TWI438511B - Optoelectronic module - Google Patents

Description

Photoelectric module

The invention relates to a photoelectric module, in particular to a photoelectric module integrating a light guiding structure and a 矽 perforated structure.

A connector is usually provided in the electronic device to electrically connect with another component to enable the electronic device to communicate with or transmit signals to other devices. However, with the advancement of technology, electronic devices are moving toward a trend of thinning and thinning. The connector plastic body made by the conventional mold and the conductive terminals made by applying the stamping technology are not easily installed in the thin and light electronic device.

The use of optocoupler elements as the basic design for photoelectric conversion and electrical signal transmission has been widely used in various current circuit configurations, electronic devices or related systems. Under the condition that the size of the relevant unit of the optocoupler element is small, it is quite difficult and inconvenient to assemble or implant the optical fiber into the light coupling device to conduct or introduce the optical signal to the light coupling device for transmission. Even errors can occur, which in turn can not accurately transmit optical signals to the fiber and affect transmission. Furthermore, the optical fiber system needs to be fixedly assembled or implanted in the light coupling device, so that in addition to the inability to provide repeated insertion and removal and assembly, the exposed fiber rear end will also form a linear extension and cause use. inconvenient.

In addition, an optical bonding technology of a germanium-based micro-optical platform can be used as an application platform for board-to-board or USB 3.0 optical bonding technology. Architecturally, the optical connection transceiver module of the bismuth-based micro-optical platform comprises: a 45-degree micro-reflective surface of a monolithic body, a V-shaped groove for placing an optical fiber array, a high-frequency transmission line with 2.5 GHz, and a tin-gold solder. Etc., and a surface-emitting laser and photodetector can be packaged onto the micro-optical platform via appropriate optical alignment.

In addition, it has been developed to integrate the wafer and the light laser onto the germanium-based micro-optical platform; however, the wafer and the light-emitting element are usually electrically connected through a wire, thereby affecting the components. Transmission speed.

Therefore, based on the above-mentioned drawbacks, it is known that the performance of the above-mentioned photoelectric connector has yet to be further improved.

One embodiment of the present invention provides a photovoltaic module including a substrate, a photovoltaic element, and a control unit. The substrate has an upper surface, a lower surface, a groove structure, a perforated structure and a conductive material, wherein the upper surface is opposite to the lower surface, the groove structure is disposed on the upper surface and has two opposite first reflective surfaces and a second reflection The perforated structure is formed by the upper surface passing through the substrate to the lower surface, and the perforated structure is filled with the conductive material; the photoelectric element is disposed on the substrate and is adapted to provide or receive an optical signal, and the first reflective surface and the second reflective surface are both located in the light. The light path of the signal; the control unit is disposed on the upper surface, and electrically connected to the conductive material and the photoelectric element to control the photoelectric element.

The photovoltaic module of an embodiment of the invention comprises a substrate, a photoelectric element, a light guiding structure and a control unit. The substrate has an upper surface, a lower surface, a first recess structure, a first perforated structure and a first conductive material, wherein the upper surface is opposite to the lower surface, the first recess structure is disposed on the upper surface, and the first perforated structure The first perforated structure is filled with the first conductive material from the bottom surface of the first groove structure; the photoelectric element is disposed on the substrate, wherein the photoelectric element is adapted to provide or receive an optical signal; the light guiding structure is disposed On the substrate, the light guiding structure is located on the optical path of the optical signal; the control unit is disposed in the first groove structure, and electrically connects the first conductive material and the photoelectric element to control the photoelectric element.

The photoelectric module of an embodiment of the invention comprises a first substrate, a photoelectric element, a light guiding structure, an upper layer structure, a first perforated structure, a first conductive material and a control unit. The first substrate has an upper surface, a lower surface, and a groove structure, wherein the upper surface is opposite to the lower surface, and the groove structure is disposed on the upper surface; the photoelectric element is disposed in the groove structure, wherein the photoelectric element is adapted to provide or receive a The light guiding structure is disposed on the upper surface of the first substrate, and the light guiding structure is located on the optical path of the optical signal; the upper structure is disposed above the first substrate for fixing the light guiding structure with the first substrate, wherein The upper structure has a reflective surface on the optical path of the optical signal for transmitting the optical signal between the photoelectric element and the light guiding structure; the first conductive material is filled in the first perforated structure; and the control unit is electrically connected to the first conductive Materials and optoelectronic components to control optoelectronic components.

