TWI462127B - Common mode filter with multi spiral layer structure - Google Patents

Description

Multimode helical structure common mode filter

The invention relates to a common mode filter, in particular to a multimode spiral structure common mode filter and a manufacturing method thereof, which can reduce the oscillation of the characteristic impedance at different operating frequencies, and is suitable for USB 3.0, IEEE 1394, LVDS, High-speed differential transmission signals such as DVI, HDMI, and MIPI.

Common mode noise is noise that is conducted in the same direction on all wires. To suppress common mode noise, a common mode filter or choke can be installed on the line that conducts noise. Traditionally, common mode filters have been constructed primarily of components with two coils of the same number of turns on the core. When the common mode current flows through the common mode filter, the two coils generate a co-directional magnetic field, so that the common mode filter exhibits high impedance to achieve the effect of suppressing the common mode current.

At present, the frequency bands used for matching various common mode filters only reach the low frequency band. As the market gradually increases and matures, the applied frequency bands are getting higher and higher. According to the current common mode filter, the matching frequency range is Not enough, and the current electronic products are developing towards light, thin, short and small designs. Under this circumstance, the development of common mode filters that can match high frequency bands will be the mainstream trend of related electronic products. In response to the demand for portable electronic products, wafer common mode filters have been developed.

However, the conventional common mode filter exhibits an oscillation problem at different operating frequencies, and the effect of eliminating signal noise in the common mode is poor. Can not meet the specifications of international communications.

The invention discloses a multi-layer spiral structure common mode filter and a manufacturing method thereof, which can reduce the oscillation of the characteristic impedance at different operating frequencies, and is suitable for high-speed differentials such as USB 3.0, IEEE 1394, LVDS, DVI, HDMI and MIPI. Transmit the signal.

A common mode filter of a multi-layer spiral structure according to an embodiment of the present invention includes a first coil, a second coil, a third coil, and a fourth coil, and the second coil is disposed between the first coil and the third coil. The third coil is disposed between the second coil and the fourth coil, the first coil is connected in series with the fourth coil, and the second coil is connected in series with the third coil.

A common mode filter of a multi-layer spiral structure according to another embodiment of the present invention includes a first coil, a second coil, a third coil, and a fourth coil, and the second coil is disposed between the first coil and the third coil. The third coil is disposed between the second coil and the fourth coil, wherein the first, second, third, and fourth coils surround a rectangle. The common mode filter of the multi-layer spiral structure further includes a first conductive pillar and a second conductive pillar. The first conductive pillar and the second conductive pillar are disposed at opposite corners or the same side corners of the rectangle.

The common mode filter of the embodiment of the invention adopts two sets of series coupled coils and a conductive column configuration mode, so the characteristic impedance is less oscillated, and is suitable for high speed difference of USB 3.0, IEEE 1394, LVDS, DVI, HDMI and MIPI. Dynamic transmission of signals.

The technical features and advantages of the present disclosure have been broadly described above, and the detailed description of the present disclosure will be better understood. Other technical features and advantages of the subject matter of the claims of the present disclosure will be described below. It will be appreciated by those skilled in the art that the present invention may be practiced with the same or equivalents. It is also to be understood by those of ordinary skill in the art that this invention is not limited to the spirit and scope of the disclosure as defined by the appended claims.

The common mode filter disclosed in the embodiment of the invention, wherein adjacent coils are separated by an insulating layer. When changing the coil connection mode, it has been experimentally confirmed that the oscillation of the frequency domain characteristic limit can be slowed down, which is in accordance with the use of the communication specifications. In addition, the embodiment of the present invention can improve the characteristic impedance by changing the position of the conductive pillar, and the different characteristic impedance can increase the matching application bandwidth.

1 is an exploded perspective view of a common mode filter 100 according to an embodiment of the present invention. FIG. 2 is a schematic plan view of the common mode filter 100 of FIG. 1. FIG. 3 is a side view of the common mode filter 100 of FIG. The common mode filter 100 includes a material layer 1, a side insulating layer 2, a first coil layer 3, a first insulating layer 4, a second coil layer 5, a second insulating layer 6, and a third coil layer. 7. A third insulating layer 8, a fourth coil layer 9, a side insulating layer 10, and a material layer 11, Wherein the first insulating layer 4 isolates the first coil layer 3 and the second coil layer 5, the second insulating layer 6 isolates the second coil layer 5 and the third coil layer 7, and the third insulating layer 8 isolates the third coil layer 7 and Four coil layers 9.

