanol, a saponification using an alkali catalyst, and a copolymer. A method in which an organic solvent such as toluene, xylene or hexane is dissolved in advance, and then saponified with a small amount of an alcohol or a base catalyst. Further, a monomer having a functional group other than a hydroxyl group may be subjected to graft copolymerization to a saponified copolymer. The saponified compound exemplified herein has a hydroxyl group in the side chain, so that the adhesion can be further improved as compared with the copolymer before saponification. Physical properties such as transparency and adhesion can be controlled by adjusting the degree of saponification.

聚烯烴系樹脂可舉出除了上述密度為0.860至0.910g/cm3 之聚乙烯系樹脂以外之聚烯烴系樹脂。由腐蝕性及水蒸氣障壁性的觀點來看,較佳為由聚乙烯系樹脂、聚丙烯系樹脂及聚丁烯系樹脂所成群組選出至少一種,由成本觀點來看,更佳為聚乙烯系樹脂。聚丙烯系樹脂表示丙烯之同元聚合物,或是丙烯與一種或兩種以上其他單體之共聚物。聚丁烯系樹脂表示丁烯之同元聚合物,或是丁烯與一種或兩種以上其他單體之共聚物。The polyolefin-based resin may be a polyolefin-based resin other than the polyethylene-based resin having a density of 0.860 to 0.910 g/cm 3 . From the viewpoint of corrosiveness and water vapor barrier properties, at least one selected from the group consisting of a polyethylene resin, a polypropylene resin, and a polybutene resin is preferred, and it is more preferable from the viewpoint of cost. Vinyl resin. The polypropylene resin means a homopolymer of propylene or a copolymer of propylene and one or two other monomers. The polybutene resin represents a homopolymer of butene, or a copolymer of butene and one or more other monomers.

除了上述以外,以賦予樹脂密封片接著性為目的,較佳為含有由以下所成群組中選出之至少一種樹脂:具有羥基之烯烴系共聚物、以酸性官能基改質末端或接枝部分之改質聚烯烴、含甲基丙烯酸環氧丙酯(以下略記為「GMA」。)之乙烯共聚物。In addition to the above, in order to impart adhesion to the resin sealing sheet, it is preferred to contain at least one resin selected from the group consisting of olefin-based copolymers having a hydroxyl group, modified ends or grafting moieties with acidic functional groups. The modified polyolefin and the ethylene copolymer containing glycidyl methacrylate (hereinafter abbreviated as "GMA").

含有上述接著性樹脂時,例如含有含甲基丙烯酸環氧丙酯之乙烯共聚物時,因甲基丙烯酸環氧丙酯的反應性高,故可發揮安定之接著性。When the above-mentioned adhesive resin is contained, for example, when the ethylene copolymer containing glycidyl methacrylate is contained, since the reactivity of the glycidyl methacrylate is high, the stability of the stability can be exhibited.

構成具有羥基之烯烴系共聚物之烯烴以乙烯為宜。可藉由將乙烯-醋酸乙烯共聚物、乙烯-醋酸乙烯-丙烯酸酯共聚物之醋酸基皂化而取代成為羥基,而可得羥基。具有羥基之烯烴系共聚物,具體來說可舉出乙烯-醋酸乙烯共聚物之部分或完全皂化物、乙烯-醋酸乙烯-丙烯酸酯共聚物之部分或完全皂化物。The olefin constituting the olefin-based copolymer having a hydroxyl group is preferably ethylene. The hydroxyl group can be obtained by saponifying an acetic acid group of an ethylene-vinyl acetate copolymer or an ethylene-vinyl acetate-acrylate copolymer to form a hydroxyl group. The olefin-based copolymer having a hydroxyl group may specifically be a partial or complete saponified product of an ethylene-vinyl acetate copolymer or a partial or complete saponified product of an ethylene-vinyl acetate-acrylate copolymer.

以酸性官能基改質末端或接枝部分之改質聚烯烴,可舉出例如用以具有順丁烯二酸酐、硝基、羥基、羧基等極性基之化合物等,改質聚乙烯樹脂及聚丙烯樹脂之末端或接枝部分者。其中,從極性基之安定性的觀點來看,較佳為以順丁烯二酸酐改質末端或接枝部分之順丁烯二酸改質聚烯烴。此處所述之聚乙烯系樹脂、聚丙烯系樹脂,可使用與後述聚烯烴系樹脂所列舉者相同者。The modified polyolefin which is modified with an acidic functional group or a grafted portion may, for example, be a compound having a polar group such as maleic anhydride, nitro group, hydroxyl group or carboxyl group, etc., modified polyethylene resin and poly The end or graft portion of the propylene resin. Among them, from the viewpoint of the stability of the polar group, a maleic acid-modified polyolefin in which the terminal or graft portion of the maleic anhydride is modified is preferable. The polyethylene resin or the polypropylene resin described herein can be the same as those described for the polyolefin resin described later.

含甲基丙烯酸環氧丙酯之乙烯共聚物,表示具有環氧基作為反應部位之甲基丙烯酸環氧丙酯與乙烯之共聚物、以及與乙烯之三元聚合物(terpolymer),例如可例舉:乙烯-甲基丙烯酸環氧丙酯共聚物、乙烯-甲基丙烯酸環氧丙酯-醋酸乙烯共聚物、乙烯-甲基丙烯酸環氧丙酯-丙烯酸甲酯共聚物等。因甲基丙烯酸環氧丙酯之反應性高,故上述化合物係可發揮安定的接著性。The ethylene copolymer containing glycidyl methacrylate represents a copolymer of glycidyl methacrylate and ethylene having an epoxy group as a reaction site, and a terpolymer with ethylene, for example, Examples: ethylene-glycidyl methacrylate copolymer, ethylene-glycidyl methacrylate-vinyl acetate copolymer, ethylene-glycidyl methacrylate-methyl acrylate copolymer, and the like. Since the reactivity of glycidyl methacrylate is high, the above compound can exhibit stable adhesion.

樹脂密封片所使用之樹脂組成物可復含電離輻射線裂解(degradation)型樹脂。電離輻射線裂解型樹脂係指具有藉由照射α射線、β射線、γ射線、中子射線、電子射線等電離輻射而裂解之性質的樹脂。The resin composition used for the resin sealing sheet may further contain an ionizing radiation degradation type resin. The ionizing radiation-cleaving type resin refers to a resin having a property of being cracked by irradiation with ionizing radiation such as α rays, β rays, γ rays, neutron rays, and electron beams.

電離輻射線裂解型樹脂可舉出例如官能基鍵結於主鏈C-C鍵結之α位之裂解型樹脂。官能基例如可舉出由以下所成群組中選出之至少一種:鹵素原子、羥基、硝基、可取代之烷基、可取代之烷氧基、可取代之胺基、可取代之羧基、可取代之醯胺基、及可取代之芳基。The ionizing radiation cleavage type resin may, for example, be a cleavage type resin in which a functional group is bonded to the α position of the main chain C-C bond. The functional group may, for example, be at least one selected from the group consisting of a halogen atom, a hydroxyl group, a nitro group, a substitutable alkyl group, a substitutable alkoxy group, a substitutable amine group, a substitutable carboxyl group, An amine group which may be substituted, and an aryl group which may be substituted.

在此,可於烷基、烷氧基、胺基、羧基、醯胺基及芳基之可取代位置,以一個或兩個以上取代基取代之。相關之取代基例如可列舉:鹵素原子(例如氟原子、氯原子、溴原子)、碳數1至6之烷基(例如甲基、乙基、丙基、異丙基、丁基、異丁基、第二丁基、第三丁基、戊基、己基)、芳基(例如苯基、萘基)、芳烷基(例如苄基、苯乙基)、烷氧基(例如甲氧基、乙氧基)等。Here, one or two or more substituents may be substituted at the substitutable positions of the alkyl group, the alkoxy group, the amine group, the carboxyl group, the decylamino group and the aryl group. Examples of the related substituent include a halogen atom (for example, a fluorine atom, a chlorine atom, and a bromine atom), and an alkyl group having 1 to 6 carbon atoms (for example, methyl group, ethyl group, propyl group, isopropyl group, butyl group, and isobutyl group). Base, second butyl, tert-butyl, pentyl, hexyl), aryl (eg phenyl, naphthyl), aralkyl (eg benzyl, phenethyl), alkoxy (eg methoxy) , ethoxy) and so on.

具體來說,電離輻射線裂解型樹脂例如可舉出由以下所成群組中選出之至少一種:聚丙烯、聚異丁烯、聚α-甲基苯乙烯、聚四氟乙烯、聚甲基丙烯酸甲酯、聚丙烯醯胺、聚甲基丙烯酸甲基環氧丙酯及纖維素。Specifically, the ionizing radiation-cleaving type resin may, for example, be at least one selected from the group consisting of polypropylene, polyisobutylene, poly-α-methylstyrene, polytetrafluoroethylene, and polymethyl methacrylate. Ester, polypropylene decylamine, polymethyl methacrylate methacrylate and cellulose.

構成樹脂密封片之樹脂中,可含有具有交聯性的部位與具有裂解性的部位兩者之電離輻射線交聯裂解型樹脂。此等樹脂可列舉如下:含有甲基丙烯酸環氧丙酯之乙烯共聚物、含有聚丙烯之乙烯共聚物、含有甲基丙烯酸甲酯之乙烯共聚物、含有異戊二烯橡膠之乙烯共聚物、含有丁二烯橡膠之乙烯共聚物、含有苯乙烯-丁二烯共聚合橡膠之乙烯共聚物等。The resin constituting the resin sealing sheet may contain an ionizing radiation cross-linking cleavage resin having both a crosslinkable portion and a cleavable portion. Examples of such resins include ethylene copolymers containing glycidyl methacrylate, ethylene copolymers containing polypropylene, ethylene copolymers containing methyl methacrylate, and ethylene copolymers containing isoprene rubber. An ethylene copolymer containing butadiene rubber, an ethylene copolymer containing a styrene-butadiene copolymer rubber, and the like.

含甲基丙烯酸環氧丙酯之乙烯共聚物,係表示具有環氧基作為反應部位之甲基丙烯酸環氧丙酯與乙烯之共聚物、以及與乙烯之三元聚合物,亦可為多元共聚物。例如可例舉:乙烯-甲基丙烯酸環氧丙酯共聚物、乙烯-甲基丙烯酸環氧丙酯-醋酸乙烯共聚物、乙烯-甲基丙烯酸環氧丙酯-丙烯酸甲酯共聚物等。因甲基丙烯酸環氧丙酯之反應性高,故此等化合物係可發揮安定的接著性,且有降低玻璃轉移溫度且使柔軟性良好之傾向。The ethylene copolymer containing propylene methacrylate is a copolymer of propylene glycol methacrylate and ethylene having an epoxy group as a reaction site, and a terpolymer with ethylene, or a multicomponent copolymer. Things. For example, an ethylene-glycidyl methacrylate copolymer, an ethylene-glycidyl methacrylate-vinyl acetate copolymer, an ethylene-glycidyl methacrylate-methyl acrylate copolymer, etc. are mentioned. Since the reactivity of glycidyl methacrylate is high, these compounds exhibit a stable adhesive property, and tend to lower the glass transition temperature and provide good flexibility.

上述各共聚物之共聚合係可因應構成共聚物之單體的種類,而藉由高壓法、熔融法等公知之方法進行,聚合反應之觸媒可使用多位點觸媒及單點系觸媒等。此外,上述共聚物中,各單體之鍵結形狀並無特別限定,可使用具有無規(random)鍵結、崁段(block)鍵結等鍵結形狀之樹脂。此外,從光學特性之觀點來看,上述共聚物較佳為使用高壓法並以無規鍵結所聚合之共聚物。The copolymerization of each of the above copolymers can be carried out by a known method such as a high pressure method or a melting method depending on the type of the monomer constituting the copolymer, and the catalyst for the polymerization can be used with a plurality of sites and a single point contact. Media and so on. Further, in the above copolymer, the bonding shape of each monomer is not particularly limited, and a resin having a bonding shape such as random bonding or block bonding can be used. Further, from the viewpoint of optical properties, the above copolymer is preferably a copolymer which is polymerized by random bonding using a high pressure method.

本實施型態之樹脂密封片中,在不損及其本來特性之範圍內可添加偶合劑(coupling agent)、防霧劑(antifogging agent)、塑化劑、抗氧化劑、界面活性劑、著色劑(coloring agent)、紫外線吸收劑、抗靜電劑(antistatic agent)、結晶成核劑(crystal nucleating agent)、助滑劑(slip agent)、抗結塊劑(antiblocking agent)、無機填充劑(inorganic filler)、交聯調整劑、防銹劑(antitarnish agent)等。此等添加劑可使用公知者。尤其是有必要長期維持透明性及接著性時,相對於樹脂總量,此等添加劑含量之總量較佳為0至10質量%,添加方法更佳為0至5質量%。可藉由將液體添加於熔融樹脂、直接揉捏添加入對象樹脂層、於製膜後塗佈等可發揮添加劑效果之公知添加方法,而將樹脂導入。In the resin sealing sheet of this embodiment, a coupling agent, an antifogging agent, a plasticizer, an antioxidant, a surfactant, and a colorant may be added within a range that does not impair the original characteristics. (coloring agent), ultraviolet absorber, antistatic agent, crystal nucleating agent, slip agent, antiblocking agent, inorganic filler (inorganic filler) ), a crosslinking regulator, an antitarnish agent, and the like. These additives can be used by a known person. In particular, when it is necessary to maintain transparency and adhesion for a long period of time, the total amount of such additives is preferably from 0 to 10% by mass based on the total amount of the resin, and the addition method is more preferably from 0 to 5% by mass. The resin can be introduced by adding a liquid to the molten resin, directly kneading the target resin layer, and applying a known additive method such as coating after film formation.

例如,可添加偶合劑以確保本實施型態之樹脂密封片中安定的接著性。偶合劑的添加量係根據所求接著性之程度及被接著物之種類,但相對於樹脂總量較佳為0.01至5質量%,更佳為0.03至4質量%,又更佳為0.05至3質量%。For example, a coupling agent may be added to ensure stable adhesion in the resin sealing sheet of this embodiment. The amount of the coupling agent to be added is preferably from 0.01 to 5% by mass, more preferably from 0.03 to 4% by mass, still more preferably 0.05 to the total amount of the resin, depending on the degree of the desired adhesion and the type of the substrate to be subjected. 3 mass%.

偶合劑添加於乙烯系共聚物中,其較佳為賦予對太陽能電池及玻璃等有良好接著性的物質,前述乙烯系共聚物例如為從乙烯-醋酸乙烯共聚物、乙烯-脂肪族不飽和羧酸共聚物、乙烯-脂肪族不飽和羧酸酯共聚物所選出至少一種樹脂之乙烯系共聚物。偶合劑之具體例子可列舉:有機矽烷化合物、有機矽烷過氧化物、有機鈦酸鹽(titanate)化合物。上述中,較佳之偶合劑係可舉出具有不飽和基及環氧基者:γ-氯丙基甲氧基矽烷、乙烯基三氯矽烷、乙烯基三乙氧基矽烷、乙烯基-三(β-甲氧基乙氧基)矽烷、γ-甲基丙烯醯氧基丙基三甲氧基矽烷(γ-methacryloxypropyltrimethoxysilane)、β-(3,4-乙氧基環己基)乙基三甲氧基矽烷、γ-環氧丙氧基丙基三甲氧基矽烷(γ-glycidoxypropyltrimethoxysilane)、乙烯基三乙醯氧基矽烷(vinyltriacetoxysilane)、γ-巰基丙基三甲氧基矽烷(γ-mercaptopropyltrimethoxysilane)、γ-胺基丙基三乙氧基矽烷、N-β-(胺基乙基)-γ-胺基丙基三甲氧基矽烷、環氧丙氧基丙基三乙氧基矽烷等。The coupling agent is preferably added to the ethylene-based copolymer, and it is preferred to impart a good adhesion to a solar cell, glass, or the like. The ethylene-based copolymer is, for example, an ethylene-vinyl acetate copolymer or an ethylene-aliphatic unsaturated carboxylic acid. The acid copolymer, the ethylene-aliphatic unsaturated carboxylic acid ester copolymer is selected from at least one resin of a vinyl copolymer. Specific examples of the coupling agent include an organic decane compound, an organic decane peroxide, and an organic titanate compound. Among the above, preferred coupling agents include those having an unsaturated group and an epoxy group: γ-chloropropyl methoxy decane, vinyl trichloro decane, vinyl triethoxy decane, and vinyl-tri ( --methoxyethoxy methoxy decane, γ-methacryloxypropyltrimethoxysilane, β-(3,4-ethoxycyclohexyl)ethyltrimethoxydecane , γ-glycidoxypropyltrimethoxysilane, vinyltriacetoxysilane, γ-mercaptopropyltrimethoxysilane, γ-amine Propyltriethoxydecane, N-β-(aminoethyl)-γ-aminopropyltrimethoxydecane, glycidoxypropyltriethoxydecane, and the like.

此外,只要以公知之添加方法即可無障礙的添加此等偶合劑,此公知方法可列舉:於擠壓機(extruder)內將偶合劑注入混合至樹脂中、於擠壓機漏斗(hopper)內將偶合劑混合導入、將偶合劑事前母粒化(masterbatch)而混合添加等。但因經由擠壓機,故會因擠壓機內的熱及壓力等而妨礙本來的功能,有必要依照偶合劑種類而增減添加量。此外,在與樹脂混合時,偶合劑的種類可從樹脂透明性、分散程度、對於擠壓機之腐蝕及擠壓(extrusion)安定性之觀點而適宜的選擇。Further, the coupling agent can be added unobstructed by a known addition method, and the known method can be exemplified by injecting and mixing a coupling agent into a resin in an extruder, in an extruder hopper. The coupling agent is mixed and introduced, and the coupling agent is masterbatch, mixed and added. However, since it passes through the extruder, the original function is hindered by heat and pressure in the extruder, and it is necessary to increase or decrease the amount of addition according to the type of the coupling agent. Further, when mixed with a resin, the kind of the coupling agent can be suitably selected from the viewpoints of transparency of the resin, degree of dispersion, corrosion to an extruder, and extrusion stability.

較佳之紫外線吸收劑可列舉如下:2-羥基-4-正辛氧基二苯基甲酮、2-羥基-4-正-5-磺酸基二苯基甲酮、2-羥基-4-甲氧基二苯基甲酮、2,2’-二羥基-4,4’-二甲氧基二苯基甲酮、2-羥基-4-正十二氧基二苯基甲酮、2,4-二羥基二苯基甲酮、2,2’-二羥基-4-甲氧基二苯基甲酮等。Preferred ultraviolet absorbers are as follows: 2-hydroxy-4-n-octyloxydiphenyl ketone, 2-hydroxy-4-n--5-sulfonyldiphenyl ketone, 2-hydroxy-4- Methoxydiphenyl ketone, 2,2'-dihydroxy-4,4'-dimethoxydiphenyl ketone, 2-hydroxy-4-n-dodecyloxydiphenyl ketone, 2 , 4-dihydroxydiphenyl ketone, 2,2'-dihydroxy-4-methoxydiphenyl ketone, and the like.

較佳之抗氧化劑可列舉如下:酚系、硫系、磷系、胺系、受阻酚(hindered phenol)系、受阻胺系、聯胺(hydrazine)系等。Preferred antioxidants are phenol-based, sulfur-based, phosphorus-based, amine-based, hindered phenol-based, hindered amine-based, hydrazine-based, and the like.

此等紫外線吸收劑、抗氧化劑等不僅可添加於乙烯系共聚物,亦可添加於構成樹脂層之其他樹脂,相對於構成各樹脂層之樹脂該添加劑較佳為0至10質量%,更佳為0至5質量%。These ultraviolet absorbers, antioxidants, and the like may be added not only to the ethylene copolymer but also to other resins constituting the resin layer, and the additive is preferably 0 to 10% by mass, more preferably the resin constituting each resin layer. It is 0 to 5 mass%.

聚乙烯系樹脂之情形,可藉由將具有矽醇基之樹脂母粒化而混合,而更加提升接著性。In the case of a polyethylene-based resin, the resin having a sterol group can be granulated and mixed to further improve the adhesion.

本實施型態之樹脂密封片可為單層構造、多層構造任一者。以下說明有關於各構造。在此,樹脂密封片為多層構造時,係將樹脂密封片表面的層稱為「表面層」,此外稱為「內層」(三層以上時)。即形成樹脂密封片之兩表面之兩層皆為「表面層」。例如由兩層構成多層構造時,係由兩個表面層所構成之構造,一邊的表面層與另一邊的表面層可為相同成分,亦可為相異成分。The resin sealing sheet of the present embodiment may be either a single layer structure or a multilayer structure. The following description pertains to each configuration. Here, when the resin sealing sheet has a multilayer structure, the layer on the surface of the resin sealing sheet is referred to as a "surface layer", and is also referred to as an "inner layer" (in the case of three or more layers). That is, both layers forming the both surfaces of the resin sealing sheet are "surface layers". For example, when the two-layer structure is composed of two layers, the structure is composed of two surface layers, and the surface layer on one side and the surface layer on the other side may be the same component or may be different components.

[單層構造][single layer structure]

本實施型態之樹脂密封片可為滿足懸掛收縮率及膠化率;慕尼黏度;或活化能及與儲存模數(G’)任一特定條件,並含有密度0.860至0.910g/cm3 之聚乙烯系樹脂,且不含交聯劑之單層樹脂密封片。從確保與被接著物之良好的接著性之觀點來看,較佳為含有由以下所成群組中所選出之至少一種樹脂:具有羥基之烯烴系共聚物、以酸性官能基改質末端或接枝部分之改質聚烯烴、含甲基丙烯酸環氧丙酯之乙烯共聚物。The resin sealing sheet of this embodiment can satisfy any specific conditions of suspension shrinkage and gelation rate; Mui viscosity; or activation energy and storage modulus (G'), and has a density of 0.860 to 0.910 g/cm 3 A polyethylene resin, and a single layer resin sealing sheet containing no crosslinking agent. From the viewpoint of ensuring good adhesion to the substrate to be attached, it is preferred to contain at least one resin selected from the group consisting of olefin-based copolymers having a hydroxyl group, modified ends with an acidic functional group or A grafted portion of a modified polyolefin, an ethylene copolymer containing propylene glycol methacrylate.

[多層構造][Multilayer construction]

本實施型態之樹脂密封片較佳為多層構造。藉由多層構造可賦予各層(樹脂層)不同機能,而可提升樹脂密封片之物性。樹脂密封片為多層構造時,薄片整體滿足特定之懸掛收縮率及膠化率、黏彈性或是慕尼黏度即可。此外,多層構造之樹脂密封片中,至少任一層含有密度0.860至0.910g/cm3 之聚乙烯系樹脂即可。多層構造之樹脂密封片整體中,密度0.860至0.910g/cm3 之聚乙烯系樹脂的含量並無特別限定,但較佳為70質量%以上,更佳為80質量%以上,又更佳為90質量%以上。以下說明有關於各層。The resin sealing sheet of the present embodiment preferably has a multilayer structure. The multilayer structure can impart different functions to the respective layers (resin layers), and the physical properties of the resin sealing sheets can be improved. When the resin sealing sheet has a multilayer structure, the sheet as a whole can satisfy a specific suspension shrinkage ratio, a gelation ratio, a viscoelasticity or a Mooney viscosity. Further, at least one of the resin sealing sheets of the multilayer structure may contain a polyethylene resin having a density of 0.860 to 0.910 g/cm 3 . In the entire resin sealing sheet having a multilayer structure, the content of the polyethylene resin having a density of 0.860 to 0.910 g/cm 3 is not particularly limited, but is preferably 70% by mass or more, more preferably 80% by mass or more, and still more preferably 90% by mass or more. The following description pertains to each layer.

(表面層)(surface layer)

多層構造之情形,與被密封物接觸的層(表面層)較佳為含有由以下所成群組中選出之至少一種接著性樹脂之樹脂層:具有羥基之烯烴系共聚物、以酸性官能基改質末端或接枝部分之改質聚烯烴、含甲基丙烯酸環氧丙酯之乙烯共聚物。In the case of a multilayer structure, the layer (surface layer) which is in contact with the object to be sealed is preferably a resin layer containing at least one adhesive resin selected from the group consisting of an olefin-based copolymer having a hydroxyl group and an acidic functional group. A modified polyolefin having a modified terminal or grafting portion, an ethylene copolymer containing propylene glycol methacrylate.

表面層可為僅以上述接著性樹脂所形成的層,但從確保良好的透明性、柔軟性、與被接著物之接著性以及操作性之觀點來看,較佳為上述接著性樹脂與由以下所成群組中所選出至少一種的樹脂之混合樹脂所形成的層:密度0.860至0.910g/cm3 之聚乙烯系樹脂、乙烯-醋酸乙烯共聚物、乙烯-脂肪族不飽和羧酸共聚物、乙烯-脂肪族不飽和羧酸酯共聚物、乙烯-醋酸乙烯共聚物皂化物、乙烯-醋酸乙烯-丙烯酸酯共聚物皂化物及聚烯烴系樹脂。該等樹脂可作為其它樹脂而使用上述者。例如乙烯-脂肪族不飽和羧酸共聚物可使用上述乙烯-脂肪族不飽和羧酸共聚物,具體來說可舉出乙烯-丙烯酸共聚物、乙烯-甲基丙烯酸共聚物等。聚烯烴系樹脂可使用上述聚烯烴系樹脂,具體來說可舉出聚乙烯系樹脂、聚丙烯系樹脂、聚丁烯系樹脂等。The surface layer may be a layer formed only of the above-mentioned adhesive resin, but from the viewpoint of ensuring good transparency, flexibility, adhesion to the substrate, and handleability, the above-mentioned adhesive resin is preferably used. A layer formed by mixing a resin of at least one selected from the group consisting of a polyethylene resin having a density of 0.860 to 0.910 g/cm 3 , an ethylene-vinyl acetate copolymer, and an ethylene-aliphatic unsaturated carboxylic acid copolymerization. , an ethylene-aliphatic unsaturated carboxylic acid ester copolymer, an ethylene-vinyl acetate copolymer saponified product, an ethylene-vinyl acetate-acrylate copolymer saponified product, and a polyolefin-based resin. These resins can be used as the other resins. For example, the ethylene-aliphatic unsaturated carboxylic acid copolymer can be used, and specifically, an ethylene-acrylic acid copolymer, an ethylene-methacrylic acid copolymer, or the like can be used. The polyolefin resin may be used as the polyolefin resin, and specific examples thereof include a polyethylene resin, a polypropylene resin, and a polybutene resin.

表面層中之接著性樹脂含量並無特別限定,但從接著性的觀點來看,較佳為5至50質量%,更佳為5至40質量%,又更佳為5至35質量%。The content of the adhesive resin in the surface layer is not particularly limited, but is preferably from 5 to 50% by mass, more preferably from 5 to 40% by mass, still more preferably from 5 to 35% by mass, from the viewpoint of adhesion.

樹脂密封片具有多層構造時,電離輻射線裂解型樹脂較佳為包含於與被密封物接觸的層(表面層)之中。若於與樹脂密封片之被密封物接觸的層中含有電離輻射線裂解型樹脂,則將發電元件及配線等的高低差無間隙地密封之性能(間隙填覆性)會有變良好的傾向。When the resin sealing sheet has a multilayer structure, the ionizing radiation-cleaving type resin is preferably contained in a layer (surface layer) which is in contact with the object to be sealed. When the layer which is in contact with the to-be-sealed material of the resin sealing sheet contains the ionizing radiation-cracking resin, the performance (gap filling property) of sealing the gap between the power generating element and the wiring without gaps tends to be good. .

表面層含有電離輻射線裂解型樹脂時,表面層中之電離輻射線裂解型樹脂之含量較佳為5至80質量%更佳為7至70質量%,又更佳為8至60質量%。When the surface layer contains the ionizing radiation-cracking resin, the content of the ionizing radiation-cracking resin in the surface layer is preferably from 5 to 80% by mass, more preferably from 7 to 70% by mass, still more preferably from 8 to 60% by mass.

與被密封物接觸的層含有電離輻射線裂解型樹脂時,表面層的膠化率較佳為未滿3質量%,更佳為0.1質量%以上2質量%以下,又更佳為0.1質量%以上1質量%以下。若表面層的膠化率未滿3質量%,則間隙填覆性有變良好的傾向,若在0.1質量%以上,則在夏季等高溫狀態下不會有樹脂熔解使被密封物流動之情況,可有安定密封之傾向。When the layer in contact with the object to be sealed contains the ionizing radiation-cracking resin, the gelation rate of the surface layer is preferably less than 3% by mass, more preferably 0.1% by mass to 2% by mass, still more preferably 0.1% by mass. The above is 1% by mass or less. When the gelation rate of the surface layer is less than 3% by mass, the gap filling property tends to be good. When the content is 0.1% by mass or more, the resin is not melted in the high temperature state such as summer to cause the sealed object to flow. , can have a tendency to stabilize the seal.

從防止阻塞(blocking)的觀點來看,表面層之密度較佳為0.870g/cm3 以上,從緩衝性(cushion)、透明性的觀點來看較佳為0.960g/cm3 以下。作為防止阻塞的方法而使用公知的壓印方法以減少表面之接觸面積,亦為有效的。從確保良好接著性之觀點來看,相對於樹脂密封片整體厚度,與被密封物接觸之表面層的層比例較佳為至少具有5%以上之厚度。若厚度在5%以上,則有可獲得與上述單層構造時相同之接著性的傾向。The density of the surface layer is preferably 0.870 g/cm 3 or more from the viewpoint of preventing blocking, and is preferably 0.960 g/cm 3 or less from the viewpoint of cushioning property and transparency. It is also effective to use a known imprint method as a method of preventing clogging to reduce the contact area of the surface. From the viewpoint of ensuring good adhesion, the layer ratio of the surface layer in contact with the object to be sealed is preferably at least 5% or more with respect to the entire thickness of the resin sealing sheet. When the thickness is 5% or more, the same adhesiveness as in the case of the above-described single layer structure tends to be obtained.

(內層)(inner layer)

內層較佳為含有密度0.860至0.910g/cm3 之聚乙烯系樹脂的層,或是由其他樹脂所形成的層,其他樹脂係由以下所成群組中所選出至少一種:乙烯-醋酸乙烯共聚物、乙烯-脂肪族不飽和羧酸共聚物、乙烯-脂肪族不飽和羧酸酯共聚物及聚烯烴系樹脂。The inner layer is preferably a layer containing a polyethylene resin having a density of 0.860 to 0.910 g/cm 3 or a layer formed of other resins, and the other resin is selected from the group consisting of at least one selected from the group consisting of ethylene-acetic acid. An ethylene copolymer, an ethylene-aliphatic unsaturated carboxylic acid copolymer, an ethylene-aliphatic unsaturated carboxylic acid ester copolymer, and a polyolefin-based resin.

以賦予其他機能為目的,可於內層適宜地選擇樹脂材料、混合物、添加物等。例如,以新賦予的緩衝性為目的,可設置含有熱可性樹脂的層作為內層。作為內層而使用之熱可塑性樹脂可列舉:聚烯烴系樹脂、苯乙烯系樹脂、氯乙烯系樹脂、聚酯系樹脂、聚胺甲酸酯系樹脂、氯系聚乙烯系樹脂、聚醯胺系樹脂等。復含有具有生物分解性者及源自植物之原料系者。上述之中,從與結晶性聚乙烯系樹脂之相容性佳、透明性良好之觀點來看,較佳為氫化崁段共聚物樹脂、丙烯系共聚物樹脂、乙烯系共聚物樹脂,更佳為氫化崁段共聚物樹脂及丙烯系共聚物樹脂。For the purpose of imparting other functions, a resin material, a mixture, an additive, or the like can be appropriately selected in the inner layer. For example, a layer containing a thermosetting resin may be provided as an inner layer for the purpose of newly imparted cushioning properties. Examples of the thermoplastic resin used as the inner layer include a polyolefin resin, a styrene resin, a vinyl chloride resin, a polyester resin, a polyurethane resin, a chlorine-based polyethylene resin, and a polyamide. Resin or the like. It contains biodegradable and plant-derived raw materials. Among the above, from the viewpoint of good compatibility with the crystalline polyethylene resin and good transparency, a hydrogenated cerium segment copolymer resin, a propylene copolymer resin, and a vinyl copolymer resin are preferable. It is a hydrogenated oxime copolymer resin and a propylene-based copolymer resin.

氫化崁段共聚物樹脂較佳為乙烯芳族烴與共軛二烯之崁段共聚物。乙烯芳族烴可列舉:苯乙烯、鄰甲基苯乙烯、對甲基苯乙烯、對第三丁基苯乙烯、1,3-二甲基苯乙烯、α-甲基苯乙烯、乙烯萘、乙烯蒽、1,1-二苯基乙烯、N,N-二甲基-對胺基乙基苯乙烯、N,N-二乙基-對胺基乙基苯乙烯等,尤其較佳為苯乙烯。此等可單獨使用一種,亦可並用兩種以上。共軛二烯係具有一對其軛雙鍵之二烯烴(diolefin),可列舉:1,3-丁二烯、2-甲基-1,3-丁二烯(異戊二烯)、2,3-二甲基-1,3-二丁烯、1,3-戊二烯、1,3-己二烯等。此等可單獨使用一種,亦可並用兩種以上。The hydrogenated hydrazine segment copolymer resin is preferably a fluorene copolymer of a vinyl aromatic hydrocarbon and a conjugated diene. Examples of the vinyl aromatic hydrocarbons include styrene, o-methyl styrene, p-methyl styrene, p-tert-butyl styrene, 1,3-dimethyl styrene, α-methyl styrene, and vinyl naphthalene. Ethylene hydride, 1,1-diphenylethylene, N,N-dimethyl-p-aminoethylstyrene, N,N-diethyl-p-aminoethylstyrene, etc., particularly preferably benzene Ethylene. These may be used alone or in combination of two or more. The conjugated diene has a diolefin having a conjugated double bond thereto, and examples thereof include 1,3-butadiene, 2-methyl-1,3-butadiene (isoprene), and 2 , 3-dimethyl-1,3-dibutene, 1,3-pentadiene, 1,3-hexadiene, and the like. These may be used alone or in combination of two or more.

丙烯系共聚物樹脂較佳為丙烯與乙烯或碳原子數4至20之α-烯烴所得之共聚物。此乙烯或碳原子數4至20之α-烯烴的含量較佳為6至30質量%。此碳原子數4至20之α-烯烴可列舉:1-丁烯、1-戊烯、1-己烯、1-辛烯、4-甲基-1-戊烯、3-甲基-1-戊烯、1-癸烯、1-十二烯、1-十四烯、1-十六烯、1-十八烯、1-二十烯(1-icosene)等。The propylene-based copolymer resin is preferably a copolymer of propylene and ethylene or an α-olefin having 4 to 20 carbon atoms. The content of the ethylene or the α-olefin having 4 to 20 carbon atoms is preferably 6 to 30% by mass. Examples of the α-olefin having 4 to 20 carbon atoms include 1-butene, 1-pentene, 1-hexene, 1-octene, 4-methyl-1-pentene, and 3-methyl-1. -pentene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-icosene, and the like.

丙烯系共聚物樹脂可使用多位點系觸媒、單點系觸媒及其他任意觸媒聚合。復可使用以奈米排序(nano order)控制樹脂結晶/非結晶構造(形態(morphology))之乙烯系共聚物。The propylene-based copolymer resin can be polymerized using a multi-site catalyst, a single-point catalyst, and any other catalyst. A vinyl copolymer having a resin crystal/non-crystalline structure (morphology) controlled by a nano order can be used.

乙烯系共聚物樹脂可以多位點系觸媒、單點系觸媒及其他任意觸媒聚合。此外,可使用以奈米排序控制樹脂結晶/非結晶構造(形態)之乙烯系共聚物。The ethylene-based copolymer resin can be polymerized by a multi-site catalyst, a single-point catalyst, and any other catalyst. Further, a vinyl-based copolymer which controls the resin crystal/non-crystalline structure (morphology) by nano-ordering can be used.

此外,樹脂密封片可具有以下構造:於其中央層(位於多層構造中央位置的層)的兩面,以對稱於中央層之方式,積層一或二層以上同一成分的層。此等樹脂密封片可舉出例如以下之樹脂密封片:由兩層表面層(以下稱為「表層」)與三層內層所成的樹脂密封片中,兩層的表面層為同一成分所成,鄰接表面層之兩層的內層(以下稱為「基(base)層」)為同一成分所成。Further, the resin sealing sheet may have a structure in which one or two or more layers of the same composition are laminated on both sides of the central layer (the layer located at the central position of the multilayer structure) so as to be symmetric with respect to the central layer. The resin sealing sheet may be, for example, a resin sealing sheet comprising two surface layers (hereinafter referred to as "surface layer") and three inner layers, wherein the surface layers of the two layers are the same component. The inner layer (hereinafter referred to as "base layer") of the two layers adjacent to the surface layer is formed of the same component.

具有上述構造之樹脂密封片中,相對於樹脂密封片整體的膜厚,表層的膜厚較佳為5至40%,相對於樹脂密封片整體的膜厚,基層的膜厚較佳為50至90%,相對於樹脂密封片整體的膜厚,基層所夾之內層(以下稱為「核心層」)的膜厚較佳為5至40%。In the resin sealing sheet having the above-described structure, the film thickness of the surface layer is preferably 5 to 40% with respect to the film thickness of the entire resin sealing sheet, and the film thickness of the base layer is preferably 50 to 50 with respect to the film thickness of the entire resin sealing sheet. 90%, the film thickness of the inner layer (hereinafter referred to as "core layer") sandwiched by the base layer is preferably 5 to 40% with respect to the film thickness of the entire resin sealing sheet.

本實施型態之樹脂密封片較佳為至少於表面的一部分施以壓印加工。藉由壓印加工可防止阻塞(耐阻塞性)。進行壓印加工之方法並無特別限定,可使用公知方法。例如可於軟質化之樹脂密封膜表面以壓印輥按壓而賦予壓印形狀。或可使用附有壓印之離型紙而賦予壓印形狀。從壓印之轉印精度的觀點來看,較佳為將樹脂製膜為薄片狀後使其一時地冷卻固化,將前述冷卻固化後之樹脂密封片加熱使其軟化後,再施以壓印加工。此處「軟質化」(亦稱「軟化」)係指可用壓印輥壓印而賦予形狀之狀態,通常可藉由加熱至較樹脂熔點高10℃左右之溫度而軟質化。The resin sealing sheet of this embodiment is preferably subjected to imprint processing at least a part of the surface. Blocking (blocking resistance) is prevented by imprint processing. The method of performing the imprint processing is not particularly limited, and a known method can be used. For example, the surface of the softened resin sealing film can be pressed by a platen roller to give an embossed shape. Alternatively, an embossed release paper may be used to impart an embossed shape. From the viewpoint of transfer precision of imprinting, it is preferred that the resin is formed into a sheet shape and then cooled and solidified at one time, and the resin sealing sheet after cooling and solidification is heated and softened, and then imprinted. machining. Here, "softening" (also referred to as "softening") refers to a state in which a shape can be imparted by imprinting with a platen roller, and it is usually softened by heating to a temperature higher by about 10 ° C than the melting point of the resin.

壓印之形狀及大小並無特別限定,可根據樹脂密封片之用途等而選擇適宜的條件。壓印之形狀(花樣)並無特別限定,例如可列舉:條紋狀、交織狀、斑點狀(satin finished surface)、皮革紋(dermatoglyph)、菱形格狀(diamond lattice)、合成皮革花樣、皺紋花樣、四角椎狀(即金字塔花樣)、四角椎台狀(pyramid frustum)(即梯形杯子花樣)等。壓印加工部較佳為平面部分少者,更佳為壓印之凸部面積比例佔壓印加工部分整體面積之5至50%。The shape and size of the embossing are not particularly limited, and suitable conditions can be selected depending on the use of the resin sealing sheet or the like. The shape (pattern) of the embossing is not particularly limited, and examples thereof include a striped shape, a woven pattern, a satin finished surface, a dermatoglyph, a diamond lattice, a synthetic leather pattern, and a wrinkle pattern. , four-cornered vertebra (ie, pyramid pattern), quadrilateral pyramidal (pyramid frustum) (ie trapezoidal cup pattern). The embossed portion preferably has a small number of planar portions, and more preferably the embossed convex portion has a ratio of 5 to 50% of the total area of the embossed portion.

於樹脂密封片至少單面的一部分施以壓印加工即可,但亦可於樹脂密封片兩面施以壓印加工。從樹脂密封片之耐阻塞性的觀點來看,壓印深度較佳為5至300μm。此處壓印深度是指由壓印形狀凸部至凹部之深度。It is sufficient to apply at least a part of the resin sealing sheet to the embossing process, but it is also possible to apply embossing to both sides of the resin sealing sheet. The embossing depth is preferably from 5 to 300 μm from the viewpoint of the blocking resistance of the resin sealing sheet. The embossing depth here means the depth from the convex portion of the embossed shape to the concave portion.

本實施型態之樹脂密封片可用作為密封各種構件之密封材,但特別適用於作為太陽能電池用樹脂密封片。因本實施型態之樹脂密封片間隙填覆性及耐潛變性優異,故適合用於作為密封太陽能電池的發電元件之密封材。The resin sealing sheet of this embodiment can be used as a sealing material for sealing various members, but is particularly suitable as a resin sealing sheet for solar cells. Since the resin sealing sheet of the present embodiment is excellent in gap filling property and latent resistance, it is suitably used as a sealing material for a power generating element for sealing a solar cell.

本實施型態之樹脂密封片可由如上述之方式而得各種型態,其製法可採用適宜適合之條件。較佳之樹脂密封片製造方法例如可舉出具有以下步驟者:於含有密度0.860至0.910g/cm3 之聚乙烯系樹脂,且不含交聯劑之薄片,照射30kGy以上60kGy以下之電離輻射線。電離輻射線之照射條件可適宜地選擇上述適合條件。此外,可在電離輻射線之照射步驟前後,適宜地組合上述各種的準備步驟及處理步驟等。The resin sealing sheet of the present embodiment can be obtained in various forms as described above, and the production method can be suitably adapted. For example, a method for producing a resin sealing sheet is as follows: a sheet containing a polyethylene resin having a density of 0.860 to 0.910 g/cm 3 and containing no crosslinking agent, and irradiating an ionizing radiation of 30 kGy or more and 60 kGy or less. . The irradiation conditions of the ionizing radiation can be appropriately selected from the above suitable conditions. Further, various preparation steps, processing steps, and the like described above may be appropriately combined before and after the irradiation step of the ionizing radiation.

<太陽能電池模組><Solar battery module>

本實施型態之樹脂密封片可用於太陽能電池模組。第1圖係本實施型態之太陽能電池模組之一樣態的概略截面圖。即本實施型態之太陽能電池模組1至少具有:透光性絕緣基板2、背面絕緣基板3、配置於前述透光性絕緣基板2與背面絕緣基板3之間的發電元件4、及密封前述發電元件4之樹脂密封膜5。The resin sealing sheet of this embodiment can be used for a solar cell module. Fig. 1 is a schematic cross-sectional view showing the same state of the solar cell module of the present embodiment. In other words, the solar cell module 1 of the present embodiment includes at least a translucent insulating substrate 2, a back insulating substrate 3, a power generating element 4 disposed between the translucent insulating substrate 2 and the back insulating substrate 3, and sealing the foregoing. The resin sealing film 5 of the power generating element 4.

作為太陽能電池模組時,太陽能電池模組所含有之樹脂密封片之膠化率(太陽能電池模組化時樹脂密封片之膠化率)並無特別限定,但較佳為0質量%以上未滿1質量%。換句話說,若舉上述第一型態之樹脂密封片作為例子,因不僅可控制太陽能電池模組化前的樹脂密封片的膠化率,且可控制太陽能電池模組化後的樹脂密封片(即太陽能電池模組所含有之樹脂密封片)的膠化率,故可更加提升間隙填覆性、耐潛變性、透明性、色差的安定性。此外,上述之第二型態及第三型態之樹脂密封片可更加提升間隙填覆性、耐潛變性、透明性、色差的安定性係不需贅言。從耐潛變性之觀點來看,太陽能電池模組膠化率的下限值較佳為0質量%以上,更佳為0.2質量%以上。從間隙填覆性,尤其是填覆用厚金屬連線連結的凹凸大之發電元件間隙的觀點來看,太陽能電池模組膠化率的上限值較佳為未滿1質量%,更佳為0.8質量%以下。太陽能電池模組之膠化率可藉由後述實施例所記載之方法測定。When the solar cell module is used, the gelation rate of the resin sealing sheet contained in the solar cell module (the gelation rate of the resin sealing sheet during solar cell module formation) is not particularly limited, but is preferably 0% by mass or more. Full 1% by mass. In other words, if the first type of resin sealing sheet is taken as an example, not only the gelation rate of the resin sealing sheet before the solar cell module can be controlled, but also the resin sealing sheet after the solar cell moduleization can be controlled. (The resin sealing sheet contained in the solar cell module) has a gelation rate, so that the gap filling property, the latent deformation resistance, the transparency, and the chromatic aberration stability can be further improved. Further, the above-mentioned second type and third type of resin sealing sheets can further improve the gap filling property, the latent denaturation resistance, the transparency, and the stability of the chromatic aberration, and need not be said. The lower limit of the gelation rate of the solar cell module is preferably 0% by mass or more, and more preferably 0.2% by mass or more from the viewpoint of resistance to latent denaturation. The upper limit of the gelation rate of the solar cell module is preferably less than 1% by mass, more preferably from the viewpoint of the gap filling property, in particular, the gap of the power generating element which is connected by the thick metal wire. It is 0.8% by mass or less. The gelation rate of the solar cell module can be measured by the method described in the examples below.

(透光性絕緣基板)(translucent insulating substrate)

透光性絕緣基板並無特別限定,但因其位於太陽能電池模組的最表層,故較佳為具有以耐候性、疏水性、耐汙染性、機械強度為主之可確保太陽能電池暴露於屋外的長期信賴性之性能。此外,為了有效活用太陽光,較佳為光學損失少、透明性高之構件。The translucent insulating substrate is not particularly limited. However, since it is located at the outermost layer of the solar cell module, it is preferable to have weather resistance, hydrophobicity, stain resistance, and mechanical strength to ensure that the solar cell is exposed to the outside. Long-term reliability performance. Further, in order to effectively utilize sunlight, a member having less optical loss and high transparency is preferable.

透光性絕緣基板材料可列舉:聚酯樹脂、氟樹脂、丙烯酸樹脂、環狀烯烴(共)聚合物、乙烯-醋酸乙烯共聚物等所成之樹脂薄膜及玻璃基板等,其中,從耐候性、耐衝擊性、成本平衡之觀點來看較佳為玻璃基板。樹脂薄膜特別適合透明性、強度、成本等數點優異之聚酯樹脂,尤其是聚對苯二甲酸乙二酯(polyethylene terephthalate)樹脂。Examples of the light-transmitting insulating substrate material include a resin film formed of a polyester resin, a fluororesin, an acrylic resin, a cyclic olefin (co)polymer, and an ethylene-vinyl acetate copolymer, and a glass substrate, and the like, wherein weather resistance is obtained. From the viewpoint of impact resistance and cost balance, a glass substrate is preferred. The resin film is particularly suitable for polyester resins excellent in transparency, strength, cost, and the like, and particularly polyethylene terephthalate resins.

此外,亦適合使用耐候性特別良好之氟樹脂。具體來說可列舉:四氟乙烯-乙烯共聚物(ETFE)、聚氟乙烯樹脂(PVF)、聚偏二氟乙烯樹脂(PVDF)、聚四氟乙烯樹脂(TFE)、四氟乙烯-六氟丙烯共聚物(FEP)、聚三氟氯乙烯樹脂(CTFE)。從耐候性之觀點來看較佳為聚偏二氟乙烯樹脂,但從使耐候性及機械強度兼顧之觀點來看較佳為四氟乙烯-乙烯共聚物。此外,為了改善與構成樹脂密封片等其他層之材料之間的接著性,較佳為於透光性絕緣基板進行電暈(corona)處理、電漿(plasma)處理。為了提升機械強度可使用施以延伸處理之薄片,例如二軸延伸之聚乙烯薄片。Further, it is also suitable to use a fluororesin which is particularly excellent in weather resistance. Specific examples thereof include tetrafluoroethylene-ethylene copolymer (ETFE), polyvinyl fluoride resin (PVF), polyvinylidene fluoride resin (PVDF), polytetrafluoroethylene resin (TFE), and tetrafluoroethylene-hexafluorocarbon. Propylene copolymer (FEP), polychlorotrifluoroethylene resin (CTFE). From the viewpoint of weather resistance, a polyvinylidene fluoride resin is preferred, but a tetrafluoroethylene-ethylene copolymer is preferred from the viewpoint of achieving both weather resistance and mechanical strength. Further, in order to improve the adhesion to the material constituting the other layer such as the resin sealing sheet, it is preferable to perform a corona treatment or a plasma treatment on the translucent insulating substrate. In order to increase the mechanical strength, a sheet subjected to elongation treatment such as a biaxially stretched polyethylene sheet may be used.

使用玻璃基板作為透光性絕緣基板時,較佳為波長350至1400nm的光之全光穿透率在80%以上,更加為90%以上。一般使用紅外線部吸收少之白板玻璃作為此玻璃基板,但即使是青板玻璃,若厚度在3mm以下則對於太陽能電池模組之輸出特性的影響較少。此外,為了提高玻璃基板之機械強度,可藉由熱處理而得強化玻璃,但亦可使用無熱處理之浮板玻璃(float glass)。為了抑制反射,可於玻璃基板受光面施以防止反射之塗層(coating)。When a glass substrate is used as the light-transmitting insulating substrate, the total light transmittance of light having a wavelength of 350 to 1400 nm is preferably 80% or more, and more preferably 90% or more. In general, white glass having a small absorption in the infrared portion is used as the glass substrate. However, even if the thickness is 3 mm or less, the thickness of the green glass has little influence on the output characteristics of the solar cell module. Further, in order to increase the mechanical strength of the glass substrate, the tempered glass may be obtained by heat treatment, but a float glass having no heat treatment may be used. In order to suppress reflection, a coating for preventing reflection can be applied to the light-receiving surface of the glass substrate.

(背面絕緣基板)(back insulating substrate)

背面絕緣基板並無特別限定,但因其位於太陽能電池模組的最表層,故與上述透光性絕緣基板同樣要求耐候性、機械強度等諸特性。因此可用與透光性絕緣基板同樣的材質構成背面絕緣基板。即透光性絕緣基板可使用之上述各種材料,亦可使用於背面絕緣基板。尤其較佳為使用聚酯樹脂及玻璃基板,其中,從耐候性、成本之觀點來看,更佳為聚對苯二甲酸乙二酯樹脂(PET)。The back insulating substrate is not particularly limited. However, since it is located on the outermost layer of the solar cell module, it is required to have properties such as weather resistance and mechanical strength similarly to the above-mentioned translucent insulating substrate. Therefore, the back insulating substrate can be formed of the same material as that of the translucent insulating substrate. That is, the above various materials which can be used for the translucent insulating substrate can be used for the back insulating substrate. In particular, a polyester resin and a glass substrate are preferably used, and from the viewpoint of weather resistance and cost, polyethylene terephthalate resin (PET) is more preferable.

因背面絕緣基板不須以透過太陽光為前提,故沒有必要要求透光性絕緣基板所需之透明性(透光性)。在此,為了增加太陽能電池模組之機械強度,或是防止溫度變化所造成之彎曲、翹曲而可鋪設補強板。例如較佳可使用鋼板、塑膠板、FRP(玻璃纖維強化塑膠)板等。Since the back insulating substrate does not have to transmit sunlight, it is not necessary to require transparency (transparency) required for the translucent insulating substrate. Here, in order to increase the mechanical strength of the solar cell module, or to prevent bending and warping caused by temperature changes, a reinforcing plate may be laid. For example, a steel plate, a plastic plate, an FRP (glass fiber reinforced plastic) plate or the like can be preferably used.

