TWI469453B - Electrical connector - Google Patents

Electrical connector Download PDF

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Publication number
TWI469453B
TWI469453B TW100107486A TW100107486A TWI469453B TW I469453 B TWI469453 B TW I469453B TW 100107486 A TW100107486 A TW 100107486A TW 100107486 A TW100107486 A TW 100107486A TW I469453 B TWI469453 B TW I469453B
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TW
Taiwan
Prior art keywords
circuit board
conductive
electrical connector
shielding
docking
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TW100107486A
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Chinese (zh)
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TW201238174A (en
Inventor
zhi-cheng Zhang
Zhi-Jian Liu
Li Chun Wu
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Hon Hai Prec Ind Co Ltd
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Priority to TW100107486A priority Critical patent/TWI469453B/en
Publication of TW201238174A publication Critical patent/TW201238174A/en
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Publication of TWI469453B publication Critical patent/TWI469453B/en

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Description

電連接器 Electrical connector

本發明涉及一種電連接器,特別係涉及一種設有竪直並左右間隔設置的電路板的電連接器。 The present invention relates to an electrical connector, and more particularly to an electrical connector having vertical and left and right spaced circuit boards.

網絡接口連接器RJ45用於高速傳輸時,需要設置濾波元件及進行防串音干擾設計,對於具有堆疊設置的上、下接口的RJ45,通常設有竪直的兩內置電路板,用以承載濾波元件,上、下接口的對接端子則延伸至對應的內置電路板並焊接於對應的內置電路板,此時上、下接口的對接端子往往延伸較長且彼此間距離較近,端子間的串擾較強,如何才能方便地進行抑制端子間串擾的設計係一個難點。 When the network interface connector RJ45 is used for high-speed transmission, it is necessary to set the filter component and prevent crosstalk interference design. For the RJ45 with the upper and lower interfaces of the stack setting, there are usually two vertical built-in circuit boards for carrying the filter. The mating terminals of the upper and lower interfaces extend to the corresponding built-in circuit board and are soldered to the corresponding built-in circuit board. At this time, the mating terminals of the upper and lower interfaces tend to extend longer and are closer to each other, and crosstalk between the terminals Strong, how to conveniently carry out the design of suppressing crosstalk between terminals is a difficult point.

本發明所要解決的技術問題係提供一種便於所設有的對接模組進行抗串音干擾設計的電連接器。 The technical problem to be solved by the present invention is to provide an electrical connector that facilitates the anti-crosstalk interference design of the docking module provided.

為解決以上技術問題,本發明提供一種電連接器,其形成有堆疊的上、下對接端口,所述電連接器包括對接模組及竪直並左右間隔設置的第一、二電路板,所述對接模組設有可與插入上對接端口的對接連接器對接的複數上側觸接部及可與插入下對接端口的對接連接器對接的複數下側觸接部,所述對接模組還包括電性連接於複數所述上側觸接部與第一電路板之間的上側電路板及電性 連接於複數所述下側觸接部與第二電路板之間的下側電路板,所述上、下側電路板均設有用於接地的接地點。 In order to solve the above problems, the present invention provides an electrical connector formed with stacked upper and lower docking ports, the electrical connector including a docking module and first and second circuit boards vertically and vertically spaced apart. The docking module is provided with a plurality of upper side contact portions that can be docked with the mating connector inserted into the docking port, and a plurality of lower side contact portions that can be docked with the mating connector inserted into the lower docking port, the docking module further includes Electrically connecting to an upper circuit board between the plurality of upper contact portions and the first circuit board and electrical Connected to a lower circuit board between the lower contact portion and the second circuit board, the upper and lower circuit boards are each provided with a grounding point for grounding.

本創作中上、下側電路板及其用於接地的接地點的設置,便於對接模組進行抗串音干擾設計,提高電連接器的電氣性能。 The upper and lower circuit boards and the grounding points for grounding in the creation facilitate the cross-talking design of the docking module and improve the electrical performance of the electrical connector.

以下結合圖式及實施方式對本創作進一步說明。 The present invention will be further described below in conjunction with the drawings and embodiments.

100‧‧‧電連接器 100‧‧‧Electrical connector

101‧‧‧外部設備 101‧‧‧External equipment

102‧‧‧上對接端口 102‧‧‧Upper docking port

103‧‧‧下對接端口 103‧‧‧Docking port

20‧‧‧前端壁 20‧‧‧ front wall

200‧‧‧通口 200‧‧‧ mouth

201‧‧‧第一槽部 201‧‧‧First groove

202‧‧‧第二槽部 202‧‧‧Second trough

21‧‧‧兩側壁 21‧‧‧Two side walls

22‧‧‧間隔壁 22‧‧‧ partition wall

23‧‧‧頂壁 23‧‧‧ top wall

230‧‧‧第二開槽 230‧‧‧Second slotting

24‧‧‧收容空間 24‧‧‧ accommodating space

25‧‧‧上側對接空間 25‧‧‧Upper docking space

26‧‧‧下側對接空間 26‧‧‧Under docking space

3‧‧‧竪直屏蔽體 3‧‧‧Vertical shield

4‧‧‧插入組件 4‧‧‧Insert components

5‧‧‧端子模組 5‧‧‧Terminal module

50‧‧‧對接模組 50‧‧‧Docking module

51‧‧‧上側屏蔽元件 51‧‧‧Upper shielding element

510‧‧‧第一通槽 510‧‧‧ first through slot

511‧‧‧第一凹部 511‧‧‧ first recess

512‧‧‧第一缺角 512‧‧‧First corner

52‧‧‧下側屏蔽元件 52‧‧‧Bottom shielding element

520‧‧‧第二通槽 520‧‧‧Second pass

521‧‧‧第二凹部 521‧‧‧Second recess

522‧‧‧第二缺角 522‧‧‧second corner

53‧‧‧電子模組 53‧‧‧Electronic module

530‧‧‧第一電路板 530‧‧‧First board

531‧‧‧第二電路板 531‧‧‧second circuit board

5310‧‧‧水平開槽 5310‧‧‧ horizontal slotting

5311、5413、5433‧‧‧導電片 5311, 5413, 5433‧‧‧ conductive sheets

5312‧‧‧接地區域 5312‧‧‧ Grounding area

532‧‧‧中間支架 532‧‧‧ intermediate bracket

5320‧‧‧開口 5320‧‧‧ openings

5321‧‧‧第一半絕緣支架 5321‧‧‧First half insulated bracket

5322‧‧‧第二半絕緣支架 5322‧‧‧Second half insulated bracket

5323‧‧‧中間屏蔽片 5323‧‧‧Intermediate shielding film

5324‧‧‧第一磁性元件 5324‧‧‧First magnetic component

5325‧‧‧翻邊 5325‧‧‧Flanging

5326‧‧‧第一接地臂 5326‧‧‧First grounding arm

5327‧‧‧第二接地臂 5327‧‧‧Second grounding arm

5328‧‧‧第二接地腳 5328‧‧‧Second grounding foot

533‧‧‧轉接模組 533‧‧‧Transfer module

5330‧‧‧第一轉接端子 5330‧‧‧First adapter terminal

5331‧‧‧第二轉接端子 5331‧‧‧Second transfer terminal

5332‧‧‧轉接承載體 5332‧‧‧Transfer carrier

540‧‧‧上側對接端子 540‧‧‧Upper butt terminal

5400‧‧‧上側觸接部 5400‧‧‧Upper contact

5401‧‧‧上側連接部 5401‧‧‧Upper connection

541‧‧‧上側電路板 541‧‧‧Upper board

5410‧‧‧第一導電線路 5410‧‧‧First conductive line

5411‧‧‧第二導電線路 5411‧‧‧Second conductive line

5412‧‧‧第一導電邊緣 5412‧‧‧First conductive edge

5414、5434‧‧‧接地點 5414, 5434‧‧‧ Grounding point

5415‧‧‧第六開槽 5415‧‧‧6th slot

542‧‧‧下側對接端子 542‧‧‧Bottom docking terminal

5420‧‧‧下側觸接部 5420‧‧‧Bottom contact

5421‧‧‧下側連接部 5421‧‧‧Bottom connection

543‧‧‧下側電路板 543‧‧‧lower circuit board

5430‧‧‧第三導電線路 5430‧‧‧ Third conductive line

5431‧‧‧第四導電線路 5431‧‧‧4th conductive line

5432‧‧‧第二導電邊緣 5432‧‧‧Second conductive edge

5435‧‧‧第七開槽 5435‧‧‧ seventh slot

544‧‧‧絕緣載體 544‧‧‧Insulation carrier

5440‧‧‧第四開槽 5440‧‧‧fourth slot

545‧‧‧上側絕緣體 545‧‧‧Upper insulator

546‧‧‧下側絕緣體 546‧‧‧Bottom insulator

547‧‧‧前屏蔽片 547‧‧‧ Front shield

5470‧‧‧第五開槽 5470‧‧‧5th slot

5471‧‧‧止擋部 5471‧‧‧stop

548‧‧‧上側固持空間 548‧‧‧Upper holding space

549‧‧‧下側固持空間 549‧‧‧Lower holding space

550‧‧‧上側接地部 550‧‧‧Upper grounding

551‧‧‧下側接地部 551‧‧‧Bottom grounding

552‧‧‧屏蔽片開口 552‧‧‧Shield opening

553‧‧‧第一連通部 553‧‧‧The first communication department

5536‧‧‧第一定位部 5536‧‧‧First Positioning Department

5537‧‧‧第二定位部 5537‧‧‧Second Positioning Department

5538‧‧‧第三定位部 5538‧‧‧The third positioning department

5539‧‧‧第四定位部 5539‧‧‧Four Positioning Department

554‧‧‧第二連通部 554‧‧‧Second communication department

555‧‧‧固定臂 555‧‧‧Fixed Arm

556‧‧‧固定端 556‧‧‧ fixed end

6‧‧‧底部電路板 6‧‧‧Bottom board

7‧‧‧屏蔽殼體 7‧‧‧Shield housing

70‧‧‧前殼體 70‧‧‧ front housing

71‧‧‧後殼體 71‧‧‧ Rear housing

72‧‧‧殼前壁 72‧‧‧The front wall of the shell

73‧‧‧殼頂壁 73‧‧‧shell top wall

730‧‧‧殼頂壁前部分 730‧‧‧ front part of the top wall of the shell

731‧‧‧殼頂壁後部分 731‧‧‧The rear part of the top wall of the shell

74‧‧‧殼後壁 74‧‧‧ behind the shell

75‧‧‧殼兩側壁 75‧‧‧Two side walls of the shell

750‧‧‧殼兩側壁前部分 750‧‧‧ front part of the side wall of the shell

751‧‧‧殼兩側壁後部分 751‧‧‧The rear part of the two side walls of the shell

76‧‧‧配合槽 76‧‧‧With slot

77‧‧‧第三接地腳 77‧‧‧ Third grounding foot

8‧‧‧屏蔽圈組件 8‧‧‧Shielding ring assembly

90、91‧‧‧導電襯墊 90, 91‧‧‧ conductive pads

900、910‧‧‧導電棉 900, 910‧‧‧ conductive cotton

901、911‧‧‧導電布 901, 911‧‧‧ conductive cloth

912‧‧‧配合口 912‧‧‧With the mouth

第一圖係本創作電連接器安裝於外部設備的立體組合圖。 The first figure is a three-dimensional combination diagram of the present electrical connector mounted on an external device.

第二圖係本創作電連接器屏蔽殼體的立體組合圖。 The second figure is a three-dimensional combination diagram of the shield housing of the present electrical connector.

第三圖係本創作電連接器的分解圖。 The third figure is an exploded view of the present electrical connector.

第四圖係本創作電連接器另一視角的立體組合圖。 The fourth figure is a three-dimensional combination diagram of another perspective of the present electrical connector.

第五圖係本創作電連接器沿第一圖中V-V線的剖視圖。 The fifth figure is a cross-sectional view of the present electrical connector along the line V-V in the first figure.

第六圖係本創作電連接器去除屏蔽殼體後的部分分解圖。 The sixth figure is a partial exploded view of the present electrical connector after removing the shield case.

第七圖係本創作電連接器絕緣本體的立體視圖。 The seventh figure is a perspective view of the insulative body of the present electrical connector.

第八圖係本創作電連接器端子模組一視角的立體組合圖。 The eighth figure is a three-dimensional combination view of the perspective of the terminal module of the present electrical connector.

第九圖係本創作電連接器端子模組另一視角的立體組合圖。 The ninth figure is a three-dimensional combination view of another perspective of the terminal module of the present electrical connector.

第十圖係本創作電連接器端子模組的分解圖。 The tenth figure is an exploded view of the terminal module of the present electrical connector.

第十一圖係本創作電連接器端子模組一視角的初步分解圖。 The eleventh figure is a preliminary exploded view of a perspective view of the terminal module of the present electrical connector.

第十二圖係本創作電連接器端子模組另一視角的初步分解圖。 The twelfth figure is a preliminary exploded view of another perspective of the terminal module of the present electrical connector.

第十三圖係本創作電連接器端子模組的爆炸圖。 The thirteenth figure is an exploded view of the terminal module of the present electrical connector.

第十四圖係本創作電連接器對接模組一視角的分解圖。 The fourteenth figure is an exploded view of a perspective view of the docking module of the present electrical connector.

第十五圖係本創作電連接器對接模組另一視角的分解圖。 The fifteenth figure is an exploded view of another perspective of the docking module of the present electrical connector.

第十六圖係本創作電連接器第一對接端子組與第一子電路板相分離後的視圖。 Figure 16 is a view showing the first butt terminal group of the present electrical connector separated from the first sub-board.

第十七圖係本創作電連接器第二對接端子組與第二子電路板相分離後的視圖。 Figure 17 is a view showing the second butt terminal group of the present electrical connector separated from the second sub-board.

請參閱第一圖至第四圖所示,一種符合本創作的2×N型電連接器100,其為RJ45連接器,其可供對接連接器(未圖示)自前向後插入對接並可安裝於外部設備101,所述電連接器100形成有堆疊的上、下對接端口102、103,所述電連接器100設有絕緣本體2、安裝於絕緣本體2的竪直屏蔽體3、安裝於絕緣本體2的端子模組5、安裝於端子模組5底部的底部電路板6、導電襯墊(導電襯墊90及導電襯墊91)、設於電連接器100外部的屏蔽殼體7及套設於屏蔽殼體7前端的屏蔽圈組件8。 Referring to the first to fourth figures, a 2×N type electrical connector 100 conforming to the present invention is an RJ45 connector, which can be docked and mounted from the front to the rear of the docking connector (not shown). In the external device 101, the electrical connector 100 is formed with stacked upper and lower docking ports 102, 103. The electrical connector 100 is provided with an insulating body 2, a vertical shielding body 3 mounted on the insulating body 2, and is mounted on a terminal module 5 of the insulative housing 2, a bottom circuit board 6 mounted on the bottom of the terminal module 5, a conductive pad (conductive pad 90 and conductive pad 91), a shield case 7 disposed outside the electrical connector 100, and A shielding ring assembly 8 is disposed on the front end of the shielding case 7.

請參閱第五圖及第七圖所示,所述絕緣本體2設有前端壁20、兩側壁21、位於兩側壁21之間且並列設置的複數間隔壁22、頂壁23。前端壁20設有貫通前端壁20前後兩側並位於上對接端口102與下對接端口103之間的通口200。導電襯墊90收容於所述通口200。所述通口200水平設置,呈前大後小的結構,通口200包括自前端壁20前面向後延伸的第一槽部201及自第一槽部201向後延伸的第二槽部202。所述第一槽部201在上下方向的尺寸大於第二槽部202。所述頂壁23設有貫通頂壁23上下兩側的第二開槽230,所述第二開槽230自頂壁23的後端向前延伸。所述絕緣本體2的後部形成有收容空間24,絕緣本體2的前部形成有可收容對接連接器的 上側對接空間25及下側對接空間26,所述間隔壁22將左右相鄰的兩對上、下側對接空間25、26間隔開。 Referring to the fifth and seventh figures, the insulative housing 2 is provided with a front end wall 20, two side walls 21, a plurality of partition walls 22 and a top wall 23 disposed between the side walls 21 and juxtaposed. The front end wall 20 is provided with a through opening 200 penetrating the front and rear sides of the front end wall 20 and between the upper docking port 102 and the lower docking port 103. A conductive gasket 90 is received in the through port 200. The through-port 200 is horizontally disposed, and has a front large and small structure. The through-port 200 includes a first groove portion 201 extending rearward from the front end wall 20 and a second groove portion 202 extending rearward from the first groove portion 201. The first groove portion 201 has a larger dimension in the up and down direction than the second groove portion 202. The top wall 23 is provided with a second slot 230 extending through the upper and lower sides of the top wall 23, and the second slot 230 extends forward from the rear end of the top wall 23. The rear portion of the insulative housing 2 is formed with a receiving space 24, and the front portion of the insulative housing 2 is formed with a docking connector. The upper docking space 25 and the lower docking space 26 partition the two pairs of upper and lower adjacent docking spaces 25, 26 adjacent to each other.

請參閱第八圖至第十圖所示,所述端子模組5包括對接模組50、上側屏蔽元件51、下側屏蔽元件52及與對接模組50電性連接的電子模組53。端子模組5收容於絕緣本體2,對接模組50組裝於電子模組53的前部,上、下側屏蔽元件51、52也組裝於電子模組53的前部。 As shown in FIG. 8 to FIG. 10 , the terminal module 5 includes a docking module 50 , an upper shielding component 51 , a lower shielding component 52 , and an electronic module 53 electrically connected to the docking module 50 . The terminal module 5 is housed in the insulative housing 2, the docking module 50 is assembled to the front of the electronic module 53, and the upper and lower shield members 51, 52 are also assembled to the front of the electronic module 53.

請參閱第十四圖及第十五圖所示,對接模組50包括上側絕緣體545、複數上側對接端子540、上側電路板541、下側絕緣體546、複數下側對接端子542、下側電路板543、承載上、下側電路板541、543的絕緣載體544及前屏蔽片547。所述複數上側對接端子540與上側絕緣體545一體成型構成上側對接端子組,上側對接端子組形成有上側固持空間548,所述上側電路板541的前端插入並固持於所述上側固持空間548。所述複數下側對接端子542與下側絕緣體546一體成型構成下側對接端子組,下側對接端子組形成有下側固持空間549,所述下側電路板543的前端插入並固持於所述下側固持空間549。所述上側電路板541承載於絕緣載體544的上側,所述下側電路板543承載於絕緣載體544的下側。所述上、下側電路板541、543及前屏蔽片547皆水平設置,前屏蔽片547設於上側電路板541與下側電路板543之間,上、下側電路板541、543皆位於上側屏蔽元件51與下側屏蔽元件52之間。絕緣載體544設有貫通絕緣載體544前後兩側的第四開槽5440,所述前屏蔽片547插入所述第四開槽5440,前屏蔽片547的前後兩端皆超出第四開槽5440,前屏蔽片547設有位於前屏蔽片547左右兩側的止擋部 5471及自前屏蔽片547的後端向前延伸形成且貫通前屏蔽片547上下兩側的第五開槽5470。所述前屏蔽片547自後向前插入第四開槽5440,前屏蔽片547左右兩側的止擋部5471被止擋於絕緣載體544,以控制前屏蔽片547的插入深度。 Referring to FIG. 14 and FIG. 15 , the docking module 50 includes an upper insulator 545 , a plurality of upper docking terminals 540 , an upper circuit board 541 , a lower insulator 546 , a plurality of lower docking terminals 542 , and a lower circuit board. 543. An insulating carrier 544 and a front shielding sheet 547 carrying the upper and lower circuit boards 541 and 543. The upper upper butt terminal 540 and the upper insulator 545 are integrally formed to form an upper docking terminal group, and the upper docking terminal group is formed with an upper holding space 548. The front end of the upper circuit board 541 is inserted into and held by the upper holding space 548. The plurality of lower-side docking terminals 542 and the lower insulator 546 are integrally formed to form a lower-side docking terminal group, and the lower-side docking terminal group is formed with a lower-side holding space 549, and the front end of the lower-side circuit board 543 is inserted and held in the The lower side holds the space 549. The upper circuit board 541 is carried on the upper side of the insulating carrier 544, and the lower circuit board 543 is carried on the lower side of the insulating carrier 544. The upper and lower circuit boards 541 and 543 and the front shielding sheet 547 are horizontally disposed. The front shielding sheet 547 is disposed between the upper circuit board 541 and the lower circuit board 543, and the upper and lower circuit boards 541 and 543 are located. Between the upper shield member 51 and the lower shield member 52. The insulating carrier 544 is provided with a fourth slot 5440 extending through the front and rear sides of the insulating carrier 544. The front shielding piece 547 is inserted into the fourth slot 5440, and the front and rear ends of the front shielding piece 547 are beyond the fourth slot 5440. The front shielding piece 547 is provided with a stop portion on the left and right sides of the front shielding piece 547 The rear end of the front shielding piece 547 extends forwardly and extends through the fifth slot 5470 of the upper and lower sides of the front shielding piece 547. The front shielding piece 547 is inserted into the fourth slot 5440 from the rear to the front, and the stoppers 5471 on the left and right sides of the front shielding piece 547 are stopped by the insulating carrier 544 to control the insertion depth of the front shielding piece 547.

請參閱第十四圖至第十六圖所示,上側對接端子540包括上側觸接部5400及電性連接於上側電路板541與上側觸接部5400之間的上側連接部5401。上側觸接部5400可與插入上對接端口102的對接連接器對接,上側觸接部5400呈傾斜延伸的懸臂狀,上側觸接部5400對應與上側電路板541電性連通。所述上側觸接部5400位於上側電路板541的上側,上側連接部5401自上側觸接部5400延伸並直接電連接於上側電路板541的下側,於本實施方式中,上側連接部5401焊接於上側電路板541的下表面,當然也可係電性接觸。上側電路板541設有電性連接於複數所述上側觸接部5400與電子模組53(容後詳述)之間的複數導電線路(未標號)、屏蔽層(未圖示)、第一導電邊緣5412、用於接地的接地點5414及自上側電路板541的後端向前延伸形成且貫通上側電路板541上下兩側的第六開槽5415。上側電路板541的導電線路包括與部分上側連接部5401對應電性連通的複數第一導電線路5410及與另一部分上側連接部5401對應電性連通的複數第二導電線路5411,第一導電線路5410位於上側電路板541屏蔽層的上側,第二導電線路5411位於上側電路板541屏蔽層的下側,上側電路板541屏蔽層提供第一導電線路5410與第二導電線路5411之間的電磁干擾隔離,抑制第一導電線路5410與第二導電線路5411之間的串音干擾。所述第一導電邊緣5412的上下兩側均設有複數導電片5413,所述第一導電邊緣5412的導電片5413與上側電路板541的導電線路電性 連接。上側電路板541屏蔽層與接地點5414電性連通,接地點5414接地後將上側電路板541的屏蔽層接地。於本實施方式中接地點5414設於上側電路板541的上表面。 Referring to FIGS. 14 to 16 , the upper docking terminal 540 includes an upper contact portion 5400 and an upper connecting portion 5401 electrically connected between the upper circuit board 541 and the upper contact portion 5400 . The upper contact portion 5400 can be in abutment with the mating connector inserted into the upper docking port 102. The upper contact portion 5400 has a cantilever shape extending obliquely. The upper contact portion 5400 is electrically connected to the upper circuit board 541. The upper side contact portion 5400 is located on the upper side of the upper circuit board 541, and the upper side connecting portion 5401 extends from the upper side contact portion 5400 and is directly electrically connected to the lower side of the upper circuit board 541. In the present embodiment, the upper side connecting portion 5401 is soldered. On the lower surface of the upper circuit board 541, it is of course also possible to make electrical contact. The upper circuit board 541 is provided with a plurality of conductive lines (not labeled) electrically connected between the upper contact portion 5400 and the electronic module 53 (described in detail later), a shielding layer (not shown), and the first The conductive edge 5412, the grounding point 5414 for grounding, and the rear end of the upper circuit board 541 extend forwardly and penetrate the sixth slot 5415 on the upper and lower sides of the upper circuit board 541. The conductive circuit of the upper circuit board 541 includes a plurality of first conductive lines 5410 electrically connected to the upper portion of the upper connecting portion 5401 and a plurality of second conductive lines 5411 electrically connected to the other portion of the upper connecting portion 5401. The first conductive line 5410 The second conductive line 5411 is located on the lower side of the shielding layer of the upper circuit board 541, and the shielding layer of the upper circuit board 541 provides electromagnetic interference isolation between the first conductive line 5410 and the second conductive line 5411. The crosstalk interference between the first conductive line 5410 and the second conductive line 5411 is suppressed. The upper and lower sides of the first conductive edge 5412 are provided with a plurality of conductive sheets 5413, and the conductive strips of the first conductive edges 5412 and the upper circuit board 541 are electrically conductive. connection. The shielding layer of the upper circuit board 541 is electrically connected to the grounding point 5414. After the grounding point 5414 is grounded, the shielding layer of the upper circuit board 541 is grounded. In the present embodiment, the grounding point 5414 is provided on the upper surface of the upper circuit board 541.

請參閱第十四圖至第十七圖所示,下側對接端子542包括下側觸接部5420及電性連接於下側電路板543與下側觸接部5420之間的下側連接部5421。下側觸接部5420可與插入下對接端口103的對接連接器對接,下側觸接部5420呈傾斜延伸的懸臂狀,下側觸接部5420對應與下側電路板543電性連通。所述下側觸接部5420位於下側電路板543的下側,下側連接部5421自下側觸接部5420延伸並直接電連接於下側電路板543的上側,於本實施方式中,下側連接部5421焊接於下側電路板543的上表面,當然也可係電性接觸。下側電路板543設有電性連接於複數所述下側觸接部5420與電子模組53(容後詳述)之間的複數導電線路(未標號)、屏蔽層(未圖示)、第二導電邊緣5432、用於接地的接地點5434及自下側電路板543的後端向前延伸形成且貫通下側電路板543上下兩側的第七開槽5435。下側電路板543的導電線路包括與部分下側連接部5421對應電性連通的複數第三導電線路5430、與另一部分下側連接部5421對應電性連通的複數第四導電線路5431,第三導電線路5430位於下側電路板543屏蔽層的下側,第四導電線路5431位於下側電路板543屏蔽層的上側,下側電路板543屏蔽層提供第三導電線路5430與第四導電線路5431之間的電磁干擾隔離,抑制第三導電線路5430與第四導電線路5431之間的串音干擾。所述第二導電邊緣5432的上下兩側均設有複數導電片5433,所述導電片5433與下側電路板543的導電線路電性連接。下側電路板543屏蔽層與接地點5434電性連通,接地點5434接地後將下側電路板 543的屏蔽層接地。於本實施方式中接地點5434設於下側電路板543的下表面。前屏蔽片547處於上側觸接部5400與下側觸接部5420之間,可抑制上側觸接部5400與下側觸接部5420之間的電磁干擾。上、下側電路板541、543皆延伸入上對接端口102與下對接端口103之間,上、下側電路板541、543所設的屏蔽層可抑制上對接端口102與下對接端口103之間的電磁干擾。 Referring to FIGS. 14 to 17 , the lower docking terminal 542 includes a lower contact portion 5420 and a lower connection portion electrically connected between the lower circuit board 543 and the lower contact portion 5420. 5421. The lower contact portion 5420 can be docked with the mating connector inserted into the lower docking port 103, the lower contact portion 5420 is cantilevered, and the lower contact portion 5420 is electrically connected to the lower circuit board 543. The lower side contact portion 5420 is located on the lower side of the lower circuit board 543, and the lower side connecting portion 5421 extends from the lower side contact portion 5420 and is directly electrically connected to the upper side of the lower circuit board 543. In this embodiment, The lower connecting portion 5421 is soldered to the upper surface of the lower circuit board 543, and may of course be electrically contacted. The lower circuit board 543 is provided with a plurality of conductive lines (not labeled) and a shielding layer (not shown) electrically connected between the plurality of lower contact portions 5420 and the electronic module 53 (described in detail later). The second conductive edge 5432, the grounding point 5434 for grounding, and the seventh slot 5435 extending from the rear end of the lower circuit board 543 and extending through the upper and lower sides of the lower circuit board 543. The conductive circuit of the lower circuit board 543 includes a plurality of third conductive lines 5430 electrically connected to the partial lower connecting portion 5421 and a plurality of fourth conductive lines 5431 electrically connected to the other portion of the lower connecting portion 5421. The conductive line 5430 is located on the lower side of the shielding layer of the lower circuit board 543, the fourth conductive line 5431 is located on the upper side of the shielding layer of the lower circuit board 543, and the shielding layer of the lower circuit board 543 provides the third conductive line 5430 and the fourth conductive line 5431. The electromagnetic interference between them suppresses crosstalk interference between the third conductive line 5430 and the fourth conductive line 5431. A plurality of conductive strips 5433 are disposed on the upper and lower sides of the second conductive edge 5432. The conductive strips 5433 are electrically connected to the conductive lines of the lower circuit board 543. The shielding layer of the lower circuit board 543 is electrically connected to the grounding point 5434, and the grounding point 5434 is grounded and the lower circuit board is grounded. The shield of 543 is grounded. In the present embodiment, the grounding point 5434 is provided on the lower surface of the lower circuit board 543. The front shielding piece 547 is between the upper side contact portion 5400 and the lower side contact portion 5420, and electromagnetic interference between the upper side contact portion 5400 and the lower side contact portion 5420 can be suppressed. The upper and lower circuit boards 541 and 543 extend between the upper docking port 102 and the lower docking port 103. The shielding layers provided on the upper and lower circuit boards 541 and 543 can suppress the upper docking port 102 and the lower docking port 103. Electromagnetic interference between.

請參閱第十四圖至第十七圖所示,所述對接模組50形成有電性連接於複數所述上側觸接部5400與電子模組53之間的複數上側導電路徑(未標號)及電性連接於複數所述下側觸接部5420與電子模組53之間的複數下側導電路徑(未標號)。於本實施方式中所述上側導電路徑為設於上側電路板541的所述導電線路,所述下側導電路徑為設於下側電路板543的所述導電線路,當然於其他實施方式中上、下側導電路徑可為其他形式,如上側連接部5401向後延伸穿過上側屏蔽元件51的上側形成上側導電路徑,下側連接部5421向後延伸穿過下側屏蔽元件52的上側形成下側導電路徑。所述上側屏蔽元件51對應設於複數所述上側導電路徑的上側,下側屏蔽元件52對應設於複數所述下側導電路徑的下側,所述上側屏蔽元件51提供複數所述上側觸接部5400與電子模組53之間的電磁干擾隔離,所述下側屏蔽元件52提供複數所述下側觸接部5420與電子模組53之間的電磁干擾隔離。 Referring to FIG. 14 to FIG. 17 , the docking module 50 is formed with a plurality of upper conductive paths (not labeled) electrically connected between the upper contact portion 5400 and the electronic module 53 . And electrically connected to a plurality of lower conductive paths (not labeled) between the lower contact portion 5420 and the electronic module 53. In the embodiment, the upper conductive path is the conductive line provided on the upper circuit board 541, and the lower conductive path is the conductive line provided on the lower circuit board 543. Of course, in other embodiments, The lower side conductive path may be in other forms. The upper side connecting portion 5401 extends rearward through the upper side of the upper side shield member 51 to form an upper side conductive path, and the lower side connecting portion 5421 extends rearward through the upper side of the lower side shield member 52 to form a lower side conductive portion. path. The upper shielding element 51 is correspondingly disposed on an upper side of the plurality of upper conductive paths, and the lower shielding element 52 is correspondingly disposed on a lower side of the plurality of lower conductive paths, and the upper shielding element 51 provides a plurality of the upper side contacts The portion 5400 is isolated from the electromagnetic interference between the electronic module 53 and the lower shielding member 52 provides electromagnetic interference isolation between the plurality of the lower contact portions 5420 and the electronic module 53.

請參閱第八圖至第十三圖所示,電子模組53收容於收容空間24並位於上、下側觸接部5400、5420後側。電子模組53包括竪直並左右間隔設置的第一、二電路板530、531、中間支架532、中間屏蔽片5323及組裝於中間支架532底部的轉接模組533。第一電路板 530對應與所述複數上側觸接部5400電性連通,第二電路板531對應與所述複數下側觸接部5420電性連通。所述上側電路板541電性連接於複數所述上側觸接部5400與第一電路板530之間,下側電路板543電性連接於複數所述下側觸接部5420與第二電路板531之間。所述上側屏蔽元件51沿著對接連接器的插入方向向後投影與第一、二電路板530、531皆部分重合,所述下側屏蔽元件52沿著對接連接器的插入方向向後投影也與第一、二電路板530、531皆部分重合,使得上、下側屏蔽元件51、52的屏蔽面積較大。所述上側電路板541與第一電路板530相焊接,所述下側電路板543與第二電路板531相焊接。所述第一、二電路板530、531均設有水平開槽5310及位於水平開槽5310上、下兩側的複數導電片5311。第一導電邊緣5412延伸出第一電路板530的水平開槽5310,第二導電邊緣5432延伸出第二電路板531的水平開槽5310,第一電路板530的導電片5311對應與第一導電邊緣5412的導電片5413焊接,第二電路板531的導電片5311對應與第二導電邊緣5432的導電片5433焊接。所述第一電路板530組設於中間支架532左右兩側其中一側,所述第二電路板531組設於中間支架532左右兩側的其中另一側。自所述中間支架532的前端向後延伸形成有開口5320,所述對接模組50的後部固持於所述開口5320,絕緣載體544被夾持於開口5320中。中間屏蔽片5323設置於所述中間支架532,中間支架532包括對應第一電路板530的第一半絕緣支架5321及對應第二電路板531的第二半絕緣支架5322,中間屏蔽片5323設置於第一半絕緣支架5321與第二半絕緣支架5322之間。所述第一半絕緣支架5321、第二半絕緣支架5322及中間屏蔽片5323組設在一起,所述第一電路板530組設於第一半絕緣支架5321的外側並與 第一半絕緣支架5321之間收容有第一磁性元件5324,所述第二電路板531組設於第二半絕緣支架5322的外側並與第二半絕緣支架5322之間收容有第二磁性元件(未圖示)。第一磁性元件5324與上側觸接部5400電性連通,第二磁性元件與下側觸接部5420電性連通;第一磁性元件5324設置於所述中間屏蔽片5323的一側,第二磁性元件設置於所述中間屏蔽片5323的相反另一側,即第一磁性元件5324與第二磁性元件位於所述中間屏蔽片5323的相反兩側;於本實施方式中第一磁性元件5324及第二磁性元件均為隔離變壓器。所述中間屏蔽片5323與第一、二電路板530、531並列設置並位於第一電路板530與第二電路板531之間。 Referring to FIGS. 8 to 13 , the electronic module 53 is housed in the accommodating space 24 and located at the rear side of the upper and lower contact portions 5400 and 5420. The electronic module 53 includes first and second circuit boards 530 and 531 arranged vertically and left and right, an intermediate bracket 532, an intermediate shielding piece 5323, and a switching module 533 assembled at the bottom of the intermediate bracket 532. First board The 530 is electrically connected to the plurality of upper side contact portions 5400 , and the second circuit board 531 is electrically connected to the plurality of lower side contact portions 5420 . The upper circuit board 541 is electrically connected to the plurality of the upper side contact portions 5400 and the first circuit board 530, and the lower circuit board 543 is electrically connected to the plurality of the lower side contact portions 5420 and the second circuit board. Between 531. The upper shield member 51 is projected rearwardly along the insertion direction of the mating connector, and partially overlaps the first and second circuit boards 530 and 531. The lower shield member 52 projects rearward along the insertion direction of the mating connector. The first and second circuit boards 530 and 531 are partially overlapped, so that the shielding areas of the upper and lower shielding elements 51 and 52 are large. The upper circuit board 541 is soldered to the first circuit board 530, and the lower circuit board 543 is soldered to the second circuit board 531. The first and second circuit boards 530 and 531 are each provided with a horizontal slot 5310 and a plurality of conductive strips 5311 on the upper and lower sides of the horizontal slot 5310. The first conductive edge 5412 extends from the horizontal slot 5310 of the first circuit board 530, and the second conductive edge 5432 extends out of the horizontal slot 5310 of the second circuit board 531. The conductive strip 5311 of the first circuit board 530 corresponds to the first conductive The conductive piece 5413 of the edge 5412 is soldered, and the conductive piece 5311 of the second circuit board 531 is soldered to the conductive piece 5433 of the second conductive edge 5432. The first circuit board 530 is disposed on one of the left and right sides of the intermediate bracket 532, and the second circuit board 531 is disposed on the other side of the left and right sides of the intermediate bracket 532. An opening 5320 is formed extending rearward from the front end of the intermediate bracket 532. The rear portion of the docking module 50 is retained in the opening 5320, and the insulating carrier 544 is clamped in the opening 5320. The intermediate shielding piece 5323 is disposed on the intermediate bracket 532. The intermediate bracket 532 includes a first semi-insulating bracket 5321 corresponding to the first circuit board 530 and a second semi-insulating bracket 5322 corresponding to the second circuit board 531. The intermediate shielding piece 5323 is disposed on the intermediate shielding piece 5323. Between the first insulating bracket 5321 and the second insulating bracket 5322. The first semi-insulating bracket 5321, the second semi-insulating bracket 5322 and the intermediate shielding sheet 5323 are assembled together, and the first circuit board 530 is disposed outside the first semi-insulating bracket 5321 and A first magnetic element 5324 is received between the first insulating brackets 5321, and the second circuit board 531 is disposed outside the second semi-insulating bracket 5322 and accommodates a second magnetic component between the second semi-insulating bracket 5322 and the second semi-insulating bracket 5322. (not shown). The first magnetic element 5324 is in electrical communication with the upper contact portion 5400, and the second magnetic element is in electrical communication with the lower contact portion 5420; the first magnetic element 5324 is disposed on one side of the intermediate shielding sheet 5323, and the second magnetic The element is disposed on the opposite side of the intermediate shielding sheet 5323, that is, the first magnetic element 5324 and the second magnetic element are located on opposite sides of the intermediate shielding sheet 5323; in the embodiment, the first magnetic element 5324 and the The two magnetic components are all isolation transformers. The intermediate shielding sheet 5323 is disposed in parallel with the first and second circuit boards 530 and 531 and located between the first circuit board 530 and the second circuit board 531.

請參閱第八圖至第十三圖所示,所述中間屏蔽片5323竪直設置,其大體呈矩形,其後端與上端皆設有壓接於第一、二半絕緣支架5321、5322外側的翻邊5325,以使中間屏蔽片5323與第一、二半絕緣支架5321、5322更好地相互固持;所述中間屏蔽片5323部分收容於第二開槽230,中間屏蔽片5323的上端邊沿向上超出第二開槽230以與導電襯墊91抵接;所述中間屏蔽片5323的後端設有直接連接於第一電路板530的第一接地臂5326及直接連接於第二電路板531的第二接地臂5327,第一接地臂5326穿孔焊接於第一電路板530,第二接地臂5327穿孔焊接於第二電路板531;所述中間屏蔽片5323的底部向下延伸設有複數第二接地腳5328,所述第二接地腳5328穿過底部電路板6並可安裝於外部設備101;所述中間屏蔽片5323的前部設有直接電連接上側電路板541的接地點5414的上側接地部550、直接電連接下側電路板543的接地點5434的下側接地部551、成型上、下側接地部550、551而形成的屏蔽片開口552、第一連通部553、第二連通部554。所述上、下側接 地部550、551呈水平的片狀,所述上側接地部550向中間屏蔽片5323的一側彎折並焊接於上側電路板541的接地點5414,所述下側接地部551向中間屏蔽片5323的相反另一側彎折並焊接於下側電路板543的接地點5434。屏蔽片開口552為開口5320的一部分,中間屏蔽片5323部分暴露於開口5320中,所述對接模組50插入所述開口5320,中間屏蔽片5323暴露於開口5320中的部分進入第五、六、七開槽5470、5415、5435,第五開槽5470的槽邊夾持於中間屏蔽片5323暴露於開口5320中的部分的左右兩側,第五、六、七開槽5470、5415、5435在上下方向大致對齊,以便中間屏蔽片5323的進入。所述中間屏蔽片5323還設有固定臂555,所述固定臂555用於固定導電襯墊91。 Referring to FIG. 8 to FIG. 13 , the intermediate shielding piece 5323 is vertically disposed, and has a substantially rectangular shape. The rear end and the upper end are respectively crimped to the outside of the first and second semi-insulating brackets 5321 and 5322. The flange 5325 is such that the intermediate shielding piece 5323 and the first and second semi-insulating brackets 5321, 5322 are better mutually held; the intermediate shielding piece 5323 is partially received in the second slot 230, and the upper end edge of the intermediate shielding piece 5323 The second slot 230 is protruded upward to abut the conductive pad 91; the rear end of the intermediate shield 5323 is provided with a first grounding arm 5326 directly connected to the first circuit board 530 and directly connected to the second circuit board 531. The second grounding arm 5327, the first grounding arm 5326 is perforated and welded to the first circuit board 530, the second grounding arm 5327 is pierced and welded to the second circuit board 531; the bottom of the intermediate shielding piece 5323 extends downwardly to have a plurality of Two grounding legs 5328, the second grounding legs 5328 pass through the bottom circuit board 6 and can be mounted to the external device 101; the front portion of the intermediate shielding sheet 5323 is provided with an upper side directly connecting the grounding point 5414 of the upper circuit board 541 Grounding part 550, direct electrical connection to the lower side The lower ground portion 551 of the grounding point 5434 of the road plate 543, the shield opening 552 formed by the upper and lower ground portions 550 and 551, the first communicating portion 553, and the second communicating portion 554. The upper and lower sides are connected The ground portions 550 and 551 are in a horizontal sheet shape, and the upper side ground portion 550 is bent toward one side of the intermediate shielding piece 5323 and welded to the grounding point 5414 of the upper circuit board 541, and the lower side grounding portion 551 is directed to the intermediate shielding piece. The opposite side of the 5323 is bent and soldered to the ground point 5434 of the lower circuit board 543. The shielding plate opening 552 is a part of the opening 5320, the intermediate shielding piece 5323 is partially exposed in the opening 5320, the docking module 50 is inserted into the opening 5320, and the portion of the intermediate shielding piece 5323 exposed to the opening 5320 enters the fifth, sixth, The seven slots 5470, 5415, 5435, the slot sides of the fifth slot 5470 are clamped to the left and right sides of the portion of the intermediate shield 5323 exposed in the opening 5320, and the fifth, sixth, and seventh slots 5470, 5415, 5435 are The up and down directions are substantially aligned for the entry of the intermediate shield 5323. The intermediate shielding piece 5323 is further provided with a fixing arm 555 for fixing the conductive pad 91.

請參閱第十圖所示,轉接模組533組裝於中間支架532的底部,轉接模組533設有直接電連接於第一電路板530的複數第一轉接端子5330、直接電連接於第二電路板531的複數第二轉接端子5331及承載第一、二轉接端子5330、5331的轉接承載體5332。第一、二轉接端子5330、5331穿過底部電路板6並可安裝於外部設備101。 As shown in the tenth figure, the adapter module 533 is assembled on the bottom of the intermediate bracket 532. The adapter module 533 is provided with a plurality of first adapter terminals 5330 directly connected to the first circuit board 530, and is directly electrically connected to The plurality of second transfer terminals 5331 of the second circuit board 531 and the transfer carrier 5332 carrying the first and second transfer terminals 5330 and 5331. The first and second transfer terminals 5330, 5331 pass through the bottom circuit board 6 and can be mounted to the external device 101.

請參閱第八圖至第十一圖所示,上側屏蔽元件51呈垂直於對接連接器插入方向的片狀,上側屏蔽元件51位於複數所述上側對接端子540的後側,且與複數所述上側對接端子540在上下方向的投影無重合,如此利於上側對接端子540與電子模組53之間的電磁干擾隔離。所述上側屏蔽元件51設有貫穿上側屏蔽元件51前後兩側的第一通槽510、設於上側屏蔽元件51左右兩側並向前凹的第一凹部511,第一凹部511上設有第一缺角512。所述中間支架532的前端左右兩側形成有向前突出並收容於第一凹部511的第一定位 部5536及向前超出第一定位部5536並延伸出第一缺角512的第二定位部5537。第一連通部553延伸入第一通槽510並電連接於上側屏蔽元件51。第一、二定位部5536、5537皆用以定位上側屏蔽元件51。下側屏蔽元件52呈垂直於對接連接器插入方向的片狀,下側屏蔽元件52位於複數所述下側對接端子542的後側,且與複數所述下側對接端子542在上下方向的投影無重合,如此利於下側對接端子542與電子模組53之間的電磁干擾隔離。所述下側屏蔽元件52設有貫穿下側屏蔽元件52前後兩側的第二通槽520、設於下側屏蔽元件52左右兩側並向前凹的第二凹部521,第二凹部521上設有第二缺角522。所述中間支架532的前端左右兩側還形成有向前突出並收容於第二凹部521的第三定位部5538及向前超出第三定位部5538並延伸出第二缺角522的第四定位部5539。第二連通部554延伸入第二通槽520並電連接於下側屏蔽元件52。第三、四定位部5538、5539皆用以定位下側屏蔽元件52。底部電路板6具有屏蔽層(未圖示),底部電路板6位於電子模組53的底側,以提供電子模組53底部的電磁屏蔽;上、下側屏蔽元件51、52皆垂直於底部電路板6,上、下側屏蔽元件51、52提供電子模組53前部的電磁屏蔽。所述第一電路板530至少與上、下側屏蔽元件51、52中的一個接地焊接,所述第二電路板531也至少與上、下側屏蔽元件51、52中的一個接地焊接,例如本實施方式中第一、二電路板530、531均設有的接地區域5312皆焊接於下側屏蔽元件52。 Referring to FIGS. 8 to 11 , the upper shield member 51 is in a sheet shape perpendicular to the insertion direction of the mating connector, and the upper shield member 51 is located on the rear side of the plurality of upper mating terminals 540, and the plurality of The projection of the upper butt terminal 540 in the up and down direction is not overlapped, so that the electromagnetic interference between the upper butt terminal 540 and the electronic module 53 is isolated. The first shielding member 51 is provided with a first through groove 510 extending through the front and rear sides of the upper shielding member 51, and a first concave portion 511 disposed on the left and right sides of the upper shielding member 51 and recessed forward. The first concave portion 511 is provided with a first recess 511. A corner 512. The front and rear sides of the front bracket 532 are formed with a first positioning that protrudes forward and is received in the first recess 511 The portion 5536 and the second positioning portion 5537 extending forward beyond the first positioning portion 5536 and extending out of the first notch 512. The first communication portion 553 extends into the first through groove 510 and is electrically connected to the upper shield member 51. The first and second positioning portions 5536 and 5537 are used to position the upper shielding member 51. The lower shield member 52 has a sheet shape perpendicular to the insertion direction of the mating connector, the lower shield member 52 is located at the rear side of the plurality of the lower docking terminals 542, and the projection of the plurality of the lower docking terminals 542 in the up and down direction There is no overlap, which is advantageous for electromagnetic interference isolation between the lower docking terminal 542 and the electronic module 53. The lower shielding member 52 is provided with a second through slot 520 extending through the front and rear sides of the lower shield member 52, and a second recess 521 disposed on the left and right sides of the lower shield member 52 and recessed forward. The second recess 521 is provided. A second corner 522 is provided. The front and rear sides of the front bracket 532 are further formed with a third positioning portion 5538 protruding forwardly and received in the second recess 521 and a fourth positioning portion extending forward beyond the third positioning portion 5538 and extending out of the second corner 522 Department 5539. The second communication portion 554 extends into the second through groove 520 and is electrically connected to the lower side shield member 52. The third and fourth positioning portions 5538 and 5539 are used to position the lower shield member 52. The bottom circuit board 6 has a shielding layer (not shown), and the bottom circuit board 6 is located on the bottom side of the electronic module 53 to provide electromagnetic shielding at the bottom of the electronic module 53; the upper and lower shielding members 51, 52 are perpendicular to the bottom. The circuit board 6, the upper and lower shielding members 51, 52 provide electromagnetic shielding at the front of the electronic module 53. The first circuit board 530 is grounded to at least one of the upper and lower shield members 51, 52, and the second circuit board 531 is also grounded to at least one of the upper and lower shield members 51, 52, for example In the present embodiment, the grounding regions 5312 provided in the first and second circuit boards 530 and 531 are all soldered to the lower shielding member 52.

請參閱第一圖至第五圖所示,屏蔽殼體7包覆於絕緣本體2外側,屏蔽殼體7由前殼體70與後殼體71組裝而成。所述屏蔽殼體7設有殼前壁72、殼頂壁73、殼後壁74、殼兩側壁75及複數可安裝於外 部設備101的第三接地腳77。所述殼前壁72位於前屏蔽片547的前側,殼頂壁73位於中間屏蔽片5323的上側,殼後壁74位於中間屏蔽片5323的後側。屏蔽殼體7上還形成有配合槽76。殼頂壁73由包含於前殼體70的殼頂壁前部分730及包含於後殼體71的殼頂壁後部分731組成。殼兩側壁75由包含於前殼體70的殼兩側壁前部分750及包含於後殼體71的殼兩側壁後部分751組成。所述殼前壁72可讓對接連接器穿過以與電連接器100對接。 Referring to the first to fifth figures, the shield case 7 is wrapped around the outside of the insulative housing 2, and the shield case 7 is assembled from the front case 70 and the rear case 71. The shielding shell 7 is provided with a shell front wall 72, a shell top wall 73, a shell rear wall 74, two shell side walls 75, and a plurality of shells that can be installed outside. The third grounding leg 77 of the device 101. The front wall 72 of the casing is located on the front side of the front shielding piece 547, the top wall 73 of the casing is located on the upper side of the intermediate shielding piece 5323, and the rear wall 74 of the casing is located on the rear side of the intermediate shielding piece 5323. A fitting groove 76 is also formed in the shield case 7. The case top wall 73 is composed of a case top wall front portion 730 included in the front case 70 and a case top wall rear portion 731 included in the rear case 71. The two side walls 75 of the casing are composed of a front side wall portion 750 of the casing included in the front casing 70 and a rear side portion 751 of the side wall of the casing included in the rear casing 71. The housing front wall 72 allows the docking connector to pass through to interface with the electrical connector 100.

請參閱第三圖至第六圖所示,導電襯墊90包括導電棉900及包覆導電棉900的導電布901。所述導電襯墊90被抵壓於前屏蔽片547的前端邊沿與屏蔽殼體7的殼前壁72之間。導電襯墊90將前屏蔽片547與屏蔽殼體7的殼前壁72電性連接,導電襯墊90封堵了前屏蔽片547的前端邊沿與屏蔽殼體7的殼前壁72之間的縫隙,有效抑制電磁輻射通過所述縫隙流竄。導電襯墊90呈長條狀,其左右兩端超出前屏蔽片547的前端邊沿的左右兩側。導電襯墊91包括導電棉910及包覆導電棉910的導電布911。所述導電襯墊91被抵壓於中間屏蔽片5323的邊沿與屏蔽殼體7之間。導電襯墊91將中間屏蔽片5323與屏蔽殼體7電性連接,導電襯墊91封堵了中間屏蔽片5323的邊沿與屏蔽殼體7之間的縫隙,有效抑制電磁輻射通過所述縫隙流竄。所述導電襯墊91貫通設有配合口912,所述固定臂555穿過所述配合口912至屏蔽殼體7的外側並與屏蔽殼體7相固定,以對導電襯墊91準確定位與穩定固持。配合口912與配合槽76對應設置,固定臂555先穿過配合口912再穿過配合槽76而至屏蔽殼體7的外側;固定臂555末端設有壓接於屏蔽殼體7外側的固定端556,以與屏蔽殼體7相固定;於本實施方式中固定臂555設有一對固定端556,該對固定端556彎折方向相反。所述導電襯墊 91呈“L”型並具有水平部分(未標號)和垂直部分(未標號),所述水平部分被抵壓於中間屏蔽片5323的上端邊沿與屏蔽殼體7的殼頂壁73之間,垂直部分被抵壓於中間屏蔽片5323的後端邊沿與屏蔽殼體7的殼後壁74之間。為了穩定地固定導電襯墊91,所述中間屏蔽片5323的上端邊沿與後端邊沿皆具有固定臂555,所述水平部分與垂直部分皆具有相應的配合口912,殼頂壁73與殼後壁74皆具有相應的配合槽76。 Referring to FIGS. 3 to 6 , the conductive gasket 90 includes a conductive cotton 900 and a conductive cloth 901 covering the conductive cotton 900 . The conductive gasket 90 is pressed between the front end edge of the front shielding sheet 547 and the front wall 72 of the shield case 7. The conductive gasket 90 electrically connects the front shielding piece 547 with the front wall 72 of the shield case 7, and the conductive gasket 90 blocks the front edge of the front shielding piece 547 and the front wall 72 of the shield case 7. The slit effectively suppresses electromagnetic radiation from flowing through the gap. The conductive gasket 90 has an elongated shape, and the left and right ends thereof extend beyond the left and right sides of the front end edge of the front shielding sheet 547. The conductive gasket 91 includes a conductive cotton 910 and a conductive cloth 911 covering the conductive cotton 910. The conductive gasket 91 is pressed between the edge of the intermediate shielding sheet 5323 and the shield case 7. The conductive gasket 91 electrically connects the intermediate shielding piece 5323 and the shielding case 7. The conductive pad 91 blocks the gap between the edge of the intermediate shielding piece 5323 and the shielding case 7, and effectively suppresses electromagnetic radiation from flowing through the gap. . The conductive pad 91 is disposed through the mating port 912. The fixing arm 555 passes through the mating port 912 to the outside of the shield case 7 and is fixed to the shield case 7 to accurately position the conductive pad 91. Stable holding. The engaging port 912 is disposed corresponding to the engaging groove 76. The fixing arm 555 passes through the engaging hole 912 and then passes through the engaging groove 76 to the outside of the shielding case 7; the end of the fixing arm 555 is fixedly fixed to the outside of the shielding case 7. The end 556 is fixed to the shield case 7; in the embodiment, the fixed arm 555 is provided with a pair of fixed ends 556, and the pair of fixed ends 556 are bent in opposite directions. The conductive gasket 91 is of an "L" shape and has a horizontal portion (not labeled) and a vertical portion (not labeled) which is pressed between the upper end edge of the intermediate shielding piece 5323 and the top wall 73 of the shield case 7, The vertical portion is pressed between the rear end edge of the intermediate shielding piece 5323 and the case rear wall 74 of the shield case 7. In order to stably fix the conductive pad 91, the upper end edge and the rear end edge of the intermediate shielding piece 5323 have a fixing arm 555, and the horizontal portion and the vertical portion each have a corresponding fitting opening 912, and the top wall 73 and the rear of the shell The walls 74 each have a corresponding mating slot 76.

所述前屏蔽片547、中間屏蔽片5323皆為設於屏蔽殼體7內的內部屏蔽片,即電連接器100包括設於屏蔽殼體7內的內部屏蔽片,內部屏蔽片並不限於前屏蔽片547、中間屏蔽片5323這兩種形式,在不同的連接器中,內部屏蔽片可為其他形式。本創作導電襯墊的設置,即導電襯墊被抵壓於內部屏蔽片的邊沿與屏蔽殼體7之間,以封堵內部屏蔽片的邊沿與屏蔽殼體7間的縫隙,可有效抑制內部屏蔽片的邊沿與屏蔽殼體7間由於縫隙而造成的電磁洩漏,增強電連接器100的電氣性能。 The front shielding piece 547 and the intermediate shielding piece 5323 are internal shielding sheets disposed in the shielding case 7. The electrical connector 100 includes an inner shielding piece disposed in the shielding case 7. The inner shielding piece is not limited to the front. There are two forms of the shielding piece 547 and the intermediate shielding piece 5323. In different connectors, the inner shielding piece can be in other forms. The arrangement of the conductive gasket of the present invention, that is, the conductive gasket is pressed between the edge of the inner shielding sheet and the shielding shell 7 to block the gap between the edge of the inner shielding sheet and the shielding shell 7, which can effectively suppress the interior. The electromagnetic leakage between the edge of the shielding sheet and the shield case 7 due to the gap enhances the electrical performance of the electrical connector 100.

可按照以下步驟組裝本電連接器100:第一,將第一半絕緣支架5321、第二半絕緣支架5322及中間屏蔽片5323組設在一起,將上側屏蔽元件51自前向後組裝於中間支架532,中間屏蔽片5323的第一連通部553進入上側屏蔽元件51的第一通槽510,將下側屏蔽元件52自前向後組裝於中間支架532,中間屏蔽片5323的第二連通部554進入下側屏蔽元件52的第二通槽520,將第一連通部553焊接於第一通槽510處,將第二連通部554焊接於第二通槽520處;第二,將對接模組50自前向後組裝於中間支架532的開口5320處,中間屏蔽片5323部分進入第五、六、七開槽5470、5415、 5435,將中間屏蔽片5323的上側接地部550焊接於上側電路板541的接地點5414,將中間屏蔽片5323的下側接地部551焊接於下側電路板543的接地點5434;將第一、二電路板530、531安裝於中間支架532,將第一電路板530與上側電路板541的第一導電邊緣5412焊接,第二電路板531與下側電路板543的第二導電邊緣5432焊接,接著將第一、二電路板530、531的接地區域5312焊接於下側屏蔽元件52;將竪直屏蔽體3插入絕緣本體2;將底部電路板6安裝於端子模組5的底部形成插入組件4,將插入組件4安裝於絕緣本體2,上側觸接部5400收容於絕緣本體2的上側對接空間25,下側觸接部5420收容於絕緣本體2的下側對接空間26,前屏蔽片547的前端自通口200的第二槽部202進入通口200的第一槽部201;將導電襯墊90置於所述通口200的第一槽部201,將導電襯墊91初步定位於中間屏蔽片5323(此時中間屏蔽片5323的固定臂555所設有的固定端556尚未彎折);將前殼體70安裝於絕緣本體2,導電襯墊91被抵壓於前屏蔽片547的前端邊沿與屏蔽殼體7的殼前壁72之間;將後殼體71組裝於殼前壁72與絕緣本體2,固定臂555依次穿過配合口912與配合槽76而至屏蔽殼體7的外側,接著固定臂555的固定端556壓接於屏蔽殼體7外側,導電襯墊91的水平部分被抵壓於中間屏蔽片5323的上端邊沿與屏蔽殼體7的殼頂壁73之間,導電襯墊91的垂直部分被抵壓於中間屏蔽片5323的後端邊沿與屏蔽殼體7的殼後壁74之間;將屏蔽圈組件8套設於屏蔽殼體7的前端外側,如此即製成了電連接器100。 The electrical connector 100 can be assembled according to the following steps: First, the first semi-insulating bracket 5321, the second semi-insulating bracket 5322 and the intermediate shielding sheet 5323 are assembled together, and the upper shielding member 51 is assembled to the intermediate bracket 532 from the front to the rear. The first communication portion 553 of the intermediate shielding piece 5323 enters the first through groove 510 of the upper shielding member 51, and the lower shielding member 52 is assembled to the intermediate holder 532 from the front to the rear, and the second communication portion 554 of the intermediate shielding piece 5323 enters the lower portion. The second through slot 520 of the side shield member 52 welds the first communication portion 553 to the first through slot 510 and the second communication portion 554 to the second through slot 520. Second, the docking module 50 is As assembled from the front to the rear at the opening 5320 of the intermediate bracket 532, the intermediate shielding piece 5323 partially enters the fifth, sixth, and seventh slots 5470, 5415, 5435, the upper grounding portion 550 of the intermediate shielding sheet 5323 is soldered to the grounding point 5414 of the upper circuit board 541, and the lower grounding portion 551 of the intermediate shielding sheet 5323 is soldered to the grounding point 5434 of the lower circuit board 543; The two circuit boards 530, 531 are mounted on the intermediate bracket 532, the first circuit board 530 is soldered to the first conductive edge 5412 of the upper circuit board 541, and the second circuit board 531 is soldered to the second conductive edge 5432 of the lower circuit board 543. Next, the grounding region 5312 of the first and second circuit boards 530, 531 is soldered to the lower shielding member 52; the vertical shielding body 3 is inserted into the insulative housing 2; and the bottom circuit board 6 is mounted on the bottom of the terminal module 5 to form an insertion assembly. 4, the insertion assembly 4 is mounted on the insulative housing 2, the upper contact portion 5400 is received in the upper docking space 25 of the insulative housing 2, and the lower contact portion 5420 is received in the lower docking space 26 of the insulative housing 2, the front shielding sheet 547 The front end of the second slot portion 202 of the through port 200 enters the first slot portion 201 of the port 200; the conductive pad 90 is placed at the first slot portion 201 of the port 200 to initially position the conductive pad 91 Intermediate shield 5323 (in this case, the intermediate shield 5323 The fixed end 556 of the fixed arm 555 is not bent yet; the front case 70 is mounted on the insulative housing 2, and the conductive pad 91 is pressed against the front end edge of the front shielding piece 547 and the front wall of the shield case 7 The rear housing 71 is assembled to the front wall 72 of the casing and the insulative housing 2, and the fixed arm 555 sequentially passes through the mating opening 912 and the engaging groove 76 to the outside of the shielding housing 7, and then the fixed end 556 of the fixing arm 555. Pressed on the outside of the shield case 7, the horizontal portion of the conductive pad 91 is pressed between the upper end edge of the intermediate shield 5323 and the top wall 73 of the shield case 7, and the vertical portion of the conductive pad 91 is pressed. Between the rear end edge of the intermediate shielding piece 5323 and the case rear wall 74 of the shield case 7; the shield ring assembly 8 is sleeved outside the front end of the shield case 7, thus forming the electrical connector 100.

綜上所述,本發明符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本發明之較佳實施例,本發明之範圍並不以上述實施例為限,舉凡熟習本案技藝之人士援依本發明之精神所作 之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those skilled in the art can make the spirit of the present invention. Equivalent modifications or variations are intended to be included within the scope of the following claims.

510‧‧‧第一通槽 510‧‧‧ first through slot

511‧‧‧第一凹部 511‧‧‧ first recess

512‧‧‧第一缺角 512‧‧‧First corner

520‧‧‧第二通槽 520‧‧‧Second pass

521‧‧‧第二凹部 521‧‧‧Second recess

522‧‧‧第二缺角 522‧‧‧second corner

5310‧‧‧水平開槽 5310‧‧‧ horizontal slotting

5311‧‧‧導電片 5311‧‧‧Conductor

5434‧‧‧接地點 5434‧‧‧ Grounding point

551‧‧‧下側接地部 551‧‧‧Bottom grounding

Claims (9)

一種電連接器,其形成有堆疊的上、下對接端口,並包括:對接模組,所述對接模組設有可與插入上對接端口的對接連接器對接的複數上側觸接部及可與插入下對接端口的對接連接器對接的複數下側觸接部;及竪直並左右間隔設置的第一、二電路板;其中所述對接模組還包括電性連接於複數所述上側觸接部與第一電路板之間的上側電路板及電性連接於複數所述下側觸接部與第二電路板之間的下側電路板,所述上、下側電路板均設有用於接地的接地點,所述電連接器還包括與第一、二電路板並列設置並位於第一電路板與第二電路板之間的中間屏蔽片,所述中間屏蔽片的前部設有直接電連接上側電路板的接地點的上側接地部及直接電連接下側電路板的接地點的下側接地部。 An electrical connector formed with stacked upper and lower docking ports, and comprising: a docking module, wherein the docking module is provided with a plurality of upper contact portions that can be docked with a mating connector inserted into the docking port and a plurality of first and second circuit boards that are inserted into the butt connector of the lower docking port; and first and second circuit boards that are vertically and vertically spaced apart; wherein the docking module further includes an electrical connection to the plurality of upper side contacts An upper circuit board between the portion and the first circuit board and a lower circuit board electrically connected between the lower contact portion and the second circuit board, wherein the upper and lower circuit boards are respectively provided for a grounding point of the ground, the electrical connector further comprising an intermediate shielding piece disposed in parallel with the first and second circuit boards and located between the first circuit board and the second circuit board, the front part of the intermediate shielding piece being directly provided The upper grounding portion of the grounding point of the upper circuit board and the lower grounding portion of the grounding point of the lower circuit board are electrically connected. 如申請專利範圍第1項所述之電連接器,其中上側電路板的接地點設於上側電路板的上表面,下側電路板的接地點設於下側電路板的下表面。 The electrical connector of claim 1, wherein a grounding point of the upper circuit board is disposed on an upper surface of the upper circuit board, and a grounding point of the lower circuit board is disposed on a lower surface of the lower circuit board. 如申請專利範圍第2項所述之電連接器,其中所述上側接地部向中間屏蔽片的一側彎折並焊接於上側電路板的接地點,所述下側接地部向中間屏蔽片的相反另一側彎折並焊接於下側電路板的接地點。 The electrical connector of claim 2, wherein the upper ground portion is bent toward one side of the intermediate shield and soldered to a ground point of the upper circuit board, and the lower ground portion is toward the intermediate shield The other side is bent and soldered to the ground point of the lower board. 如申請專利範圍第2項所述之電連接器,其中所述中間屏蔽片的前部還設有成型上、下側接地部而形成的屏蔽片開口,所述屏蔽片開口自中間屏蔽片的前端向後延伸,所述上側接地部對應位於屏蔽片開口的上側,所述下側接地部對應位於屏蔽片開口的下側,所述上、下側電路板部分收容於所述屏蔽片開口。 The electrical connector of claim 2, wherein the front portion of the intermediate shielding sheet is further provided with a shielding sheet opening formed by forming upper and lower side ground portions, the shielding sheet opening from the intermediate shielding sheet The front end portion extends rearwardly, and the upper side ground portion corresponds to an upper side of the opening of the shielding sheet, and the lower side ground portion corresponds to a lower side of the opening of the shielding sheet, and the upper and lower side circuit board portions are received in the shielding sheet opening. 如申請專利範圍第1項所述之電連接器,其中所述電連接器還包括中間支架,所述中間支架包括對應第一電路板的第一半絕緣支架、對應第二電路板的第二半絕緣支架,中間屏蔽片設於第一半絕緣支架與第二半絕緣支架之間,所述第一、二半絕緣支架及中間屏蔽片組設在一起,所述第一電路板組設於第一半絕緣支架的外側並與第一半絕緣支架之間收容有與上側觸接部電性連通的第一磁性元件,所述第二電路板組設於第二半絕緣支架的外側並與第二半絕緣支架之間收容有與下側觸接部電性連通的第二磁性元件。 The electrical connector of claim 1, wherein the electrical connector further comprises an intermediate bracket, the intermediate bracket comprising a first semi-insulating bracket corresponding to the first circuit board, and a second corresponding to the second circuit board The semi-insulating bracket is disposed between the first semi-insulating bracket and the second semi-insulating bracket, wherein the first and second semi-insulating brackets and the intermediate shielding sheet are assembled together, and the first circuit board is assembled a first magnetic component electrically connected to the upper contact portion is received between the outer side of the first insulating bracket and the first semi-insulating bracket, and the second circuit board is disposed outside the second semi-insulating bracket and A second magnetic element electrically connected to the lower contact portion is received between the second semi-insulating brackets. 如申請專利範圍第1項所述之電連接器,其中所述上、下側電路板均設有屏蔽層,所述上側電路板的屏蔽層與上側電路板的接地點電性連通,所述下側電路板的屏蔽層與下側電路板的接地點電性連通。 The electrical connector of claim 1, wherein the upper and lower circuit boards are each provided with a shielding layer, and the shielding layer of the upper circuit board is electrically connected to a grounding point of the upper circuit board, The shielding layer of the lower circuit board is electrically connected to the grounding point of the lower circuit board. 如申請專利範圍第1項所述之電連接器,其中所述上側電路板與第一電路板相焊接,所述下側電路板與第二電路板相焊接。 The electrical connector of claim 1, wherein the upper circuit board is soldered to the first circuit board and the lower circuit board is soldered to the second circuit board. 如申請專利範圍第7項所述之電連接器,其中所述第一、二電路板均設有水平開槽及位於水平開槽上、下兩側的複數導電片,上側電路板設有延伸出第一電路板的水平開槽的第一導電邊緣,下側電路板設有延伸出第二電路板的水平開槽的第二導電邊緣,所述第一、二導電邊緣的上下兩側均設有複數導電片,第一電路板的導電片對應與第一導電邊緣的導電片焊接,第二電路板的導電片對應與第二導電邊緣的導電片焊接。 The electrical connector of claim 7, wherein the first and second circuit boards are provided with a horizontal slot and a plurality of conductive strips on the upper and lower sides of the horizontal slot, and the upper circuit board is provided with an extension. a horizontally slotted first conductive edge of the first circuit board, the lower circuit board being provided with a horizontally slotted second conductive edge extending from the second circuit board, the upper and lower sides of the first and second conductive edges A plurality of conductive sheets are disposed. The conductive sheets of the first circuit board are soldered to the conductive sheets of the first conductive edge, and the conductive sheets of the second circuit board are soldered to the conductive sheets of the second conductive edge. 如申請專利範圍第1項所述之電連接器,其中所述對接模組還包括絕緣載體,所述上側電路板承載於絕緣載體的上側,所述下側電路板承載於絕緣載體的下側。 The electrical connector of claim 1, wherein the docking module further comprises an insulating carrier, the upper circuit board is carried on an upper side of the insulating carrier, and the lower circuit board is carried on a lower side of the insulating carrier .
TW100107486A 2011-03-07 2011-03-07 Electrical connector TWI469453B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI303118B (en) * 2004-06-18 2008-11-11 Hon Hai Prec Ind Co Ltd Electrical adapter assembly
TWM398260U (en) * 2010-07-15 2011-02-11 Hon Hai Prec Ind Co Ltd Electrical connector

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI303118B (en) * 2004-06-18 2008-11-11 Hon Hai Prec Ind Co Ltd Electrical adapter assembly
TWM398260U (en) * 2010-07-15 2011-02-11 Hon Hai Prec Ind Co Ltd Electrical connector

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