TWI446635B - Connector and connector apparatus - Google Patents
Connector and connector apparatus Download PDFInfo
- Publication number
- TWI446635B TWI446635B TW100135826A TW100135826A TWI446635B TW I446635 B TWI446635 B TW I446635B TW 100135826 A TW100135826 A TW 100135826A TW 100135826 A TW100135826 A TW 100135826A TW I446635 B TWI446635 B TW I446635B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- connector
- hole
- contact
- housing
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Description
本發明係關於連接器及連接器裝置。The present invention relates to connectors and connector devices.
以往，知道一種卡連接器500(例如，參照日本實開平6-11283號公報(專利文獻1))，如第12圖所示，係相互連接第一基板T1及第二基板(未圖示)之卡連接器500，於卡連接器500被搭載於第一基板T1之狀態下，卡連接器500之一部分被配置於形成在第一基板T1的安裝用開口T1’內。In the related art, a card connector 500 is known (for example, refer to Japanese Laid-Open Patent Publication No. Hei 6-121283 (Patent Document 1)), and as shown in Fig. 12, the first substrate T1 and the second substrate (not shown) are connected to each other. In the card connector 500, in a state where the card connector 500 is mounted on the first substrate T1, one portion of the card connector 500 is disposed in the mounting opening T1' of the first substrate T1.
另一方面，知道一種疊板連接器600(例如，參照日本特開平6-283238號公報(專利文獻2))，如第13圖所示，係由搭載於第一配線基板T1之母連接器610、及搭載於第二配線基板T2之公連接器620所構成，於連接器610、620間之嵌合狀態下，陽連接器620之一部分被插入形成於第一配線基板T1之安裝孔T1’內。On the other hand, a laminated connector 600 is known (for example, refer to Japanese Laid-Open Patent Publication No. Hei 6-283238 (Patent Document 2)), as shown in Fig. 13, by a female connector mounted on the first wiring substrate T1. 610 and a male connector 620 mounted on the second wiring board T2. In a fitting state between the connectors 610 and 620, a part of the male connector 620 is inserted into the mounting hole T1 formed in the first wiring substrate T1. 'Inside.
然而，於專利文獻1及專利文獻2所記載之技術中，具有嵌合於連接器間之狀態下的在連接器間之嵌合方向，連接器裝置整體之尺寸大的問題。However, in the techniques described in Patent Document 1 and Patent Document 2, there is a problem in that the size of the entire connector device is large in the fitting direction between the connectors in a state of being fitted between the connectors.
在此，本發明係為了解決習知之問題而完成發明者，亦即，本發明之目的在於提供一種連接器及連接器裝置，其可實現連接器裝置整體之低背化。Here, the present invention has been made in order to solve the conventional problems, that is, an object of the present invention is to provide a connector and a connector device which can achieve a low profile of the connector device as a whole.
本發明之連接器，係具有：第一連接器，其搭載於具有第一基板孔之第一基板；及第二連接器，其搭載於第二基板；投影在與該第一連接器及該第二連接器之間的嵌合方向正交的平面上之該第二連接器之外形，係以收容於該第一基板孔之外形內的方式形成，藉此，可解決前述之課題。The connector of the present invention has a first connector mounted on a first substrate having a first substrate hole, and a second connector mounted on the second substrate; projected onto the first connector and the second connector The shape of the second connector on the plane orthogonal to the fitting direction of the second connectors is formed so as to be received in the outer shape of the first substrate hole, whereby the above problems can be solved.
本發明之連接器裝置，係具有：第一基板，其具有第一基板孔；第二基板；第一連接器，其搭載於該第一基板；及第二連接器，其搭載於該第二基板；投影在與該第一連接器及該第二連接器之間的嵌合方向正交的平面上之該第二連接器之外形，係以收容於該第一基板孔之外形內的方式形成，藉此，可解決前述之課題。The connector device of the present invention has a first substrate having a first substrate hole, a second substrate, a first connector mounted on the first substrate, and a second connector mounted on the second substrate a substrate; a shape of the second connector projected on a plane orthogonal to a fitting direction between the first connector and the second connector, and being received in a shape outside the hole of the first substrate Formed by this, the aforementioned problems can be solved.
於本發明中，以收容於第一基板孔之外形內的方式形成第二連接器之外形，藉此，可實現在第一連接器及第二連接器之間的嵌合方向的連接器裝置整體之低背化。In the present invention, the second connector outer shape is formed so as to be received in the outer shape of the first substrate hole, whereby the connector device in the fitting direction between the first connector and the second connector can be realized. The overall low profile.
以下，參照圖面，針對本發明之一實施例之連接器裝置進行說明。Hereinafter, a connector device according to an embodiment of the present invention will be described with reference to the drawings.
本發明之一實施例之連接器裝置，如第1圖所示，係由第一基板300、第二基板400、搭載於第一基板300之第一連接器100、及搭載於第二基板400之第二連接器200所構成。第一連接器100與第二連接器200係構成在與第一基板300及第二基板400之基板面垂直的方向(以下稱為嵌合方向X3)相互接近並嵌合而電性連接於第一基板300與第二基板400之間的連接器。As shown in FIG. 1, the connector device according to the first embodiment of the present invention includes a first substrate 300, a second substrate 400, a first connector 100 mounted on the first substrate 300, and a second substrate 400. The second connector 200 is constructed. The first connector 100 and the second connector 200 are configured to be close to each other in a direction perpendicular to the substrate surface of the first substrate 300 and the second substrate 400 (hereinafter referred to as a fitting direction X3), and are electrically connected to each other. A connector between the substrate 300 and the second substrate 400.
以下之說明中，將與使第一連接器100及第二連接器200相互接近之嵌合方向X3正交的方向規定為第一方向X1及第二方向X2。第一方向X1及第二方向X2係相互正交。In the following description, the direction orthogonal to the fitting direction X3 in which the first connector 100 and the second connector 200 are close to each other is defined as the first direction X1 and the second direction X2. The first direction X1 and the second direction X2 are orthogonal to each other.
第一連接器100係所謂插頭式連接器，如第2～第4圖所示，其具有複數個第一接觸體110、及保持第一接觸體110之第一殼體120。第一接觸體110及第一殼體120係藉由嵌入成型而一體成型。The first connector 100 is a so-called plug connector. As shown in FIGS. 2 to 4, the first connector 100 has a plurality of first contacts 110 and a first case 120 that holds the first contacts 110. The first contact body 110 and the first housing 120 are integrally formed by insert molding.
第一接觸體110係由導電性之銅合金所成型，如第2～第4圖所示，其於第二方向X2之第一殼體120的兩側且在以既定間距排列於第一方向X1的狀態下分別配置有複數個。並列配置於第二方向X2之第一殼體120的一側之複數個第一接觸體110、與並列配置於第二方向X2之第一殼體120的另一側之複數個第一接觸體110，係以藉由嵌合方向X3及第一方向X1所規定之平面作為基準而呈面對稱地配置。The first contact body 110 is formed of a conductive copper alloy, as shown in the second to fourth figures, which are arranged on the both sides of the first casing 120 in the second direction X2 at a predetermined pitch in the first direction. A plurality of X1 states are respectively arranged. a plurality of first contact bodies 110 disposed on one side of the first casing 120 in the second direction X2 and a plurality of first contact bodies disposed on the other side of the first casing 120 arranged in the second direction X2 110 is arranged in plane symmetry with reference to a plane defined by the fitting direction X3 and the first direction X1 as a reference.
如第7圖所示，第一接觸體110係呈一體式地具有第一端子部111、連設於第一端子部111之第一直線部112、連設於第一直線部112之第一接觸部113、及形成於第一接觸部113之端部的捲曲端部114。As shown in FIG. 7 , the first contact body 110 integrally includes a first terminal portion 111 , a first straight portion 112 connected to the first terminal portion 111 , and a first contact portion connected to the first straight portion 112 . 113. And a curled end portion 114 formed at an end of the first contact portion 113.
第一端子部111係被焊接連接於形成在第一基板300之表面310的焊墊311上(參照第2圖)。第一端子部111係自第一殼體120朝第二方向X2突出，且露出於第一殼體120之外部。第一端子部111係具有：第一抵接面111a，其抵接於第一基板300之表面310上；及彎曲部111b，其在由嵌合方向X3及第二方向X2所規定之平面內作彎曲且自第一基板300之表面310離開。彎曲部111b係為了在第一端子部111與焊墊311之間的焊接作業時，藉由使焊料進入形成於彎曲部111b與焊墊311之間的間隙內，而可容易形成焊料填充，以提高焊接強度為目的所形成。The first terminal portion 111 is soldered to the pad 311 formed on the surface 310 of the first substrate 300 (see FIG. 2). The first terminal portion 111 protrudes from the first housing 120 in the second direction X2 and is exposed outside the first housing 120. The first terminal portion 111 has a first abutting surface 111a that abuts against the surface 310 of the first substrate 300, and a curved portion 111b that is in a plane defined by the fitting direction X3 and the second direction X2. Bending and exiting from surface 310 of first substrate 300. The curved portion 111b is formed so as to allow solder to enter the gap formed between the curved portion 111b and the pad 311 during the soldering operation between the first terminal portion 111 and the pad 311, so that solder filling can be easily formed. It is formed for the purpose of improving the welding strength.
如第7圖所示，第一直線部112係沿第二方向X2延伸，其一部分被埋設於第一殼體120之第一本體部121內。第一直線部112係形成在與除了上述彎曲部111b以外之第一端子部111的直線部分為一直線上。As shown in FIG. 7, the first straight portion 112 extends in the second direction X2, and a portion thereof is embedded in the first body portion 121 of the first casing 120. The first straight portion 112 is formed on a straight line with a straight portion of the first terminal portion 111 excluding the curved portion 111b.
第一接觸部113係沿嵌合方向X3延伸，於第一連接器100與第二連接器200之間的嵌合時，與第二接觸體210之第二接觸部215接觸而被電性連接(參照第8圖)。於本實施例中，如第7圖所示，於將第一連接器100搭載於第一基板300之狀態下，第一接觸部113超出第一基板孔330而朝第一基板300之背面320側突出，如第9圖所示，於第一連接器100與第二連接器200之間的嵌合狀態下，以第一接觸部113進入第二基板孔430內之方式設定嵌合方向X3的第一接觸部113的尺寸。The first contact portion 113 extends in the fitting direction X3, and is electrically connected to the second contact portion 215 of the second contact body 210 when the first connector 100 and the second connector 200 are fitted. (Refer to Figure 8). In the present embodiment, as shown in FIG. 7 , in a state where the first connector 100 is mounted on the first substrate 300 , the first contact portion 113 extends beyond the first substrate hole 330 toward the back surface 320 of the first substrate 300 . As shown in FIG. 9, in the fitting state between the first connector 100 and the second connector 200, the fitting direction X3 is set such that the first contact portion 113 enters the second substrate hole 430. The size of the first contact portion 113.
如第7圖所示，捲曲端部114係將其一部分埋設於第一殼體120之第一突出部123內，以提高第一殼體120與第一接觸體110之間的固接強度。As shown in FIG. 7, the curled end portion 114 is partially embedded in the first protrusion portion 123 of the first housing 120 to improve the fastening strength between the first housing 120 and the first contact body 110.
第一殼體120係由絕緣性樹脂所形成，如第3、第4圖所示，其具有：平板狀之第一本體部121；第一凸緣部122，其形成於第一本體部121之外緣；一對之第一突出部123，其係在沿第二方向X2相互分離而對向之狀態下自第一本體部121分別朝向嵌合方向X3突出所形成；一對之銷部124，其係在沿第一方向X1相互分離而對向之狀態下自第一本體部121分別朝向嵌合方向X3突出所形成；及容納部125，其係由第一本體部121、一對之第一突出部123及一對之銷部124所界定，且於第二連接器200側開口。The first casing 120 is formed of an insulating resin. As shown in FIGS. 3 and 4, the first casing 120 has a flat first body portion 121 and a first flange portion 122 formed on the first body portion 121. a pair of first protruding portions 123 formed by being protruded from the first body portion 121 toward the fitting direction X3 in a state of being separated from each other in the second direction X2; a pair of pin portions 124, which is formed by being protruded from the first body portion 121 toward the fitting direction X3 in a state in which the first direction X1 is separated from each other in the opposing direction, and the accommodating portion 125 is formed by the first body portion 121 and the pair The first protruding portion 123 and the pair of pin portions 124 are defined and open on the side of the second connector 200.
第一本體部121係於俯視之情況下呈矩形，如第7圖所示，其具有：第一部分121a，其於將第一連接器100搭載於第一基板300之狀態下，在第一基板孔330之上方位於第一基板300之表面310側；及第二部分121b，其於將第一連接器100搭載於第一基板300之狀態下位於第一基板孔330內。第二部分121b係於外緣具有在對第一基板300進行第一連接器100之安裝時，於將第一連接器100載置於第一基板300之狀態下(亦即，未進行第一接觸體110與第一基板300之間的焊接之狀態)，藉由第一基板孔330之內側面限制於第一方向X1及第二方向X2移動的被限制面121b-1。於將第一連接器100搭載於第一基板300之狀態下(亦即，進行了第一接觸體110與第一基板300之間的焊接之狀態)，於被限制面121b-1與第一基板孔330之內側面之間，在第一方向X1及第二方向X2形成有間隙。如第3圖所示，於第一本體部121(第一部分121a)之表面存在未形成有後述的孔126之平坦面，此平坦面係於將第一連接器100載置於第一基板300時，具有作為藉由抬起第一連接器100進行運送之運送裝置(未圖示)的吸附部(未圖示)所吸附保持之被吸附部127的功能。The first main body portion 121 has a rectangular shape in a plan view. As shown in FIG. 7 , the first main body portion 121 has a first portion 121 a on the first substrate in a state where the first connector 100 is mounted on the first substrate 300 . The hole 330 is located on the surface 310 side of the first substrate 300; and the second portion 121b is located in the first substrate hole 330 in a state where the first connector 100 is mounted on the first substrate 300. The second portion 121b has a state in which the first connector 100 is placed on the first substrate 300 when the first substrate 300 is mounted on the first substrate 300 (ie, the first portion is not in the first state). The state of the solder between the contact body 110 and the first substrate 300 is restricted by the inner surface of the first substrate hole 330 to the restricted surface 121b-1 that moves in the first direction X1 and the second direction X2. In a state in which the first connector 100 is mounted on the first substrate 300 (that is, a state in which the first contact body 110 and the first substrate 300 are welded), the restricted surface 121b-1 and the first surface A gap is formed between the inner side surfaces of the substrate holes 330 in the first direction X1 and the second direction X2. As shown in FIG. 3, a flat surface on which a hole 126, which will be described later, is not formed on the surface of the first body portion 121 (first portion 121a) is provided on the first substrate 300. At this time, the function of the adsorbed portion 127 that is adsorbed and held by the adsorption unit (not shown) of the transport device (not shown) that transports the first connector 100 by lifting is provided.
如第4圖所示，第一凸緣部122係形成於第一本體部121之第一部分121a的外緣(第一部分121a之四邊)。在嵌合方向X3之第一凸緣部122的厚度係以與在嵌合方向X3之第一本體部121的第一部分121a之厚度相同之尺寸所設定。於將第一連接器100載置於第一基板300之狀態下，以在第一凸緣部122與第一基板300之表面310之間形成間隔的方式構成第一殼體120。如此，藉由構成第一殼體120，即使於第一殼體120、第一接觸體110上產生尺寸及形狀上的略微製造誤差的情況下，於將第一連接器100載置於第一基板300之狀態下，仍可使第一接觸體110之第一端子部111的第一抵接面111a確實地抵接於第一基板300之焊墊311。然而，第一凸緣部122亦能對第一基板300之表面310以物理性接觸的方式構成。第一凸緣部122係於將第一連接器100搭載於第一基板300之狀態下，在嵌合方向X3與對除了第一基板孔330以外之第一基板300的基板部分重疊。亦即，包含投影於第一基板300上之第一凸緣部122的第一殼體120之外形，係以未被收容在與嵌合方向X3正交的平面內之第一基板孔330之外形內的方式所形成。如此，第一凸緣部122以在嵌合方向X3與對除了第一基板孔330以外之第一基板300的基板部分重疊的方式構成，藉此，即使在對第一連接器100施加了某種負荷或衝擊的情況下，仍可避免對第一接觸體110施加過量之變形負荷，可提高所謂連接器擺動強度。又，於本實施例中，第一凸緣部122係形成於第一本體部121之第一部分121a的四邊，但具體之構成不限於此，亦能於將第一連接器100搭載於第一基板300之狀態下，以第一殼體120之至少一部分，在嵌合方向X3與對除了第一基板孔330以外之第一基板300的基板部分重疊的方式構成。As shown in Fig. 4, the first flange portion 122 is formed on the outer edge (four sides of the first portion 121a) of the first portion 121a of the first body portion 121. The thickness of the first flange portion 122 in the fitting direction X3 is set to be the same as the thickness of the first portion 121a of the first body portion 121 in the fitting direction X3. The first housing 120 is configured to form a space between the first flange portion 122 and the surface 310 of the first substrate 300 in a state where the first connector 100 is placed on the first substrate 300. Thus, by constituting the first casing 120, even if a slight manufacturing error in size and shape occurs on the first casing 120 and the first contact body 110, the first connector 100 is placed first. In the state of the substrate 300, the first abutting surface 111a of the first terminal portion 111 of the first contact body 110 can be surely abutted against the pad 311 of the first substrate 300. However, the first flange portion 122 can also be configured to physically contact the surface 310 of the first substrate 300. The first flange portion 122 is in a state in which the first connector 100 is mounted on the first substrate 300, and overlaps the substrate portion of the first substrate 300 excluding the first substrate hole 330 in the fitting direction X3. That is, the first housing 120 including the first flange portion 122 projected on the first substrate 300 has a shape other than the first substrate hole 330 that is not accommodated in a plane orthogonal to the fitting direction X3. Formed within the shape of the shape. In this manner, the first flange portion 122 is configured to overlap the substrate portion of the first substrate 300 excluding the first substrate hole 330 in the fitting direction X3, whereby even if a certain portion is applied to the first connector 100 In the case of a load or an impact, it is still possible to avoid applying an excessive deformation load to the first contact body 110, and the so-called connector swing strength can be improved. Moreover, in the present embodiment, the first flange portion 122 is formed on four sides of the first portion 121a of the first body portion 121, but the specific configuration is not limited thereto, and the first connector 100 can be mounted on the first side. In the state of the substrate 300, at least a part of the first casing 120 is configured to overlap the substrate portion of the first substrate 300 excluding the first substrate hole 330 in the fitting direction X3.
第一突出部123係用以支撐第一接觸體110之第一接觸部113。於本實施例中，如第7圖所示，於將第一連接器100搭載於第一基板300之狀態下，第一突出部123係於第一基板300之背面320側突出，如第9圖所示，於第一連接器100與第二連接器200之間的嵌合狀態下，以第一突出部123進入第二基板孔430內之方式設定在嵌合方向X3的第一突出部123的尺寸。The first protruding portion 123 is for supporting the first contact portion 113 of the first contact body 110. In the present embodiment, as shown in FIG. 7, in a state where the first connector 100 is mounted on the first substrate 300, the first protruding portion 123 protrudes from the back surface 320 side of the first substrate 300, as in the ninth. As shown in the figure, in the fitting state between the first connector 100 and the second connector 200, the first protrusion in the fitting direction X3 is set such that the first protrusion 123 enters the second substrate hole 430. Size of 123.
銷部124係在第一連接器100與第二連接器200之間的嵌合狀態下，以進入形成於第二連接器200之第二殼體220的銷容納部223內(參照第5圖)，且藉由銷容納部223之內側面限制於第一方向X1及第二方向X2移動之方式所形成。於本實施例中，如第7圖所示，於將第一連接器100搭載於第一基板300之狀態下，銷部124係於第一基板300之背面320側突出，如第10圖所示，於第一連接器100與第二連接器200之間的嵌合狀態下，以銷部124進入第二基板孔430內之方式設定在嵌合方向X3之銷部124的尺寸。The pin portion 124 is in a fitted state between the first connector 100 and the second connector 200 to enter the pin housing portion 223 formed in the second housing 220 of the second connector 200 (refer to FIG. 5). And formed by the inner side surface of the pin accommodating portion 223 being restricted from moving in the first direction X1 and the second direction X2. In the present embodiment, as shown in FIG. 7, in a state in which the first connector 100 is mounted on the first substrate 300, the pin portion 124 protrudes from the back surface 320 side of the first substrate 300, as shown in FIG. In the fitting state between the first connector 100 and the second connector 200, the size of the pin portion 124 in the fitting direction X3 is set such that the pin portion 124 enters the second substrate hole 430.
如第4或第7圖所示，容納部125係於第二連接器200側開口，於第一連接器100與第二連接器200之間的嵌合時，以收容第二殼體220及第二接觸體210之一部分的方式所構成。As shown in FIG. 4 or FIG. 7 , the accommodating portion 125 is opened on the side of the second connector 200 to accommodate the second housing 220 when the first connector 100 and the second connector 200 are fitted together. The second contact body 210 is constructed in a manner of one portion.
第2或第7圖所示之元件符號126係形成於第一殼體120之孔，在第一接觸體110與第一殼體120之嵌入成型時，需要以模具之突起等抑制第一接觸體110的移動，該孔係作為此結果而形成之孔。The component symbol 126 shown in FIG. 2 or FIG. 7 is formed in the hole of the first casing 120. When the first contact body 110 and the first casing 120 are insert-molded, it is necessary to suppress the first contact by the protrusion of the mold or the like. The movement of the body 110, which is the hole formed as a result of this.
第二連接器200係所謂接受式連接器，如第2、第5及第6圖所示，其具有複數個第二接觸體210、及保持第二接觸體210之第二殼體220。第二接觸體210係嵌入第二殼體220內。The second connector 200 is a so-called receiving connector, as shown in FIGS. 2, 5, and 6, having a plurality of second contacts 210 and a second casing 220 holding the second contacts 210. The second contact body 210 is embedded in the second housing 220.
第二接觸體210係由導電性之銅合金所成型，如第2、第5及第6圖所示，其於第二方向X2之第二殼體220的兩側且在以既定間距排列於第一方向X1的狀態下分別配置有複數個。並列配置於在第二方向X2之第二殼體220的一側之複數個第二接觸體210、與並列配置於在第二方向X2之第二殼體220的另一側之複數個第二接觸體210，係以藉由嵌合方向X3及第一方向X1所規定之平面作為基準而呈面對稱地配置。The second contact body 210 is formed of a conductive copper alloy, as shown in the second, fifth, and sixth figures, which are arranged on both sides of the second casing 220 in the second direction X2 and at a predetermined pitch. A plurality of states are arranged in the first direction X1. a plurality of second contact bodies 210 arranged side by side on the second casing 220 in the second direction X2 and a plurality of second bodies arranged in parallel on the other side of the second casing 220 in the second direction X2 The contact body 210 is arranged in plane symmetry with reference to a plane defined by the fitting direction X3 and the first direction X1.
如第8圖所示，第二接觸體210係呈一體式地具有第二端子部211、連設於第二端子部211之第二直線部212、自第二直線部212朝向嵌合方向X3突出形成之被保持部213、連設於第二直線部212之彈簧部214、及於彈簧部214之前端部於第二方向X2突出的第二接觸部215。As shown in FIG. 8, the second contact body 210 integrally includes the second terminal portion 211, the second straight portion 212 connected to the second terminal portion 211, and the second straight portion 212 toward the fitting direction X3. The held portion 213 that is formed to protrude, the spring portion 214 that is connected to the second straight portion 212, and the second contact portion 215 that protrudes in the second direction X2 at the front end of the spring portion 214.
第二端子部211係被焊接連接於形成在第二基板400之表面410的焊墊411(參照第2圖)。第二端子部211係自第二殼體220朝向第二方向X2突出，且露出於第二殼體220之外部。第二端子部211係具有抵接於第二基板400之表面410上的第二抵接面211a。包含投影在與嵌合方向X3正交的平面上(第一基板300)之第二端子部211的第二連接器200的外形，係以被收容在第一基板孔330之外形內的方式形成。另外，於本實施例中，如第9圖所示，於第一連接器100與第二連接器200之間的嵌合狀態下，以包括第二接觸體210及第二殼體220之一部分在內，還使第二端子部211之一部分進入第一基板孔330內之方式設定在嵌合方向X3之第二端子部211的尺寸。The second terminal portion 211 is soldered to the pad 411 formed on the surface 410 of the second substrate 400 (see FIG. 2). The second terminal portion 211 protrudes from the second housing 220 toward the second direction X2 and is exposed outside the second housing 220 . The second terminal portion 211 has a second abutting surface 211 a that abuts on the surface 410 of the second substrate 400 . The outer shape of the second connector 200 including the second terminal portion 211 projected on a plane orthogonal to the fitting direction X3 (first substrate 300) is formed so as to be housed in the outer shape of the first substrate hole 330. . In addition, in this embodiment, as shown in FIG. 9, in a fitting state between the first connector 100 and the second connector 200, a part including the second contact body 210 and the second housing 220 is included. In the inside, the size of the second terminal portion 211 in the fitting direction X3 is set such that one of the second terminal portions 211 enters the first substrate hole 330.
如第8圖所示，第二直線部212係沿第二方向X2延伸。As shown in Fig. 8, the second straight portion 212 extends in the second direction X2.
如第8圖所示，被保持部213係自第二直線部212朝向嵌合方向X3突出形成，且以被壓入形成於第二殼體220之保持部225的固定狀態而保持。As shown in FIG. 8, the held portion 213 is formed to protrude from the second straight portion 212 toward the fitting direction X3, and is held in a fixed state in which the holding portion 225 formed in the second casing 220 is press-fitted.
彈簧部214係由連設於第二直線部212且沿嵌合方向X3延伸之第一部分214a、連設於第一部分214a且沿第二方向X2延伸之第二部分214b、及連設於第二部分214b且朝向嵌合方向X3延伸之第三部分214c所構成，整體形狀呈字狀。於本實施例中，如第8圖所示，於將第二連接器200搭載於第二基板400之狀態下，第三部分214c之一部分位於第二基板孔430內，並且第三部分214c之另一部分在第二基板孔430的上方位於第二基板400之表面410側，如第9圖所示，於第一連接器100與第二連接器200之間的嵌合狀態下，以第三部分214c之一部分位於第一基板孔330內之方式設定在嵌合方向X3之第三部分214c的尺寸。The spring portion 214 is a first portion 214a that is connected to the second straight portion 212 and extends in the fitting direction X3, a second portion 214b that is connected to the first portion 214a and extends in the second direction X2, and is connected to the second portion. The portion 214b is formed by the third portion 214c extending toward the fitting direction X3, and the overall shape is Word shape. In the present embodiment, as shown in FIG. 8, in a state where the second connector 200 is mounted on the second substrate 400, one portion of the third portion 214c is located in the second substrate hole 430, and the third portion 214c is The other part is located on the surface 410 side of the second substrate 400 above the second substrate hole 430. As shown in FIG. 9, in the fitting state between the first connector 100 and the second connector 200, the third The size of the third portion 214c of the fitting direction X3 is set in such a manner that one of the portions 214c is located in the first substrate hole 330.
如第8圖所示，第二接觸部215係在位於第一連接器100側之第三部分214c的前端部於第二方向X2突出。於第一連接器100與第二連接器200之間的嵌合時，彈簧部214發生彈性變形，第二接觸部215與第一接觸體110之第一接觸部113接觸而被電性連接。As shown in Fig. 8, the second contact portion 215 protrudes in the second direction X2 at the front end portion of the third portion 214c on the first connector 100 side. When the first connector 100 and the second connector 200 are fitted, the spring portion 214 is elastically deformed, and the second contact portion 215 is electrically connected to the first contact portion 113 of the first contact body 110.
