TWI467114B - Heat-dissipating module for light emitter - Google Patents

Description

Luminaire cooling module

The invention relates to a heat dissipation module for an illuminant, in particular to a heat source for guiding the illuminant only by a heat dissipating member.

The Republic of China Announcement No. M334919 "LED Lighting Improved Structure" patent case discloses a heat dissipation method of a conventional LED lamp, which mainly comprises a heat sink seat set in a receiving space of a lamp body and abutting on the back side of the LED substrate. A heat dissipating fan is connected to the heat sink side, and the heat sink fan drives the airflow to dissipate the heat source of the LED substrate.

In addition, the Republic of China Announcement No. M339202 "LED Light Dissipation Structure" patent case reveals another type of LED lamp heat dissipation method, which mainly comprises a light-emitting diode body housed in a lamp body and coated by a ring groove of the lamp body. The adhesive is used to bond the lamp cover, and the lamp body is provided with a heat sink for dissipating the heat source generated by the light-emitting diode.

According to the above-mentioned conventional heat dissipation method, since only the accommodating space of the luminaire main body is abutted on the back side of the LED substrate, or only the illuminating diode is housed in the luminaire body, the LED substrate or the illuminating diode The body and the heat sink or the lamp body are only in contact with a single surface, or the contact between them is not reliable. Therefore, the heat source generated by the LED substrate or the light emitting diode can only be guided to the heat dissipation by a small heat conduction area. Therefore, the heat dissipation effect of the conventional heat dissipation method is not good, and the heat dissipation method of driving the airflow by the heat dissipation fan causes the heat dissipation structure to be complicated and large in size, which is disadvantageous for the lightweight and miniaturization of the product.

In general, if the contact between the LED substrate or the light-emitting diode and the heat sink is more reliable, or the heat transfer area between the LED substrates or the light-emitting diodes is increased, the heat generated by the LED substrate or the light-emitting diode is more effective. exclude. For the above reasons, it is necessary to improve the heat dissipation of the conventional LED substrate or the light-emitting diode.

The invention provides a heat dissipating module of an illuminant, which mainly makes a tight, exact and larger area of the substrate between the illuminant and a heat dissipating member, so that the illuminant has an optimal heat dissipation effect. The main purpose of the invention.

Furthermore, the present invention provides a heat dissipation module for an illuminator. The heat dissipation module of the present invention has a simple structure, because the illuminant substrate and a heat dissipating member are tightly connected, and a relatively large area is closely connected. The small size can be used to reduce the weight and size of the product.

In order to achieve the foregoing object, the technical means utilized by the present invention and the achievable effects by the technical means include:

A heat dissipating module comprising: an illuminant substrate having an illuminant and a substrate, the substrate having at least two opposing surfaces; a first heat dissipating member having a first contact surface and a heat dissipating portion, The first contact surface is in contact with a surface of the substrate; a second heat dissipating member is provided with a second contact surface and a heat dissipating portion, and the second contact surface is adhered to another corresponding surface of the substrate; The first heat dissipating member and the second heat dissipating member are coupled to each other, and the surfaces of the second and second heat dissipating members are respectively adhered to the second contact surface of the first heat dissipating member.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

Referring to FIG. 1 , a preferred embodiment of the heat dissipation module of the illuminator of the present invention is disclosed, wherein the illuminant substrate 1 is sandwiched between the first heat dissipation member 2 and the second heat dissipation member 3, and The substrate 1 is firmly bonded to the first heat dissipation member 2 and the second heat dissipation member 3 by a positioning member 4.

The main design feature of the present invention is that the first heat dissipating member 2 and the second heat dissipating member 3 combine the illuminant substrate 1 with a large area and a close contact manner, so that the heat source generated by the illuminant substrate 1 can be effectively used. discharge.

More specifically, the present invention is further applied to the actual structure of a heat dissipation module of an LED illuminator according to the prior art concept, as a preferred embodiment of the present invention, wherein:

Referring to FIGS. 1 and 6 , the heat dissipation module of the preferred embodiment of the present invention includes an illuminant substrate 1 , a first heat dissipation member 2 , a second heat dissipation member 3 , and a positioning member 4 .

The illuminant substrate 1 has an illuminant 11 and a substrate 12 itself. The illuminator 11 can be a conventional LED illuminator 11 . The substrate 12 includes a chip set that can illuminate the illuminator 11 . The electrical connection portion 13 is electrically connected to the power source to cause the illuminant 11 to emit light. The illuminant substrate 1 has at least two corresponding surfaces, and the surface is preferably planar. The two surfaces respectively have a width W and a thickness T between the two planes, and the illuminant substrate 1 preferably uses thickness or width. The difference is such that more than one positioning portion 14 is formed, and when the first heat dissipating member 2 and the second heat dissipating member 3 are coupled to the illuminator substrate 1, a better positioning effect is obtained. In addition, the illuminant substrate 1 may further be provided with one or more first positioning holes 15 penetrating the two corresponding surfaces of the illuminant substrate 1, especially in the corresponding two Surfaces.

As shown in FIG. 6, the first heat dissipating member 2 is made of a material having good heat transfer performance. The first heat dissipating member 2 has a first contact surface 21 and a heat dissipating portion 22, and the first contact surface 21 can be combined with The two corresponding surfaces of the illuminant substrate 1 are mostly attached, and the first contact surface 21 is preferably formed into a plane. The heat dissipating portion 22 can be formed to expose a large area to the outside air, or to any design that is easy to dissipate heat, such as a heat dissipating fin or a heat dissipating hole, so that the heat source is easily dissipated.

As shown in FIG. 1 , in order to connect the first heat dissipating member 2 to the illuminator substrate 1 , the contact area is larger and the positioning effect is better. The first heat dissipating member 2 can be on the first contact surface 21 . Forming a first counterbore 23, the first counterbore 23 is formed in a shape matching the illuminant substrate 1, and the depth T1 of the first counterbore 23 is equal to or smaller than a thickness T of the illuminant substrate 1 . In addition, the first heat dissipating member 2 is provided with more than one second positioning hole 24, the second positioning hole 24 penetrating the first contact surface 21 and its opposite surface, so that the second positioning hole 24 is available for the positioning member 4 The second positioning hole 24 is preferably located at the position of the first counterbore 23 and corresponds to the first positioning hole 15 of the illuminant substrate 1 .

As shown in FIGS. 1 and 6 , the second heat dissipating member 3 can be embedded with the illuminant substrate 1 together with the first heat dissipating member 2 , and the second heat dissipating member 3 and the first heat dissipating member 2 are preferably formed in the same manner. The shape of the symmetry, so that the second heat dissipating member 3 and the first heat dissipating member 2 can be produced by only a single mold, and it is not necessary to distinguish the difference in assembly, and the assembly can be facilitated. Therefore, the second heat dissipating member 3 is also provided with the same and symmetrical second contact surface 31, the heat dissipating portion 32, the second counterbore 33 and the third positioning hole 34, and the second counterbore 33. The depth T2 may also be equal to or smaller than a half of the thickness T of the illuminant substrate 1. .

The positioning member 4 is configured to couple the first heat dissipating member 2 and the second heat dissipating member 3 and fix the illuminant substrate 1 therebetween. The positioning member 4 can be of various configurations, such as a conventional clasp and a buttonhole. In this embodiment, the bolt and the nut can be used, or the second positioning hole 24 and the third positioning hole 34 can be directly A screw hole is formed, and the bolt is directly screwed to the second positioning hole 24 and the third positioning hole 34, and the first heat dissipation member 2 and the second heat dissipation member 3 can be coupled.

