TWI442608B - - Google Patents

Info

Publication number
TWI442608B
TWI442608B TW100123147A TW100123147A TWI442608B TW I442608 B TWI442608 B TW I442608B TW 100123147 A TW100123147 A TW 100123147A TW 100123147 A TW100123147 A TW 100123147A TW I442608 B TWI442608 B TW I442608B
Authority
TW
Taiwan
Application number
TW100123147A
Other versions
TW201301588A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW100123147A priority Critical patent/TW201301588A/zh
Priority to US13/348,792 priority patent/US20130001630A1/en
Publication of TW201301588A publication Critical patent/TW201301588A/zh
Application granted granted Critical
Publication of TWI442608B publication Critical patent/TWI442608B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H01L33/42—Transparent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
TW100123147A 2011-06-30 2011-06-30 大發光面積的發光二極體晶粒及其封裝結構 TW201301588A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100123147A TW201301588A (zh) 2011-06-30 2011-06-30 大發光面積的發光二極體晶粒及其封裝結構
US13/348,792 US20130001630A1 (en) 2011-06-30 2012-01-12 Light-emitting diode structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100123147A TW201301588A (zh) 2011-06-30 2011-06-30 大發光面積的發光二極體晶粒及其封裝結構

Publications (2)

Publication Number Publication Date
TW201301588A TW201301588A (zh) 2013-01-01
TWI442608B true TWI442608B (zh) 2014-06-21

Family

ID=47389686

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100123147A TW201301588A (zh) 2011-06-30 2011-06-30 大發光面積的發光二極體晶粒及其封裝結構

Country Status (2)

Country Link
US (1) US20130001630A1 (zh)
TW (1) TW201301588A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI523269B (zh) * 2012-03-30 2016-02-21 晶元光電股份有限公司 發光元件

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE525755T1 (de) * 2001-10-12 2011-10-15 Nichia Corp Lichtemittierendes bauelement und verfahren zu seiner herstellung
US8283683B2 (en) * 2006-11-07 2012-10-09 Opto Tech Corporation Chip-bonding light emitting diode chip
JP5047013B2 (ja) * 2008-03-12 2012-10-10 株式会社東芝 半導体発光素子及びその製造方法
DE102009018603B9 (de) * 2008-04-25 2021-01-14 Samsung Electronics Co., Ltd. Leuchtvorrichtung und Herstellungsverfahren derselben

Also Published As

Publication number Publication date
US20130001630A1 (en) 2013-01-03
TW201301588A (zh) 2013-01-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees