TWI447829B - - Google Patents
Info
- Publication number
- TWI447829B TWI447829B TW100136855A TW100136855A TWI447829B TW I447829 B TWI447829 B TW I447829B TW 100136855 A TW100136855 A TW 100136855A TW 100136855 A TW100136855 A TW 100136855A TW I447829 B TWI447829 B TW I447829B
- Authority
- TW
- Taiwan
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100136855A TW201316425A (zh) | 2011-10-12 | 2011-10-12 | 晶圓劈裂檢知方法 |
| CN201210196421.7A CN103050422B (zh) | 2011-10-12 | 2012-06-14 | 晶圆劈裂检知方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100136855A TW201316425A (zh) | 2011-10-12 | 2011-10-12 | 晶圓劈裂檢知方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201316425A TW201316425A (zh) | 2013-04-16 |
| TWI447829B true TWI447829B (https=) | 2014-08-01 |
Family
ID=48063021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100136855A TW201316425A (zh) | 2011-10-12 | 2011-10-12 | 晶圓劈裂檢知方法 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103050422B (https=) |
| TW (1) | TW201316425A (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104332421B (zh) * | 2014-09-01 | 2017-05-03 | 上海华力微电子有限公司 | 一种检测扫描机台的性能方法 |
| CN105047576A (zh) * | 2015-07-09 | 2015-11-11 | 深圳市华腾半导体设备有限公司 | 图像检测芯片未断方法 |
| CN109425315B (zh) * | 2017-08-31 | 2021-01-15 | 长鑫存储技术有限公司 | 半导体结构的测试载具及测试方法 |
| CN112446887B (zh) * | 2019-09-05 | 2022-04-08 | 长鑫存储技术有限公司 | 晶圆切割晶片数计算方法及计算设备 |
| TWI727860B (zh) * | 2020-07-22 | 2021-05-11 | 環球晶圓股份有限公司 | 晶圓橫向撞擊測試裝置及晶圓強度測試方法 |
| CN120300072B (zh) * | 2025-06-11 | 2025-09-05 | 深圳平湖实验室 | 一种晶圆的加工方法、晶圆加工设备及晶粒 |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6192289B1 (en) * | 1997-04-13 | 2001-02-20 | Inspectech Ltd. | Method and apparatus for analyzing cuts |
| TW490351B (en) * | 2000-10-03 | 2002-06-11 | Chuan-Huei Tsai | Laser cutting system of controlled fracture and the method of optimizing the laser path |
| TW200415453A (en) * | 2002-09-30 | 2004-08-16 | Tokyo Electron Ltd | Method and apparatus for the monitoring and control of a semiconductor manufacturing process |
| US20050158967A1 (en) * | 2004-01-20 | 2005-07-21 | Taiwan Semiconductor Manufacturing Co. | Semiconductor chip singulation method |
| TW200622509A (en) * | 2004-09-14 | 2006-07-01 | Asml Masktools Bv | A method for performing full-chip manufacturing reliability checking and correction |
| TW200741973A (en) * | 2005-08-26 | 2007-11-01 | Dynatex Internat | Method and apparatus for breaking semiconductor wafers |
| TWM322058U (en) * | 2007-04-27 | 2007-11-11 | Uni Via Technology Inc | All lighting device for LED wafer cutting process |
| TW200931552A (en) * | 2008-01-11 | 2009-07-16 | Horng Terng Automation Co Ltd | Optical detection method of cleaving wafer |
| TW200931553A (en) * | 2008-01-11 | 2009-07-16 | Horng Terng Automation Co Ltd | Image-capturing device of the optical detection equipment for cleaving wafer |
| TWM377691U (en) * | 2009-10-09 | 2010-04-01 | Horng Terng Automation Co Ltd | Wafer cleavage detection device |
| TWI349305B (https=) * | 2008-01-11 | 2011-09-21 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0115259D0 (en) * | 2001-06-21 | 2001-08-15 | Esm Ltd | Method of monitoring and controlling a photoresist edge bead |
| JP2003168655A (ja) * | 2001-12-03 | 2003-06-13 | Tokyo Seimitsu Co Ltd | ダイシング装置 |
| JP2005028423A (ja) * | 2003-07-09 | 2005-02-03 | Disco Abrasive Syst Ltd | レーザー加工方法およびレーザー加工装置 |
| US20050148203A1 (en) * | 2003-12-29 | 2005-07-07 | Shirley Paul D. | Method, apparatus, system and computer-readable medium for in situ photoresist thickness characterization |
| CN101685271B (zh) * | 2008-09-23 | 2012-01-11 | 和舰科技(苏州)有限公司 | 一种晶圆片晶边清洗宽度的检测方法 |
-
2011
- 2011-10-12 TW TW100136855A patent/TW201316425A/zh not_active IP Right Cessation
-
2012
- 2012-06-14 CN CN201210196421.7A patent/CN103050422B/zh not_active Expired - Fee Related
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6192289B1 (en) * | 1997-04-13 | 2001-02-20 | Inspectech Ltd. | Method and apparatus for analyzing cuts |
| TW490351B (en) * | 2000-10-03 | 2002-06-11 | Chuan-Huei Tsai | Laser cutting system of controlled fracture and the method of optimizing the laser path |
| TW200415453A (en) * | 2002-09-30 | 2004-08-16 | Tokyo Electron Ltd | Method and apparatus for the monitoring and control of a semiconductor manufacturing process |
| US20050158967A1 (en) * | 2004-01-20 | 2005-07-21 | Taiwan Semiconductor Manufacturing Co. | Semiconductor chip singulation method |
| TW200622509A (en) * | 2004-09-14 | 2006-07-01 | Asml Masktools Bv | A method for performing full-chip manufacturing reliability checking and correction |
| TW200741973A (en) * | 2005-08-26 | 2007-11-01 | Dynatex Internat | Method and apparatus for breaking semiconductor wafers |
| TWM322058U (en) * | 2007-04-27 | 2007-11-11 | Uni Via Technology Inc | All lighting device for LED wafer cutting process |
| TW200931552A (en) * | 2008-01-11 | 2009-07-16 | Horng Terng Automation Co Ltd | Optical detection method of cleaving wafer |
| TW200931553A (en) * | 2008-01-11 | 2009-07-16 | Horng Terng Automation Co Ltd | Image-capturing device of the optical detection equipment for cleaving wafer |
| TWI349305B (https=) * | 2008-01-11 | 2011-09-21 | ||
| TWM377691U (en) * | 2009-10-09 | 2010-04-01 | Horng Terng Automation Co Ltd | Wafer cleavage detection device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103050422B (zh) | 2015-03-04 |
| CN103050422A (zh) | 2013-04-17 |
| TW201316425A (zh) | 2013-04-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |