TWI460822B - - Google Patents

Info

Publication number
TWI460822B
TWI460822B TW099144242A TW99144242A TWI460822B TW I460822 B TWI460822 B TW I460822B TW 099144242 A TW099144242 A TW 099144242A TW 99144242 A TW99144242 A TW 99144242A TW I460822 B TWI460822 B TW I460822B
Authority
TW
Taiwan
Application number
TW099144242A
Other versions
TW201227872A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW99144242A priority Critical patent/TW201227872A/zh
Publication of TW201227872A publication Critical patent/TW201227872A/zh
Application granted granted Critical
Publication of TWI460822B publication Critical patent/TWI460822B/zh

Links

TW99144242A 2010-12-16 2010-12-16 Metal wire structure and manufacturing method thereof TW201227872A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW99144242A TW201227872A (en) 2010-12-16 2010-12-16 Metal wire structure and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW99144242A TW201227872A (en) 2010-12-16 2010-12-16 Metal wire structure and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TW201227872A TW201227872A (en) 2012-07-01
TWI460822B true TWI460822B (zh) 2014-11-11

Family

ID=46933428

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99144242A TW201227872A (en) 2010-12-16 2010-12-16 Metal wire structure and manufacturing method thereof

Country Status (1)

Country Link
TW (1) TW201227872A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10755917B2 (en) 2018-06-29 2020-08-25 Taiwan Semiconductor Manufacturing Company, Ltd. Treatment for adhesion improvement

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101360851A (zh) * 2005-11-18 2009-02-04 莱里斯奥鲁斯技术公司 一种主电极及其制备方法
TW200952080A (en) * 2008-02-26 2009-12-16 Applied Materials Inc A process for selective growth of films during ECP plating

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101360851A (zh) * 2005-11-18 2009-02-04 莱里斯奥鲁斯技术公司 一种主电极及其制备方法
TW200952080A (en) * 2008-02-26 2009-12-16 Applied Materials Inc A process for selective growth of films during ECP plating

Also Published As

Publication number Publication date
TW201227872A (en) 2012-07-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees