TWI463552B - - Google Patents

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Publication number
TWI463552B
TWI463552B TW097145089A TW97145089A TWI463552B TW I463552 B TWI463552 B TW I463552B TW 097145089 A TW097145089 A TW 097145089A TW 97145089 A TW97145089 A TW 97145089A TW I463552 B TWI463552 B TW I463552B
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TW
Taiwan
Application number
TW097145089A
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TW200929348A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of TW200929348A publication Critical patent/TW200929348A/zh
Application granted granted Critical
Publication of TWI463552B publication Critical patent/TWI463552B/zh

Links

TW97145089A 2007-11-21 2008-11-21 Examination method for trimming chemical mechanical polishing pad and related system thereof TW200929348A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US98977507A 2007-11-21 2007-11-21

Publications (2)

Publication Number Publication Date
TW200929348A TW200929348A (en) 2009-07-01
TWI463552B true TWI463552B (zh) 2014-12-01

Family

ID=44864460

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97145089A TW200929348A (en) 2007-11-21 2008-11-21 Examination method for trimming chemical mechanical polishing pad and related system thereof

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TW (1) TW200929348A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110871403A (zh) * 2018-08-31 2020-03-10 台湾积体电路制造股份有限公司 化学机械平坦化系统和使用其的方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5801066A (en) * 1995-09-29 1998-09-01 Micron Technology, Inc. Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers
TW515021B (en) * 2000-09-29 2002-12-21 Strasbaugh Inc Polishing pad with built-in optical sensor
US20040176018A1 (en) * 2003-03-03 2004-09-09 Elledge Jason B. Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
US20060172662A1 (en) * 2005-01-31 2006-08-03 Tech Semiconductor Singapore Pte. Ltd. Real time monitoring of cmp pad conditioning process
TWI286502B (en) * 2003-03-28 2007-09-11 Intel Corp Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads
TWI287485B (en) * 2006-05-09 2007-10-01 Powerchip Semiconductor Corp Retaining ring with dresser for CMP
US20080004743A1 (en) * 2006-06-28 2008-01-03 3M Innovative Properties Company Abrasive Articles, CMP Monitoring System and Method

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5801066A (en) * 1995-09-29 1998-09-01 Micron Technology, Inc. Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers
TW515021B (en) * 2000-09-29 2002-12-21 Strasbaugh Inc Polishing pad with built-in optical sensor
US20040176018A1 (en) * 2003-03-03 2004-09-09 Elledge Jason B. Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces
TWI286502B (en) * 2003-03-28 2007-09-11 Intel Corp Diamond conditioning of soft chemical mechanical planarization/polishing (CMP) polishing pads
US20060172662A1 (en) * 2005-01-31 2006-08-03 Tech Semiconductor Singapore Pte. Ltd. Real time monitoring of cmp pad conditioning process
TWI287485B (en) * 2006-05-09 2007-10-01 Powerchip Semiconductor Corp Retaining ring with dresser for CMP
US20080004743A1 (en) * 2006-06-28 2008-01-03 3M Innovative Properties Company Abrasive Articles, CMP Monitoring System and Method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
H. Xiao, "Introduction to semiconductor manufacturing technology," 2001 M. Quirk, " Semiconductor manufacturing technology," 2001 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110871403A (zh) * 2018-08-31 2020-03-10 台湾积体电路制造股份有限公司 化学机械平坦化系统和使用其的方法
CN110871403B (zh) * 2018-08-31 2022-02-18 台湾积体电路制造股份有限公司 化学机械平坦化系统和使用其的方法
US11806833B2 (en) 2018-08-31 2023-11-07 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical planarization system and a method of using the same

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Publication number Publication date
TW200929348A (en) 2009-07-01

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MM4A Annulment or lapse of patent due to non-payment of fees