TWI452316B - Thermal invalidation debug system and temperature control device thereof - Google Patents

Description

Thermal failure debugging system and temperature control device thereof

The present invention relates to a thermal fail-safe system and a temperature control device therefor.

The life of an electronic device is closely related to the temperature at which the electronic component operates. Excessive or too low temperature during operation of electronic components can affect the performance and reliability of electronic equipment. Therefore, almost all electronic devices, especially communication devices, have some high and low temperature tests. The most common failure phenomenon in the industry during low temperature testing is that it cannot be started at low temperatures. It is common practice to test suspected electronic components one by one with refrigerant at room temperature until a fault occurs. However, such a method is not easy to determine at which temperature the electronic component generates heat failure, and the injection of the refrigerant under normal temperature conditions cannot cause the entire electronic device to be tested to be placed in a low temperature condition.

In view of the above, it is necessary to provide a thermal fail-safe system to enable electronic devices to perform thermal failure debugging at low temperatures and to determine at which temperature the electronic components generate heat failure.

It is also necessary to provide a temperature control device.

A thermal failure debugging system for performing thermal failure debugging on an electronic device, the thermal failure debugging system comprising a voltage source, a voltage dividing circuit, an amplifying circuit, and a device for setting in the electronic device Measuring the temperature generator on the electronic component, one a temperature and humidity test cabinet for accommodating the electronic device and the temperature generator, and a temperature tester connected to the temperature generator, the voltage dividing circuit comprising a resistor and a resistor connected in series with the resistor a variable resistor between the ground, the input end of the amplifying circuit is connected to a node between the resistor and the variable resistor, and an output end of the amplifying circuit is grounded through the temperature generator, and the variable resistor is changed by The resistance of the device can change the voltage input to the amplifying circuit to change the amplification signal outputted by the amplifying circuit to the temperature generator, thereby changing the temperature generated by the temperature generator, and displaying the temperature generator through the temperature tester Temperature, the electronic device is activated at different temperatures generated by the temperature generator, and when the electronic device is inoperable, it is determined that the electronic component to be tested has a heat failing function.

A temperature control device includes a voltage source, a voltage dividing circuit, an amplifying circuit and a temperature generator. The voltage dividing circuit includes a resistor and a resistor connected in series between the voltage source and the ground. a variable resistor, an input end of the amplifying circuit is connected to a node between the resistor and the variable resistor, an output end of the amplifying circuit is grounded through the temperature generator, and the temperature generator is used for placing an electronic component The change of the resistance of the variable resistor can change the voltage input to the amplifier circuit to change the amplification signal outputted by the amplifier circuit to the temperature generator, thereby changing the temperature generated by the temperature generator, thereby changing the electron. The temperature of the components.

The heat failing debugging system changes the voltage input to the temperature generator by changing the resistance of the variable resistor to change the voltage input to the temperature generator, thereby changing the temperature generated by the temperature generator, thereby Changing the temperature of the electronic component, starting the electronic device at different temperatures generated by the temperature generator, determining that the electronic component to be tested has a heat failure function when the electronic device is inoperable, thereby performing thermal failure debugging on the electronic device .

1‧‧‧ Thermal failure debugging system

2‧‧‧Host

3‧‧‧Integrated wafer

4‧‧‧Warm and humidity test cabinet

5‧‧‧Power switch

6‧‧‧Monitor

7‧‧‧ Temperature Tester

8‧‧‧ Temperature control device

10‧‧‧voltage source

20‧‧‧Voltage adjustment circuit

30‧‧‧voltage circuit

40‧‧‧Amplification circuit

50‧‧‧ Temperature generator

52‧‧‧Cement resistance

54‧‧‧ Heat sink

56‧‧‧Temperature Sensor

T‧‧‧Transformer

D‧‧‧Rectifier

U1‧‧‧ voltage regulator

U2‧‧‧Operational Amplifier

Q‧‧‧Optocrystal

R1, R3‧‧‧ resistance

C1, C2, C3‧‧‧ capacitors

R2‧‧‧Variable Resistors

1 is a block diagram of a preferred embodiment of the thermal fail-safe system of the present invention.

Figure 2 is a schematic illustration of the temperature generator of Figure 1.

Figure 3 is a circuit diagram of Figure 1.

Figure 4 is a schematic illustration of a preferred embodiment of the thermal fail-safe system of the present invention in use.

