TWI441298B - Chip on flexible printed circuit type semiconductor package - Google Patents

Description

Chip-type semiconductor package on flexible printed circuit board

This invention relates to semiconductor packages, and more particularly to wafer-type semiconductor packages on flexible printed circuit boards.

Various semiconductor packages have been developed due to the demand for highly integrated integrated circuit (IC) drivers that can drive liquid crystal display (LCD) panels after bonding. In general, a Tape Carrier Package (TCP), a Chip On Glass (COG), and a Chip On Flexible Printed Circuit (COF) can be used to drive an LCD. The semiconductor package of the panel. Since the 1980s, TCP-type semiconductor packages have been used to drive high-resolution screen displays. The TCP type semiconductor package is one of the semiconductor package methods commonly used in the field of LCDs. However, TCP-type semiconductor packages may have higher production costs and/or their productivity is not comparable to cost.

Therefore, TCP type semiconductor packages have been replaced by COF type semiconductor packages, and the application of COF type semiconductor packages in the field of LCDs is increasing. COF-type semiconductor packages are used as LCD IC drivers to accommodate IC drivers that are downsized and/or operating at higher speeds.

Recently, in order to realize a higher resolution display device (for example, an LCD panel), the driving load of the IC driver also increases as the driving frequency of the television and the screen display increases from 60 Hz to 120 Hz.

In one embodiment, a flexible printed circuit board (COF) half The conductor package can include a flexible film, a semiconductor IC wafer on the flexible film, and a heating pad on the flexible film.

In another embodiment, a flexible printed circuit board (COF) semiconductor package can include: a flexible film, a semiconductor IC wafer on the flexible film, and a heating pad on the semiconductor IC wafer and the flexible film. Wherein the heating pad includes a slot corresponding to a corner edge of the semiconductor IC chip.

In one embodiment, a flexible printed circuit board (COF) semiconductor package can include a flexible film, a semiconductor IC wafer on a flexible film, and a heated pad including a slot on the flexible film.

In an embodiment, the COF-type semiconductor package can regulate or dissipate excess heat.

It will be understood that when an element or layer is referred to as "on", "connected to" or "coupled" to another element or layer, it may be directly connected to another element or layer Or coupled to another element or layer or there may be an intervening element or layer. In contrast, when an element is referred to as being "directly on", "directly connected" or "directly connected" to another element or layer, the element or layer is not present. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items. It will be understood that when an element or layer is referred to as "on", "connected to" or "coupled" to another element or layer, "directly" or "directly" When it is "directly coupled" to another element or layer, it can be above, below or to the side of the element or layer.

It will be appreciated that, although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, such elements, components, regions, layers and/or sections It should not be limited by these terms. The terms may be used to distinguish one element, component, region, layer or section from another region, layer or section. Thus, a first element, component, region, layer or section that is discussed below may be referred to as a second element, component, region, layer or section, without departing from the teachings of the invention.

For ease of description, spatially related terms (such as "under", "below", "lower", "above", "upper", and the like) may be used herein to describe as in the drawings. The relationship between one element or feature described in the specification and another (other) element or feature. It will be appreciated that spatially relative terms may be intended to encompass different orientations of the device in use or in operation in addition to the orientation depicted in the drawings. For example, an element that is "under" or "beneath" or "an" or "an" Thus, the example term "below" can encompass the orientation above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatial relationship descriptors are used herein to interpret accordingly

The terminology used herein is for the purpose of describing the embodiments and is not intended to be limiting. As used herein, the singular forms "" In addition, the term "comprising", when used in the specification, indicates the presence of the features, integers, steps, operations, components and/or components, but does not exclude one or more other features, integers, steps, Operation, components, The existence of components and/or their groups.

Embodiments may be described herein with reference to cross-sectional illustrations that may be illustrative of the preferred embodiments (and intermediate structures). Accordingly, variations from the shapes of the descriptions are contemplated as a result of, for example, the manufacturing techniques and/or tolerances. Thus, the examples are not to be construed as limited to the particular shapes of the embodiments described herein. Therefore, the regions illustrated in the figures are illustrative in nature and are not intended to illustrate the actual shape of the region of the device and are not intended to limit the embodiments.

All terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art, unless otherwise defined. In addition, it should be understood that the terms such as the terms defined in the commonly used dictionary should be interpreted as having a meaning consistent with their meaning in the context of the related art and should not be construed as idealized unless clearly defined as such. Or too formal meaning.

1 may be a cross-sectional view of a flexible printed circuit board (COF) type semiconductor package 1 having a heating pad 20 in accordance with an embodiment. Referring to FIG. 1, a COF-type semiconductor package 1 may include a semiconductor IC wafer 18 disposed on a flexible film 11. The flexible film 11 may include a lower insulating layer 10, a lead layer 12, and/or a surface insulating layer 14. For example, the lower insulating layer 10 may be a polyimide, the lead layer 12 may be copper, and the surface insulating layer 14 may be a surface resist layer. In the horizontal direction, a plurality of lead layers 12 may be disposed on the lower insulation 10 separately from each other and the inner ends of the wiring layers 12 may be disposed to be concentrated in the central region. Surface insulating layer 14 can be covered The lead layer 12 is exposed and the inner end of the lead layer 12 is exposed.

In the region between the semiconductor IC wafer 18 and the flexible film 11, an underfill 16 may be provided to reinforce the semiconductor IC wafer 18 and the flexible film 11.

The heating pad 20 may be attached to the insulating layer 10 under the flexible film 11 by a bonding layer 21 (for example, an adhesive layer based on acrylic) including a conductive material. The heat generated from the semiconductor IC wafer 18 may be diverged by the heating pad 20 after passing through the underfill 16, the wiring layer 12, and/or the lower insulating layer 10. In an embodiment, the conductivity of the heating pad 20 is higher than the conductivity of the lower insulating layer 10. For example, the heating pad 20 may be made of a metallic material such as aluminum or the like. In order to increase heat resistance, the adhesive layer 21 may be disposed between the heating pad 20 and the lower insulating layer 10. The bonding layer 21 may include a conductive material such as metal particles and/or metal balls. The bonding layer 21 may include aluminum particles or balls.

Referring to Figures 1 and 3, the shape of the heating pad 20 can be rectangular. In the fabrication of the COF-type semiconductor package 1, a plurality of semiconductor IC wafers 18 can be disposed on a single wide range of flexible films. The entire flexible film can be transported to a device for cutting individual COF-type semiconductor packages 1 before cutting each individual COF-type semiconductor package 1 from a wide range of flexible films. However, it is impossible to transport the entire wide range of flexible films. That is, it may be necessary to wind the flexible film into a roll. The flexible film can be unrolled after the wound flexible film is delivered to a suitable device, and then the individual COF-type semiconductor package 1 can be cut from the flexible film. However, as indicated by the arrow in Fig. 3, when the flexible film is repeatedly wound and unfolded, a force is concentrated on the edge of the heating pad 20, as indicated by "A" in Fig. 1. These effects may cause the corners of the heating pad 20 to separate from the flexible film.

In the embodiment illustrated in Figure 4, the corners of the heating pad 20A can be wedge-shaped or beveled. For example, the corners can be chamfer cut. In the case where the corner is wedge-shaped, the above-described force generated for the corner of the heating pad 20A can be substantially reduced. As can be seen from Figure 4, the force represented by the arrow can be reduced by the bevel corner. Therefore, even if the flexible film 11 is wound before being conveyed to the cutting device, the heating pad 20A may remain attached to the insulating layer 10 under the flexible film 11.

In another embodiment as illustrated in Figure 5, the corners of the heating pad 20B may be wedge shaped, but not beveled, and the corners may be rounded. Therefore, as can be seen from Figure 5, the force as represented by the arrow can be reduced by rounding the corners. Therefore, even if the flexible film 11 is wound to be conveyed to the cutting device, the heating pad 20B may remain attached to the insulating layer 10 under the flexible film 11.

2 is a cross-sectional view of a COF-type semiconductor package 1 having a heater pad 20 in accordance with another embodiment. Referring to FIG. 2, the COF type semiconductor package 1 may include a semiconductor IC wafer 18 disposed on the flexible film 11. The flexible film 11 may include a lower insulating layer 10, a wiring layer 12, and/or a surface insulating layer 14. For example, the lower insulating layer 10 may be polyimide, the lead layer 12 may be copper, and the surface insulating layer 14 may be a surface resist layer. The semiconductor IC wafer 18 can be attached to the exposed portion of the lead layer 12. In the region around the semiconductor IC wafer 18, an underfill 16 may be provided to reinforce the semiconductor IC wafer 18 and the flexible film 11. For example, an anisotropic conductive film (ACF) or a non-conductive paste (Non-Conductive Paste, NCP) can be used as the underfill 16 .

Unlike the embodiment of FIG. 1, the heater pad 20 can be disposed on the semiconductor IC wafer 18. In order to improve heat resistance, the bonding layer 21 may be disposed between the heating pad 20 and the IC wafer 18. The bonding layer 21 may include conductive particles, such as metal particles and/or metal balls, as shown in FIG.

As noted above, a flexible film having a plurality of semiconductor IC wafers 18 can be wound into a roll and transported to a suitable cutting device. When the flexible film is repeatedly wound and unfolded, the force may be concentrated on the heating pad 20 at "B" and "C" as illustrated in FIG. The force at "B" and "C" can cause the heating pad 20 to peel off the semiconductor IC wafer 10 or tear at such locations.

As illustrated in Figures 6A and 6B, in order to reduce the stress at "B", the heating pads 20C and 20D may include slots 52A and 52B, respectively. The slots 52A, 52B may correspond to the corners 20C and 20D of the heating pads located on the semiconductor IC wafer 18. The slots 52A, 52B may be indented notches in the heating pads 20C and 20D. The slots 52A, 52B may be of various shapes and sizes. As illustrated in Figure 6A, the slot 52A can be "L" shaped. As illustrated in Figure 6B, the slot 52B can be in the shape of an "L" having a rounded corner.

In other embodiments illustrated in Figures 7A and 7B, individually, the heating pad 20A having a beveled corner may have a slot 52A, or the heating pad 20A having a beveled corner may have a slot 52B. In other embodiments illustrated in Figures 8A and 8B, individually, the heating pad 20B having rounded corners may have slots 52A, or the heating pad 20B having rounded corners may have slots 52B. Embodiments such as the embodiments illustrated in Figures 7-8 may be reduced The force at "B" and "C" as illustrated in Figure 2 is small. It will be appreciated by those skilled in the art that the heating mat and/or slot can be of other shapes and sizes in other embodiments.

9 through 10 illustrate other embodiments. Referring to FIG. 10, the COP type semiconductor package 1 can be connected to a display panel board 26. Display panel 26 may be an LCD panel.

As illustrated in FIG. 10, the COF-type semiconductor package 1 may include a semiconductor IC wafer 18 disposed on the flexible film 11. The flexible film 11 may include: a lower insulating layer 10; a wiring layer 12; and/or a surface insulating layer 14. For example, the lower insulating layer 10 may be polyimide, the lead layer 12 may be copper, and the surface insulating layer 14 may be a surface resist layer.

In the region between the semiconductor IC wafer 18 and the flexible film 11, an underfill 16 may be provided to reinforce the semiconductor IC wafer 18 and the flexible film 11.

The heating pad 20 can be attached to the insulating layer 10 under the flexible film 11 by the adhesive layer 21. The heat generated from the semiconductor IC wafer 18 may be dissipated by the heating pad 20 after passing through the underfill 16, the wiring layer 12, and the lower insulating layer 10. In order to increase heat resistance, the adhesive layer 21 may be disposed between the heating pad 20 and the lower insulating layer 10. The bonding layer 21 may include a conductive material such as metal particles and/or metal balls.

When the COF-type semiconductor package 1 is attached to the display panel 26 via the bonding member 24, the heating pad 20 can be bent at "D". The bending of the heating pad 20 may cause a force at "D" which may cause the heating pad 20 to be separated from the insulating layer 10 below the flexible film 11, or separate from the bonding layer 21.

To reduce stress at "D", the heating pad 20 can include a slot 82. narrow The slots 82A can be completely disposed within the heating pad 20C (as illustrated in Figure 9A), or the slots 82B can be recesses (as illustrated in Figure 9B) disposed at the edges (e.g., opposite edges). It will be appreciated by those skilled in the art that the shape, size and location of the slots are contemplated within the scope of the embodiments.

11 is a cross-sectional view of a COF-type semiconductor package 1 in accordance with other embodiments. Compared to FIG. 1, the lower reinforcing member 120 can be attached to the lower heating pad 20 of FIG. 1 via the adhesive 121. Detailed descriptions of the same elements as in Fig. 1 are omitted.

Referring to Fig. 11, a lower reinforcing member 120 may be formed on the lower heating pad 20 to improve the adhesion thereof using the adhesive 121. As shown in FIG. 11, a portion of the lower reinforcement member 120 can cover the lower heating pad 20. The other portion of the lower reinforcing member 120 can be extended and adhered to the lower surface of the flexible film 11. The width of the lower reinforcing member 120 may be greater than the width of the lower heating pad 20 to sufficiently cover the lower heating pad 20, thereby enhancing adhesion.

The lower reinforcing member 120 may be made of a flexible film, for example, a flexible film mainly composed of polyimide. The adhesive 121 used may be the same as the adhesive 21 disposed between the heating pad 20 and the flexible film 11. For example, an acrylic-based bonding material can be used as the bonding agent 121. The binder 121 may include particles of a smaller size or a conductive particle of a metal ball, for example, aluminum particles or balls therein.

In other embodiments, the lower reinforcement member 120 may be made of an opaque or colored material that reduces light reflection to facilitate image recognition in an Outer Lead Bonding (OLB) process.

FIG. 12 is a cross-sectional view of a COF semiconductor package 1 according to other embodiments. view. Compared to FIG. 2, the upper reinforcing member 122 can be attached to the upper heating pad 22 via the adhesive 121, similar to FIG. A detailed description of the same elements as in FIG. 2 is omitted.

Referring to Fig. 12, an upper reinforcing member 122 may be formed on the upper heating pad 22 to use the adhesive 121 to enhance its adhesion. As shown in FIG. 12, a portion of the upper reinforcing member 122 may cover the upper heating pad 22 and another portion of the reinforcing member 122 may extend and adhere to the upper surface of the flexible film 11, that is, adhere to the surface of the surface insulating layer 14. The width of the reinforcing member 122 can be greater than the width of the upper heating pad 22 to cover the upper heating pad 22, thereby increasing adhesion.

The upper reinforcing member 122 may be made of a flexible film, for example, a flexible film mainly composed of polyimide. It is possible to use the same adhesive 121 as the adhesive 21 disposed between the heating pad 22 and the flexible film 11. For example, a bonding material mainly composed of acrylic acid may be used as the bonding agent 121. The binder 121 may include metal particles of a conductive material or smaller metal balls, such as aluminum particles or balls therein.

The upper stiffening member 122 may be made of an opaque or colored material that reduces the reflection of light to enhance image recognition in an external wire bonding (OLB) process.

The foregoing description may be illustrative of the embodiments but not limited to the embodiments. While the embodiment has been described, it will be understood by those skilled in the art that many modifications may be made in the novel teachings and embodiments without departing from the spirit of the embodiments. For example, the heating pad 20 can be formed under and above the flexible film 11 at the same time, and the reinforcing members 120 and 122 can also be simultaneously in the flexible film. 11 is formed below and above. Accordingly, all such modifications are intended to be included within the scope of the appended claims.

1‧‧‧Flexible Printed Circuit Board (COF) semiconductor package

10‧‧‧Lower insulation

11‧‧‧Flexible film

12‧‧‧ lead layer

14‧‧‧Surface insulation

16‧‧‧Bottom packing

18‧‧‧Semiconductor IC chip

20‧‧‧heating mat

20A‧‧‧heating mat

20B‧‧・heating mat

20C‧‧‧heating mat

20D‧‧‧heating mat

21‧‧‧Bonded layer

22‧‧‧Upper heating mat

24‧‧‧bonded parts

26‧‧‧ display panel

52A‧‧ slot

52B‧‧‧ slot

82‧‧‧ slot

82A‧‧ slot

82B‧‧‧ slot

120‧‧‧ Lower reinforcement parts

121‧‧‧Adhesive

122‧‧‧Upper reinforcement

The above-described features and other features of the embodiments may be apparent from the following detailed description.

1 is a cross-sectional view of a COF-type semiconductor package with a heater pad in accordance with an embodiment.

2 is a cross-sectional view of a COF-type semiconductor package with a heater pad in accordance with another embodiment.

3 to 5 are schematic views of a heating pad according to an embodiment.

6A-8B are schematic illustrations of a heated pad having a slot, in accordance with an embodiment.

9A and 9B are schematic views of a heated pad having a slot in accordance with other embodiments.

10 is a schematic diagram of a COF-type semiconductor package attached to a display panel, in accordance with an embodiment.

11 is a cross-sectional view of a COF-type semiconductor package having a stiffening feature adhered to the heating pad of FIG. 1 in accordance with an embodiment.

12 is a cross-sectional view of a COF-type semiconductor package having a stiffening feature adhered to the heating pad of FIG. 2, in accordance with an embodiment.

1‧‧‧Flexible Printed Circuit Board (COF) semiconductor package

10‧‧‧Lower insulation

11‧‧‧Flexible film

12‧‧‧ lead layer

14‧‧‧Surface insulation

16‧‧‧Bottom packing

18‧‧‧Semiconductor IC chip

20‧‧‧heating mat

21‧‧‧Bonded layer

Claims (31)

A flexible printed circuit board (COF) type semiconductor package comprising: a flexible film; a semiconductor IC chip on the flexible film; a heating pad on the flexible film; and reinforcement on the heating pad A component, wherein the heating pad is between the semiconductor IC wafer and the reinforcing member. The flexible printed circuit board (COF) type semiconductor package of claim 1, wherein the heating pad has a rectangular shape and a corner of the heating pad is beveled. The flexible printed circuit board (COF) type semiconductor package of claim 1, wherein the heating pad has a rectangular shape and the corner of the heating pad is rounded. The flexible printed circuit board (COF) type semiconductor package of claim 1, further comprising a bonding layer between the heating pad and the flexible film. The flexible printed circuit board (COF) type semiconductor package of claim 4, wherein the bonding layer comprises metal particles. The flexible printed circuit board (COF) type semiconductor package of claim 1, wherein the flexible film comprises a lower insulating layer, a wiring layer, and a surface insulating layer. The flexible printed circuit board (COF) type semiconductor package of claim 6, wherein the lower insulating layer comprises a polysilicon The amine, the lead layer comprises copper, and the surface insulating layer comprises a surface resist layer. The flexible printed circuit board (COF) type semiconductor package of claim 6, wherein the heating pad is more conductive than the lower insulating layer. The flexible printed circuit board (COF) type semiconductor package of claim 1, wherein the heating pad is located on the semiconductor IC chip and the flexible film, and the heating pad comprises a semiconductor IC corresponding to the semiconductor IC A slot at the corner edge of the wafer. The flexible printed circuit board (COF) type semiconductor package of claim 9, wherein the slot has an "L" shape. The flexible printed circuit board (COF) type semiconductor package of claim 9, wherein the heating pad has a rectangular shape and a corner of the heating pad is beveled. The flexible printed circuit board (COF) type semiconductor package of claim 9, wherein the heating pad has a rectangular shape and the corner of the heating pad is rounded. The flexible printed circuit board (COF) semiconductor package of claim 9, further comprising a bonding layer between the heating pad and the semiconductor IC wafer. The flexible printed circuit board (COF) type semiconductor package of claim 1, wherein the heating pad comprises a first slot corresponding to a corner edge of the semiconductor IC chip. The flexible printed circuit board (COF) type semiconductor package of claim 14, wherein the first slot is located in the heating Within the boundaries of the mat. The flexible printed circuit board (COF) type semiconductor package of claim 14, wherein the first slot is located at a boundary of the heating pad. The flexible printed circuit board (COF) type semiconductor package of claim 14, wherein the heating pad is on the semiconductor IC wafer, and the heating pad comprises a corner edge corresponding to the semiconductor IC chip. The second slot. The flexible printed circuit board (COF) type semiconductor package of claim 14, wherein the heating pad has a rectangular shape and a corner of the heating pad is beveled. The flexible printed circuit board (COF) type semiconductor package of claim 14, wherein the heating pad has a rectangular shape and the corner of the heating pad is rounded. The flexible printed circuit board (COF) type semiconductor package of claim 1, wherein the heating pad is made of a metal material containing aluminum. The flexible printed circuit board (COF) type semiconductor package of claim 1, wherein a portion of the reinforcing member covers the heating pad, and another portion of the reinforcing member extends over the flexible film. The flexible printed circuit board (COF) type semiconductor package according to claim 1, wherein the reinforcing member is a flexible film mainly composed of polyimide. The flexible printed circuit board as described in claim 1 A wafer (COF) type semiconductor package in which the reinforcing member is made of an opaque material. The flexible printed circuit board (COF) type semiconductor package of claim 1, wherein the reinforcing member is made of a colored material. The flexible printed circuit board (COF) type semiconductor package of claim 1, further comprising a bonding layer, the bonding layer being disposed between the reinforcing member and the heating pad, and between the reinforcing member and the reinforcing member Metal particles between the flexible films. The flexible printed circuit board (COF) type semiconductor package of claim 9, wherein a portion of the reinforcing member covers the heating pad, and another portion of the reinforcing member extends and is located on the flexible film. . The flexible printed circuit board (COF) type semiconductor package of claim 9, wherein the reinforcing member comprises a flexible film mainly composed of polyimide. The flexible printed circuit board (COF) type semiconductor package of claim 9, wherein the reinforcing member is made of an opaque material. The flexible printed circuit board (COF) type semiconductor package of claim 9, wherein the reinforcing member is made of a colored material. The flexible printed circuit board (COF) type semiconductor package of claim 9, further comprising a bonding layer, the bonding The layer includes metal particles between the reinforcing member and the heating pad and between the reinforcing member and the flexible film. A display panel comprising: the COP-type semiconductor package of claim 14, wherein the flexible layer is connected to the display panel.