TWI432825B - Flat panel display manufacturing system and method for controlling the same - Google Patents
Flat panel display manufacturing system and method for controlling the same Download PDFInfo
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- TWI432825B TWI432825B TW095129619A TW95129619A TWI432825B TW I432825 B TWI432825 B TW I432825B TW 095129619 A TW095129619 A TW 095129619A TW 95129619 A TW95129619 A TW 95129619A TW I432825 B TWI432825 B TW I432825B
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- panel
- grinding
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- 238000004519 manufacturing process Methods 0.000 title claims description 26
- 238000000034 method Methods 0.000 title claims description 20
- 238000005498 polishing Methods 0.000 claims description 67
- 238000001514 detection method Methods 0.000 claims description 23
- 239000003086 colorant Substances 0.000 claims description 9
- 239000004973 liquid crystal related substance Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 230000011664 signaling Effects 0.000 description 3
- 239000000565 sealant Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
- B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
- G02F2201/58—Arrangements comprising a monitoring photodetector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Description
本發明係關於一種平面顯示器製造系統及其控制方法。The present invention relates to a flat panel display manufacturing system and a control method therefor.
一般而言，當前平面顯示器已被廣泛使用，且一液晶顯示器(LCD)、一有機發光二極體(OLED)顯示器等等係其習知之實例。In general, current flat panel displays have been widely used, and a liquid crystal display (LCD), an organic light emitting diode (OLED) display, and the like are known examples.
其中，LCD包括：一上部顯示面板，其上設置有共用電極、濾色片等；一下部顯示面板，其上設置有像素電極、薄膜電晶體等；及一液晶材料，其設置於該上部顯示面板與該下部顯示面板之間。液晶材料之液晶分子之定向係由施加至共用電極之電壓所控制。可藉由根據液晶分子之定向控制通過液晶材料之光之透射率來顯示一影像。The LCD includes: an upper display panel on which a common electrode, a color filter, and the like are disposed; a lower display panel on which a pixel electrode, a thin film transistor, and the like are disposed; and a liquid crystal material disposed on the upper display Between the panel and the lower display panel. The orientation of the liquid crystal molecules of the liquid crystal material is controlled by the voltage applied to the common electrode. An image can be displayed by controlling the transmittance of light passing through the liquid crystal material according to the orientation of the liquid crystal molecules.
特定而言，此種LCD可藉由如下製程來製造。In particular, such an LCD can be manufactured by the following process.
首先，在上部及下部顯示面板上塗佈一用於配向液晶分子之配向層。First, an alignment layer for aligning liquid crystal molecules is coated on the upper and lower display panels.
第二，藉由施加一密封劑在下部顯示面板上界定一呈閉環形狀之有效面積。Second, an effective area in a closed loop shape is defined on the lower display panel by applying a sealant.
第三，在該有效面積內設置一液晶。Third, a liquid crystal is disposed within the effective area.
第四，在真空狀態下將該對顯示面板組配在一起，並硬化該密封劑。Fourth, the pair of display panels are assembled together under vacuum and the sealant is hardened.
第五，將該顯示面板總成切割成單元面板(下文中將其稱作"面板")。Fifth, the display panel assembly is cut into unit panels (hereinafter referred to as "panels").
第六，研磨該面板之一銳利切割部分，並偵測研磨量以決定研磨是否過度。Sixth, one of the sharply cut portions of the panel is ground and the amount of grinding is detected to determine if the grinding is excessive.
下文將詳細闡述一用於實踐第六製程之習用研磨量偵測器件。A conventional abrasive amount detecting device for practicing the sixth process will be described in detail below.
該習用研磨量偵測器件包括一接納該面板之平臺及一定位於面板側表面之上部邊緣之攝影機。因此，可藉由一攝影機所顯示之影像來決定該面板之研磨量是否過度。The conventional abrasive amount detecting device includes a platform that receives the panel and a camera that must be located at an upper edge of the side surface of the panel. Therefore, whether the amount of polishing of the panel is excessive can be determined by an image displayed by a camera.
然而，根據該習用研磨量偵測器件，無法顯示該面板側表面之一下部邊緣，此乃因定位於該面板側表面之上部部分之攝影機僅可顯示該面板側表面之上部邊緣。亦即，該習用器件可具有一問題，亦即，對於其下部邊緣而言，無法決定該下部邊緣之研磨量是否過度。However, according to the conventional grinding amount detecting device, the lower edge of one of the side surfaces of the panel cannot be displayed because the camera positioned on the upper portion of the side surface of the panel can only display the upper edge of the side surface of the panel. That is, the conventional device may have a problem that, for its lower edge, it is impossible to determine whether the amount of grinding of the lower edge is excessive.
以上先前技術中所揭示之資訊僅用於加強對本發明背景之理解且因此可能包括並非構成本國熟悉此項技術者已知之先前技術資訊。The information disclosed in the prior art is only used to enhance the understanding of the background of the invention and thus may include prior art information that is not known to those skilled in the art.
本發明致力於提供一種平面顯示器製造系統，該系統具有同時偵測一面板之至少一個側表面的一上部邊緣與一下部邊緣之研磨量之優點。SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a flat panel display manufacturing system having the advantage of simultaneously detecting the amount of polishing of an upper edge and a lower edge of at least one side surface of a panel.
此外，本發明還致力於提供一種用於控制該平面顯示器製造系統之方法，該方法具有根據一研磨單元與研磨量偵測單元之間的回授控制來控制該面板之一位置之優點。Moreover, the present invention is also directed to a method for controlling the flat panel display manufacturing system having the advantage of controlling the position of one of the panels based on feedback control between a polishing unit and an abrasive amount detecting unit.
根據本發明之一實施例，一平面顯示器製造系統包括一用於偵測一面板之至少一個側表面的一上部邊緣與一下部邊緣之研磨量之研磨量偵測單元，其中該研磨量偵測單元包括：一第一研磨量偵測器，其用於同時偵測一面板之一第一側表面的一上部邊緣與一下部邊緣之研磨量；及一第二研磨量偵測器，其用於同時偵測該面板之一第二側表面的一上部邊緣與一下部邊緣之研磨量。其中該第一與第二研磨量偵測器各自形成為一體。According to an embodiment of the invention, a flat panel display manufacturing system includes an apparatus for detecting an amount of grinding of an upper edge and a lower edge of at least one side surface of a panel, wherein the amount of polishing is detected The unit includes: a first grinding amount detector for simultaneously detecting an amount of grinding of an upper edge and a lower edge of a first side surface of a panel; and a second grinding amount detector for using Simultaneously detecting the amount of grinding of an upper edge and a lower edge of the second side surface of one of the panels. The first and second grinding amount detectors are each formed integrally.
於根據本發明之實施例之系統中，該第一研磨量偵測器包括：一第一體；一第一攝影機，其設置於該第一體之一上部部分上以便偵測該面板之第一側表面之上部邊緣之研磨量；及一第二攝影機，其設置於該第一體之一下部部分上以便偵測該面板之第一側表面之下部邊緣之研磨量。In the system according to the embodiment of the present invention, the first grinding amount detector includes: a first body; a first camera disposed on an upper portion of the first body to detect the first part of the panel An amount of grinding of the upper edge of the one side surface; and a second camera disposed on a lower portion of the first body to detect the amount of grinding of the lower edge of the first side surface of the panel.
於根據本發明之實施例之系統中，該第二研磨量偵測器包括：一第二體；一第三攝影機，其設置於該第二體之一上部部分上以便偵測該面板之第二側之上部邊緣之研磨量，及一第四攝影機，其設置於該第二體之一下部部分上以便偵測該面板之第二側之下部邊緣之研磨量。In the system according to the embodiment of the present invention, the second grinding amount detector includes: a second body; a third camera disposed on an upper portion of the second body to detect the panel The amount of grinding of the upper edge of the two sides, and a fourth camera disposed on a lower portion of the second body to detect the amount of grinding of the lower edge of the second side of the panel.
於根據本發明之實施例之系統中，該第一體及該第二體係設置於一個板上，以便其可朝該板之左側及右側移動。In a system according to an embodiment of the invention, the first body and the second system are disposed on a plate such that they are movable toward the left and right sides of the plate.
於根據本發明之實施例之系統中，該研磨量偵測單元進一步包括一用於接納該面板之平臺，及一用於沿一向前/向後方向移動該平臺之平臺驅動部分。In a system according to an embodiment of the present invention, the polishing amount detecting unit further includes a platform for receiving the panel, and a platform driving portion for moving the platform in a forward/backward direction.
於根據本發明之實施例之系統中，該研磨量偵測單元進一步包括：一第一消除器，其設置於該第一體上以便移除該面板之第一側表面之上部邊緣或下部邊緣之異物；及一第二消除器，其設置於該第二體上以便移除該面板之第二側表面之上部邊緣或下部邊緣之異物。In the system according to the embodiment of the present invention, the polishing amount detecting unit further includes: a first canceller disposed on the first body to remove an upper edge or a lower edge of the first side surface of the panel And a second eliminator disposed on the second body to remove foreign matter from an upper edge or a lower edge of the second side surface of the panel.
於根據本發明之實施例之系統中，該第一消除器包括：一第一空氣噴射器，其設置於該第一體之上部部分上以便移除該面板之第一側表面之上部邊緣之異物；及一第二空氣噴射器，其設置於該第一體之下部部分上以便移除該面板之第一側表面之下部邊緣之異物。In a system according to an embodiment of the present invention, the first canceller includes: a first air ejector disposed on an upper portion of the first body to remove an upper edge of the first side surface of the panel a foreign object; and a second air ejector disposed on the lower portion of the first body to remove foreign matter from a lower edge of the first side surface of the panel.
於根據本發明之實施例之系統中，該第二消除器包括：一第三空氣噴射器，其設置於該第二體之上部部分上以便移除該面板之第二側表面之上部邊緣之異物；及一第四空氣噴射器，其設置於該第二體之下部部分上以便移除該面板之第二側表面之下部邊緣之異物。In a system according to an embodiment of the present invention, the second canceller includes: a third air ejector disposed on the upper portion of the second body to remove an upper edge of the second side surface of the panel And a fourth air ejector disposed on the lower portion of the second body to remove foreign matter at a lower edge of the second side surface of the panel.
於根據本發明之實施例之系統中，該研磨量偵測單元進一步包括：一第一燈，其設置於該第一攝影機之一第一側上以便照射該面板之第一側表面之上部邊緣；一第二燈，其設置於該第二攝影機之一第一側上以便照射該面板之第一側表面之下部邊緣；一第三燈，其設置於該第三攝影機之一第一側上以便照射該面板之第二側表面之上部邊緣，及一第四燈，其設置於該第四攝影機之一第一側上以便照射該面板之第二側表面之下部邊緣。In the system according to the embodiment of the present invention, the polishing amount detecting unit further includes: a first lamp disposed on a first side of the first camera to illuminate an upper edge of the first side surface of the panel a second lamp disposed on a first side of the second camera to illuminate a lower edge of the first side surface of the panel; a third lamp disposed on a first side of the third camera To illuminate an upper edge of the second side surface of the panel, and a fourth lamp disposed on a first side of the fourth camera to illuminate a lower edge of the second side surface of the panel.
於根據本發明之實施例之系統中，該第一燈及該第二燈輻照彼此不同色彩之光，且該第三燈及該第四燈輻照彼此不同色彩之光。In a system according to an embodiment of the invention, the first lamp and the second lamp illuminate light of different colors from each other, and the third lamp and the fourth lamp illuminate light of different colors from each other.
於根據本發明之實施例之系統中，該第一燈、該第二燈、該第三燈、及該第四燈輻照彼此不同色彩之光。In a system according to an embodiment of the invention, the first lamp, the second lamp, the third lamp, and the fourth lamp illuminate light of different colors from each other.
根據本發明實施例之系統進一步包括：一研磨單元，其用於研磨該面板之側表面的上部邊緣及下部邊緣；一面板驅動部分，其用於將該面板自該研磨單元移至該研磨量偵測單元；及一控制器，其用於根據該研磨單元所偵測之面板位置資訊與該研磨量偵測單元所偵測之面板研磨量資訊之間的一回授控制來控制該面板之一位置。該研磨單元包括：一研磨臺，其上設置有面板；一位置偵測器，其用於偵測設置於該研磨臺上之面板位置；及一研磨器，其用於在沿所偵測之面板位置向左及向右移動時研磨該面板。其中該控制器係根據該位置偵側器所偵測之一位置資訊來控制該面板驅動部分。A system according to an embodiment of the present invention further includes: a grinding unit for grinding an upper edge and a lower edge of a side surface of the panel; and a panel driving portion for moving the panel from the polishing unit to the polishing amount a detecting unit; and a controller for controlling the panel according to a feedback control between the panel position information detected by the grinding unit and the panel grinding amount information detected by the grinding amount detecting unit a location. The grinding unit comprises: a polishing table on which a panel is disposed; a position detector for detecting a position of the panel disposed on the polishing table; and a grinder for detecting along the edge Grind the panel as it moves to the left and right. The controller controls the panel driving part according to the position information detected by the position detector.
於根據本發明之實施例之系統中，該控制器根據該位置偵測器所偵測之面板位置資訊接收一第一偵測信號，將該第一偵測信號轉換成一第一控制信號，儲存該第一控制信號，並根據該第一控制信號控制該面板驅動部分同時將在該研磨單元上研磨之面板移至設置至該研磨量偵測單元之平臺。In the system according to the embodiment of the present invention, the controller receives a first detection signal according to the panel position information detected by the position detector, and converts the first detection signal into a first control signal, and stores The first control signal controls the panel driving portion according to the first control signal to simultaneously move the panel polished on the polishing unit to a platform set to the polishing amount detecting unit.
於根據本發明之實施例之系統中，該控制器係根據該第一及第二研磨量偵測器所偵測之面板研磨量資訊來控制該研磨器。In the system according to the embodiment of the invention, the controller controls the grinder based on the panel grinding amount information detected by the first and second grinding amount detectors.
於根據本發明之實施例之系統中，該控制器根據該第一及第二研磨量偵測器所偵測之面板研磨量資訊接收一第二偵測信號，將該第二偵測信號轉換成一第二控制信號，儲存該第二控制信號，並根據該第二控制信號控制該研磨器向左/向右之移動量同時藉由該研磨單元中之研磨器研磨該面板。In the system according to the embodiment of the present invention, the controller receives a second detection signal according to the panel grinding amount information detected by the first and second polishing amount detectors, and converts the second detection signal Forming a second control signal, storing the second control signal, and controlling the amount of movement of the grinder to the left/right according to the second control signal while grinding the panel by the grinder in the grinding unit.
根據本發明之一實施例，一種用於控制該平面顯示器製造系統之方法包括：根據來自一設置於該研磨單元上之位置偵測器的一面板位置資訊接收一第一偵測信號，將該第一偵測信號轉換成一第一控制信號，儲存該第一控制信號，並根據該第一控制信號控制該面板驅動部分同時將在該研磨單元上研磨之面板移至一設置至該研磨量偵測單元之平臺。According to an embodiment of the present invention, a method for controlling a flat panel display manufacturing system includes: receiving a first detection signal according to a panel position information from a position detector disposed on the polishing unit, Converting the first detection signal into a first control signal, storing the first control signal, and controlling the panel driving portion according to the first control signal to simultaneously move the panel polished on the polishing unit to a setting to the grinding amount The platform of the measurement unit.
根據本發明實施例之方法進一步包括根據來自一設置至研磨量偵測單元之研磨量偵測器的面板研磨量資訊接收一第二偵測信號，將該第二偵測信號轉換成一第二控制信號，儲存該第二控制信號，並根據該第二控制信號控制該研磨器向左/向右之移動量同時藉由設置至該研磨單元之研磨器研磨該面板。The method according to the embodiment of the present invention further includes receiving a second detection signal according to the panel polishing amount information from a polishing amount detector set to the polishing amount detecting unit, and converting the second detection signal into a second control And storing the second control signal, and controlling the amount of movement of the grinder to the left/right according to the second control signal while grinding the panel by a grinder disposed to the grinding unit.