Referring to FIG. 1, the thermal fail-safe system 1 of the present invention is used for performing thermal failure debugging on an electronic device such as a host 2 (see FIG. 4) because the heat of the electronic components such as the integrated chip in the integrated circuit fails to work normally. . A preferred embodiment of the thermal fail-safe system 1 includes a temperature control device 8, a temperature tester 7, and a temperature and humidity test cabinet 4. The temperature control device 8 includes a voltage source 10, a voltage adjustment circuit 20, a voltage dividing circuit 30, an amplifying circuit 40, and a temperature generator 50. The temperature generator 50 is disposed in the temperature and humidity test cabinet 4. The voltage source 10, the voltage adjusting circuit 20, the voltage dividing circuit 30, and the amplifying circuit 40 are disposed outside the temperature and humidity test cabinet 4. In the present embodiment, the voltage source 10 is used to output an alternating voltage. The voltage adjustment circuit 20 is connected to the voltage source 10 for adjusting the AC voltage output by the voltage source 10 to a stable DC voltage. The voltage dividing circuit 30 is connected between the voltage adjusting circuit 20 and the amplifying circuit 40, and is used for dividing the DC voltage outputted by the voltage adjusting circuit 20, and outputs the DC voltage to the amplifying circuit 40. The amplifying circuit 40 is connected. The temperature generator 50 is provided to provide an amplification signal to the temperature generator 50. The temperature generator 50 is configured to generate corresponding heat according to the amplified signal provided by the amplifying circuit 40. The thermal failure of the integrated wafer means that the integrated wafer will stop working if its temperature is too high or too low during operation. When the host 2 is operated in a high temperature or low temperature environment, the integrated chip therein The heat failure caused by working at high temperature or low temperature makes the host 2 unable to work normally. The process of finding out which integrated chip or chips in the host 2 generate heat failure and the host 2 is not working properly is heat failing.

Referring to FIG. 2 , the temperature generator 50 includes a cement resistor 52 , a heat sink 54 and a temperature sensor 56 . The cement resistor 52 and the temperature sensor 56 are both disposed on the heat sink 54. The temperature of the cement resistor 52 varies with power, i.e., as the power increases, the temperature increases. The heat sink 54 is used to transfer heat generated by the cement resistor 52. The temperature sensor 56 is used to sense the temperature on the heat sink 54.

Referring to FIG. 3, the voltage adjustment circuit 20 includes a transformer T, a rectifier D, capacitors C1, C2, and C3, and a voltage regulator U1. The voltage dividing circuit 30 includes a resistor R1 and a variable resistor R2. The amplifying circuit 40 includes a resistor R3, an operational amplifier U2, and a transistor Q as an electrical switch. The two inputs of the transformer T are connected to the two outputs of the voltage source 10. The two outputs of the transformer T are connected to the two inputs of the rectifier D. The two output ends of the rectifier D are respectively connected to the input terminal VIN of the voltage regulator U1 and the ground terminal GND. The two capacitors C1 and C2 are connected between the input terminal VIN of the regulator U1 and the ground GND. The ground terminal GND of the regulator U1 is grounded. The capacitor C3 is connected between the output terminal VOUT of the regulator U1 and the ground GND. The output terminal VOUT of the regulator U1 is sequentially grounded through the resistor R1 and the variable resistor R2. The non-inverting input of the operational amplifier U2 (as the input of the amplifying circuit 40) is coupled to the node of the resistor R1 and the variable resistor R2. The inverting input of the operational amplifier U2 is coupled to the emitter of the transistor Q (as the output of the amplifying circuit 40). The output of the operational amplifier U2 is coupled to the base of the transistor Q through the resistor R3. The emitter of the transistor Q is grounded through the cement resistor 52, and the collector of the transistor Q is connected to the output terminal VOUT of the regulator U1.

In the present embodiment, the capacitors C1, C2, and C3 generate a filtering function. The regulator U1 produces a stable voltage. In other embodiments, the transformer T, the capacitors C1, C2, C3, and the regulator U1 may be omitted, as long as the series resistor R1 and the variable resistor R2 are connected between the DC power source and the ground. can. The transistor Q can also be replaced by other components, such as a field effect transistor.

Referring to FIG. 4, if the host 2 can be normally turned on at room temperature, but it is not normally turned on after being placed in a low temperature environment, such as minus 30 degrees, the host 2 needs to be thermally disabled. The components that normally cause heat failure are primarily integrated wafers 3 on the host. This embodiment can find out which integrated wafer 3 has incurred thermal failure.

The process of performing thermal failure debugging on the host 2 is as follows: the heat sink 54 of the temperature generator 50 is attached to the integrated wafer 3 to be tested of the host 2 through a thermal grease. The host 2 is placed in the temperature and humidity test cabinet 4, and the power switch 5 of the host 2 is led out to the temperature and humidity test cabinet 4, and the host 2 is also connected to a monitor disposed outside the temperature and humidity test cabinet 4. 6. The temperature sensor 56 on the heat sink 54 is coupled to the temperature tester 7 to display the temperature of the heat sink 54, that is, the temperature of the integrated wafer 3 to be tested. Adjusting the temperature of the temperature and humidity test cabinet 4 causes the host 2 to be at a low temperature, such as a temperature of minus 30 degrees that prevents it from being normally turned on. Starting the power switch 5 of the host 2, the monitor 6 indicates that the host 2 cannot be turned on, adjusting the variable resistor R2 to increase its resistance value, the voltage of the non-inverting input terminal of the operational amplifier U2 is increased, and the output of the operational amplifier U2 is increased. As the voltage at the terminal increases, the base current of the transistor Q increases, and the emitter current of the transistor Q also increases, so that the voltage on the cement resistor 52 increases and its power also increases. The temperature of the cement resistor 52 rises. Waiting for the heat of the cement resistor 52 to accumulate for a period of time, such as 2 minutes, observe whether the temperature displayed by the temperature tester 7 is increased by a temperature difference such as 5 degrees, and if the temperature difference is not raised, continue to adjust the variable resistor R2 until Make the temperature The degree tester 7 shows that the temperature of the cement resistor 52 rises by the temperature difference, that is, the temperature displayed by the temperature tester 7 is minus 25 degrees. The power switch 5 of the host 2 is started again, and it is observed whether the monitor 6 displays that the host 2 is powered on. If the monitor 6 displays that the host 2 is powered on, it indicates that the integrated chip 3 has a heat failure characteristic, which results in the host 2 The reason why it cannot be turned on in a low temperature environment. If the monitor 6 indicates that the host 2 cannot be turned on, it is necessary to continue to adjust the resistance of the variable resistor R2 so that the temperature displayed by the temperature tester 7 continues to rise with the temperature difference until it rises to room temperature, while Each time the variable resistor R2 is adjusted such that the temperature of the cement resistor 52 is increased by the temperature difference from the previous temperature, the host 2 is activated. If the startup phenomenon occurs during the temperature rise, the integrated chip to be tested is indicated. 3 has the characteristics of heat failure. If the host 2 still fails to boot after the host 2 is started up, it indicates that the integrated chip 3 to be tested does not have a thermal failure characteristic, and the integrated chip 3 to be tested is not an element that causes the host 2 to fail to be turned on at a low temperature. Then, in the same way, the other integrated chips are sequentially determined to determine whether there is a heat failure characteristic, thereby performing thermal failure debugging on the host 2.

Similarly, the integrated wafer for high temperature failure will also cause the host 2 to be inoperable in a high temperature environment. The process of performing thermal failure debugging on the host 2 is to adjust the variable resistor R2 to increase the temperature of the cement resistor 52 by the temperature difference when the host 2 is in the on state, and the cement resistor 52 is at When the temperature between the room temperature and a preset temperature, for example, 50 degrees, that is, the temperature of the integrated wafer 3 to be tested is equal to the temperature of the cement resistor 52, the host 2 is automatically turned off, indicating that the integrated wafer 3 to be tested has heat. The failure characteristics are responsible for the failure of the host to operate under high temperature conditions. If the host 2 does not automatically shut down at any temperature between the room temperature and the preset temperature, it indicates that the integrated chip 3 to be tested does not have the characteristics of heat failure, and does not cause the host to fail to operate under high temperature conditions. the reason.

The heat failing debugging system 1 changes the voltage on the cement resistor 52 by changing the resistance of the variable resistor R2, changes the power of the cement resistor 52, thereby changing the heat generated by the cement resistor 52, thereby changing the waiting time. The temperature of the integrated wafer 3 was measured. The thermal failure of the host 2 is determined by observing the inoperable condition of the host 2 by observing the change of the temperature of the integrated chip 3 to be tested to determine whether the integrated chip 3 to be tested has a thermal failure characteristic.

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the following claims.

