TWI466930B - Method for manufacturing porous sheet and porous sheet manufactured by the method - Google Patents

Method for manufacturing porous sheet and porous sheet manufactured by the method Download PDF

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TWI466930B
TWI466930B TW99118909A TW99118909A TWI466930B TW I466930 B TWI466930 B TW I466930B TW 99118909 A TW99118909 A TW 99118909A TW 99118909 A TW99118909 A TW 99118909A TW I466930 B TWI466930 B TW I466930B
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polymer resin
supercritical fluid
supercritical
resin sheet
fluid extraction
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TW201109375A (en
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Seong-Uk Jeong
Byeong-In Ahn
Young-Ji Tae
Keong-Yeon Yoon
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Lg Chemical Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C44/00Shaping by internal pressure generated in the material, e.g. swelling or foaming ; Producing porous or cellular expanded plastics articles
    • B29C44/34Auxiliary operations
    • B29C44/3469Cell or pore nucleation
    • B29C44/348Cell or pore nucleation by regulating the temperature and/or the pressure, e.g. suppression of foaming until the pressure is rapidly decreased
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/26Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by elimination of a solid phase from a macromolecular composition or article, e.g. leaching out
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2201/00Foams characterised by the foaming process
    • C08J2201/04Foams characterised by the foaming process characterised by the elimination of a liquid or solid component, e.g. precipitation, leaching out, evaporation
    • C08J2201/042Elimination of an organic solid phase
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2203/00Foams characterized by the expanding agent
    • C08J2203/08Supercritical fluid
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00Technologies relating to chemical industry
    • Y02P20/50Improvements relating to the production of bulk chemicals
    • Y02P20/54Improvements relating to the production of bulk chemicals using solvents, e.g. supercritical solvents or ionic liquids

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Description

多孔板之製造方法及使用該方法製得之多孔板Method for producing porous plate and porous plate prepared by using same

本發明係關於一種使用超臨界流體萃取(supercritical fluid extraction(SFE))製備多孔板之方法,及使用該方法製得之一種多孔板。The present invention relates to a method for preparing a multi-well plate using supercritical fluid extraction (SFE), and a porous plate obtained by the method.

本申請案主張享有於2009年6月10日向韓國專利局申請之韓國專利申請案第No.10-2009-0051598號之優先權,個別地,揭示內容全體皆引用作為本說明書之參考資料。The present application claims priority to Korean Patent Application No. 10-2009-0051, 598, filed on Jan. 10, 2009, the entire disclosure of which is hereby incorporated by reference.

化學機械研磨(CMP)製程用於製造微電子裝置中,細用以在半導體晶圓、場發射顯示器及許多其他微電子基材上形成平坦表面。例如,半導體裝置的製造通常包括:各種製程層(process layer)之形成、此類層之選擇性移除或圖案化、以及在一半導基材之表面上額外製程層之沈積而形成一半導體晶圓。該製程層可包含,例如:絕緣層、閘極氧化層、傳導層、及金屬或玻璃層等。通常需要在晶圓製程之特定步驟中製程層的最上層之表面較佳為平的,即:對後續層之沈積而言是平坦的。Chemical mechanical polishing (CMP) processes are used in the fabrication of microelectronic devices to form flat surfaces on semiconductor wafers, field emission displays, and many other microelectronic substrates. For example, the fabrication of semiconductor devices typically involves the formation of various process layers, the selective removal or patterning of such layers, and the deposition of additional process layers on the surface of a semi-conductive substrate to form a semiconductor crystal. circle. The process layer can include, for example, an insulating layer, a gate oxide layer, a conductive layer, and a metal or glass layer. It is generally desirable that the surface of the uppermost layer of the process layer is preferably flat in a particular step of the wafer process, i.e., flat for deposition of subsequent layers.

化學機械研磨(CMP)製程係用於平面化製程層,其中一沈積材料(如:一傳導或絕緣材料)經研磨並移除以平面化用於後續製程步驟之晶圓。A chemical mechanical polishing (CMP) process is used to planarize the process layer, wherein a deposition material (eg, a conductive or insulating material) is ground and removed to planarize the wafer for subsequent processing steps.

在一典型的化學機械研磨(CMP)製程中,一晶圓倒置在一CMP器具中之一承載體(carrier)上。一力推進該承載體且該晶圓往下朝向一研磨墊(polishing pad)。該承載體及該晶圓在CMP器具的研磨桌上之旋轉的研磨墊上旋轉。一研磨組合物(亦稱之為一研磨漿液(polishing slurry))通常在研磨製程期間導入介於旋轉的晶圓及旋轉的研磨墊之間。該研磨組合物典型上包含:可與最上層晶圓層之部分交互作用或將其溶解之一化學品、以及一物理性地移除該層之部分之研磨材料。該晶圓以及該研磨墊可以相同方向或以相反方向旋轉,無論哪一種對正在進行的特定研磨製程而言都是適合的。該承載體亦可在研磨桌上的研磨墊間振盪。In a typical chemical mechanical polishing (CMP) process, a wafer is inverted onto a carrier in a CMP apparatus. The carrier is pushed forward and the wafer is directed downward toward a polishing pad. The carrier and the wafer are rotated on a rotating polishing pad on a polishing table of a CMP apparatus. A polishing composition (also referred to as a polishing slurry) is typically introduced between the rotating wafer and the rotating polishing pad during the polishing process. The abrasive composition typically comprises: an abrasive material that can interact with or dissolve a portion of the uppermost wafer layer, and a portion that physically removes the layer. The wafer and the polishing pad can be rotated in the same direction or in opposite directions, whichever is appropriate for the particular polishing process being performed. The carrier can also oscillate between the polishing pads on the grinding table.

用於化學機械研磨(CMP)製程的研磨墊使用軟性及硬性墊材兩者而製造,其係包含:聚合物-浸漬織物(polymer-impregnated fabrics)、微多孔膜(microporous films)、多孔聚合物發泡體(cellular polymer foams)、無孔聚合物板(non-porous polymer sheets)以及燒結熱塑性顆粒(sintered thermoplastic particles)。The polishing pad used in the chemical mechanical polishing (CMP) process is manufactured using both soft and rigid mats, including: polymer-impregnated fabrics, microporous films, porous polymers. Cellular polymer foams, non-porous polymer sheets, and sintered thermoplastic particles.

包含有浸漬入一聚酯不織布的一聚胺甲酸酯樹脂(polyurethane resin)之一墊可說是一聚合物浸漬織物之研磨墊(polymer-impregnated fabric polishing pad)。微多孔研磨墊包括塗佈在一基底材料上的微多孔之胺甲酸乙酯(urethane)膜。此類研磨墊為密閉性、多孔性膜。多孔聚合物發泡體研磨墊包含任意地且均勻地分布於所有三維空間中之一密封性結構。A pad comprising a polyurethane resin impregnated into a polyester nonwoven fabric can be said to be a polymer-impregnated fabric polishing pad. The microporous polishing pad comprises a microporous urethane film coated on a substrate material. Such a polishing pad is a hermetic, porous film. The porous polymer foam polishing pad comprises a hermetic structure that is randomly and evenly distributed in all three-dimensional spaces.

近來,大部分研磨墊中,在該墊上使用具有閉合孔(closed-pores)之多孔板,其中該孔控制研磨漿液之流動性以改善製程效率。因此,均勻分散研磨墊中的孔洞是重要的。Recently, in most of the polishing pads, a perforated plate having closed-pores is used on the pad, wherein the hole controls the fluidity of the slurry to improve process efficiency. Therefore, it is important to uniformly disperse the holes in the polishing pad.

研磨墊之製造方法的一例子為如韓國專利案第No. 10-0191227號所述,藉由添加中空聚合性微元件(hollow polymeric microelements)至一聚合性基質(polymeric matrix)。An example of a method of producing a polishing pad is as described in Korean Patent No. 10-0191227, by adding hollow polymeric microelements to a polymeric matrix.

然而,該中空聚合性微元件具有數微米之厚度的外殼,且有問題的是,此類外殼會在一待研磨物體上(例如:在化學機械研磨(CMP)製程期間的一晶片)產生刮痕。However, the hollow polymerizable micro-elements have a casing having a thickness of several micrometers, and it is problematic that such a casing will be scraped on an object to be polished (for example, a wafer during a chemical mechanical polishing (CMP) process). mark.

本發明之一目的為提供一種製造一多孔板之方法,其中形成具有優異均勻性及分散性之孔洞、減少製程期間刮痕的產生、及改善製程效率,以及使用該方法所製得之一種多孔板。An object of the present invention is to provide a method for producing a porous plate, wherein a hole having excellent uniformity and dispersibility is formed, a generation of scratches during a process is reduced, and process efficiency is improved, and a method obtained by using the method is provided. Multiwell plate.

本發明提供一種製造一多孔板之方法,包括步驟a)製造包含經由溶解於超臨界流體之超臨界流體萃取處理之一物體之一聚合物樹脂板;以及b)將該超臨界流體注入該聚合物樹脂板以萃取包含於聚合物樹脂板中經超臨界流體萃取處理之該物體,因此於該聚合物樹脂板中形成孔洞。The present invention provides a method of making a multi-well plate comprising the steps of a) fabricating a polymer resin sheet comprising one of an object treated by supercritical fluid extraction dissolved in a supercritical fluid; and b) injecting the supercritical fluid into the The polymer resin sheet extracts the object subjected to supercritical fluid extraction treatment in the polymer resin sheet, thereby forming voids in the polymer resin sheet.

本發明提供依據本發明之製造方法所製造之一多孔板。The present invention provides a porous plate produced in accordance with the manufacturing method of the present invention.

本發明提供包含有本發明的多孔板之一研磨墊。The present invention provides a polishing pad comprising one of the perforated plates of the present invention.

依據本發明,提供一種製造一多孔板之方法,能在一板中形成具有優異均勻性及分散性之孔洞。此外,可形成孔洞而不會在該板中留有殘餘物,因為該方法藉由萃取溶解於超臨界流體之一材料而實施。因此,在研磨製程期間,可減少因殘餘物而在一研磨物體(晶圓)上所產生的刮痕,且可改善製程效率。According to the present invention, there is provided a method of producing a perforated plate capable of forming pores having excellent uniformity and dispersibility in a sheet. In addition, holes can be formed without leaving a residue in the plate because the method is carried out by extracting a material dissolved in one of the supercritical fluids. Therefore, during the polishing process, scratches generated on a polishing object (wafer) due to residues can be reduced, and process efficiency can be improved.

依據本發明製造一多孔板之方法,包括步驟a)製造包含經由溶解於超臨界流體之超臨流體界萃取處理之一物體之一聚合物樹脂板;以及b)將該超臨界流體注入該聚合物樹脂板,以萃取包含於聚合物樹脂板中經超臨界流體萃取處理之該物體,因此於該聚合物樹脂板中形成孔洞。A method of making a multi-well plate according to the present invention, comprising the steps of a) producing a polymer resin sheet comprising one of an object via a supercritical fluid boundary extraction process dissolved in a supercritical fluid; and b) injecting the supercritical fluid into the A polymer resin sheet for extracting the object subjected to supercritical fluid extraction treatment in a polymer resin sheet, thereby forming pores in the polymer resin sheet.

步驟a)中,經超臨界流體萃取處理之該物體可為選自由:芳香族化合物、脂肪族烴、以及脂肪族醇之一材料。In the step a), the object subjected to supercritical fluid extraction treatment may be selected from the group consisting of: an aromatic compound, an aliphatic hydrocarbon, and a material of an aliphatic alcohol.

於此,芳香族化合物之例子可包含:萘(naphthalene)、蒽(anthracene)、1,2-苯並菲(chrysene)、及稠五苯(pentacene)。該脂肪族烴可為C7 到C10 脂肪族烴,但不限於此,其具體例子可包括:礦物油、辛烷、癸烷、及十二烷。脂肪族醇之例子可包括:庚醇、壬醇、及十二醇。Here, examples of the aromatic compound may include naphthalene, anthracene, 1,2-benzophene, and pentacene. The aliphatic hydrocarbon may be a C 7 to C 10 aliphatic hydrocarbon, but is not limited thereto, and specific examples thereof may include mineral oil, octane, decane, and dodecane. Examples of the aliphatic alcohol may include heptanol, decyl alcohol, and dodecyl alcohol.

其中,較佳的是經超臨界流體萃取處理之該物體可為萘或辛烷,但不限於此。Among them, it is preferred that the object treated by supercritical fluid extraction may be naphthalene or octane, but is not limited thereto.

包含於聚合物樹脂板中經超臨界流體萃取處理之該物體可為圓或卵形,但不限於此。The object contained in the polymer resin sheet subjected to supercritical fluid extraction treatment may be round or oval, but is not limited thereto.

步驟a)中,經超臨界流體萃取處理之該物體可以數量在5至50%之重量包含於聚合物樹脂板中,且更較佳地為20至40%之重量。In the step a), the object treated by the supercritical fluid extraction may be contained in the polymer resin sheet in an amount of 5 to 50% by weight, and more preferably 20 to 40% by weight.

步驟a)之聚合物樹脂板可包括一聚合物樹脂,其係選自由:聚胺甲酸酯、熱塑彈性體、聚烯烴、聚碳酸酯、聚乙烯醇、尼龍、彈性體橡膠、苯乙烯基共聚物、聚芳香族化合物、氟聚合物、聚醯亞胺、交聯聚胺甲酸酯、交聯聚烯烴、聚醚、聚酯、聚丙烯酸酯、彈性體聚乙烯、聚四氟乙烯、聚對酞酸乙二酯(polyethylene terephthalate)、聚芳基化合物(polyarylene)、聚苯乙烯(polystyrene)、聚甲基丙烯酸酯(polymethylmethacrylate)、其共聚物、其嵌段共聚物、其混合物、以及其摻合物所組成之群組。於此,該聚胺甲酸酯樹脂為用於形成該研磨墊之一最佳材料,因為其優異的耐磨耗性(abrasion resistance)。此外,具有期望物理特性之一聚胺甲酸酯樹脂可輕易地藉由改變其原料組成而獲得。聚胺甲酸酯樹脂之此類性質適合形成該研磨墊。The polymer resin sheet of step a) may comprise a polymer resin selected from the group consisting of: polyurethane, thermoplastic elastomer, polyolefin, polycarbonate, polyvinyl alcohol, nylon, elastomer rubber, styrene Base copolymer, polyaromatic compound, fluoropolymer, polyimine, crosslinked polyurethane, crosslinked polyolefin, polyether, polyester, polyacrylate, elastomer polyethylene, polytetrafluoroethylene , polyethylene terephthalate, polyarylene, polystyrene, polymethylmethacrylate, copolymers thereof, block copolymers thereof, mixtures thereof, And a group of blends thereof. Here, the polyurethane resin is an optimum material for forming the polishing pad because of its excellent abrasion resistance. Further, a polyurethane resin having one of desired physical properties can be easily obtained by changing its raw material composition. Such properties of the polyurethane resin are suitable for forming the polishing pad.

