TWI449820B - Crystal growth system with close thermal cycling structure - Google Patents

Crystal growth system with close thermal cycling structure Download PDF

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TWI449820B
TWI449820B TW101139927A TW101139927A TWI449820B TW I449820 B TWI449820 B TW I449820B TW 101139927 A TW101139927 A TW 101139927A TW 101139927 A TW101139927 A TW 101139927A TW I449820 B TWI449820 B TW I449820B
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heat
crystal growth
growth furnace
sidewall
furnace
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TW201416503A (en
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Chia Ho Hsieh
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Eversol Corp
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具有閉鎖熱循環結構之長晶爐Crystal growth furnace with locked thermal cycle structure

一種長晶爐,尤其是指一種具有閉鎖熱循環結構之長晶爐。A crystal growth furnace, especially a crystal growth furnace having a closed thermal cycle structure.

隨著能源短缺問題的日益嚴重,對替代能源的研究也日趨熱絡。太陽光因無汙染及取之不盡的特性,為重要替代能源之一。太陽能電池是一種能吸收太陽光並將光能轉變為電能的裝置。太陽能電池基本由多層膜組成。多層膜原料來自於半導體晶體。晶體品質是影響太陽能電池光電轉換效率的重要因素。As the problem of energy shortages has become more serious, research on alternative energy sources has become increasingly hot. Sunlight is one of the important alternative energy sources because of its pollution-free and inexhaustible properties. A solar cell is a device that absorbs sunlight and converts it into electrical energy. A solar cell consists essentially of a multilayer film. The multilayer film material is derived from a semiconductor crystal. Crystal quality is an important factor affecting the photoelectric conversion efficiency of solar cells.

成長晶體的方法有很多種。但是能成長大體積晶體且兼顧成本效益的長晶方法則為數不多。太陽能產業中,常利用方向性凝固法(Directional Solidification Method)來成長矽的初始材料晶體,例如矽錠。方向性凝固法基本原理為將矽原料放置在多晶鑄錠爐內的爐體中,通過改變溫度場使矽原料從下向上定向結晶形成多晶矽。在此過程中,矽原料放置於爐體底部,經過加熱而形成熔解物。當熱被移除時,熔解物底層開始固化,而形成初始之矽固化層。隨著溫度的逐漸移除,矽固化層逐漸向上累積而至所有熔解物形成一完整之固化體。上述之固化過程中,熱移除方向與晶體成長方向恰好相反。亦即,熱由爐體底部移除,而熔解物往爐體頂部成長。因此,溫度梯度為方向性凝固法中一重要參數,對溫度梯度的掌控影響長晶品質甚 鉅。There are many ways to grow crystals. However, there are only a few long-crystal methods that can grow large-volume crystals and are cost-effective. In the solar industry, the Directional Solidification Method is often used to grow the initial material crystals of the crucible, such as antimony ingots. The basic principle of the directional solidification method is to place the niobium raw material in the furnace body in the polycrystalline ingot furnace, and to change the temperature field to make the niobium raw material crystallize from bottom to top to form polycrystalline crucible. During this process, the crucible material is placed at the bottom of the furnace and heated to form a melt. When heat is removed, the bottom layer of the melt begins to solidify, forming an initial solidified layer. As the temperature is gradually removed, the ruthenium solidified layer gradually builds up until all of the melt forms a complete solidified body. In the above curing process, the heat removal direction is opposite to the crystal growth direction. That is, heat is removed from the bottom of the furnace body, and the molten material grows toward the top of the furnace body. Therefore, the temperature gradient is an important parameter in the directional solidification method, and the control of the temperature gradient affects the quality of the crystal growth. huge.

傳統DSS(DIRECTIONAL SOLIDFIATION SYSTEM)長晶系統,通常包含爐體、承載基座及加熱器。爐體具有底部及至少一側壁,側壁圍繞底部形成一容置空間供置放長晶原料之用。底部下設有一承載基座。加熱器通常設置於側壁外側,目的在提供溫度於放置於爐體底部之長晶原料,使原料產生融熔狀態。承載基座及爐體周側設置有隔熱層。隔熱層的豎直邊能上下移動以便露出承載基座的邊緣,使熱量輻射到爐體下腔室的水冷四壁上。水冷卻承載基座後再返回來冷卻爐體底部,從而使爐體內的熔解物周圍形成了一個垂直溫度梯度。此垂直溫度梯度使爐體內的矽料從底部開始凝固,從熔解物底部向頂部開始長晶。The traditional DSS (DIRECTIONAL SOLIDFIATION SYSTEM) crystal growth system usually includes a furnace body, a bearing base and a heater. The furnace body has a bottom portion and at least one side wall, and the side wall forms an accommodating space around the bottom portion for placing the crystal growth material. A carrier base is provided under the bottom. The heater is usually disposed outside the side wall for the purpose of providing a temperature to the crystal growth material placed at the bottom of the furnace body to cause the raw material to melt. A heat insulating layer is disposed on the bearing base and the circumferential side of the furnace body. The vertical edges of the insulation layer can be moved up and down to expose the edges of the carrier base, allowing heat to be radiated to the water-cooled walls of the lower chamber of the furnace body. The water cools the load-bearing susceptor and returns to cool the bottom of the furnace body, thereby creating a vertical temperature gradient around the melt in the furnace. This vertical temperature gradient causes the crucible in the furnace to solidify from the bottom, starting from the bottom of the melt to the top.

上述長晶系統中,由於溫度變化極為複雜,故尚未能對所需之溫度梯度進行有效之控制,因此需要一種能對溫度梯度具有良好控制性之長晶設備。In the above-mentioned crystal growth system, since the temperature change is extremely complicated, the required temperature gradient has not been effectively controlled, and therefore a crystal growth apparatus capable of controlling the temperature gradient is required.

本發明揭示一種具有閉鎖熱循環結構之長晶爐。藉由在爐體側壁及絕緣層間設置一熱導引件,使熱流閉鎖於絕緣層與爐體間所形成之空間內,並且形成長晶所需之垂直溫度梯度。藉此,使對於長晶時溫度梯度之控制性更佳。並且,熱導引件一側可具有不同結構組合,使溫度梯度之變化更為精密,更能因應實際長晶時複雜之溫度變化。The invention discloses a crystal growth furnace having a closed thermal cycle structure. By providing a heat guiding member between the sidewall of the furnace body and the insulating layer, the heat flow is locked in the space formed between the insulating layer and the furnace body, and the vertical temperature gradient required for the crystal growth is formed. Thereby, the controllability of the temperature gradient for the growth of the crystals is better. Moreover, the heat guide member side can have different structural combinations, so that the temperature gradient changes more precisely, and it can respond to the complicated temperature change in actual crystal growth.

本發明之一態樣在提供一種具有閉鎖熱循環結構之長晶爐,包含一爐體、一承載基座、至少一絕緣層及至少一 熱導引件。爐體包含一底部及圍繞底部之至少一側壁。承載基座設置於底部下。至少一絕緣層設於側壁外並與側壁間隔一距離。至少一熱導引件設於絕緣層與側壁間,並相對圍繞底部。An aspect of the present invention provides a crystal growth furnace having a closed thermal cycle structure, comprising a furnace body, a bearing base, at least one insulating layer, and at least one Thermal guide. The furnace body includes a bottom and at least one side wall surrounding the bottom. The carrier base is placed under the bottom. At least one insulating layer is disposed outside the sidewall and spaced apart from the sidewall. At least one heat guide is disposed between the insulating layer and the sidewall and relatively surrounds the bottom.

依據本發明一實施例,承載基座及熱導引件材質可為石墨。熱導引件可具有階梯狀結構,或可於結構中包含至少一平面、至少一斜面或至少一弧面。According to an embodiment of the invention, the material of the carrier base and the heat guiding member may be graphite. The heat guide may have a stepped structure or may include at least one plane, at least one slope, or at least one arc surface in the structure.

依據本發明一實施例,熱導引件側邊與側壁間距離由熱導引件側邊底部往熱導引件側邊頂部遞增。According to an embodiment of the invention, the distance between the side of the heat guide and the side wall is increased from the bottom of the side of the heat guide to the top of the side of the heat guide.