In summary, the embodiment of the present invention provides a new photovoltaic module structure, which integrates the substrate with the light guiding structure and the perforated structure, so that the control unit and the photoelectric element are integrated on a single substrate.

In another embodiment, the substrate integrates the perforated structure, the light guiding structure and the reflective surface, and the electrical signal can be transmitted to the control unit via the conductive material in the perforated structure, thereby driving the photoelectric element to emit light. After the optical signal enters the light guiding structure, after two 45-degree reflections, the light beam can be turned to the forward (upper) light, and the light guiding structure can perform high-efficiency beam guiding.

In another embodiment, due to the perforated structure and the conductive material therein, the module can be assembled without a wire (Wire) process for the control unit and the optoelectronic component, in high frequency characteristics, high speed transmission, and component assembly speed. Get promoted.

The invention will be described in conjunction with the embodiments and the accompanying drawings. It is to be understood that all of the embodiments of the invention are illustrative and not intended to be limiting. Therefore, the invention may be applied to other embodiments in addition to the embodiments described herein. The invention is not limited to any embodiment, but should be determined by the scope of the appended claims and their equivalents.

The first figure shows a schematic view of a photovoltaic module in accordance with an embodiment of the present invention. In this embodiment, the optoelectronic module 10 can be used as a miniaturized passive optical connection transmitting end or receiving end, which comprises a substrate 100 such as a semiconductor material, a fan-out condcutive pattern 102, and an upper conductive bump. (Solder bumps) 103a / 103b, lower conductive bumps 104, control wafer 105, photovoltaic elements 106 and light guiding structure 107. The substrate 100 has an upper surface, a lower surface, a groove structure 108, a first perforated structure and a first conductive material, wherein the upper surface is opposite to the lower surface, and the groove structure 108 is disposed on the upper surface and has two opposite sides. a reflective surface 108a and a second reflective surface 108b, the first perforated structure passes through the substrate 100 to the lower surface from the upper surface, and the first perforated structure is filled, for example, with the first conductive material to form a through silicon via (101V) The through hole 101 is electrically connected to the diffusion conductive pattern 102, and the diffusion conductive pattern 102 is formed on the upper surface of the substrate 100. The upper conductive bumps 103a/103b can be directly electrically connected to the control wafer 105, the photovoltaic element 106, and the diffusion conductive pattern 102 or electrically connected to the control wafer 105 and the photovoltaic element 106 through the diffusion conductive pattern 102. In other words, the control wafer 105 is electrically connected to the photovoltaic element 106 through the diffusion conductive pattern 102, and the control wafer 105 is electrically connected to the lower layer through the upper conductive bump 103a and via the diffusion conductive pattern 102 and the via hole 101. Laminate 111. In this embodiment, the upper conductive bumps 103a are electrically connected to the diffusion conductive pattern 102.

The diffusion conductive pattern 102 described above may allow the lower surface pins (eg, conductive bumps) of the control wafer 105 to be diffused out of the area covered by the control wafer 105 to provide better connections to other devices. It can also reduce the electromagnetic interference between the pins.

The substrate 100 is, for example, a tantalum interposer 100 (Silicon Interposer). The light guiding structure 107 is a waveguide, disposed in the groove structure 108 and located between the first reflecting surface 108a and the second reflecting surface 108b. The portion of the substrate 100 provided with the recess structure 108 constitutes a Silicon Optical Bench 108, and the first reflective surface 108a and the second reflective surface 108b on opposite sides of the recess structure 108 have 45 degrees respectively. The angle is used as the optical reflecting surface required in various types of photovoltaic elements. The above-described photovoltaic element 106 can be disposed on one side of the groove structure 108, such as the first reflective surface 108a. For example, the optoelectronic component 106 is disposed on the substrate 100, wherein the optoelectronic component 106 is adapted to provide or receive an optical signal, and the first reflective surface 108a and the second reflective surface 108b are both located on the optical path of the optical signal. The light guiding structure 107 includes, for example, a polymer material having a refractive index of about 1.4 to 1.6, which can be fabricated by a thin film deposition process to achieve the effect of the waveguide. The light guiding structure 107 can be selected to fill or not fill in the corresponding groove structure 108, depending on the actual application.

In one embodiment, the substrate 100 can be used as a sub-package platform (sub-- for driving integrated circuit/transistor amplifier (Driver IC/TIA) or vertical cavity surface radiation laser/photodetector (VCSEL/PD). In addition to mount, other logic devices, memory, or integrated passive components (IPD) can be integrated on them. In another embodiment, the processing wafer, central processing unit wafer, image wafer, audio chip, or data wafer can be integrated.

The photovoltaic module 10 further includes a layer 111. The layer 111 is disposed under the substrate 100, and the lower conductive bumps 104 electrically couple the layer 111 and the turns 101. In another embodiment, a second diffusion conductive pattern (not shown) may be selectively disposed on the lower surface of the substrate 100 and connected to the lower conductive bumps 104. The second diffusion conductive pattern 102a described above can cause the lower surface pins of the substrate 100 to be diffusedly dispersed to provide better connection between other devices and to reduce electromagnetic interference between the pins. The laminate 111 is, for example, a printed circuit board that is electrically coupled to the external components through the conductive bumps 112 thereunder. In addition, the optoelectronic module further includes a housing 110 having a dimming component 109. The position of the dimming member 109 corresponds to the position of the second reflecting surface 108b and is located on the optical path of the optical signal; wherein the dimming member 109 is a lens. In one example, the outer casing 110 seals the unitary substrate 100 above the ply 111. The control wafer 105 is a control unit disposed on the upper surface of the substrate 100 and electrically connected to the via hole 101 and the photovoltaic element 106 to control the photovoltaic element 106.

In one embodiment, the substrate 100 is used as a germanium interposer material. To be electrically coupled to the laminate 111 on the bottom surface, it is necessary to meet the accuracy of the traces in the laminate 111; and if the laminate 111 is a printed circuit board. (PCB), the lower conductive bumps 104 under the substrate 100 need to meet the process precision of the printed circuit board 111. In other words, in order to electrically couple the control wafer 105 to the underlying printed circuit board 111, the lower conductive bumps 104 are electrically outwardly diffused by the second diffusion conductive pattern, and the lower conductive bumps 104 are spaced apart. The setting will depend on the accuracy requirements of the printed circuit board 111. If the laminate 111 is an alumina substrate, the distance between the lower conductive bumps 104 under the substrate 100 may be small.

The depth of the ruthenium perforation 101 depends on the type of via hole (the via hole is formed first or the via hole is formed later) and its application. The through-hole depth of the perforated 101 is from 20 microns to 500 microns, typically between about 50 microns and about 250 microns. The via opening of the ruthenium perforation 101 has a via size, such as a diameter between about 20 microns and about 200 microns, and typically between about 25 microns and about 75 microns. The aspect ratio of the perforated 101 is from 0.3:1 to greater than 20:1, such as between about 4:1 and about 15:1.

In one embodiment, the through hole of the through hole 101, that is, the first through structure, includes an opening on the upper surface of the substrate, a sidewall extending from the upper surface of the substrate, and a bottom portion. The method of forming the through hole 101 includes: The substrate 100 is immersed in an electrolytic metal (eg, copper) deposition composition, wherein the electrolytic metal (eg, copper) deposition composition comprises: a metal (eg, copper) ion source, an acid (selected from a mineral acid, an organic sulfonic acid, and/or Or a mixture thereof, one or more organic compounds (causing copper deposition at the bottom of the via to be deposited faster than the metal at the opening of the via), and chloride ions; and supplying current to the electrolytic deposition composition to deposit copper metal The bottom and side walls are filled from bottom to top, thereby creating a copper filled crucible 101.

The control wafer 105 is, for example, a driver circuit wafer, a control wafer or a Trans-impedance Amplifier (TIA) wafer, wherein the driver circuit wafer can be used to drive the photovoltaic element 106 to emit light. The control wafer 105 and the photovoltaic element 106 are electrically connected to each other via the diffusion conductive pattern 102 to the upper conductive bumps 103a/103b. The control wafer 105 and the layer 111 are electrically connected to each other through the conductive bumps 103a, the diffusion conductive patterns 102, the via holes 101, and the lower conductive bumps 104 under the control wafer 105. The germanium via 101 is electrically connected to the diffusion conductive pattern 102 and the lower conductive bump 104. The optoelectronic component 106 can be a light emitting or receiving component such as a laser, a Vertical Cavity Surface Emitting Laser (VCSEL), a Photo-Detector, or a light emitting diode. By way of example, a light emitting element, the main function of the photovoltaic element 106 is to generate or emit a corresponding converted beam or optical signal for transmission based on the electrical signal transmitted by the control wafer 105. The laser beam emitted by the photovoltaic element 106 is reflected by the first reflecting surface 108a, transmitted therein via the light guiding structure 107, and then the laser beam is vertically guided out of the substrate 100 via the second reflecting surface 108b. For example, the light path of the light emitted by the photoelectric element 106 includes: a light exit of the photoelectric element 106 → a light guiding structure 107 → a 45 degree reflecting surface 108 a → a light transmitting structure 107 → a 45 degree reflecting surface 108 b → a light guiding structure 107 → Light emission → Coupling with the external photovoltaic element via the light adjustment member 109. The optical path of the optoelectronic component 106 is opposite to that described above, wherein the optoelectronic component 106 is the receiving end.

In one embodiment, the laser beam exiting light through the light directing structure 107 can be further optically adjusted via the dimming component 109 and then coupled to an external fiber or another light directing structure. For one embodiment, the structural error tolerance of the dimming member 109 is ±10 microns, and the alignment error tolerance of the dimming member 109 is ±20 microns. The dimming member 109 can be an optical lens or a collimation lens. The optical lens is, for example, a plastic optical lens.

The second figure shows a schematic view of a photovoltaic module in accordance with another embodiment of the present invention. In the present embodiment, the substrate 100a includes two groove structures (a first groove structure 108d and a second groove structure 108c) formed on the substrate 100a. The light guiding structure 107a is disposed in the second groove structure 108c, and the light guiding structure 107a is, for example, an optical fiber. The photo-electric element 106 can be disposed on a side of the second recess structure 108c, and the control wafer 105 is disposed in the first recess structure 108d. Alternatively, the side of the second recess structure 108c adjacent to the optoelectronic component 106 can be formed as a 45 degree reflective surface. Embodiments of the present invention can reduce the depth of the pupil perforation 101 by forming the first groove structure 108d, making the fabrication of the pupil perforation 101 easy. The fabrication of the first recess structure 108d can elastically select wet etching, dry etching, or wet and dry etching. In addition, a high-frequency trace 102b is formed on the bottom surface and the side surface of the first recess structure 108d and a portion of the upper surface of the substrate 100a, and is electrically connected to the control wafer 105 and the photoelectric through the upper conductive bumps 103a and 103b. Element 106. Further, in the present embodiment, a package structure of a ball grid array (BGA) type can be used to connect the printed circuit board 111 without wire-bonding.

The third figure shows a schematic diagram of a photovoltaic module in accordance with an embodiment of the present invention. In the present embodiment, the second groove structure 108e has a difference from the depth of the second groove structure 108c of the second figure. For example, the second groove structure 108e and the first groove structure 108d are formed by the same etching process or step, so that the depth thereof is approximately equal, and the depth thereof is greater than the depth of the second groove structure 108c of the second figure. .

In the present embodiment, the first perforated structure is formed in the substrate 100a, extends from the bottom surface of the first recess structure 108d to the lower surface of the substrate 100a, and is filled with the first conductive material to form the crucible hole 101. The second perforated structure is formed in the substrate 100a, extending from the upper surface of the substrate 100a to the lower surface of the substrate 100a, and the second conductive material is filled into the second perforated structure to form the crucible perforation 101b, and the perforation 101b is electrically connected Photoelectric element 106.

The through-hole 101b directly penetrates the portion of the substrate 100a under the photovoltaic element 106, and is electrically coupled to the photovoltaic element 106 and the printed circuit board 111 through the conductive bumps 103b and 104. Therefore, in this embodiment, the example of the high-frequency wire 102b can be formed directly under the position of the photovoltaic element 106 instead of the high-frequency wire 102b, and the photovoltaic element 106 and the control wafer 105 can be integrated through the through-hole 101 and the through-hole 101b. The photovoltaic element 106 and the control wafer 105 may also be electrically connected to each other through the via hole 101, the printed circuit board 111, and the turn-by-hole 101b.

The fourth figure shows a schematic diagram of a photovoltaic module in accordance with an embodiment of the present invention. In the present embodiment, a package structure for an OE IC type or a ball grid array (BGA) type can be used to connect the ceramic substrate structure 111. In addition, the case 110b covers and protects the overall photovoltaic module from external environmental contamination. For example, the conductive bumps 112 are exposed outside the upper cover 110b to facilitate connection of external components. In another embodiment, the upper case 110b covers only the photovoltaic element 106, the control wafer 105, and the light guiding structure 107a on the substrate 100a, as shown in the fifth figure.

Figure 6 is a schematic illustration of a photovoltaic module in accordance with yet another embodiment of the present invention. In the present embodiment, the substrate 100b has a recess structure 108f, and the photovoltaic element 106 and the control wafer 105 are integrated into the recess structure 108f of the substrate 100b. The photoelectric element 106 and the control wafer 105 are electrically coupled to the printed circuit board 111 through the through-holes 101 and the through-holes 101b, respectively. The light guiding structure 107b is disposed on the substrate 100b. The substrate 100b is placed over the printed circuit board 111. For example, the active area of the photovoltaic element 106 is on the same side as the contact pad. In this embodiment, the optoelectronic module further includes a top structure 110c disposed on the light guiding structure 107b and fixed to the light guiding structure 107b with the substrate 100b. The upper structure 110c has a 45-degree reflecting surface for facilitating the vertical light output of the photovoltaic element 106 to be advanced to the light guiding structure 107b in the horizontal direction and transmitted to the outside through the reflection of the 45-degree reflecting surface. In this embodiment, the photovoltaic element 106 and the control wafer 105 are electrically connected to each other through the through-hole 101, the printed circuit board 111 and the meandering hole 101b.

The first perforated structure is formed in the substrate 100b, and extends from the bottom surface of the recess structure 108f to the lower surface of the substrate 100b. The first perforated structure is filled with the first conductive material to form the crucible hole 101, and is electrically connected to the control wafer. 105. The second perforated structure is formed in the substrate 100b, extending from the bottom surface of the recess structure 100b to the lower surface of the substrate 100b, and the second conductive material is filled into the second perforated structure to form the crucible hole 101b, and electrically connected to the photoelectric element 106.

In addition, as shown in the seventh embodiment, in another embodiment, only the photovoltaic element 106 is disposed in the recess structure 108f of the substrate 100b, and the control wafer 105 is disposed on another substrate, such as a ceramic substrate (Ceramics sub The conductive bumps 103a are disposed on the ceramic substrate 111. The vias 101 are disposed in the ceramic substrate 111 and electrically connected to the upper conductive bumps 103a and the conductive bumps 112. The control wafers 105 are transmitted through the upper conductive bumps 103a. The vias 101 are electrically coupled to the vias 101 and electrically coupled to the conductive bumps 112 under the ceramic substrate 111 through the vias 101. The wire-bondings 122 are electrically connected to the photovoltaic elements 106 and the vias 101. Based on the ceramic substrate structure, the present embodiment can be integrated into a ball grid array (BGA) type or a Land Grid Array (LGA) type optoelectronic integrated circuit. In this embodiment, another control wafer 105a may be included, and the other components are electrically connected through the diffusion conductive pattern 102c. The control wafer 105a may be electrically coupled to the conductor circuit on the ceramic substrate 111 through the via hole 101. The control wafer 105 and/or the control wafer 105a are electrically connected to the bonding wire 122 through the wire circuit above or below the silicon via hole 101 and the ceramic substrate 111.

The optoelectronic module can be connected to a fiber connector for transmitting optical signals to external components.

In summary, the embodiment of the present invention proposes a new photovoltaic module structure, which integrates the light guiding structure and the 矽-perforated structure, so that the IC and the VCSEL/PD are integrated on a single substrate.