The first coil layer 3 includes a first coil 31, the second coil layer 5 includes a second coil 51, the third coil layer 7 includes a third coil 71, and the fourth coil layer 9 includes a fourth coil 91. The second coil 51 is disposed between the first coil 31 and the third coil 71, and the third coil 71 is disposed between the second coil 51 and the fourth coil 91. The first coil 31 is connected in series with the fourth coil 91, and the second coil 51 is connected in series with the third coil 71. The first coil 31 and the fourth coil 91 connected in series and the second coil 51 and the third coil 71 connected in series are electromagnetically coupled, so that the first coil 31 and the fourth coil 91 connected in series and the second coil 51 and the series connected in series The three coils 71 eliminate common mode noise.

In an embodiment of the present invention, the first coil 31, the second coil 51, the third coil 71, and the fourth coil 91 may be rectangular spirals as shown in FIG. 1; but they may also have other shapes. A spiral, such as a circular spiral. In an embodiment of the invention, the first coil 31, the second coil 51, the third coil 71, and the fourth coil 91 mostly overlap in the vertical direction. In an embodiment of the invention, the first coil 31, the second coil 51, the third coil 71, and the fourth coil 91 may be wound in the same number of turns.

Referring to FIG. 1 , the first insulating layer 4 includes a contact hole 41 , the second insulating layer 6 includes a connecting hole 61 , and the third insulating layer 8 includes a connecting hole 81 , wherein the connecting hole 41 , the connecting hole 61 , The connection holes 81 mostly overlap in the vertical direction. In addition, the first coil 31 includes an inner end portion 35, and a fourth line The ring 91 includes an inner end 95.

The connecting hole 41 is formed between the inner end portion 35 of the first coil 31 and a portion of the conductive post 55 inside the second coil layer 5, and the partial conductive post 55 is not electrically connected to the second coil 51. The connecting hole 61 is also formed between a portion of the conductive post 55 inside the second coil layer 5 and a portion of the conductive post 75 inside the third coil layer 7. The partial conductive post 75 is not electrically connected to the third coil 71. The connection hole 81 is also formed between the portion of the conductive post 75 inside the third coil layer 7 and the inner end portion 95 of the fourth coil 91. Thus, the inner end portion 35 of the first coil 31 and the inner end portion 95 of the fourth coil 91 are electrically connected through the partial conductive post 55 and the partial conductive post 75, so that the first coil 31 and the fourth coil 91 are electrically connected in series. Further, the inner end portion 35 of the first coil 31, a portion of the conductive post 55 inside the second coil layer 5, a portion of the conductive post 75 inside the third coil layer 7, and the inner end portion 95 of the fourth coil 91 are electrically connected to each other. The first conductive pillar 111 of the common mode filter 100 is formed as shown in FIGS. 2 and 3.

Furthermore, referring to FIG. 1, the second coil 51 includes an inner end portion 56, the third coil 71 includes an inner end portion 76, and the second insulating layer 6 includes a connecting hole 62. The connecting hole 62 is formed between the inner end portion 56 of the second coil 51 and the inner end portion 76 of the third coil 71, and the inner end portion 56 of the second coil 51 passes through the connecting hole 62 and the inner end portion 76 of the third coil 71. Electrically connected, the second coil 51 and the third coil 71 are electrically connected in series. Further, the inner end portion 56 of the second coil 51 and the inner end portion 76 of the third coil 71 are electrically connected to each other to form the second conductive post 222 of the common mode filter 100, as shown in FIGS. 2 and 3.

Referring to FIG. 1, the first conductive pillar 111 of the common mode filter 100 can pass through. The connection hole 41, the connection hole 61, and the connection hole 81 are connected in series to the inner end portion 35 of the first coil 31 and the inner end portion 95 of the fourth coil 91. The second conductive pillar 222 of the common mode filter 100 can pass through the connection hole 62, and the inner end portion 56 of the second coil 51 and the inner end portion 76 of the third coil 71 are connected in series. The first coil 31, the second coil 51, the third coil 71, and the fourth coil 91 surround the coil in a rectangular manner, and the first conductive pillar 111 and the second conductive pillar 222 are disposed at opposite corners of the rectangle, as shown in the top view of FIG. Show.

Referring to FIG. 3, the first conductive pillar 111 is longer than the second conductive pillar 222, and the first conductive pillar 111 penetrates through the first insulating layer 4, the second insulating layer 6, and the third insulating layer 8, and the first coil layer 3 is connected in series. a coil 31 and a fourth coil 91 of the fourth coil layer 9, but the first conductive pillar 111 is not electrically connected to the second coil layer 5 and the third coil layer 7; the second conductive pillar 222 penetrates the second insulating layer 6 The second coil 51 of the second coil layer 5 and the third coil 71 of the third coil layer 7 are connected in series.

Referring to FIG. 1, the outer end portions 33, 53, 73 or 93 of each of the first coil 31, the second coil 51, the third coil 71 and the fourth coil 91 may be extendedly connected to a corresponding electrode 34, 54, 74 or 94. The electrodes 34, 54, 74 or 94 are disposed around the common mode filter 100. The first coil 31, the second coil 51, the third coil 71, and the fourth coil 91 are electrically connected to the external element through the respective electrodes 34, 54, 74 or 94.

4 is a frequency domain characteristic impedance electrical diagram of the common mode filter 100 of FIG. 1. The horizontal axis represents frequency and the vertical axis represents characteristic impedance values. The common mode filter of the conventional technology exhibits an oscillation problem at different operating frequencies, and the effect is poor in eliminating common mode noise and cannot meet the specifications of international communication. Relatively The characteristic impedance of the common mode filter 100 of the embodiment of the present invention is small, and is suitable for high-speed differential transmission signals such as USB 3.0, IEEE 1394, LVDS, DVI, HDMI, and MIPI. For example, according to the specification of USB 3.0, the oscillation of the characteristic impedance value must conform to 90±15 Ω. The common mode filter 100 of the embodiment of the present invention conforms to the specification of USB 3.0, and the common mode filter of the prior art does not.

5 is a time-domain characteristic impedance electrical diagram of the common mode filter 100 of FIG. 1, with the horizontal axis being time and the vertical axis being the characteristic impedance value. The common mode filter of the conventional technology exhibits an oscillation problem at different operating frequencies, and the effect is poor when the common mode noise is eliminated. In contrast, the characteristic impedance of the common mode filter 100 in the embodiment of the present invention is less oscillating, and the effect is better when the common mode noise is eliminated.

In short, the common mode filter of the embodiment of the present invention adopts two sets of series coupled coils and a conductive column configuration mode, has high frequency band operation characteristics that cannot be achieved by the prior art, and solves the problem that the prior art characteristic impedance oscillation is too large.

6 is an exploded perspective view of a common mode filter 101 according to another embodiment of the present invention, and FIG. 7 is a schematic plan view of the common mode filter 101 of FIG. The first conductive pillar 111 and the second conductive pillar 222 of the common mode filter 100 shown in FIG. 1 are disposed at opposite corners of the rectangle, and the first conductive pillar 112 of the common mode filter 101 of FIG. The column 223 is disposed at the same side corner of the rectangle. The first coil 311 includes an inner end 351, the fourth coil 911 includes an inner end 951, the first insulating layer 4 includes a connecting hole 42, the second coil layer 5 includes a portion of the conductive post 55, and the second insulating layer 6 includes A connecting hole 63, the third coil layer 7 includes a portion of the conductive post 75, and the third insulating layer 8 includes a connecting hole 82. The connecting hole 42 is formed at the inner end 351 of the first coil 311 and the second coil layer 5. Part of Between the conductive pillars 55, a part of the conductive pillars 55 and the second coil 511 are not electrically connected. The connecting hole 63 is also formed between the portion of the conductive post 55 of the second coil layer 5 and a portion of the conductive post 75 of the third coil layer 7. The portion of the conductive post 75 is not electrically connected to the third coil 711. The connection hole 82 is also formed between the portion of the conductive post 75 of the third coil layer 7 and the inner end portion 951 of the fourth coil 91.

