TWI470290B - Method of making a light guide plate, light guide plate and mask - Google Patents
Method of making a light guide plate, light guide plate and mask Download PDFInfo
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- TWI470290B TWI470290B TW100133633A TW100133633A TWI470290B TW I470290 B TWI470290 B TW I470290B TW 100133633 A TW100133633 A TW 100133633A TW 100133633 A TW100133633 A TW 100133633A TW I470290 B TWI470290 B TW I470290B
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- cover plate
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0065—Manufacturing aspects; Material aspects
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00663—Production of light guides
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
- G02B1/045—Light guides
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/0036—2-D arrangement of prisms, protrusions, indentations or roughened surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
- B29C2045/14868—Pretreatment of the insert, e.g. etching, cleaning
- B29C2045/14885—Pretreatment of the insert, e.g. etching, cleaning by plasma treatment
Description
本發明是有關於一種導光板製造方法,特別是指一種可快速製造出佈有光學微結構的導光板製造方法。The invention relates to a method for manufacturing a light guide plate, in particular to a method for manufacturing a light guide plate with an optical microstructure.
由於液晶顯示器(Liquid Crystal Display,LCD)的液晶面板本身無法主動發光,因此需設置背光模組(Backlight Module)提供液晶顯示器所需光線。背光模組依光源之配置位置可分為直下式背光模組以及側光式背光模組。Since the liquid crystal panel of a liquid crystal display (LCD) cannot be actively illuminated by itself, a backlight module (Backlight Module) is required to provide the light required for the liquid crystal display. The backlight module can be divided into a direct type backlight module and an edge light type backlight module according to the position of the light source.
中華民國第I325502號發明專利揭露一種直下式背光模組的光學擴散板,包含一透明基板及複數光學結構。透明基板厚度為1.5~2毫米(mm)之間,光學結構以印刷式、蝕刻、熱滾壓等方式設置於透明基板的出光面。The invention patent of No. I325502 discloses a light diffusing plate of a direct type backlight module, which comprises a transparent substrate and a plurality of optical structures. The thickness of the transparent substrate is between 1.5 and 2 millimeters (mm), and the optical structure is disposed on the light-emitting surface of the transparent substrate by printing, etching, hot rolling or the like.
有別於直下式背光模組,側光式背光模組是將光源設置於導光板的側邊,透過導光板將光引導照亮整片液晶面板,因此可使用較少光源,節省成本且省電;此外,由於光源設置位置不影響背光模組厚度,因此能夠降低螢幕整體的厚度,側光式背光模組特別適用於講求精巧的可攜式電子產品。Different from the direct-type backlight module, the edge-lit backlight module has a light source disposed on the side of the light guide plate, and the light guide guides the entire liquid crystal panel through the light guide plate, so that less light source can be used, saving cost and saving In addition, since the position of the light source does not affect the thickness of the backlight module, the thickness of the entire screen can be reduced. The edge-lit backlight module is particularly suitable for compact portable electronic products.
側光式背光模組所採用的導光板需滿足薄且光學結構精細的要求,若直接將前述直下式背光模組的光學板的光學結構製作方式應用於側光式背光模組的導光板,則有以下問題:印刷式之網點尺寸及油墨黏度不易控制,產品良 率低而漸被淘汰;現有蝕刻製程是應用於製作模仁,製程包括塗佈光阻、顯影曝光、移除光阻層等,再配合熱印壓方式製造導光板,製程不但繁複且製造出的導光板光學結構大約150微米(μm),無法再突破;熱滾壓則因為採用外加材料,容易產生黃化而影響良率問題。此外,目前還有業界提出噴墨方式產生細點,以及利用雷射刻亮點。但前者與熱滾壓方式同樣有外加材料黃化問題;後者雖可製作出精細之光學結構,但製程相當耗時而無法量產。The light guide plate used in the edge-lit backlight module needs to meet the requirements of thin and fine optical structure. If the optical structure of the optical module of the direct-lit backlight module is directly applied to the light guide plate of the edge-lit backlight module, There are the following problems: the printed dot size and ink viscosity are not easy to control, the product is good The rate is low and gradually eliminated; the existing etching process is applied to the mold, the process includes coating photoresist, developing exposure, removing the photoresist layer, etc., and then manufacturing the light guide plate by hot stamping, the process is not only complicated but also manufactured. The optical structure of the light guide plate is about 150 micrometers (μm), which can no longer be broken. The hot rolling is easy to produce yellowing due to the use of additional materials, which affects the yield problem. In addition, there are still industry-recommended inkjet methods to produce fine spots, as well as the use of laser engraving highlights. However, the former has the same problem of yellowing of the material as the hot rolling method; although the latter can produce a fine optical structure, the process is quite time consuming and cannot be mass-produced.
由以上可知,需要精細光學結構的導光板製造方式,仍有待突破。From the above, it is known that a light guide plate manufacturing method requiring a fine optical structure still needs to be broken.
因此,本發明之目的,即在提供一種可製作出精細之光學結構且適於快速量產的導光板製造方法。Accordingly, it is an object of the present invention to provide a light guide plate manufacturing method which can produce a fine optical structure and is suitable for rapid mass production.
於是,本發明導光板製造方法,包含以下步驟:(A)提供一基板及一蓋設於該基板上的罩板,該罩板設置有多數尺寸為10~150微米的開孔,該基板對應該等開孔處外露;(B)採用電漿蝕刻方式對該基板外露部分表面進行蝕刻;及(C)移除該罩板,該基板即為具有光學結構的導光板。Therefore, the method for manufacturing a light guide plate of the present invention comprises the following steps: (A) providing a substrate and a cover plate covered on the substrate, the cover plate being provided with a plurality of openings having a size of 10 to 150 micrometers, the substrate pair (B) etching the exposed portion of the substrate by plasma etching; and (C) removing the cover plate, which is a light guide plate having an optical structure.
較佳地,該罩板包括一厚度介於10~200微米的金屬層。更佳地,該金屬層材質選自鎳、銅、鋁及不鏽鋼所組成的群組。Preferably, the cover plate comprises a metal layer having a thickness of 10 to 200 microns. More preferably, the metal layer material is selected from the group consisting of nickel, copper, aluminum, and stainless steel.
較佳地,該罩板還包括一貼合於該金屬層底面且厚度介於10~400微米的聚合物層。更佳地,該聚合物層材質選自聚乙烯(PE)、聚對苯二甲酸乙二醇酯(PET)及聚醯亞胺(PI)所組成的群組。Preferably, the cover plate further comprises a polymer layer attached to the bottom surface of the metal layer and having a thickness of 10 to 400 μm. More preferably, the polymer layer material is selected from the group consisting of polyethylene (PE), polyethylene terephthalate (PET), and polyimine (PI).
較佳地,該步驟(B)電漿蝕刻所採用的電極表面呈中央高側邊低的弧形,擺放於該電極上的基板及罩板的側邊因重力或向外伸張的彈簧設計而產生下拉效果,使該基板及罩板密合貼附於該電極上。或者,該步驟(B)電漿蝕刻所採用的電極提供靜電,使該基板及罩板密合貼附於該電極上。或者,該步驟(B)電漿蝕刻所採用的機台兩側設有彈簧及夾具,以夾具夾置於該罩板兩側而對該罩板產生向外且向下拉的力量,藉此緊壓基板而使基板密合貼附於電極上。Preferably, the surface of the electrode used in the plasma etching of the step (B) has a curved shape with a low central side and a side of the substrate and the cover plate disposed on the electrode due to gravity or outward extension. A pull-down effect is generated to adhere the substrate and the cover sheet to the electrode. Alternatively, the electrode used in the step (B) plasma etching provides static electricity so that the substrate and the cover plate are closely attached to the electrode. Alternatively, the step (B) of the plasma etching is provided on both sides of the machine with springs and clamps, and the clamps are placed on both sides of the cover plate to generate outward and downward force on the cover plate, thereby tightening The substrate is pressed to adhere the substrate to the electrode.
為達到量產的目的,該步驟(B)所述電漿蝕刻,是在蝕刻腔室內提供多數層電極,同時製作多數導光板。For the purpose of mass production, the plasma etching in the step (B) is to provide a plurality of layer electrodes in the etching chamber, and at the same time, a plurality of light guide plates are fabricated.
較佳地,本發明所採用罩板的開孔是利用雷射加工形成。Preferably, the opening of the cover plate used in the present invention is formed by laser processing.
較佳地,本發明所採用基板的材質選自聚甲基丙烯酸甲酯(PMMA)及聚對苯二甲酸乙二醇酯(PET)所組成的群組。Preferably, the material of the substrate used in the present invention is selected from the group consisting of polymethyl methacrylate (PMMA) and polyethylene terephthalate (PET).
本發明之另一目的在於提供一種利用前述導光板製造方法所製成之導光板。Another object of the present invention is to provide a light guide plate produced by the above-described light guide plate manufacturing method.
本發明之再一目的在於提供一種用於執行前述導光板製造方法的罩板。本發明之功效在於,利用罩板的設計,搭配電漿蝕刻技術直接製造導光板,無須製作膜仁也無須執行光阻顯影、移除等製程,可快速量產具有精細光學結構的導光板,且適當的電漿蝕刻參數可調整到罩板對基板很高的蝕刻選擇比使得本發明罩板可重複使用,達到便利且節省成本之附加效果。It is still another object of the present invention to provide a cover sheet for performing the above-described method of manufacturing a light guide plate. The utility model has the advantages that the light guide plate can be directly manufactured by using the design of the cover plate and the plasma etching technology, and the light guide plate having the fine optical structure can be mass-produced without the need to fabricate the film core and the process of performing the photoresist development and removal. Appropriate plasma etch parameters can be adjusted to a high etch selectivity of the hood to the substrate such that the hood of the present invention can be reused for a convenient and cost effective addition.
有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之一個較佳實施例的詳細說明中,將可清楚的呈現。The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.
參閱圖1,本發明導光板製造方法之較佳實施例包含以下步驟:Referring to FIG. 1, a preferred embodiment of a method of fabricating a light guide plate of the present invention comprises the following steps:
步驟S1─提供一如圖2中所示的的一基板1及一蓋設於該基板1上的罩板2,使基板1及罩板2貼放於電漿蝕刻系統的電極3上。Step S1 - providing a substrate 1 as shown in FIG. 2 and a cover plate 2 covering the substrate 1 so that the substrate 1 and the cover plate 2 are attached to the electrodes 3 of the plasma etching system.
本實施例所採用基板1的材質可以是聚甲基丙烯酸甲酯(PMMA)或聚對苯二甲酸乙二醇酯(PET)。The material of the substrate 1 used in this embodiment may be polymethyl methacrylate (PMMA) or polyethylene terephthalate (PET).
該罩板2詳細如圖3所示,包括一厚度介於10~200微米的金屬層21、一貼合於該金屬層21底面且厚度介於10~400微米的聚合物層22,及多數貫穿已貼合之金屬層21與聚合物層22的開孔23。基板1對應該等開孔23處因此外露。前述聚合物層22可使整體罩板2對於基板1的密合度更佳,且在後續製程中提供緩衝及穩定的效果。The cover plate 2 is detailed as shown in FIG. 3, and includes a metal layer 21 having a thickness of 10 to 200 μm, a polymer layer 22 attached to the bottom surface of the metal layer 21 and having a thickness of 10 to 400 μm, and a majority The metal layer 21 and the opening 23 of the polymer layer 22 are passed through. The substrate 1 is correspondingly exposed at the opening 23 and thus exposed. The aforementioned polymer layer 22 can make the overall cover 2 have a better adhesion to the substrate 1, and provide a buffering and stabilizing effect in subsequent processes.
罩板2的各該開孔23尺寸介於10~150微米之間,可利用雷射加工或鑽孔機鑽洞形成;由於該罩板2整體厚度相當薄,因此無論採雷射加工或鑽孔機鑽洞,皆能快速完成。Each of the openings 23 of the cover panel 2 has a size between 10 and 150 micrometers, and can be formed by laser processing or drilling machine drilling; since the overall thickness of the cover panel 2 is relatively thin, regardless of the laser processing or drilling The hole drilling machine can be completed quickly.
前述罩板2的金屬層21材質可以是鎳、銅、鋁或不鏽鋼。聚合物層22材質可以是聚乙烯(PE)、聚對苯二甲酸乙二醇酯(PET)或聚醯亞胺(PI)。The material of the metal layer 21 of the cover plate 2 may be nickel, copper, aluminum or stainless steel. The polymer layer 22 may be made of polyethylene (PE), polyethylene terephthalate (PET) or polyimine (PI).
步驟S2-採用電漿蝕刻方式對該基板1外露部分表面進行蝕刻,得到如圖4所示的結果。Step S2: etching the exposed portion of the substrate 1 by plasma etching to obtain a result as shown in FIG.
本實施例藉由控制電漿製程參數-包括電漿氣體種類、電漿氣體流量、腔室4內壓力,以及電極3的電壓等,蝕刻產生出預期的光學結構態樣,例如V型槽、圓柱狀或圓錐狀槽等。此外,藉由適當的電漿蝕刻參數可調整到罩板2對基板1很高的蝕刻選擇比,使得罩板2可重複使用。In this embodiment, by controlling the plasma process parameters including the plasma gas type, the plasma gas flow rate, the pressure in the chamber 4, and the voltage of the electrode 3, etching is performed to produce a desired optical structural state, such as a V-groove, Cylindrical or conical grooves, etc. In addition, the high etching selectivity of the mask 2 to the substrate 1 can be adjusted by appropriate plasma etching parameters so that the mask 2 can be reused.
值得一提的是,本實施例為了提供基板1及罩板2在電極3上之較佳貼附效果,所採用之電極3如圖5所示,其表面呈中央高側邊低的弧形,擺放於該電極3上的基板1及罩板2的側邊因重力G而產生下拉效果,使該基板1及罩板2密合貼附於該電極3上。或者,藉由使電極3提供靜電,該基板1及罩板2因靜電而密合貼附於電極3上。另外,也可如圖6所示,在機台5兩側各設有至少一彈簧51及至少一夾具52,以夾具52夾置於罩板2兩側而對該罩板2產生向外且向下拉的力量,藉此緊壓基板1而使基板1密合貼附於電極3上。It is worth mentioning that, in order to provide a better adhesion effect of the substrate 1 and the cover plate 2 on the electrode 3, the electrode 3 used in the embodiment has a curved surface with a high central side and a low side as shown in FIG. The side of the substrate 1 and the cover 2 placed on the electrode 3 is pulled down by the gravity G, and the substrate 1 and the cover 2 are adhered to the electrode 3. Alternatively, by electrostatically supplying the electrode 3, the substrate 1 and the cover sheet 2 are adhered to the electrode 3 by static electricity. In addition, as shown in FIG. 6, at least one spring 51 and at least one clamp 52 are respectively disposed on both sides of the machine table 5, and the clamp 52 is clamped on both sides of the cover plate 2 to generate outwardly and The force pulled downward is thereby pressed against the substrate 1 to adhere the substrate 1 to the electrode 3.
步驟S3-移除該罩板2,留下如圖7所示的基板,即為具有光學結構10的導光板100。Step S3 - removing the cover 2, leaving the substrate as shown in FIG. 7, which is the light guide 100 having the optical structure 10.
此外,為達到量產的目的,本發明實際操作時,可如圖8所示,在蝕刻腔室4內提供多數層電極3,同時製作多數導光板100。Further, in order to achieve mass production, in the actual operation of the present invention, as shown in FIG. 8, a plurality of layer electrodes 3 may be provided in the etching chamber 4, and a plurality of light guide plates 100 may be fabricated at the same time.
綜上所述,本發明導光板製造方法利用罩板2的設計,搭配電漿蝕刻技術,取代現有技術中執行光阻顯影、移除等製程製作膜仁再熱印壓的繁複製程,更沒有印刷、噴墨、轉印、雷射刻亮點等缺點,可快速量產具有精細光學結構10的導光板100,該導光板100可應用於側光式背光模組或太陽能光電板,且罩板2可重複使用,相當便利且節省成本,故確實能達成本發明之目的。In summary, the method for manufacturing the light guide plate of the present invention utilizes the design of the cover plate 2, and the plasma etching technology, instead of the conventional process of performing photoresist development, removal, etc. Printing, inkjet, transfer, laser engraving and other shortcomings, can quickly mass produce light guide plate 100 with fine optical structure 10, the light guide plate 100 can be applied to edge-light backlight module or solar photovoltaic panel, and cover plate 2 It can be reused, is quite convenient and cost-effective, so it can achieve the object of the present invention.
惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.
1...基板1. . . Substrate
10...光學結構10. . . Optical structure
100...導光板100. . . Light guide
2...罩板2. . . Cover plate
21...金屬層twenty one. . . Metal layer
22...聚合物層twenty two. . . Polymer layer
3...電極3. . . electrode
4...蝕刻腔室4. . . Etching chamber
5...機台5. . . Machine
51...彈簧51. . . spring
52...夾具52. . . Fixture
S1~S3...步驟S1~S3. . . step
圖1是一流程圖,說明本發明導光板製造方法的較佳實施例之步驟;圖2是一說明本實施例執行電漿蝕刻前的示意圖;圖3是一罩板的局部放大示意圖;圖4是一說明本實施例執行電漿蝕刻後的示意圖;圖5是一說明本實施例所採用電極之形狀的示意圖;圖6是一說明本實施例利用彈簧及夾具夾置罩板而使基板密合貼附於電極的示意圖;圖7是一說明本實施例製造出之導光板的示意圖;及圖8是一說明本實施例實際操作上,為達到量產之效果所採用的電極配置型態。1 is a flow chart showing the steps of a preferred embodiment of a method for fabricating a light guide plate of the present invention; FIG. 2 is a schematic view showing a front view of the present embodiment before performing plasma etching; and FIG. 3 is a partially enlarged schematic view of a cover plate; 4 is a schematic view showing the plasma etching after the embodiment is performed; FIG. 5 is a schematic view showing the shape of the electrode used in the embodiment; and FIG. 6 is a view illustrating the substrate by using a spring and a clamp to sandwich the cover plate. FIG. 7 is a schematic view showing a light guide plate manufactured in the embodiment; and FIG. 8 is an electrode configuration type for explaining the effect of mass production in the actual operation of the embodiment. state.
S1~S3...步驟S1~S3. . . step
Claims (12)
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TW100133633A TWI470290B (en) | 2011-01-07 | 2011-09-19 | Method of making a light guide plate, light guide plate and mask |
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TW100133633A TWI470290B (en) | 2011-01-07 | 2011-09-19 | Method of making a light guide plate, light guide plate and mask |
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TWI470290B true TWI470290B (en) | 2015-01-21 |
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EP0260201B1 (en) * | 1986-09-11 | 1992-06-03 | Fairchild Semiconductor Corporation | Plasma etching using a bilayer mask |
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TW200528925A (en) * | 2004-02-20 | 2005-09-01 | Hon Hai Prec Ind Co Ltd | A manufacturing method of a light guide plate |
TW200723397A (en) * | 2005-08-31 | 2007-06-16 | Tokyo Electron Ltd | Device and system for processing substrate |
US20070262051A1 (en) * | 2006-05-12 | 2007-11-15 | Advanced Chip Engineering Technology Inc. | Method of plasma etching with pattern mask |
TW201001014A (en) * | 2009-08-28 | 2010-01-01 | Fu-Yi Lin | Method for manufacturing light guide plate with surface having micro-patterns |
TW201036509A (en) * | 2009-03-17 | 2010-10-01 | Advanced Semiconductor Eng | Structure of embedded-trace substrate and method of manufacturing the same |
TW201102758A (en) * | 2009-07-03 | 2011-01-16 | Univ Nat Cheng Kung | Use method of carbon dioxide laser applied in microstructure |
Family Cites Families (3)
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JP4094439B2 (en) * | 2003-01-27 | 2008-06-04 | Towa株式会社 | Processing method of light guide plate mold |
CN1576899A (en) * | 2003-07-29 | 2005-02-09 | 鸿富锦精密工业(深圳)有限公司 | Method for producing Light conducting plate mould |
TWI272456B (en) * | 2003-08-08 | 2007-02-01 | Hon Hai Prec Ind Co Ltd | Method for making mold of light guide plate |
-
2011
- 2011-06-30 CN CN201110181031.8A patent/CN102590924B/en not_active Expired - Fee Related
- 2011-09-19 TW TW100133633A patent/TWI470290B/en not_active IP Right Cessation
- 2011-10-21 KR KR1020110107970A patent/KR20120080518A/en not_active Application Discontinuation
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EP0260201B1 (en) * | 1986-09-11 | 1992-06-03 | Fairchild Semiconductor Corporation | Plasma etching using a bilayer mask |
US6491835B1 (en) * | 1999-12-20 | 2002-12-10 | Applied Materials, Inc. | Metal mask etching of silicon |
TW200416793A (en) * | 2002-11-26 | 2004-09-01 | Tokyo Electron Ltd | Plasma processing apparatus and method |
TW200528925A (en) * | 2004-02-20 | 2005-09-01 | Hon Hai Prec Ind Co Ltd | A manufacturing method of a light guide plate |
TW200723397A (en) * | 2005-08-31 | 2007-06-16 | Tokyo Electron Ltd | Device and system for processing substrate |
US20070262051A1 (en) * | 2006-05-12 | 2007-11-15 | Advanced Chip Engineering Technology Inc. | Method of plasma etching with pattern mask |
TW201036509A (en) * | 2009-03-17 | 2010-10-01 | Advanced Semiconductor Eng | Structure of embedded-trace substrate and method of manufacturing the same |
TW201102758A (en) * | 2009-07-03 | 2011-01-16 | Univ Nat Cheng Kung | Use method of carbon dioxide laser applied in microstructure |
TW201001014A (en) * | 2009-08-28 | 2010-01-01 | Fu-Yi Lin | Method for manufacturing light guide plate with surface having micro-patterns |
Also Published As
Publication number | Publication date |
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TW201229584A (en) | 2012-07-16 |
KR20120080518A (en) | 2012-07-17 |
CN102590924B (en) | 2014-08-20 |
CN102590924A (en) | 2012-07-18 |
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