Referring to FIGS. 2 and 3, in the use case of the present invention, the illuminant substrate 1 is disposed between the first heat dissipating member 2 and the second heat dissipating member 3, and sequentially positioned by the locating member 4. The second positioning hole 24 of the first heat dissipation member 2 , the first positioning hole 15 of the illuminant substrate 1 , and the third positioning hole 34 of the second heat dissipation member 3 . When the depth T1 of the first counterbore 23 of the first heat dissipating member 2 and the depth T2 of the second counterbore 33 of the second heat dissipating member 3 are equal to one-half of the thickness T of the illuminant substrate 1, the illuminant substrate 1 The second corresponding surface can be attached to the first contact surface 21 of the first heat dissipation member 2 and the second contact surface 31 of the second heat dissipation member 3, so that the heat source generated by the wafer group of the illuminant substrate 1 can be larger. The conductive area may be transmitted to the first heat dissipating member 2 and the second heat dissipating member 3, and may be dissipated by the heat dissipating portions 22 and 32. Further, the surface of the substrate 12 of the illuminant substrate 1 and the first heat dissipating member 2 may be A contact surface 21, a second contact surface 31 of the second heat dissipation member 3, or a wall surface of each of the first counterbore 23 and the second counterbore 33 is coated with a thermal conductive paste, which has a better heat conduction effect.

As shown in FIG. 4 and FIG. 5 , which is another embodiment of the present invention, in the embodiment, the depth T1 of the first counterbore 23 of the first heat dissipation member 2 and the second sink of the second heat dissipation member 3 The depth T2 of the hole 33 is smaller than a thickness T of the illuminant substrate 1 . Therefore, when the first heat dissipating member 2 , the illuminator substrate 1 and the second heat dissipating member 3 are coupled by the positioning member 4 , the first heat dissipating member Although a gap is not formed between the first contact surface 21 of the second contact surface 21 and the second contact surface 31 of the second heat dissipation member 3, the first contact surface 21 of the first heat dissipation member 2 and one of the illuminant substrates 1 are The surface, and the second contact surface 31 of the second heat dissipating member 3 and the other corresponding surface of the illuminant substrate 1 are formed to be closely attached and firmly fixed. Thus, the heat source generated by the wafer group of the illuminant substrate 1 can also be A larger conductive area is transmitted to the first heat dissipating member 2 and the second heat dissipating member 3, and is dissipated by the heat dissipating portions 22, 32. Similarly, each surface of the substrate 12 of the illuminant substrate 1 and the first contact surface 21 of the first heat dissipation member 2, the second contact surface 31 of the second heat dissipation member 3, or the first counterbore 23, the second sink The wall surface of the hole 33 is coated with a thermal conductive paste, which also has a better thermal conductivity.

The above embodiment of the present invention discloses that the depth T1 of the first counterbore 23 and the depth T2 of the second counterbore 33 are less than or equal to one-half the thickness T of the illuminant substrate 1, but the first counterbore 23 is The depth T1 and the depth T2 of the second counterbore 33 form different depths, and the sum of the depth T1 of the first counterbore 23 and the depth T2 of the second counterbore 33 is less than or equal to the thickness T of the illuminant substrate 1, There will be the same effect and effect.

The illuminant substrate 1 and the first heat dissipating member 2 and the second heat dissipating member 3 are formed between the illuminant substrate 1 and the first heat dissipating member 2 and the second heat dissipating member 3 in addition to the combination of tightness, reliability, and firmness. There is also a maximum heat transfer area. Therefore, the heat dissipation module of the illuminator of the present invention has an optimum heat dissipation effect. Moreover, since the heat dissipation module of the illuminator of the present invention and the illuminator substrate have the largest heat conduction area, the heat source generated by the wafer group of the illuminant substrate 1 can be effectively eliminated, and thus, the illuminating light of the present invention The heat dissipation module of the body does not need to have an additional cooling fan, and the heat dissipation module structure of the invention can be simplified, and the volume is reduced to facilitate the lightweight and miniaturization of the product.

While the invention has been described in connection with the preferred embodiments described above, it is not intended to limit the scope of the invention. The technical scope of the invention is protected, and therefore the scope of the invention is defined by the scope of the appended claims.

[this invention]

1. . . Luminescent substrate

11. . . illuminator

12. . . Substrate

13. . . Electrical connection

14. . . Positioning department

15. . . First positioning hole

2. . . First heat dissipation member

twenty one. . . First contact surface

twenty two. . . Heat sink

twenty three. . . First counterbore

twenty four. . . Second positioning hole

3. . . Second heat dissipation member

31. . . Second contact surface

32. . . Heat sink

33. . . Second counterbore

34. . . Third positioning hole

4. . . Positioning member

Fig. 1 is an exploded perspective view showing a first embodiment of the present invention.

Fig. 2 is a combination top view of the first embodiment of the present invention.

Figure 3: A cross-sectional view taken along line 3-3 of Figure 2.

Figure 4 is a combination top view of a second embodiment of the present invention.

Figure 5: A cross-sectional view taken along line 5-5 of Figure 4.

Figure 6 is a perspective exploded view of still another embodiment of the present invention.

1. . . Luminescent substrate

11. . . illuminator

12. . . Substrate

13. . . Electrical connection

14. . . Positioning department

15. . . First positioning hole

2. . . First heat dissipation member

twenty one. . . First contact surface

twenty two. . . Heat sink

twenty three. . . First counterbore

twenty four. . . Second positioning hole

3. . . Second heat dissipation member

31. . . Second contact surface

32. . . Heat sink

33. . . Second counterbore

34. . . Third positioning hole

4. . . Positioning member

Claims (8)

A heat dissipating module comprising: an illuminant substrate having an illuminant and a substrate, the substrate having at least two opposite planes; a first heat dissipating member having a first contact surface and a heat dissipating portion a contact surface is in contact with a plane of the substrate; a second heat dissipating member is disposed with a second contact surface and a heat dissipating portion, and the second contact surface of the second heat dissipating member and the first contact surface of the first heat dissipating member Facing each other, the second contact surface is in contact with another corresponding plane of the substrate; a positioning member is configured to combine the first heat dissipating member and the second heat dissipating member, and the opposite planes of the substrate of the illuminant substrate are respectively The first contact surface of the first heat dissipation member and the second contact surface of the second heat dissipation member are attached. The heat dissipation module of the illuminator according to claim 1, wherein the first heat dissipation member and the second heat dissipation member are formed in the same shape and corresponding shapes. The heat dissipation module of the illuminator according to the first or second aspect of the invention, wherein the first contact surface of the first heat dissipation member forms a first counterbore, and the second contact surface of the second heat dissipation member forms a first Two counterbore. The heat dissipation module of the illuminant according to claim 3, wherein the substrate of the illuminant substrate forms a shape that matches the first counterbore and the second counterbore. The heat dissipation module of the illuminant according to item 4 of the patent application scope, wherein The substrate forms one or more positioning portions by the difference in width or thickness. The heat dissipation module of the illuminant according to claim 4, wherein a thickness is formed between the opposite surfaces of the substrate of the illuminant substrate, and the depth of the first counterbore and the second counterbore is less than or equal to the thickness One of the points. The heat dissipation module of the illuminant according to the first or second aspect of the invention, wherein the substrate of the light substrate is provided with a first positioning hole, the first heat dissipation member is provided with a second positioning hole, and the second heat dissipation member is provided The three positioning holes, the first positioning hole, the second positioning hole and the third positioning hole are correspondingly connected to the positioning member. The heat dissipation module of the illuminator according to the seventh aspect of the invention, wherein the second positioning hole of the first heat dissipation member is located at the first counterbore, and the third positioning hole of the second heat dissipation member is the second Counterbore.