TWI453678B - Image inputting apparatus - Google Patents

Description

Image input device

The present invention relates to an image input device, and more particularly to a switching mechanism that implies the start of image input.

In recent years, the requirements for the reliability and security of the management, protection, and crime prevention of personal information or corporate information have risen in the society, and personal certification is considered to be an important issue. In response to the rise in such social demands, we are actively developing technology for personal authentication using biometric information such as fingerprints, pupil iridescence, and veins.

In order to incorporate biometric information into the personal authentication system, various sensors are developed. As the sensor, there are optical, electrostatic, electric field, thermal, pressure sensitive, ultrasonic, etc. sensors, which are contacted by the sensor to take in contact with the contact surface of the sensor. The surface shape or internal form of the object to be inspected (for example, a finger), and the captured image becomes the biological information, and the image is compared using an individual authentication system.

In order to suppress the power consumption of the sensor, the sensor performs a sensing action only when the object to be inspected contacts the sensor. Specifically, the push switch is disposed on the lower side of the sensor, and when the push switch is pushed down by the test object, the output signal of the push switch becomes a trigger signal, and the sense is obtained. Detector action. (Patent Document 1: Japanese Patent Laid-Open Publication No. 2000-57328)

However, in the technique disclosed in Patent Document 1, in the space between the sensor element (2) and the contact connection switch (18), a leaf spring (15) that urges the sensor element upward is disposed only when Using the object to be inspected to press the sensor element Upon entry, the leaf spring resists the applied force and contacts and conducts with the contact connection switch to perform a sensing action. However, in this technique, the leaf spring is bent upward during the non-sensing operation (see Patent Document 1 and FIG. 1), and does not necessarily become flat even when subjected to the pressing of the object to be inspected during the sensing operation. And it is in contact with and connected to the contact connection switch (refer patent documents 1 and 3).

Further, when the sensor is pushed in by the state in which the push switch is pushed by the sensor, the sensor may be damaged because the sensor is bent in a state supported by the push switch. Therefore, the patent applicant concentrates on research and development to increase the strength of the sensor and the like, and can suppress the damage of the sensor. Thereby, it is desirable to reduce the probability of occurrence of damage to the sensor.

Accordingly, it is a primary object of the present invention to provide an image input device that is pressed by a test object to be surely turned on to start a sensing operation.

Another main object of the present invention is to provide an image input device that can suppress damage to the sensor body.

According to the invention of the first to fifth aspects of the patent application, since the convex portion is disposed opposite to the switch, when the sensor body is pressed downward by the object to be inspected, the pressing force of the object to be inspected is concentrated on the convex portion or Nearby, and the switch tends to become conductive. Therefore, the sensing operation can be surely started by being pressed by the object to be inspected.

According to the invention of claims 6 to 15, when the sensor body is pushed down, the switch is pushed or contacted by the switch, and the switch is changed from the non-conducting state to the conducting state or vice versa, and the sensor is The body pushes down again At this time, since the lower side of the sensor body or the upper side of the base is held by the receiving portion, the sensor body cannot be further bent downward. Thus, damage to the sensor body can be suppressed.

According to the invention of claims 16 to 26, when the sensor body is pushed downward, the underside of the sensor body and the upper surface of the base form an acute angle on the rotating shaft side of the sensor body. Therefore, since the lower surface of the sensor body is supported by the upper surface of the base on the side of the rotating shaft, the sensor body cannot be further bent downward. Thus, damage to the sensor body can be suppressed.

In order to achieve the object, according to the invention of claim 1, the image input device is provided with the following members.

a base; a sensor body that is movable up and down and coupled to the base; the switch is disposed on an upper side of the base and a lower side of the sensor body; and a convex portion The other side of the base or the lower side of the sensor body, and the position opposite to the switch.

According to a second aspect of the invention, in the image input device of the first aspect of the invention, in the image input device of the first aspect of the invention, the folded portion is formed in the base, and a part thereof is folded back, and the sensing is performed. The sensor body is biased upward by the state in which the lower side of the body abuts.

According to a third aspect of the invention, in the image input device of claim 1, the curved portion is formed in the base, and a part thereof is curved, and the sensing is performed. The sensor body is biased upward by the state in which the lower side of the body abuts.

Moreover, as a preferred form, according to item 4 of the scope of the patent application The image input device according to claim 1, further comprising a wiring sheet that forms a pattern of wiring connected to the sensor body; the electronic component is assembled to the wiring sheet; and the electronic component can be housed A recess is formed in the sensor body.

According to a fifth aspect of the invention, in the image input device of claim 4, the sensor body has a backlight portion that emits light; the electronic component includes a light-emitting element; a concave portion that can accommodate the light-emitting element is formed in the backlight portion.

According to a sixth aspect of the invention, the video input device according to the first aspect of the invention is further provided with a wiring sheet provided on the upper surface side of the base and the sense One side of the lower side of the detector body forms a pattern of wiring connected to the sensor body and the switch.

According to a seventh aspect of the invention, in the image input device according to the first aspect of the invention, the convex portion is provided in a senseable sense of the sensor body. The position corresponding to the outside of the measurement area.

In order to achieve the object, the image input device is provided with the following members in accordance with the invention of claim 8 of the patent application.

a base; the sensor body is movable up and down on the base and coupled to the base; the switch is disposed on an upper side of the base and a lower side of the sensor body; and a receiving portion is provided On the upper side of the base or the lower side of the sensor body, it protrudes toward the opposite surface.

Moreover, as a preferred form, according to item 9 of the scope of the patent application The image input device according to claim 8 is characterized in that the image input device includes a support portion that couples the base and the sensor body; the sensor body pivots the support portion as a shaft and can be rotated up and down .

According to a tenth aspect of the invention, in the image input device of claim 9, the receiving portion is provided on a rotation axis of the sensor body, and The contact surface or the switch that the switch contacts when the sensor body rotates.

According to a seventh aspect of the invention, in the image input device of claim 8, the image input device further includes a convex portion formed on the base The other side of the side and the lower side of the sensor body corresponds to the position of the switch.

According to a second aspect of the invention, the image input device of claim 11 further includes a wiring sheet that forms a wiring connected to the sensor. a pattern; the wiring sheet is disposed on the upper side of the base and the one side of the lower surface side of the sensor body; and the convex portion is disposed at a position overlapping the portion where the wiring sheet does not form the wiring.

According to a thirteenth aspect of the invention, the image input device of claim 8 further includes a wiring sheet that forms a wiring connected to the sensor. a pattern; the wiring sheet is disposed on the upper side of the base and the one side of the lower surface side of the sensor body; and the receiving portion is disposed at a position overlapping the portion where the wiring sheet does not form the wiring.

According to a fourth aspect of the invention, the image input device of claim 8 is provided with a support portion that couples the base and the sensor body; The receiving portion is disposed between the support portion and the convex portion.

According to a fifth aspect of the invention, in the video input device of claim 10, the receiving unit has a plurality of receiving portions, and a convex portion is formed in the image input device. The other side of the upper side of the base and the lower side of the sensor body corresponds to the position of the switch; the convex portion is disposed between the plurality of receiving portions toward the rotational axis of the sensor body.

According to a still further aspect of the invention, in the image input device of claim 11, the convex portion is provided in a senseable sense of the sensor body. The position corresponding to the outside of the measurement area.

According to a seventh aspect of the invention, in the image input device of claim 8, the receiving portion is provided in a senseable sense with the sensor body. The position corresponding to the outside of the measurement area.

In order to achieve the object, according to the invention of claim 18, the image input device is provided with the following members.

The base of the sensor has a first end surface and a second end surface, and is arranged to be rotatable up and down on the base; and the rotating shaft is configured to rotate the base and the sensor body up and down The rotating shaft is located near the second end surface of the first end surface and the second end surface, the sensing a portion of the lower surface of the body opposite to the surface of the upper surface of the base is located adjacent to the second end surface of the first end surface and the second end surface, and a surface direction of the lower surface of the sensor body The intersection angle of the upper surface direction of the base forms an acute angle.

In order to achieve the object, according to the invention of claim 19, the image input device is provided with: a base; and a sensor body disposed on the base to be rotatable up and down, the base facing the same The underside of the base is tilted, or the underside of the sensor body is inclined to the upper surface of the sensor body.

In order to achieve the object, according to the invention of claim 20, the image input device is provided with: a base; the sensor body has a first end surface and a second end surface, and is disposed above and below the base Rotating; rotating the shaft so that the base and the sensor body can be rotated up and down; and the switch is disposed above the base or below the sensor body at a position away from the rotating shaft of the sensor body, The rotating shaft is located near the second end surface of the first end surface and the second end surface, and the sensor body is rotated toward the base side, and the switch is turned on and non-conducting, the sensor a portion of the first end surface and the second end surface adjacent to the second end surface of the first end surface and the second end surface, the surface direction of the lower surface of the sensor body and the portion of the first end surface and the second end surface The intersection angle of the face direction of the upper surface of the base forms an acute angle.

In order to achieve the object, according to the invention of claim 21, the image input device is provided with: a base; the sensor body has a first end surface and a second end surface, and is disposed above and below the base turn The rotating shaft is configured to rotate the base and the sensor body up and down; and the push switch is disposed on the base or the sensor body at a position away from the rotating shaft of the sensor body Next, the rotating shaft is located near the second end surface of the first end surface and the second end surface, and the sensor body is rotated toward the base side to push the state of the push switch, the sensor a portion of the first end surface and the second end surface adjacent to the second end surface of the first end surface and the second end surface, the surface direction of the lower surface of the sensor body and the portion of the first end surface and the second end surface The intersection angle of the face direction of the upper surface of the base forms an acute angle.

According to the invention of claim 22, the image input device of claim 20 is a push switch having a recoverable shape.

According to a second aspect of the invention, the image input device of claim 20, further comprising a convex portion formed on the base or the sensing The portion of the lower portion of the body opposite the switch.

According to a second aspect of the invention, in the image input device of claim 20, in the state in which the switch is restored, the upper surface of the sensor body and the base are provided. The bottom is parallel.

Further, in a preferred embodiment, according to the invention of claim 25, in the image input device of claim 20, the thickness of the base in the downward direction is from the switch to the sensor. The axis of the body is gradually increasing.

According to a second aspect of the invention, in the image input device of claim 20, the thickness of the sensor body in the upper and lower directions is from the switch to the The axis of the sensor body is gradually increasing.

Hereinafter, preferred embodiments for carrying out the invention will be described using the drawings. In addition, in the embodiment described below, various limitations of the technical means are added in order to implement the present invention, but the scope of the invention is not limited to the following embodiments and examples.

[First Embodiment]

Fig. 1 is a perspective view showing a video input device 50 according to the first embodiment of the present invention. 2 is an exploded side view of the image input device 50.

As shown in Fig. 1, the video input device 50 has a base 200 having a plate shape or a thin plate shape. The sensor portion 300 is disposed on the base 200 and covers the sensor portion 300 with a cover 400. The cover 400 has a rectangular frame shape, and the sensing region 322 of the sensor portion 300 is exposed from the opening portion 402 thereof.

As shown in FIG. 2, the image input device 50 is mainly decomposed into a base 200, a sensor portion 300, and three portions of the cover 400. As shown in FIGS. 2 and 3, the support portions 203 and 204 are respectively disposed at the rear of the left and right side faces of the base 200, and the guide portions 231 and 232 are respectively disposed on the front and rear sides of the base 200. At the office. The support portions 203 and 204 and the guide portions 231 and 232 are provided in a state of standing on the upper surface side of the base 200.

The shaft hole 203a penetrates the support portion 203 in the left-right direction, and the shaft hole 204a penetrates the support portion 204 in the left-right direction. Looking in the left and right direction, the shaft hole 203a, The shaft holes 204a are concentric. Long guide holes 231a and 232a are formed in the guide portions 231 and 232, respectively.

The convex portion 205 is provided on the upper surface side of the base 200. The convex portion 205 is provided as a convex portion in a state of protruding toward the upper surface side of the base 200.

The sensor portion 300 has a sensor body 301 mainly composed of a backlight portion 302 and a sensor wafer 320. In the sensor body 301, the backlight portion 302 is disposed below, and the sensor wafer 320 is mounted on the upper portion thereof.

The backlight unit 302 is mainly composed of a light guide plate made of acrylic or the like (including a diffusion sheet and a reflection sheet), and diffuses and reflects the light and emits it upward. As shown in FIG. 2, FIG. 4A, and FIG. 4B, the pivots 304, 306 are respectively formed at the rear of the left and right sides of the backlight portion 302, and the pivot 304 is inserted into the shaft hole 203a of the base 200, and the pivot 306 The shaft hole 204a of the base 200 is inserted. Thus, the pivots 304, 306 are each pivoted by the support portions 203, 204 of the base 200, and the sensor portion 300 can be rotated up and down with respect to the base 200. Further, the guided portions 308 and 310 are respectively protruded forward of the left and right side surfaces of the backlight unit 302, and the guided portion 308 is inserted into the long hole 231a, and the guided portion 310 is inserted into the long hole 232a. Therefore, the guided portions 308 and 310 are guided up and down by the guiding portions 231 and 232.

As shown in FIG. 4A, the concave portion 312 is provided on the front side of the lower surface side of the backlight unit 302. On the left and right sides of the lower surface side of the backlight unit 302, recessed portions 314 and 316 are also provided symmetrically. The sensing region 322 of the sensor wafer 320 is disposed at a substantially central portion of the backlight portion 302 surrounded by the recesses 312, 314, and 316 (see below).

The sensor wafer 320 has a contact side with its upper side as a sensor surface The sensor is a solid-state imaging element that changes the form of the surface of the object to be inspected (for example, a finger or the like) on the upper side into an image and inputs it. In particular, the sensor cell 320 is a double gate transistor of a photoelectric conversion element as a pixel, and a plurality of double gate transistors are arranged in an array on a transparent glass substrate. In the case where the sensor cell 320 is viewed from the upper side, the portion between the double gate transistors is transparent, and light passes through the portion between the double gate transistors. Thus, the sensor wafer 320 is a transparent solid-state photographic element having light transparency. Light incident from the lower side of the sensor cell 320 into the lower side of the sensor cell 320 does not enter the semiconductor of the double gate transistor, but is incident from the upper side of the sensor cell 320. The light on the upper side of the transistor 320 is incident on the semiconductor of the double gate transistor.

Further, among the upper side of the sensor wafer 320, a portion exposed from the opening portion 402 of the cover 400 forms a sensing region 322 which becomes a semiconductor-sensing portion of the double gate transistor.

As shown in FIG. 2, on the upper side of the front end of the sensor wafer 320, a driver 330 for driving the sensor wafer 320 is loaded.

A flexible wiring piece 340 is connected to the front end portion of the upper surface side of the sensor wafer 320. This wiring sheet 340 is bent from the upper end side of the front end portion of the sensor wafer 320 toward the lower surface side of the backlight unit 302, and is wired to the rear of the backlight unit 302. Then, the wiring sheet 340 is adhered to the lower surface side of the backlight unit 302.

The wiring sheet 340 is a laminate in which an insulating film is laminated, and a pattern for wiring for driving the sensor wafer 320 is formed between those layers. The wiring formed on the wiring sheet 340 is turned on to the terminals of the sensor wafer 320.

As shown in FIG. 5A, the light emitting diode 342 is mounted on the wiring sheet 340. The front side of the upper side. An example of a light-emitting diode 342-based light-emitting element. Each of the electronic component groups 344 and 346 such as a resistor or a capacitor is mounted on the left and right side portions on the upper surface side of the wiring sheet 340. As shown in FIG. 5B, the hemispherical switch 350 is disposed on the lower surface side of the wiring sheet 340, and the hemispherical switch 350 is disposed at the left and right central portions of the wiring sheet 340 when viewed in the front-rear direction. The hemispherical switch 350 has a restoring force restored from the pressed state, and has the same structure as the hemispherical switch of the fourth embodiment (see FIG. 21).

When the wiring sheet 340 is attached to the sensor unit 300, as shown in FIG. 6, the front end portion of the wiring sheet 340 (see FIGS. 5A and 5B) is adhered to the sensor wafer 320 from the state of the sensor wafer 320. The upper side is bent downward, and the wiring sheet 340 is adhered to the lower surface side of the backlight unit 302. At this time, as shown in FIG. 7, the light-emitting diode 342 of the wiring sheet 340 is fitted and housed in the concave portion 312 of the backlight unit 302, and the electronic component groups 344 and 346 are fitted and housed in the concave portions 314 and 316. . Therefore, the wiring sheet 340 is adhered to the backlight unit 302 in a state in which it is bulged by the thickness of the light-emitting diode 342 or the electronic component groups 344 and 346, but is adhered to a flat shape in a state of being in close contact with the lower surface side of the backlight unit 302. .

Further, when the wiring piece 340 is adhered to the backlight unit 302 and the base 200 is attached to the sensor unit 300, as shown in FIG. 2, the hemispherical switch 350 of the wiring piece 340 becomes the convex portion 205 of the base 200. Relative.

The arrangement positions of the convex portion 205, the hemispherical switch 350, and the sensor wafer 320 are explained.

The convex portion 205 is disposed at a position overlapping with a portion where the wiring is not formed, that is, a portion overlapping the wiring and the wiring, as viewed from above.

The convex portion 205 is disposed at a position away from the sensing region 322 on the upper side of the sensor wafer 320 as viewed from above. In addition, the sensing region 322 utilizes a region that can be sensed by the sensor die 320, and is not sensed by the sensor die 11 on the outside of the sensing region.

The convex portion 205 is provided at a position corresponding to the central portion of the sensor wafer 320 in the left-right direction.

Next, the operation and operation of the video input device 50 will be described.

In a state where the base 200 is attached to the sensor portion 300, the convex portion 205 of the base 200 faces the state in which the hemispherical switch 350 abuts, and the sensor body 301 is applied upward by the restoring force of the hemispherical switch 350. force.

In this state, as shown in FIG. 8, when the examinee touches the upper side of the sensor wafer 320 with a finger or the like and pushes the sensor portion 300 downward with a finger or the like, the sensor portion 300 The pivots 304, 306 are pivoted downward for the fulcrum. When the sensor portion 300 is pushed downward, the hemispherical switch 350 is held by the convex portion 205, and the hemispherical switch 350 is pushed by the convex portion 205. When the hemispherical switch 350 is pushed, the electrical contact portion (not shown) of the hemispherical switch 350 is turned on, and the hemispherical switch 350 outputs the purpose to the controller (not shown) via the wiring of the wiring sheet 340. signal.

As a result, the controller causes the light emitting diode 342 to emit light, and outputs a sensor driving signal to the driver 330. When the sensor wafer 320 is driven by the driver 330, the light of the light-emitting diode 342 propagates in the backlight portion 302 and passes through the sensor wafer 320, and enters the finger of the examinee or the like. As a result, the subject's finger or the like is irradiated, and the examinee's hand is used by the sensor wafer 320. The image of the finger is converted into an image signal. The image input by the sensor die 320 is output from the driver 330 to the controller.

Then, when the finger of the examinee leaves the sensor die 320, the hemispherical switch 350 is restored to return to the original state, restored by the hemispherical switch 350, and the sensor portion 300 is rotated upward.

According to the above embodiment, since the convex portion 205 of the base 200 and the hemispherical switch 350 are disposed to face each other, when the sensor wafer 320 is pushed downward by the finger of the examinee or the like, the pressing force is concentrated. The convex portion 205 (or its vicinity) is positively transmitted to the hemispherical switch 350. Therefore, it is possible to withstand the pressing of the finger or the like of the examinee, and the sensing operation is surely started.

Moreover, the recesses 312, 314, and 316 are formed in the backlight portion 302 of the sensor body 301. Since the light emitting diodes 342 or the electronic component groups 344, 346 are housed in the recesses 312, 314, and 316, the sensor can be used. The portion 300 becomes a thin type (small size).

Further, the present invention is not limited to the above-described embodiments, and various modifications of the above-described embodiments are also included in the scope of the present invention. Hereinafter, although a modification is given, the scope of the present invention is not limited to the following modifications. The following modifications are provided in the same manner as the video input device 50 of the above-described embodiment except for the changed portions. Further, the following first to third modifications may be combined in a possible range.

[First Modification] The position of the hemispherical switch 350 and the position at which the convex portion 205 is disposed may be reversed. In the case where the hemispherical switch is disposed on the upper side of the base 200, It suffices that the wiring different from the wiring sheet 340 is provided on the upper surface side of the chassis 200, and the wiring and the hemispherical switch are connected. The convex portion pressed into the hemispherical switch may be formed on the lower surface side of the backlight unit 302 or may be formed on the wiring sheet 340.

[Second Modification] Further, in the above-described embodiment, the convex portion 205 is protruded, but the convex portion 205 may be convex or may be a convex portion having another shape.

[Third Modification] Further, instead of the hemispherical switch 350, a contact switch (a contact sensor for detecting contact) may be provided on the wiring sheet 340. In this case, the elastic member (spring, rubber, other elastic member) is sandwiched between the lower surface side of the backlight portion 302 and the base 200, in the original state (the state in which the sensor body 301 is not pushed), the contact switch and The convex portion 205 is not in contact due to the elastic member. On the other hand, when the sensor body 301 is pushed downward, the elastic member is compressed, and the contact switch is in contact with the convex portion 205. On the other hand, when the depression of the sensor body 301 is released, the elastic member is restored, and the contact switch and the convex portion 205 are separated.

[Second Embodiment]

In the second embodiment, the following matters are different from those of the first embodiment, and the same as the first embodiment.

As shown in FIG. 9, the video input device 60 of the second embodiment is also mainly decomposed into a base 200, a sensor unit 300, and a cover 400.

As shown in FIG. 10A, two convex portions 206, 208 (instead of the convex portions 205) are provided on the upper surface side of the base 200. The convex portions 206 and 208 are provided as convex portions in a state of protruding toward the upper surface side of the base 200.

Further, the base 200 is provided with a folded portion 210 in which a part thereof is folded back 90 degrees or more toward the front and rear direction. The notch portions 212 and 214 are formed on the left and right side portions of the folded portion 210, and the folded portions 206 and 208 are corresponding to the notch portions 212 and 214 (repeated) in a state where the folded portion 210 is folded back.

As shown in FIG. 10B, the folded-back portion 210 is folded back in a state of being slightly inclined to the upper surface side of the base 200 (a state in which the upper surface side of the base 200 is maintained at a fixed angle). When the folding portion 210 applies pressure downward, the folded portion 210 has an urging force that rebounds upward to bounce the pressure.

As shown in FIG. 11, two pattern switches 352 and 354 (instead of the hemispherical switch 350) are provided on the upper surface side of the wiring sheet 340.

Next, the operation and operation of the video input device 60 will be described.

As shown in FIG. 12A, in a state in which the base 200 is attached to the sensor portion 300, the folded portion 210 of the base 200 and the backlight portion 302 abut and bias upward, and the pattern switch 352 of the sensor portion 300, The 354 series and the convex portions 206, 208 are opposed to each other in a slightly separated state.

In this state, when the examinee touches the upper side of the sensor wafer 320 with a finger or the like and pushes the sensor portion 300 downward with a finger or the like, the sensor portion 300 resists the folded portion 210 of the base 200 at one side. The force is applied to rotate downward with the pivots 304, 306 as fulcrums. As shown in FIG. 12B, when the sensor portion 300 is pushed downward, the pattern switches 352, 354 are in contact with the convex portions 206, 208. When the two convex portions 206, 208 each contact the pattern switches 352, 354, the pattern switch 352 The electrical contact portion (not shown) of the 354 is turned on, and the signal of the purpose is output from the pattern switches 352 and 354 to the controller (not shown) via the wiring of the wiring sheet 340.

On the other hand, when the examinee leaves the finger away from the sensor wafer 320, the upward force of the folded portion 210 of the base 200 is received, and the contact of the pattern switches 352, 354 and the convex portions 206, 208 is released, and the sensor portion is removed. 300 turns upwards.

According to the above embodiment, one portion of the base 200 is folded back, and as the folded portion 210, since the sensor body 301 is biased upward (because it functions as a spring), the hemispherical switch 350 is not used. The dedicated switching element can also realize the sensing action, and the degree of folding back of the folded portion 210 can also control the force applied to the sensor body 301.

Further, the present invention is not limited to the above-described embodiments, and various modifications of the above-described embodiments are also included in the scope of the present invention. For example, the design modification described in the first to third modifications of the first embodiment may be applied to the video input device 60 of the second embodiment, and the following modifications may be applied to the video input device. 60.

[Modification]

Instead of the base 200 of FIGS. 10A and 10B, the base 200 of FIGS. 13A and 13B is used.

In the base 200 of FIGS. 13A and 13B, the bent portions 220 and 222 are provided instead of the folded portion 210. As shown in FIG. 13A, the curved portions 220 and 222 have a shape in which a part of the base portion 200 is cut away in the front-rear direction on the left and right side portions, and as shown in FIG. 13B, the rear end portion is integrated with the base 200. The front end portion is bent slightly upward (less than 90° to the base 200). Then, in a state where the base 200 is attached to the sensor unit 300, the curved portions 220 and 222 and the backlight unit 302 abut and are biased upward.

In this case, one of the bases 200 is also bent as a curved portion. 220, 222, since the sensor body 301 is biased upward (because it functions as a spring), a dedicated switching element such as the hemispherical switch 350 is not used, and a sensing operation can be realized, using the bending portion 220, The degree of bending of 222 can also control the force applied to sensor body 301.

[Third embodiment]

In the third embodiment, the following matters are different from those of the first embodiment, and the same as the first embodiment.

As shown in Fig. 14, the video input device 70 of the third embodiment is also mainly decomposed into a base 200, a sensor unit 300, and a cover 400.

In the base 200, the convex portion 205 is not provided, and a member corresponding to the convex portion 205 is provided on the lower surface side of the backlight portion 302 as the convex portion 318.

As shown in FIGS. 15A and 15B, the concave portion 312 is formed in the front side portion of the backlight unit 302, and is opened to the front.

As shown in Fig. 16, the hemispherical switch 350 is disposed on the lower side of the wiring sheet 340.

When the wiring piece 340 is attached to the sensor unit 300, as shown in FIG. 17, the front end portion of the wiring sheet 340 (refer to FIG. 16) is bent from the top to the bottom in a state of being stuck to the sensor wafer 320. And the wiring sheet 340 is adhered to the lower surface side of the backlight portion 302. At this time, as shown in FIG. 18, the light-emitting diode 342 of the wiring sheet 340 is fitted and housed in the concave portion 312 of the backlight unit 302, and the hemispherical switch 350 and the convex portion 318 face each other.

Next, the operation and operation of the video input device 70 will be described.

In a state where the base 200 is attached to the sensor portion 300, the hemispherical switch 350 and the convex portion 318 are opposed to each other in abutting state.

In this state, when the examinee touches the upper side of the sensor wafer 320 with a finger or the like and pushes the sensor portion 300 downward with a finger or the like, the sensor portion 300 pivots with the pivots 304, 306 as a fulcrum. Turn down. When the sensor portion 300 is pushed downward, the convex portion 318 is held by the hemispherical switch 350, and the hemispherical switch 350 is pushed by the convex portion 318. When the hemispherical switch 350 is pushed, the electrical contact portion (not shown) of the hemispherical switch 350 is turned on, and the hemispherical switch 350 outputs the purpose to the controller (not shown) via the wiring of the wiring sheet 340. signal.

Then, when the examinee leaves the finger away from the sensor wafer 320, the hemispherical switch 350 is restored to return to the original state, restored by the hemispherical switch 350, and the sensor portion 300 is rotated upward.

According to the above embodiment, the recessed portion 312 of the backlight unit 302 is formed on the front side surface, and since the light emitting diode 342 is housed in the recessed portion 312, the light of the light emitting diode 342 is planar from the side of the backlight unit 302. The ground is propagated, and the amount of light emitted from the backlight unit 302 from above is made uniform throughout the sensing area 322.

Further, since the light-emitting diode 342, the electronic component groups 344 and 346, and the hemispherical switch 350 are all assembled on the same surface (single-sided assembly) of the wiring sheet 340, the light-emitting diode 342 and the electronic component group 344, 346 are combined. As well as the hemispherical switch 350 being assembled on different sides, the manufacturing system is easier and the manufacturing cost can be reduced.

Further, the present invention is not limited to the above-described embodiments, and various modifications of the above-described embodiments are also included in the scope of the present invention. For example, the design described in the first to third modifications of the first embodiment described above may be employed. The deformation is applied to the video input device 70 of the third embodiment described above.

[Fourth embodiment]

Fig. 19 is a right side view showing the video input device 1 according to the fourth embodiment of the present invention, and Fig. 20 is a rear view of the video input device 1.

As shown in Figs. 19 and 20, the base 2 is a plate-like or thin-plate-shaped member, and the upper side and the lower side of the base 2 are disposed in parallel with each other. The support portions 3 and 4 are respectively disposed at the rear of the left and right sides of the upper side of the base 2 . The support portions 3, 4 are disposed in a state of standing on the upper side of the base 2.

The shaft hole penetrates the support portion 3 in the left-right direction, and the shaft hole also penetrates the support portion 4 in the left-right direction. When viewed in the left-right direction, the shaft hole of the support portion 3 and the shaft hole of the support portion 4 are concentric.

The convex portion 5 and the sensor receiving portions 7 and 8 are provided on the upper surface side of the base 2. The convex portion 5 and the sensor receiving portions 7, 8 are provided in a state in which the upper surface side of the base 2 protrudes, and the shape of the sensor receiving portions 7, 8 seen from above is a long diameter in the front and rear directions. An elliptical shape with a short diameter in the left and right direction. The protruding height of the sensor receiving portion 7 and the protruding height of the sensor receiving portion 8 are equal.

The convex portion 5 is provided at the front portion of the base 2, and the sensor receiving portions 7, 8 are disposed rearward of the convex portion 5, and the sensor receiving portions 7, 8 are disposed on the support portion 3 and the convex portion 5 as viewed from the left and right direction. between. Further, as seen from the front-rear direction, the convex portion 5 is provided at the left and right central portions of the chassis 2, and the convex portion 5 is disposed between the sensor receiving portion 7 and the sensor receiving portion 8 as viewed in the front-rear direction, particularly between them. central.

The sensor body 9 and the support portions 3, 4 are coupled to be rotatable up and down. The sensor body 9 is provided with: a bottom plate 10 made of resin; and a sensor The wafer 11 is mounted on the bottom plate 10. The pivots 13, 14 are each formed at the rear of the left and right sides of the bottom plate 10, the pivot 13 is inserted into the shaft hole of the support portion 3, and the pivot 14 is inserted into the shaft hole of the support portion 4. Thus, the pivots 13, 14 are respectively supported by the support portions 3, 4, and the sensor body 9 can rotate up and down the base 2, and the rotational axis of the sensor body 9 is located at the center line of the pivots 13, 14. And extending in the left and right direction. Further, although the pivots 13, 14 are provided on the bottom plate 10, and the shaft holes are provided in the support portions 3, 4, the pivot portions may be provided on the support portions 3, 4, and the shaft holes may be provided in the bottom plate 10.

The sensor wafer 11 is loaded on the bottom plate 10, and the lower side of the bottom plate 10 and the upper side of the sensor wafer 11 are parallel.

The sensor wafer 11 is a contact sensor having its upper side as a sensor surface, and is in contact with the surface of the surface of the object to be inspected (for example, a finger or the like) on the upper side (for example, a concave-convex pattern (in the case of being inspected) In the case where the finger is a finger, it is a fingerprint or a form in which the inside of the subject on the upper side is contacted (for example, a vein pattern inside the finger when the subject is a finger) becomes an image and is input. As a sensor crystal As the element 11, a sensor that senses the surface morphology or internal shape of the object to be inspected by an optical type, an electrostatic capacitance type, an electric field type, a thermal type, a pressure sensitive type, or an ultrasonic type can be used.

A flexible wiring sheet 15 is connected to the front end portion of the upper surface side of the sensor wafer 11. The wiring sheet 15 is bent from the upper end side of the front end portion of the sensor wafer 11 toward the lower surface side of the bottom plate 10, and is wired to the rear of the bottom plate 10. Then, the wiring sheet 15 is adhered to the lower surface side of the bottom plate 10.

The wiring sheet 15 is a laminate in which an insulating film is laminated, and a pattern for driving wiring of the sensor is formed between those layers. Wiring pair formed on the wiring sheet 15 The terminals of the sensor wafer 11 are turned on.

The push switch 16 is disposed on the lower side of the sensor body 9, and the push switch 16 is disposed at the left and right central portions of the sensor body 9 as viewed in the front-rear direction. Specifically, the push switch 16 is attached to the wiring sheet 15 , and the push switch 16 is provided at a position corresponding to the convex portion 5 . The push switch 16 is a push switch such as a hemispherical switch, a contact switch, or a push button switch, and has a restoring force that is restored from a pressed state.

In the case where the push switch 16 is a hemispherical switch, as shown in FIG. 21, the push switch 16 has a conductive elastic member 17 which is formed to be hemispherical so as to be convex downward; a plurality of electrical contacts The portion 18 is provided inside the elastic member 17; and the insulating elastic member 19 is provided to cover the elastic member 17. As shown in Fig. 22, when the elastic members 17, 19 are pressed, the elastic members 17, 19 are elastically deformed, and the elastic member 17 contacts the electrical contact portion 18, so that the electrical contact portions 18 become conductive. When the pressing of the elastic members 17 and 19 is released, the elastic members 17 and 19 are restored to the original hemispherical shape. Here, the electrical contact portion 18 is electrically connected to the wiring of the wiring sheet 15.

The installation positions of the convex portion 5, the sensor receiving portions 7, 8, the push switch 16, and the sensor wafer 11 will be described.

Both the convex portion 5 and the sensor receiving portions 7 and 8 are provided at positions overlapping the portions where the wirings are not formed, that is, the portions overlapping the wirings and the wirings, as viewed from above.

Both the convex portion 5 and the sensor receiving portions 7, 8 are disposed at positions away from the sensing region on the upper side of the sensor wafer 11 as viewed from above. In addition, the sensing area utilizes an area that the sensor die 11 can sense, on the outside of the sensing area, Sensing is not performed using the sensor die 11.

The convex portion 5 is provided at a position corresponding to the central portion of the sensor wafer 11 in the left-right direction.

The radial direction of the rotation of the sensor body 9 to the sensor body 9 is set to the rotational axis (the pivots 13, 14) of the sensor body 9 and the contact surface of the push switch 16 or the push switch 16 between.

Next, the operation and operation of the video input device 1 will be described.

When the examinee touches the upper side of the sensor wafer 11 with a finger or the like and pushes the sensor body 9 downward with a finger or the like, the sensor body 9 is rotated downward with the pivots 13, 14 as a fulcrum. When the sensor body 9 is pushed downward, the push switch 16 is held by the convex portion 5, and the push switch 16 is pushed by the convex portion 5. When the push switch 16 is pushed, since the electric contact portion 18 of the push switch 16 is turned on, a signal is output from the push switch 16 to the control circuit via the wiring of the wiring sheet 15. Using this as a trigger signal, the sensor circuit 11 is driven by the control circuit, and the sensor wafer 11 is used to take in the surface form or internal form of the finger or the like.

Then, when the finger of the examinee leaves the sensor die 11, the push switch 16 is restored to return to the original state, and the push switch 16 is restored, and the sensor body 9 is rotated upward.

According to the present embodiment, as shown in Fig. 23, when the pusher switch 16 is pressed by the convex portion 5 and the examiner pushes the sensor main body 9 downward, the sensor body 9 is only slightly Bend down. In this case, since the lower side of the curved sensor body 9 is held by the sensor receiving portions 7, 8, even if the sensor wafer 11 or the bottom plate 10 is made thin, the sensor is Body 9 will not be greatly deformed. Therefore, the sensor wafer 11 or the bottom plate 10 can be protected from the downward load, and the sensor wafer 11 or the bottom plate 10 can be made compact and lightweight.

Further, since the sensor receiving portions 7, 8 are disposed at positions overlapping the portions of the wiring sheet 15 where the wiring is not formed, the sensor receiving portions 7, 8 are pushed even by pushing the sensor body 9 downward. When the wiring sheet 15 is hit, the wiring inside the wiring sheet 15 is not pressed by the sensor receiving portions 7, 8. Therefore, it is possible to surely prevent the disconnection of the wiring.

Moreover, since the convex portion 5 and the sensor receiving portions 7, 8 are disposed at positions away from the sensing region of the sensor wafer 11, it is possible to suppress the convex portion 5 and the feeling when the sensor body 9 is pushed downward. The sensor receiving portions 7, 8 abut against the decrease in the sensing performance of the sensor wafer 11.

Moreover, since the sensor body 9 is supported by the convex portion 5 and the sensor receiving portions 7, 8 at three points, the sensor body 9 is stabilized even in a state where the sensor body 9 is pushed, especially because Since the position of the convex portion 5 and the sensor receiving portions 7 and 8 is set, the stability is excellent. Thus, damage to the sensor body 9 can be further prevented.

Further, the present invention is not limited to the above-described embodiments, and various modifications of the above-described embodiments are also included in the scope of the present invention. Hereinafter, although a modification is given, the scope of the present invention is not limited to the following modifications. The following modifications are provided in the same manner as the video input device 1 of the above-described embodiment except for the changed portions. Further, the following modifications may be combined in the possible range.

[First Modification] The position of the push switch 16 and the position at which the convex portion 5 is disposed may be reversed. In the case where the push switch is provided on the upper surface side of the chassis 2, the wiring different from the wiring sheet 15 may be provided on the upper surface side of the chassis 2, and this wiring may be connected to the push switch. The convex portion to which the push switch is pressed may be formed on the lower surface side of the bottom plate 10 or may be formed on the wiring sheet 15.

[Second Modification] Further, in the above-described embodiment, the convex portion 5 and the sensor receiving portions 7 and 8 are protruded, but the convex portion 5 and the sensor receiving portions 7 and 8 may be convex or may be convex portions of other shapes. .

[Third Modification] Further, in the sensor receiving portions 7 and 8 of the above-described embodiment, the sensor receiving portions 7 and 8 are formed on the upper surface side of the chassis 2, but the receiving portions of the sensor receiving portions 7 and 8 may be replaced with the receiving portion of the bottom plate 10. It is formed on the lower surface side of the bottom plate 10. Alternatively, in addition to the sensor receiving portions 7 and 8 formed on the upper surface side of the chassis 2, a receiving portion in a state in which the lower surface side of the bottom plate 10 protrudes may be formed on the lower surface side of the bottom plate 10.

[Fourth Modification] Further, in the above embodiment, the sensor body 9 is vertically rotatable with the pivots 13, 14 as a fulcrum. However, the sensor body 9 may be provided so as to be linearly movable up and down. For example, instead of the support portions 3 and 4, the guide bar is erected on the upper surface side of the base 2, the hole penetrates the bottom plate 10 up and down, and the guide bar is inserted into the hole. Therefore, the bottom plate 10 is guided up and down by the guide bars and the holes.

[Fifth Modification] Further, instead of the push switch 16, a contact switch (a contact sensor for detecting contact) may be provided on the wiring sheet 15. In this case, an elastic member (an elastic member such as a spring or a rubber) is sandwiched between the lower surface side of the bottom plate 10 and the base 2, and in the original state (the state in which the sensor body 9 is not pushed), the contact switch and the convex portion 5 are contacted. Not in contact due to the elastic member. On the other hand, when the sensor body 9 is pushed downward, the elastic member is compressed, and the contact switch is in contact with the convex portion 5. On the other hand, when the depression of the sensor body 9 is released, the elastic member is restored, and the contact switch and the convex portion 5 are separated.

[Sixth Modification] Further, in the above embodiment, the sensor wafer 11 is mounted on the substrate 10, but the sensor wafer 11 may not be mounted on the substrate 10, and the pivot may be disposed on the left and right sides of the sensor wafer 11. And the pivots are each coupled to the support portions 3, 4, and the sensor wafer 11 can be rotated up and down.

[Fifth Embodiment]

Fig. 24 is a perspective view showing a video input device 101 according to a fifth embodiment of the present invention, and Fig. 25 is an exploded perspective view of the video input device 101, and Fig. 26 is a view showing a direction different from that of Fig. 25; An exploded perspective view. Fig. 27 is a perspective view showing the image input apparatus 101 in a state in which the cover 160 is removed, Fig. 28A is a side view showing the cover 160 detached from the image input apparatus 101, and Fig. 28B is a view showing the state in which the cover 160 is removed. Side view of the image input device 101.

As shown in Figs. 24 to 27, 28A and 28B, the base 102 is a plate-like or thin-plate-shaped member. The support portions 103 and 104 are respectively disposed at the rear of the left and right sides of the base 102, and the guide portions 131 and 132 are provided. They are respectively disposed at the front of the left and right sides of the base 102. The support portions 103 and 104 and the guide portions 131 and 132 are provided in a state of standing on the upper side of the base 102.

The shaft hole 103a penetrates the support portion 103 in the left-right direction, and the shaft hole 104a penetrates the support portion 104 in the left-right direction. When viewed in the left-right direction, the shaft hole 103a and the shaft hole 104a are concentric. Long guide holes 131a and 132a are formed in the guide portions 131 and 132, respectively.

The convex portion 105 and the sensor receiving portions 107 and 108 are provided on the upper surface side of the base 102. The convex portion 105 and the sensor receiving portions 107 and 108 are provided as convex portions in a state in which the upper surface side of the base 102 protrudes, and the shape of the sensor receiving portions 107 and 108 seen from above is long in the front and rear directions. The diameter is an elliptical shape with a short diameter in the left and right direction. The protruding height of the sensor receiving portion 107 and the protruding height of the sensor receiving portion 108 are equal.

The convex portion 105 is disposed at the front portion of the base 102, and the sensor receiving portions 107, 108 are disposed rearward of the convex portion 105. The sensor receiving portions 107, 108 are disposed at the convex portion 105 and the supporting portion 103 as viewed from the right direction. Between 104. Further, as seen in the front-rear direction, the convex portions 105 are provided at the left and right central portions of the base 102, and the convex portions 105 are disposed between the sensor receiving portion 107 and the sensor receiving portion 108, particularly the center therebetween, as viewed in the front-rear direction. .

On the other hand, the sensor body 109 is provided with a bottom plate 110 which is made of a transparent resin, and a sensor wafer 111 which is mounted on the bottom plate 110. The pivots 113, 114 are each formed at the rear of the left and right sides of the bottom plate 110, the pivot 113 is inserted into the shaft hole 103a, and the pivot 114 is inserted into the shaft hole 104a. Thus, the pivots 113, 114 are each supported by the support portions 103, 104. The sensor body 109 can rotate up and down the base 102. Further, the guided portions 141 and 142 are respectively protruded from the front side of the left and right side surfaces of the bottom plate 110, and the guided portion 141 is inserted into the long hole 131a, and the guided portion 142 is inserted into the long hole 132a. Therefore, the guided portions 141 and 142 are guided up and down.

The diffusion plate 133 is adhered to the lower surface side of the bottom plate 110. The diffusing plate 133 is a white plate, and diffuses the light incident on the surface on the side of the bottom plate 110. The rectangular housing recess 110a is formed on the upper surface side of the bottom plate 110. The sensor wafer 111 is mounted on the bottom of the housing recess 110a.

At the bottom plate 110, the cover 160 is covered from above. The plurality of claws 110c are formed on the side surface of the bottom plate 110, and the cover 160 is fixed to the bottom plate 110 by the claws 110c being locked to the cover 160. A rectangular opening 161 is formed in the cover 160, and the sensing region 111b on the upper side of the sensor wafer 111 is exposed in the opening 161.

The sensor wafer 111 is a contact type sensor in which the upper side thereof is a sensor surface, and is a solid-state imaging element that converts the form of the surface of the object to be inspected (for example, a finger or the like) on the upper side into an image. In particular, the sensor wafer 111 is a double gate transistor of a photoelectric conversion element as a pixel, and a plurality of double gate transistors are arranged in an array on a transparent glass substrate. In the case where the sensor wafer 111 is viewed from the upper side, a portion between the double gate transistors is transparent, and light is transmitted through a portion between the double gate transistors. Thus, the sensor wafer 111 is a light-transmissive transparent solid-state imaging element. Light incident from the lower side of the sensor wafer 111 into the lower side of the sensor wafer 111 does not enter the semiconductor of the double gate transistor, but is incident from the upper side of the sensor wafer 111. The light on the upper side of the transistor 320 is incident on the semiconductor of the double gate transistor. In addition, the sensing region 111b is a double gate The portion of the semiconductor that is photosensitive to the semiconductor.

On the upper side of the front end of the sensor wafer 111, a driver 111a for driving the sensor wafer 111 is loaded.

At the front end portion of the upper surface side of the sensor wafer 111, one end portion 115m of the flexible wiring sheet 115 is connected. This wiring sheet 115 is bent from the upper end side of the front end portion of the sensor wafer 111 toward the lower surface side of the bottom plate 110, and is wired to the rear side of the bottom plate 110. Then, the other end portion 115n of the wiring sheet 115 is connected to the controller 170 of the IC wafer (illustrated in Fig. 31).

The wiring sheet 115 is a laminate in which an insulating film is laminated, and a pattern in which wiring is formed between those layers. Figs. 29 and 30 show the wiring of the wiring of the wiring sheet 115. Here, Fig. 29 is a view showing a wiring formed between the layers on the side of the bottom plate 110, and Fig. 30 is a view showing a wiring formed between the layers on the opposite side to the bottom plate 110. As shown in FIG. 29 and FIG. 30, in the wiring sheet 115, the driver wiring group 115a, the switching wiring group 115b, the power supply wiring group 115c, the inspection wiring group 115d, and the LED wiring group 115e are formed. Further, in the wiring sheet 115, passive groups (resistors, capacitors, etc.) groups 115f, 115g, 115h, and 115i are mounted. Further, the contact portions 118a, 118b of the hemispherical switch 116 are formed on the wiring sheet 115. Further, the light-emitting diode 151 is mounted on the wiring sheet 115. In addition, the driver wiring group 115a, the switching wiring group 115b, the power supply wiring group 115c, the inspection wiring group 115d, and the LED wiring group 115e are covered with an insulating film, but the contact portions 118a and 118b are exposed.

The driver wiring group 115a is connected to the driver 111a and the passive component group 115g. Switch wiring group 115b via passive component group 115f and contacts The sections 118a and 118b are connected. The power supply wiring group 115c is connected to the passive element group 115g. The inspection wiring group 115d is connected to the passive element group 115i and the driver 111a. The LED wiring group 115e is connected to the light-emitting diode 151 via the passive element group 115h.

As shown in FIG. 26, FIG. 28A, and FIG. 28B, the hemispherical switch 116 is disposed on the opposite side of the bottom plate 110 from both sides of the wiring sheet 115. The hemispherical switch 116 is provided with contact portions 118a and 118b (shown in FIG. 30) formed on the wiring sheet 115, and an elastic member 117 provided in a hemispherical shape. The conductive film is formed on the inner surface of the elastic member 117. Although the conductive film is connected to the contact portion 118a, it is not connected to the contact portion 118b. On the other hand, when the elastic member 117 is pressed, the conductive film is connected to the contact portion 118b.

As shown in the block diagram of Fig. 31, when the hemispherical switch 116 is depressed, the contact portions 118a and 118b are turned on, and the hemispherical switch 116 is turned on, and the purpose is input to the controller 170 via the switch wiring group 115b.

Moreover, the controller 170 causes the light-emitting diode 151 to emit light via the LED wiring group 115e at a predetermined timing.

Moreover, the electric power is supplied from the controller 170 to the driver 111a of the sensor wafer 111 via the power supply wiring group 115c and the driver wiring group 115a. Further, the sensor driving signal is output by the controller 170, and the sensor driving signal is input to the driver 111a via the driver wiring group 115a, and the driver 111a drives the sensor wafer 111 in accordance with the sensor driving signal. Thus, light incident on each of the double gate transistors of the sensor wafer 111 is converted into an electrical signal by photoelectric conversion, and thus photographing is performed by the sensor wafer 111. The image signal input by the sensor wafer 111 is transmitted via the driver wiring group 115a. The controller 170 outputs.

The relationship between the convex portion 105, the sensor receiving portions 107 and 108, the light-emitting diode 151, and the installation position of the sensor wafer 111 will be described.

As shown in FIGS. 29 and 30, the sensor receiving portions 107 and 108 are both disposed at positions overlapping the portions of the wiring sheet 115 where the wiring is not formed, as viewed from above.

Further, as shown in Fig. 25, the convex portion 105 and the sensor receiving portions 107, 108 are disposed outside the sensing region 111b of the sensor wafer 111 as viewed from above.

The convex portion 105 is provided at a position corresponding to the central portion of the sensor wafer 111 in the left-right direction.

As shown in Fig. 26, the hemispherical switch 116 is disposed at a position corresponding to the convex portion 105, and the hemispherical switch 116 and the convex portion 105 overlap when viewed from the bottom.

The light-emitting diode 151 is disposed further forward than the sensing region 111b of the sensor wafer 111 when viewed from above. Moreover, the light-emitting diode 151 is disposed in the center portion of the sensor wafer 111 in the left-right direction when viewed from above.

The accommodating recess is formed on the lower surface side of the bottom plate 110, and the light emitting diode 151 is housed in the accommodating recess. Further, the light-emitting diode 151 emits light rearward, and light enters the bottom plate 110 on the lower side of the sensor wafer 111, and the bottom plate 110 functions as a light guiding member, and light is incident on the substrate 110. The diffused reflection is performed by the diffusion plate 133, and the reflected light is emitted from the bottom plate 110, and is incident on the lower surface side of the sensor wafer 111 as a whole in the sensing region 111b.

Next, the operation and operation of the video input device 101 will be described.

When the examinee touches the sensing area 111b on the upper side of the sensor wafer 111 with a finger or the like and pushes the sensor body 109 downward with a finger, the sensor body 109 pivots with the pivots 113, 114 as a fulcrum. Turn down. When the sensor body 109 is pushed downward, the hemispherical switch 116 is held by the convex portion 105, and the hemispherical switch 116 is pushed by the convex portion 105. When the hemispherical switch 116 is pressed, since the contact portions 118a and 118b of the hemispherical switch 116 are turned on, the signal from the hemispherical switch 116 is output to the controller 170 via the switch wiring group 115b of the wiring sheet 115.

As a result, the controller 170 causes the light emitting diode 151 to emit light, and outputs a sensor driving signal to the driver 111a. The sensor wafer 111 is driven by the driver 111a, and the light of the light-emitting diode 151 is transmitted through the sensor wafer 111 and injected into the finger or the like of the examinee. As a result, the finger or the like of the examinee is irradiated, and the image of the subject's finger or the like is converted into a video signal by the sensor wafer 111. The image input by the sensor wafer 111 is output from the driver 111a to the controller 170 via the driver wiring group 115a.

Then, when the inspector's finger leaves the sensor wafer 111, the hemispherical switch 116 is restored to return to the original state, restored by the hemispherical switch 116, and the sensor body 109 is rotated upward.

Further, the present invention is not limited to the above-described embodiments, and various modifications of the above-described embodiments are also included in the scope of the present invention. For example, the design modification described in the modification of the fourth embodiment can be applied to the video input device 101 of the fifth embodiment.

[Examples]

About Figure 24 to Figure 27, Figure 28A, and Figure 28B The image input device 101 pushes the sensing region 111b of the sensor wafer 111 downward by a jig, applies a load to the sensor wafer 111 to be damaged, and measures the load at the time of damage. As a result of performing such a test on a plurality of samples (image input device 101), it was found that the sensor wafer 111 was damaged at a load of an average value of 130.7 N (13.3 kgf).

On the other hand, regarding the image input device of the sensorless receiving portions 107 and 108 of the image input device 101 shown in Figs. 24 to 27, 28A, and 28B, the same test is performed plural times. As a result, it was found that the sensor wafer 111 was damaged at a load of an average value of 69.6 N (7.1 kgf).

From the above results, it is found that when the sensor wafer 111 has the sensor receiving portions 107 and 108, it can withstand a higher load than in the case of no.

[Sixth embodiment]

32 and 33 are right side views of the video input device 1001 according to the sixth embodiment of the present invention. Here, in Fig. 32, the push switch 1016 is in the original state, and in Fig. 33, the sensor body 1009 is rotated downward about the rotation shaft 1013 and pushes the push switch 1016.

As shown in Figs. 32 and 33, the base 1002 is a plate-like or thin-plate-shaped member, and the upper surface 1002a and the lower surface 1002b of the base 1002 are not parallel, and the upper surface 1002a is inclined to the lower surface 1002b. Thus, the thickness of the base 1002 in the upper and lower directions gradually increases from the front end 1002c of the base 1002 to the rear end 1002d. Further, the upper surface 1011a and the lower surface 1010a of the sensor body 1009 are parallel to the surface direction.

The convex portion 1005 is disposed on the upper side of the upper portion 1002a of the base 1002 At the end 1002c. The convex portion 1005 is provided as a protrusion in a state in which the upper surface 1002a of the base 1002 protrudes.

The support portions 1003 are respectively disposed on the left and right side faces of the base 1002 closer to the rear end 1002d than the convex portions 1005. The shaft hole penetrates the support portion 1003 in the left-right direction.

A rotating shaft 1013 that can rotate the base 1002 and the sensor body 1009 up and down is attached to the support portion 1003. The sensor body 1009 includes a bottom plate 1010 made of a resin, and a sensor wafer 1011 mounted on the bottom plate 1010. The rotating shafts 1013 are respectively formed at the rear end 1009d of the left and right sides of the sensor body 1009, and the rotating shaft 1013 is inserted into the shaft hole of the supporting portion 1003. Thus, the shaft 1013 is pivoted by the support portion 1003, and the sensor body 1009 can be rotated up and down on the base 1002. The rotation axis of the sensor body 1009 is located at the center line of the shaft 1013, and is directed to the left and right. The direction extends. Further, although the rotating shaft 1013 is provided on the bottom plate 1010 and the shaft hole is provided in the support portion 1003, the rotating shaft 1013 may be provided on the support portion 1003 instead, and the shaft hole may be provided in the bottom plate 1010.

The sensor wafer 1011 is loaded on the bottom plate 1010, and the lower surface 1010a of the bottom plate 1010 and the upper surface 1011a of the sensor wafer 1011 are parallel, that is, the upper surface 1011a and the lower surface 1010a of the sensor body 1009 are parallel to each other.

The sensor wafer 1011 is a contact sensor having the upper surface 1011a as a sensor surface, and is in contact with the surface of the object to be inspected (for example, a finger or the like) of the upper surface 1011a (for example, a concave-convex pattern (inspected) When the body is a finger, it is a fingerprint)) or the form of the inside of the object to be inspected on the upper side (for example, when the object to be inspected is a finger, it is a vein pattern inside the finger) Like and input. As the sensor wafer 1011, a sensor that senses the surface morphology or internal shape of the object to be inspected by an optical type, a capacitive type, an electric field type, a thermal type, a pressure sensitive type, or an ultrasonic type can be used. Further, the driver may be mounted on the outer edge portion of the sensor wafer 1011 (for example, the front end portion of the sensor wafer 1011).

A flexible wiring piece 1015 is connected to the front end portion of the upper surface side 1011a of the sensor wafer 1011. The wiring sheet 1015 is bent from the front end portion of the upper surface 1011a of the sensor wafer 1011 toward the lower surface 1010a of the bottom plate 1010, and is wired to the rear of the bottom plate 1010. Then, the wiring sheet 1015 is adhered to the lower surface 1010a of the bottom plate 1010.

The wiring sheet 1015 is a laminate in which an insulating film is laminated, and a pattern for driving wiring of the sensor wafer 1011 is formed between those layers. The wiring formed on the wiring sheet 1015 is turned on to the terminals of the sensor wafer 1011.

In the wiring sheet 1015, an active element (a transistor, a diode, a light emitting diode) or a passive element (a resistor or a capacitor) may be mounted. In particular, the sensor wafer 1011 is a light-transmitting solid-state imaging element that exhibits photosensitivity to light incident on the upper surface 1011a, and the light incident on the lower surface is emitted from the upper surface 1011a, and the light-emitting diode is used. It is mounted on the wiring sheet 1015. In the case where the sensor wafer 1011 is a light-transmitting solid-state imaging element, the substrate 1010 is transparent, and light emitted from the light-emitting diode mounted on the wiring sheet 1015 passes through the substrate 1010 and enters the lower surface of the sensor wafer 1011. Then, it is emitted from the upper surface 1011a of the sensor wafer 1011.

The push switch 1016 is disposed closer to the front end than the rotating shaft 1013 of the lower surface 1010a of the system sensor body 1009. Specifically, the push switch 1016 It is attached to the wiring sheet 1015, and the push switch 1016 is provided at a position corresponding to the convex portion 1005. The push switch 1016 is a push switch such as a hemispherical switch, a contact push switch, or a push button switch, and has a restoring force restored from a pressed state. Further, in the case where the push switch 1016 is a hemispherical switch, the push switch 1016 has a conductive elastic member which is formed to be hemispherical so as to be convex downward, and a plurality of electrical contact portions are electrically conductive. The inner side of the elastic member is provided on the wiring sheet 1015; and the insulating elastic member is provided to cover the outer side of the conductive elastic member. When the conductive elastic member and the insulating elastic member are pressed, the conductive elastic member and the insulating elastic member are elastically deformed, and the conductive elastic member contacts the electrical contact portion, and thus the electrical contact portions are turned on. When the pressing of the conductive elastic member and the insulating elastic member is released, the conductive elastic member and the insulating elastic member are restored to the original hemispherical shape.

Since the push switch 1016 is disposed at a position corresponding to the convex portion 1005, as shown in FIG. 32, the push switch 1016 and the convex portion 1005 are in contact due to the weight of the sensor body 1009 or the like. In a state where the push switch 1016 is not pushed in the original state, the upper surface 1011a of the sensor body 1009 and the lower surface 1002b of the base 1002 are parallel, and the upper surface 1002a of the base 1002 is inclined to the lower surface 1010a of the sensor body 1009. Thus, the upper surface 1002a of the base 1002 and the lower surface 1010a of the sensor body 1009 form an acute angle on the rear end side. On the other hand, as shown in Fig. 33, even when the sensor body 1009 is rotated toward the base 1002 side, and the push switch 1016 is pushed, the upper surface 1002a of the base 1002 and the lower surface 1010a of the sensor body 1009 are also An acute angle is formed on the side of the rear end.

The arrangement positions of the convex portion 1005, the push switch 1016, and the sensor wafer 1011 are explained.

The convex portion 1005 is disposed at a position away from the sensing region of the upper surface 1011a of the sensor wafer 1011 as viewed from above. The sensing region utilizes a region that the sensor cell 1011 can sense, on the outside of the sensing region, without sensing with the sensor die 1011.

The convex portion 1005 is provided at a position corresponding to the central portion of the sensor wafer 1011 in the left-right direction.

Next, the operation and operation of the video input device 1001 will be described.

When the examinee touches the upper surface 1011a of the sensor wafer 1011 with a finger or the like and pushes the sensor body 1009 downward with a finger or the like, the sensor body 1009 rotates downward with the rotation shaft 1013 as a fulcrum. When the sensor body 1009 is pushed downward, the push switch 1016 is held up by the convex portion 1005, and the push switch 1016 is pushed by the convex portion 1005. When the push switch 1016 is pushed, since the electrical contact portion of the push switch 1016 is turned on by the conductive elastic member, the push switch 1016 is switched from non-conductive to conductive, and from the push switch 1016 via the wiring sheet 1015. The wiring outputs an ON signal to the control circuit. Using this as a trigger signal, the sensor circuit 1011 is driven by the control circuit, and the sensor wafer 1011 is used to take in the surface form or internal form of the finger or the like.

Then, when the finger of the examinee leaves the sensor wafer 1011, the push switch 1016 is restored to return to the original state, and is restored by the push switch 1016, and the sensor body 1009 is rotated upward, and the push switch 1016 is returned. Go to the original state. In addition, although the push switch 16 is pushed, the push switch 1016 From no conduction to conduction, but vice versa, the push switch 1016 changes from conducting to non-conducting when the push switch 1016 is released.

According to the present embodiment, since the thickness of the base 1002 gradually increases from the front end 1002c toward the rotating shaft 1013, the sensor body 1009 is pushed downward, and the lower surface 1010a of the sensor body 1009 and the base 1002 are The intersection of the upper surface direction of 1002a is located on the side of the rotating shaft 1013 of the sensor body, and the crossing angle forms an acute angle. Then, from the state in which the push switch 1016 is pushed by the convex portion 1005 in this state, when the examinee pushes the sensor body 1009 downward again, the sensor body 1009 is only slightly bent downward. Since the lower surface 1010a of the sensor body 1009 and the upper surface 1002a of the base 1002 form an acute angle on the side of the rotating shaft 1013, the portion of the lower surface 1010a of the curved sensor body 1009 that is close to the rotating shaft 1013 abuts the upper surface 1002a of the base 1002, and Withstood by 1002a above it. Since the lower surface 1010a of the sensor body 1009 is thus supported, the sensor wafer 1011 or the bottom plate 1010 can be protected from the downward load, thereby making the sensor wafer 1011 or the bottom plate 1010 small and lightweight. In particular, in the case where the bottom plate 1010 has a glass substrate as a base like a solid-state imaging element, deformation of the sensor wafer 1011 can be suppressed, and the sensor wafer sensor wafer 1011 is protected.

Moreover, since the convex portion 1005 is disposed at a position away from the sensing region of the sensor wafer 1011, the sensor wafer 1011 caused by the abutment of the convex portion 1005 when the sensor body 1009 is pushed downward can be suppressed. The sensing performance is reduced.

Also, the original state of the push switch 1016 is not pushed because the sensor The upper surface 1011a of the wafer 1011 and the lower surface 1002b of the base 1002 are parallel. Therefore, even if the base 1002 is placed on a horizontal surface or the like, one portion of the image input device 1001 does not protrude upward from the horizontal surface or is recessed downward than the horizontal surface. Therefore, the image input device 1001 as a whole can be made thin.

[Seventh embodiment]

Fig. 34 and Fig. 35 are side views showing the video input device 1001 according to the seventh embodiment of the present invention. Here, the same components are assigned to the portions corresponding to each other between the video input device 1001 shown in FIGS. 34 and 35 and the video input device 1001 according to the sixth embodiment. Hereinafter, a portion different from the video input device 1001 of the sixth embodiment will be described with respect to the video input device 1001 shown in FIGS. 34 and 35.

As shown in Figs. 34 and 35, the base 1002 is a plate-like or thin-plate-shaped flat plate, and the upper surface 1002a and the lower surface 1002b of the base 1002 are parallel to the surface direction. Further, the upper surface 1011a and the lower surface 1010a of the sensor body 1009 are not parallel, and the upper surface 1011a is inclined to the lower surface 1010a. Therefore, the thickness of the sensor body 1009 in the upper and lower directions gradually increases from the front end 1009c to the rear end 1009d. Here, since the thickness of the sensor wafer 1011 is substantially uniform among the sensor bodies 1009, the thickness of the bottom plate 1010 gradually increases from the front end to the rear end.

In a state where the push switch 1016 is not pushed in the original state, the upper surface 1011a of the sensor body 1009 and the lower surface 1002b of the base 1002 are parallel, and the upper surface 1002a of the base 1002 is inclined to the lower surface 1010a of the sensor body 1009. Thus, the upper surface 1002a of the base 1002 and the lower surface 1010a of the sensor body 1009 form an acute angle on the side of the rear end 1009d. on the other hand, As shown in Fig. 35, even when the sensor body 1009 is rotated toward the base 1002 side, and the push switch 1016 is pushed, the upper surface 1002a of the base 1002 and the lower surface 1010a of the sensor body 1009 are also at the rear end 1009d. The sides form an acute angle.

Except for the above-described matters, the video input device 1001 shown in FIGS. 34 and 35 and the video input device 1001 according to the sixth embodiment are provided in the same manner.

In the video input device 1001, when the examiner pushes the sensor body 1009 downward with a finger or the like, the push switch 1016 is pressed by the convex portion 1005, and the sensor wafer 1011 is used to capture the finger with the image. Surface morphology or internal morphology. Then, when the examinee's finger or the like leaves the sensor body 1009, the push switch 1016 is restored, and the sensor body 1009 is rotated upward.

Since the thickness of the sensor body 1009 gradually increases from the front end thereof toward the rotating shaft 1013, the sensor body 1009 is rotated toward the base 1002 side and the push switch 1016 is pushed, and the sensor body 1009 is under the state. The upper surface 1002a of the 1010a and the base 1002 forms an acute angle on the side of the rotating shaft 1013. Thus, even if the sensor body 1009 is slightly curved, since the lower surface 1010a of the sensor body 1009 is supported on the side of the rotating shaft 1013, the sensor wafer 1011 or the bottom plate 1010 can be protected against the downward load.

Specifically, it is considered as follows. As shown in the schematic diagrams of FIGS. 36 and 37, in a state where the push switch 1016 is pushed, it is disposed between the lower surface 1010a of the sensor body 1009 at the front end of the sensor body 1009 and the upper surface 1002a of the base 1002. The interval is L, and the length of the sensor body 1009 is d. Here, when the sensor body 1009 is pushed down and bent, the feeling The detector body 1009 can be displaced by only L/2 at its central portion. The formation angle θ 2 of the horizontal line and the upper surface 1011a of the sensor body 1009 is expressed by the following formula (1).

θ 2≒sin(θ 2)≒(L/2)/(d/2)=L/d (1)

Therefore, the bending angle ψ 2 of the upper surface 1011a of the sensor body 1009 is expressed by the following formula (2)

ψ 2=π-2×θ 2=π-2×L/d (2)

On the other hand, the comparative examples shown in Figs. 38 and 39 are reviewed.

In the image input device 1101 of this comparative example, the base 1102 is a flat plate, and the upper surface 1111a and the lower surface 1110a of the sensor body 1109 are parallel in a state where the push switch 1116 is not pressed. Therefore, the sensor body 1109 is pushed downward, and the sensor body 1109 is rotated downward with the rotation shaft 1113 as a fulcrum, and when the push switch 1116 is pushed by the convex portion 1105, the lower surface 1110a of the sensor body 1109 and The upper surface 1102a of the base 1102 forms an acute angle on the front end side of the sensor body 1109. When it is roughly shown, it is shown in FIG. In this case, when the sensor body 1109 is pushed down more and bent, since the sensor body 1109 can be displaced only at its central portion, the horizontal line and the upper surface 1111a of the sensor body 1109 form an angle θ The following formula (3) is indicated.

≒≒sin(θ)≒L/(d/2)=2×L/d (3)

Therefore, the bending angle ψ of the upper surface 1111a of the sensor body 1109 is expressed by the following formula (4).

ψ=π-2×θ=π-4×L/d (4)

Therefore, ψ 2>ψ, because the bending of this embodiment is smaller than the comparative example, Therefore, the probability of damage to the sensor body 1009 is lower than the probability of damage to the sensor body 1109.

Further, the present invention is not limited to the sixth or seventh embodiment, and various modifications of the above-described embodiments are also included in the scope of the present invention. Hereinafter, although a modification is given, the scope of the present invention is not limited to the following modifications. The following modifications are provided in the same manner as the video input device 1001 of the sixth or seventh embodiment except for the changed portions. Further, the following modifications may be combined in the possible range.

[First Modification] The position of the push switch 1016 and the position at which the convex portion 1005 is disposed may be reversed. In the case where the push switch is provided on the upper surface of the base 1002, a wiring different from the wiring sheet 1015 may be provided on the upper surface of the base 1002, and this wiring may be connected to the push switch. The convex portion to which the push switch is pressed may be formed directly on the lower surface 1010a of the bottom plate 1010 or may be formed on the wiring sheet 1015.

[Second Modification] Further, although the convex portion 1005 is formed in the above-described embodiment, the convex portion 1005 may be convex or may be a convex portion having another shape.

[Third Modification] Further, instead of the push switch 1016, a contact switch (a contact sensor for detecting contact) may be provided on the wiring sheet 1015. In this case, an elastic member (an elastic member such as a spring or a rubber) is sandwiched between the lower surface of the bottom plate 1010 and the base 1002. In the original state (the state in which the sensor body 1009 is not pushed), the contact switch and the convex portion 1005 are The elastic member is not in contact. On the other hand, will sense When the body 1009 is pushed down, the elastic member is compressed, and the contact switch is in contact with the convex portion 1005. However, when the depression of the sensor body sensor body 1009 is released, the elastic member is restored, and the contact switch and the convex portion 1005 are separated. Here, although the contact switch becomes conductive when the contact switch contacts the convex portion 1005, and the contact switch becomes non-conductive when the contact switch leaves the convex portion 1005, the contact, the non-conduction and the contact, and the uncontacted relationship of the contact switch can also be contacted. in contrast. In addition, it may not be a contact switch such as a push switch 1016 or a contact switch, but may be a non-contact switch.

[Fourth Modification] Further, in the above embodiment, the sensor wafer 1011 is mounted on the bottom plate 1010, but the sensor wafer 1011 may not be mounted on the bottom plate 1010, and the rotating shaft may be disposed on the left and right sides of the sensor wafer 1011, and Each of the rotating shafts is coupled to the support portion 1003, and the sensor wafer 1011 is rotatable up and down.

[Fifth Modification] When the video input device 1001 is mounted on an electronic device or the like, the base 1002 may be shared with other members such as a casing or a bottom plate of the device.

Further, in each of the above embodiments, the convex portion and the sensor receiving portion are provided on the base, and the switch is provided on the sensor body. However, the present invention is not limited thereto. For example, as shown in FIG. 41, the sensing may be performed. The receiver receiving portions 7 and 8 are disposed on the lower surface of the sensor body 9, and the sensor receiving portions 7 and 8 are received in the opening 15A formed by the wiring sheet 15 disposed under the sensor body 9. The lower ends of the sensor receiving portions 7, 8 are lower than the wiring sheets 15 The face protrudes further downwards. Moreover, as shown in FIG. 42, the convex portion 5 may be disposed on the lower surface of the sensor body 9, and the push switch 16 and the wiring sheet 15 may be disposed on the upper surface of the base 2 by receiving the sensor. The portions 7 and 8 are housed in the opening 15A formed by the wiring sheet 15 disposed on the upper surface of the chassis 2, and the upper ends of the sensor receiving portions 7 and 8 protrude upward from the upper surface of the wiring sheet 15. Moreover, as shown in FIG. 43, the convex portion 5 and the sensor receiving portions 7, 8 may be disposed on the lower surface of the sensor body 9, and the push switch 16 and the wiring sheet 15 may be disposed on the upper surface of the base 2. .

Japanese Patent Application No. 2007-118571, filed on Apr. 27, 2007, and Japanese Patent Application No. 2007-172770, filed on Jun. 29, 2007, and Japanese Patent Application No. 2007-228917, filed on Apr. 4, the entire disclosure of which is incorporated herein by reference.

While various exemplary embodiments have been shown and described, the invention is not limited to those embodiments. Therefore, the scope of the invention is limited only by the scope of the claims below.

50‧‧‧Image input device

200‧‧‧Base

203‧‧‧Support Department

203a‧‧‧Axis hole

205‧‧‧ convex

231‧‧‧Guidance Department

231a‧‧‧ long hole

300‧‧‧Sensor Department

301‧‧‧ sensor body

302‧‧‧Backlight

304‧‧‧ pivot

308‧‧‧ Guided Department

320‧‧‧Sensor crystal

330‧‧‧ drive

340‧‧‧Wiring sheet

350‧‧‧Domed switch

400‧‧‧ Cover

Fig. 1 is a perspective view showing a video input device according to a first embodiment of the present invention.

Figure 2 is an exploded side view of the image input device.

Fig. 3 is a plan view showing a base provided in the image input device.

Fig. 4A is a rear view showing a backlight unit included in the image input device.

Fig. 4B is a view showing a surface of a backlight unit included in the image input device.

Fig. 5A is a rear view showing a wiring sheet included in the image input device.

Fig. 5B is a view showing the surface of a wiring sheet provided in the video input device.

Fig. 6 is a side view of the sensor unit included in the image input device, showing a state before the bending of the wiring piece.

Fig. 7 is a side view of the sensor unit included in the image input device, showing a state in which the wiring piece is bent.

Fig. 8 is a view for explaining the action and action of the image input device.

Fig. 9 is an exploded side view showing the video input device according to the second embodiment of the present invention.

Fig. 10A is a plan view showing a base provided in the video input device of the second embodiment.

Fig. 10B is a side view showing the base provided in the video input device of the second embodiment.

Fig. 11 is a front view showing a wiring sheet included in the video input device of the second embodiment.

Fig. 12A is a view for explaining the operation and operation of the video input device in the second embodiment.

Fig. 12B is a view for explaining the operation and operation of the video input device in the second embodiment.

Fig. 13A is a plan view showing a modification of the base of Figs. 10A and 10B.

Fig. 13B is a side view showing a modification of the base of Figs. 10A and 10B.

Fig. 14 is an exploded side view showing the video input device according to the third embodiment of the present invention.

Fig. 15A is a rear view showing a backlight unit included in the video input device of the third embodiment.

Fig. 15B is a front side view showing a backlight unit included in the video input device of the third embodiment.

Fig. 16 is a rear elevational view showing a wiring sheet included in the video input device of the third embodiment.

Fig. 17 is a side view of the sensor unit included in the video input device of the third embodiment, showing a state before the bending of the wiring piece.

Fig. 18 is a side view of the sensor unit included in the video input device of the third embodiment, showing a state in which the wiring piece is bent.

Figure 19 is a right side view showing a video input device according to a fourth embodiment of the present invention.

Fig. 20 is a rear elevational view showing the video input device of the fourth embodiment.

Fig. 21 is a cross-sectional view mainly showing a switch provided in the video input device of the fourth embodiment.

Figure 22 is a cross-sectional view showing the state in which the switch is pressed.

Figure 23 is a view showing the image input device of the fourth embodiment. The right side view of the state in which the sensor body is pushed down.

Figure 24 is a perspective view showing a video input device according to a fifth embodiment of the present invention.

Fig. 25 is an exploded perspective view showing the video input device of the fifth embodiment in a partially exploded state.

Fig. 26 is an exploded perspective view showing the direction different from that of Fig. 25.

Fig. 27 is an exploded perspective view showing the video input device of the fifth embodiment in a partially exploded state.

Fig. 28A is a side view showing the cover shown in Fig. 26.

Fig. 28B is a side view showing the image input device in a state in which the cover is removed.

Fig. 29 is a plan view showing mainly the wiring sheet included in the video input device of the fifth embodiment.

Figure 30 is a plan view mainly showing the reverse side of the face shown in Figure 29.

Figure 31 is a schematic block diagram of an image input device.

Figure 32 is a right side view showing a video input device according to a sixth embodiment of the present invention.

Figure 33 is a right side view showing the video input device of the sixth embodiment of the present invention.

Figure 34 is a right side view showing a video input device according to a seventh embodiment of the present invention.

Figure 35 is a right side view showing the video input device of the seventh embodiment of the present invention.

Fig. 36 is a schematic side view showing the image input device of the seventh embodiment in a state in which the push switch is pressed.

Fig. 37 is a right side view schematically showing the image input apparatus of the seventh embodiment in a state in which the sensor body is bent.

Figure 38 is a right side view showing the image input device of the comparative example.

Figure 39 is a right side view showing the image input device of the comparative example.

Fig. 40 is a right side view schematically showing the image input apparatus of the comparative example in which the push switch is pressed.

Figure 41 is a right side view showing the image input device of the present invention.

Figure 42 is a right side view showing the image input device of the present invention.

Figure 43 is a right side view showing the image input device of the present invention.

50‧‧‧Image input device

400‧‧‧ Cover

300‧‧‧Sensor Department

301‧‧‧ sensor body

302‧‧‧Backlight

320‧‧‧Sensor crystal

330‧‧‧ drive

340‧‧‧Wiring sheet

304‧‧‧ pivot

308‧‧‧ Guided Department

350‧‧‧Domed switch

200‧‧‧Base

203‧‧‧Support Department

203a‧‧‧Axis hole

205‧‧‧ convex

231‧‧‧Guidance Department

231a‧‧‧ long hole

Claims (22)

An image input device comprising: a base; the sensor body is movable up and down to the base; and the switch is disposed on an upper side of the base and a lower side of the sensor body; The convex portion is disposed on the upper side of the base and the other side of the lower surface of the sensor body, and is opposite to the switch, wherein the base forms a folded-back portion, a part of which is folded back, and the feeling is The sensor body is biased upward by the state in which the lower side of the detector body abuts. An image input device comprising: a base; the sensor body is movable up and down to the base; and the switch is disposed on an upper side of the base and a lower side of the sensor body; The convex portion is disposed on the upper side of the base and the other side of the lower surface of the sensor body, and is opposite to the switch, wherein a curved portion is formed on the base, a part thereof is curved, and the feeling is The sensor body is biased upward by the state in which the lower side of the detector body abuts. An image input device comprising: a base; the sensor body is movable on the base and coupled to the base; The switch is disposed on one side of the upper surface of the base and the lower side of the sensor body; and the convex portion is disposed on the upper side of the base and the other side of the lower surface of the sensor body, and a position opposite to the switch, wherein the wiring piece is further provided with a pattern of wiring connected to the sensor body; the electronic component is mounted on the wiring sheet; and a recess portion accommodating the electronic component is formed on the sensor body The sensor body has a backlight portion that emits light; the electronic component includes a light emitting element; and a concave portion that can receive the light emitting element is formed in the backlight portion. The image input device according to any one of claims 1 to 3, further comprising a wiring sheet provided on one side of the upper surface of the base and the lower surface side of the sensor body, and forming the feeling The pattern of the detector body and the wiring to which the switch is connected. The image input device of any one of claims 1 to 3, wherein the convex portion is disposed at a position corresponding to an outer side of the sensible sensing region of the sensor body. An image input device comprising: a base; the sensor body is movable up and down to the base; and the switch is disposed on an upper side of the base and a lower side of the sensor body; The receiving portion is disposed on the upper side of the base and the sensor body The lower side protrudes toward the opposite surface, and has a support portion that couples the base and the sensor body; the sensor body pivots the support portion as a shaft. The image input device of claim 6, wherein the receiving portion is disposed on a rotation axis of the sensor body, and a contact surface or a switch contacted by the switch when the sensor body rotates . The image input device of claim 6, wherein the receiving portion is disposed at a position corresponding to an outer side of the sensible sensing region of the sensor body. The image input device of claim 7, wherein the receiving portion is plural; and the convex portion is formed on the upper side of the base and the other side of the lower surface of the sensor body, corresponding to The position of the switch; the convex portion is disposed between the plurality of receiving portions toward the rotational axis of the sensor body. An image input device comprising: a base; the sensor body is movable up and down to the base; and the switch is disposed on an upper side of the base and a lower side of the sensor body; The receiving portion is disposed on the upper surface side of the base and the lower surface side of the sensor body, and protrudes toward the opposite surface, and further has a convex portion formed on the upper surface side of the base and the sensor body The other side of the lower side, corresponding to the position of the switch, Further, there is provided a wiring sheet which forms a pattern of wiring connected to the sensor; the wiring sheet is disposed on an upper surface side of the base and the one side of the lower surface side of the sensor body; the convex portion is disposed at and in the The wiring sheet does not form a position where the wiring partially overlaps. An image input device comprising: a base; the sensor body is movable up and down to the base; and the switch is disposed on an upper side of the base and a lower side of the sensor body; The receiving portion is disposed on the upper surface side of the base and the lower surface side of the sensor body, and protrudes toward the opposite surface, wherein the wiring portion is further provided with a wiring sheet forming a pattern of wiring connected to the sensor; The wiring sheet is provided on one side of the upper surface side of the base and the lower surface side of the sensor body; the receiving portion is provided at a position overlapping with a portion where the wiring sheet does not form the wiring. An image input device comprising: a base; the sensor body is movable up and down to the base; and the switch is disposed on an upper side of the base and a lower side of the sensor body; The receiving portion is disposed on the upper surface side of the base and the lower surface side of the sensor body, and protrudes toward the opposite surface, and is provided with a supporting portion that connects the base and the sensor body; the receiving portion Disposed between the support portion and the convex portion. An image input device comprising: a base; the sensor body is movable up and down to the base; and the switch is disposed on an upper side of the base and a lower side of the sensor body; The receiving portion is disposed on the upper surface side of the base and the lower surface side of the sensor body, and protrudes toward the opposite surface, wherein the protruding portion is further provided with a convex portion formed on the upper surface side of the base and the sensor body The other side of the lower side, corresponding to the position of the switch, is disposed at a position corresponding to the outer side of the sensible sensing area of the sensor body. An image input device comprising: a base; the sensor body has a first end surface and a second end surface, and the base is arranged to be rotatable up and down; and the rotating shaft is configured to enable the base and the sensor body to be Rotating up and down, the rotating shaft is located near the second end surface of the first end surface and the second end surface, the surface direction of the lower surface of the sensor body and the surface of the upper surface of the base The portion to which the intersection is located is located near the second end surface of the first end surface and the second end surface, and the intersection angle between the surface direction of the lower surface of the sensor body and the surface direction of the upper surface of the base forms an acute angle. An image input device comprising: a base; and a sensor body, wherein the base is arranged to be rotatable up and down, the base is inclined to face the lower surface of the base, or the sensor body is below the sensor body The upper surface of the sensor body is inclined. An image input device comprising: a base; the sensor body has a first end surface and a second end surface, and is arranged to be rotatable up and down at the base; the rotating shaft is configured to enable the base and the sensor body to be up and down Rotating; and a switch disposed above the base or under the sensor body at a position away from the rotating shaft of the sensor body, the rotating shaft being located near the first end surface and the second end surface At the second end face, when the sensor body is rotated toward the base side, and the switch is turned on or off, the direction of the lower surface of the sensor body and the surface direction of the upper surface of the base are crossed. a portion of the first end surface and the second end surface adjacent to the second end surface, under the sensor body The intersection angle of the face direction of the face and the face direction of the upper face of the base forms an acute angle. The image input device of claim 16, wherein the open shape is a reversible push switch. The image input device of claim 16, further comprising a convex portion formed on a portion of the base or the lower surface of the sensor body opposite to the switch. The image input device of claim 16, wherein in the state in which the switch is restored, the upper surface of the sensor body and the lower surface of the base are parallel. The image input device of claim 16, wherein the thickness of the upper and lower sides of the base gradually increases from the switch to the axis of the sensor body. The image input device of claim 16, wherein the thickness of the sensor body in the upper and lower directions gradually increases from the switch to the axis of the sensor body. An image input device comprising: a base; the sensor body has a first end surface and a second end surface, and is arranged to be rotatable up and down at the base; the rotating shaft is configured to enable the base and the sensor body to be up and down Rotating; and pushing switch is disposed at a position away from the rotating shaft of the sensor body Positioned on the upper surface of the base or under the sensor body, the rotating shaft is located near the second end surface of the first end surface and the second end surface, and the sensor body is rotated toward the base side, and Pushing the state of the push switch, a portion of the sensor body that faces the surface direction of the lower surface and the surface direction of the upper surface of the base is located near the second end surface of the first end surface and the second end surface The angle of intersection between the surface direction of the lower surface of the sensor body and the surface direction of the upper surface of the base forms an acute angle.