The connecting hole 42, the connecting hole 63, and the connecting hole 82 are mostly overlapped in the vertical direction, so that the inner end portion 351 of the first coil 311 and the inner end portion 951 of the fourth coil 911 can pass through the portion of the conductive post 55 and the portion of the conductive post 75. Electrically connected, the first coil 311 and the fourth coil 911 are electrically connected in series. Further, the inner end portion 351 of the first coil 311, the partial conductive pillar 55 of the second coil layer 5, the partial conductive pillar 75 of the third coil layer 7, and the inner end portion 951 of the fourth coil 91 are electrically connected to each other to form a common The first conductive pillar 112 of the mode filter 101.

The common mode filter 101 includes another second conductive pillar 223. The second coil 511 includes an inner end portion 561, the third coil 711 includes an inner end portion 761, and the second insulating layer 6 includes a connecting hole 64. The connecting hole 64 is formed between the inner end portion 561 of the second coil 511 and the inner end portion 761 of the third coil 711, and the inner end portion 561 of the second coil 511 passes through the connecting hole 64 and the inner end portion 761 of the third coil 711. Electrically connected, the second coil 511 and the third coil 711 are electrically connected in series. Further, the inner end portion 561 of the second coil 511 is electrically connected to the inner end portion 761 of the third coil 711 to form the second conductive post 223 of the common mode filter 101.

The first conductive pillar 112 of the common mode filter 101 can pass through the connection hole 42, the connection hole 63, and the connection hole 82, and the inner end portion 351 of the first coil 311 and the inner end portion 951 of the fourth coil 911 are connected in series. The second conductive pillar 223 of the common mode filter 101 The inner end portion 561 of the second coil 511 and the inner end portion 761 of the third coil 711 may be connected in series through the connecting hole 64.

In an embodiment of the invention, the first coil 311, the second coil 511, the third coil 711, and the fourth coil 911 surround the coil in a rectangular manner, and the first conductive pillar 112 connects the first coil 311 and the fourth coil 911. And disposed in the interior of the rectangle, the second conductive pillar 223 is connected to the second coil 511 and the third coil 711 and disposed inside the rectangle, and the first conductive pillar 112 and the second conductive pillar 223 are in the same corner in the interior of the rectangle. .

In one embodiment of the present invention, the first conductive pillars 112 and the second conductive pillars 223 are disposed at the same side corners, so that the two conductive pillars are each represented by one of the inner sides of the rectangular shape. The first conductive pillar 112 penetrates through the first insulating layer 4, the second insulating layer 6, and the third insulating layer 8, and connects the first coil 311 of the first coil layer 3 and the fourth coil 911 of the fourth coil layer 9; The conductive pillar 223 penetrates only the second insulating layer 6, and the second coil 511 of the second coil layer 5 and the third coil 711 of the third coil layer 7 are connected in series. Therefore, the first conductive pillar 112 is longer than the second conductive pillar 223. The first conductive pillars 112 are not electrically connected to the second coil layer 5 and the third coil layer 7 .

The outer end portions 331, 531, 731 or 931 of each of the first coil 311, the second coil 511, the third coil 711, and the fourth coil 911 may be extendedly coupled to a corresponding electrode 341, 541, 741 or 941. The electrodes 341, 541, 741 or 941 are adjacent to the periphery of the common mode filter 101. The first coil 311, the second coil 511, the third coil 711, and the fourth coil 911 are electrically connected to the external elements through the respective electrodes 341, 541, 741 or 941.

8 is an exploded perspective view of a common mode filter 102 according to another embodiment of the present invention, and FIG. 9 is a schematic plan view of the common mode filter 102 of FIG. . The first coil 31 and the fourth coil 91 of the common mode filter 100 shown in FIG. 1 are connected in series and the second coil 51 is connected in series with the third coil 71; in contrast, the common mode filter shown in FIG. The first coil 312 of the 102 is connected in series with the third coil 712 and the second coil 512 is connected in series with the fourth coil 912. A first conductive pillar 113 and a second conductive pillar 224 are disposed at opposite corners of the rectangle. The first coil 312 includes an inner end 352, the first insulating layer 4 includes a connecting hole 43, the second coil layer 5 includes a portion of the conductive post 58, the second insulating layer 6 includes a connecting hole 65, and the third coil 712 includes a Inner end 762. The connecting hole 43 is formed between the inner end 352 of the first coil 312 and a portion of the conductive post 58 of the second coil layer 5, and the partial conductive post 58 is not electrically connected to the second coil 512. The connection hole 65 is formed between the portion of the conductive post 58 of the second coil layer 5 and the inner end portion 762 of the third coil layer 7. The connecting hole 43 and the connecting hole 65 are mostly overlapped in the vertical direction, so that the inner end portion 352 of the first coil 312 and the inner end portion 762 of the third coil 712 can be electrically connected through the partial conductive post 58 to achieve the first coil 312. It is electrically connected in series with the third coil 712. Further, the inner end portion 352 of the first coil 312, the portion of the conductive post 58 of the second coil layer 5, and the inner end portion 762 of the third coil layer 7 are electrically connected to each other to form the first conductive post 113 of the common mode filter 102.

The second coil 512 includes an inner end portion 562, the second insulating layer 6 includes a connecting hole 66, the third coil 712 includes a portion of the conductive post 77, the third insulating layer 8 includes a connecting hole 83, and the fourth coil 912 includes an inner portion. End 952. The connection hole 66 is formed in the inner end portion 562 of the second coil 512 and the portion of the third coil 712 Between the conductive pillars 77, the connecting hole 83 is formed between the portion of the conductive post 77 of the third coil 712 and the inner end 952 of the fourth coil 912, and the inner end of the second coil 512 and the inner end of the fourth coil 912. The portion 952 is electrically connected through the partial conductive posts 77 to achieve the second coil 512 and the fourth coil 912 are connected in series. The connection hole 66 and the connection hole 83 mostly overlap in the vertical direction. Further, the inner end portion 562 of the second coil 512, the partial conductive post 77, and the inner end portion 952 of the fourth coil 912 are electrically connected to each other to form the second conductive post 224 of the common mode filter 102.

In summary, the common mode filter 102 includes a first conductive pillar 113 and a second conductive pillar 224. The first conductive pillar 113 passes through the connecting hole 43, the connecting hole 65, and the inner end 352 and the third coil of the first coil 312 are connected in series. End 762 within 712. The second conductive post 224 passes through the connecting hole 66 and the connecting hole 83, and the inner end portion 562 of the second coil 512 and the inner end portion 952 of the fourth coil 912 are connected in series.

In this embodiment, as shown in FIG. 8, the first coil 312, the second coil 512, the third coil 712, and the fourth coil 912 are coils surrounded by a rectangle, and the first conductive pillar 113 is connected to the first coil 312 and The third coil 712 is disposed inside the rectangle, the second conductive pillar 224 is connected to the second coil 512 and the fourth coil 912 and is disposed inside the rectangle, and the first conductive pillar 113 and the second conductive pillar 224 are disposed at opposite corners of the rectangle. .

In an embodiment of the present invention, the materials of the first insulating layer 4, the second insulating layer 6, and the third insulating layer 8 may include a polyimide, an epoxy resin, or a benzo ring. Butylene resin (BCB). At least one of the first insulating layer 4, the second insulating layer 6, and the third insulating layer 8 contains a magnetic material such as a ferromagnetic material. In an embodiment, the magnetic material may comprise nickel zinc Ferrite or manganese zinc ferrite.

The manufacturing method of the first insulating layer 4, the second insulating layer 6, the third insulating layer 8, and the like may include a spin coating process, a dipping process, a spraying process, and a screen-printing process. Or a thin film formation process or the like.

In an embodiment of the present invention, the first coil layer 3, the second coil layer 5, the third coil layer 7, and the fourth coil layer 9 may be subjected to a vacuum film formation process (evaporation or sputtering). Or plating process. The material of the first coil layer 3, the second coil layer 5, the third coil layer 7, and the fourth coil layer 9 may include silver, palladium, aluminum, chromium, nickel, titanium, gold, copper, platinum, or an alloy thereof.

In an embodiment of the invention, at least one of the first material layer 1 and the second material layer 11 comprises a magnetic material, such as a ferromagnetic material. In other words, the first material layer 1 is a magnetic material layer, the second material layer 11 is a non-magnetic material layer or an insulating layer; or, the first material layer 1 is a non-magnetic material layer or an insulating layer, and the second material layer 11 is magnetic Material layer. The first material layer 1 and/or the second material layer 11 comprise a magnetic material, which can confine the magnetic field range of the common mode filter 100, so that the common mode filter 100 has a better filtering effect. In an embodiment of the invention, the magnetic material layer comprises a magnetic substrate. The aforementioned non-magnetic material layer includes a non-magnetic material substrate, and the foregoing insulating layer includes an insulating substrate. In an embodiment of the invention, the magnetic material layer comprises nickel zinc ferrite or manganese zinc ferrite, and the nonmagnetic material layer comprises aluminum oxide, aluminum nitride, glass or quartz. In an embodiment of the invention, the magnetic material layer comprises a The polymer material and the magnetic powder may comprise a polyimine, an epoxy resin or a benzocyclobutene resin, and the magnetic powder comprises nickel zinc ferrite or manganese zinc ferrite.

In an embodiment of the invention, the first material layer 1 comprises a heterogeneous laminated substrate; and in another embodiment of the invention, the second material layer 11 comprises a heterogeneous laminated substrate comprising an insulating material layer and a magnetic layer. Material layer. The insulating material layer and the magnetic material layer may be co-fired to cause diffusion bonding between the two. The insulating material layer and the magnetic material layer can be adhered by adhesive. The insulating material layer and the magnetic material layer may be individually formed by thick film printing.

In an embodiment of the invention, the first coil 31 can be fabricated using a frame plating process. The frame plating process first forms an electrode layer on the side insulating layer 2. The electrode layer can be formed by a sputtering or evaporation process. A chromium film or a titanium film may be formed under the electrode layer to improve adhesion. Next, a photoresist pattern having a coil pattern is formed by a lithography process. Thereafter, an electroplating process is performed to form a plating layer, and the photoresist layer is peeled off. Then, the electrode layer is removed by an etching process to form the first coil 31.

Thereafter, a first insulating layer 4 is formed to cover the first coil layer 3. The first insulating layer 4 may comprise a polymer material including a polyimide, an epoxy resin or a benzocyclobutene resin. The manufacturing method of the first insulating layer 4 may include a spin coating process, a dipping process, a spraying process, a screen printing process, or a film forming process. Then, the above process is repeated to prepare the second coil layer 5, the second coil layer 5, the second insulating layer 6, the third coil layer 7, the third insulating layer 8, and the fourth coil layer. 9.

A method of forming a connection hole of a common mode filter. For example, on the inner end portion 35 of the first coil 31 of FIG. 1, the connection hole 41, the connection hole 61, and the connection hole 81 may be formed by a photolithography etching process to expose the inner end portion 35 of the first coil 31. Then, metal is deposited in the connection hole 41, the connection hole 61, and the connection hole 81 by a vacuum film formation process (evaporation or sputtering) or an electroplating process or the like to form the first conductive pillar 111. The connection hole 62 and the second conductive pillar 222 can be formed in the same manner; as shown in FIG. 6, the connection hole 42, the connection hole 63, and the connection hole 82 are formed in the same manner to form the first conductive pillar 112; the connection hole 64 is formed in the same manner. And the second conductive pillar 223; and as shown in FIG. 8, the connection hole 43 and the connection hole 65 are formed in the same manner to form the first conductive pillar 113; the connection hole 66 and the second conductive pillar 224 of the connection hole 83 are formed in the same manner. The conductive pillars can be fabricated using a vacuum film formation process (evaporation or sputtering) or a plating process. The material of the conductive pillar may comprise silver, palladium, aluminum, chromium, nickel, titanium, gold, copper, platinum or alloys thereof.

The technical content and the technical features of the present disclosure have been disclosed as above, but those skilled in the art should understand that the teachings and disclosures of the present disclosure are disclosed without departing from the spirit and scope of the disclosure as defined by the appended claims. Can be used for various substitutions and modifications. For example, many of the processes disclosed above may be implemented in different ways or in other processes, or a combination of the two.

Moreover, the scope of the present invention is not limited to the process, machine, manufacture, composition of matter, device, method or step of the specific embodiments disclosed above. Step. It should be understood by those of ordinary skill in the art that, based on the teachings of the present disclosure, the process, the machine, the manufacture, the composition of the material, the device, the method, or the steps, whether present or future developers, The revealer performs substantially the same function in substantially the same manner, and achieves substantially the same result, and can also be used in the present disclosure. Accordingly, the scope of the following claims is intended to cover such <RTIgt; </ RTI> processes, machines, manufactures, compositions, devices, methods or steps.

1‧‧‧Material layer

2‧‧‧Side insulation

3‧‧‧First coil layer

4‧‧‧First insulation

5‧‧‧second coil layer

6‧‧‧Second insulation

7‧‧‧ third coil layer

8‧‧‧ third insulation

9‧‧‧fourth coil layer

10‧‧‧Side insulation

11‧‧‧Material layer

31‧‧‧First coil

33‧‧‧Outside

34‧‧‧ electrodes

35‧‧‧Inside

41‧‧‧connection hole

42‧‧‧connection hole

43‧‧‧connection hole

51‧‧‧second coil

53‧‧‧Outside

54‧‧‧Electrode

55‧‧‧Partial conductive column

56‧‧‧Inside

58‧‧‧Partial conductive column

61‧‧‧connection hole

62‧‧‧connection hole

63‧‧‧connection hole

64‧‧‧connection hole

65‧‧‧connection hole

66‧‧‧Connection hole

71‧‧‧third coil

73‧‧‧Outside

74‧‧‧Electrode

75‧‧‧Partial conductive column

76‧‧‧Inside

77‧‧‧Partial conductive column

81‧‧‧connection hole

82‧‧‧connection hole

83‧‧‧connection hole

91‧‧‧fourth coil

93‧‧‧Outside

94‧‧‧Electrode

95‧‧‧Inside

100‧‧‧Common mode filter

101‧‧‧Common mode filter

102‧‧‧Common mode filter

111‧‧‧First conductive column

112‧‧‧First conductive column

113‧‧‧First conductive column

222‧‧‧Second conductive column

223‧‧‧second conductive column

224‧‧‧Second conductive column

311‧‧‧First coil

312‧‧‧First coil

331‧‧‧Outer end

332‧‧‧Outer end

341‧‧‧electrode

342‧‧‧electrode

351‧‧‧Inside

352‧‧‧Inside

511‧‧‧second coil

512‧‧‧second coil

531‧‧‧Outside

532‧‧‧Outer end

541‧‧‧electrode

542‧‧‧Electrode

561‧‧ ‧ inner end

562‧‧‧Inside

711‧‧‧third coil

712‧‧‧third coil

731‧‧‧Outer end

732‧‧‧Outside

741‧‧‧electrode

742‧‧‧electrode

761‧‧ ‧ inner end

762‧‧‧Inside

911‧‧‧fourth coil

912‧‧‧fourth coil

931‧‧‧Outer end

932‧‧‧Outer end

941‧‧‧electrode

942‧‧‧Electrode

951‧‧‧Inside

952‧‧‧Inside

The technical features and advantages of the present disclosure are fully understood by reference to the foregoing description and the accompanying drawings.

1 is a schematic exploded view of a common mode filter according to an embodiment of the present invention; FIG. 2 is a schematic plan view showing a common mode filter according to an embodiment of the present invention; and FIG. 3 is a view showing a side of a common mode filter according to an embodiment of the present invention. FIG. 4 shows a frequency domain characteristic impedance electrical diagram according to an embodiment of the present invention; FIG. 5 shows a time domain characteristic impedance electrical diagram according to an embodiment of the present invention; and FIG. 6 shows a common mode filter according to another embodiment of the present invention. FIG. 7 is a schematic exploded view of a common mode filter according to another embodiment of the present invention; FIG. 8 is a schematic exploded view of a common mode filter according to still another embodiment of the present invention; and FIG. 9 is another schematic view of the present invention. The top surface of the common mode filter of the embodiment is schematically illustrated Figure.

1‧‧‧First material layer

2‧‧‧Side insulation

3‧‧‧First coil layer

4‧‧‧First insulation

5‧‧‧second coil layer

6‧‧‧Second insulation

7‧‧‧ third coil layer

8‧‧‧ third insulation

9‧‧‧fourth coil layer

10‧‧‧Side insulation

11‧‧‧Second material layer

31‧‧‧First coil

33‧‧‧Outside

34‧‧‧ electrodes

35‧‧‧Inside

41‧‧‧connection hole

51‧‧‧second coil

53‧‧‧Outside

54‧‧‧Electrode

55‧‧‧Partial conductive column

56‧‧‧Inside

61‧‧‧connection hole

62‧‧‧connection hole

71‧‧‧third coil

73‧‧‧Outside

74‧‧‧Electrode

75‧‧‧Partial conductive column

76‧‧‧Inside

81‧‧‧connection hole

91‧‧‧fourth coil

93‧‧‧Outside

94‧‧‧Electrode

95‧‧‧Inside

100‧‧‧Common mode filter

Claims (8)

A multi-mode helical structure common mode filter comprising: a first coil; a second coil disposed on the first coil; a third coil disposed on the second coil; and a fourth coil And disposed on the third coil, wherein the first, second, third, and fourth coils surround a rectangle; a first conductive pillar disposed inside the rectangle and connecting the first coil and the third coil; a second conductive pillar disposed inside the rectangle and connecting the second coil and the fourth coil, the first conductive pillar and the second conductive pillar are disposed at opposite corners of the rectangle; and a first material layer and a second material layer, wherein the first, second, third, and fourth coils are disposed between the first material layer and the second material layer; wherein the first material layer and the second material layer are heterogeneous A laminated substrate comprising a magnetic material layer and an insulating material layer. The common mode filter of the multi-layer spiral structure according to claim 1, further comprising: a first insulating layer separating the first coil and the second coil; and a second insulating layer separating the second coil from the a third coil; and a third insulating layer separating the third coil from the fourth coil. The multimode helical structure common mode filter according to claim 2, wherein the first conductive pillar penetrates the first and second insulating layers, and the second conductive pillar penetrates the Second and third insulation layers. The common mode filter of the multi-layered spiral structure according to claim 1, wherein the first conductive post is electrically connected to the inner end of the first coil and electrically connected to the inner end of the third coil, the second conductive The post is electrically connected to the inner end of the second coil and the inner end of the fourth coil. A multi-mode helical structure common mode filter comprising: a first coil; a second coil disposed on the first coil; a third coil disposed on the second coil; and a fourth coil And disposed on the third coil, wherein the first, second, third, and fourth coils surround a rectangle; a first conductive pillar disposed inside the rectangle and connecting the first coil and the fourth coil; a second conductive pillar disposed inside the rectangle and connecting the second coil and the third coil, the first conductive pillar and the second conductive pillar are disposed at opposite corners of the rectangle; and a first material layer and a second material layer, wherein the first, second, third, and fourth coils are disposed between the first material layer and the second material layer; wherein the first material layer and the second material layer are heterogeneous A laminated substrate comprising a magnetic material layer and an insulating material layer. The common mode filter of the multi-layer spiral structure according to claim 5, wherein the first conductive post is electrically connected to the inner end of the first coil and the inner end of the fourth coil, and the second conductive post is electrically Connecting the inner end of the second coil with The inner end of the third coil. The multimode helical structure common mode filter according to claim 5, further comprising: a first insulating layer separating the first coil and the second coil; and a second insulating layer separating the second coil from the a third coil; and a third insulating layer separating the third coil from the fourth coil. The multimode helical structure common mode filter according to claim 7, wherein the first conductive pillar penetrates the first, second, and third insulating layers, and the second conductive pillar penetrates the second insulating layer.