本發明之另一態樣在提供一種具有閉鎖熱循環結構之長晶爐,包含一爐體、一承載基座、至少一熱交換件、至少一絕緣層及至少一熱導引件。爐體包含一底部及圍繞底部之至少一側壁。承載基座設置於底部下,其包含至少一凹部,凹部形成於承載基座周側,並相對位於底部周緣下方。至少一熱交換件接合於凹部。絕緣層設於側壁外並與側壁間隔一距離。至少一熱導引件設於絕緣層與側壁間,並相對圍繞底部。其中,熱導引件側邊與側壁間距離由熱導引件側邊底部往熱導引件側邊頂部遞增。Another aspect of the present invention provides a crystal growth furnace having a locked thermal cycle structure including a furnace body, a carrier base, at least one heat exchange member, at least one insulation layer, and at least one heat guide. The furnace body includes a bottom and at least one side wall surrounding the bottom. The carrier base is disposed under the bottom portion and includes at least one recess formed on a circumferential side of the carrier base and located opposite the bottom periphery of the bottom. At least one heat exchange member is joined to the recess. The insulating layer is disposed outside the sidewall and spaced apart from the sidewall. At least one heat guide is disposed between the insulating layer and the sidewall and relatively surrounds the bottom. Wherein, the distance between the side of the heat guide and the side wall is increased from the bottom of the side of the heat guide to the top of the side of the heat guide.

依據本發明一實施例,熱導引件可具有階梯狀結構,或可於結構中包含至少一平面、至少一斜面或至少一弧面。According to an embodiment of the invention, the heat guiding member may have a stepped structure or may include at least one plane, at least one slope or at least one curved surface in the structure.

依據本發明一實施例,熱交換件互相銜接圍繞該承載基座。此外,更可包含一隔熱件,設於底部及承載基座間。According to an embodiment of the invention, the heat exchange members are coupled to each other around the carrier base. In addition, a heat insulating member may be included, which is disposed between the bottom and the carrying base.

本段落先介紹”閉鎖熱循環結構”之定義,藉此使本發 明之技術特徵能更為清楚明瞭。本發明之長晶爐熱流應用,是透過爐體側邊加熱器來供給長晶溫度,而於爐體上方有氬氣灌入爐體,經由氬氣的流動帶動爐體之輻射熱流均勻佈滿整個爐體內,最後透過設置於爐體底部的真空幫浦的抽氣將氬氣抽走,重覆此過程即所稱之”熱場循環”。而所稱之閉鎖場,係藉由額外增設之熱導引件,此熱導引件透過將由上方供給的氬氣封閉至爐體側邊,因此熱流會被閉鎖在此區間循環,達到將爐體由上而下溫度遞減的效果。以下實施例,皆為基於上述基本原理所實施之結構改良。This paragraph first introduces the definition of "locking thermal cycle structure", thereby making this issue The technical characteristics of Ming can be more clear. The heat transfer application of the crystal growth furnace of the present invention is to supply the crystal growth temperature through the side heater of the furnace body, and argon gas is poured into the furnace body above the furnace body, and the radiant heat flow of the furnace body is evenly distributed through the flow of argon gas. Throughout the furnace, the argon gas is finally withdrawn through the pumping of the vacuum pump placed at the bottom of the furnace body, and the process is repeated as the so-called "thermal field cycle". The so-called lockout field is an additional heat guide that is closed to the side of the furnace by argon gas supplied from above, so that the heat flow is blocked in this interval to achieve the furnace. The effect of the body decreasing from top to bottom. The following embodiments are structural improvements implemented based on the above basic principles.

請參照第1圖,第1圖繪示本發明之具有閉鎖熱循環結構之長晶爐之一實施例結構側視圖。具有閉鎖熱循環結構之長晶爐包含爐體100、承載基座200、絕緣層300及熱導引件400。爐體100包含一底部102及圍繞底部之至少一側壁101。底部102及側壁101形成一容置空間以供置放長晶原料。絕緣層300設置於側壁101外圍並與側壁101間隔一距離。絕緣層300下端具有一延伸部301,其往爐體100方向延伸。熱導引件400設置於延伸部301上,並相對位於底部102外圍。側面視之,熱導引件400面向爐體100之一側形成側邊底部401、側邊中間部402及側邊頂部403不等長結構。換言之,熱導引件400與爐體100之側壁101之距離由其側邊底部401往側邊頂部403逐次遞增。第1圖中,熱導引件400側邊底部401與側壁101之垂直距離為d1,熱導引件400側邊中間部402與側壁101之垂直距離為d2,熱導引件400側邊頂部403與側壁101 之垂直距離為d3,其滿足d3>d2>d1的關係。藉此,使於長晶過程中,熱流可隨d1、d2及d3之變化,由爐體底部102由下往上逐漸形成一逐次變化之溫度梯度,有助於長晶晶體之垂直固化,進而使長晶品質更穩定。第1圖中,箭頭a為熱場循環方向,而藉由熱導引件400之閉鎖作用,使循環熱場閉鎖於爐體周側。以下實施例中,箭頭b及箭頭c亦同,特不再贅述。Referring to FIG. 1, FIG. 1 is a side view showing the structure of an embodiment of a crystal growth furnace having a closed thermal cycle structure according to the present invention. The crystal growth furnace having a locked thermal cycle structure includes a furnace body 100, a carrier base 200, an insulating layer 300, and a heat guide 400. The furnace body 100 includes a bottom portion 102 and at least one side wall 101 surrounding the bottom portion. The bottom portion 102 and the side wall 101 form an accommodating space for placing the crystal growth material. The insulating layer 300 is disposed on the periphery of the sidewall 101 and spaced apart from the sidewall 101 by a distance. The lower end of the insulating layer 300 has an extending portion 301 extending toward the furnace body 100. The heat guide 400 is disposed on the extension 301 and is located at the periphery of the bottom portion 102. Viewed from the side, the heat guide 400 faces the side of the furnace body 100 to form a side bottom 401, a side intermediate portion 402, and a side top portion 403 of unequal length. In other words, the distance between the heat guide 400 and the side wall 101 of the furnace body 100 is gradually increased from its side bottom 401 to the side top 403. In the first figure, the vertical distance between the bottom bottom portion 401 of the heat guiding member 400 and the side wall 101 is d1, the vertical distance between the side intermediate portion 402 of the heat guiding member 400 and the side wall 101 is d2, and the top side of the heat guiding member 400 is d1. 403 and side wall 101 The vertical distance is d3, which satisfies the relationship of d3>d2>d1. Thereby, in the process of crystal growth, the heat flow can change with d1, d2 and d3, and a successively changing temperature gradient is formed from the bottom of the furnace body 102 from bottom to top, which contributes to the vertical solidification of the crystal growth crystal, and further Make the crystal quality more stable. In Fig. 1, the arrow a is the direction of the thermal field circulation, and the circulating heat field is blocked on the circumferential side of the furnace body by the blocking action of the heat guiding member 400. In the following embodiments, the arrows b and c are the same, and will not be described again.

請參照第2圖,第2圖繪示依據第1圖之具有閉鎖熱循環結構之長晶爐之另一實施例結構側視圖。承載基座200之周側具有一凹部201。至少一外加之熱交換件500接合於凹部201並銜接圍繞承載基座200。熱交換件500接觸底部周緣。藉此,可平衡底部周緣區域及中央區域之溫度,使溫度均勻性增加。再者,可搭配熱導引件400的設置使長晶爐100具有較好的溫度控制性。第2圖中,箭頭b為熱場循環方向。Referring to FIG. 2, FIG. 2 is a side view showing another embodiment of the crystal growth furnace having the closed thermal cycle structure according to FIG. 1. The peripheral side of the carrier base 200 has a recess 201. At least one additional heat exchange member 500 is joined to the recess 201 and engages around the carrier base 200. The heat exchange member 500 contacts the bottom periphery. Thereby, the temperature of the bottom peripheral region and the central region can be balanced to increase the temperature uniformity. Moreover, the arrangement of the heat guide 400 can be combined to make the crystal growth furnace 100 have better temperature controllability. In Fig. 2, the arrow b is the direction of the thermal field circulation.

請參照第3圖,第3圖繪示依據第2圖之具有閉鎖熱循環結構之長晶爐之另一實施例結構側視圖。底部102與承載基座200間設置有一隔熱件600。藉由隔熱件600可避免外界之熱擾動影響底部102,進而確保長晶品質。第3圖中,箭頭c為熱場循環方向。Please refer to FIG. 3, which shows a side view of another embodiment of the crystal growth furnace having the closed thermal cycle structure according to FIG. A heat insulation member 600 is disposed between the bottom portion 102 and the carrier base 200. By the heat insulating member 600, the external thermal disturbance can be prevented from affecting the bottom portion 102, thereby ensuring the crystal growth quality. In Fig. 3, the arrow c is the direction of the thermal field circulation.

請參照第4圖,第4圖繪示熱導引件組合上視圖。熱導引件400銜接圍繞於底部102外圍(請同時參照第1圖)。藉此使溫度之控制性更佳。Please refer to FIG. 4, which shows a top view of the combination of the heat guides. The heat guide 400 is coupled around the periphery of the bottom portion 102 (please refer to FIG. 1 at the same time). Thereby the controllability of the temperature is better.

請參照第5圖,第5圖繪示依據第1圖之熱導引件結構立體圖。熱引導件400一側具有階梯狀結構,其側邊底 部401、側邊中間部402及側邊頂部403皆不等長,藉此形成與爐體100(請參照第1圖)不等距之結構,而能形成溫度梯度之變化,有助於提昇長晶品質。Referring to FIG. 5, FIG. 5 is a perspective view showing the structure of the heat guide according to FIG. 1. The heat guide 400 has a stepped structure on one side and a side bottom thereof The portion 401, the side intermediate portion 402 and the side top portion 403 are not unequal in length, thereby forming a structure that is not equidistant from the furnace body 100 (please refer to FIG. 1), and can form a temperature gradient change, which contributes to the improvement. Crystal quality.

請參照第6圖,第6圖繪示熱導引件之一實施例結構立體圖。熱導引件400之一側未必一定要是階梯型變化,亦可以是一具有連續變化之結構。第6圖中,熱導引件400之一側具有一連續變化之斜面404。藉由斜面404之連續變化,使溫度梯度之變化更為精密,進而使溫度控制性更佳。Please refer to FIG. 6. FIG. 6 is a perspective view showing the structure of one embodiment of the heat guiding member. One side of the heat guiding member 400 does not necessarily have to be a step type change, and may be a structure having a continuous change. In Fig. 6, one side of the heat guide 400 has a continuously varying ramp 404. By the continuous variation of the slope 404, the temperature gradient is more precisely changed, thereby making the temperature control better.

請參照第7圖,第7圖繪示依據第6圖中斜面之另一實施例示意圖。熱導引件400之斜面404可形成不同傾斜角度,因應對溫度梯度不同的控制需求。Please refer to FIG. 7. FIG. 7 is a schematic view showing another embodiment of the inclined surface according to FIG. 6. The bevel 404 of the heat guide 400 can be formed at different tilt angles due to different control requirements for temperature gradients.

請參照第8圖,第8圖繪示熱導引件之一實施例結構立體圖。熱導引件400之一側具有一連續變化之弧面405。弧面405之曲率可造成不同之溫度梯度變化,藉此能因應不同之實際狀況之需求。Please refer to FIG. 8. FIG. 8 is a perspective view showing the structure of one embodiment of the heat guiding member. One side of the heat guide 400 has a continuously varying curved surface 405. The curvature of the curved surface 405 can cause different temperature gradient changes, thereby being able to respond to different actual conditions.

請參照第9圖,第9圖繪示熱導引件之一實施例結構立體圖。第9圖中,熱導引件400之側邊頂部403具有一垂直平面406結構,而側邊中間部402及側邊底部401分別包含具有不同傾斜角度之斜面404a及404b。藉此不同型態之結構組合,可產生多種變化之溫度梯度,對溫度控制性更佳。Please refer to FIG. 9. FIG. 9 is a perspective view showing the structure of one embodiment of the heat guiding member. In Fig. 9, the side top 403 of the heat guide 400 has a vertical plane 406 structure, and the side intermediate portion 402 and the side bottom portion 401 respectively include slopes 404a and 404b having different inclination angles. By combining the different types of structures, a variety of varying temperature gradients can be produced, which is more controllable for temperature.

請參照第10圖,第10圖繪示熱導引件之一實施例結構立體圖。第10圖中,熱導引件400一側包含三個具有不同曲率之弧面405a、405b及405c。藉此不同之曲度組合, 可產生多種變化之溫度梯度,對溫度控制性更佳。Referring to FIG. 10, FIG. 10 is a perspective view showing the structure of an embodiment of the heat guiding member. In Fig. 10, one side of the heat guide 400 includes three curved faces 405a, 405b and 405c having different curvatures. With this different combination of curvatures, A variety of varying temperature gradients can be produced with better temperature control.

請參照第11圖,第11圖繪示熱導引件之一實施例結構立體圖。第11圖中,熱導引件400一側包含斜面404c、斜面404d及弧面405d之組合。斜面404c及斜面404d具有不同傾斜角度。藉此不同型態之結構組合,可產生多種變化之溫度梯度,對溫度控制性更佳。Referring to FIG. 11, FIG. 11 is a perspective view showing the structure of one embodiment of the heat guiding member. In Fig. 11, the heat guide 400 side includes a combination of a slope 404c, a slope 404d, and a curved surface 405d. The slope 404c and the slope 404d have different inclination angles. By combining the different types of structures, a variety of varying temperature gradients can be produced, which is more controllable for temperature.

綜合以上,本發明之具有閉鎖熱循環結構之長晶爐。藉由設置一熱導引件於側壁及絕緣層之間,使對於長晶時溫度梯度之控制性更佳。熱導引件一側更可具有不同結構組合,使溫度梯度之可具有多種變化,並可藉由熱導引件一側結構之連續變化,使溫度梯度之變化更為精密,進而使對長晶控制性更好,長晶品質更佳。In summary, the crystal growth furnace of the present invention having a closed thermal cycle structure. By providing a heat guiding member between the sidewall and the insulating layer, the controllability of the temperature gradient for the growth of the crystal is better. The heat guide member side can have different structural combinations, so that the temperature gradient can have various changes, and the temperature gradient can be more precisely changed by the continuous change of the structure of the heat guide member side, thereby making the pair longer. The crystal is more controllable and the crystal quality is better.

100‧‧‧爐體100‧‧‧ furnace body

101‧‧‧側壁101‧‧‧ side wall

102‧‧‧底部102‧‧‧ bottom

200‧‧‧承載基座200‧‧‧bearing base

201‧‧‧凹部201‧‧‧ recess

300‧‧‧絕緣層300‧‧‧Insulation

301‧‧‧延伸部301‧‧‧Extension

400‧‧‧熱導引件400‧‧‧Hot guides

401‧‧‧側邊底部401‧‧‧Bottom of the bottom

402‧‧‧側邊中間部402‧‧‧ middle side of the side

403‧‧‧側邊頂部403‧‧‧Side top

404‧‧‧斜面404‧‧‧Bevel

404a‧‧‧斜面404a‧‧‧Bevel

404b‧‧‧斜面404b‧‧‧Bevel

404c‧‧‧斜面404c‧‧‧ Bevel

404d‧‧‧斜面404d‧‧‧Bevel

405‧‧‧弧面405‧‧‧ curved surface

405a‧‧‧弧面405a‧‧‧Arc face

405b‧‧‧弧面405b‧‧‧ curved surface

405c‧‧‧弧面405c‧‧‧ curved surface

405d‧‧‧弧面405d‧‧‧ curved surface

406‧‧‧垂直平面406‧‧‧Vertical plane

500‧‧‧熱交換件500‧‧‧Hot exchange parts

600‧‧‧隔熱件600‧‧‧Insulation

d1‧‧‧熱導引件側邊底部與側壁之垂直距離D1‧‧‧The vertical distance between the bottom and the side wall of the hot guide

a、b、c‧‧‧熱場循環方向a, b, c‧‧ ‧ thermal field circulation direction

d2‧‧‧熱導引件側邊中間部與側壁之垂直距離D2‧‧‧The vertical distance between the middle part of the side of the heat guide and the side wall

d3‧‧‧熱導引件側邊頂部與側壁之垂直距離D3‧‧‧The vertical distance between the top and side walls of the hot guide

第1圖繪示本發明之具有閉鎖熱循環結構之長晶爐之一實施例結構側視圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a side view showing the structure of an embodiment of a crystal growth furnace having a closed thermal cycle structure of the present invention.

第2圖繪示依據第1圖之具有閉鎖熱循環結構之長晶爐之另一實施例結構側視圖。Fig. 2 is a side view showing the structure of another embodiment of the crystal growth furnace having the closed thermal cycle structure according to Fig. 1.

第3圖繪示依據第2圖之具有閉鎖熱循環結構之長晶爐之另一實施例結構側視圖。Fig. 3 is a side view showing the structure of another embodiment of the crystal growth furnace having the closed thermal cycle structure according to Fig. 2.

第4圖繪示熱導引件組合上視圖。Figure 4 is a top view of the combination of the heat guides.

第5圖繪示依據第1圖之熱導引件結構立體圖。Fig. 5 is a perspective view showing the structure of the heat guide according to Fig. 1.

第6圖繪示熱導引件之一實施例結構立體圖。Figure 6 is a perspective view showing the structure of one embodiment of the heat guiding member.

第7圖繪示依據第6圖中斜面之另一實施例示意圖。Fig. 7 is a schematic view showing another embodiment of the inclined surface according to Fig. 6.

第8圖繪示熱導引件之一實施例結構立體圖。Figure 8 is a perspective view showing the structure of one embodiment of the heat guide.

第9圖繪示熱導引件之一實施例結構立體圖。Figure 9 is a perspective view showing the structure of one embodiment of the heat guiding member.

第10圖繪示熱導引件之一實施例結構立體圖。Figure 10 is a perspective view showing the structure of one embodiment of the heat guiding member.

第11圖繪示熱導引件之一實施例結構立體圖。Figure 11 is a perspective view showing the structure of one embodiment of the heat guide.

100‧‧‧爐體100‧‧‧ furnace body

101‧‧‧側壁101‧‧‧ side wall

102‧‧‧底部102‧‧‧ bottom

200‧‧‧承載基座200‧‧‧bearing base

300‧‧‧絕緣層300‧‧‧Insulation

301‧‧‧延伸部301‧‧‧Extension

400‧‧‧熱導引件400‧‧‧Hot guides

401‧‧‧側邊底部401‧‧‧Bottom of the bottom

402‧‧‧側邊中間部402‧‧‧ middle side of the side

403‧‧‧側邊頂部403‧‧‧Side top

a‧‧‧熱場循環方向A‧‧‧ Thermal field circulation direction

d1‧‧‧熱導引件側邊底部與側壁之垂直距離D1‧‧‧The vertical distance between the bottom and the side wall of the hot guide

d2‧‧‧熱導引件側邊中間部與側壁之垂直距離D2‧‧‧The vertical distance between the middle part of the side of the heat guide and the side wall

d3‧‧‧熱導引件側邊頂部與側壁之垂直距離D3‧‧‧The vertical distance between the top and side walls of the hot guide

Claims (14)

一種具有閉鎖熱循環結構之長晶爐,包含:一爐體,包含:一底部;及至少一側壁,圍繞該底部;一承載基座,設置於該底部下;至少一絕緣層,設於該側壁外並與該側壁間隔一距離;以及至少一熱導引件,設於該絕緣層與該側壁間,並相對圍繞該底部及該側壁周側,其中該熱導引件側邊與該側壁間距離由該熱導引件側邊底部往該熱導引件側邊頂部遞增,令該爐體自該底部由下往上逐漸形成一逐次變化之溫度梯度。 A crystal growth furnace having a locked thermal cycle structure, comprising: a furnace body comprising: a bottom; and at least one side wall surrounding the bottom; a bearing base disposed under the bottom; at least one insulating layer disposed on the Outside the sidewall and spaced apart from the sidewall; and at least one heat guiding member disposed between the insulating layer and the sidewall and surrounding the bottom portion and the sidewall side of the sidewall, wherein the heat guiding member side and the sidewall The distance between the sides of the side of the heat guide member increases toward the top of the side of the heat guide member, so that the furnace body gradually forms a successive temperature gradient from the bottom to the bottom. 如請求項1之長晶爐,其中該承載基座材質為石墨。 The crystal growth furnace of claim 1, wherein the carrier base is made of graphite. 如請求項1之長晶爐,其中該熱導引件材質為石墨。 The crystal growth furnace of claim 1, wherein the heat guide is made of graphite. 如請求項1之長晶爐,其中該熱導引件具有階梯狀結構。 The crystal growth furnace of claim 1, wherein the heat guide has a stepped structure. 如請求項1之長晶爐,其中該熱導引件包含至少一斜面。 The crystal growth furnace of claim 1, wherein the heat guide comprises at least one slope. 如請求項1之長晶爐,其中該熱導引件包含至少一弧面。 The crystal growth furnace of claim 1, wherein the heat guide comprises at least one curved surface. 如請求項1之長晶爐,其中該熱導引件包含至少一平面。 The crystal growth furnace of claim 1, wherein the heat guide comprises at least one plane. 一種具有閉鎖熱循環結構之長晶爐,包含:一爐體,包含:一底部;及至少一側壁,圍繞該底部;一承載基座,設置於該底部下,該承載基座包含:至少一凹部,形成於該承載基座周側,並相對位於該底部周緣下方;至少一熱交換件,接合於該凹部;至少一絕緣層,設於該側壁外並與該側壁間隔一距離;以及至少一熱導引件,設於該絕緣層與該側壁間,並相對圍繞該底部,其中該熱導引件側邊與該側壁間距離由該熱導引件側邊底部往該熱導引件側邊頂部遞增。 A crystal growth furnace having a locked thermal cycle structure, comprising: a furnace body comprising: a bottom; and at least one side wall surrounding the bottom; a bearing base disposed under the bottom, the carrier base comprising: at least one a recess formed on a peripheral side of the carrier base and located opposite the bottom periphery; at least one heat exchange member is coupled to the recess; at least one insulating layer disposed outside the sidewall and spaced apart from the sidewall; and at least a heat guiding member is disposed between the insulating layer and the sidewall and relatively surrounding the bottom portion, wherein a distance between a side of the heat guiding member and the sidewall is from a bottom of the side of the heat guiding member to the heat guiding member The top of the side is incremented. 如請求項8之長晶爐,其中該些熱交換件互相銜接圍繞該承載基座。 The crystal growth furnace of claim 8, wherein the heat exchange members are coupled to each other around the carrier base. 如請求項8之長晶爐,更包含: 一隔熱件,設於該底部及該承載基座間。 The crystal growth furnace of claim 8 further includes: A heat insulating member is disposed between the bottom and the bearing base. 如請求項8之長晶爐,其中該熱導引件具有階梯狀結構。 The crystal growth furnace of claim 8, wherein the heat guide has a stepped structure. 如請求項8之長晶爐,其中該熱導引件包含至少一斜面。 The crystal growth furnace of claim 8, wherein the heat guide comprises at least one slope. 如請求項8之長晶爐,其中該熱導引件包含至少一弧面。 The crystal growth furnace of claim 8, wherein the heat guide comprises at least one curved surface. 如請求項8之長晶爐,其中該熱導引件包含至少一平面。The crystal growth furnace of claim 8, wherein the heat guide comprises at least one plane.
TW101139927A 2012-10-29 2012-10-29 Crystal growth system with close thermal cycling structure TWI449820B (en)

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Publication number Priority date Publication date Assignee Title
TWM241435U (en) * 2003-08-08 2004-08-21 Sino American Silicon Product Epitaxial device with enhanced epitaxial growth efficiency

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM241435U (en) * 2003-08-08 2004-08-21 Sino American Silicon Product Epitaxial device with enhanced epitaxial growth efficiency

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