現在，將在下文中參照顯示本發明較佳實施例之附圖更全面地闡述本發明。熟習此項技術者應瞭解，可以各種不同之方式修改所述實施例，此等修改並不背離本發明之精神及範疇。The invention will now be described more fully hereinafter with reference to the accompanying drawings in which, It will be appreciated by those skilled in the art that the present invention may be modified in various different ways and without departing from the spirit and scope of the invention.
圖1係一顯示一根據本發明一實施例之一平面顯示器製造系統中之研磨量偵測單元之正視圖，且圖2係一顯示圖1之"A"部分之放大圖。1 is a front view showing a grinding amount detecting unit in a flat panel display manufacturing system according to an embodiment of the present invention, and FIG. 2 is an enlarged view showing a portion "A" of FIG. 1.
如圖1中所示，根據本發明一實施例之一平面顯示器製造系統包括一研磨量偵測單元100，其用於偵測面板10之至少一個側的一上部邊緣及一下部邊緣之一研磨量。As shown in FIG. 1 , a flat panel display manufacturing system according to an embodiment of the present invention includes a polishing amount detecting unit 100 for detecting one of an upper edge and a lower edge of at least one side of the panel 10 to be ground. the amount.
研磨量偵測單元100包括一第一研磨量偵測器110及一第二研磨量偵測器130。第一研磨量偵測器110係形成為一個體且同時偵測面板10之一第二側表面的一上部邊緣11及一下部邊緣12之一研磨量。第二研磨量偵測器130亦形成為一個體且同時偵測面板10之一第二側表面的一上部邊緣13及一下部邊緣14之一研磨量。The grinding amount detecting unit 100 includes a first grinding amount detector 110 and a second grinding amount detector 130. The first polishing amount detector 110 is formed as one body and simultaneously detects an amount of grinding of one of the upper edge 11 and the lower edge 12 of the second side surface of one of the panels 10. The second amount of polishing detector 130 is also formed as a body and simultaneously detects an amount of grinding of an upper edge 13 and a lower edge 14 of the second side surface of one of the panels 10.
詳言之，第一研磨量偵測器110可包括：一第一體115；一第一攝影機111，其設置於第一體115之上部部分上，以便偵測面板10之第一側表面的上部邊緣11之一研磨量；及一第二攝影機112，其設置於第一體115之下部部分上，以便偵測面板10之第一側表面的下部邊緣12之一研磨量。In detail, the first grinding amount detector 110 may include: a first body 115; a first camera 111 disposed on the upper portion of the first body 115 to detect the first side surface of the panel 10. An amount of grinding of the upper edge 11; and a second camera 112 disposed on the lower portion of the first body 115 to detect an amount of grinding of the lower edge 12 of the first side surface of the panel 10.
此外，第二研磨量偵測器130可包括：一第二體135；一第三攝影機131，其設置於第二體135之上部部分上，以便偵測面板10之第二側的上部邊緣13之一研磨量；及一第四攝影機134，其設置於第二體135之下部部分上，以便偵測面板10之第二側的下部邊緣14之一研磨量。In addition, the second grinding amount detector 130 may include: a second body 135; a third camera 131 disposed on the upper portion of the second body 135 to detect the upper edge 13 of the second side of the panel 10. One of the grinding amounts; and a fourth camera 134 disposed on the lower portion of the second body 135 to detect the amount of grinding of one of the lower edges 14 of the second side of the panel 10.
此外，第一體115及第二體135之每一個可設置於一個板150上，以便其可朝板150之左側及右側移動。此外，一軌道151可形成於板150上，以便引導第一體115及第二體135之移動。因此，第一及第二體115及135可沿軌道151向左或向右移動，以便可將第一、第二、第三及第四攝影機111、112、131及132完美地定位至數個地點，該等地點對應於面板10中的第一側表面之上部及下部邊緣11及12及對應於第二側表面之上部及下部邊緣13及14。Further, each of the first body 115 and the second body 135 may be disposed on one of the plates 150 so as to be movable toward the left and right sides of the plate 150. Further, a track 151 may be formed on the board 150 to guide the movement of the first body 115 and the second body 135. Therefore, the first and second bodies 115 and 135 can be moved left or right along the track 151 so that the first, second, third and fourth cameras 111, 112, 131 and 132 can be perfectly positioned to several The locations correspond to the upper and lower edges 11 and 12 of the first side surface of the panel 10 and to the upper and lower edges 13 and 14 of the second side surface.
此外，該研磨量偵測單元可進一步包括一用於接納面板10之平臺160，及一用於沿一向前/向後方向移動平臺160之平臺驅動部分140。因此，當在將第一、第二、第三及第四攝影機111、112、131及132分別定位至該等地點後，藉由平臺驅動部分140移動平臺160時，第一、第二、第三及第四攝影機111、112、131、132即可準確地偵測面板10中的第一側表面之上部及下部邊緣11及12及第二側表面之上部及下部邊緣13及14之每一研磨量。In addition, the polishing amount detecting unit may further include a platform 160 for receiving the panel 10, and a platform driving portion 140 for moving the platform 160 in a forward/backward direction. Therefore, when the first, second, third, and fourth cameras 111, 112, 131, and 132 are respectively positioned to the locations, when the platform driving portion 140 moves the platform 160, the first, second, and The third and fourth cameras 111, 112, 131, 132 can accurately detect the upper and lower edges 11 and 12 of the first side surface and the upper and lower edges 13 and 14 of the second side surface of the panel 10. The amount of grinding.
此外，如圖2中所示，上述研磨量偵測單元100可進一步包括一第一消除器170及一第二消除器180。第一消除器170可設置於第一體115上，以便移除面板10之第一側表面的上部或下部邊緣11或12之異物。此外，第二消除器180可設置於第二體135上，以便移除面板10之第二側表面的上部或下部邊緣13或14之異物。In addition, as shown in FIG. 2 , the polishing amount detecting unit 100 may further include a first canceller 170 and a second canceller 180 . The first canceller 170 may be disposed on the first body 115 to remove foreign matter of the upper or lower edge 11 or 12 of the first side surface of the panel 10. Further, the second canceller 180 may be disposed on the second body 135 to remove foreign matter of the upper or lower edge 13 or 14 of the second side surface of the panel 10.
詳言之，第一消除器170可包括：一第一空氣噴射器171，其設置於第一體115之上部部分上以便移除面板10之第一側表面的上部邊緣11之異物；及一第二空氣噴射器172，其設置於第一體115之下部部分上以便移除面板10之第一側表面的下部邊緣12之異物。In detail, the first canceller 170 may include: a first air ejector 171 disposed on the upper portion of the first body 115 to remove the foreign matter of the upper edge 11 of the first side surface of the panel 10; A second air ejector 172 is disposed on a lower portion of the first body 115 to remove foreign matter from the lower edge 12 of the first side surface of the panel 10.
此外，第二消除器180可包括：一第三空氣噴射器181，其設置於第二體135之上部部分上以便移除面板10之第二側表面的上部邊緣13之異物；及一第四空氣噴射器182，其設置於第二體135之下部部分上以便移除面板10之第二側表面的下部邊緣14之異物。In addition, the second canceller 180 may include: a third air ejector 181 disposed on the upper portion of the second body 135 to remove the foreign matter of the upper edge 13 of the second side surface of the panel 10; and a fourth An air ejector 182 is disposed on a lower portion of the second body 135 to remove foreign matter from the lower edge 14 of the second side surface of the panel 10.
此外，上述研磨量偵測單元100可進一步包括一第一燈191、一第二燈192、一第三燈193及一第四燈194。In addition, the polishing amount detecting unit 100 may further include a first lamp 191, a second lamp 192, a third lamp 193, and a fourth lamp 194.
詳言之，第一燈191可設置於第一攝影機111之第一側上，以便照射面板10之第一側表面之上部邊緣11。第二燈192可設置於第二攝影機112之第一側上，以便照射面板10之第一側表面之下部邊緣12。第三燈193可設置於第三攝影機131之第一側上，以便照射面板10之第二側表面之上部邊緣13。第四燈194可設置於第四攝影機132之第一側上，以便照射面板10之第二側表面之下部邊緣14。In detail, the first lamp 191 can be disposed on the first side of the first camera 111 to illuminate the upper edge 11 of the first side surface of the panel 10. A second lamp 192 can be disposed on the first side of the second camera 112 to illuminate the lower side edge 12 of the first side surface of the panel 10. The third lamp 193 can be disposed on the first side of the third camera 131 to illuminate the upper edge 13 of the second side surface of the panel 10. A fourth lamp 194 can be disposed on the first side of the fourth camera 132 to illuminate the lower side edge 14 of the second side surface of the panel 10.
此外，作為一實例，第一燈191與第二燈192可輻照彼此不同色彩之光。因此，可容易地將面板10之第一側表面的上部邊緣11之影像與面板10之第一側表面的下部邊緣12之影像區分開，且該等影像可藉由一監視器(未顯示)來顯示。Further, as an example, the first lamp 191 and the second lamp 192 may illuminate light of different colors from each other. Thus, the image of the upper edge 11 of the first side surface of the panel 10 can be easily distinguished from the image of the lower edge 12 of the first side surface of the panel 10, and the images can be viewed by a monitor (not shown). To show.
此外，第三燈193與第四燈194可輻照彼此不同色彩之光。因此，可容易地將面板10之第一側表面的上部邊緣13之影像與面板10之第一側表面的下部邊緣14之影像區分開，且該等影像可藉由一監視器(未顯示)來顯示。Further, the third lamp 193 and the fourth lamp 194 can illuminate light of different colors from each other. Thus, the image of the upper edge 13 of the first side surface of the panel 10 can be easily distinguished from the image of the lower edge 14 of the first side surface of the panel 10, and the images can be viewed by a monitor (not shown). To show.
作為另一實施例，第一燈191、第二燈192、第三燈193、及第四燈194可輻照彼此不同色彩之光。As another embodiment, the first lamp 191, the second lamp 192, the third lamp 193, and the fourth lamp 194 may illuminate light of different colors from each other.
圖3係一顯示根據本發明一實施例之一平面顯示器製造系統中之研磨單元之俯視平面圖，圖4係一顯示根據本發明一實施例之一平面顯示器製造系統中面板自研磨單元移至研磨量偵測單元之狀態之俯視平面圖，且圖5係一顯示根據本發明一實施例之一平面顯示器製造系統中研磨單元、一控制器及研磨量偵測單元之間的一關係之方塊圖。3 is a top plan view showing a polishing unit in a flat panel display manufacturing system according to an embodiment of the present invention, and FIG. 4 is a view showing a panel moving from a grinding unit to a polishing in a flat panel display manufacturing system according to an embodiment of the invention. A top plan view of the state of the volume detecting unit, and FIG. 5 is a block diagram showing a relationship between the polishing unit, a controller, and the grinding amount detecting unit in the flat panel display manufacturing system according to an embodiment of the present invention.
如圖3至5中所示，根據本發明一實施例之一平面顯示器製造系統可進一步包括一研磨單元300、一面板驅動部分500、及一控制器700。As shown in FIGS. 3 through 5, a flat panel display manufacturing system according to an embodiment of the present invention may further include a polishing unit 300, a panel driving portion 500, and a controller 700.
研磨單元300研磨面板10之第一側表面的上部及下部邊緣11及12及面板10之第二側表面的上部及下部邊緣13及14。詳言之，研磨單元300可包括一研磨臺310、一位置偵測器330、及一研磨器350。面板10係設置於研磨臺310上。位置偵測器330係用於偵測設置於研磨臺310上的面板10之位置。研磨器350係用於在沿面板10之偵測位置向左及向右移動時研磨面板10。The polishing unit 300 polishes the upper and lower edges 11 and 12 of the first side surface of the panel 10 and the upper and lower edges 13 and 14 of the second side surface of the panel 10. In detail, the polishing unit 300 can include a polishing table 310, a position detector 330, and a grinder 350. The panel 10 is disposed on the polishing table 310. The position detector 330 is for detecting the position of the panel 10 disposed on the polishing table 310. The grinder 350 is used to polish the panel 10 as it moves left and right along the detection position of the panel 10.
如圖4中所示，面板驅動部分500將經研磨之面板10自研磨單元300移至研磨量偵測單元100之平臺160。As shown in FIG. 4, the panel driving portion 500 moves the ground panel 10 from the polishing unit 300 to the platform 160 of the grinding amount detecting unit 100.
如圖5中所示，控制器700係藉由交換研磨單元300所偵測之面板10之位置資訊與研磨量偵測單元100所偵測之面板10之研磨量資訊，根據一回授控制來控制面板10之一位置。As shown in FIG. 5, the controller 700 exchanges the position information of the panel 10 detected by the polishing unit 300 with the grinding amount information of the panel 10 detected by the grinding amount detecting unit 100 according to a feedback control. One position of the control panel 10.
另一方面，控制器700可藉由一個或多個由一預定程式啟動之處理器來實現，且該預定程式可經程式化以實施根據本發明一實施例之一用於控制平面顯示器製造系統之方法之每一步驟。Alternatively, the controller 700 can be implemented by one or more processors activated by a predetermined program, and the predetermined program can be programmed to implement a control plane display manufacturing system in accordance with one embodiment of the present invention. Each step of the method.
圖6及7係顯示根據本發明一實施例之一用於控制平面顯示器製造系統之方法之流程圖。6 and 7 are flow diagrams showing a method for controlling a flat panel display manufacturing system in accordance with an embodiment of the present invention.
下文將參照圖6詳細闡述根據本發明之一用於控制平面顯示器製造系統之方法。A method for controlling a flat panel display manufacturing system in accordance with one of the present invention will be described in detail below with reference to FIG.
於步驟S11處，控制器700根據來自設置於研磨單元300上之位置偵測器330的面板10之位置資訊接收一第一偵測信號。特定而言，每當將下一面板設置於研磨臺310上時，位置偵測器330即偵測面板10之位置資訊。At step S11, the controller 700 receives a first detection signal based on the position information from the panel 10 of the position detector 330 disposed on the polishing unit 300. In particular, the position detector 330 detects the position information of the panel 10 each time the next panel is placed on the polishing table 310.
於步驟S13處，控制器700將該第一偵測信號轉換成一第一控制信號。At step S13, the controller 700 converts the first detection signal into a first control signal.
於步驟S15處，將第一控制信號儲存於一設置至控制器700之記憶體(未顯示)內。特定而言，若下一面板10之位置資訊被更新，則將該更新之第一控制信號儲存於已移除現有第一控制信號之記憶體內。At step S15, the first control signal is stored in a memory (not shown) that is set to the controller 700. Specifically, if the location information of the next panel 10 is updated, the updated first control signal is stored in the memory in which the existing first control signal has been removed.
於步驟S17處，控制器700係根據儲存於記憶體內之第一控制信號來控制面板驅動部分500，同時將在研磨單元300上研磨之面板10移至一設置至研磨量偵測單元100之平臺160。因此，面板驅動部分500可將已被固持至面板驅動部分500(例如，藉由一機械手臂等)之面板10準確地設置於平臺160上。At step S17, the controller 700 controls the panel driving portion 500 according to the first control signal stored in the memory, and simultaneously moves the panel 10 polished on the polishing unit 300 to a platform set to the polishing amount detecting unit 100. 160. Therefore, the panel driving portion 500 can accurately set the panel 10 that has been held to the panel driving portion 500 (for example, by a robot arm or the like) on the platform 160.
根據本發明之方法可進一步包括以下步驟。The method according to the invention may further comprise the following steps.
