TWI438863B - Stage unit for a probe station and apparatus for testing a wafer including the same - Google Patents

Description

Probe platform unit and wafer test device including the same

The embodiments of the present invention relate to an inspection apparatus for supporting a platform unit of a wafer, having a platform unit for supporting a wafer, and more particularly, the temperature of a platform unit is based on The temperature of one of the wafers in the inspection program is changed, and the temperature of the platform unit is changed according to the temperature range of the wafer in the inspection program.

In general, an integrated circuit device is fabricated on a semiconductor substrate (eg, a wafer) so that a plurality of wafers can be fabricated on a wafer during a manufacturing process to provide a semiconductor device. . An electrical inspection procedure is performed on the entire wafer having a plurality of wafers by a die sorting process. Each of the die is cut from the wafer and assembled with a lead frame, whereby a semiconductor device (for example, a memory device) can be fabricated.

An inspection system having a probe device and a tester is typically used to perform inspection procedures on wafers of wafers. The power and various test signals can be applied to one of the contact pads of the wafer by contacting the terminal system via one of the probe devices by the tester, and the output signal generated by one of the electrodes of the wafer can be tested by Detection and analysis. When a particular output signal is out of an allowable range, the tester measures the wafer from which the particular output signal is produced and defines it as a defective wafer.

The probe device is often subjected to inspection procedures under various inspection conditions and various use requirements of each wafer. For example, the wafer on the wafer can be inspected at a temperature ranging from about 40 ° C to 150 ° C or from about -60 ° C to -200 ° C. In order to control the wide temperature range described above, it is common to use a heater or a cooler in the probe device to heat or cool the platform unit.

For example, a high temperature check procedure can be performed immediately after a low temperature check procedure is completed. During the low temperature check procedure, the chiller provides a coolant to the platform unit to reduce the temperature of a wafer chuck. After the temperature of the wafer chuck is reduced, heat is supplied to the platform unit by the heater, thus performing a high temperature inspection procedure. However, since the heat is supplied to the platform unit, the liquefied coolant for performing the low temperature inspection process is evaporated in the platform unit, thereby causing the evaporated coolant to be discharged outward from the platform unit. In addition, one of the remaining portions of the coolant can be maintained in a supply route, and the residual portion of the coolant can be supplied to the platform unit without arrangement, thereby allowing the heated platform unit to have a non- Uniform temperature distribution.

The illustrated embodiment provides a platform unit that can have a uniform temperature for one wafer chuck of the platform unit, regardless of a high temperature inspection procedure and a low temperature inspection procedure in an inspection system.

The illustrated embodiment provides an inspection system having one of the above platform units.

In accordance with some of the embodiments listed in the concept of the present invention, these embodiments provide a platform unit for a probe station. The platform unit includes a wafer chuck, a pipeline route, a heating element and a heating block. A wafer is positioned over the wafer chuck and includes a flow path within the wafer chuck. The coolant flows through the pipeline path into the wafer chuck, thereby cooling the wafer chuck to a first temperature, the pipeline route is connected to the flow path of the wafer chuck, and the pipeline route includes a supply route and A discharge route, the supply route supplies coolant to the wafer chuck, and the discharge route discharges the coolant from the wafer chuck. The heating element is disposed in the wafer chuck and is used to heat the wafer chuck. The heating block is positioned adjacent to the wafer chuck. When the wafer chuck is changed to a second temperature via the first temperature, the heating block evaporates the remaining coolant remaining in the supply path by heat. The second temperature is above the first temperature via the heating element. In one of the illustrated embodiments, the heating block can include a heating coil and a shielding plate. The heating coil system can be positioned adjacent to the wafer chuck and surrounded for the supply path. The heat is generated by the heating coil, and the second residual coolant can be evaporated in the supply path, thereby preventing heat generated by the heating coil from being transferred outward. The platform unit further includes a controller for controlling the heating coil of the heating block, so that the heating block can be heated to a third temperature for a first time and can be second after one of the first time elapses. Time to cool the heating block to a fourth temperature lower than the third temperature, and the wafer chuck is heated to a second temperature, thereby reducing the heat caused by the heat generated by the heating block at the third temperature damage.

In accordance with some of the enumerated embodiments of the present inventive concept, these embodiments provide a device for inspecting a wafer. The device includes a chamber, a platform unit and a probe card unit. The chamber includes an inspection space, and the wafer is inspected in the inspection space of the chamber. The platform unit includes a wafer chuck, a pipeline route, a heating element and a heating block. The wafer chuck includes a flow path and supports the wafer, and a coolant flows through the pipeline to enter the wafer. The chuck, thereby cooling the wafer chuck to a first temperature, the pipeline route is connected to the flow path of the wafer chuck and the pipeline route includes a supply route and a discharge route, and the supply route supplies the coolant To the wafer chuck, the discharge route discharges the coolant from the wafer chuck, and the heating element is disposed in the wafer chuck for heating the wafer chuck, and the heating block is positioned adjacent to The wafer chuck, when the wafer chuck is changed to a second temperature via the first temperature, the heating block evaporates the remaining coolant remaining in the supply path by heat, and the second temperature is heated. The component is above the first temperature. The probe card unit is provided with a probe card for checking the wafer. In an exemplary embodiment, the heating block includes a heating coil and a shielding plate. The heating coil surrounds the supply path adjacent to the wafer chuck and heats the supply path. The shielding plate covers the heating coil and the supply path, thereby preventing heat generated by the heating coil from being transmitted to the outside. The platform unit further includes a controller for controlling the heating coil of the heating block, so that the heating block can be heated to a third temperature for a first time and can be second after one of the first time elapses. Time to cool the heating block to a fourth temperature lower than the third temperature, and the wafer chuck is heated to a second temperature, thereby reducing the heat caused by the heat generated by the heating block at the third temperature damage.

According to a partially enumerated embodiment of the concept of the present invention, when an inspection mode is changed to a high temperature inspection program via a low temperature inspection program, a residual coolant in a supply route can be performed in the supply route. evaporation. Therefore, the internal pressure of the supply route is increased, and the liquefied coolant can be completely prevented from flowing into a wafer chuck, thereby reducing the temperature variation of the wafer chuck and increasing the temperature uniformity of the wafer chuck.

The enumerated embodiments are described in detail below in conjunction with the drawings. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and the present invention can be modified and retouched without departing from the spirit and scope of the present invention. The scope of protection is subject to the definition of the scope of the patent application attached. For the sake of clarity, the dimensions and relative dimensions of the layers and regions in the drawings will be presented in an exaggerated manner.

It will be understood that the relationship between an element or layer and another element or layer is indicated as "on (one element or layer is on the other element or layer)", "connected to" When an element or layer or "coupled to" or "layer" or "layer" or "layer" or "layer" A layer may be directly connected to another element or layer, or an element or layer may be directly coupled to another element or layer, or an intermediate element or layer may be present. In contrast, when an element or layer is referred to as "directly on" or "directly connected to" or "directly connected to". When another element or layer "" or "directly coupled to" is used, it is meant that the element or layer is not present. The same elements are denoted by the same symbols throughout the text. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

It will be understood that although the first, second, third, etc. names may be used to describe various elements, parts, regions, layers and/or segments, these elements, parts, regions, layers and/or segments are not They are limited to these names, and these names are only used to make one element, one part, one area, one layer or one part with another element, another part, another area, another layer or another part. Separate between. One of the first elements, a first part, a first area, a first layer or a first section discussed below may be referred to as a second element, one without departing from the teachings of the present invention. a second part, a second area, a second layer or a second section.

For convenience of explanation, space-related names (for example: "beneath (below)", "below", "lower", "above", " Upper (on top of) and the like are used to describe one element or one appearance relationship in the drawings and another element or another appearance relationship. It will be understood that these spatially related names may be used to encompass different orientations of the device in use or operation, in addition to the orientations illustrated in the drawings. For example, if the device shown in the drawings is turned over, the description of the "plural component below the other component" or "the plural component is below the other component" or appearance will be changed to "plural" The component is located above the other components" or the appearance. Therefore, the "below" example name can include both the above (above...) and below (below). The device can be steered in other ways (rotating at 90 degrees or in other directions) and thus can be explained using spatially related descriptors.

The specific names used herein are for the purpose of describing particular embodiments, and are not intended to limit the invention. The singular forms "a", "an", "the" and "the" may also include the plural unless the words are clearly indicated. It will be further understood that the terms "comprises" and/or "comprising" are used in the specification to indicate the presence of the features, integers, steps, operations, components and/or parts. However, the existence or addition of one or more other features, elements, steps, operations, components, parts and/or their groups are not excluded.

With respect to the cross-sectional views of the embodiments, these cross-sectional views are schematic representations of the preferred embodiments (and intermediate structures), and thus variations in the shapes of the manufacturing techniques and/or tolerances are contemplated. . Therefore, the illustrated embodiments are not to be construed as limited to the particular shapes of the particular aspects depicted in the drawings and the. For example, an implanted area drawn in a rectangle typically has a fillet or curved appearance and/or a gradient of implant concentration on the edge of the rectangle, rather than in the implanted area to non-planted The inbound region produces a binary change. Similarly, under the action of a buried region formed by implantation, a partial implantation will occur in the region between the buried region and the surface through which the implantation takes place. Accordingly, the plural regions in the drawings are simply illustrated, and the shapes of these regions are not intended to depict the true shape of one of the regions of the device and are not intended to limit the scope of the invention.

All names (including technical names and scientific names) used herein are the same as those understood by those skilled in the art to which the invention pertains, unless otherwise defined. It will be further understood that the meanings of the names in the relevant technical text are defined by the meaning of having a consistent name in the general dictionary, and unless otherwise specified in the specification, these names are not suitable for use. Or define it in a way that is over-formal.

The enumerated embodiments are described in detail below in conjunction with the drawings. 1 shows a cross-sectional view of a platform unit 100 for a probe station in accordance with an embodiment of the present invention. Fig. 2 is a view showing the relationship between the temperature on the heating block of the stage unit 100 in Fig. 1 and the heating time.

Referring to FIG. 1 , a platform unit 100 according to a first embodiment of the present invention is used for a probe station. The platform unit 100 includes a wafer chuck 110 , a supply route 121 , a discharge route 123 and a The block 130 is heated. The wafer chuck 110 is used to support a wafer W. The supply path 121 supplies a coolant to the wafer chuck 110. The discharge route 123 is for discharging the coolant from the wafer chuck 110. The heating block 130 evaporates the remaining coolant remaining in the supply path 121.

In one embodiment, the wafer chuck 110 is formed in the shape of a wafer W, and the wafer W is stably positioned over the wafer chuck 110. For example, when the wafer W is formed in a disk shape, the wafer chuck 110 also has a disk-like shape. A plurality of wafer systems can be fabricated on the wafer W.

The wafer chuck 110 is movable in three different directions, such as an x direction, a y direction, and a z direction, and the wafer chuck 110 is rotatable relative to a central axis thereof. Therefore, the wafer chuck 110 can be coupled to a first driving unit (not shown) and a second driving unit (not shown), and the wafer chuck 110 can be along the x via the first driving unit. The direction, the y direction, and the z direction are linearly moved, and the wafer chuck 110 is rotatable via a second driving unit (not shown). The first drive unit may include a pneumatic cylinder, a hydraulic cylinder and a linear motor, and the second drive unit may include a generator using a screw and a bearing. The plurality of wafers of the wafer W located above the wafer chuck 110 are electrically connected to a plurality of tips (not shown) of a probe card (not shown).

A flow path 115 can be provided inside the wafer chuck 110 and a coolant can flow along the flow path 115. For example, the flow path 115 can be shaped in a zigzag shape. The length and shape of the flow path 115 may vary depending on the temperature range of the platform unit 100 and the coolant.

The supply path 121 can be connected to the flow path 115 located in the wafer chuck 110 such that the coolant used to cool the wafer chuck 110 can be supplied to the wafer chuck 110 via the flow path 115. Among them. When a concentrated and liquefied coolant is supplied to the inside of the wafer chuck 110 via the supply path 121, the wafer chuck 110 can be sufficiently cooled to a lower temperature so that it can be at a first temperature The wafer W above the wafer chuck 110 is inspected for a first temperature below a second temperature. The supply route 121 can be connected to a storage tank 120 for storing the coolant.

In the illustrated embodiment, the venting route 123 is connectable to a flow path 115 located in the wafer chuck 110. The coolant from the wafer chuck 110 for cooling the wafer chuck 110 can be discharged via the discharge path 123, and thus can be in the wafer chuck 110 by the supply route 121 and the discharge route 123. The coolant is circulated. Therefore, the coolant supplied via the supply route 121 can be circulated inside the wafer chuck 110, and then the coolant from the wafer chuck 110 can be discharged via the discharge route 123.

The heating block 130 can be positioned adjacent to the wafer chuck 110 and the heating block 130 can be wrapped around at least a portion of the supply path 121.

The wafer W system can be inspected at a second temperature that is higher than the first temperature. That is, when a high temperature check procedure is performed after a low temperature check procedure, the wafer W can be inspected at a second temperature higher than the first temperature. In the illustrated embodiment, a plurality of heating elements 150 can be disposed in the wafer chuck 110 such that the wafer chuck 110 can be heated to a second temperature. One of the first residual coolant remaining in the flow path 115 can be evaporated away from the wafer chuck 110. However, although the heating element 150 is disposed in the wafer chuck 110, the coolant may remain in the supply path 121 adjacent the wafer chuck 110. The heating element 150 surrounding the supply path 121 can heat one of the second residual coolant remaining in the supply path 121, thereby evaporating for the second residual coolant. Therefore, evaporation of the coolant will likely cause an increase in the internal pressure of one of the supply paths 121, thereby allowing the evaporated coolant to penetrate into the wafer chuck 110. Therefore, the wafer chuck when the evaporated coolant is supplied to the wafer chuck 110 is compared with the degree of temperature change of the wafer chuck 110 when the liquefied coolant is supplied to the wafer chuck 110. The temperature change of 110 can be reduced to a minimum.

In one embodiment, the heating block 130 can include a heating coil 131 and a shielding plate 133. The heating coil 131 can be positioned adjacent to the wafer chuck 110 and surrounded for the supply path 121. The heat is generated by the heating coil 131, and the second residual coolant can be evaporated in the supply path 121. For example, the heating coil 131 can include a tungsten W coil.

The shielding plate 133 can cover the heating coil 131 and prevent heat generated by the heating coil 131 from being transmitted to other elements of the platform unit 100. Therefore, the heat generated by the heating coil 131 can be collectively transmitted to the shielding plate 133.

Referring to Figures 1 and 2, when the heating block 130 is overheated, the heat of the heating block 130 will cause thermal damage to other components of the platform unit 100. In view of this, the heating block 130 is heated to a third temperature T1 at a first time t1, and the heating block 130 can be cooled to a temperature lower than the third temperature T1 at a second time after one of the first times t1 elapses. One of the fourth temperatures. Therefore, when the liquefied coolant is supplied to the wafer chuck 110 via the supply path 121, the coolant can be evaporated at the fourth temperature. That is, the coolant in the supply path 121 adjacent to the wafer chuck 110 can be evaporated at a relatively low temperature, and although the evaporated coolant can penetrate into the wafer chuck 110, The temperature of the wafer chuck 110 is hardly altered by the effect of the evaporated coolant. Therefore, the temperature of the wafer chuck 110 is maintained at the second temperature in a uniform manner.

For example, when the coolant has a boiling point of about 76 ° C, the third temperature is between about 500 ° C and about 700 ° C and the fourth temperature is between about 100 ° C and about 200 ° C.

In an exemplary embodiment, the platform unit 100 further includes a controller 140 for controlling the temperature of one of the heating blocks 130. In other words, the heating block 130 can be heated or cooled by the controller 140. For example, the heating block 130 can be maintained at the third temperature T1 at the first time t1, and then the heating block 130 can be maintained at the fourth temperature T2 at the second time t2.

As mentioned above, the platform unit 100 for the probe station further includes a heating element 150 disposed in the wafer chuck 110.

In one embodiment, the heating element 150 can be located inside the wafer chuck 110, and the wafer chuck 110 can be changed from the first temperature to the second temperature by heating of the heating element 150. For example, the heating element 150 can be arranged in a zigzag shape, and the heating element 150 can include a generator (eg, a tungsten (W) coil).

Figure 3 shows a cross-sectional view of a device 200 having a platform unit 100 in Figure 1 for inspecting a wafer W.

Referring to FIG. 3, an apparatus 200 for inspecting a wafer W (hereinafter referred to as an inspection apparatus) in an embodiment of the present invention may include a chamber 205, a platform unit 100, and a probe card. Unit 250.

The chamber 205 can include an inspection space 220 in which the wafer W is inspected in the inspection space 220 of the chamber 205. The chamber 205 further includes a loading section 240 and an inspection section 220. The loading section 240 and the inspection section 220 are arranged in a line with each other. A partition wall 254 can be disposed between the loading section 240 and the inspection section 220, and the wafer W can be moved between the loading section 240 and the inspection section 220 via the partition wall 254.

The loading section 240 can load and align the wafer W over the wafer chuck 110, and the loading section 240 can unload the wafer W above the wafer chuck 110. A top opening 222 can be provided on top of one of the chambers 205, and a probe card 300 (described in more detail below) can be disposed within the top opening 222. The loading section 240 can include a support plate 242, an aligner (not shown), and a transfer robot (not shown). One of the wafer cassettes for holding the wafer W is supported by the support plate 242. The aligner is used to align the wafer W. The transfer robot is used to transfer the aligned wafer W onto the platform unit 100.

The platform unit 100 can be positioned in the inspection space 220, and the wafer W to be inspected in the inspection apparatus 200 can be placed on the platform unit 100. When the platform unit 100 is movable in three directions, the plurality of wafers above the wafer W can be fabricated with electrical contacts having the probe card 300.

The platform unit 100 is linearly movable in the x-direction, the y-direction, and the z-direction, and the platform unit 100 is rotatable relative to a central axis thereof by a driver 170. In addition, the platform unit 100 can control the temperature of the wafer chuck 110, and the wafer W is positioned above the wafer chuck 110. That is, the platform unit 100 can reduce the temperature of the wafer chuck 110, thereby allowing the wafer W at the platform unit 100 to be inspected at a relatively low temperature of one of the low temperature inspection procedures. Conversely, the platform unit 100 can increase the temperature of the wafer chuck 110, thereby allowing the wafer W at the platform unit 100 to be inspected at a relatively high temperature of one of the high temperature inspection procedures.

The structure of the platform unit 100 in the inspection apparatus 200 can be substantially the same as that of the platform unit in FIGS. 1 and 2, and thus the detailed description of the platform unit 100 will not be repeated below.

The probe card unit 250 can be positioned on top of the platform unit 100 and the probe card 300 can be held in the probe card unit 250. The probe card 300 can include a bottom surface, a disk-shaped printed circuit board (PCB) and a probe tip, wherein the probe tip is disposed on the bottom surface. The probe tip can protrude from the bottom surface and can face the wafer chuck 110. A plurality of wafers located above the wafer W can be fabricated by the probe card 300 as electrical contacts having a tester.

According to an embodiment of the present invention, when an inspection mode is changed to a high temperature inspection program via a low temperature inspection program, a residual coolant in a supply path can be evaporated in the supply route. Therefore, the internal pressure of the supply route is increased, and the liquefied coolant can be completely prevented from flowing into a wafer chuck, thereby reducing the temperature variation of the wafer chuck and increasing the temperature uniformity of the wafer chuck.

The above is a description of the illustrated embodiments, but the description of these embodiments does not impose its own limitations. Although only a few examples are set forth above, modifications and retouchings may be made without departing from the novel teachings and advantages of the present invention, as will be appreciated by those skilled in the art. Therefore, the scope of protection of the present invention is defined by the scope of the appended claims. The functional device statements in the scope of the claims include the structures described herein that perform the functions described above, and in addition to the structural equivalents, the equivalent structures are also proposed. Therefore, it is to be understood that the various embodiments of the invention have been described in the foregoing description The limitations and other enumerated embodiments are included in the scope of the appended claims.

100. . . Platform unit

110. . . Wafer chuck

115. . . Flow path

120. . . Storage tank

121. . . Supply route

123. . . Emission route

130. . . Heating block

131. . . Heating coil

133. . . Masking board

140. . . Controller

150. . . Heating element

170. . . driver

200. . . Inspection device

205. . . Chamber

222. . . Top opening

240. . . Loading section

242. . . Support plate

250. . . Probe card unit

254. . . Partition wall

300. . . Probe card

T1. . . first timing

T1. . . Third temperature

T2. . . Second time

T2. . . Fourth temperature

W. . . Wafer

The enumerated embodiments are described in detail below in conjunction with the drawings. Figures 1 through 3 show embodiments that are not intended to be limiting.

1 is a cross-sectional view showing a platform unit for a probe station in accordance with an embodiment of the present invention;

Figure 2 is a diagram showing the relationship between the temperature on the heating block of one of the platform units in Fig. 1 and the heating time;

Figure 3 is a cross-sectional view of a device having a platform unit in Figure 1 for inspecting a wafer.

100. . . Platform unit

110. . . Wafer chuck

115. . . Flow path

120. . . Storage tank

121. . . Supply route

123. . . Emission route

130. . . Heating block

131. . . Heating coil

133. . . Masking board

140. . . Controller

150. . . Heating element

W. . . Wafer

Claims (6)

a platform unit for a probe station, the platform unit includes: a wafer chuck, a wafer is used for positioning on the wafer chuck, and a flow path is included in the wafer chuck; a pipeline route through which a coolant flows into the wafer chuck, thereby cooling the wafer chuck to a first temperature, the pipeline route being connected to the wafer chuck The flow path, and the pipeline route includes a supply route and a discharge route, the supply route is to supply the coolant to the wafer chuck, the discharge route is for the coolant from the wafer chuck Performing a discharge; a heating element disposed in the wafer chuck for heating the wafer chuck; and a heating block positioned adjacent to the wafer chuck when the wafer chuck is passed through When the first temperature is changed to a second temperature, the heating block evaporates the remaining coolant remaining in the supply route by heat, and the second temperature is higher than the heating element First temperature. The platform unit of claim 1, wherein the heating block comprises: a heating coil surrounding the supply route adjacent to the wafer chuck and heating the supply route; and a shielding plate The heating coil is coated with the supply path, thereby preventing the heat generated by the heating coil from being transmitted to the outside. The platform unit of claim 2, further comprising a controller for controlling the heating coil of the heating block, such as The heating block may be heated to a third temperature at a first time and the heating block may be cooled to a fourth temperature lower than the third temperature at a second time after one of the first times elapses. And the wafer chuck is heated to the second temperature, thereby reducing thermal damage caused by the heat generated by the heating block at the third temperature. A wafer inspection apparatus includes: a chamber including an inspection space, the wafer being inspected in the inspection space of the chamber; a platform unit including a wafer chuck, a pipeline route, and a a heating element and a heating block, the wafer chuck includes a flow path for supporting the wafer, and a coolant flows through the pipeline path to enter the wafer chuck, thereby clamping the wafer Cooling the head to a first temperature, the pipeline route is connected to the flow path of the wafer chuck and the pipeline route includes a supply route and a discharge route, the supply route is to supply the coolant to the crystal a circular chuck that discharges the coolant from the wafer chuck, the heating element being disposed in the wafer chuck for heating the wafer chuck, the heating The block is positioned adjacent to the wafer chuck, and when the wafer chuck is changed to a second temperature via the first temperature, the heating block is retained by heat for remaining in the supply route The coolant is evaporated, the second temperature System through which the heating element is higher than the first temperature; and a probe card unit is provided with a probe card, the probe card for performing inspection system for the wafer. A wafer inspection apparatus according to claim 4, wherein The heating block includes: a heating coil surrounding the supply route adjacent to the wafer chuck and heating the supply route; and a shielding plate covering the heating coil and the supply route, Thereby, the heat generated by the heating coil is prevented from being transmitted to the outside. The wafer inspection device of claim 5, wherein the platform unit further comprises a controller for controlling the heating coil of the heating block, so that the first time Heating the heating block to a third temperature and cooling the heating block to a fourth temperature lower than the third temperature at a second time after one of the first times elapses, and the wafer chuck is tied Heating to the second temperature, thereby reducing thermal damage caused by the heat generated by the heating block at the third temperature.