TWI460762B - - Google Patents
Info
- Publication number
- TWI460762B TWI460762B TW101110033A TW101110033A TWI460762B TW I460762 B TWI460762 B TW I460762B TW 101110033 A TW101110033 A TW 101110033A TW 101110033 A TW101110033 A TW 101110033A TW I460762 B TWI460762 B TW I460762B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210065396.9A CN103311084B (en) | 2012-03-13 | 2012-03-13 | A kind of electric power system regulating plasma processing chambers Electric Field Distribution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201338005A TW201338005A (en) | 2013-09-16 |
| TWI460762B true TWI460762B (en) | 2014-11-11 |
Family
ID=49136169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101110033A TW201338005A (en) | 2012-03-13 | 2012-03-23 | Power supply system for regulating electric field distribution of plasma processing chamber |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103311084B (en) |
| TW (1) | TW201338005A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103792842B (en) * | 2014-01-22 | 2016-08-17 | 清华大学 | A kind of base station that can be used for power field spatial distribution precise controlling and control method |
| CN111020533B (en) * | 2018-10-09 | 2022-02-18 | 上海理想万里晖薄膜设备有限公司 | Method for changing electromagnetic field distribution in PECVD (plasma enhanced chemical vapor deposition) discharge cavity by phase modulation |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0867913A1 (en) * | 1997-03-26 | 1998-09-30 | Hitachi, Ltd. | Plasma processing system and plasma processing method |
| CN1543671A (en) * | 2002-03-08 | 2004-11-03 | ���������ƴ���ʽ���� | Plasma device |
| TWI255671B (en) * | 2001-03-30 | 2006-05-21 | Lam Res Corp | Inductive plasma processor including current sensor for plasma excitation coil |
| TWM370181U (en) * | 2009-07-03 | 2009-12-01 | Advanced Micro Fab Equip Inc | A plasma processing apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6459066B1 (en) * | 2000-08-25 | 2002-10-01 | Board Of Regents, The University Of Texas System | Transmission line based inductively coupled plasma source with stable impedance |
| US6527912B2 (en) * | 2001-03-30 | 2003-03-04 | Lam Research Corporation | Stacked RF excitation coil for inductive plasma processor |
| JP5231308B2 (en) * | 2009-03-31 | 2013-07-10 | 東京エレクトロン株式会社 | Plasma processing equipment |
-
2012
- 2012-03-13 CN CN201210065396.9A patent/CN103311084B/en active Active
- 2012-03-23 TW TW101110033A patent/TW201338005A/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0867913A1 (en) * | 1997-03-26 | 1998-09-30 | Hitachi, Ltd. | Plasma processing system and plasma processing method |
| TWI255671B (en) * | 2001-03-30 | 2006-05-21 | Lam Res Corp | Inductive plasma processor including current sensor for plasma excitation coil |
| CN1543671A (en) * | 2002-03-08 | 2004-11-03 | ���������ƴ���ʽ���� | Plasma device |
| TWM370181U (en) * | 2009-07-03 | 2009-12-01 | Advanced Micro Fab Equip Inc | A plasma processing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103311084B (en) | 2016-03-30 |
| TW201338005A (en) | 2013-09-16 |
| CN103311084A (en) | 2013-09-18 |