TWI470072B - - Google Patents
Info
- Publication number
- TWI470072B TWI470072B TW101101793A TW101101793A TWI470072B TW I470072 B TWI470072 B TW I470072B TW 101101793 A TW101101793 A TW 101101793A TW 101101793 A TW101101793 A TW 101101793A TW I470072 B TWI470072 B TW I470072B
- Authority
- TW
- Taiwan
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101101793A TW201331353A (zh) | 2012-01-17 | 2012-01-17 | 散熱材料、散熱結構、製備方法及其用途 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101101793A TW201331353A (zh) | 2012-01-17 | 2012-01-17 | 散熱材料、散熱結構、製備方法及其用途 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201331353A TW201331353A (zh) | 2013-08-01 |
| TWI470072B true TWI470072B (fr) | 2015-01-21 |
Family
ID=49478884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101101793A TW201331353A (zh) | 2012-01-17 | 2012-01-17 | 散熱材料、散熱結構、製備方法及其用途 |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201331353A (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI756333B (zh) * | 2016-12-28 | 2022-03-01 | 德商羅伯特博斯奇股份有限公司 | 電子模組與方法 |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201538651A (zh) * | 2014-04-02 | 2015-10-16 | Tan Xin Technology Dev Inc | 散熱塗料溶液 |
| TWI495716B (zh) * | 2014-04-29 | 2015-08-11 | 石墨烯散熱結構 | |
| CN105895788A (zh) * | 2014-05-08 | 2016-08-24 | 罗冠杰 | 片式白光发光二极管、制备片式白光发光二极管的方法及封装胶材 |
| JP6566554B2 (ja) * | 2014-08-20 | 2019-08-28 | 昭和電工株式会社 | 積層シートおよび積層シートの製造方法 |
| TWI764785B (zh) * | 2021-07-19 | 2022-05-11 | 勤力合實業股份有限公司 | 均溫導熱塗料及其製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090004389A1 (en) * | 2007-06-29 | 2009-01-01 | Deborah Duen Ling Chung | High-performance interface materials for improving thermal contacts |
| TW201024398A (en) * | 2008-12-23 | 2010-07-01 | Kuo Chun Ying | Nano-scale heat dissipation material |
| CN101815772A (zh) * | 2007-09-14 | 2010-08-25 | 汉高股份两合公司 | 导热组合物 |
| EP1623061B1 (fr) * | 2003-05-09 | 2010-10-27 | Showa Denko K.K. | Fibre de carbone fine lineaire et materiau composite a base de resine utilisant ladite fibre de carbone fine |
| CN102209756A (zh) * | 2008-11-12 | 2011-10-05 | 积水化学工业株式会社 | 金属氧化物微粒分散浆料 |
-
2012
- 2012-01-17 TW TW101101793A patent/TW201331353A/zh unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1623061B1 (fr) * | 2003-05-09 | 2010-10-27 | Showa Denko K.K. | Fibre de carbone fine lineaire et materiau composite a base de resine utilisant ladite fibre de carbone fine |
| US20090004389A1 (en) * | 2007-06-29 | 2009-01-01 | Deborah Duen Ling Chung | High-performance interface materials for improving thermal contacts |
| CN101815772A (zh) * | 2007-09-14 | 2010-08-25 | 汉高股份两合公司 | 导热组合物 |
| CN102209756A (zh) * | 2008-11-12 | 2011-10-05 | 积水化学工业株式会社 | 金属氧化物微粒分散浆料 |
| TW201024398A (en) * | 2008-12-23 | 2010-07-01 | Kuo Chun Ying | Nano-scale heat dissipation material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI756333B (zh) * | 2016-12-28 | 2022-03-01 | 德商羅伯特博斯奇股份有限公司 | 電子模組與方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201331353A (zh) | 2013-08-01 |