TWI438842B - - Google Patents

Info

Publication number
TWI438842B
TWI438842B TW100120684A TW100120684A TWI438842B TW I438842 B TWI438842 B TW I438842B TW 100120684 A TW100120684 A TW 100120684A TW 100120684 A TW100120684 A TW 100120684A TW I438842 B TWI438842 B TW I438842B
Authority
TW
Taiwan
Application number
TW100120684A
Other languages
Chinese (zh)
Other versions
TW201250849A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW100120684A priority Critical patent/TW201250849A/zh
Priority to CN2011102726851A priority patent/CN102832147A/zh
Publication of TW201250849A publication Critical patent/TW201250849A/zh
Application granted granted Critical
Publication of TWI438842B publication Critical patent/TWI438842B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83201—Compression bonding
    • H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
    • H01L2224/83204—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding with a graded temperature profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H01L2224/83815—Reflow soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H01L2224/8382—Diffusion bonding
    • H01L2224/83825—Solid-liquid interdiffusion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H01L2224/8382—Diffusion bonding
    • H01L2224/8383—Solid-solid interdiffusion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83905—Combinations of bonding methods provided for in at least two different groups from H01L2224/838 - H01L2224/83904
    • H01L2224/83906—Specific sequence of method steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83905—Combinations of bonding methods provided for in at least two different groups from H01L2224/838 - H01L2224/83904
    • H01L2224/83907—Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
TW100120684A 2011-06-14 2011-06-14 Low-temperature chip bonding method for light-condensing type solar chip, power transistor and field effect transistor TW201250849A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW100120684A TW201250849A (en) 2011-06-14 2011-06-14 Low-temperature chip bonding method for light-condensing type solar chip, power transistor and field effect transistor
CN2011102726851A CN102832147A (zh) 2011-06-14 2011-09-15 晶片低温接合的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100120684A TW201250849A (en) 2011-06-14 2011-06-14 Low-temperature chip bonding method for light-condensing type solar chip, power transistor and field effect transistor

Publications (2)

Publication Number Publication Date
TW201250849A TW201250849A (en) 2012-12-16
TWI438842B true TWI438842B (ko) 2014-05-21

Family

ID=47335219

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100120684A TW201250849A (en) 2011-06-14 2011-06-14 Low-temperature chip bonding method for light-condensing type solar chip, power transistor and field effect transistor

Country Status (2)

Country Link
CN (1) CN102832147A (ko)
TW (1) TW201250849A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI761227B (zh) * 2021-06-08 2022-04-11 遠東科技大學 結合銦鉍合金和鋁基材的複合材及其製作方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI654779B (zh) 2013-04-26 2019-03-21 新世紀光電股份有限公司 發光二極體結構及其製造方法
US9818903B2 (en) 2014-04-30 2017-11-14 Sunpower Corporation Bonds for solar cell metallization

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4882229B2 (ja) * 2004-09-08 2012-02-22 株式会社デンソー 半導体装置およびその製造方法
CN101950782B (zh) * 2009-07-10 2013-01-09 财团法人工业技术研究院 低温形成反射性发光二极管固晶接合结构的方法
TWI401825B (zh) * 2009-11-27 2013-07-11 Ind Tech Res Inst 發光二極體晶片的固晶方法及固晶完成之發光二極體

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI761227B (zh) * 2021-06-08 2022-04-11 遠東科技大學 結合銦鉍合金和鋁基材的複合材及其製作方法

Also Published As

Publication number Publication date
CN102832147A (zh) 2012-12-19
TW201250849A (en) 2012-12-16

Similar Documents

Publication Publication Date Title
BR112013022641A2 (ko)
AP3853A (ko)
BR112013027245A2 (ko)
BR112013024383A2 (ko)
BR112013026905A2 (ko)
BR112013023185A2 (ko)
BR112013026744A2 (ko)
BR112013023927A2 (ko)
BR112013024365A2 (ko)
BR112013027121A2 (ko)
BR112013027452A2 (ko)
AP2016009466A0 (ko)
BR112013026790A2 (ko)
BR112013024588A2 (ko)
BR112013026895A2 (ko)
BR112013021637A2 (ko)
BR112013023266A2 (ko)
BR112013032392A2 (ko)
BR112013025487A2 (ko)
BR112013027871A2 (ko)
BR112013026861A2 (ko)
BR112013032394A2 (ko)
BR112013027657A2 (ko)
BR112013027112A2 (ko)
BR112013022499A2 (ko)

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees