TWI438047B - Drilling tools - Google Patents

Drilling tools Download PDF

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Publication number
TWI438047B
TWI438047B TW100113737A TW100113737A TWI438047B TW I438047 B TWI438047 B TW I438047B TW 100113737 A TW100113737 A TW 100113737A TW 100113737 A TW100113737 A TW 100113737A TW I438047 B TWI438047 B TW I438047B
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Taiwan
Prior art keywords
groove
tool
sub
main groove
drilling tool
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TW100113737A
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Chinese (zh)
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TW201206595A (en
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Yukiyoshi Hoshi
Toshio Yasuda
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Union Tool Kk
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/16Perforating by tool or tools of the drill type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B2251/00Details of tools for drilling machines
    • B23B2251/24Overall form of drilling tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B2251/00Details of tools for drilling machines
    • B23B2251/40Flutes, i.e. chip conveying grooves
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F2210/00Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
    • B26F2210/08Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Drilling Tools (AREA)

Description

鑽孔工具Drilling tool

本發明,是關於鑽孔工具。The present invention relates to a drilling tool.

對於印刷電路板(PCB)的鑽孔加工,是使用如第1圖所示之由具有刃部C的鑽身部A和柄部B所構成的鑽頭。鑽頭的尺寸是根據用途有各種的尺寸,但一般大多數是使用直徑0.7mm以下的鑽頭。For the drilling of a printed circuit board (PCB), a drill having a blade portion A having a blade portion C and a shank portion B as shown in Fig. 1 is used. The size of the drill bit is various depending on the application, but most of the drill bits are used with a diameter of 0.7 mm or less.

具體而言,於刃部C,如第2圖所示是在本體20的外圍從鑽頭前端朝基端側形成有螺旋狀的切屑排出槽22,於該切屑排出槽22的傾斜面和設置在前端的第一後隙面之交叉稜線部是形成有切刃21(例如參照專利文獻1、2)。另,圖中,圖號25是連設在第一後隙面24之工具旋轉方向後方側的第二後隙面,d’是工具直徑,1’是切屑排出槽的溝槽長,α’是螺旋角。Specifically, as shown in FIG. 2, in the blade portion C, a spiral chip discharge groove 22 is formed on the outer periphery of the body 20 from the tip end of the drill toward the base end side, and the inclined surface of the chip discharge groove 22 is provided at the front end. The intersecting ridge portion of the first flank surface is formed with a cutting edge 21 (see, for example, Patent Documents 1 and 2). In addition, in the figure, the figure 25 is a second flank face which is connected to the rear side of the first flank face 24 in the tool rotation direction, d' is the tool diameter, and 1' is the groove length of the chip discharge groove, α' It is a spiral angle.

此外,鋁合金、鈦、鎂、銅等非鐵系被削材所適合之具有耐磨損性和耐熔敷性的皮膜是以非晶質碳皮膜為實用性,其是使用做為鑽頭或銑刀、刃頭交換型切削刀等切削工具的被覆(例如參照專利文獻3)。In addition, a film having abrasion resistance and weldability suitable for non-ferrous materials such as aluminum alloy, titanium, magnesium, and copper is practical for an amorphous carbon film, and is used as a drill or A coating of a cutting tool such as a milling cutter or a blade-replacement type cutter (see, for example, Patent Document 3).

然而,PCB是由銅和做為絕緣層之含浸有樹脂的玻璃布貼合構成,近年來的PCB,為了要更加提昇其可靠性,是需要提昇耐熱性,加強彎曲強度及低熱膨脹化,因此大多數是提高PCB構成用的玻璃布或樹脂的機械性強度,藉此確保較高的可靠性。However, the PCB is composed of copper and a glass cloth impregnated with resin as an insulating layer. In recent years, in order to further improve the reliability of the PCB, it is necessary to improve heat resistance, strengthen bending strength, and reduce thermal expansion. Most of them are mechanical strengths for improving the glass cloth or resin used for the construction of the PCB, thereby ensuring high reliability.

不過,當考慮到PCB是做為要進行鑽孔加工的被削材時,上述構成的PCB會因為機械性強度的提高相對地容易促進鑽頭磨損,容易導致鑽孔加工中的鑽頭折損或過度磨損造成孔位置精度等的孔品質變差。However, when considering that the PCB is used as a material to be drilled, the PCB constructed as described above is relatively easy to promote bit wear due to an increase in mechanical strength, and is liable to cause bit breakage or excessive wear in the drilling process. The quality of the hole causing the hole position accuracy or the like is deteriorated.

另一方面,隨著PCB的高密度化,所要求的孔徑(鑽頭的直徑)是逐年小徑化,直徑為0.4mm以下的鑽孔加工逐漸變多。On the other hand, as the density of the PCB is increased, the required aperture (diameter of the drill) is reduced in diameter year by year, and the drilling process having a diameter of 0.4 mm or less is gradually increased.

此外,於鑽孔加工步驟,考慮到加工效率,一般是將相同規格的PCB複數片重疊後進行鑽孔加工。具體而言,一般是在複數片重疊的PCB上面載置有目的為提高鑽頭之求心性的抵接板即鋁板或表面被覆有樹脂之附帶樹脂的鋁板之後進行鑽孔加工。附帶樹脂的鋁板是比鋁板提昇求心性的效果高,此外為了有助於鑽頭折損的改善,特別是以使用在直徑0.4mm以下之小徑鑽頭的鑽孔加工為多數。In addition, in the drilling processing step, in consideration of the processing efficiency, generally, a plurality of PCBs of the same specification are overlapped and then drilled. Specifically, in general, an aluminum plate which is an abutting plate for improving the centering property of the drill or an aluminum plate with a resin-coated resin whose surface is designed to improve the centering property of the drill is placed on the PCB, and then the drilling process is performed. The aluminum plate with resin is more effective than the aluminum plate for improving the centering property, and in order to contribute to the improvement of the bit breakage, in particular, drilling using a small diameter drill having a diameter of 0.4 mm or less is common.

近年來,針對上述加工性比較差的PCB之加工所使用的PCB用小徑鑽頭,同樣地也以削減加工成本為目的要求能夠在PCB重疊片數增加及鑽頭不折損的狀況下進行鑽孔加工又能夠延長鑽頭鑽孔的壽命。In recent years, in order to reduce the processing cost, the small-diameter drill for PCB used for the processing of the PCB having poor workability is required to be drilled under the condition that the number of overlapping PCBs is increased and the drill is not broken. It also extends the life of the drill bit.

不過,使用附帶樹脂之鋁板做為抵接板進行鑽孔加工時,是比使用鋁板進行鑽孔加工時,還會在鑽頭之刃部C的基端部附近明確產生切屑之捲附殘屑,樹脂的黏性愈高或被覆的樹脂厚度愈厚,產生上述切屑之捲附殘屑的傾向愈高,以致難以實現上述的要求。However, when the aluminum plate with the resin is used as the abutting plate for drilling, when the aluminum plate is used for drilling, the scraps of the chips are clearly generated near the base end portion of the blade portion C of the drill. The higher the viscosity of the resin or the thicker the thickness of the resin to be coated, the higher the tendency of the above-mentioned chips to wrap the debris, so that it is difficult to achieve the above requirements.

其原因是,通常鑽孔加工時產生的切屑是利用鑽孔機附屬的切屑吸取功能吸取,然後搬出至指定的垃圾箱,但使用附帶樹脂之鋁板時,因鑽孔加工時的切削熱而形成為軟化的樹脂會和切屑一起受到切屑排出槽的引導而排出,導致在刃部C的基端部附近產生鑽頭和切屑的黏附作用,持續重覆進行鑽孔加工勢必會造成切屑之捲附殘屑量的增加。The reason is that the chips generated during the drilling process are usually sucked by the chip suction function attached to the drilling machine, and then carried out to the designated garbage bin, but when the aluminum plate with the resin is used, it is formed by the heat of cutting during the drilling process. The softened resin is discharged together with the chips by the guiding of the chip discharge groove, resulting in the adhesion of the drill bit and the chip near the base end portion of the blade portion C. Continuously repeating the drilling process is bound to cause the chip to be attached. The amount of scrap is increased.

切屑之捲附殘屑量,也會因為鑽孔加工時之鑽頭的旋轉數或進刀速度的加工條件或PCB的材質而有所改變,但如第3(a)圖所示產生明顯的切屑之捲附殘屑,其原因是該切屑之捲附殘屑在持續的鑽孔加工中因某種因素的振動等造成切屑(切屑塊)離開鑽頭,即使鑽孔機具有上述吸取功能但切屑塊也不會被吸取以致切屑塊掉落在抵接板上,然後,正要鑽孔加工的鑽頭會因掉落的切屑塊干涉導致孔位置精度變差或鑽頭折損。另,第3(b)圖中例示著掉落在抵接板上的切屑塊。The amount of debris attached to the chip is also changed by the number of rotations of the drill during the drilling process or the machining conditions of the feed speed or the material of the PCB, but the obvious chip is produced as shown in Fig. 3(a). The coil is attached with debris, because the chip is attached to the chip during the continuous drilling process due to vibration of a certain factor, etc., causing the chip (chip block) to leave the drill bit, even if the drill has the above suction function but the chip block It is also not sucked so that the chip pieces fall on the abutment plate, and then the drill bit being drilled may cause the hole position accuracy to deteriorate or the bit to be broken due to the interference of the falling chip block. In addition, the chip block dropped on the abutting plate is exemplified in the third (b).

此外,例如:專利文獻4中,是針對具有2個切任和2個切屑排出槽的PCB鑽頭,揭示有下述技術即是將各切屑排出槽在從前端後退指定量的位置合流,在比合流點還後方的位置成為1個溝槽,藉此提高剛性,但並未言及切屑的捲附,因此是無法滿足上述要求。Further, for example, Patent Document 4 discloses a PCB drill having two cutting and two chip discharge grooves, and discloses a technique in which each of the chip discharge grooves is merged at a predetermined amount from the front end. The position behind the merging point is one groove, thereby increasing the rigidity, but does not mention the winding of the chips, and thus the above requirements cannot be satisfied.

[先行技術文獻][Advanced technical literature] [專利文獻][Patent Literature]

[專利文獻1]日本特開昭56-39807號公報[Patent Document 1] Japanese Patent Laid-Open No. 56-39807

[專利文獻2]日本特開2006-55915號公報[Patent Document 2] Japanese Patent Laid-Open Publication No. 2006-55915

[專利文獻3]日本特開2001-341021號公報[Patent Document 3] Japanese Patent Laid-Open Publication No. 2001-341021

[專利文獻4]日本特開昭2007-307642號公報[Patent Document 4] Japanese Laid-Open Patent Publication No. 2007-307642

本發明是有鑑於上述現狀而為的發明,目的是提供一種能夠防止切屑捲附,即使是直徑為0.7mm以下,特別是0.4mm以下的小徑鑽頭,也可成為折損壽命長能夠實現穩定的鑽孔加工又實用性極為優秀的鑽孔工具。The present invention has been made in view of the above circumstances, and it is an object of the invention to provide a small-diameter drill having a diameter of 0.7 mm or less, particularly 0.4 mm or less, which can be stabilized even when the diameter is 0.7 mm or less, particularly 0.4 mm or less. Drilling and drilling tools that are extremely practical.

以下是參照附圖對本發明的主旨進行說明。The gist of the present invention will be described below with reference to the drawings.

本發明相關的鑽孔工具,是在工具本體1的前端設有1個或複數切刃,於該工具本體1的外圍從工具前端朝基端側設有複數螺旋狀切屑排出槽,該複數切屑排出槽是至少包括1個主溝槽2a和1個副溝槽2b,在上述主溝槽2a的途中部設有1個或複數副溝槽2b形成合流,其特徵是於上述主溝槽2a及副溝槽2b的合流部6設置段差7。In the drilling tool according to the present invention, one or a plurality of cutting edges are provided at the front end of the tool body 1. On the periphery of the tool body 1, a plurality of spiral chip discharge grooves are provided from the front end of the tool toward the base end side, and the plurality of chips are discharged. The groove includes at least one main groove 2a and one sub-groove 2b, and one or a plurality of sub-grooves 2b are formed in the middle of the main groove 2a to form a merged flow, which is characterized by the main groove 2a and The merging portion 6 of the sub-groove 2b is provided with a step 7.

此外,本發明相關的鑽孔工具,是於申請專利範圍第1項記載的鑽孔工具中,其特徵為,上述段差7是由上述主溝槽2a和上述副溝槽2b之溝槽深度的差異形成。Further, the boring tool according to the first aspect of the invention is characterized in that the step 7 is a groove depth of the main groove 2a and the sub-groove 2b. Differences are formed.

另外,本發明相關的鑽孔工具,是於申請專利範圍第1項記載的鑽孔工具中,其特徵為,上述段差7是2μm以上。Further, the drilling tool according to the first aspect of the invention is characterized in that the step 7 is 2 μm or more.

此外,本發明相關的鑽孔工具,是於申請專利範圍第2項記載的鑽孔工具中,其特徵為,上述段差7是2μm以上。Further, the drilling tool according to the second aspect of the invention is characterized in that the step 7 is 2 μm or more.

另外,本發明相關的鑽孔工具,是於申請專利範圍第3項記載的鑽孔工具中,其特徵為,上述段差7是主溝槽2a之溝槽深度的70%以下。Further, the drilling tool according to the third aspect of the invention is characterized in that the step 7 is 70% or less of the groove depth of the main groove 2a.

此外,本發明相關的鑽孔工具,是於申請專利範圍第4項記載的鑽孔工具中,其特徵為,上述段差7是主溝槽2a之溝槽深度的70%以下。Further, the drilling tool according to the fourth aspect of the invention is characterized in that the step 7 is 70% or less of the groove depth of the main groove 2a.

另外,本發明相關的鑽孔工具,是於申請專利範圍第1項至第6項任一項記載的鑽孔工具中,其特徵為,將上述主溝槽2a或上述副溝槽2b的螺旋角在工具前端側和工具基端側形成為不同,藉此使上述主溝槽2a和上述副溝槽2b形成合流。Further, the boring tool according to any one of the first to sixth aspects of the present invention is characterized in that the main groove 2a or the sub-groove 2b is spiraled. The corners are formed differently on the tool leading end side and the tool base end side, whereby the main groove 2a and the sub-groove 2b are joined together.

此外,本發明相關的鑽孔工具,是於申請專利範圍第1項至第6項任一項記載的鑽孔工具中,其特徵為,上述合流部6是設置在距離工具前端有上述主溝槽2a之溝槽長1的50%以下的位置。The boring tool according to any one of claims 1 to 6, wherein the merging portion 6 is provided at the front end of the tool and has the main groove. The groove 2a has a groove length of 50% or less.

另外,本發明相關的鑽孔工具,是於申請專利範圍第7項記載的鑽孔工具中,其特徵為,上述合流部6是設置在距離工具前端有上述主溝槽2a之溝槽長1的50%以下的位置。Further, the boring tool according to the seventh aspect of the invention is characterized in that the merging portion 6 is disposed at a groove length of the main groove 2a from the front end of the tool. Below 50% of the location.

此外,本發明相關的鑽孔工具,是於申請專利範圍第8項記載的鑽孔工具中,其特徵為,被覆有潤滑性皮膜。Further, the drilling tool according to the invention of claim 8 is characterized in that the drilling tool is coated with a lubricating film.

另外,本發明相關的鑽孔工具,是於申請專利範圍第9項記載的鑽孔工具中,其特徵為,被覆有潤滑性皮膜。Further, the boring tool according to the invention of claim 9 is characterized in that the boring tool according to claim 9 is coated with a lubricating film.

此外,本發明相關的鑽孔工具,是於申請專利範圍第10項記載的鑽孔工具中,其特徵為,上述潤滑性皮膜是採用非晶質碳皮膜。Further, the drilling tool according to the invention of claim 10 is characterized in that the lubricating film is made of an amorphous carbon film.

另外,本發明相關的鑽孔工具,是於申請專利範圍第11項記載的鑽孔工具中,其特徵為,上述潤滑性皮膜是採用非晶質碳皮膜。Further, the drilling tool according to the invention of claim 11 is characterized in that the lubricating film is made of an amorphous carbon film.

此外,本發明相關的鑽孔工具,是於申請專利範圍第12項記載的鑽孔工具中,其特徵為,工具直徑為0.7mm以下。Further, the drilling tool according to the invention of claim 12 is characterized in that the tool diameter is 0.7 mm or less.

另外,本發明相關的鑽孔工具,是於申請專利範圍第13項記載的鑽孔工具中,其特徵為,工具直徑為0.7mm以下。Further, the drilling tool according to the invention of claim 13 is characterized in that the tool diameter is 0.7 mm or less.

此外,本發明相關的鑽孔工具,是於申請專利範圍第12項記載的鑽孔工具中,其特徵為,工具直徑為0.4mm以下。Further, the drilling tool according to the invention of claim 12 is characterized in that the tool diameter is 0.4 mm or less.

另外,本發明相關的鑽孔工具,是於申請專利範圍第13項記載的鑽孔工具中,其特徵為,工具直徑為0.4mm以下。Further, the drilling tool according to the invention of claim 13 is characterized in that the tool diameter is 0.4 mm or less.

本發明因是如以上所述的構成,所以就能夠防止切屑捲附,即使是直徑0.7mm以下特別是0.4mm以下的小徑鑽頭,還是能夠成為折損壽命長能夠實現穩定鑽孔加工之實用性極佳的鑽孔工具。Since the present invention has the above-described configuration, it is possible to prevent the chip from being wound up, and even a small-diameter drill having a diameter of 0.7 mm or less and particularly 0.4 mm or less can be used for a stable drilling process with a long breakage life. Excellent drilling tool.

[發明之最佳實施形態][Best Embodiment of the Invention]

以下,是根據圖面以揭示本發明作用的方式對本發明之最佳實施形態進行簡單的說明。Hereinafter, the best mode for carrying out the invention will be briefly described on the basis of the drawings.

在鑽孔加工時當工具前端部產生的切屑沿著切屑排出槽排出時,切屑彼此會在主溝槽2a和副溝槽b的合流部6產生衝撞,此外,又加上主溝槽2a和副溝槽b之合流部6的段差7,是會使切屑於合流部6強制性(朝工具徑方向)飛散難以到達工具基端部,因此就能夠防止工具基端部的切屑捲附。When the chips generated at the front end portion of the tool are discharged along the chip discharge groove during the drilling process, the chips collide with each other at the joining portion 6 of the main groove 2a and the sub groove b, and further, the main groove 2a is added. The step 7 of the merging portion 6 of the sub-grooves b makes it difficult for the chips to be converge in the merging portion 6 (toward the tool diameter direction) and is difficult to reach the tool base end portion. Therefore, it is possible to prevent the chip from being attached to the tool base end portion.

[實施例][Examples]

針對本發明具體性的實施例是根據第4圖~第10圖進行說明。Embodiments specific to the present invention will be described with reference to Figs. 4 to 10 .

本實施例的鑽孔工具,是在工具本體1的前端設有1個或複數的切刃,於該工具本體1的外圍從工具前端朝基端側設有複數螺旋狀切屑排出槽,該複數切屑排出槽是至少包括1個主溝槽2a和1個副溝槽2b,在上述主溝槽2a的途中部設有1個或複數副溝槽2b形成合流,其特徵為是於上述主溝槽2a及副溝槽2b的合流部6設置段差7。In the drilling tool of this embodiment, one or a plurality of cutting edges are provided at the front end of the tool body 1. On the periphery of the tool body 1, a plurality of spiral chip discharge grooves are provided from the front end of the tool toward the base end side, and the plurality of chips are provided. The discharge groove is composed of at least one main groove 2a and one sub-groove 2b, and one or a plurality of sub-grooves 2b are formed in the middle of the main groove 2a to form a merged flow, which is characterized in that the main groove is The merging portion 6 of 2a and the sub-groove 2b is provided with a step difference 7.

具體而言,本實施例的鑽頭,工具直徑為0.075mm,設有1條溝槽長1為1.2mm之主溝槽2a和與該主溝槽2a合流的副溝槽2b,在該主溝槽2a及副溝槽2b的傾斜面和上述工具本體1之前端後隙面(第一後隙面)之交叉稜線部是分別設有與工具本體1成為一體的切刃,該鑽頭是使用在PCB的鑽孔加工。Specifically, the drill of the present embodiment has a tool diameter of 0.075 mm, and is provided with a main groove 2a having a groove length of 1 and a sub groove 2b which merges with the main groove 2a, and a main groove 2b. The intersecting ridge portions of the inclined surface of the groove 2a and the auxiliary groove 2b and the front end flank surface (first flank surface) of the tool body 1 are respectively provided with cutting edges integral with the tool body 1, and the drill is used in Drilling of PCB.

該PCB的鑽孔加工,例如:如下述的實驗例所示,是將難削材即半導體封裝用的PCB(基板:厚度0.1mm/表背兩面Cu層)5片重疊,在該上面載置厚度0.1mm的附帶樹脂鋁板做為抵接板,為了能夠進行貫通孔加工,在上述PCB的下面配置一般做為丟棄材使用之厚度為1.5mm的紙酚材,於該狀態下進行鑽孔加工。抵接板的厚度是適當設定在0.04~1.0mm的範圍。此外,厚度0.1mm程度之PCB的Cu層厚度通常為2~80μm程度。The drilling process of the PCB is, for example, as shown in the following experimental example, in which a hard-to-cut material, that is, a PCB for a semiconductor package (a substrate: a thickness of 0.1 mm/a Cu layer on the front and back sides) is superposed on each other, and is placed thereon. A resin-coated aluminum plate having a thickness of 0.1 mm is used as a contact plate, and in order to enable through-hole processing, a paper phenol material having a thickness of 1.5 mm which is generally used as a discard material is disposed on the lower surface of the PCB, and drilling is performed in this state. . The thickness of the abutment plate is appropriately set in the range of 0.04 to 1.0 mm. Further, the thickness of the Cu layer of the PCB having a thickness of about 0.1 mm is usually about 2 to 80 μm.

另,於本實施例中是針對具有2個切刃和2個切屑排出槽(1個主溝槽2a和1個副溝槽2b)的鑽頭(2片刃)進行說明,但對於形態為只在主溝槽側設有切刃的1片刃鑽頭,或3片刃以上的鑽頭(例如具有1個主溝槽和2個副溝槽的鑽頭)也是相同。Further, in the present embodiment, a drill (two blades) having two cutting edges and two chip discharge grooves (one main groove 2a and one sub groove 2b) will be described, but the form is only The same is true for a one-blade drill having a cutting edge on the main groove side or a drill having three blades or more (for example, a drill having one main groove and two sub-grooves).

更具體地說,於上述條件之形態時,因容易產生上述切屑的捲附殘屑,所以為了解決該問題就對第2圖所示的工具進行了改良,所改良的構成為是於工具本體1被覆非晶質碳皮膜,在鑽頭的主溝槽2a設置具有第一螺旋角α1 的第一螺旋區域3和連設在第一螺旋區域3的工具基端側具有比第一螺旋角α1 還大之第二螺旋角α2 的第二螺旋區域4(副溝槽2b的螺旋角α3 為一定),使主溝槽2a和副溝槽2b形成合流[參照第4圖、第5圖,另,第5(a)圖~第5(c)圖是第4圖前端部份從各種不同旋轉相位看時的圖面。]。More specifically, in the case of the above condition, since the chip is likely to be wound, the tool shown in Fig. 2 is improved in order to solve the problem, and the improved structure is the tool body. 1 coating an amorphous carbon film, providing a first spiral region 3 having a first helix angle α 1 in the main groove 2a of the drill bit and a tool base end side connected to the first spiral region 3 having a first helix angle α 1 is further large in the second spiral region 4 of the second helix angle α 2 (the helix angle α 3 of the sub-groove 2b is constant), and the main groove 2a and the sub-groove 2b are merged [refer to Figs. 4 and 5). In addition, Fig. 5(a) to Fig. 5(c) are diagrams of the front end portion of Fig. 4 as seen from various rotation phases. ].

另,也可構成為並不是在主溝槽2a而是在副溝槽2b或是在主溝槽2a及副溝槽2b的雙方設置第一螺旋區域和第二螺旋區藉此形成合流(連設),亦可構成為是將主溝槽2a或副溝槽2b的螺旋角朝工具基端側逐漸(曲線性)改變(變大)藉此形成合流,也可構成為開始就先改變主溝槽2a及副溝槽2b的螺旋角使該等形成合流。Alternatively, the first spiral region and the second spiral region may be disposed not on the main trench 2a but in the sub trench 2b or on both the main trench 2a and the sub trench 2b. Further, it may be configured such that the spiral angle of the main groove 2a or the sub-groove 2b is gradually changed (curved) toward the base end side of the tool to form a merged flow, and it may be configured to change the main body at the beginning. The helix angles of the grooves 2a and the sub-grooves 2b cause the formation to merge.

此外,主溝槽2a和副溝槽2b之合流部6的段差7,是以切屑的飛散效果為目的利用主溝槽2a和副溝槽2b之溝槽深度的不同形成,因此主溝槽2和副溝槽2b的溝槽深度是沒有限定那一方為較深。具體而言,當將主溝槽2a的溝槽深度(主溝槽深度、主溝槽2a之工具半徑方向最深距離)X形成為比副溝槽2b的溝槽深度(副溝槽深度、副溝槽2b之工具半徑方向最深距離)Y還深藉此形成段差7時,於合流部6欲合流的切屑彼此會衝撞無法合流,導致切屑往徑方向飛散。此外,當將副溝槽2b的溝槽深度Y形成為比主溝槽2a的溝槽深度X還深藉此形成段差7時,副溝槽2b於合流部6會消失使切屑衝撞主溝槽2a的壁,由於排出空間消失,因此切屑就會往徑方向飛散。Further, the step 7 of the merging portion 6 of the main groove 2a and the sub-groove 2b is formed by the difference in the groove depth of the main groove 2a and the sub-groove 2b for the purpose of the scattering effect of the chips, and thus the main groove 2 The groove depth of the sub-groove 2b and the groove depth of the sub-groove 2b are not limited. Specifically, when the groove depth of the main groove 2a (the depth of the main groove, the deepest distance in the tool radius direction of the main groove 2a) X is formed to be the groove depth of the sub groove 2b (the sub groove depth, the sub When the depth of the tool 2 in the radial direction of the groove 2b is deep, the chips which are to be joined at the merging portion 6 collide with each other and cannot merge, and the chips are scattered in the radial direction. Further, when the groove depth Y of the sub-groove 2b is formed deeper than the groove depth X of the main groove 2a to thereby form the step 7, the sub-groove 2b disappears at the merging portion 6 to cause the chip to collide with the main groove. In the wall of 2a, since the discharge space disappears, the chips will scatter in the radial direction.

另外,於本實施例中,為了避免以下詳細說明之磨石痕造成的折損危險性,是將副溝槽2b的溝槽深度Y形成為比主溝槽2a的溝槽深度X還淺藉此形成段差7[參照表示第5(b)圖A-A剖面圖的第6圖]。Further, in the present embodiment, in order to avoid the risk of breakage caused by the grindstones described in detail below, the groove depth Y of the sub-groove 2b is formed to be shallower than the groove depth X of the main groove 2a. A step 7 is formed [refer to Fig. 6 showing a sectional view of Fig. 5(b) AA].

該段差7是以2μm以上且為主溝槽2a之溝槽深度X的70%以下為佳。當上述斷差7未滿2μm時,製造上於主溝槽2a產生有磨石痕的可能性就高,應力會集中在該磨石痕可能成為折損的起點,以致折損的可能性變高,此外工具剛性變差也會影響到孔位精度。本實施例1是將上述段差7設定為3μm(主溝槽2a之溝槽深度X的37%),本實施例2是將上述段差7設定為5.2μm(主溝槽2a之溝槽深度X的64%)。另外,當上述段差7大於主溝槽2a之溝槽深度X的70%時,副溝槽2b會變太淺,有可能阻礙到需求最低限度的切屑排出性,因此並不理想(第7圖中並未圖示,但將段差7設定為主溝槽2a之溝槽深度X的70%時鑽頭的實驗結果為折損)。The step difference 7 is preferably 2 μm or more and 70% or less of the groove depth X of the main groove 2a. When the above-mentioned hysteresis 7 is less than 2 μm, the possibility of producing a grindstone mark on the main groove 2a is high, and the stress is concentrated on the grindstone mark which may become a starting point of the breakage, so that the possibility of breakage becomes high. In addition, the rigidity of the tool will also affect the accuracy of the hole position. In the first embodiment, the step 7 is set to 3 μm (37% of the groove depth X of the main trench 2a), and in the second embodiment, the step 7 is set to 5.2 μm (the groove depth X of the main trench 2a) 64%). Further, when the step 7 is larger than 70% of the groove depth X of the main groove 2a, the sub-groove 2b becomes too shallow, which may hinder the chip discharge with the minimum demand, and thus is not preferable (Fig. 7) Although not shown in the figure, the experimental result of the drill is the break when the step 7 is set to 70% of the groove depth X of the main groove 2a.

另,於本申請中是將主溝槽2a和副溝槽2b的合流開始點(離工具前端有O距離的位置)至合流結束點(離工具前端有P距離的位置)為止的區域為合流部6。此外,於本申請該段差7的測定位置,是在主溝槽2a和副溝槽2b之合流開始點和合流結束點的中間位置Q即合流(連設)中心點的位置。In the present application, the joining start point of the main groove 2a and the sub-groove 2b (the position having an O distance from the tool tip) to the joining end point (the position having a P distance from the tool tip) is merged. Department 6. Further, the measurement position of the step 7 in the present application is a position at which the center point of the joining start point and the joining end point of the main groove 2a and the sub-groove 2b is merged (connected).

此外,是以可使合流部6的基端位置(主溝槽2a和付溝槽2b的合流結束點)設置在距離工具前端有主溝槽2a之溝槽長1的50%以下的位置為條件來設定第一螺旋區域3及第二螺旋區域4的各螺旋角及連設位置。該形態時,溝槽在距離工具前端超過溝槽長1之50%的區域就會成為1個使剛性提高,提昇孔位置精度。當將合流部6從工具前端設置在比主溝槽2a的溝槽長1之50%還後方(基端側)的位置時,溝槽容積會變大,導致工具的剛性變差,孔位置精度變差或導致折損的可能性變高。於本實施例,合流部6的基端位置是設定成位於距離工具前端有溝槽長1之32%的位置。Further, the position of the base end of the merging portion 6 (the end point of the joining of the main groove 2a and the sub groove 2b) is set to be 50% or less of the groove length 1 of the main groove 2a at the tip end of the tool. The respective helix angles and the connection positions of the first spiral region 3 and the second spiral region 4 are set under the conditions. In this form, the groove is increased in rigidity in a region that is more than 50% of the groove length from the tip end of the tool, and the hole position accuracy is improved. When the merging portion 6 is disposed at a position rearward (base end side) of 50% longer than the groove of the main groove 2a from the tip end of the tool, the groove volume becomes large, resulting in deterioration of the rigidity of the tool, and the hole position The possibility of deterioration in accuracy or loss of damage is increased. In the present embodiment, the position of the base end of the merging portion 6 is set to be located at a position 32% longer than the groove length of the tool tip.

接著,是對各部進行具體性說明。Next, each part will be specifically described.

該鑽頭,其基材,是以WC為主成份的硬質粒子和以Co為主成份的結合材所形成的超硬合金製,採用該超硬合金之WC粒子的平均粒徑為0.1μm~2μm且Co含有量其重量%為5~15%的超合金基材,此外至少是在工具本體1的切屑排出槽被覆有非晶質碳皮膜。非晶質碳皮膜因是為硬質所以能夠抑制工具的磨耗,此外又具有高的潤滑性容易使切屑沿著切屑排出槽往工具本體1的基端側排出能夠防止切屑堵塞因此就不易折損。The drill bit is made of a superhard alloy formed of a hard particle containing WC as a main component and a binder composed mainly of Co. The average particle diameter of the WC particle using the superhard alloy is 0.1 μm to 2 μm. Further, the Co content is a superalloy base material having a weight % of 5 to 15%, and at least the amorphous carbon film is coated on the chip discharge groove of the tool body 1. Since the amorphous carbon film is hard, it is possible to suppress wear of the tool, and it has high lubricity, and it is easy to discharge the chips along the chip discharge groove toward the proximal end side of the tool body 1 to prevent clogging of the chips, so that the chips are less likely to be broken.

此外,本實施例中,潤滑性皮膜,是採用以碳原子為主體構成其維克氏硬度為3000以上之高硬度非晶質碳(DLC)所形成的非晶質碳皮膜,但只要維克氏硬度為2000以上,也可採用比較低硬度的非晶質碳(DLC)和其他物質(例如金屬)之混合物所形成的皮膜,此外也可採用鉻氮化物等其他的潤滑性皮膜。Further, in the present embodiment, the lubricating film is an amorphous carbon film formed of a high hardness amorphous carbon (DLC) having a Vickers hardness of 3,000 or more mainly composed of carbon atoms, but as long as Vic When the hardness is 2,000 or more, a film formed by a mixture of a relatively low hardness amorphous carbon (DLC) and another substance (for example, a metal) may be used, and another lubricating film such as a chromium nitride may be used.

另,本實施例中,非晶質碳皮膜是形成在基材正上方,但也可構成為例如:是於基材正上方,形成有從週期表之4a、5a、6a族及Si當中選出1種或2種以上之元素所形成的金屬或半金屬所構成,其膜厚為200nm以下且1nm以上的下層皮膜層(底膜),然後在該下層皮膜層上形成有上述非晶質碳皮膜。此外,下層皮膜層,並不限於上述構成,也可採用從週期表之4a、5a、6a族及Si當中選出1種或2種以上之元素和從氮及碳當中選出1種以上之元素的化合物所構成的下層皮膜層。Further, in the present embodiment, the amorphous carbon film is formed directly above the substrate, but may be formed, for example, directly above the substrate, and formed from the group 4a, 5a, 6a and Si of the periodic table. a thin film layer (base film) having a thickness of 200 nm or less and 1 nm or more, which is formed of a metal or a semimetal formed of one or more kinds of elements, and then the amorphous carbon is formed on the lower film layer. Membrane. In addition, the lower film layer is not limited to the above-described configuration, and one or two or more elements selected from Groups 4a, 5a, and 6a of the periodic table and Si may be used, and one or more elements selected from nitrogen and carbon may be used. The underlying film layer composed of the compound.

此外,本實施例中,對於非晶質碳皮膜或底膜的成膜,是使用電弧離子鍍敷方式的成膜裝置,但也可使用濺鍍方式或雷射燒蝕塗敷方式等PVD成膜裝置。Further, in the present embodiment, the film formation apparatus using the arc ion plating method is used for film formation of the amorphous carbon film or the base film, but PVD formation such as sputtering method or laser ablation coating method may be used. Membrane device.

第一螺旋角α1 是設定在30°~45°。螺旋角,是會影響切屑的排出性和鑽頭剛性,當將螺旋角形成為較大時是可提昇切屑排出性,但相反地會和剛性降低有關。當構成為小徑鑽頭的形態時,鑽頭的耐折損性不只會受到剛性的影響也容易受到切屑排出性的影響。因此,直徑為0.7mm以下,特別是為0.4mm以下之鑽頭的螺旋角是以設定成較大為佳,一般是設定在30°~45°。The first helix angle α 1 is set at 30° to 45°. The helix angle affects the discharge of the chips and the rigidity of the drill bit. When the helix angle is formed to be large, the chip discharge property can be improved, but conversely, it is related to the decrease in rigidity. When it is configured in the form of a small-diameter drill, the fracture resistance of the drill is not only affected by the rigidity but also susceptible to the chip discharge property. Therefore, the helix angle of the drill having a diameter of 0.7 mm or less, particularly 0.4 mm or less, is preferably set to be larger, and is generally set at 30 to 45 degrees.

本發明者等,為了要更家提昇鑽頭的耐折損性,針對鑽頭的剛性和切屑排出性之顯示相反特性的螺旋角進行重覆研究的結果,得知:當被削物上面載置有鋁板或附帶樹脂鋁板時,或被削物的內外層等有較多的銅箔時,若是將螺旋角為未滿30°,則切屑排出性會變差導致鑽頭容易折損,若將螺旋角設定成比45°,則因切屑排出性的提昇是會造成耐折損性提昇,但會導致鋁或銅的切屑形成為過度薄又長,以致在工具本體1(切屑排出槽)的基端部(根基部)容易產生切屑的捲附殘屑。In order to further improve the fracture resistance of the drill bit, the inventors of the present invention conducted a repeated study on the rigidity of the drill bit and the spiral angle of the opposite characteristic of the chip discharge property, and found that the aluminum plate was placed on the object to be cut. When a resin aluminum plate is attached, or when there is a large amount of copper foil in the inner and outer layers of the workpiece, if the helix angle is less than 30°, the chip discharge property is deteriorated, and the drill is easily broken. If the helix angle is set to When the ratio is 45°, the increase in chip discharge is caused by the increase in the fracture resistance, but the chip of aluminum or copper is formed to be excessively thin and long, so that the base end of the tool body 1 (chip discharge groove) Part) It is easy to produce chips with attached debris.

再加上,本發明者等,也查明:構成為被覆有非晶質碳皮膜等潤滑性皮膜的鑽頭時,其與沒有塗敷的鑽頭相比是有提昇耐折損性的效果,但會明顯產生切屑的捲附殘屑,該切屑的捲附殘屑(切屑塊)會掉落在抵接板上,因掉落的切屑塊有時會干涉到鑽頭造成孔位置精度變差或造成鑽頭的折損壽命不穩定以致早期折損。In addition, the inventors of the present invention have also found that when a drill having a lubricating film such as an amorphous carbon film is coated, it has an effect of improving fracture resistance as compared with a drill which is not coated. The debris of the chip is obviously generated, and the debris (chip block) of the chip is dropped on the abutting plate, and the falling chip block sometimes interferes with the bit to cause the hole position accuracy to be deteriorated or the drill bit is caused. The fracture life is unstable and causes early damage.

當考慮到該等因素時,切削執行用之工具前端的切刃部份是以螺旋角(第一螺旋角α1 及副溝槽2b的螺旋角α3 )為45°以下的角度(30°~45°)為佳,藉此確保切屑排出性的同時使產生的切屑較短不會有切屑捲附。再加上,該螺旋角(第一螺旋角α1 及副溝槽2b的螺旋角α3 )又以設定成30°~45°為更佳。本實施例中,主溝槽2a的第一螺旋角α1 及副溝槽2b的螺旋角α3 是設定成38°。When these factors are taken into consideration, the cutting edge portion of the tip end of the tool for cutting execution is an angle (30°) at a helix angle (the first helix angle α 1 and the helix angle α 3 of the subgroove 2b) is 45° or less. It is preferable to use ~45°) to ensure the chip discharge property while making the generated chips shorter without chipping. Further, the helix angle (the first helix angle α 1 and the helix angle α 3 of the sub-groove 2b) is more preferably set to 30° to 45°. In the present embodiment, the first helix angle α 1 of the main groove 2a and the helix angle α 3 of the sub-groove 2b are set to 38°.

第二螺旋角α2 是設定成比第一螺旋角α1 還大5°以上的角度,並且是設定在35°~65°。藉由將第二螺旋角α2 形成為比第一螺旋角α1 還大,是能夠提高切屑排出槽之基端側的切屑排出性能夠提昇耐折損性。The second helix angle α 2 is an angle set to be larger than the first helix angle α 1 by 5° or more, and is set at 35° to 65°. By forming the second helix angle α 2 larger than the first helix angle α 1 , the chip discharge performance on the proximal end side of the chip discharge groove can be increased, and the fracture resistance can be improved.

此外,利用被覆有非晶質碳皮膜(潤滑性皮膜)的效果,是可使沿著設定成第一螺旋角α1 之第一螺旋區域3的切屑排出槽順暢排出的切屑排出方向強制性改變成往設定成第二螺旋角α2 之第二螺旋區域4的切屑排出槽,利用與離心力的相乘效果使切屑往工具本體1的外方飛散,從該點來看也是能夠防止切屑的捲附使折損壽命變長又穩定。Further, the effect of coating the amorphous carbon film (lubricating film) is such that the chip discharge direction which is smoothly discharged along the chip discharge groove of the first spiral region 3 set to the first helix angle α 1 can be forcibly changed. The chip discharge groove which is set to the second spiral region 4 of the second helix angle α 2 is used to scatter the chips to the outside of the tool body 1 by the synergistic effect with the centrifugal force, and from this point of view, it is also a roll capable of preventing chips. The damage life is longer and stable.

當第一螺旋角α1 和第二螺旋角α2 的角度差未滿5°時,強制性改變切屑排出方向的效果就會降低,螺旋角改變所造成之切屑往工具本體1外方飛散的效果就會降低。此外,當第二螺旋角α2 比第一螺旋角α1 大時工具本體1之基端部的剛性會降低,導致耐折損性變差。When the angular difference between the first helix angle α 1 and the second helix angle α 2 is less than 5°, the effect of forcibly changing the direction in which the chips are discharged is lowered, and the chips caused by the change in the helix angle are scattered toward the outside of the tool body 1 . The effect will be reduced. Further, when the second helix angle α 2 is larger than the first helix angle α 1 , the rigidity of the base end portion of the tool body 1 is lowered, resulting in deterioration of the fracture resistance.

再加上,又以第一螺旋角α1 和第二螺旋角α2 的角度差設定成10°以上,並且,第一螺旋角α1 和第二螺旋角α2 的合計角度設定在45°~60°為更佳。本實施例中,第二螺旋角α2 ,是設定成與第一螺旋角α1 (38°)有17°之角度差的55°。Further, the angle difference between the first helix angle α 1 and the second helix angle α 2 is set to 10° or more, and the total angle of the first helix angle α 1 and the second helix angle α 2 is set at 45°. ~60° is better. In the present embodiment, the second helix angle α 2 is set to 55° which is an angular difference of 17° from the first helix angle α 1 (38°).

另外,為了良好排出切屑,是以盡可能在工具前端側改變成第二螺旋角α2 為佳,但一般而言PCB用的鑽頭是在使用後重新研磨前端之後再做為使用(再研磨),因此第一螺旋區域3和第二螺旋區域4的連設部5,當考慮到研磨量時是以設定在距離工具前端0.2mm以上且為切屑排出槽之溝槽長1的50%以下的位置為佳。In addition, in order to discharge the chips well, it is preferable to change the second helix angle α 2 as far as possible on the tool front end side, but generally, the drill bit for the PCB is used after re-polishing the front end after use (re-grinding). Therefore, when the amount of polishing is taken into consideration, the connecting portion 5 of the first spiral region 3 and the second spiral region 4 is set to be 0.2 mm or more from the tip end of the tool and 50% or less of the groove length 1 of the chip discharge groove. The location is better.

於本實施例中,第一螺旋角α1 和第二螺旋角α2 的變化點(連設部5)是設定在距離工具前端有溝槽長度1之20.8%的位置(C1 )。In the present embodiment, the change point (joining portion 5) of the first helix angle α 1 and the second helix angle α 2 is set at a position (C 1 ) which is 20.8% from the tip end of the tool.

本發明是以PCB等非鐵系被削材鑽孔加工等所使用之被覆有非晶質碳皮膜等潤滑性皮膜的鑽頭為發明對象,但其基材,是以WC為主成份的硬質粒子和以Co為主成份的結合材所形成的超硬合金其硬度和韌性均衡的材料為佳。The present invention is directed to a drill which is coated with a non-ferrous-based material such as a PCB and is coated with a lubricating film such as an amorphous carbon film. However, the substrate is a hard particle containing WC as a main component. A superhard alloy formed of a composite material containing Co as a main component is preferably a material having a balanced hardness and toughness.

WC粒子的平均粒徑若太小,則難以使WC粒子均勻分散在結合材中,容易導致超硬合金的抗折力降低。另一方面,WC粒子的平均粒徑若太大,則超硬合金的硬度會降低。此外,Co含有量若太少則會降低超硬合金的抗折力,反之Co含有量若太多則會降低超硬合金的硬度。因此,基材是以WC粒子的平均粒徑為0.1μm~2μm,Co含有量其重量%為5~15%的超硬合金為佳。If the average particle diameter of the WC particles is too small, it is difficult to uniformly disperse the WC particles in the binder, which tends to cause a decrease in the folding strength of the cemented carbide. On the other hand, if the average particle diameter of the WC particles is too large, the hardness of the superhard alloy may decrease. In addition, if the Co content is too small, the flexural strength of the superhard alloy is lowered, and if the Co content is too large, the hardness of the superhard alloy is lowered. Therefore, the base material is preferably a superhard alloy having an average particle diameter of WC particles of 0.1 μm to 2 μm and a Co content of 5 to 15% by weight.

此外,針對PCB等難削材為了要進行皮膜不剝落之穩定的鑽孔加工,是需要更加提高基材和非晶質碳皮膜之緊密性。將Ti、Cr、Ta等週期表之4a、5a、6a族元素及Si當中選出1種或2種以上之元素所形成的金屬或半金屬做為底膜成膜在基材正上方,然後在其上方成膜非晶質碳皮膜,藉此就能夠使基材和非晶質碳皮膜之緊密性更高。此外,也可將從週期表之4a、5a、6a族及Si當中選出1種或2種以上之元素和從氮及碳當中選出1種以上之元素的化合物做為底膜成膜在基材正上方。In addition, it is necessary to further improve the tightness of the substrate and the amorphous carbon film in order to perform stable drilling without peeling off the film for difficult-to-cut materials such as PCB. A metal or a semimetal formed by selecting one or more elements of elements 4a, 5a, and 6a of the periodic table such as Ti, Cr, or Ta, and Si as a base film is formed directly above the substrate, and then The amorphous carbon film is formed on the film, whereby the substrate and the amorphous carbon film can be made more compact. In addition, one or more elements selected from Groups 4a, 5a, 6a and Si of the periodic table and compounds in which one or more elements selected from nitrogen and carbon are selected as a base film can be formed on the substrate. Directly above.

底膜的成膜是以提昇基材和非晶質碳皮膜之緊密性為目的,若太厚就無意義,因此是以200nm以下且1nm以上之膜厚為佳。The film formation of the under film is for the purpose of improving the adhesion between the substrate and the amorphous carbon film. If it is too thick, it is meaningless. Therefore, it is preferably a film thickness of 200 nm or less and 1 nm or more.

本實施例是構成為如以上所述,所以至少會因為切屑排出槽被覆有非晶質碳皮膜等潤滑性皮膜而使切屑排出槽的表面潤滑性變高,因此鑽孔加工所產生之切屑的剪斷角會變大使切屑變薄變長的同時,由於表面潤滑性高使切屑沿著切屑排出槽容易往工具本體1(第1圖的刃部C)的基端部排出,相對地就能夠防止切屑堵塞,使賺頭不易折損。In the present embodiment, as described above, at least the lubricating film such as the amorphous carbon film is coated on the chip discharge groove to increase the surface lubricity of the chip discharge groove, so that the chips generated by the drilling process are diced. When the cutting angle is increased, the chips become thinner and longer, and the surface lubricity is high, so that the chips can be easily discharged to the base end portion of the tool body 1 (the blade portion C of the first drawing) along the chip discharge groove, and relatively Prevent chip clogging, making it difficult to break the profit.

此外,因是將工具前端的螺旋角α1 及α3 形成為較小,所以就能夠防止切屑變太薄長,使切屑變厚變短難以捲附在工具本體1,再加上,還能夠將切刃的刃物角確保成較大,因此能夠避免切刃破角能夠改善孔位置精度的同時使鑽頭不易折損。Further, since the spiral angles α 1 and α 3 of the tip end of the tool are formed to be small, it is possible to prevent the chips from becoming too thin and long, and to make the chips thick and short, which is difficult to be attached to the tool body 1 and, in addition, The blade angle of the cutting edge is ensured to be large, so that it is possible to prevent the cutting edge from being broken and the hole position accuracy can be improved, and the drill bit is not easily broken.

再加上,因是將工具基端側的螺旋角α2 形成為較大,所以就能夠提高切屑排出槽2之基端側的切屑排出性使耐折損性提昇,並且,利用被覆有非晶質碳皮膜(潤滑性皮膜)的效果,是可使沿著切屑排出槽順暢排出的切屑排出方向強制性改變,利用與離心力的相乘效果使切屑往工具本體1的外方飛散,防止切屑的捲附使折損壽命變長能夠實現穩定的鑽孔加工。In addition, since the helix angle α 2 on the proximal end side of the tool is formed to be large, the chip discharge property on the proximal end side of the chip discharge groove 2 can be improved, and the fracture resistance can be improved, and the coating can be made amorphous. The effect of the carbonaceous film (lubricating film) is that the direction in which the chips are discharged smoothly along the chip discharge groove can be forcibly changed, and the effect of multiplying the centrifugal force causes the chips to scatter outside the tool body 1 to prevent chipping. The coil attachment makes the breakage life longer and enables stable drilling.

另外,於鑽孔加工時當工具前端部產生的切屑會沿著切屑排出槽排出時,切屑彼此會在主溝槽2a和副溝槽2b的合流部6衝撞,此外,又加上主溝槽2a和副溝槽b之合流部6的段差7,是會使切屑於合流部6強制性(朝工具徑方向)飛散難以到達工具基端部,因此就能夠防止工具基端部的切屑捲附。Further, when the chips generated at the front end portion of the tool are discharged along the chip discharge groove during the drilling process, the chips collide with each other at the joining portion 6 of the main groove 2a and the sub groove 2b, and the main groove is added. The step 7 of the merging portion 6 between the 2a and the sub-groove b is such that the chips are forced to converge in the tool-diameter portion 6 (in the tool diameter direction) and it is difficult to reach the end portion of the tool base. Therefore, it is possible to prevent the chip from being attached to the end portion of the tool base. .

基於此,本實施例的鑽孔工具,即使是在使用附帶樹脂之鋁板做為抵接板時,還是難以折損並且可使切屑排出性飛躍性良好能夠防止切屑捲附,即使是直徑為0.7mm以下,特別是0.4mm以下的小徑鑽頭,也可使其成為折損壽命變長且孔位置精度良好能夠實現穩定的鑽孔加工又實用性極為優秀的鑽孔工具。Based on this, the drilling tool of the present embodiment is difficult to be broken even when the aluminum plate with the resin is used as the abutting plate, and the chip discharge property is excellent, and the chip winding can be prevented, even if the diameter is 0.7 mm. In the following, in particular, a small-diameter drill having a diameter of 0.4 mm or less can be used as a drilling tool which is excellent in the fracture life and has excellent hole position accuracy, and can achieve stable drilling processing and is extremely practical.

接著,是以本實施例的效果為依據針對實驗例進行說明。Next, an experimental example will be described based on the effects of the present embodiment.

第7圖,是表示使用主溝槽2a為一定的溝槽深度X,副溝槽2b的溝槽深度Y有所改變之鑽頭進行鑽孔加工時評估其孔位置精度的實驗結果圖表。該實驗使用的鑽頭,是工具直徑為0.075mm,(主溝槽的)溝槽長1為1.2mm,比較例1是先前2片刃2溝槽形狀的鑽頭(2個切屑排出槽的螺旋角都是45°不改變),比較例2(於主溝槽和副溝槽的合流部沒有段差的例)、實施例1及實施例2,是主溝槽2a的螺旋角α1 、α2 為38°、55°,副溝槽2b的螺旋角α3 為38°不改變,其他:心厚、前端角等,副溝槽2b的溝槽深度Y以外的規格是相同的值。另,實施例1及實施例2之副溝槽2b的溝槽深度Y,都是設定成比主溝槽2a的溝槽深度X還淺。此外,於工具本體1是被覆有非晶質碳皮膜(DLC)。Fig. 7 is a graph showing an experimental result of evaluating the accuracy of the hole position when the drill is drilled using the groove depth X in which the main groove 2a is constant and the groove depth Y of the sub groove 2b is changed. The drill used in this experiment has a tool diameter of 0.075 mm and a groove length of 1 (of the main groove) of 1.2 mm. Comparative Example 1 is a drill bit of the previous two blade 2 groove shapes (the spiral angles of the two chip discharge grooves are both In the case of Comparative Example 2 (in the case where the merging portion of the main groove and the sub-groove has no step), and in the first and second embodiments, the helix angles α 1 and α 2 of the main groove 2a are 38°, 55°, the helix angle α 3 of the sub-groove 2b is 38°, and the other is: the core thickness, the front end angle, and the like, and the specifications other than the groove depth Y of the sub-groove 2b are the same value. Further, the groove depths Y of the sub-grooves 2b of the first embodiment and the second embodiment are set to be shallower than the groove depth X of the main grooves 2a. Further, the tool body 1 is covered with an amorphous carbon film (DLC).

該實驗中,是將難削材即半導體封裝用的PCB(基板:厚度0.1mm/表背兩面Cu層)5片重疊然後在其上面載置厚度0.1mm的附帶樹脂鋁做為抵接板,為了要能夠進行貫通孔加工是在上述PCB的下面配置有一般使用之厚度1.5mm的紙酚材做為丟棄板。另外,鑽頭(心軸)的旋轉數為300krpm,進刀速度為1.8m/min,設定擊數為10,000擊。In this experiment, a hard-to-cut material, that is, a PCB for semiconductor packaging (substrate: a thickness of 0.1 mm / a Cu layer on both sides of the front and back sides) is superposed, and then a resin-attached aluminum having a thickness of 0.1 mm is placed thereon as an abutting plate. In order to be able to perform through-hole processing, a paper phenol material having a thickness of 1.5 mm which is generally used is disposed as a discarding plate on the lower surface of the above-mentioned PCB. In addition, the number of rotations of the drill (mandrel) was 300 krpm, the feed speed was 1.8 m/min, and the number of strokes was set to 10,000 strokes.

根據第7圖、第8圖,確認出比較例1在實驗後半期產生明顯的切屑捲附,在抵接板進入側有捲附的磨擦痕跡及所捲附之切屑的掉落。接著,是確認出該等在抵接板進入側表面形成凹凸,使鑽頭的附著性變差,導致鑽頭容易彎曲。另一方面,根據第7圖、第10圖,確認出實施例1及實施例2,因溝槽在工具基端側是成為1個,所以工具基端側的剛性高,不會產生上述問題,鑽頭不易彎曲,又確認出當主溝槽、副溝槽深度差(段差)/主溝槽深度為70%以下時孔位置精度是會獲得改善。另,亦確認出當主溝槽、副溝槽深度差(段差)/主溝槽深度超過70%時孔位置精度是會變差。此外。根據第8圖~第10圖,是確認出切屑捲附量依照比較例1、比較例2、實施例的順序變少,雖然未圖示但確認出實施例2的切屑捲附量是和實施例1同等。因此,可確認出根據本實施例時與先前的鑽頭相比是能夠改善捲附性。According to Fig. 7 and Fig. 8, it was confirmed that Comparative Example 1 produced a significant chip wrap in the latter half of the experiment, and there was a rubbing trace attached to the entry side of the abutting plate and a drop of the attached chip. Then, it was confirmed that the unevenness was formed on the entry side surface of the contact plate, and the adhesion of the drill was deteriorated, which caused the drill to be easily bent. On the other hand, according to Fig. 7 and Fig. 10, it was confirmed that in the first embodiment and the second embodiment, since the groove is one on the tool base end side, the rigidity of the tool base end side is high, and the above problem does not occur. The drill bit is not easily bent, and it is confirmed that the hole position accuracy is improved when the main groove and the sub groove depth difference (step difference) / the main groove depth is 70% or less. In addition, it was also confirmed that the hole position accuracy was deteriorated when the main groove and the sub groove depth difference (step difference)/main groove depth exceeded 70%. Also. According to the eighth to tenth drawings, it was confirmed that the amount of the chip winding amount was reduced in the order of the comparative example 1, the comparative example 2, and the example, and the amount of the chip winding amount of the second embodiment was confirmed and implemented. Example 1 is equivalent. Therefore, it was confirmed that the curling property can be improved as compared with the prior drill bit according to the present embodiment.

1...工具本體1. . . Tool body

2a...主溝槽2a. . . Main groove

2b...副溝槽2b. . . Secondary groove

6...合流部6. . . Confluence

7...段差7. . . Step difference

1...溝槽長1. . . Long groove

第1圖為PCB用鑽頭的概略說明側面圖。Fig. 1 is a schematic side view showing a drill bit for a PCB.

第2圖為先前例的放大概略說明圖。Fig. 2 is an enlarged schematic explanatory view of a prior art.

第3(a)圖為鑽頭刃部C基端部附近之切屑的捲附殘屑的例示照片,第3(b)圖為掉落在抵接板上的切屑塊例示照片。Fig. 3(a) is a photograph showing an example of the crumb of the chip near the base end portion of the drill blade portion C, and Fig. 3(b) is a photograph of the chip block dropped on the abutment plate.

第4圖為本實施例的刃部概略說明圖。Fig. 4 is a schematic explanatory view of the blade portion of the embodiment.

第5圖為第4圖前端部份的放大概略說明圖。Fig. 5 is an enlarged schematic explanatory view of the front end portion of Fig. 4.

第6圖為第5(a)圖的A-A剖面圖。Fig. 6 is a cross-sectional view taken along line A-A of Fig. 5(a).

第7圖為表示實驗結果的圖表。Figure 7 is a graph showing the results of the experiment.

第8圖為表示比較例1之切屑捲附狀態及加工後之抵接板的照片。Fig. 8 is a photograph showing the state of the chip winding of Comparative Example 1 and the abutment plate after the processing.

第9圖為表示比較例1之切屑捲附狀態的照片。Fig. 9 is a photograph showing the state of the chip winding of Comparative Example 1.

第10圖為表示實施例1之切屑捲附狀態及加工後之抵接板的照片。Fig. 10 is a photograph showing the state of the chip winding of the first embodiment and the abutting plate after the processing.

1...工具本體1. . . Tool body

2a...主溝槽2a. . . Main groove

2b...副溝槽2b. . . Secondary groove

6...合流部6. . . Confluence

7...段差7. . . Step difference

α1 ...主溝槽的第一螺旋角α 1 . . . First helix angle of the main groove

α2 ...主溝槽的第二螺旋角α 2 . . . Second helix angle of the main groove

α3 ...副溝槽的螺旋角α 3 . . . Helix angle of the secondary groove

Claims (15)

一種鑽孔工具,係於工具本體(1)的前端具有1個或複數切刃,在該工具本體(1)的外圍從工具前端朝基端側設有複數螺旋狀切屑排出槽,該複數切屑排出槽是至少包括1個主溝槽(2a)和1個副溝槽(2b),在上述主溝槽(2a)的途中部設有1個或複數副溝槽(2b)形成合流,其特徵為:在上述主溝槽(2a)及副溝槽(2b)的合流部(6)設置段差(7),上述段差(7)是2μm以上。 A drilling tool having one or a plurality of cutting edges at a front end of the tool body (1), and a plurality of spiral chip discharge grooves are provided on a periphery of the tool body (1) from a front end of the tool toward a base end side, and the plurality of cutting chips are discharged The groove is composed of at least one main groove (2a) and one sub-groove (2b), and one or a plurality of sub-grooves (2b) are formed in the middle of the main groove (2a) to form a merged flow. The step (7) is provided in the merging portion (6) of the main groove (2a) and the sub-groove (2b), and the step (7) is 2 μm or more. 如申請專利範圍第1項所記載的鑽孔工具,其中,上述段差(7)是由上述主溝槽(2a)和上述副溝槽(2b)之溝槽深度的差異形成。 The drilling tool according to claim 1, wherein the step (7) is formed by a difference in groove depth between the main groove (2a) and the sub groove (2b). 如申請專利範圍第1項所記載的鑽孔工具,其中,上述段差(7)是主溝槽(2a)之溝槽深度的70%以下。 The drilling tool according to claim 1, wherein the step (7) is 70% or less of a groove depth of the main groove (2a). 如申請專利範圍第2項所記載的鑽孔工具,其中,上述段差(7)是主溝槽(2a)之溝槽深度的70%以下。 The drilling tool according to claim 2, wherein the step (7) is 70% or less of a groove depth of the main groove (2a). 如申請專利範圍第1項至第4項任一項所記載的鑽孔工具,其中,將上述主溝槽(2a)或上述副溝槽(2b)的螺旋角在工具前端側和工具基端側形成為不同,藉此使上述主溝槽(2a)和上述副溝槽(2b)形成合流。 The drilling tool according to any one of claims 1 to 4, wherein a spiral angle of the main groove (2a) or the sub-groove (2b) is at a tool front end side and a tool base end The sides are formed differently, whereby the main groove (2a) and the sub-groove (2b) are joined together. 如申請專利範圍第1項至第4項任一項所記載的鑽孔工具,其中,上述合流部(6)是設置在距離工具前端有上述主溝槽(2a)之溝槽長50%以下的位置。 The boring tool according to any one of claims 1 to 4, wherein the merging portion (6) is provided at a distance of 50% or less from a groove having the main groove (2a) at a tip end of the tool. s position. 如申請專利範圍第5項記載的鑽孔工具,其中,上述合流部(6)是設置在距離工具前端有上述主溝槽(2a)之 溝槽長50%以下的位置。 The drilling tool according to claim 5, wherein the merging portion (6) is disposed at a front end of the tool and has the main groove (2a) The groove is 50% or less in length. 如申請專利範圍第6項所記載的鑽孔工具,其中,被覆有潤滑性皮膜。 The drilling tool according to claim 6, wherein the drilling tool is coated with a lubricating film. 如申請專利範圍第7項所記載的鑽孔工具,其中,被覆有潤滑性皮膜。 The drilling tool according to claim 7, wherein the drilling tool is coated with a lubricating film. 如申請專利範圍第8項所記載的鑽孔工具,其中,上述潤滑性皮膜是採用非晶質碳皮膜。 The drilling tool according to claim 8, wherein the lubricating film is made of an amorphous carbon film. 如申請專利範圍第9項所記載的鑽孔工具,其中,上述潤滑性皮膜是採用非晶質碳皮膜。 The drilling tool according to claim 9, wherein the lubricating film is made of an amorphous carbon film. 如申請專利範圍第10項所記載的鑽孔工具,其中,工具直徑為0.7mm以下。 The drilling tool according to claim 10, wherein the tool diameter is 0.7 mm or less. 如申請專利範圍第11項所記載的鑽孔工具,其中,工具直徑為0.7mm以下。 The drilling tool according to claim 11, wherein the tool diameter is 0.7 mm or less. 如申請專利範圍第10項所記載的鑽孔工具,其中,工具直徑為0.4mm以下。 The drilling tool according to claim 10, wherein the tool has a diameter of 0.4 mm or less. 如申請專利範圍第11項所記載的鑽孔工具,其中,工具直徑為0.4mm以下。 The drilling tool according to claim 11, wherein the tool has a diameter of 0.4 mm or less.
TW100113737A 2010-06-30 2011-04-20 Drilling tools TWI438047B (en)

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