於步驟S21處，控制器700根據來自設置至研磨量偵測單元100的第一、第二、第三及第四攝影機111、112、131、132的面板10之研磨量資訊接收一第二偵測信號。特定而言，每當將下一面板設置於平臺160上時，第一、第二、第三、及第四111、112、131及132攝影機即偵測面板10之研磨量資訊。At step S21, the controller 700 receives a second Detector based on the grinding amount information from the panel 10 of the first, second, third, and fourth cameras 111, 112, 131, 132 set to the polishing amount detecting unit 100. Measuring signal. In particular, the first, second, third, and fourth 111, 112, 131, and 132 cameras detect the amount of polishing information of the panel 10 each time the next panel is placed on the platform 160.
於步驟S23處，控制器700將該第二偵測信號轉換成一第二控制信號。At step S23, the controller 700 converts the second detection signal into a second control signal.
於步驟S25處，將該第二控制信號儲存於記憶體內。特定而言，若下一面板10之研磨量資訊被更新，則將該更新之第二控制信號儲存於已移除現有第二控制信號之記憶體內。At step S25, the second control signal is stored in the memory. Specifically, if the polishing amount information of the next panel 10 is updated, the updated second control signal is stored in the memory in which the existing second control signal has been removed.
於步驟S27處，當藉由設置至研磨單元300之研磨器350研磨面板10時，該控制器係根據該第二控制信號來控制研磨器350之一向左/向右移動量。因此，可藉由可向左/向右移動之研磨器350精細地研磨面板10。At step S27, when the panel 10 is ground by the grinder 350 provided to the grinding unit 300, the controller controls the amount of left/rightward movement of one of the grinders 350 according to the second control signal. Therefore, the panel 10 can be finely ground by the grinder 350 that can be moved left/right.
另一方面，於上述方法中，已闡述：實施一根據位置偵測器330所偵測之位置資訊控制面板驅動部分500之第一製程(參見圖6)，且隨後實施一根據攝影機111、112、131及132所偵測之研磨量資訊控制研磨器350之移動量之第二製程(參見圖7)，但可在該第一製程(參見圖6)前實施該第二製程(參見圖7)。On the other hand, in the above method, it has been explained that a first process of controlling the panel driving portion 500 according to the position information detected by the position detector 330 is implemented (see FIG. 6), and then a camera 111, 112 is implemented. The grinding amount information detected by 131 and 132 controls the second process of the movement amount of the grinder 350 (see FIG. 7), but the second process can be implemented before the first process (see FIG. 6) (see FIG. 7). ).
如已解釋，根據本發明一實施例的平面顯示器製造系統及用於控制該平面顯示器製造系統之方法可具有以下優點。As has been explained, a flat panel display manufacturing system and a method for controlling the flat panel display manufacturing system according to an embodiment of the present invention can have the following advantages.
根據本發明之實施例，可同時偵測該面板之至少一個側表面的上部及下部邊緣之研磨量。亦即，可減少兩個研磨量偵測次數。因此，可減小總平均循環時間(TACT)。According to an embodiment of the present invention, the amount of grinding of the upper and lower edges of at least one side surface of the panel can be simultaneously detected. That is, the number of times of grinding amount detection can be reduced. Therefore, the total average cycle time (TACT) can be reduced.
此外，根據本發明之實施例，可根據係藉由交換該研磨單元所偵測之面板位置資訊與該研磨量偵測單元所偵測之面板研磨量資訊控制之回授控制來控制該面板之位置。亦即，由於可根據該回授控制來控制該面板之位置，故可精確地研磨該面板。In addition, according to the embodiment of the present invention, the panel can be controlled according to the panel position information detected by the polishing unit and the feedback control of the panel grinding amount information detected by the polishing amount detecting unit. position. That is, since the position of the panel can be controlled according to the feedback control, the panel can be precisely ground.
儘管已結合當前被認作為可實踐之實例性實施例闡述了本發明，但應瞭解，本發明並非侷限於該等所揭示之實施例，而相反，本發明意欲涵蓋隨附申請專利範圍之精神及範疇內所包含的各種修改及等效佈置。Although the present invention has been described in connection with the exemplary embodiments of the present invention, it is understood that the invention is not limited to the disclosed embodiments, but the invention is intended to cover the spirit of the appended claims And various modifications and equivalent arrangements contained in the scope.
10．．．面板10. . . panel
11．．．上部邊緣11. . . Upper edge
12．．．下部邊緣12. . . Lower edge
13．．．上部邊緣13. . . Upper edge
14．．．下部邊緣14. . . Lower edge
100．．．研磨量偵測單元100. . . Grinding amount detecting unit
110．．．第一研磨量偵測器110. . . First grinding amount detector
111．．．第一攝影機111. . . First camera
112．．．第二攝影機112. . . Second camera
115．．．第一體115. . . First body
130．．．第二研磨量偵測器130. . . Second grinding amount detector
131．．．第三攝影機131. . . Third camera
132．．．第四攝影機132. . . Fourth camera
135．．．第二體135. . . Second body
140．．．平臺驅動部分140. . . Platform driver
150．．．板150. . . board
151．．．軌道151. . . track
160．．．平臺160. . . platform
170．．．第一消除器170. . . First canceller
171．．．第一空氣噴射器171. . . First air injector
172．．．第二空氣噴射器172. . . Second air injector
180．．．第二消除器180. . . Second canceller
181．．．第三空氣噴射器181. . . Third air injector
182．．．第四空氣噴射器182. . . Fourth air ejector
191．．．第一燈191. . . First light
192．．．第二燈192. . . Second light
193．．．第三燈193. . . Third light
194．．．第四燈194. . . Fourth light
300．．．研磨單元300. . . Grinding unit
310．．．研磨臺310. . . Grinding table
330．．．位置偵測器330. . . Position detector
350．．．研磨器350. . . abrader
500．．．面板驅動部分500. . . Panel drive section
700．．．控制器700. . . Controller
圖1係一根據本發明一實施例顯示一平面顯示器製造系統中之研磨量偵測單元之正視圖。1 is a front elevational view showing a grinding amount detecting unit in a flat panel display manufacturing system according to an embodiment of the invention.
圖2係一顯示圖1之部分"A"之放大圖。Fig. 2 is an enlarged view showing a portion "A" of Fig. 1.
圖3係一根據本發明一實施例顯示一平面顯示器製造系統中之研磨單元之俯視平面圖。3 is a top plan view showing a polishing unit in a flat panel display manufacturing system in accordance with an embodiment of the present invention.
圖4係一顯示根據本發明一實施例之一狀態之俯視平面圖，其中於平面顯示器製造系統中面板係自研磨單元移至研磨量偵測單元。4 is a top plan view showing a state in which a panel is moved from a polishing unit to a polishing amount detecting unit in a flat panel display manufacturing system in accordance with an embodiment of the present invention.
圖5係一方塊圖，其顯示根據本發明一實施例之平面顯示器製造系統中研磨單元、一控制器及研磨量偵測單元之間的一關係。FIG. 5 is a block diagram showing a relationship between a polishing unit, a controller, and a grinding amount detecting unit in a flat panel display manufacturing system according to an embodiment of the invention.
圖6及7係流程圖，其顯示根據本發明一實施例之一用於控制平面顯示器製造系統之方法。6 and 7 are flow diagrams showing a method for controlling a flat panel display manufacturing system in accordance with an embodiment of the present invention.
10．．．面板10. . . panel
11．．．上部邊緣11. . . Upper edge
12．．．下部邊緣12. . . Lower edge
100．．．研磨量偵測單元100. . . Grinding amount detecting unit
110．．．第一研磨量偵測器110. . . First grinding amount detector
111．．．第一攝影機111. . . First camera
112．．．第二攝影機112. . . Second camera
115．．．第一體115. . . First body
130．．．第二研磨量偵測器130. . . Second grinding amount detector
131．．．第三攝影機131. . . Third camera
132．．．第四攝影機132. . . Fourth camera
135．．．第二體135. . . Second body
140．．．平臺驅動部分140. . . Platform driver
150．．．板150. . . board
151．．．軌道151. . . track
160．．．平臺160. . . platform
170．．．第一消除器170. . . First canceller
171．．．第一空氣噴射器171. . . First air injector
172．．．第二空氣噴射器172. . . Second air injector
180．．．第二消除器180. . . Second canceller
181．．．第三空氣噴射器181. . . Third air injector
182．．．第四空氣噴射器182. . . Fourth air ejector
191．．．第一燈191. . . First light
192．．．第二燈192. . . Second light
193．．．第三燈193. . . Third light
194．．．第四燈194. . . Fourth light
Claims (19)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020050100727A KR101188168B1 (en) | 2005-10-25 | 2005-10-25 | System for manufacturing a flat panel type display and controlling method thereof |
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| Publication Number | Publication Date |
|---|---|
| TW200717086A TW200717086A (en) | 2007-05-01 |
| TWI432825B true TWI432825B (en) | 2014-04-01 |
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| TW095129619A TWI432825B (en) | 2005-10-25 | 2006-08-11 | Flat panel display manufacturing system and method for controlling the same |
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| Country | Link |
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| KR (1) | KR101188168B1 (en) |
| CN (1) | CN1955801B (en) |
| TW (1) | TWI432825B (en) |
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| CN106200038B (en) * | 2016-07-13 | 2019-07-30 | 芜湖东旭光电科技有限公司 | A kind of the edge detection system and its detection method of glass substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10229060A (en) * | 1997-02-13 | 1998-08-25 | Nikon Corp | Polishing amount measuring equipment |
| JP2000216122A (en) * | 1999-01-20 | 2000-08-04 | Toshiba Ceramics Co Ltd | Surface grinding method for semiconductor wafer |
| DE10128476C2 (en) * | 2001-06-12 | 2003-06-12 | Siemens Dematic Ag | Optical sensor device for the visual detection of substrates |
| KR100798322B1 (en) * | 2002-03-21 | 2008-01-28 | 엘지.필립스 엘시디 주식회사 | Apparatus and method for correcting grind amount of liquid crystal display panel |
| KR100832297B1 (en) * | 2002-12-17 | 2008-05-26 | 엘지디스플레이 주식회사 | Apparatus for measuring grinding amount of liquid crystal display panel and method thereof |
| KR100960472B1 (en) * | 2003-12-16 | 2010-05-28 | 엘지디스플레이 주식회사 | Appratus for fabricating liquid crystal display panel and fabricating method thereof |
-
2005
- 2005-10-25 KR KR1020050100727A patent/KR101188168B1/en active IP Right Grant
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| CN1955801A (en) | 2007-05-02 |
| KR101188168B1 (en) | 2012-10-05 |
| TW200717086A (en) | 2007-05-01 |
| CN1955801B (en) | 2011-08-03 |
| KR20070044617A (en) | 2007-04-30 |
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