步驟a)可包括步驟a1)混合經超臨界流體萃取處理之該物體與一聚合物樹脂或一前驅物,及a2)硬化步驟a1)之混合物。Step a) may comprise the step a1) mixing the mixture of the supercritical fluid extraction treated with a polymer resin or a precursor, and a2) the hardening step a1).

步驟a1)中,經超臨界流體萃取處理之該物體與該聚合物樹脂或前驅物之混合環境可依照渦輪速度(impeller speed)以及在一反應器中之反應器溫度而變化。此外,一硬化劑可同時地用於混合製程期間。於此,渦輪速度(impeller speed)及反應器溫度可個別地控制,但較佳的渦輪速度(impeller speed)可為200至3000 rpm且較佳的反應器溫度可為40至70℃。In step a1), the mixed environment of the object and the polymer resin or precursor subjected to supercritical fluid extraction may vary depending on the impeller speed and the reactor temperature in a reactor. In addition, a hardener can be used simultaneously during the mixing process. Here, the impeller speed and the reactor temperature can be individually controlled, but a preferred impeller speed can be 200 to 3000 rpm and a preferred reactor temperature can be 40 to 70 °C.

步驟a1)中,可進一步添加一或多種鏈伸長劑,其係選自由:1,4-丁二醇、4,4’-亞甲基雙(2-氯苯胺)、乙二醇、1,2-丙二醇、1,3-丙二醇、1,2-丁二醇、1,6-己二醇、新戊二醇、1,4-環己二醇、1,4-環己烷二甲醇、2,2,4-三甲基戊二醇、氫醌、雙(2-羥乙基)氫醌、4,4’-二羥基聯苯、雙酚A、雙酚F以及其混合物所組成之群組。In the step a1), one or more chain extenders may be further added, which are selected from the group consisting of: 1,4-butanediol, 4,4'-methylenebis(2-chloroaniline), ethylene glycol, 1, 2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,6-hexanediol, neopentyl glycol, 1,4-cyclohexanediol, 1,4-cyclohexanedimethanol, 2,2,4-trimethylpentanediol, hydroquinone, bis(2-hydroxyethyl)hydroquinone, 4,4'-dihydroxybiphenyl, bisphenol A, bisphenol F, and mixtures thereof Group.

步驟a2)中,硬化製程可在70至100℃實施歷時4至48小時。In step a2), the hardening process can be carried out at 70 to 100 ° C for 4 to 48 hours.

步驟a)中,就使用一聚胺甲酸酯樹脂製造一板而言,該聚胺甲酸酯可由一有機聚異氰酸酯、一聚胺甲酸酯預聚合物、一聚醇化合物及一鏈伸長劑所製備。In the step a), in the case of using a polyurethane resin to produce a sheet, the polyurethane may be elongated from an organic polyisocyanate, a polyurethane prepolymer, a polyalcohol compound and a chain. Prepared by the agent.

於此,可包括:1至20%重之有機聚異氰酸酯、10至88%重之聚胺甲酸酯預聚合物、10至88%重之聚醇化合物及1至50%重之鏈伸長劑。Herein, it may include: 1 to 20% by weight of organic polyisocyanate, 10 to 88% by weight of polyurethane prepolymer, 10 to 88% by weight of polyol compound and 1 to 50% by weight of chain extender .

該有機聚異氰酸酯之例子可包括:芳香族二異氰酸酯(如:2,4-甲苯二異氰酸酯(2,4-toluene diisocyanate)、2,6-甲苯二異氰酸酯(2,6-toluene diisocyanate)、2,2’-二苯甲烷二異氰酸酯(2,2’-diphenylmethane diisocyanate)、2,4’-二苯甲烷二異氰酸酯(2,4’-diphenylmethane diisocyanate)、4,4’-二苯甲烷二異氰酸酯(4,4’-diphenylmethane diisocyanate)、1,5-萘二異氰酸酯(1,5-naphthalene diisocyanate)、對伸苯基二異氰酸酯(p-phenylene diisocyanate)、間伸苯基二異氰酸酯(m-phenylene diisocyanate)及間茬基二異氰酸酯(m-xylylene diisocyanate));脂肪族二異氰酸酯(aliphatic diisocyanates)(如:二異氰酸伸乙酯(ethylenediisocyanate)、2,2,4-二異氰酸三甲基六亞甲酯(2,2,4-trimethylhexamethylene diisocyanate)及1,6-二異氰酸六亞甲酯(1,6-hexamethylene diisocyanate));以及環脂族二異氰酸酯(cycloaliphatic diisocyanates)(如:1,4-環己烷二異氰酸酯(1,4-cyclohexane diisocyanate)、4,4’-二環己基甲烷二異氰酸酯(4,4’-dicyclohexylmethane diisocyanate)、異佛酮二異氰酸酯(isophorone diisocyanate)、氫化間茬基二異氰酸酯(hydrogenated m-xylylene diisocyanate)以及降莰烷二異氰酸酯(norbornane diisocyanate)。可使用其一或二或多種之混合物。然而,該有機聚異氰酸酯不限於此。Examples of the organic polyisocyanate may include: an aromatic diisocyanate (e.g., 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 2, 2'2'-diphenylmethane diisocyanate, 2,4'-diphenylmethane diisocyanate, 4,4'-diphenylmethane diisocyanate (4 , 4'-diphenylmethane diisocyanate), 1,5-naphthalene diisocyanate, p-phenylene diisocyanate, m-phenylene diisocyanate, and M-xylylene diisocyanate; aliphatic diisocyanates (eg ethylenediisocyanate, 2,2,4-diisocyanate trimethylhexa) Methyl (2,2,4-trimethylhexamethylene diisocyanate) and 1,6-hexamethylene diisocyanate); and cycloaliphatic diisocyanates (eg 1, 4-cyclohexane diisocyanate e), 4,4'-dicyclohexylmethane diisocyanate, isophorone diisocyanate, hydrogenated m-xylylene diisocyanate, and hail Norbornane diisocyanate. A mixture of one or two or more kinds thereof may be used. However, the organic polyisocyanate is not limited thereto.

該有機聚異氰酸酯不僅包含上述之二異氰酸酯化合物而且包含多官能(三官能或更多)之聚異氰酸酯化合物。作為多官能異氰酸酯化合物,Desmodule-N(由Bayer Ltd.製造)或在Duranate(Asahi Kasei Corporation)商標名下一系列之二異氰酸酯加合物化合物可由商業購買。The organic polyisocyanate contains not only the above-mentioned diisocyanate compound but also a polyfunctional (trifunctional or more) polyisocyanate compound. As the polyfunctional isocyanate compound, a series of diisocyanate adduct compounds of Desmodule-N (manufactured by Bayer Ltd.) or under the trade name of Duranat (Asahi Kasei Corporation) are commercially available.

該聚醇化合物以高分子量聚醇例示(如:聚醚聚醇、聚酯聚醇、聚碳酸酯聚醇以及丙烯多元醇(acryl polyol)。除了高分子量聚醇外,亦使用低分子量聚醇。此類聚醇化合物可以二或多種之混合物使用。然而,該聚醇化合物不限於此。The polyol compound is exemplified by high molecular weight polyalcohols (eg, polyether polyols, polyester polyols, polycarbonate polyols, and acryl polyols. In addition to high molecular weight polyols, low molecular weight polyols are also used. Such a polyol compound may be used in a mixture of two or more kinds. However, the polyol compound is not limited thereto.

該有機聚異氰酸酯、聚醇化合物及鏈伸長劑之比例依每一化合物之分子量或由此類化合物(如:研磨墊)製造的聚胺甲酸酯之用途及期望性質而變化。為獲得具有期望研磨性質之一研磨墊,有機聚異氰酸酯之異氰酸酯數目對於該聚醇化合物及鏈伸長劑(羥基、胺基等之活化氫基數目)之官能基總數之範圍可較佳地從0.95到1.15,且更較佳地從0.99至1.10。同時,在聚醇化合物中高分子量成分對低分子量成分之比值可由其所製造之聚胺甲酸酯的所需性質而決定。The ratio of the organic polyisocyanate, the polyol compound, and the chain extender varies depending on the molecular weight of each compound or the use and desired properties of the polyurethane produced by such a compound (e.g., a polishing pad). In order to obtain a polishing pad having one of the desired abrasive properties, the number of isocyanates of the organic polyisocyanate may preferably range from 0.95 to the total number of functional groups of the polyol compound and the chain extender (the number of activated hydrogen groups of the hydroxyl group, the amine group, etc.). To 1.15, and more preferably from 0.99 to 1.10. Meanwhile, the ratio of the high molecular weight component to the low molecular weight component in the polyhydric alcohol compound can be determined by the desired properties of the polyurethane to which it is produced.

步驟a)中,就使用一聚胺甲酸酯樹脂製造一板而言,該作為基質之聚胺甲酸酯樹脂可由胺甲酸乙酯技術之應用(如一熔融法、一溶液法或其類似法)而製得。且考慮到花費以及操作環境,以熔融法較佳。In the step a), in the case of using a polyurethane resin to produce a sheet, the matrix-based polyurethane resin can be applied by an urethane technique (for example, a melt method, a solution method or the like). ) made. In view of cost and operating environment, the melting method is preferred.

單擊(one-shot)及預聚合物法之任一種可應用於聚胺甲酸酯之製造。然而,就製得的聚胺甲酸酯之物理特性而言,適合的為一預聚合物法,其中由有機聚異氰酸酯及聚醇化合物之一異氰酸酯末端預聚合物事先合成且一鏈伸長劑與此反應。Any one of the one-shot and prepolymer methods can be applied to the manufacture of polyurethanes. However, in terms of the physical properties of the obtained polyurethane, a prepolymer method in which an isocyanate terminal prepolymer of one of an organic polyisocyanate and a polyol compound is synthesized in advance and a chain extender is This reaction.

同時,若適合於本發明,且亦可使用於以預聚合物法製造聚胺甲酸酯之生產上,可使用由有機聚異氰酸酯及聚醇化合物所製造之任何商業上可購得之異氰酸酯末端預聚合物。具有約800至5000之一分子量的異氰酸酯末端預聚合物就加工性(processibility)及物理特性而言是適合的。Also, if it is suitable for the present invention, and can also be used in the production of polyurethanes by a prepolymer process, any commercially available isocyanate end made from organic polyisocyanates and polyalcohol compounds can be used. Prepolymer. Isocyanate terminal prepolymers having a molecular weight of from about 800 to 5,000 are suitable in terms of processibility and physical properties.

在預聚合物法中,異氰酸酯末端預聚合物為一含有異氰酸酯基之化合物,且該鏈伸長劑(若需要的話,聚醇化合物)為一含有活化氫基之化合物。在單擊(one-shot)製程中,該有機聚異氰酸酯為一含有異氰酸酯基之化合物,且該鏈伸長劑及該聚醇化合物為一含有活化氫基之化合物。In the prepolymer process, the isocyanate terminal prepolymer is a compound containing an isocyanate group, and the chain extender (polyalcohol compound if necessary) is a compound containing an activated hydrogen group. In the one-shot process, the organic polyisocyanate is a compound containing an isocyanate group, and the chain extender and the polyalcohol compound are a compound containing an activated hydrogen group.

聚胺甲酸酯之製造中,如果需要的話,安定劑(如抗氧化劑、界面活性劑、潤滑劑、色素、填充物、抗靜電劑以及其他添加劑)可添加至聚胺甲酸酯儲存溶液。In the manufacture of polyurethanes, stabilizers (such as antioxidants, surfactants, lubricants, pigments, fillers, antistatic agents, and other additives) can be added to the polyurethane storage solution, if desired.

步驟b)中,將該超臨界流體注入步驟a)所製造之該聚合物樹脂板之方法,可藉由包括有使用高壓以推進超臨界流體進入該聚合物樹脂板的經加壓之氣體噴射製程而實施。In the step b), the method of injecting the supercritical fluid into the polymer resin sheet produced in the step a) can be carried out by including a pressurized gas jet using a high pressure to advance the supercritical fluid into the polymer resin sheet. Implemented by the process.

步驟b)中的該超臨界流體注入該聚合物樹脂板將詳細描述。The injection of the supercritical fluid in step b) into the polymer resin sheet will be described in detail.

於此,超臨界流體指一材料,於通常溫度及壓力具有液體及氣體兩者之特性,處在高於超臨界點之一臨界狀態,意即,處於高溫及高壓之一液體無法區別出一氣體時稱為一超臨界點,因為一化學品可不再被蒸發。Herein, the supercritical fluid refers to a material which has the characteristics of both liquid and gas at normal temperature and pressure, and is at a critical state higher than the supercritical point, that is, one of the liquids at a high temperature and a high pressure cannot be distinguished. The gas is called a supercritical point because a chemical can no longer be evaporated.

該超臨界流體係藉由對於氣體增加溫度及壓力所製造,該溫度及壓力足以維持該流體在一超臨界狀態。The supercritical flow system is produced by increasing the temperature and pressure of the gas, which is sufficient to maintain the fluid in a supercritical state.

該氣體可為碳氫化合物、氟氯碳化物、氫氟氯碳化物(如:氟氯烷)、氮、二氧化碳、一氧化碳或其組合。The gas can be a hydrocarbon, a chlorofluorocarbon, a hydrochlorofluorocarbon (e.g., chlorofluorocarbon), nitrogen, carbon dioxide, carbon monoxide, or a combination thereof.

較佳的氣體為不可燃氣體,例如:無C-H鍵之氣體。更佳地,該氣體為氮、二氧化碳或其組合。更佳地,該氣體為二氧化碳或含二氧化碳之氣體。Preferred gases are non-flammable gases, such as gases without C-H bonds. More preferably, the gas is nitrogen, carbon dioxide or a combination thereof. More preferably, the gas is carbon dioxide or a gas containing carbon dioxide.

較佳的是在注入該聚合物樹脂板前,將該氣體轉換為超臨界氣體。It is preferred to convert the gas into a supercritical gas before injecting the polymer resin sheet.

若該氣體為二氧化碳,溫度超過31℃且壓力範圍由7 MPa(約1000 psi)至35 MPa(約5000 psi)(如:19 MPa(約2800 psi)至26 MPa(約3800 psi))。If the gas is carbon dioxide, the temperature exceeds 31 ° C and the pressure ranges from 7 MPa (about 1000 psi) to 35 MPa (about 5000 psi) (eg, 19 MPa (about 2800 psi) to 26 MPa (about 3800 psi)).

步驟b)之該超臨界流體可較佳地包含選自:超臨界二氧化碳、超臨界異丁烷、超臨界丁烷、超臨界丙烷、超臨界戊烷、以及超臨界氮之一或多種。The supercritical fluid of step b) may preferably comprise one or more selected from the group consisting of supercritical carbon dioxide, supercritical isobutane, supercritical butane, supercritical propane, supercritical pentane, and supercritical nitrogen.

步驟b)於50至300 atm之一壓力以及25至120℃之一溫度實施,且較佳地於70至200 atm之一壓力以及30至80℃之一溫度實施。步驟b)係於該技術領域已知之一超臨界設備實施。Step b) is carried out at a pressure of one of 50 to 300 atm and a temperature of 25 to 120 ° C, and preferably at a pressure of one of 70 to 200 atm and a temperature of 30 to 80 ° C. Step b) is one of the supercritical device implementations known in the art.

步驟b)中,一超臨界流體萃取方法可由與丙酮、醇類或其類似物混合實施。In step b), a supercritical fluid extraction method can be carried out by mixing with acetone, an alcohol or the like.

於此,當注射超臨界流體時,該溶劑可同時添加,或該溶劑事先置於一超臨界反應器中,接著實施混合製程。該溶劑可依包含聚合物樹脂板經超臨界流體萃取處理之該物體而變化。例如,丙酮、醇類或己烷為一材料能良好的溶解經超臨界流體萃取處理之該物體。Here, when the supercritical fluid is injected, the solvent may be simultaneously added, or the solvent may be previously placed in a supercritical reactor, followed by a mixing process. The solvent may vary depending on the object comprising the polymeric resin sheet treated by supercritical fluid extraction. For example, acetone, alcohol or hexane is a material that dissolves the object treated by supercritical fluid extraction well.

確切而言,當步驟b)之超臨界流體注入步驟a)製造之該聚合物樹脂板,該超臨界流體溶解包含於聚合物樹脂板中經超臨界流體萃取處理之該物體,因此於步驟a)製造之聚合物樹脂板內形成孔洞而無殘餘物。於此,該形成之孔洞可為密閉性孔洞,其中該密閉性孔洞指不連接至其他孔洞之一孔洞。Specifically, when the supercritical fluid of step b) is injected into the polymer resin sheet produced in step a), the supercritical fluid dissolves the object contained in the polymer resin sheet subjected to supercritical fluid extraction, thus in step a A hole is formed in the manufactured polymer resin sheet without residue. Here, the formed hole may be a closed hole, wherein the closed hole refers to a hole that is not connected to one of the other holes.

步驟b)中,形成於聚合物樹脂板內之該孔洞可為圓或卵形,但不限於此。In the step b), the pores formed in the polymer resin sheet may be round or oval, but are not limited thereto.

步驟b)中,形成於聚合物樹脂板內之該孔洞可具有80微米或較小之一平均直徑,較佳地為5至50微米,且更佳地為10至30微米。於此,該孔洞之平均直徑指數個由其圓周通過圓心的線條的平均值。In the step b), the pores formed in the polymer resin sheet may have an average diameter of 80 μm or less, preferably 5 to 50 μm, and more preferably 10 to 30 μm. Here, the average diameter of the holes is an average of the lines passing through the center of the circle.

步驟b)中,具有形成於其內的孔洞之該板可具有0.5至1 g/cm3 之密度,較佳地為0.6至1 g/cm3 ,更佳地為0.7至0.9 g/cm3In the step b), the plate having the pores formed therein may have a density of 0.5 to 1 g/cm 3 , preferably 0.6 to 1 g/cm 3 , more preferably 0.7 to 0.9 g/cm 3 . .

步驟b)中,具有形成於其內的孔洞之該板可具有50%或更少之一孔隙率(porosity),較佳地為10至50%之一孔隙率,更佳地為20至40%之一孔隙率。In the step b), the sheet having the pores formed therein may have a porosity of 50% or less, preferably 10 to 50%, more preferably 20 to 40. One of the porosity.

確切而言,依據本發明,孔洞可形成於聚合物樹脂板內而無殘餘物(請參見圖2)。然而,已知的高壓氣體發泡方法中,當發泡製程經由注射入該硬化(即,交聯)之聚胺甲酸酯而達成,此處有一問題為發泡會依硬化之程度可能不產生。在不交聯或具低的係數之聚胺甲酸酯中,發泡係經由加壓之氣體噴射產生,但實際上,其未顯示出適合於CMP墊之性質。當該發泡製程由加壓氣體法以具有一高硬化程度之聚胺甲酸酯實施時,發泡不會產生、或聚合性基質可被破壞(請參見圖4)。Specifically, according to the present invention, the pores can be formed in the polymer resin sheet without residue (see Fig. 2). However, in the known high pressure gas foaming method, when the foaming process is carried out by injection into the hardened (i.e., crosslinked) polyurethane, there is a problem that the degree of hardening may not be due to the degree of hardening. produce. In polyurethanes that do not crosslink or have a low coefficient, the foaming is produced via pressurized gas jet, but in practice, it does not exhibit properties suitable for CMP mats. When the foaming process is carried out by a pressurized gas method with a polyurethane having a high degree of hardening, foaming does not occur, or the polymerizable matrix can be destroyed (see Fig. 4).

同時,本發明提供由上述方法所製造之一多孔板。Meanwhile, the present invention provides a porous plate manufactured by the above method.

本發明之多孔板可用作一研磨墊。該多孔板可用於作為一研磨墊,單數的及複數的多孔板疊合並用作一研磨墊。此外,連接至該多孔板之其他薄膜可用作一研磨墊。The perforated plate of the present invention can be used as a polishing pad. The perforated plate can be used as a polishing pad, and the singular and plural porous plate stacks are combined for use as a polishing pad. Further, other films attached to the perforated plate can be used as a polishing pad.

於下,本發明將搭配圖1詳細說明。Hereinafter, the present invention will be described in detail in conjunction with FIG.

如圖1所示,聚胺甲酸酯之預聚合物與溶解於超臨界流體之脂肪族烴、萘或魚油混合並良好地分散。此預聚合物混合溶液與作為一鏈鏈伸長劑之1,4-丁二醇或4,4’-亞甲基雙(2-氯苯胺)反應以形成聚合物鏈。此合成物於100℃烘箱經硬化歷時4小時至6小時,並透過一鑄型形成為一期望形狀。該經硬化之聚胺甲酸酯置於一超臨界設備以萃取一溶質。於此,CO2 可用作一超臨界流體,且超臨界流體萃取可由與丙酮或醇類混合而實施。具體地說,一材料(如丙酮或醇類)被放進一聚胺甲酸酯板中以被同時萃取。即,將一適當量之丙酮或醇類置於超臨界流體萃取設備中,接著關閉超臨界流體萃取設備,其後注入CO2 達一期望壓力。或者,同時注入CO2 進該超臨界設備。As shown in Fig. 1, the prepolymer of the polyurethane is mixed with the aliphatic hydrocarbon, naphthalene or fish oil dissolved in the supercritical fluid and well dispersed. This prepolymer mixed solution is reacted with 1,4-butanediol or 4,4'-methylenebis(2-chloroaniline) as a chain extender to form a polymer chain. The composition was hardened in an oven at 100 ° C for 4 hours to 6 hours and formed into a desired shape through a mold. The hardened polyurethane is placed in a supercritical device to extract a solute. Here, CO 2 can be used as a supercritical fluid, and supercritical fluid extraction can be carried out by mixing with acetone or an alcohol. Specifically, a material such as acetone or an alcohol is placed in a polyurethane plate to be simultaneously extracted. That is, a suitable amount of acetone, alcohol or supercritical fluid extraction apparatus is placed, followed by closing the supercritical fluid extraction equipment, followed by injection of a desired CO 2 pressure. Alternatively, simultaneously inject CO 2 into the supercritical device.

[發明範例][Example of invention]

於下,本發明將搭配例子更加詳細說明。Hereinafter, the present invention will be described in more detail with examples.

實施例1Example 1

在實施例1中,首先將預聚合物及辛烷互相混合以製備一混合溶液。L325(由Chemtura製造,NCO% 9.17%)用作為預聚合物,且辛烷用作為經超臨界流體萃取處理之一物體(溶於超臨界流體中),即,作為一造孔原(porogen)。In Example 1, the prepolymer and octane were first mixed with each other to prepare a mixed solution. L325 (manufactured by Chemtura, NCO% 9.17%) is used as a prepolymer, and octane is used as an object treated by supercritical fluid extraction (dissolved in a supercritical fluid), ie, as a porogen .

首先,將預聚合物1000 g及辛烷400 g置於一50℃反應器,且互相混合歷時5分鐘。於此例中,辛烷分散於預聚合物中形成為預聚合物內的球狀液滴。其後,將MOCA(亞甲基雙(2-氯苯胺),methylenebis(2-chloroaniline))加入其中,接著混合。該經製備之聚胺甲酸酯混合物倒入一鑄型,並在室溫下凝膠化歷時1小時,其後於100℃烘箱硬化歷時24小時。First, 1000 g of prepolymer and 400 g of octane were placed in a 50 ° C reactor and mixed with each other for 5 minutes. In this case, octane is dispersed in the prepolymer to form a spherical droplet in the prepolymer. Thereafter, MOCA (methylenebis(2-chloroaniline), methylenebis (2-chloroaniline)) was added thereto, followed by mixing. The prepared polyurethane mixture was poured into a mold and gelled at room temperature for 1 hour, followed by oven hardening at 100 ° C for 24 hours.

該經硬化之聚胺甲酸酯混合物以3 mm之一厚度切割,並置於一超臨界流體萃取設備。將該超臨界流體萃取設備之溫度設在45℃,並將二氧化碳加壓進入該設備,且使該壓力維持在150 bar。該混合物維持在該設備中歷時1小時,接著減壓。該聚胺甲酸酯樣品自該設備取出後,留在室溫下歷時1小時,其後置於100℃烘箱歷時1小時。The hardened polyurethane mixture was cut at a thickness of 3 mm and placed in a supercritical fluid extraction apparatus. The temperature of the supercritical fluid extraction apparatus was set at 45 ° C, and carbon dioxide was pressurized into the apparatus, and the pressure was maintained at 150 bar. The mixture was maintained in the apparatus for 1 hour followed by reduced pressure. The polyurethane sample was taken out of the apparatus, left at room temperature for 1 hour, and then placed in a 100 ° C oven for 1 hour.

該經製備之樣品具有0.802 g/cm3 之一密度以及50之一Shore D硬度。該樣品之SEM照片顯示於圖2。該樣品之儲存模數及δ正切值(tan delta)顯示於圖3。The prepared sample had a density of 0.802 g/cm 3 and a hardness of 50 Shore D. A SEM photograph of this sample is shown in Figure 2. The storage modulus and tan delta of the sample are shown in Figure 3.

確切而言,當依據本發明由超臨界流體萃取(SFE)而製造一多孔板時,可形成孔洞而不會在該板中留有殘餘物,因為該方法藉由萃取溶解於超臨界流體之一材料而實施。因此,可減少在研磨製程期間因該板之殘餘物而在一研磨物體上的刮痕產生,且可改善製程效率。Specifically, when a porous plate is produced by supercritical fluid extraction (SFE) according to the present invention, pores can be formed without leaving a residue in the plate because the method is dissolved in the supercritical fluid by extraction. Implemented as one of the materials. Therefore, the generation of scratches on an abrasive object due to the residue of the board during the polishing process can be reduced, and the process efficiency can be improved.

實施例2Example 2

在實施例2中,首先將預聚合物及MOCA混合,接著將辛烷與其混合。In Example 2, the prepolymer and MOCA were first mixed, followed by mixing with octane.

首先,將作為一預聚合物的L325(由Chemtura製造,NCO% 9.17%) 1000 g置於一反應器,且該溫度維持在50℃。將事先溶解的MOCA 260 g置入並以1000 rpm混合歷時30秒,接著將辛烷400 g與其混合。First, L325 (manufactured by Chemtura, NCO% 9.17%) 1000 g as a prepolymer was placed in a reactor, and the temperature was maintained at 50 °C. The previously dissolved MOCA 260 g was placed and mixed at 1000 rpm for 30 seconds, followed by mixing octane 400 g with it.

將該經製備之聚胺甲酸酯混合物倒入一鑄型,並在室溫下凝膠化歷時30分鐘,其後於100℃烘箱硬化歷時16小時。The prepared polyurethane mixture was poured into a mold and gelled at room temperature for 30 minutes, followed by oven hardening at 100 ° C for 16 hours.

將該經硬化之聚胺甲酸酯混合物以3 mm之一厚度切割,並置於一超臨界流體萃取設備。將該超臨界流體萃取設備之溫度設在40℃,並將二氧化碳加壓進入該設備,且該壓力維持在100 bar。將該混合物維持在該設備中歷時2小時,接著減壓。將該聚胺甲酸酯樣品自該設備取出後,留在室溫下歷時1小時,其後置於100℃烘箱歷時1小時。The hardened polyurethane mixture was cut at a thickness of 3 mm and placed in a supercritical fluid extraction apparatus. The temperature of the supercritical fluid extraction apparatus was set at 40 ° C, and carbon dioxide was pressurized into the apparatus, and the pressure was maintained at 100 bar. The mixture was maintained in the apparatus for 2 hours, followed by reduced pressure. The polyurethane sample was taken out of the apparatus, left at room temperature for 1 hour, and then placed in a 100 ° C oven for 1 hour.

實施例3Example 3

在實施例3中,為了製造具有高模數之一墊,添加H12 MDI。In Example 3, in order to manufacture a pad having a high modulus, H 12 MDI was added.

該實驗以如實施例1之相同方式實施,但須將H12 MDI添加至L325,以製備NCO% 9.7%之預聚合物。實施例3中該製出的墊之儲存模數及δ正切值(tan delta)係顯示於圖3。The experiment was carried out in the same manner as in Example 1, except that H 12 MDI was added to L325 to prepare a prepolymer having an NCO % of 9.7%. The storage modulus and tan delta of the mat produced in Example 3 are shown in Fig. 3.

實施例4Example 4

在實施例4中,為了製造具有高模數之一墊,係添加H12 MDI。In Example 4, in order to manufacture a pad having a high modulus, H 12 MDI was added.

該實驗以如實施例1之相同方式實施,但須將H12 MDI添加至L325,以製備NCO% 11%之預聚合物。實施例4中該製出的墊之儲存模數及δ正切值(tan delta)顯示於圖3。The experiment was carried out in the same manner as in Example 1, except that H 12 MDI was added to L325 to prepare a NCO% 11% prepolymer. The storage modulus and tan delta of the mat produced in Example 4 are shown in Fig. 3.

實施例5Example 5

在實施例5中,為了製造具有高模數之一墊,係添加H12 MDI。In Example 5, in order to manufacture a pad having a high modulus, H 12 MDI was added.

該實驗以如實施例1之相同方式實施,但須將H12 MDI添加至L325,以製備NCO% 12%之預聚合物。實施例5中該製出的墊之儲存模數及δ正切值(tan delta)顯示於圖3。The experiment was carried out in the same manner as in Example 1, except that H 12 MDI was added to L325 to prepare a NCO% 12% prepolymer. The storage modulus and tan delta of the pad produced in Example 5 are shown in Fig. 3.

實施例6Example 6

首先,將預聚合物1000 g及辛烷300 g置於一50℃反應器,且互相混合歷時2分鐘。於此例中,辛烷及十二烷分散於預聚合物中形成為預聚合物內的球狀液滴(1至100微米)。其後,將MOCA(亞甲基雙(2-氯苯胺),methylenebis(2-chloroaniline))加入其中,接著混合。將該製備之聚胺甲酸酯混合物倒入一鑄型,並在室溫下凝膠化歷時1小時,其後於100℃烘箱硬化歷時24小時。在硬化製程後,該實驗以如實施例1之相同方式實施。製得的墊之孔洞具有10至70微米之一直徑。First, 1000 g of prepolymer and 300 g of octane were placed in a 50 ° C reactor and mixed with each other for 2 minutes. In this case, octane and dodecane are dispersed in the prepolymer to form spherical droplets (1 to 100 microns) in the prepolymer. Thereafter, MOCA (methylenebis(2-chloroaniline), methylenebis (2-chloroaniline)) was added thereto, followed by mixing. The prepared polyurethane mixture was poured into a mold and gelled at room temperature for 1 hour, followed by oven hardening at 100 ° C for 24 hours. After the hardening process, the experiment was carried out in the same manner as in Example 1. The holes of the resulting mat have a diameter of one of 10 to 70 microns.

實施例7Example 7

如實施例1之相同方式,將該經硬化之墊板置於該超臨界流體萃取設備。將溫度及壓力分別地維持在50℃及150 bar。在1小時候,除去該壓力,且取出該板,並將CO2 從100℃烘箱中徹底地移除。該製得的之墊具有0.75 g/cm3 之密度。The hardened backing sheet was placed in the supercritical fluid extraction apparatus in the same manner as in Example 1. The temperature and pressure were maintained at 50 ° C and 150 bar, respectively. After 1 hour, the pressure was removed, and the plate removed, and the CO 2 is removed from the oven at 100 deg.] C completely. The resulting pad had a density of 0.75 g/cm 3 .

實施例1及實施例3至5之實驗結果(儲存模數及δ正切值(tan delta))係顯示於圖3,且圖3之儲存模數及δ正切值(tan delta)測量方法將詳細敘述。該儲存模數及δ正切值(tan delta)在1.5 Hz之一頻率及0.05 mm之振幅下使用DMA8000(由PerkinElmer製造)測量,在-10℃至100℃之溫度掃描。The experimental results (storage modulus and tan delta) of Example 1 and Examples 3 to 5 are shown in Figure 3, and the storage modulus and tan delta measurement method of Figure 3 will be detailed. Narrative. The storage modulus and the tan delta were measured using a DMA8000 (manufactured by PerkinElmer) at a frequency of 1.5 Hz and an amplitude of 0.05 mm, and scanned at a temperature of -10 ° C to 100 ° C.

如圖3所示,實施例1中製得的該樣品(NCO% 9.17%)之儲存模數及δ正切值(tan delta)在25℃時有396.5 MPa。As shown in Fig. 3, the storage modulus and the tan delta of the sample (NCO% 9.17%) prepared in Example 1 were 396.5 MPa at 25 °C.

該樣品之儲存模數(其係藉由添加H12 MDI而其中NCO%增加至9.7、11或12%)分別地為446.8、580.3、698.4 MPa,顯示NCO%之增加可改善儲存模數。The storage modulus of the sample, which was increased by the addition of H 12 MDI with NCO% to 9.7, 11 or 12%, was 446.8, 580.3, 698.4 MPa, respectively, indicating that an increase in NCO% improved the storage modulus.

同時,如圖3所示,δ正切值(tan delta)傾向當儲存模數增加時降低。Meanwhile, as shown in FIG. 3, the tan delta tendency tends to decrease as the storage modulus increases.

對照例Control case

首先,將作為一預聚合物的L325(由Chemtura製造,NCO% 9.17%) 1000 g置於一50℃反應器,並混合歷時5分鐘。其後,將MOCA(亞甲基雙(2-氯苯胺),methylenebis(2-chloroaniline))260 g加入其中,接著混合。該製備之聚胺甲酸酯混合物倒入一鑄型,並在室溫下凝膠化歷時1小時,其後於100℃烘箱硬化歷時24小時。First, 1000 g of L325 (manufactured by Chemtura, NCO% 9.17%) 1000 g as a prepolymer was placed in a 50 ° C reactor and mixed for 5 minutes. Thereafter, MOCA (methylenebis(2-chloroaniline)), 260 g of methylenebis (2-chloroaniline) was added thereto, followed by mixing. The prepared polyurethane mixture was poured into a mold and gelled at room temperature for 1 hour, followed by oven hardening at 100 ° C for 24 hours.

將該經硬化之聚胺甲酸酯混合物以3 mm之一厚度切割,並置於一超臨界發泡設備。使該超臨界發泡設備之溫度設在45℃,並將二氧化碳加壓進入該設備,且該壓力維持在150 bar。該混合物維持在該設備中歷時一小時,接著減壓。該聚胺甲酸酯樣品自該設備取出後,留在室溫下歷時1小時,其後置於100℃烘箱歷時1小時。The hardened polyurethane mixture was cut at a thickness of 3 mm and placed in a supercritical foaming apparatus. The temperature of the supercritical foaming apparatus was set at 45 ° C, and carbon dioxide was pressurized into the apparatus, and the pressure was maintained at 150 bar. The mixture was maintained in the apparatus for one hour and then depressurized. The polyurethane sample was taken out of the apparatus, left at room temperature for 1 hour, and then placed in a 100 ° C oven for 1 hour.

取得依據比較例之該板之一SEM照片。因此,發現有裂痕,如圖4所示。結果表明,一旦由加壓氣體法發泡具高硬化程度之聚胺甲酸酯時,該聚合性基質會被破壞,如圖4所示。An SEM photograph of one of the plates according to the comparative example was obtained. Therefore, cracks were found, as shown in FIG. The results show that once the polyurethane having a high degree of hardening is foamed by the pressurized gas method, the polymerizable matrix is destroyed as shown in FIG.

圖1為一圖表,描述依據本發明製造一多孔板之方法。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a diagram depicting a method of making a multi-well plate in accordance with the present invention.

圖2為依據本發明實施例1之多孔板之一SEM照片。Figure 2 is a SEM photograph of one of the perforated plates according to Example 1 of the present invention.

圖3為一圖表,顯示實施例1及實施例3至5之實驗結果。Fig. 3 is a graph showing the experimental results of Example 1 and Examples 3 to 5.

圖4為依據對照例之多孔板之一SEM照片。Figure 4 is a SEM photograph of one of the perforated plates according to the comparative example.

(該圖為一流程圖故無元件代表符號)(The figure is a flow chart, so there is no component symbol)

Claims (13)

一種製造一多孔板之方法,包含步驟:a)製造包含經由溶解於超臨界流體之超臨界流體萃取處理之一物體之一聚合物樹脂板;以及b)將該超臨界流體注入該聚合物樹脂板,以萃取包含於聚合物樹脂板中經超臨界流體萃取處理之該物體,因此於該聚合物樹脂板中形成孔洞,其中,經超臨界流體萃取處理之該物體包含選自由:芳香族化合物、脂肪族烴、以及脂肪族醇之一或多種。 A method of making a multi-well plate comprising the steps of: a) fabricating a polymer resin sheet comprising one of an object treated by supercritical fluid extraction dissolved in a supercritical fluid; and b) injecting the supercritical fluid into the polymer a resin sheet for extracting the object subjected to supercritical fluid extraction treatment in the polymer resin sheet, thereby forming a void in the polymer resin sheet, wherein the object subjected to supercritical fluid extraction treatment comprises an aromatic selected from: One or more of a compound, an aliphatic hydrocarbon, and an aliphatic alcohol. 如申請專利範圍第1項所述之方法,其中步驟a)之聚合物樹脂板包括一聚合物樹脂,其係選自由:聚胺甲酸酯、熱塑彈性體、聚烯烴、聚碳酸酯、聚乙烯醇、尼龍、彈性體橡膠、苯乙烯基共聚物、聚芳香族化合物、氟聚合物、聚醯亞胺、交聯聚胺甲酸酯、交聯聚烯烴、聚醚、聚酯、聚丙烯酸酯、彈性體聚乙烯、聚四氟乙烯、聚對酞酸乙二酯(polyethylene terephthalate)、聚芳基化合物(polyarylene)、聚苯乙烯(polystyrene)、聚甲基丙烯酸酯(polymethylmethacrylate)、其共聚物、其嵌段共聚物、其混合物、以及其摻合物所組成之群組。 The method of claim 1, wherein the polymer resin sheet of step a) comprises a polymer resin selected from the group consisting of polyurethane, thermoplastic elastomer, polyolefin, polycarbonate, Polyvinyl alcohol, nylon, elastomer rubber, styrene-based copolymer, polyaromatic compound, fluoropolymer, polyimine, cross-linked polyurethane, cross-linked polyolefin, polyether, polyester, poly Acrylate, elastomeric polyethylene, polytetrafluoroethylene, polyethylene terephthalate, polyarylene, polystyrene, polymethylmethacrylate, A group of copolymers, block copolymers thereof, mixtures thereof, and blends thereof. 如申請專利範圍第1項所述之方法,其中步驟a)包括:步驟a1)混合經超臨界流體萃取處理之該物體與一聚合物樹脂或一前驅物;及a2)硬化步驟a1)之混合物。 The method of claim 1, wherein the step a) comprises: step a1) mixing the object treated by supercritical fluid extraction with a polymer resin or a precursor; and a2) a mixture of the hardening step a1) . 如申請專利範圍第3項所述之方法,其中步驟a1)中,進一步添加一或多種鏈伸長劑,其係選自由:1,4-丁二醇、 4,4’-亞甲基雙(2-氯苯胺)、乙二醇、1,2-丙二醇、1,3-丙二醇、1,2-丁二醇、1,6-己二醇、新戊二醇、1,4-環己二醇、1,4-環己烷二甲醇、2,2,4-三甲基戊二醇、氫醌、雙(2-羥乙基)氫醌、4,4’-二羥基聯苯、雙酚A、雙酚F、以及其混合物所組成之群組。 The method of claim 3, wherein in step a1), one or more chain extenders are further added, which are selected from the group consisting of: 1,4-butanediol, 4,4'-methylenebis(2-chloroaniline), ethylene glycol, 1,2-propanediol, 1,3-propanediol, 1,2-butanediol, 1,6-hexanediol, neopenta Glycol, 1,4-cyclohexanediol, 1,4-cyclohexanedimethanol, 2,2,4-trimethylpentanediol, hydroquinone, bis(2-hydroxyethyl)hydroquinone, 4 a group consisting of 4'-dihydroxybiphenyl, bisphenol A, bisphenol F, and mixtures thereof. 如申請專利範圍第3項所述之方法,其中步驟a2)中,該硬化製程係在70至100℃實施歷時4至48小時。 The method of claim 3, wherein in the step a2), the hardening process is carried out at 70 to 100 ° C for 4 to 48 hours. 如申請專利範圍第1項所述之方法,其中步驟a)中,經超臨界流體萃取處理之該物體以數量在5至50%之重量包含於聚合物樹脂板中。 The method of claim 1, wherein in the step a), the object subjected to supercritical fluid extraction is contained in the polymer resin sheet in an amount of 5 to 50% by weight. 如申請專利範圍第1項所述之方法,步驟b)之該超臨界流體包含選自於:超臨界二氧化碳、超臨界異丁烷、超臨界丁烷、超臨界丙烷、超臨界戊烷、以及超臨界氮之一或多種。 The method of claim 1, wherein the supercritical fluid comprises: supercritical carbon dioxide, supercritical isobutane, supercritical butane, supercritical propane, supercritical pentane, and One or more of supercritical nitrogen. 如申請專利範圍第1項所述之方法,其中步驟b)係於50至300atm之壓力以及25至120℃之溫度實施。 The method of claim 1, wherein the step b) is carried out at a pressure of 50 to 300 atm and a temperature of 25 to 120 °C. 如申請專利範圍第1項所述之方法,其中步驟b)中,形成於該聚合物樹脂板內之該孔洞具有80微米或更小之一平均直徑。 The method of claim 1, wherein in the step b), the pores formed in the polymer resin sheet have an average diameter of 80 μm or less. 如申請專利範圍第1項所述之方法,其中步驟b)中,具有該孔洞形成於該聚合物樹脂板內之該板具有0.5至1g/cm3 之一密度。The method of claim 1, wherein in the step b), the plate having the pores formed in the polymer resin sheet has a density of 0.5 to 1 g/cm 3 . 如申請專利範圍第1項所述之方法,其中步驟b)中,具有該孔洞之該聚合物樹脂板具有50%或更少之一孔隙率(porosity)。 The method of claim 1, wherein in step b), the polymer resin sheet having the pores has a porosity of 50% or less. 一種多孔板,係由如申請專利範圍第1至11項中任一項所述之方法製造。 A porous plate manufactured by the method of any one of claims 1 to 11. 一種研磨墊,其係包含有如申請專利範圍第12項所述之多孔板。 A polishing pad comprising the porous plate of claim 12 of the patent application.
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