TWI466162B - - Google Patents
Info
- Publication number
- TWI466162B TWI466162B TW101110045A TW101110045A TWI466162B TW I466162 B TWI466162 B TW I466162B TW 101110045 A TW101110045 A TW 101110045A TW 101110045 A TW101110045 A TW 101110045A TW I466162 B TWI466162 B TW I466162B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110407353.XA CN103165374B (en) | 2011-12-08 | 2011-12-08 | Plasma processing device and edge ring applied to the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201324577A TW201324577A (en) | 2013-06-16 |
| TWI466162B true TWI466162B (en) | 2014-12-21 |
Family
ID=48588362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101110045A TW201324577A (en) | 2011-12-08 | 2012-03-23 | Plasma processing device and edge ring applicable to the plasma processing device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103165374B (en) |
| TW (1) | TW201324577A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576305A (en) * | 2013-10-23 | 2015-04-29 | 中微半导体设备(上海)有限公司 | Self-cleaning vacuum treatment chamber |
| CN111180370A (en) * | 2020-02-21 | 2020-05-19 | 北京北方华创微电子装备有限公司 | Wafer bearing tray and semiconductor processing equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090000744A1 (en) * | 2007-06-28 | 2009-01-01 | Rajinder Dhindsa | Edge ring arrangements for substrate processing |
| TWM370181U (en) * | 2009-07-03 | 2009-12-01 | Advanced Micro Fab Equip Inc | A plasma processing apparatus |
| TW201129258A (en) * | 2010-02-12 | 2011-08-16 | Advanced Micro Fab Equip Inc | Plasma processing apparatus and processing method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6638871B2 (en) * | 2002-01-10 | 2003-10-28 | United Microlectronics Corp. | Method for forming openings in low dielectric constant material layer |
| US20050189068A1 (en) * | 2004-02-27 | 2005-09-01 | Kawasaki Microelectronics, Inc. | Plasma processing apparatus and method of plasma processing |
| KR100610010B1 (en) * | 2004-07-20 | 2006-08-08 | 삼성전자주식회사 | Apparatus for |
| US20070032081A1 (en) * | 2005-08-08 | 2007-02-08 | Jeremy Chang | Edge ring assembly with dielectric spacer ring |
| US20080296261A1 (en) * | 2007-06-01 | 2008-12-04 | Nordson Corporation | Apparatus and methods for improving treatment uniformity in a plasma process |
| CN201681788U (en) * | 2010-04-02 | 2010-12-22 | 中微半导体设备(上海)有限公司 | Reaction chamber part and plasma processing device employing same |
-
2011
- 2011-12-08 CN CN201110407353.XA patent/CN103165374B/en active Active
-
2012
- 2012-03-23 TW TW101110045A patent/TW201324577A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090000744A1 (en) * | 2007-06-28 | 2009-01-01 | Rajinder Dhindsa | Edge ring arrangements for substrate processing |
| TWM370181U (en) * | 2009-07-03 | 2009-12-01 | Advanced Micro Fab Equip Inc | A plasma processing apparatus |
| TW201129258A (en) * | 2010-02-12 | 2011-08-16 | Advanced Micro Fab Equip Inc | Plasma processing apparatus and processing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201324577A (en) | 2013-06-16 |
| CN103165374A (en) | 2013-06-19 |
| CN103165374B (en) | 2017-05-10 |