第二殼體220係由絕緣性樹脂所形成，如第5、第6及第8圖所示，其具有：第二本體部221；第二凸緣部222，其形成於第二本體部221之外緣；一對銷容納部223，其係在於第一方向X1相互分離之位置分別形成於第二本體部221；一對收容凹部224，其係在於第二方向X2相互分離之位置被凹設於第二本體部221；及一對保持部225，其形成於在第二方向X2之收容凹部224的兩外側。The second casing 220 is formed of an insulating resin, as shown in the fifth, sixth, and eighth drawings, and has a second body portion 221 and a second flange portion 222 formed in the second body portion 221 a pair of pin accommodating portions 223 formed at positions separated from each other in the first direction X1 are respectively formed in the second body portion 221; and a pair of accommodating recess portions 224 are recessed at positions separated from each other in the second direction X2 The second main body portion 221 and the pair of holding portions 225 are formed on both outer sides of the housing recess 224 in the second direction X2.
如第8圖所示，第二本體部221係具有：第一部分221a，其於將第二連接器200搭載於第二基板400之狀態下，在第二基板孔430之上方位於第二基板400之表面410側；及第二部分221b，其於將第二連接器200搭載於第二基板400之狀態下位於第二基板孔430內。第二部分221b係於外緣具有在對第二基板400進行第二連接器200之安裝時，且在對第二基板400載置第二連接器200之狀態下(亦即，未進行第二接觸體210與第二基板400之間的焊接之狀態)，藉由第二基板孔430之內側面限制於第一方向X1及第二方向X2移動的被限制面221b-1。於將第二連接器200搭載於第二基板400之狀態下(亦即，進行了第二接觸體210與第二基板400之間的焊接之狀態)，於被限制面221b-1與第二基板孔430之內側面之間，於第一方向X1及第二方向X2上形成有間隙。如第5圖所示，由一對之銷容納部223及一對之收容凹部224所包圍的位置之第二本體部221(第一部分221a)的表面，係於對第二基板400載置第二連接器200時，具有作為藉由抬起第二連接器200進行運送之搬運裝置(未圖示)的吸附部(未圖示)所吸附保持之平坦狀的被吸附部226的功能。As shown in FIG. 8 , the second body portion 221 has a first portion 221 a located on the second substrate 400 above the second substrate hole 430 in a state where the second connector 200 is mounted on the second substrate 400 . The surface 410 side and the second portion 221b are located in the second substrate hole 430 in a state where the second connector 200 is mounted on the second substrate 400. The second portion 221b is in a state where the outer edge has the second connector 200 mounted on the second substrate 400, and the second connector 200 is placed on the second substrate 400 (that is, the second connector 200 is not performed). The state of the solder between the contact body 210 and the second substrate 400 is restricted by the inner side surface of the second substrate hole 430 to the restricted surface 221b-1 that moves in the first direction X1 and the second direction X2. In a state in which the second connector 200 is mounted on the second substrate 400 (that is, a state in which the second contact body 210 and the second substrate 400 are welded), the restricted surface 221b-1 and the second surface are formed. A gap is formed between the inner side surfaces of the substrate holes 430 in the first direction X1 and the second direction X2. As shown in FIG. 5, the surface of the second main body portion 221 (first portion 221a) at a position surrounded by the pair of pin accommodating portions 223 and the pair of accommodating recess portions 224 is placed on the second substrate 400. In the case of the second connector 200, it has a function as a flat adsorbed portion 226 which is held by an adsorption unit (not shown) of a transport device (not shown) that transports the second connector 200.
如第5、第6圖所示，第二凸緣部222係形成於第二本體部221之第一部分221a的外緣(具體而言，在第二方向X2之第一部分221a之二邊)。於將第二連接器200載置於第二基板400之狀態下，以在第二凸緣部222與第二基板400之表面410之間形成間隔的方式構成第二殼體220。如此，藉由構成第二殼體220，即使在第二凸緣部222、第二接觸體210產生尺寸及形狀上的略微之製造誤差的情況下，於將第二連接器200載置於第二基板400之狀態下，仍可使第二接觸體210之第二端子部211的第二抵接面211a確實地抵接於第二基板400之焊墊411。然而，第二凸緣部222亦能對第二基板400之表面410以物理性接觸的方式構成。第二凸緣部222係於將第二連接器200搭載於第二基板400之狀態下，於嵌合方向X3與對除了第二基板孔430以外之第二基板400的基板部分重疊。亦即，包含投影於第二基板400上之第二凸緣部222的第二殼體220之外形，係以未被收容在與嵌合方向X3正交的平面內之第二基板孔430之外形內的方式所形成。如此，第二凸緣部222以在嵌合方向X3與對除了第二基板孔430以外之第二基板400的基板部分重疊的方式構成，藉此，即使在對第二連接器200施加了某種負荷或衝擊的情況下，仍可避免於第二接觸體210施加過量之變形負荷，可提高所謂連接器擺動強度。又，於本實施例中，第二凸緣部222係形成於第二本體部221之第一部分221a的二邊，但具體之構成不限於此，亦能於將第二連接器200搭載於第二基板400之狀態下，第二殼體220之至少一部分以在嵌合方向X3與對除了第二基板孔430以外之第二基板400的基板部分重疊的方式構成。As shown in FIGS. 5 and 6, the second flange portion 222 is formed on the outer edge of the first portion 221a of the second body portion 221 (specifically, on both sides of the first portion 221a in the second direction X2). The second housing 220 is configured to form a space between the second flange portion 222 and the surface 410 of the second substrate 400 in a state where the second connector 200 is placed on the second substrate 400. Thus, by constituting the second casing 220, even if the second flange portion 222 and the second contact body 210 are slightly manufactured with a size and shape, the second connector 200 is placed on the second connector 200. In the state of the second substrate 400, the second abutting surface 211a of the second terminal portion 211 of the second contact body 210 can be surely abutted against the pad 411 of the second substrate 400. However, the second flange portion 222 can also be configured to physically contact the surface 410 of the second substrate 400. The second flange portion 222 is in a state in which the second connector 200 is mounted on the second substrate 400, and overlaps the substrate portion of the second substrate 400 other than the second substrate hole 430 in the fitting direction X3. That is, the second housing 220 including the second flange portion 222 projected on the second substrate 400 has a shape other than the second substrate hole 430 that is not accommodated in a plane orthogonal to the fitting direction X3. Formed within the shape of the shape. In this manner, the second flange portion 222 is configured to overlap the substrate portion of the second substrate 400 other than the second substrate hole 430 in the fitting direction X3, whereby even if a certain portion is applied to the second connector 200 In the case of a load or an impact, it is still possible to avoid excessive deformation load applied to the second contact body 210, and the so-called connector swing strength can be improved. Moreover, in the present embodiment, the second flange portion 222 is formed on both sides of the first portion 221a of the second body portion 221, but the specific configuration is not limited thereto, and the second connector 200 can be mounted on the second connector 200. In the state of the second substrate 400, at least a portion of the second casing 220 is configured to overlap the substrate portion of the second substrate 400 other than the second substrate hole 430 in the fitting direction X3.
如第5、第6圖所示，銷容納部223係在第一方向X1的第二本體部221之兩側，且在於嵌合方向X3貫穿第二本體部221之狀態下形成，並於第一連接器100與第二連接器200之間的嵌合狀態下，以容納形成於第一殼體120之銷部124，限制在第一方向X1及第二方向X2之銷部124的移動的方式構成。於本實施例中，如第8圖所示，於將第二連接器200搭載於第二基板400之狀態下，如第10圖所示，銷容納部223之一部分位於第二基板孔430內，並且銷容納部223之另一部分在第二基板孔430之上方位於第二基板400的表面410側，於第一連接器100與第二連接器200之間的嵌合狀態下，以銷容納部223之一部分位於第一基板孔330內之方式設定在嵌合方向X3的銷容納部223的尺寸。As shown in the fifth and sixth figures, the pin accommodating portion 223 is formed on both sides of the second body portion 221 in the first direction X1, and is formed in a state in which the fitting direction X3 penetrates the second body portion 221, and is In a fitting state between the connector 100 and the second connector 200, the pin portion 124 formed in the first casing 120 is accommodated to restrict the movement of the pin portion 124 in the first direction X1 and the second direction X2. Way composition. In the present embodiment, as shown in FIG. 8, in a state in which the second connector 200 is mounted on the second substrate 400, as shown in FIG. 10, one portion of the pin accommodating portion 223 is located in the second substrate hole 430. And another portion of the pin accommodating portion 223 is located on the surface 410 side of the second substrate 400 above the second substrate hole 430, and is received by the pin in a fitting state between the first connector 100 and the second connector 200. The size of the pin housing portion 223 in the fitting direction X3 is set such that one of the portions 223 is located in the first substrate hole 330.
收容凹部224係朝向第一連接器100側開口，收容第二接觸體210之彈簧部214。於本實施例中，如第8圖所示，於將第二連接器200搭載於第二基板400之狀態下，收容凹部224之一部分位於第二基板孔430內，並且收容凹部224之另一部分在第二基板孔430之上方位於第二基板400的表面410側，如第9圖所示，於第一連接器100與第二連接器200之間的嵌合狀態下，以收容凹部224之一部分位於第一基板孔330內之方式設定在嵌合方向X3收容凹部224的尺寸。The housing recess 224 is open toward the first connector 100 side, and accommodates the spring portion 214 of the second contact body 210. In the present embodiment, as shown in FIG. 8, in a state where the second connector 200 is mounted on the second substrate 400, one portion of the housing recess 224 is located in the second substrate hole 430, and another portion of the recess 224 is received. The second substrate hole 430 is located on the surface 410 side of the second substrate 400. As shown in FIG. 9, in the fitting state between the first connector 100 and the second connector 200, the recess 224 is accommodated. The size of the recess 224 is set in the fitting direction X3 in such a manner that a part thereof is located in the first substrate hole 330.
如第8圖所示，保持部225係在於嵌合方向X3貫穿之狀態下形成於第二本體部221，且於固定狀態下保持第二接觸體210之被保持部213。As shown in FIG. 8, the holding portion 225 is formed in the second main body portion 221 in a state in which the fitting direction X3 is penetrated, and holds the held portion 213 of the second contact body 210 in a fixed state.
如第2圖所示，第一基板300係具有形成有焊墊311之表面310、背面320、及於嵌合方向X3貫穿於表背面之矩形形狀的第一基板孔330。As shown in FIG. 2, the first substrate 300 has a surface 310 on which the pad 311 is formed, a back surface 320, and a first substrate hole 330 having a rectangular shape penetrating the front and back surfaces in the fitting direction X3.
如第2圖所示，第二基板400係具有形成有焊墊411之表面410、背面420、及於嵌合方向X3貫穿於表背面之矩形形狀的第二基板孔430。As shown in FIG. 2, the second substrate 400 has a surface 410 on which the pad 411 is formed, a back surface 420, and a second substrate hole 430 having a rectangular shape penetrating the front and back surfaces in the fitting direction X3.
第一連接器100與第二連接器200係在使第一基板300之背面320與第二基板400的表面410相互對向之狀態下相互嵌合。The first connector 100 and the second connector 200 are fitted to each other in a state in which the back surface 320 of the first substrate 300 and the surface 410 of the second substrate 400 face each other.
於本實施例中，第一基板300及第二基板400係作為硬質印刷電路基板構成。然而，第一基板300及第二基板400之具體態樣，不限於硬質印刷電路基板，例如，亦可為FPC等之可撓性基板。In the present embodiment, the first substrate 300 and the second substrate 400 are configured as a hard printed circuit board. However, the specific form of the first substrate 300 and the second substrate 400 is not limited to a hard printed circuit board, and may be, for example, a flexible substrate such as FPC.
於本實施例中，於第一基板300與第二基板400之間設有間隔片(未圖示)，如第9圖所示，於第一連接器100與第二連接器200之間的嵌合時，於第一基板300與第二基板400之間形成有既定之間隔S。然而，亦可不於第一基板300與第二基板400之間設置間隔片，而以第一基板300與第二基板400相互作物理性接觸的方式構成。In this embodiment, a spacer (not shown) is disposed between the first substrate 300 and the second substrate 400, as shown in FIG. 9, between the first connector 100 and the second connector 200. At the time of fitting, a predetermined interval S is formed between the first substrate 300 and the second substrate 400. However, the spacers may not be provided between the first substrate 300 and the second substrate 400, and the first substrate 300 and the second substrate 400 may be configured to be in crop-like contact with each other.
於依此方式而獲得之本實施例的連接器裝置中，包含投影在與嵌合方向X3正交的平面上之第二端子部211的第二連接器200的外形，係以被收容在第一基板孔330之外形內的方式所形成，藉此，於第一連接器100與第二連接器200之間的嵌合時，包括第二接觸體210及第二殼體220之一部分在內，第二端子部211之一部分亦進入第一基板孔330內，所以，可實現在嵌合方向X3之連接器裝置整體的低背化。In the connector device of the present embodiment obtained in this manner, the outer shape of the second connector 200 including the second terminal portion 211 projected on a plane orthogonal to the fitting direction X3 is accommodated in the first A substrate hole 330 is formed in an outer shape, thereby including a portion of the second contact body 210 and the second housing 220 when the first connector 100 and the second connector 200 are fitted. Since one portion of the second terminal portion 211 also enters the first substrate hole 330, the overall connector device in the fitting direction X3 can be lowered.
另外，第一接觸體110及第一殼體120之一部分被配置於第一基板孔330內，並且第二接觸體210及第二殼體220之一部分被配置於第二基板孔430內，藉此，可實現在嵌合方向X3之連接器裝置整體的低背化。In addition, a portion of the first contact body 110 and the first housing 120 is disposed in the first substrate hole 330, and a portion of the second contact body 210 and the second housing 220 is disposed in the second substrate hole 430. Thereby, the overall lowering of the connector device in the fitting direction X3 can be achieved.
第一殼體120之銷部124與第二殼體220之銷容納部223，係於第一連接器100與第二連接器200之間的嵌合狀態下，以跨第一基板孔330內及第二基板孔430內之雙方而延伸的方式構成，藉此，不會阻礙連接器裝置整體的低背化，可充分確保在嵌合方向X3之銷部124及銷容納部223的長度，因此，可實現第一連接器100與第二連接器200之間的圓順之嵌合、及在第一方向X1及第二方向X2之第一連接器100與第二連接器200之間確實的移動限制。The pin portion 124 of the first housing 120 and the pin receiving portion 223 of the second housing 220 are in a fitting state between the first connector 100 and the second connector 200 to span the first substrate hole 330. And both of the second substrate holes 430 are extended, whereby the length of the pin portion 124 and the pin accommodating portion 223 in the fitting direction X3 can be sufficiently ensured without hindering the lowering of the entire connector device. Therefore, the rounded fitting between the first connector 100 and the second connector 200 and the first connector 100 and the second connector 200 in the first direction X1 and the second direction X2 can be realized. Mobile restrictions.
第一接觸體110之第一接觸部113與第二接觸體210之彈簧部214的第三部分214c，係於第一連接器100與第二連接器200之間的嵌合狀態下，跨第一基板孔330及第二基板孔430之雙方而延伸，並且，第二接觸體210之第二接觸部215被形成於第三部分214c之第一連接器100側的前端部，藉此，不會阻礙連接器裝置整體的低背化，可充分確保第一接觸體110與第二接觸體210之間的有效接觸長度。The first contact portion 113 of the first contact body 110 and the third portion 214c of the spring portion 214 of the second contact body 210 are in a fitting state between the first connector 100 and the second connector 200, spanning a substrate hole 330 and a second substrate hole 430 extend from each other, and a second contact portion 215 of the second contact body 210 is formed at a front end portion of the first connector 100 side of the third portion 214c, thereby not The low-profile of the connector device as a whole can be hindered, and the effective contact length between the first contact body 110 and the second contact body 210 can be sufficiently ensured.
其次，參照第11圖，針對本實施例之連接器裝置的變化例進行說明。在此，第一接觸體110之第一端子部111’的構成及第一基板300之配置狀態以外之構成，係與前述之連接器裝置完全相同，所以，針對第一接觸體110之第一端子部111’的構成及第一基板300之配置狀態以外之構成，省略說明。Next, a modification of the connector device of the present embodiment will be described with reference to Fig. 11. Here, the configuration of the first terminal portion 111 ′ of the first contact body 110 and the configuration of the first substrate 300 are completely the same as those of the connector device described above, so that the first contact body 110 is the first The configuration of the terminal portion 111' and the configuration of the first substrate 300 are not described.
首先，於本變化例中，如第11圖所示，第一基板300之表背面係與第1至第10圖所示之前述實施例相反。亦即，於本變化例中，在使形成有焊墊(第11圖中未圖示)的表面310與第二基板400對向之狀態下，配置第一基板300。First, in the present modification, as shown in Fig. 11, the front and back surfaces of the first substrate 300 are opposite to those of the first embodiment shown in Figs. That is, in the present modification, the first substrate 300 is placed in a state in which the surface 310 on which the pad (not shown in FIG. 11) is formed is opposed to the second substrate 400.
另外，於本變化例中，第一接觸體110之第一端子部111’係在第二方向X2中自第一直線部112的端部通過第一基板孔330內而延伸至第一基板300的表面310側，被焊接連接於形成在與第二基板400對向之第一基板300的表面310之焊墊(第11圖中未圖示)。In addition, in the present variation, the first terminal portion 111 ′ of the first contact body 110 extends from the end of the first straight portion 112 through the first substrate hole 330 to the first substrate 300 in the second direction X2 . The surface 310 side is soldered to a pad (not shown in FIG. 11) formed on the surface 310 of the first substrate 300 opposed to the second substrate 400.
100．．．第一連接器100. . . First connector
110．．．第一接觸體110. . . First contact
111,111’．．．第一端子部111,111’. . . First terminal part
111a．．．第一抵接面111a. . . First abutment
111b．．．彎曲部111b. . . Bending
112．．．第一直線部112. . . First straight line
113．．．第一接觸部113. . . First contact
114．．．捲曲端部114. . . Curled end
120．．．第一殼體120. . . First housing
121．．．第一本體部121. . . First body
121a．．．第一部分121a. . . first part
121b．．．第二部分121b. . . the second part
121b-1．．．被限制面(第一被限制面)121b-1. . . Restricted surface (first restricted surface)
122．．．第一凸緣部122. . . First flange
123．．．第一突出部123. . . First protrusion
124．．．銷部124. . . Sales department
125．．．容納部125. . . Housing
126．．．孔126. . . hole
127．．．被吸附部127. . . Adsorbed part
200．．．第二連接器200. . . Second connector
210．．．第二接觸體210. . . Second contact
211．．．第二端子部211. . . Second terminal
211a．．．第二抵接面211a. . . Second abutment
212．．．第二直線部212. . . Second straight line
213．．．被保持部213. . . Being held
214．．．彈簧部214. . . Spring part
214a．．．第一部分214a. . . first part
214b．．．第二部分214b. . . the second part
214c．．．第三部分214c. . . the third part
215．．．第二接觸部215. . . Second contact
220．．．第二殼體220. . . Second housing
221．．．第二本體部221. . . Second body
221a．．．第一部分221a. . . first part
221b．．．第二部分221b. . . the second part
221b-1．．．被限制面(第二被限制面)221b-1. . . Restricted face (second restricted face)
222．．．第二凸緣部222. . . Second flange
223．．．銷容納部223. . . Pin housing
224．．．收容凹部224. . . Containing recess
225．．．保持部225. . . Holding department
226．．．被吸附部226. . . Adsorbed part
300．．．第一基板300. . . First substrate
310．．．表面310. . . surface
311．．．焊墊311. . . Solder pad
320．．．背面320. . . back
330．．．第一基板孔330. . . First substrate hole
400．．．第二基板400. . . Second substrate
410．．．表面410. . . surface
411．．．焊墊411. . . Solder pad
420．．．背面420. . . back
430．．．第二基板孔430. . . Second substrate hole
X1．．．第一方向X1. . . First direction
X2．．．第二方向X2. . . Second direction
X3．．．嵌合方向X3. . . Mating direction
第1圖為顯示本發明之一實施例之連接器裝置的立體圖。Fig. 1 is a perspective view showing a connector device according to an embodiment of the present invention.
第2圖為顯示將第1圖所示之連接器裝置截面化而予觀察之立體圖。Fig. 2 is a perspective view showing the connector device shown in Fig. 1 in cross section.
第3圖為顯示第一連接器之立體圖。Figure 3 is a perspective view showing the first connector.
第4圖為顯示自與第3圖不同之視點觀察第一連接器之立體圖。Fig. 4 is a perspective view showing the first connector viewed from a different viewpoint from Fig. 3.
第5圖為顯示第二連接器之立體圖。Figure 5 is a perspective view showing the second connector.
第6圖為顯示自與第5圖不同之視點觀察第二連接器之立體圖。Fig. 6 is a perspective view showing the second connector viewed from a different viewpoint from Fig. 5.
第7圖為顯示第一連接器及第一基板之剖視圖。Figure 7 is a cross-sectional view showing the first connector and the first substrate.
第8圖為顯示第二連接器及第二基板之剖視圖。Figure 8 is a cross-sectional view showing the second connector and the second substrate.
第9圖為顯示使第一連接器及第二連接器嵌合之狀態的連接器裝置之剖視圖。Fig. 9 is a cross-sectional view showing the connector device in a state in which the first connector and the second connector are fitted.
第10圖為顯示銷部及銷容納部之附近部分的連接器裝置之剖視圖。Fig. 10 is a cross-sectional view showing the connector device in the vicinity of the pin portion and the pin accommodating portion.
第11圖為顯示本發明之變化例的連接器裝置之剖視圖。Figure 11 is a cross-sectional view showing a connector device of a variation of the present invention.
第12圖為顯示習知之卡連接器的剖視圖。Figure 12 is a cross-sectional view showing a conventional card connector.
第13圖為顯示習知之疊板連接器的剖視圖。Figure 13 is a cross-sectional view showing a conventional stacked board connector.
100．．．第一連接器100. . . First connector
110．．．第一接觸體110. . . First contact
113．．．第一接觸部113. . . First contact
120．．．第一殼體120. . . First housing
123．．．第一突出部123. . . First protrusion
200．．．第二連接器200. . . Second connector
210．．．第二接觸體210. . . Second contact
211．．．第二端子部211. . . Second terminal
214c．．．第三部分214c. . . the third part
215．．．第二接觸部215. . . Second contact
220．．．第二殼體220. . . Second housing
224．．．收容凹部224. . . Containing recess
300．．．第一基板300. . . First substrate
310．．．表面310. . . surface
320．．．背面320. . . back
330．．．第一基板孔330. . . First substrate hole
400．．．第二基板400. . . Second substrate
410．．．表面410. . . surface
420．．．背面420. . . back
X2．．．第二方向X2. . . Second direction
X3．．．嵌合方向X3. . . Mating direction
S．．．間隔S. . . interval
Claims (14)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010291558A JP5732250B2 (en) | 2010-12-28 | 2010-12-28 | Connector unit and connector device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201244267A TW201244267A (en) | 2012-11-01 |
| TWI446635B true TWI446635B (en) | 2014-07-21 |
Family
ID=46414899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100135826A TWI446635B (en) | 2010-12-28 | 2011-10-04 | Connector and connector apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5732250B2 (en) |
| KR (1) | KR101326395B1 (en) |
| CN (1) | CN102570080B (en) |
| TW (1) | TWI446635B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9537244B2 (en) | 2013-02-27 | 2017-01-03 | Panasonic Intellectual Property Management Co., Ltd. | Connector having an attachment piece not aligned with a protrusion formed in a sidewall of the connector body |
| KR101809339B1 (en) * | 2013-02-27 | 2017-12-14 | 파나소닉 아이피 매니지먼트 가부시키가이샤 | Connector, and header and socket to be used in the same |
| CN106848654B (en) * | 2013-02-27 | 2019-06-04 | 松下知识产权经营株式会社 | Connector and the plug piece and socket piece used in the connector |
| JP6045970B2 (en) * | 2013-04-12 | 2016-12-14 | 日本圧着端子製造株式会社 | connector |
| EP3007279A1 (en) * | 2014-10-09 | 2016-04-13 | Siemens Aktiengesellschaft | Circuit board assembly |
| JP2018532617A (en) * | 2015-09-28 | 2018-11-08 | タクトテク オーユー | Multilayer structure for electronic equipment and related manufacturing methods |
| JP7037373B2 (en) * | 2018-01-19 | 2022-03-16 | 日本圧着端子製造株式会社 | connector |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9122052D0 (en) * | 1991-10-17 | 1991-11-27 | Amp Holland | Printed circuit board electrical connector |
| JPH0611283U (en) * | 1992-07-17 | 1994-02-10 | デュポン・シンガポール・ピーティーイー・リミテッド | Card connector |
| WO1994002975A1 (en) * | 1992-07-17 | 1994-02-03 | Berg Technology, Inc. | Flat back card connector |
| JP3443864B2 (en) * | 1993-03-26 | 2003-09-08 | 松下電工株式会社 | Stacking connector |
| JPH0817527A (en) * | 1994-06-28 | 1996-01-19 | Nec Eng Ltd | Successive coupling type connector |
| US5876217A (en) | 1996-03-14 | 1999-03-02 | Molex Incorporated | Electric connector assembly with improved retention characteristics |
| US6623281B2 (en) * | 1999-06-29 | 2003-09-23 | Vlt Corporation | Mounting electronic components on circuit boards |
| JP2002319441A (en) * | 2001-04-20 | 2002-10-31 | Jst Mfg Co Ltd | Connecting structure between printed circuit boards |
| EP1981124B1 (en) * | 2002-07-23 | 2010-11-17 | Panasonic Electric Works Co., Ltd. | Low profile connector |
| JP4011530B2 (en) * | 2003-08-22 | 2007-11-21 | 日本航空電子工業株式会社 | connector |
| JP4545062B2 (en) * | 2005-08-03 | 2010-09-15 | モレックス インコーポレイテド | Board to board connector |
| CN101322287A (en) * | 2005-12-01 | 2008-12-10 | 第一电子工业株式会社 | Electrical connector |
| JP2008146888A (en) * | 2006-12-07 | 2008-06-26 | Hirose Electric Co Ltd | Electric connector |
| JP2009217943A (en) * | 2008-03-07 | 2009-09-24 | Jst Mfg Co Ltd | Connector |
| CN201285839Y (en) * | 2008-08-21 | 2009-08-05 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
-
2010
- 2010-12-28 JP JP2010291558A patent/JP5732250B2/en active Active
-
2011
- 2011-10-04 TW TW100135826A patent/TWI446635B/en active
- 2011-11-16 KR KR1020110119426A patent/KR101326395B1/en active IP Right Grant
- 2011-11-21 CN CN201110370710.XA patent/CN102570080B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN102570080B (en) | 2015-06-24 |
| TW201244267A (en) | 2012-11-01 |
| KR101326395B1 (en) | 2013-11-11 |
| KR20120075341A (en) | 2012-07-06 |
| JP5732250B2 (en) | 2015-06-10 |
| CN102570080A (en) | 2012-07-11 |
| JP2012138320A (en) | 2012-07-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI446635B (en) | Connector and connector apparatus | |
| US11158968B2 (en) | Connector and connector assembly | |
| TWI540801B (en) | Connector | |
| TWI475765B (en) | Connector | |
| US7637786B2 (en) | Electrical connector | |
| JP5197294B2 (en) | Board to board connector | |
| US11233346B2 (en) | Board-to-board connector | |
| US8092232B2 (en) | Board-to-board connector | |
| JP4851510B2 (en) | Electrical connector | |
| US20130344710A1 (en) | Circuit board-circuit board connector | |
| CN110277659B (en) | Connecting piece and socket | |
| JP2014170726A (en) | Electric connector assembly and electric connector used for the same | |
| JP4578377B2 (en) | Board connector | |
| TWI565156B (en) | Reversible connector | |
| JP6815029B2 (en) | Contact, connector member, connector and connected member | |
| US20050130506A1 (en) | Connector | |
| TW201509007A (en) | Connector | |
| JP2021064471A (en) | Connector and connector assembly | |
| JP5769589B2 (en) | Flat circuit body connector connection structure | |
| JP7283971B2 (en) | BOARD CONNECTOR AND BOARD CONNECTOR STRUCTURE | |
| JP5388350B2 (en) | Electrical connection terminal and connector using the same | |
| JP2019114500A (en) | connector | |
| JP6151517B2 (en) | connector | |
| JP2023023054A (en) | connector | |
| JP2018014180A (en) | connector |