背面絕緣基板可具有由兩層以上所成之多層構造。多層構造可舉例如以下構造:於中央層的兩面,以對稱中央層之方式積層一或二層以上同一成分的層。具有此等構造者例如可列舉:PET/鋁蒸鍍PET/PET、PVF(商品名「Tedlar」)/PET/PVF、PET/AI箔/PET等。The back insulating substrate may have a multilayer structure composed of two or more layers. The multilayer structure may have, for example, a structure in which one or two or more layers of the same composition are laminated on both sides of the center layer as a symmetrical central layer. Examples of such a structure include PET/aluminum vapor deposition PET/PET, PVF (trade name "Tedlar")/PET/PVF, PET/AI foil/PET, and the like.

(發電元件)(power generation component)

發電元件只要為可利用半導體之光伏效應(photovoltaic effect)而發電者即無特別限定,例如可使用矽(單晶系、多晶系、非晶系(amorphous))、化合物半導體(3-5族、2-6族、其他)等,其中,從發電性能與成本平衡之觀點來看較佳為多晶矽。The power generating element is not particularly limited as long as it is a photovoltaic effect that can utilize a photovoltaic effect, and for example, germanium (single crystal system, polycrystalline system, amorphous), compound semiconductor (3-5 group) can be used. , 2-6, others, etc., among which polycrystalline germanium is preferred from the viewpoint of power generation performance and cost balance.

(太陽能電池模組之製造方法)(Method of manufacturing solar cell module)

本實施型態之太陽能電池模組之製造方法並無特別限定,例如可以藉由以下方式製造:以透光性絕緣基板/樹脂密封片a/發電元件/樹脂密封片b/背面絕緣基板之順序重疊,使用真空積層裝置,以150℃,15分鐘之條件真空積層。尤其較佳為本實施型態之樹脂密封片至少可作樹脂密封片a使用,此樹脂密封片a係填覆發電元件與透光性絕緣基板之間的間隙。因太陽光經過本實施型態之樹脂密封片而到達發電元件,故可對於提升發電效率有顯著的貢獻。The manufacturing method of the solar cell module of the present embodiment is not particularly limited, and can be manufactured, for example, in the order of the translucent insulating substrate/resin sealing sheet a/the power generating element/resin sealing sheet b/back insulating substrate. The layers were superposed by vacuum lamination using a vacuum laminating apparatus at 150 ° C for 15 minutes. In particular, it is preferable that the resin sealing sheet of the present embodiment is used at least as a resin sealing sheet a which fills a gap between the power generating element and the light-transmitting insulating substrate. Since the sunlight passes through the resin sealing sheet of this embodiment and reaches the power generating element, it can contribute significantly to the improvement of power generation efficiency.

太陽能電池模組中,各構件的厚度並無特別限定,但從耐候性、耐衝擊性的觀點來看,透光性絕緣基板的厚度較佳為3mm以上;以絕緣性的觀點來看,背面絕緣基板的厚度較佳為75μm以上;以發電性能與成本平衡的觀點來看,發電元件的厚度較佳為140至250μm;以緩衝性、密封性的觀點來看,樹脂密封片的厚度較佳為250μm以上。In the solar battery module, the thickness of each member is not particularly limited, but the thickness of the light-transmitting insulating substrate is preferably 3 mm or more from the viewpoint of weather resistance and impact resistance, and the back surface is viewed from the viewpoint of insulation. The thickness of the insulating substrate is preferably 75 μm or more; the thickness of the power generating element is preferably from 140 to 250 μm from the viewpoint of balance between power generation performance and cost; and the thickness of the resin sealing sheet is preferably from the viewpoint of cushioning property and sealing property. It is 250 μm or more.

(實施例)(Example)

藉由以下實施例復詳細說明本實施型態,但本實施型態並不受限於以下實施例。The present embodiment will be described in detail by way of the following examples, but the present embodiment is not limited to the following examples.

本實施例所使用之樹脂係如下:The resins used in this example are as follows:

(1) 鏈狀低密度聚乙烯1商品名「AFFINITY EG8200G」,陶氏化學公司製(密度=0.870g/cm3 ,MFR=5.0g/10分鐘,熔點=63℃)(1) Chain-shaped low-density polyethylene 1 trade name "AFFINITY EG8200G", manufactured by The Dow Chemical Co., Ltd. (density = 0.870 g/cm 3 , MFR = 5.0 g/10 min, melting point = 63 ° C)

(2) 鏈狀低密度聚乙烯2商品名「AFFINITY PF1140G」,陶氏化學公司製(密度=0.898g/cm3 、MFR=1.6g/10分鐘,熔點=96℃)(2) Chain-shaped low-density polyethylene 2, trade name "AFFINITY PF1140G", manufactured by The Dow Chemical Co., Ltd. (density = 0.898 g/cm 3 , MFR = 1.6 g/10 min, melting point = 96 ° C)

(3) 鏈狀低密度聚乙烯3商品名「AFFINITY KC8852G」,陶氏化學公司製(密度=0.877g/cm3 ,MFR=3.0g/10分鐘,熔點=68℃)(3) Chain-shaped low-density polyethylene 3 trade name "AFFINITY KC8852G", manufactured by The Dow Chemical Company (density = 0.877 g/cm 3 , MFR = 3.0 g/10 min, melting point = 68 ° C)

(4) 鏈狀低密度聚乙烯4商品名「ENGAGE 8403」,陶氏化學公司製(密度=0.913g/cm3 ,MFR=30g/10分鐘,熔點=107℃)(4) Chain-shaped low-density polyethylene 4, trade name "ENGAGE 8403", manufactured by The Dow Chemical Company (density = 0.913 g/cm 3 , MFR = 30 g/10 min, melting point = 107 ° C)

(5) 含有甲基丙烯酸環氧丙酯(GMA)之乙烯共聚物商品名「Bondfast7B」,住友化學公司製(GMA=12質量%,VA=5質量%,密度=0.950g/cm3 ,MFR=7.0g/10分鐘,熔點=95℃)(5) An ethylene copolymer containing propylene glycol methacrylate (GMA) under the trade name "Bondfast 7B", manufactured by Sumitomo Chemical Co., Ltd. (GMA = 12% by mass, VA = 5% by mass, density = 0.950 g/cm 3 , MFR =7.0 g/10 min, melting point = 95 ° C)

(6) 矽烷偶合劑商品名「KBM503」,信越化學公司製(3-甲基丙烯醯氧基丙基三甲氧基矽烷,比重1.04)以JIS K 7112為基準測定樹脂之密度。(6) The decane coupling agent "KBM503", manufactured by Shin-Etsu Chemical Co., Ltd. (3-methacryloxypropyltrimethoxydecane, specific gravity: 1.04), was measured for the density of the resin based on JIS K 7112.

以JIS K 7121為基準測定樹脂之熔點。The melting point of the resin was measured in accordance with JIS K 7121.

以JIS K 7210為基準測定樹脂之熔融流動速率(MFR;190℃,2.16k kg)。The melt flow rate of the resin (MFR; 190 ° C, 2.16 k kg) was measured in accordance with JIS K 7210.

<實施例1至3、比較例1至8、10(製作樹脂密封片)><Examples 1 to 3, Comparative Examples 1 to 8, 10 (Production of Resin Sealing Sheet)>

使用表1及表2所示之樹脂,並使用三台擠壓機將樹脂熔融,且從接於此擠壓機之環狀模頭(die)將樹酯以管狀熔融擠壓出,將融擠壓出所形成的管朝上,藉由直接膨脹(direct inflation)之方法製膜而得熔融之樹脂密封片。對其吹以冷風使其冷卻固化而得樹脂密封片。接著,將冷卻固化之樹脂密封片藉由紅外線加熱器進行主加熱,並將軟質化之樹脂密封膜通過加壓輥(back-up roller)與壓印輥之間,藉此施以壓印加工(壓印形狀:四角椎台狀,壓印深度:50μm)。將所得之樹脂密封片(壓印片)用EPS-800電子射線照射裝置(日新電機公司製),照射電子射線而進行交聯處理。藉此可得實施例1至3、比較例1至8之三層構造所成之樹脂密封片。同樣使用表3所示之樹脂,並使用三台擠壓機將同一組成之樹脂熔融擠壓出,而得到比較例10之單層構造所成之樹脂密封片。The resin shown in Tables 1 and 2 was used, and the resin was melted using three extruders, and the resin was extruded in a tubular shape from a ring die attached to the extruder. The formed tube was extruded upward, and a molten resin sealing sheet was obtained by a direct inflation method. The resin sealing sheet was obtained by blowing it with cold air to cool and solidify it. Next, the cooled and cured resin sealing sheet is mainly heated by an infrared heater, and the softened resin sealing film is passed between a back-up roller and an impression roller, thereby performing imprint processing. (embossed shape: four-corner pedestal, embossing depth: 50 μm). The obtained resin sealing sheet (embossing sheet) was subjected to crosslinking treatment by irradiating an electron beam with an EPS-800 electron beam irradiation apparatus (manufactured by Nisshin Electric Co., Ltd.). Thus, a resin sealing sheet of the three-layer structure of Examples 1 to 3 and Comparative Examples 1 to 8 was obtained. Similarly, the resin shown in Table 3 was used, and a resin of the same composition was melt-extruded using three extruders to obtain a resin sealing sheet of the single layer structure of Comparative Example 10.

<比較例9(製作使用矽烷改質樹脂之樹脂密封片)><Comparative Example 9 (Preparation of a resin sealing sheet using a decane-modified resin)>

相對於鏈狀低密度聚乙烯2(「AFFINITY PF1140G」;(密度=0.897g/cm3 ,MFR=1.6g/10分鐘,熔點=96℃)98質量%,於其中混合矽烷偶合劑(「KBM503」3-甲基丙烯醯氧基丙基三甲氧基矽烷)2質量%、自由基產生劑之二異苯丙基過氧化物(dicumyl peroxide)0.1質量%,且於200℃加熱熔融攪拌而得矽烷改質樹脂。接著混合矽烷改質樹脂5質量%與鏈狀低密度聚乙烯2(「AFFINITY PF1140G」)95質量%,藉由與比較例10相同之操作,而得比較例9之單層構造所成之樹脂密封片。該樹脂密封片沒有進行交聯處理。Compared with chain low density polyethylene 2 ("AFFINITY PF1140G"; (density = 0.897 g/cm 3 , MFR = 1.6 g/10 min, melting point = 96 ° C) 98% by mass, a decane coupling agent was mixed therein ("KBM503" 2% by mass of 3-methacryloxypropyltrimethoxydecane) and 0.1% by mass of dicumyl peroxide of a radical generator, and heated and melted at 200 ° C to obtain The decane-modified resin was mixed with a decane-modified resin of 5% by mass and a chain-shaped low-density polyethylene 2 ("AFFINITY PF1140G") of 95% by mass, and the same operation as in Comparative Example 10 was carried out to obtain a single layer of Comparative Example 9. The resulting resin sealing sheet was constructed, and the resin sealing sheet was not subjected to crosslinking treatment.

<製作太陽能電池模組><Making a solar cell module>

使用以下所述材料製作太陽能電池模組:所得之樹脂密封片、以AGC公司製之附有壓印之太陽能電池用白板玻璃(厚度3.2mm×寬度700mm×長度1000mm,密封材面有150μm之壓印)作為透明保護材、以E-TON公司製之多晶矽電池(6吋見方×厚度200μm)作為發電元件、以三菱鋁包裝公司製之PVF(厚度40μm)/PET(厚度250μm)/PVF(厚度40μm)作為背面保護材(背板)。配置16枚(4列×4枚)6吋多晶電池,且以透明基板(透明保護材)/樹脂密封片(a)/發電元件(200μm)/樹脂密封片(b)/背板(背面保護材)之順序重疊,使用LM型真空積層裝置(NPC公司製),以150℃預熱5分鐘、壓機10分鐘之積層條件進行真空積層,而可製造太陽能電池模組,並進行各評價試驗。A solar cell module was produced using the following materials: a resin sealing sheet obtained by an AGC company, and a whiteboard glass for embossed solar cells (thickness 3.2 mm × width 700 mm × length 1000 mm, pressure of 150 μm on the sealing material surface) As a transparent protective material, a polycrystalline silicon battery (6 吋 square × thickness 200 μm) manufactured by E-TON Co., Ltd. as a power generation element, PVF (thickness 40 μm) / PET (thickness 250 μm) / PVF (thickness) manufactured by Mitsubishi Aluminum Packaging Co., Ltd. 40 μm) as a backing material (backsheet). 16 (4 columns × 4) 6-inch polycrystalline batteries are arranged, and a transparent substrate (transparent protective material) / resin sealing sheet (a) / power generating element (200 μm) / resin sealing sheet (b) / back sheet (back) In the order of the protective material), the LM type vacuum laminating apparatus (manufactured by NPC Co., Ltd.) was used to preheat the film at 150 ° C for 5 minutes and the laminate was pressed for 10 minutes to form a solar cell module, and each evaluation was performed. test.

<膠化率><gelation rate>

以JIS K 6796為基準,將試料於對二甲苯中沸騰8小時±5分鐘後萃取,如下式所表示,萃取後的試料之不溶解部分對萃取前的試料之比例即為膠化率,此膠化率係用作為樹脂密封片交聯度之基準。Based on JIS K 6796, the sample was boiled in p-xylene for 8 hours ± 5 minutes and then extracted. The ratio of the insoluble portion of the sample after extraction to the sample before extraction was the gelation rate. The gelation rate is used as a basis for the degree of crosslinking of the resin sealing sheet.

膠化率(質量%)=(萃取後試料質量/萃取前試料質量)×100Gelation rate (% by mass) = (sample quality after extraction / sample quality before extraction) × 100

此外使用烤箱(oven),將此樹脂密封片以150℃進行15分之熱歷程(thermal history),並藉由與上述相同之操作而得其膠化率。此膠化率係用作為太陽能電池模組製作後之樹脂密封片交聯度之基準。Further, using an oven, the resin sealing sheet was subjected to a thermal history of 15 minutes at 150 ° C, and its gelation ratio was obtained by the same operation as described above. This gelation rate is used as a benchmark for the degree of crosslinking of the resin sealing sheet after the solar cell module is fabricated.

<150℃懸掛收縮率><150°C suspension shrinkage>

將所得之樹脂密封片切割為寬20mm×長130mm,於距離長方向兩端保留10mm與20mm後之中央100mm長度部分,以粗細為0.5至1.0mm之油性筆畫上表示線。接著以夾子(clip)夾著長方向餘留20mm之端部,並懸掛於150℃烤箱中,於烤箱溫度指示值回歸至150℃之後10分鐘取出,測定表示線間100mm之尺寸變化,並以下式求收縮率。伸長為兩倍以上者(收縮率為-100%以下)係以「流動」表記之。The obtained resin sealing sheet was cut into a width of 20 mm × a length of 130 mm, and a central portion of 100 mm in length after leaving 10 mm and 20 mm at both ends in the longitudinal direction, and a line was indicated by an oily stroke having a thickness of 0.5 to 1.0 mm. Then, the end portion of the long direction remaining 20 mm was sandwiched by a clip, and hung in an oven at 150 ° C, and taken out after the oven temperature indicating value returned to 150 ° C for 10 minutes, and the measurement showed a dimensional change of 100 mm between the lines, and the following The formula is used to reduce the shrinkage rate. Those who have an elongation of more than twice (the shrinkage rate is -100% or less) are recorded as "flowing".

收縮率(%)=100-試驗後表示線間長度(mm)Shrinkage (%) = 100 - after the test, the length between the lines (mm)

<評價發電部分之間隙填覆><Evaluating the gap filling of the power generation part>

以太陽能電池用玻璃板(AGC公司製,白板玻璃5cm×10cm見方:厚度3mm)/樹脂密封片(厚度600μm)/發電部分/樹脂密封片/太陽能電池用玻璃板之順序重疊,使用LM50型真空積層裝置(NPC公司)於150℃真空積層,且以目視確認發電部分的單晶矽電池與樹脂密封片之接觸狀況。於發電部分之單晶矽電池(厚度200μm)的兩面,分別配線有兩條連接線(厚度300μm)。發電部分之形狀為在厚度200μm的電池兩面之其中一部分,存在有300μm凸起部。使得發電部分整體厚度成為200μm至800μm。以目視判定發電部分接觸狀況,並藉由以下基準進行。Glass plate for solar cell (manufactured by AGC, white plate glass 5 cm × 10 cm square: thickness 3 mm) / resin sealing sheet (thickness 600 μm) / power generation portion / resin sealing sheet / glass plate for solar cell overlap, using LM50 vacuum The lamination device (NPC Co., Ltd.) was vacuum-laid at 150 ° C, and the contact state of the single crystal germanium battery of the power generation portion with the resin sealing sheet was visually confirmed. Two connecting wires (thickness: 300 μm) were respectively wired on both sides of a single crystal germanium battery (thickness: 200 μm) in the power generating portion. The shape of the power generating portion was a part of both sides of the battery having a thickness of 200 μm, and a 300 μm convex portion was present. The overall thickness of the power generating portion is made 200 μm to 800 μm. The contact condition of the power generation portion was visually determined and performed by the following criteria.

○:發電部分之單晶矽電池以及連接線,其與樹脂密封片之接觸部分全部良好。○: The single crystal germanium battery and the connecting wire of the power generating portion were all in good contact with the resin sealing sheet.

×:發電部分之單晶矽電池以及連接線,其與樹脂密封片之接觸部分產生間隙。或是積層時密封片因為熱流動而超出玻璃板端部。X: The single crystal germanium battery of the power generation portion and the connecting wire have a gap with the contact portion of the resin sealing sheet. Or when the laminate is laminated, the sealing sheet extends beyond the end of the glass sheet due to heat flow.

<評價耐潛變性><Evaluation of latent resistance>

以太陽能電池用玻璃板(AGC公司製,白板玻璃5cm×10cm見方:厚度3mm)/樹脂密封片/發電部分(單晶矽電池(厚度250μm))/樹脂密封片/太陽能電池用玻璃板之順序重疊,使用LM50型真空積層裝置(NPC公司)進行真空積層,將積層之太陽能電池一邊的玻璃板固定於設定在85℃之恆溫槽的壁面放置24小時,並測定另一邊玻璃板之滑動。Glass plate for solar cell (manufactured by AGC, white plate glass 5 cm × 10 cm square: thickness 3 mm) / resin sealing sheet / power generation portion (single crystal neodymium battery (thickness: 250 μm)) / resin sealing sheet / glass plate for solar cell The LM50 vacuum laminator (NPC Co., Ltd.) was used for vacuum lamination, and the glass plate on one side of the laminated solar cell was fixed to the wall surface of the thermostat set at 85 ° C for 24 hours, and the sliding of the other glass plate was measured.

○:玻璃板的滑動未滿3mm。○: The sliding of the glass plate was less than 3 mm.

×:玻璃板的滑動在3mm以上。×: The sliding of the glass plate was 3 mm or more.

<測定熔融黏彈性及活化能><Measurement of melt viscoelasticity and activation energy>

使用TA儀器公司製多功能SMT流變儀(ARES),在150至250℃之範圍內(刻度50℃)以頻率分散(frequency dispersion)0.1至100弧度(radian)/秒之條件進行熔融黏彈性(儲存模數(G’))的測定。將樣品調整為直徑50mmΦ ,且使用平行板(parallel plate)。Melt viscoelasticity was carried out using a multi-function SMT rheometer (ARES) manufactured by TA Instruments, in the range of 150 to 250 ° C (scale 50 ° C) with a frequency dispersion of 0.1 to 100 radians / sec. (Measurement of storage modulus (G')). The sample was adjusted to a diameter of 50 mm Φ and a parallel plate was used.

藉由所得之儲存模數(G’),依照下述(1)至(3)而算出活化能(ΔH)The activation energy (ΔH) was calculated according to the following (1) to (3) by the obtained storage modulus (G').

(1) 於150℃、200℃、250℃,以頻率範圍10-1至102rad/秒測定儲存模數(G’)。(1) The storage modulus (G') was measured at 150 ° C, 200 ° C, and 250 ° C in the frequency range of 10-1 to 102 rad / sec.

(2) 藉由將所得之各個溫度之儲存模數曲線移動而重疊之原理,而作成基準溫度150℃之主曲線(master curve)。藉此得到各個溫度之平移因子(shift factor)(aT )。(2) The master curve of the reference temperature of 150 ° C is created by the principle of overlapping the stored modulus curves of the respective temperatures. Thereby, a shift factor (a T ) of each temperature is obtained.

(3) 藉由阿瑞尼氏圖(Arrhenius plot)而由所得平移因子求得活化能(ΔH)。(參照式(1))(3) The activation energy (ΔH) is obtained from the obtained translation factor by the Arrhenius plot. (Refer to equation (1))

Log(aT )=(ΔH/R)‧(1/T-1/T0) (1)Log(a T )=(ΔH/R)‧(1/T-1/T0) (1)

aT =相對於基準溫度,溫度T之平移因子a T = translation factor of temperature T relative to the reference temperature

ΔH=活化能(KJ/mol)ΔH=activation energy (KJ/mol)

R=8.31447(J‧K-1 ‧mol-1 )R=8.31447 (J‧K -1 ‧mol -1 )

T=測定溫度(K)T = measured temperature (K)

T0 =基準溫度(K)T 0 = reference temperature (K)

<慕尼黏度><Muni viscosity>

以JIS K 6300-1為基準,藉由上島製作所公司製之慕尼黏度計(MVR)MODEL VR-1130測定。輥形狀用L型輥,以試驗溫度100℃,預熱1分鐘,測定時間4分鐘,旋轉數2RPM測定。此外,依據JIS Z 8401將一次的試驗結果所得值進位至整數位以表示試驗結果。Based on JIS K 6300-1, it was measured by the Murray Viscometer (MVR) MODEL VR-1130 manufactured by Ueshima Manufacturing Co., Ltd. The roll shape was measured by an L-shaped roll at a test temperature of 100 ° C for 1 minute, a measurement time of 4 minutes, and a rotation number of 2 RPM. Further, the values obtained from the test results of one time are rounded to the integer position in accordance with JIS Z 8401 to indicate the test results.

<全光穿透率及霧度><Full light transmittance and haze>

以ASTM D-1003為基準,以日本電色工業公司製之霧度計(濁度計)NDH2000測定。評價用樣品使用如下所製者:以太陽能電池用玻璃板(AGC公司製,白板玻璃5cm×10cm見方:厚度3mm)/樹脂密封片/太陽能電池用玻璃板之順序積層,並使用LM型真空積層裝置(NPC公司製)進行真空積層者。The measurement was carried out by a haze meter (turbidity meter) NDH2000 manufactured by Nippon Denshoku Industries Co., Ltd. based on ASTM D-1003. The evaluation sample was prepared by laminating a glass plate for a solar cell (manufactured by AGC, white plate glass 5 cm × 10 cm square: thickness 3 mm) / resin sealing sheet / glass plate for solar cell, and using LM type vacuum laminate A device (manufactured by NPC Co., Ltd.) performs vacuum lamination.

全光穿透率Tt (=Td+Tp)Total light transmittance Tt (=Td+Tp)

浸射光穿透率Td(Dfs)Dip light transmittance Td(Dfs)

平行光穿透率Tp(P.t)Parallel light transmittance Tp(P.t)

霧度Hz(haze):散射光穿透率[=(全光穿透率-平行光穿透率)/全光穿透率]Haze Hz (haze): scattered light transmittance [= (total light transmittance - parallel light transmittance) / total light transmittance]

藉由上述方法測定起初之樹脂密封片之霧度後,於烤箱內以120℃,120小時處理後再度測定霧度。The haze of the initial resin sealing sheet was measured by the above method, and then the haze was measured again in the oven at 120 ° C for 120 hours.

<色差><color difference>

以JIS Z 8722色測定方法為基準,藉由日本電色工業公司製之色差計Z-300A測定b值。評價用樣品使用如下所製者:以太陽能電池用玻璃板(AGC公司製,白板玻璃5cm×10cm見方:厚度3mm)/樹脂密封片/背板(背面保護材)之順序積層,並使用LM型真空積層裝置(NPC公司)進行真空積層者。The b value was measured by a color difference meter Z-300A manufactured by Nippon Denshoku Industries Co., Ltd. based on the JIS Z 8722 color measurement method. The evaluation sample was prepared by laminating a glass plate for a solar cell (manufactured by AGC, white plate glass 5 cm × 10 cm square: thickness 3 mm) / resin sealing sheet / back sheet (back surface protective material), and using the LM type. A vacuum laminator (NPC) performs vacuum lamination.

藉由上述方法測定起初之樹脂密封片之色差後,於烤箱內以120℃,120小時處理後再度測定色差。The color difference of the original resin sealing sheet was measured by the above method, and then the color difference was measured again in the oven at 120 ° C for 120 hours.

此外,作為一例子,將實施例3中,於150℃、200℃、250℃各溫度所得薄片之儲存模數(G’)繪製為圖表,並示於第2圖。藉此所得之平移因子(aT )示於表4,且所得平移因子之阿瑞尼氏圖示於第3圖。藉此所得之活化能值表示於表1。其他實施例及比較例係藉由相同操作而求得所得活化能(ΔH),其值示於表1、表2、表3。Further, as an example, in Example 3, the storage modulus (G') of the sheets obtained at temperatures of 150 ° C, 200 ° C, and 250 ° C is plotted as a graph and shown in FIG. 2 . The translation factor (a T ) thus obtained is shown in Table 4, and the Arrhenius diagram of the obtained translation factor is shown in Fig. 3. The activation energy values thus obtained are shown in Table 1. In the other examples and comparative examples, the obtained activation energy (ΔH) was obtained by the same operation, and the values are shown in Table 1, Table 2, and Table 3.

各實施例及各比較例之製造條件及評價結果示於表1、表2、表3。The production conditions and evaluation results of the respective examples and comparative examples are shown in Table 1, Table 2, and Table 3.

如表1所示,可確認各實施例之樹脂密封片之間隙填覆性、耐潛變性、加熱處理後的霧度與色差皆優異。另一方面,如表2及表3所示,可確認各比較例之樹脂密封片之各評價結果,其至少有一者為不良。As shown in Table 1, it was confirmed that the resin sealing sheets of the respective examples were excellent in gap filling property, latent resistance, haze after heat treatment, and chromatic aberration. On the other hand, as shown in Table 2 and Table 3, the evaluation results of the resin sealing sheets of the respective comparative examples were confirmed, and at least one of them was defective.

(產業上的可利用性)(industrial availability)

本實施型態之樹脂密封片係具有以下之產業上的可利用性:作為密封構成太陽能電池之發電元件等各種構件之密封材等。The resin sealing sheet of the present embodiment has the following industrial applicability as a sealing material for sealing various members such as a power generating element constituting a solar battery.

1...太陽能電池模組1. . . Solar battery module

2...透光性絕緣基板2. . . Translucent insulating substrate

3...背面絕緣基板3. . . Back insulating substrate

4...發電元件4. . . Power generation component

5...樹脂密封片5. . . Resin sealing sheet

第1圖表示本實施型態太陽能電池模組之一樣態的概略截面圖。Fig. 1 is a schematic cross-sectional view showing the same state of the solar battery module of the present embodiment.

第2圖係實施例3中,以於150℃、200℃、250℃各溫度所得薄片之儲存模數(G’)而繪製的圖表。Fig. 2 is a graph in which the storage modulus (G') of the sheet obtained at each of 150 ° C, 200 ° C, and 250 ° C was plotted in Example 3.

第3圖表示實施例3中所得之平移因子之阿瑞尼氏圖的圖表。Fig. 3 is a graph showing the Arrhenius plot of the translation factor obtained in Example 3.

1...太陽能電池模組1. . . Solar battery module

2...透光性絕緣基板2. . . Translucent insulating substrate

4...發電元件4. . . Power generation component

5...樹脂密封片5. . . Resin sealing sheet

Claims (8)

一種樹脂密封片,其含有密度0.860至0.910g/cm3 之聚乙烯系樹脂,且不含交聯劑,在150℃之溫度下懸掛時收縮率為0至25%,且膠化率為0質量%以上且未滿1質量%。A resin sealing sheet comprising a polyethylene resin having a density of 0.860 to 0.910 g/cm 3 and containing no crosslinking agent, having a shrinkage ratio of 0 to 25% when suspended at a temperature of 150 ° C, and a gelation rate of 0 The mass% or more and less than 1 mass%. 一種樹脂密封片,其含有密度0.860至0.910g/cm3 之聚乙烯系樹脂,且不含交聯劑,慕尼黏度為70至90M。A resin sealing sheet containing a polyethylene resin having a density of 0.860 to 0.910 g/cm 3 and containing no crosslinking agent and having a Mui viscosity of 70 to 90 M. 一種樹脂密封片,其含有密度0.860至0.910g/cm3 之聚乙烯系樹脂,且不含交聯劑,且滿足下述(1)及(2)之條件(1)藉由測定150至250℃之熔融黏彈性而算出之活化能為75至90kJ/mol;(2)於150℃下,以1rad/秒所測定之儲存模數(G,)為6,000至12,000Pa。A resin sealing sheet containing a polyethylene resin having a density of 0.860 to 0.910 g/cm 3 and containing no crosslinking agent, and satisfying the following conditions (1) and (2) (1) by measuring 150 to 250 The activation energy calculated by the melt viscoelasticity of °C is 75 to 90 kJ/mol; and (2) the storage modulus (G,) measured at 1 rad/sec at 150 ° C is 6,000 to 12,000 Pa. 如申請專利範圍第1項至第3項任一項所述之樹脂密封片,其係經施加有交聯處理。 The resin sealing sheet according to any one of claims 1 to 3, which is subjected to a crosslinking treatment. 如申請專利範圍第4項所述之樹脂密封片,其中,前述交聯處理係以電離輻射線照射而實施。 The resin sealing sheet according to claim 4, wherein the crosslinking treatment is carried out by irradiation with ionizing radiation. 如申請專利範圍第5項所述之樹脂密封片,其中,前述電離輻射線照射之電離輻射線照射量係30kGy以上60kGy以下。 The resin sealing sheet according to claim 5, wherein the ionizing radiation irradiated by the ionizing radiation is 30 kGy or more and 60 kGy or less. 一種太陽能電池模組,其具有:透光性絕緣基板、相對向於前述透光性絕緣基板而配置之背面絕緣基板、配置於前述透光性絕緣基板與前述背面絕緣基板間之發電 元件、密封前述發電元件之申請專利範圍第1項至第6項中任一項所述之樹脂密封片。 A solar cell module comprising: a translucent insulating substrate; a back insulating substrate disposed opposite to the translucent insulating substrate; and a power generating disposed between the translucent insulating substrate and the back insulating substrate The resin sealing sheet according to any one of the items 1 to 6 of the invention of the present invention. 如申請專利範圍第7項所述之太陽能電池模組,其中,前述太陽能電池模組所含之前述樹脂密封片之膠化率為0質量%以上且未滿1質量%。 The solar cell module according to claim 7, wherein the resin sealing sheet contained in the solar cell module has a gelation ratio of 0% by mass or more and less than 1% by mass.
TW100130458A 2011-08-25 2011-08-25 Resin sealing sheet and solar cell module TWI474925B (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW584593B (en) * 1998-12-18 2004-04-21 Cryovac Inc Process for manufacturing a bi-axially oriented, heat-shrinkable, polyolefin multi-layer film and film obtained thereby

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW584593B (en) * 1998-12-18 2004-04-21 Cryovac Inc Process for manufacturing a bi-axially oriented, heat-shrinkable, polyolefin multi-layer film and film obtained thereby

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