2‧‧‧Host

3‧‧‧Integrated wafer

4‧‧‧Warm and humidity test cabinet

5‧‧‧Power switch

6‧‧‧Monitor

7‧‧‧ Temperature Tester

10‧‧‧voltage source

20‧‧‧Voltage adjustment circuit

30‧‧‧voltage circuit

40‧‧‧Amplification circuit

52‧‧‧Cement resistance

54‧‧‧ Heat sink

56‧‧‧Temperature Sensor

Claims (8)

A thermal failure debugging system for performing thermal failure debugging on an electronic device, the thermal failure debugging system comprising a voltage source, a voltage dividing circuit, an amplifying circuit, and a device for setting in the electronic device a temperature generator on the electronic component, a temperature and humidity test cabinet for accommodating the electronic device and the temperature generator, and a temperature tester connected to the temperature generator, the voltage dividing circuit including a resistor and a variable resistor connected in series between the voltage source and the ground, the input end of the amplifying circuit is connected to a node between the resistor and the variable resistor, and an output end of the amplifying circuit transmits the The temperature generator is grounded, and the voltage input to the amplifying circuit can be changed by changing the resistance of the variable resistor to change the amplification signal outputted by the amplifying circuit to the temperature generator, thereby changing the temperature generated by the temperature generator. The temperature tester displays the temperature generated by the temperature generator, activates the electronic device at different temperatures generated by the temperature generator, and determines when the electronic device is inoperable The measuring electronic component has a heat failing function, and the temperature generator comprises a heat sink, a cement resistor disposed on the heat sink, and a temperature sensor disposed on the heat sink for sensing the temperature of the heat sink, the temperature The tester is connected to the temperature sensor for displaying the temperature sensed by the temperature sensor, and the output end of the amplifying circuit is grounded through the cement resistor. The thermal fail-safe system of claim 1, wherein the amplifying circuit comprises an operational amplifier and an electrical switch, the operational amplifier comprising a non-inverting input terminal, an inverting input terminal, and an input terminal of the amplifying circuit; An output end, the electric switch includes a first end, a second end and a third end as the output end of the amplifying circuit, and the non-inverting input terminal of the operational amplifier is connected to the node of the resistor and the variable resistor An inverting input terminal of the operational amplifier is connected to the second end of the electrical switch, an output end of the operational amplifier is connected to the first end of the electrical switch, and a second end of the electrical switch is grounded through the temperature generator, the electric The third end of the switch is connected To the voltage source. The thermal fail-safe system of claim 1, wherein the heat sink is attached to the electronic component through a thermal grease. The thermal fail-safe system of claim 1, wherein the electronic device is a host, and the electronic component is an integrated chip in the host. A temperature control device includes a voltage source, a voltage dividing circuit, an amplifying circuit and a temperature generator. The voltage dividing circuit includes a resistor and a resistor connected in series between the voltage source and the ground. a variable resistor, an input end of the amplifying circuit is connected to a node between the resistor and the variable resistor, an output end of the amplifying circuit is grounded through the temperature generator, and the temperature generator is used for placing an electronic component The change of the resistance of the variable resistor can change the voltage input to the amplifier circuit to change the amplification signal outputted by the amplifier circuit to the temperature generator, thereby changing the temperature generated by the temperature generator, thereby changing the electron. The temperature of the component includes an operational amplifier and an electrical switch, the operational amplifier including a non-inverting input, an inverting input, and an output as an input of the amplifying circuit, the electrical switch including a first end a second end and a third end of the output of the amplifying circuit, the non-inverting input of the operational amplifier is connected to the resistor and the variable resistor The inverting input of the operational amplifier is connected to the second end of the electrical switch, the output end of the operational amplifier is connected to the first end of the electrical switch, and the second end of the electrical switch is grounded through the temperature generator The third end of the electrical switch is connected to the voltage source. The temperature control device of claim 5, wherein the temperature generator comprises a cement resistor and a temperature sensor for sensing the temperature of the electronic component, the cement resistor and the temperature sensor are used for setting On the electronic component, the output of the amplifying circuit is grounded through the cement resistor. The temperature control device of claim 5, wherein the temperature generator comprises a heat sink, a cement resistor disposed on the heat sink, and a temperature for sensing the temperature of the heat sink. a sensor, the cement resistor and the temperature sensor are disposed on the heat sink, the heat sink is configured to be disposed on the component, and an output end of the amplifying circuit is grounded through the cement resistor, and the variable is changed by The resistance of the resistor changes the voltage input to the amplifying circuit to change the amplification signal outputted by the amplifying circuit to the cement resistor, thereby changing the temperature generated by the cement resistor, thereby changing the temperature of the electronic component. The temperature control device of claim 7, wherein the heat sink is attached to the electronic component through a thermal grease.