Claims (3)
一種伺服器，包括：一機箱；一主機板模組，配置於該機箱內且具有至少一第一元件及至少一第二元件；一散熱模組，包括：至少一冷板，配置於該主機板模組上並接觸該第一元件；一導管組，配置於該主機板模組上且連通於該冷板，其中一水冷液適於在該冷板及該導管組內流動，以帶走該第一元件傳遞至該冷板的熱；至少一殼體，配置於該主機板模組上，且具有一入風口、至少一出風口及至少一隔板，其中該隔板將該殼體內部分隔為至少一第一空間及一第二空間，該第一元件及該冷板位於該第一空間內，該第二空間連通該入風口及該出風口，該第二元件位於該殼體外且鄰近該出風口；以及一風扇模組，配置於該機箱側邊且適於提供一散熱氣流至該機箱內，該散熱氣流透過該入風口進入該殼體，並透過該出風口流出該殼體而到達該第二元件；以及一冷卻裝置，其中該導管組透過該入風口從該殼體內延伸至該殼體外，且該導管組包括：一第一導管，連通於該冷板與該冷卻裝置之間，
其中該冷板的熱傳遞至該水冷液之後，該水冷液從該冷板經過該第一導管流至該冷卻裝置而被冷卻；以及一第二導管，連通於該冷板與該冷卻裝置之間，其中被冷卻的該水冷液從該冷卻裝置經過該第二導管流至該冷板，其中該隔板具有兩開口，該第一導管與該第二導管分別透過該兩開口從該第一空間外延伸至該第一空間內。
A server includes: a chassis; a motherboard module disposed in the chassis and having at least one first component and at least one second component; a heat dissipation module comprising: at least one cold plate disposed on the host The plate module is in contact with the first component; a conduit group is disposed on the motherboard module and communicates with the cold plate, wherein a water-cooling liquid is adapted to flow in the cold plate and the conduit group to take away The first component is transferred to the heat of the cold plate; at least one housing is disposed on the motherboard module, and has an air inlet, at least one air outlet, and at least one partition, wherein the partition is inside the housing The first component and the cold plate are located in the first space, the second space is connected to the air inlet and the air outlet, and the second component is located outside the housing. And a fan module disposed on a side of the chassis and configured to provide a heat dissipation airflow into the chassis, the heat dissipation airflow entering the casing through the air inlet, and flowing out of the casing through the air outlet Reaching the second component; and Cooling means, wherein the pipe group extending from the inner housing to the outer housing through the air inlet, and the catheter set comprising: a first conduit communicating between the cold plate and the cooling means,
After the heat of the cold plate is transferred to the water cooling liquid, the water cooling liquid is cooled from the cold plate through the first pipe to the cooling device; and a second pipe is connected to the cold plate and the cooling device. The water cooling liquid cooled from the cooling device flows through the second conduit to the cold plate, wherein the partition has two openings, and the first conduit and the second conduit respectively pass through the two openings from the first The space extends outside the first space.
如申請專利範圍第1項所述之伺服器，其中該機箱具有相對的一第一側壁及一第二側壁，該入風口朝向該第一側壁，該出風口朝向該第二側壁，該散熱氣流適於從該第一側壁進入該機箱並流向該入風口，且適於從該出風口流向該第二側壁並從該第二側壁流出該機箱。
The server of claim 1, wherein the chassis has a first side wall and a second side wall, the air inlet port faces the first side wall, and the air outlet port faces the second side wall, the heat dissipation airflow Suitable for entering the chassis from the first side wall and flowing to the air inlet, and adapted to flow from the air outlet to the second side wall and out of the second side wall.
如申請專利範圍第1項所述之伺服器，其中該殼體具有至少一導風板，該導風板從該殼體往該第二元件延伸，該出風口形成於該導風板末端。
The server of claim 1, wherein the housing has at least one air deflector extending from the housing to the second component, the air outlet being formed at an end of the air deflector.