TWI444295B - Tool of de-bonding and method for separating a thin-film from a substrate - Google Patents

Description

Debonder and method for separating film from substrate

The invention relates to a debonder and a method for separating a film, in particular to a debonder for separating a film from a substrate and a method for separating the film from the substrate.

With the advancement of technology, liquid crystal displays often contain many functional films with different functions to improve the display performance of liquid crystal displays. In the conventional functional film manufacturing method, when the functional film is manufactured, the upper and lower surfaces thereof are adhered to the substrate, and in order to take out the functional film, a debinding process is required to The functional film is separated from the substrate to obtain a functional film.

The traditional debonding method is to directly cut the wire into the adhesive surface between the functional film and the substrate, and then directly sweep the entire adhesive surface to separate the functional film from the substrate. However, such membrane separation methods often have the following problems:

1. Debonding surface changes from one side to two sides

In the early days, the functional film was made on the substrate, and the debonded surface (adhesive surface) had only one side. At present, it has been developed to have two sides of the debonding surface, that is, the functional film is adhered to the upper and lower sides of the substrate, so it is necessary to first debond the substrate and then debond the lower substrate.

2. Debonding line entry affects the sealing of the plastic frame

In the past, the substrate can be deformed so that the wire of the debonder can be adhered to the substrate and cut into the debonding surface between the substrate and the functional film. However, it has been found that when the substrate is deformed, the sealing of the frame seal is affected, and With the large size of the panel (G1--->G5), it is quite difficult to operate the wire directly to the surface of the large-sized substrate and directly into the line.

In view of the above, the present invention provides a debonder for separating a film from a substrate, the film is adhered to the substrate by an adhesive surface, and the debonder comprises a spreader, a thin blade and a wire. The expansion member has a first side and a second side. The thin blade has a blade surface and a non-blade surface, and the thin blade is connected to the first side of the expansion member by a non-blade surface, and moves in the first direction by the blade surface. The wire extends in the first direction and is disposed on the second side of the expansion member. When the thin blade moves in the first direction, the blade surface is cut between the film and the substrate along the edge of the bonding surface, and the film is separated from the substrate by the opening member, and the wire enters between the film and the substrate through the gap, and then the wire is The film is separated from the substrate by moving it perpendicular to the first direction and sweeping across the adhesive surface.

In addition, the present invention also provides a method for separating a film from a substrate, the film being adhered to the substrate by an adhesive surface, the method comprising: providing a blade surface; and cutting the blade surface from the edge of the adhesive surface in the first direction Between the film and the substrate; stretching the film and the substrate at the edge of the adhesive surface to separate the two; guiding a wire so that the wire enters between the film and the substrate through the gap; and moving the wire perpendicular to the first direction And the wire is swept over the adhesive surface.

In summary, unlike the prior art, the present invention utilizes a thin blade to guide the wire to cut into the adhesive surface between the film and the substrate, thereby effectively improving the problems caused by the direct entry method of the prior art.

Please refer to FIG. 1 to FIG. 3 , which are respectively a schematic diagram (1), a schematic diagram (2) and a schematic diagram (3) of the first embodiment of the present invention, and discloses a debonder 10 for separating the film 79 from the substrate 71. The film 79 is adhered to the substrate 71 with an adhesive surface 791. The debonder 10 includes a spreader 11, a thin blade 12, and a wire 13. The expansion member 11 has a first side 111 and a second side 112. The thin blade 11 has a blade surface 121 and a non-blade surface 122. The thin blade 12 is coupled to the first side 111 of the expansion member 11 by a non-blade surface 122 and moves in the first direction 91 by the blade surface 121. The wire 13 extends in the first direction 91 and is disposed on the second side 112 of the expansion member 11. When the thin blade 12 moves along the first direction 91, the blade surface 121 is cut between the film 79 and the substrate 71 along the edge of the adhesive surface 791, and the film 79 is separated from the substrate 71 by the expansion member 11, and the wire 13 is separated by the gap. It enters between the film 79 and the substrate 71. After the wire 13 is moved in the third direction 93 perpendicular to the first direction 91 and swept past the adhesive surface 791, as shown in FIG. 4, the film 79 can be separated from the substrate 71.

Referring again to FIG. 1 , the debonder 10 further includes a wire guide 14 disposed on the second side 112 of the expansion member 11 for fixing the wire 13 . In addition, the wire guide 14 further includes a first fixing portion 141 and a second fixing portion 142. The second fixing portion 142 is disposed at a second distance from the first fixing portion 141 along the second direction 92. The second direction 92 and the second portion One direction 91 clips an angle that is in the range of 45 degrees to 135 degrees.

One of the important points of this embodiment is that the blade surface 121 of the thin blade 12 is cut between the film 79 and the substrate 71, and then the wire 13 is guided into the gap it cuts. Since the substrate 71 is slightly elastic, the thin blade 12 can apply a certain pressure to the substrate 71 to make it slightly curved, as shown in FIG. 5, which further helps the thin blade 12 to smoothly cut between the film 79 and the substrate 71. Debonding.

In addition, referring to FIG. 5 , in another embodiment, the film 79 is adhered to the substrate 72 by the adhesive surface 792 in addition to the substrate 71 . In the figure, the substrate 71 and the substrate 72 are in a misaligned relationship, which contributes to the easy entry of the thin blade 12 through the more prominent portions on both sides during the automated manufacturing process. In this embodiment, the thin blade 12 is cut between the film 79 and the substrate 71 in the first direction, and then the wire 13 is swept across the entire adhesive surface 791 in the direction of the vertical plane; then, in the same manner along the first direction 91 The opposite direction is cut between the film 79 and the substrate 72, and then the wire 13 is swept across the entire adhesive surface 792 in the direction of the vertical plane, so that the film 79 can be separated from the substrate 71 and the substrate 72. In this embodiment, the film 79 may be a single layer film, or may be a functional film having a plurality of layers of film stacked, and the substrate 71 may be a glass substrate, a flexible substrate or other plate.

Please refer to FIG. 6 , which is a flow chart of a method for separating a film from a substrate according to the present invention. The film is adhered to a substrate by an adhesive surface, and the method flowchart includes:

Step S01: providing a facet.

The blade face of this step can be supplied through a thin blade.

Step S02: cutting the film into the film and the substrate.

In this step, the blade surface of step S01 is cut into the film and the substrate from the edge of the adhesive surface in the first direction.

Step S03: Opening the film and the substrate at the edge of the adhesive surface.

After the blade is cut between the film and the substrate, the film is separated from the substrate by a slit.

Step S04: guiding the wire into between the film and the substrate.

The lead material is such that the wire enters between the film and the substrate by the gap defined by the expansion member.

Step S05: Sweep the wire over the adhesive surface.

The wire is moved perpendicular to the first direction, and the wire is swept across the adhesive surface to separate the film from the substrate.

In addition, in step S04, the wire comprises a cutting segment and a first bending segment, one end of the cutting segment is connected to the first bending segment, and the wire is swept across the bonding surface by the cutting segment. In one embodiment, the first bend segment is curved such that the angle between the bend and the cut segment is in the range of 45 to 135 degrees. This design is to avoid interference between the fixing mechanism of the wire and the thin blade. The reason is that the wire has been contaminated after being scraped through the adhesive surface. Therefore, in the process of automatic production, the contaminated wire must be taken up through the winding mechanism and brought into the clean. Line. The wire can be connected to the external winding mechanism through the first bending section and maintain the cutting section and the thin blade in the path in the first direction. In another embodiment, the wire further comprises a second bending section, and the second bending section is connected to the other end of the cutting section, and the angle with the cutting section is also in the range of 45 degrees to 135 degrees. .

While the present invention has been described in its preferred embodiments, it is not intended to limit the scope of the invention, and various modifications and changes can be made without departing from the spirit and scope of the invention. As explained above, various modifications and variations can be made without departing from the spirit of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

10. . . Debonder

11. . . Propping piece

111. . . First side

112. . . Second side

12. . . Thin blade

121. . . Blade face

122. . . Non-faceted

13. . . Wire

131. . . Cutting section

132. . . First curved section

14. . . Lead frame

141. . . First fixed part

142. . . Second fixed part

71. . . Substrate

72‧‧‧Substrate

79‧‧‧film

791‧‧‧Adhesive surface

792‧‧‧Adhesive surface

91‧‧‧First direction

92‧‧‧second direction

93‧‧‧ third direction

Figure 1 is a schematic view (1) of a first embodiment of the present invention.

Figure 2 is a schematic view (2) of the first embodiment of the present invention.

Figure 3 is a schematic view (3) of the first embodiment of the present invention.

Figure 4 is a schematic view (4) of the first embodiment of the present invention.

Figure 5 is a schematic view (5) of the first embodiment of the present invention.

Figure 6 is a flow chart of the method for separating a film from a substrate according to the present invention.

10. . . Debonder

11. . . Propping piece

111. . . First side

112. . . Second side

12. . . Thin blade

121. . . Blade face

122. . . Non-faceted

13. . . Wire

131. . . Cutting section

132. . . First curved section

14. . . Lead frame

141. . . First fixed part

142. . . Second fixed part

71. . . Substrate

79. . . film

91. . . First direction

Claims (8)

A debonding device for separating a film from a substrate, the film is adhered to the substrate by an adhesive surface, the debonding device comprises: a stretching member having a first side and a second side; a thin blade a blade having a non-blade surface coupled to the first side of the expansion member, the thin blade being moved in the first direction by the blade surface; and a wire along the first a direction extending to be disposed on the second side of the expansion member; wherein, when the thin blade moves in the first direction, the blade surface is cut between the film and the substrate along an edge of the adhesive surface, and the support is supported by the support Opening the film to form a gap between the film and the substrate, the wire entering the film and the substrate through the gap, and then the film is swept across the adhesive surface perpendicular to the first direction to make the film Separated from the substrate. The debonder of claim 1, further comprising: a wire guide disposed on the second side of the expansion member for fixing the wire. The debonder of claim 2, wherein the wire guide further comprises: a first fixing portion; and a second fixing portion disposed at a second distance from the first fixing portion along a second direction The second direction is at an angle to the first direction. The debonder of claim 3, wherein the angle is in the range of 45 degrees to 135 degrees. A method for separating a film from a substrate, the film being adhered to the substrate by an adhesive surface, the method comprising: providing a blade surface; cutting the film and the substrate from an edge of the bonding surface in a first direction Opening the film at the edge of the adhesive surface and the substrate so as to be separated by a gap; guiding a wire through the gap into the film and the substrate; and moving in a direction perpendicular to the first direction The wire is swept over the adhesive surface. The method for separating a film from a substrate according to claim 5, wherein the wire comprises a cutting segment and a first bending segment, one end of the cutting segment is connected to the first bending segment, and the wire is scanned by the cutting segment And the method further comprises: bending the first bending section to make an angle with the cutting section. A method of separating a film from a substrate according to claim 6, wherein the angle is in the range of 45 to 135 degrees. The method for separating a film from a substrate according to claim 5, wherein the wire further comprises a second bending segment connected to the other end of the cutting segment, the angle between the second bending end and the cutting segment being 45 In the range of 135 degrees.