The substrate is integrated with a perforated structure, a light guiding structure (such as an optical waveguide) and a 45-degree reflecting surface, and the electrical signal can be transmitted to a specific function wafer (IC) via the boring, thereby driving the VCSEL active device to emit light. After the optical signal enters the light guiding structure, after two 45-degree reflections, the light beam can be turned to the forward (upper) light, and the light guiding structure can perform high-efficiency beam guiding.

The photoelectric module of the embodiment of the invention can complete the module assembly for the IC and VCSEL/PD without a wire (Wire) process, and the high-frequency characteristics, high-speed transmission, and component assembly speed are improved. The light guiding structure can be made of a polymer material having a refractive index of about 1.4 to 1.6, or can be fabricated by a thin film deposition process to achieve the effect of the waveguide.

The present invention has been described above by way of example, and is not intended to limit the scope of the invention. Modifications and similar configurations made within the spirit and scope of the invention are intended to be included within the scope of the appended claims.

10. . . Photoelectric module

100, 100a, 100b. . . Substrate

101, 101b. . . Piercing

102, 102a, 102c. . . Diffused conductive pattern

102b. . . wire

103a, 103b. . . Upper conductive bump

104. . . Lower conductive bump

105, 105a. . . Control chip

106. . . Optoelectronic component

107, 107a, 107b. . . Light guiding structure

108, 108c, 108d, 108e, 108f. . . Groove structure

108a. . . First reflecting surface

108b. . . Second reflecting surface

109. . . Dimming unit

110. . . shell

110b. . . Upper cover

110c. . . Superstructure

111. . . Laminate, printed circuit board, ceramic substrate

112. . . Conductive bump

122. . . Welding line

The first figure shows a schematic diagram of a photovoltaic module in accordance with an embodiment of the present invention.

The second figure shows a schematic view of a photovoltaic module in accordance with yet another embodiment of the present invention.

The third figure shows a schematic view of a photovoltaic module in accordance with yet another embodiment of the present invention.

The fourth figure shows a schematic view of a photovoltaic module in accordance with another embodiment of the present invention.

Figure 5 is a schematic illustration of a photovoltaic module in accordance with yet another embodiment of the present invention.

Figure 6 is a schematic view showing a photovoltaic module according to still another embodiment of the present invention.

Figure 7 is a schematic top and cross-sectional view of a photovoltaic module in accordance with an embodiment of the present invention.

10. . . Photoelectric module

100. . . Substrate

101. . . Piercing

102. . . Diffused conductive pattern

103a, 103b. . . Upper conductive bump

104. . . Lower conductive bump

105. . . Control chip

106. . . Optoelectronic component

107. . . Light guiding structure

108. . . Groove structure

108a. . . First reflecting surface

108b. . . Second reflecting surface

109. . . Dimming unit

110. . . shell

111. . . Laminate

112. . . Conductive bump

Claims (22)

An optoelectronic module includes: a substrate having an upper surface, a lower surface, a groove structure, a perforated structure, and a conductive material, wherein the upper surface is opposite to the lower surface, and the groove structure is disposed on the upper surface And having two opposite first reflective surfaces and a second reflective surface, the perforated structure is passed through the substrate to the lower surface, the perforated structure is filled with the conductive material, and the aspect ratio of the perforated structure The light-emitting element is disposed on the substrate, wherein the photoelectric element is adapted to provide or receive an optical signal, and the first reflective surface and the second reflective surface are located in the light a light path of the signal; and a control unit disposed on the upper surface of the substrate and electrically connecting the conductive material and the photovoltaic element to control the photoelectric element. The photoelectric module of claim 1, further comprising a light guiding structure disposed in the groove structure and located between the first reflecting surface and the second reflecting surface, wherein the light guiding structure is located at the optical signal On the light path. The photovoltaic module of claim 1, further comprising a diffusion conductive pattern formed on the upper surface of the substrate, wherein the control unit is electrically connected to the photovoltaic element through the diffusion conductive pattern, the diffusion conductive pattern The lower surface of the control unit is diffused out of the area covered by the control unit. The optical module of claim 1, further comprising a housing having a dimming component disposed on the substrate, wherein the position of the dimming component corresponds to a position of the second reflecting surface and is located in the optical signal In the light path, the outer casing seals the substrate over a layer of the substrate. The optoelectronic module of claim 4, wherein the dimming element is a lens. An optoelectronic module includes: a substrate having an upper surface, a lower surface, a first recess structure, a first perforated structure, and a first conductive material, wherein the upper surface is opposite to the lower surface, the first a groove structure is disposed on the upper surface, the first perforated structure passes through the substrate from the bottom surface of the first groove structure to the lower surface, the first perforated structure is filled with the first conductive material; a photoelectric element, Provided on the substrate, wherein the optoelectronic component is adapted to provide or receive an optical signal; a light guiding structure is disposed on the substrate, and the light guiding structure is located on the optical path of the optical signal; and a control unit, The first groove structure is electrically connected to the first conductive material and the photoelectric element to control the photoelectric element. The photoelectric module of claim 6, further comprising a second recess structure formed on the upper surface of the substrate and having a reflective surface, wherein the reflective surface is located on the optical path of the optical signal and used For the optoelectronic component The optical signal is transmitted between the light guiding structure. The photovoltaic module of claim 6, further comprising a diffusion conductive pattern formed on the upper surface of the substrate and electrically connected to the photovoltaic element and the control unit, the diffusion conductive pattern making the control unit The lower surface pins are diffused out of the area covered by the control unit. The photoelectric module of claim 8, further comprising a plurality of first conductive blocks formed between the control unit and the substrate, wherein the control unit electrically connects the first conductive through the plurality of first conductive blocks Material and the diffused conductive pattern. The photovoltaic module of claim 8, further comprising at least one second conductive block formed between the photovoltaic element and the substrate, wherein the photovoltaic element is electrically connected to the diffusion conductive through the at least one second conductive block pattern. The photovoltaic module of claim 6, wherein the substrate further comprises a second perforated structure and a second electrically conductive material, wherein the second perforated structure passes through the substrate from the upper surface to the lower surface, and the The second via structure is filled with the second conductive material, and the second conductive material is connected to the photovoltaic element. The optoelectronic module of claim 11, further comprising a printed circuit board disposed under the substrate and electrically connecting the first conductive material and the second conductive material. An optoelectronic module includes: a first substrate having an upper surface, a lower surface, and a groove structure, wherein the upper surface is opposite to the lower surface, the groove structure is disposed on the upper surface; a photoelectric element is disposed In the recessed structure, the optoelectronic component is adapted to provide or receive an optical signal; a light guiding structure is disposed on the upper surface of the first substrate, and the light guiding structure is located in the optical path of the optical signal An upper layer structure is disposed above the first substrate for fixing the light guiding structure with the first substrate, wherein the upper layer structure has a reflective surface on the optical path of the optical signal for Transmitting the optical signal between the photoelectric element and the light guiding structure; a first perforated structure having an aspect ratio ranging from 0.3:1 to greater than 20:1; a first conductive material filled in In the first perforated structure; and a control unit electrically connecting the first conductive material and the optoelectronic component to control the optoelectronic component. The optoelectronic module of claim 13, wherein the first perforated structure is formed in the first substrate, and extends from a bottom surface of the recess structure to the lower surface of the first substrate. The photovoltaic module of claim 13, further comprising a second perforated structure And a second conductive material, wherein the second perforated structure is formed in the first substrate, and extends from a bottom surface of the recess structure to the lower surface of the first substrate, wherein the second conductive material is filled in the first conductive material The optoelectronic component is electrically connected to the two via structures. The optoelectronic module of claim 15 further comprising a printed circuit board disposed under the substrate and electrically connected to the first conductive material and the second conductive material. The optoelectronic module of claim 13 further comprising a second substrate under the first substrate, wherein the first perforated structure is formed in the second substrate and extends from the upper surface of the second substrate To the lower surface of the second substrate. The optoelectronic module of claim 17, further comprising a conductive component electrically connected to the optoelectronic component and the first perforated structure. The photovoltaic module of claim 17, wherein the second substrate is a ceramic substrate. The photovoltaic module of claim 1, wherein the perforated structure has an aspect ratio of 4:1 to 15:1. The photovoltaic module of claim 1, wherein the through hole of the perforated structure is deep Degrees range from 20 microns to 500 microns. The photovoltaic module of claim 1, wherein the through-hole opening of the perforated structure has an inlet having a diameter ranging from 20 micrometers to 200 micrometers.