TWI452804B - Vibrator structure of electronic device - Google Patents

Vibrator structure of electronic device Download PDF

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Publication number
TWI452804B
TWI452804B TW097131192A TW97131192A TWI452804B TW I452804 B TWI452804 B TW I452804B TW 097131192 A TW097131192 A TW 097131192A TW 97131192 A TW97131192 A TW 97131192A TW I452804 B TWI452804 B TW I452804B
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TW
Taiwan
Prior art keywords
circuit board
vibration motor
electronic device
motor
main circuit
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Application number
TW097131192A
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Chinese (zh)
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TW201008085A (en
Inventor
Tse Shan Peng
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Chi Mei Comm Systems Inc
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Priority to TW097131192A priority Critical patent/TWI452804B/en
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Publication of TWI452804B publication Critical patent/TWI452804B/en

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Description

電子裝置之振動器結構 Vibrator structure of electronic device

本發明係關於一種電子裝置之振動器結構。 The present invention relates to a vibrator structure of an electronic device.

電子裝置內部一般都設有振動馬達,該振動馬達可在來電時產生振動,如此可避免在某些場合不致因來電響鈴而幹擾到別人。習知電子裝置中一般係通過將振動馬達直接或間接地堆疊於主電路板上,且振動馬達之電連接端子與主電路板之電路相電連接。如中國大陸專利第02239514.8號專利,如其圖1所示,其介紹一種常見之振動馬達組裝至移動電話內之方法,其通過將振動馬達堆疊於電路板上,且振動馬達與電路板形成導接;另外,如其圖3所示,該專利本身還介紹一種振動馬達組裝至電路板上之方法,其通過採用一電連接器連接振動馬達與電路板。 The inside of the electronic device is generally provided with a vibration motor, which can generate vibration when an incoming call is made, so as to avoid interference with other people due to ringing of the incoming call in some occasions. Conventional electronic devices generally connect the vibration motor directly or indirectly on the main circuit board, and the electrical connection terminals of the vibration motor are electrically connected to the circuit of the main circuit board. For example, as shown in FIG. 1, a method for assembling a common vibration motor into a mobile phone by stacking a vibration motor on a circuit board and forming a guide between the vibration motor and the circuit board is shown in Chinese Patent No. 02399514.8. In addition, as shown in FIG. 3, the patent itself also introduces a method of assembling a vibration motor to a circuit board by connecting an vibration motor and a circuit board by using an electrical connector.

然由於振動馬達本身之厚度較大,其堆疊於電路板上可使得電子裝置之整體厚度之加大,因此該種振動馬達堆疊於電路板上之組裝方法不利於電子裝置之整體厚度之降低,不利於製造輕薄型電子裝置;另,由於振動馬達堆疊於電路板上,佔用了電路板有限之板面空間,不利於其他電子元件之佈設,使得電路板之空間利用率低。 However, since the thickness of the vibration motor itself is large, stacking on the circuit board can increase the overall thickness of the electronic device. Therefore, the assembly method of the vibration motor stacked on the circuit board is disadvantageous to the overall thickness reduction of the electronic device. It is not conducive to the manufacture of thin and light electronic devices; in addition, since the vibration motor is stacked on the circuit board, it occupies a limited board space of the circuit board, which is disadvantageous for the layout of other electronic components, so that the space utilization rate of the circuit board is low.

鑒於上述內容,有必要提供一種可降低電子裝置整體厚度之電子 裝置之振動器結構。 In view of the above, it is necessary to provide an electron that can reduce the overall thickness of the electronic device. The vibrator structure of the device.

一種電子裝置之振動器結構,包括一殼體、一次電路板及一振動馬達,所述殼體上設置有一主電路板及所述振動馬達,所述振動馬達與電子裝置之主電路板不形成堆疊,所述次電路板設置於該振動馬達之一側且與該振動馬達相電連接。 A vibrator structure of an electronic device includes a casing, a primary circuit board and a vibration motor. The casing is provided with a main circuit board and the vibration motor, and the vibration motor and the main circuit board of the electronic device are not formed. Stacked, the secondary circuit board is disposed on one side of the vibration motor and electrically connected to the vibration motor.

相較習知技術,本發明通過將振動馬達佈設於主電路板之一側,且通過一次電路板與振動馬之一側相連接,如此可降低電子裝置之厚度且大大節省了電路板板面之佈設空間。 Compared with the prior art, the present invention can reduce the thickness of the electronic device and greatly save the surface of the circuit board by arranging the vibration motor on one side of the main circuit board and connecting the one side of the vibration horse through the primary circuit board. The layout space.

100‧‧‧振動結構 100‧‧‧Vibration structure

30‧‧‧振動馬達 30‧‧‧Vibration motor

10‧‧‧下殼體 10‧‧‧ Lower case

32‧‧‧馬達主體 32‧‧‧Motor body

12‧‧‧容置槽 12‧‧‧ accommodating slots

322‧‧‧彈片 322‧‧‧Shrap

14‧‧‧挾持槽 14‧‧‧挟 Holding slot

34‧‧‧偏心輪 34‧‧‧Eccentric wheel

16‧‧‧間隔壁 16‧‧‧ partition wall

40‧‧‧次電路板 40‧‧‧ times board

20‧‧‧主電路板 20‧‧‧ main board

50‧‧‧上殼體 50‧‧‧Upper casing

圖1係本發明較佳實施例電子裝置之振動結構之分解圖;圖2係本發明較佳實施例電子裝置之振動結構之組裝圖。 1 is an exploded view of a vibrating structure of an electronic device according to a preferred embodiment of the present invention; and FIG. 2 is an assembled view of a vibrating structure of the electronic device in accordance with a preferred embodiment of the present invention.

請參閱圖1及圖2,本發明較佳實施例一電子裝置之振動結構100包括一下殼體10、一主電路板20、一振動馬達30、一次電路板40及一上殼體50。 1 and 2, a vibrating structure 100 of an electronic device according to a preferred embodiment of the present invention includes a lower housing 10, a main circuit board 20, a vibration motor 30, a primary circuit board 40, and an upper housing 50.

所述下殼體10上開設有一容置槽12及一夾持槽14。所述容置槽12與該夾持槽14為一間隔壁16所間隔。 A receiving slot 12 and a clamping slot 14 are defined in the lower housing 10 . The accommodating groove 12 is spaced apart from the clamping groove 14 by a partition wall 16 .

所述主電路板20為印刷電路板,其容置於所述容置槽12內。 The main circuit board 20 is a printed circuit board that is received in the receiving slot 12 .

所述振動馬達30可容置於所述夾持槽14,該振動馬達30包括一馬達主體32及通過轉軸與馬達主體32相連之偏心輪34。該馬達主體32之一側形成有二彈片322,用於使振動馬達30與次電路板40電連接。 The vibration motor 30 can be accommodated in the clamping groove 14 . The vibration motor 30 includes a motor body 32 and an eccentric wheel 34 connected to the motor body 32 via a rotating shaft. One side of the motor body 32 is formed with two elastic pieces 322 for electrically connecting the vibration motor 30 to the secondary circuit board 40.

所述次電路板40為一柔性電路板,其可彎折地掛持於所述間隔壁16上,其一端形成有二電連接點(未圖示),該二電連接點用於與所述振動馬達30之二彈片322連接,以使次電路板40與容置在夾持槽14內之振動馬達30電性導通。該次電路板40另一端連接於主電路板20上,以導通所述主電路板20與振動馬達30。 The secondary circuit board 40 is a flexible circuit board that is bendably supported by the partition wall 16 and has two electrical connection points (not shown) formed at one end thereof, and the two electrical connection points are used for The two elastic pieces 322 of the vibration motor 30 are connected to electrically connect the secondary circuit board 40 and the vibration motor 30 housed in the clamping groove 14. The other end of the secondary circuit board 40 is connected to the main circuit board 20 to turn on the main circuit board 20 and the vibration motor 30.

所述上殼體50用於與所述下殼體10配合,以使所述主電路板20、振動馬達30及次電路板40組裝於該上殼體50與下殼體10之間。 The upper casing 50 is configured to cooperate with the lower casing 10 such that the main circuit board 20, the vibration motor 30, and the secondary circuit board 40 are assembled between the upper casing 50 and the lower casing 10.

組裝所述電子裝置之振動結構100時,先將所述主電路板20置於所述容置槽12內,然後將所述次電路板40一端連接至所述主電路板20上,另一端彎折於所述夾持槽14於間隔壁16一側之側壁上,接著將所述振動馬達30置於夾持槽14內,且振動馬達30之彈片322抵持所述次電路板40之二電連接點。 When the vibration structure 100 of the electronic device is assembled, the main circuit board 20 is first placed in the accommodating groove 12, and then one end of the secondary circuit board 40 is connected to the main circuit board 20, and the other end is connected. Bending on the side wall of the clamping groove 14 on the side of the partition wall 16, then placing the vibration motor 30 in the clamping groove 14, and the elastic piece 322 of the vibration motor 30 abuts against the secondary circuit board 40 Two electrical connection points.

最後將所述上殼體50與下殼體10組裝,使所述主電路板20、振動馬達30及次電路板40組裝穩固。 Finally, the upper casing 50 and the lower casing 10 are assembled to securely assemble the main circuit board 20, the vibration motor 30, and the secondary circuit board 40.

如此,所述振動馬達30設置於主電路板20之一側,且通過所述次電路板40與振動馬達30相電性導通,如此可降低電子裝置之厚度且大大節省了主電路板20板面之佈設空間。 In this way, the vibration motor 30 is disposed on one side of the main circuit board 20, and is electrically connected to the vibration motor 30 through the secondary circuit board 40, thereby reducing the thickness of the electronic device and greatly saving the main circuit board 20 board. The layout of the surface.

綜上所述,本創作符合發明專利要件,爰依法提出專利申請。惟,以上所述者僅為本創作之較佳實施例,舉凡熟悉本案技藝之人士,在援依本案創作精神所作之等效修飾或變化,皆應包含於以下之申請專利範圍內。 In summary, the creation meets the requirements of the invention patent, and the patent application is filed according to law. However, the above-mentioned ones are only preferred embodiments of the present invention. Any equivalent modifications or variations made by those who are familiar with the art of the present invention in the spirit of the present invention should be included in the following patent application.

100‧‧‧振動結構 100‧‧‧Vibration structure

30‧‧‧振動馬達 30‧‧‧Vibration motor

10‧‧‧下殼體 10‧‧‧ Lower case

32‧‧‧馬達主體 32‧‧‧Motor body

12‧‧‧容置槽 12‧‧‧ accommodating slots

322‧‧‧彈片 322‧‧‧Shrap

14‧‧‧挾持槽 14‧‧‧挟 Holding slot

34‧‧‧偏心輪 34‧‧‧Eccentric wheel

16‧‧‧間隔壁 16‧‧‧ partition wall

40‧‧‧次電路板 40‧‧‧ times board

20‧‧‧主電路板 20‧‧‧ main board

50‧‧‧上殼體 50‧‧‧Upper casing

Claims (4)

一種電子裝置之振動器結構,包括一殼體、一次電路板及一振動馬達,所述殼體上設置有一主電路板及所述振動馬達,其改良在於:所述殼體上開設一容置槽及一夾持槽,所述主電路板容置所述容置槽內,所述振動馬達容置於夾持槽內,所述容置槽與夾持槽之間形成有一間隔壁,所述次電路板設置於該振動馬達之一側且分別與主電路板及振動馬達相電連接。 A vibrator structure of an electronic device includes a casing, a primary circuit board and a vibration motor, and the main circuit board and the vibration motor are disposed on the casing, and the improvement is that: the housing is provided with an accommodation a slot and a clamping slot, the main circuit board is received in the receiving slot, the vibration motor is received in the clamping slot, and a partition wall is formed between the receiving slot and the clamping slot. The secondary circuit board is disposed on one side of the vibration motor and electrically connected to the main circuit board and the vibration motor, respectively. 如申請專利範圍第1項所述之電子裝置之振動器結構,其中所述次電路板為一柔性電路板。 The vibrator structure of the electronic device of claim 1, wherein the secondary circuit board is a flexible circuit board. 如申請專利範圍第1項所述之電子裝置之振動器結構,其中所述振動馬達具有一馬達主體,該馬達主體一側形成有二彈片,所述次電路板上形成有二電連接點,該次電路板一端彎折於間隔壁上,該二電連接點與馬達之二彈片抵觸。 The vibrator structure of the electronic device of claim 1, wherein the vibration motor has a motor body, two spring pieces are formed on one side of the motor body, and two electrical connection points are formed on the second circuit board. One end of the circuit board is bent on the partition wall, and the two electrical connection points are in contact with the two elastic pieces of the motor. 如申請專利範圍第1項所述之電子裝置之振動器結構,其中所述殼體包括一上殼體及一下殼體,所述主電路板、振動馬達及次電路板設置於該上殼體與下殼體之間。 The vibrator structure of the electronic device of claim 1, wherein the housing comprises an upper housing and a lower housing, wherein the main circuit board, the vibration motor and the secondary circuit board are disposed on the upper housing Between the lower case and the lower case.
TW097131192A 2008-08-15 2008-08-15 Vibrator structure of electronic device TWI452804B (en)

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TWI452804B true TWI452804B (en) 2014-09-11

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124637A (en) * 1998-10-19 2000-04-28 Matsushita Electric Ind Co Ltd Vibrating machine holding device
US6227901B1 (en) * 1998-07-10 2001-05-08 Thomas & Betts International, Inc. Motor boot for a circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6227901B1 (en) * 1998-07-10 2001-05-08 Thomas & Betts International, Inc. Motor boot for a circuit board
JP2000124637A (en) * 1998-10-19 2000-04-28 Matsushita Electric Ind Co Ltd Vibrating machine holding device

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