TWI429755B - Silicon-based alloy and manufacturing method thereof - Google Patents

Silicon-based alloy and manufacturing method thereof Download PDF

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TWI429755B
TWI429755B TW99121860A TW99121860A TWI429755B TW I429755 B TWI429755 B TW I429755B TW 99121860 A TW99121860 A TW 99121860A TW 99121860 A TW99121860 A TW 99121860A TW I429755 B TWI429755 B TW I429755B
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based alloy
bismuth
ruthenium
metal
producing
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TW99121860A
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TW201202438A (en
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Hungshang Huang
Inting Hong
Huanchien Tung
Chunhao Chiu
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China Steel Corp
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Description

矽基合金及其製造方法Base alloy and manufacturing method thereof

本發明是有關於一種矽基合金及其製造方法,且特別是有關於具有高緻密性以及細緻組織之矽基合金及其製造方法。The present invention relates to a bismuth-based alloy and a method of producing the same, and more particularly to a bismuth-based alloy having high density and fine structure and a method of producing the same.

矽基合金可廣泛地應用在裝飾鍍膜、光學鍍膜或耐磨耗鍍膜等用途上,其中上述之鍍膜主要係以氬離子直接濺鍍或通入所需氣體做反應濺鍍的方式來沈積此類功能性薄膜。而上述鍍膜之技術所使用之矽基合金(靶材)的特性(例如矽基合金中所包含之縮孔的比例,或微觀組織是否粗大)會影響最後產生之薄膜的品質。Niobium-based alloys can be widely used in decorative coatings, optical coatings or wear-resistant coatings. The above coatings are mainly deposited by direct sputtering of argon ions or by reactive sputtering of the desired gas. Functional film. The properties of the bismuth-based alloy (target) used in the above coating technique (for example, the ratio of the crater contained in the bismuth-based alloy or the coarseness of the microstructure) affects the quality of the resulting film.

然而,由鍍膜所採用之矽基合金(例如矽-鋁、矽-銀、矽-金、矽-錫、或矽-鋅)之相圖可知,其中矽與金屬之熔點通常具有很大的差異性,故其幾乎互不固溶。However, the phase diagram of the ruthenium-based alloy (for example, bismuth-aluminum, bismuth-silver, bismuth-gold, bismuth-tin, or bismuth-zinc) used in the coating is known, and the melting point of bismuth and metal is usually very different. Sex, so it is almost not dissolved.

若以一般熔煉澆鑄方式製造做為靶材使用之矽基合金,則矽基合金容易有包含大量縮孔以及微觀組織非常粗大之缺陷。當此矽基合金做為靶材而使用於濺鍍製程中,容易造成異常放電(Arcing)、濺鍍速率慢、產率降低、鍍膜組成不均以及鍍膜品質劣化之缺點。If a ruthenium-based alloy used as a target is produced by a general smelting casting method, the ruthenium-based alloy is liable to have a large number of shrinkage cavities and a very large microstructure. When the ruthenium-based alloy is used as a target and used in a sputtering process, it is likely to cause abnormal discharge (Arcing), slow sputtering rate, low yield, uneven coating composition, and deterioration of coating quality.

若以習知粉末冶金方式製造做為靶材使用之矽基合金,則因矽與金屬之熔點的差異大且互不固溶,故在固態燒結時沒有燒結性,不容易獲得密度高的燒結合金,亦即燒結之矽基合金中具有之縮孔的比例過高。If a ruthenium-based alloy used as a target is produced by a conventional powder metallurgy method, since the difference in melting point between the bismuth and the metal is large and does not solidify at the same time, there is no sinterability in solid state sintering, and it is not easy to obtain a high-density sintering. The ratio of the shrinkage cavities in the alloy, that is, the sintered niobium-based alloy, is too high.

為改善上述矽基合金中的缺點,在習知技術中,提出以下所述之方法:將矽與金屬粉末混合,並將其填入無空氣之密封容器中,在矽基合金之液相以上溫度進行熱均壓(Hot Isostatic Press),利用液相來減少矽基合金中之縮孔的比例。然而,由於製程係在液相中進行,容易產生Oswald Ripening效應,亦即小顆粒的矽粉會溶解在液相中,並析出在較大之矽顆粒上,使得最後之矽晶粒的微結構變得較原始之粉末的微結構粗大。因此,在最終之矽基合金中不易獲得更細緻之微結構及均勻的組成。此外,進行熱均壓之設備造價昂貴,故增加了生產成本。In order to improve the disadvantages in the above-mentioned bismuth-based alloy, in the prior art, the following method is proposed: mixing cerium with metal powder and filling it into an airless sealed container above the liquid phase of the bismuth-based alloy The temperature is subjected to Hot Isostatic Press, and the liquid phase is used to reduce the proportion of craters in the ruthenium-based alloy. However, since the process is carried out in the liquid phase, the Oswald Ripening effect is easily generated, that is, the small particles of the tantalum powder are dissolved in the liquid phase and precipitated on the larger tantalum particles, so that the microstructure of the final tantalum grains is obtained. It becomes coarser than the original powder. Therefore, it is difficult to obtain a finer microstructure and a uniform composition in the final bismuth-based alloy. In addition, equipment that performs heat equalization is expensive, which increases production costs.

另外,在習知技術中,亦揭露有使用噴覆成型之方式來製造矽基合金之技術。然而,噴覆成型之方式具有得料率低的缺點,容易造成大量原料浪費的問題。Further, in the prior art, a technique of manufacturing a ruthenium-based alloy by means of spray coating is also disclosed. However, the method of spray forming has the disadvantage of low yield, and is liable to cause a large amount of waste of raw materials.

因此,本發明之目的係在提供一種矽基合金及其製造方法,藉由在液相生成溫度以下熱壓,可避免Oswald Ripening效應,形成具有高緻密性以及細緻組織之矽基合金。Accordingly, an object of the present invention is to provide a bismuth-based alloy and a method for producing the same, which can avoid the Oswald Ripening effect by hot pressing below the liquid phase formation temperature to form a bismuth-based alloy having high density and fine structure.

根據本發明之一實施例,提供一種矽基合金之製造方法。此製造方法包含下列步驟。提供矽及金屬之原料。進行熔煉步驟,熔煉上述矽及金屬之原料,以形成矽基合金湯液。進行霧化步驟,霧化矽基合金湯液,以形成矽基合金粉末。進行熱壓步驟,熱壓矽基合金粉末,以形成矽基合金。其中係在溫度為矽基合金之液相生成溫度以下40℃ 至矽基合金之液相生成溫度以下20℃,且壓力為150百萬帕斯卡(MPa)至200MPa進行熱壓步驟。According to an embodiment of the present invention, a method of manufacturing a bismuth based alloy is provided. This manufacturing method includes the following steps. Provides raw materials for tantalum and metals. A melting step is performed to melt the raw materials of the above-mentioned niobium and metal to form a niobium-based alloy soup solution. An atomization step is performed to atomize the bismuth-based alloy soup solution to form a bismuth-based alloy powder. A hot pressing step is performed to thermally press the ruthenium-based alloy powder to form a ruthenium-based alloy. Among them, the temperature is 40 ° C below the liquid phase formation temperature of the ruthenium based alloy. The hot pressing step is carried out until the liquid phase formation temperature of the base alloy is 20 ° C and the pressure is 150 MPa (MPa) to 200 MPa.

根據本發明之另一實施例,上述矽基合金之製造方法中,進行霧化步驟更包含進行噴擊步驟,以氣體噴擊矽基合金湯液。According to another embodiment of the present invention, in the method for producing a bismuth-based alloy, the atomizing step further comprises performing a spraying step of spraying the bismuth-based alloy soup liquid with a gas.

根據本發明之另一實施例,上述進行噴擊步驟時,氣體之壓力為1MPa至5MPa,且氣體之速度為50公尺/秒(m/s)至100m/s。According to another embodiment of the present invention, the gas pressure is from 1 MPa to 5 MPa, and the gas velocity is from 50 m/s to 100 m/s.

根據本發明之又一實施例,提供一種矽基合金。此矽基合金包含矽及金屬,其中矽所佔之重量百分比為50%至90%,矽基合金之實際密度大於或等於矽基合金之理論密度的99.5%,且在矽基合金中,每1微米(mm)之範圍內,該矽與該金屬之界面數大於或等於100個。According to still another embodiment of the present invention, a bismuth based alloy is provided. The niobium-based alloy comprises niobium and a metal, wherein the niobium accounts for 50% to 90% by weight, and the actual density of the niobium-based alloy is greater than or equal to 99.5% of the theoretical density of the niobium-based alloy, and in the niobium-based alloy, each In the range of 1 micrometer (mm), the number of interfaces of the crucible with the metal is greater than or equal to 100.

本發明之優點為,透過在液相生成溫度以下進行熱壓,可形成具有高緻密性以及細緻組織之矽基合金。當在液相生成溫度以上進行熱壓時,容易產生流湯現象,亦即液態之合金湯液受到壓力的擠壓,容易流出容置合金湯液之容器,而為了避免流湯現象的產生,通常需採用熱均壓。相對於採用熱均壓,本發明以一般之熱壓設備即可產生具有高緻密性以及細緻組織之矽基合金,故可降低設備成本。此外,相較於噴覆成型之方式,本發明更可降低原料成本之支出。再者,由於本發明所產生之矽基合金具有高緻密性以及細緻組織,故以本發明之矽基合金進行濺鍍,可提升鍍膜之組成的均勻性,亦即提升鍍膜的品質,進而提升產品的競爭性。An advantage of the present invention is that a bismuth-based alloy having high density and fine structure can be formed by hot pressing below the liquid phase formation temperature. When the hot pressing is performed above the liquid phase forming temperature, the flow of the soup is easy to occur, that is, the liquid alloy soup is pressed by the pressure, and it is easy to flow out of the container for accommodating the alloy soup, and in order to avoid the occurrence of the soup phenomenon, Hot pressure equalization is usually required. Compared with the use of the heat equalizing pressure, the present invention can produce a high-density and fine-structured bismuth-based alloy by a general hot pressing apparatus, thereby reducing the equipment cost. In addition, the present invention can reduce the cost of raw material costs compared to the manner of spray coating. Furthermore, since the bismuth-based alloy produced by the present invention has high compactness and fine structure, sputtering of the bismuth-based alloy of the present invention can improve the uniformity of the composition of the coating, that is, improve the quality of the coating, thereby improving Product competitiveness.

請參照第1圖,其係繪示根據本發明之一實施例之矽基合金之製造方法的流程圖。矽基合金之製造方法100開始於步驟102,用以提供矽及金屬之原料。在此步驟102中,依照所需選擇一金屬,並依照需求調配矽與上述金屬之重量比例。其中,上述之金屬可例如為鋁、銀、金、錫、鋅或上述材料之矽基合金。Please refer to FIG. 1 , which is a flow chart showing a method of manufacturing a bismuth-based alloy according to an embodiment of the present invention. The method of manufacturing the bismuth based alloy begins at step 102 with the provision of a raw material for bismuth and metal. In this step 102, a metal is selected as desired, and the weight ratio of bismuth to the above metal is adjusted as needed. Wherein, the above metal may be, for example, aluminum, silver, gold, tin, zinc or a ruthenium based alloy of the above materials.

接著進行熔煉步驟104,將上述調配好之矽與金屬之原料放入容器中,並將調配好之矽與金屬之原料加熱至高溫,使其熔化以形成矽基合金湯液。Next, the smelting step 104 is carried out, the raw materials of the prepared bismuth and the metal are placed in a container, and the raw materials of the prepared bismuth and metal are heated to a high temperature to be melted to form a bismuth-based alloy soup solution.

在熔煉步驟104之後,進行霧化步驟106,霧化矽基合金湯液,以形成矽基合金粉末。例如:在進行霧化步驟106當中,更包含進行噴擊步驟,亦即以一氣體噴擊矽基合金湯液,使其形成矽基合金粉末,或使得矽基合金湯液由熔煉之容器中落下至一圓盤,利用離心力之原理使矽基合金湯液形成矽基合金粉末。上述噴擊步驟或利用利用離心力原理產生合金粉末之技術,係此領域常用之技術手段,故其細節不在此加以贅述。After the smelting step 104, an atomization step 106 is performed to atomize the bismuth-based alloy soup solution to form a bismuth-based alloy powder. For example, in the performing the atomizing step 106, the spraying step is further included, that is, the strontium-based alloy soup is sprayed with a gas to form a bismuth-based alloy powder, or the bismuth-based alloy soup solution is obtained from the smelting container. Dropped to a disc, the bismuth-based alloy soup was formed into a bismuth-based alloy powder by the principle of centrifugal force. The above-described spraying step or the technique of producing alloy powder by using the centrifugal force principle is a technical means commonly used in the field, so the details thereof will not be described herein.

接著,進行熱壓步驟108,熱壓霧化步驟106中所產生之矽基合金粉末,以形成所需之矽基合金。在熱壓步驟108進行時,溫度為此矽基合金之液相生成溫度以下40℃至此矽基合金之液相生成溫度以下20℃,且熱壓所使用之壓力為150MPa至200MPa。Next, a hot pressing step 108 is performed to thermally pressurize the ruthenium-based alloy powder produced in step 106 to form the desired ruthenium-based alloy. In the hot pressing step 108, the temperature is 40 ° C below the liquid phase formation temperature of the bismuth-based alloy to 20 ° C below the liquid phase formation temperature of the bismuth-based alloy, and the pressure used for the hot pressing is 150 MPa to 200 MPa.

在本發明中,由於係在矽基合金之液相生成溫度以下 進行熱壓步驟108,因此在熱壓過程中,矽基合金粉末可保持在固態,故不會有流湯現象產生,不會影響最後產生之矽基合金的成分。此外,基於上述「不會產生流湯現象」之理由,可採用一般之熱壓設備進行熱壓步驟108,進而降低採用熱均壓製程所需之高昂的設備成本。In the present invention, it is below the liquid phase formation temperature of the ruthenium based alloy. The hot pressing step 108 is carried out, so that the ruthenium-based alloy powder can be kept in a solid state during the hot pressing process, so that no flow-through phenomenon occurs and the composition of the finally produced ruthenium-based alloy is not affected. Further, based on the above-mentioned "no flow phenomenon", the hot pressing step 108 can be carried out by a general hot pressing apparatus, thereby reducing the high equipment cost required for the heat equalizing process.

在特定之實施例中,上述霧化步驟106所包含之噴擊步驟中所使用之氣體可為惰性氣體,例如:氮氣或氬氣。此外,在特定之實施例中,上述噴擊步驟中所採用之氣體之壓力為1MPa至5MPa,且其速度為50公尺/秒(m/s)至100m/s。In a particular embodiment, the gas used in the spraying step included in the atomizing step 106 described above may be an inert gas such as nitrogen or argon. Further, in a specific embodiment, the pressure of the gas used in the above-described spraying step is 1 MPa to 5 MPa, and the speed thereof is 50 meters/second (m/s) to 100 m/s.

在特定之實施例中,為了使得最終之矽基合金能夠充分具有高緻密性以及細緻組織,上述熱壓步驟108持續之時間為1小時至3小時。In a particular embodiment, the hot pressing step 108 is continued for a period of from 1 hour to 3 hours in order to enable the final bismuth-based alloy to have sufficient high density and fine texture.

上述矽基合金之緻密性係指矽基合金中的空孔率,一般係以經由製程產生之矽基合金的實際密度佔有其理論密度之百分比來表示(可稱之為燒結密度)。例如:一矽基合金之實際密度佔有其理論密度之99%,另一矽基合金之實際密度佔有其理論密度之90%,則稱,相較上述第二個矽基合金,上述第一個矽基合金具有較佳之緻密性。The compactness of the above-mentioned bismuth-based alloy refers to the porosity in the bismuth-based alloy, which is generally expressed as a percentage of the theoretical density of the bismuth-based alloy produced by the process, which may be referred to as a sintered density. For example, if the actual density of a bismuth-based alloy occupies 99% of its theoretical density and the actual density of another bismuth-based alloy occupies 90% of its theoretical density, it is said that the first one is compared with the second bismuth-based alloy. The bismuth based alloy has better compactness.

另外,上述矽基合金之細緻組織係用來評估經由製程產生之矽基合金中,矽與其他金屬分佈之均勻性,通常係利用如掃描型電子顯微鏡(SEM)觀察矽基合金之金相組織,並以定量金相分析方式來評估矽基合金之微結構中,矽與其他金屬分佈之均勻性。例如:以每1微米(mm)之範圍內,矽與金屬之界面數之平均個數(可稱之為「平均矽/ 金屬界面數」)來評估矽基合金之均勻性。In addition, the fine structure of the above-mentioned bismuth-based alloy is used to evaluate the uniformity of the distribution of bismuth and other metals in the bismuth-based alloy produced by the process, and the metallographic structure of the bismuth-based alloy is usually observed by a scanning electron microscope (SEM). And quantitative metallographic analysis to evaluate the uniformity of the distribution of niobium and other metals in the microstructure of niobium-based alloys. For example, the average number of interfaces between bismuth and metal in the range of 1 micrometer (mm) (can be called "average 矽 / The number of metal interfaces") was used to evaluate the uniformity of the bismuth based alloy.

在特定之實施例中,當熱壓步驟108之持續之時間如以上所述為1小時至3小時,所產生之矽基合金之實際密度大於或等於此矽基合金之理論密度的99.5%。此外,在上述矽基合金中,每1mm之範圍內,矽與金屬之界面數大於或等於100個。在此欲強調的是,在本發明中,允許存在特定含量下之雜質。In a particular embodiment, when the duration of the hot pressing step 108 is from 1 hour to 3 hours as described above, the actual density of the resulting bismuth-based alloy is greater than or equal to 99.5% of the theoretical density of the bismuth-based alloy. Further, in the above-mentioned bismuth-based alloy, the number of interfaces of bismuth and metal is greater than or equal to 100 per 1 mm. It is emphasized here that in the present invention, the presence of impurities at a specific level is allowed.

在特定之實施例中,其中矽所佔之重量百分比為50%至90%時。在特定之實施例中,為了使得矽基合金中所包含之矽與其他金屬能夠充分混合,故在溫度1500℃至1700℃進行上述之熔煉步驟104。In a particular embodiment, wherein the percentage by weight of bismuth is from 50% to 90%. In a specific embodiment, in order to allow the ruthenium contained in the ruthenium-based alloy to be sufficiently mixed with other metals, the above-described smelting step 104 is carried out at a temperature of 1500 ° C to 1700 ° C.

以下以實際實施例及比較實施例更具體地說明本發明,惟本發明的範圍不受此些實施例及比較實施例限制。The present invention is more specifically described by the following examples and comparative examples, but the scope of the present invention is not limited by the examples and comparative examples.

實施例Example

首先,將純矽塊及純鋁塊進行調配,使得矽所佔之重量百分比為70%。接著,將調配好之矽與鋁之原料放入真空感應熔煉噴霧製粉設備之坩鍋中,加熱至1600℃,使得矽塊及鋁塊熔化形成矽-鋁合金湯液。完成上述熔煉步驟後,通入惰性氣體噴擊從坩鍋底部開孔流下之熔融矽-鋁合金湯液,矽-鋁合金湯液被急速霧化成金屬液滴,固化後成為具有細緻組織,且矽之重量百分比為70%的矽-鋁合金粉末。然後收集上述之矽-鋁合金粉末,將其置入可進行高溫高壓之熱壓模具中,並將溫度升高至550℃(矽-鋁合金之液相生成溫度約為580℃),以175MPa之壓力進行熱壓2小時。待矽-鋁合金之燒結體冷卻後,將其從爐中取出,以阿 基米德法進行密度之測量,以SEM背向散射影像觀察其金相組織,以定量金相分佈分析方式評估其組織之細緻程度。上述SEM背向散射影像如附件1,而其緻密性及組織之細緻程度則如以下表一所示,其中燒結密度達99.9%,平均矽/鋁界面數為126個/mm。First, the pure niobium block and the pure aluminum block are blended so that the weight percentage of niobium is 70%. Next, the raw materials of the prepared crucible and aluminum are placed in a crucible of a vacuum induction melting spray milling apparatus, and heated to 1600 ° C to melt the crucible and the aluminum block to form a niobium-aluminum alloy soup solution. After the above melting step is completed, the molten strontium-aluminum alloy soup flowing from the bottom of the crucible is sprayed with an inert gas, and the bismuth-aluminum alloy soup is rapidly atomized into metal droplets, and after solidification, it has a fine structure, and The weight percentage of niobium is 70% of niobium-aluminum alloy powder. Then, the above-mentioned bismuth-aluminum alloy powder is collected, placed in a hot-pressing mold capable of high temperature and high pressure, and the temperature is raised to 550 ° C (the liquid phase formation temperature of the bismuth-aluminum alloy is about 580 ° C) to 175 MPa. The pressure was hot pressed for 2 hours. After the sintered body of the aluminum alloy is cooled, it is taken out of the furnace, The Kimidd method was used to measure the density, and the metallographic structure was observed by SEM backscattering image. The degree of detail of the microstructure was evaluated by quantitative metallographic analysis. The above SEM backscattered image is shown in Annex 1, and its compactness and fineness of the structure are as shown in Table 1 below, wherein the sintered density is 99.9%, and the average 矽/aluminum interface number is 126/mm.

比較實施例一Comparative Example 1

在比較實施例一中,製備矽-鋁合金之步驟類似於以上實施例之步驟,其中差異在於,在比較實施例一中係以大於矽-鋁合金之液相生成溫度之600℃,以及50MPa之壓力進行熱壓。結果產生嚴重之流湯現象,造成最終之矽-鋁合金成分不準確。In Comparative Example 1, the step of preparing the bismuth-aluminum alloy is similar to the steps of the above examples, wherein the difference is that in Comparative Example 1, the liquid phase formation temperature is greater than 矽-aluminum alloy at 600 ° C, and 50 MPa. The pressure is hot pressed. As a result, a serious flow of soup occurs, resulting in an inaccurate composition of the final bismuth-aluminum alloy.

比較實施例二Comparative Example 2

在比較實施例二中,製備矽-鋁合金之步驟類似於以上實施例之步驟,其中差異在於,在比較實施例二中係以50MPa之壓力進行熱壓(熱壓之溫度及時間與實施例相同)。此比較實施例之矽-鋁合金之緻密性及組織之細緻程度同樣記載於以下表一之中,其中燒結密度僅約71%,並沒有燒結緻密化之效果,無法達到高密度之品質要求。In Comparative Example 2, the steps of preparing the bismuth-aluminum alloy were similar to those of the above examples, with the difference that in the comparative example 2, the hot pressing was performed at a pressure of 50 MPa (the temperature and time of the hot pressing and the examples) the same). The compactness of the bismuth-aluminum alloy of this comparative example and the degree of fineness of the structure are also described in the following Table 1, in which the sintered density is only about 71%, and there is no effect of sintering densification, and high-density quality requirements cannot be achieved.

比較實施例三Comparative Example 3

在比較實施例三中,製備矽-鋁合金之步驟類似於以上實施例之步驟,其中差異在於,本比較實施例係使用熱均壓製程,先將霧化之矽-鋁合金粉末置放於不銹鋼罐中,將不銹鋼罐抽真空並以焊接方式將不銹鋼罐封罐。接著,將不銹鋼罐置放於熱均壓爐內,以大於矽-鋁合金之液相生成溫度之600℃(熱壓之壓力及時間與實施例相同)。此對比實 施例產生之矽-鋁合金之SEM背向散射影像如附件2,而其緻密性及組織之細緻程度記載於以下表一之中,其中燒結密度達99.9%,但是其平均矽/鋁界面數僅為75個/mm,小於上述之實施例之平均矽/鋁界面數,亦即對比實施例之組織之細緻程度較上述之實施例差。In Comparative Example 3, the steps of preparing the bismuth-aluminum alloy were similar to those of the above examples, with the difference that the comparative example used a hot homogenization process to first place the atomized bismuth-aluminum alloy powder on In the stainless steel tank, the stainless steel tank is evacuated and the stainless steel tank is sealed by welding. Next, the stainless steel can was placed in a heat equalizing furnace at a temperature greater than 600 ° C of the liquid phase formation temperature of the bismuth-aluminum alloy (the pressure and time of the hot pressing were the same as in the examples). This contrast The SEM backscatter image of the bismuth-aluminum alloy produced by the example is attached as Annex 2, and its compactness and fineness of the structure are described in Table 1 below, where the sintered density is 99.9%, but the average 矽/aluminum interface number It is only 75 pieces/mm, which is smaller than the average 矽/aluminum interface number of the above embodiment, that is, the degree of detail of the structure of the comparative example is inferior to that of the above embodiment.

比較實施例四Comparative Example 4

以傳統熔煉鑄造法製備矽-鋁合金,依照上述實施例中矽所佔之重量百分比70%調配純矽塊與純鋁塊。接著,將調配好之矽與鋁之原料放入感應熔煉爐中進行熔化,並於1600℃進行澆鑄。此對比實施例產生之矽-鋁合金之SEM背向散射影像如附件3,而其緻密性及組織之細緻程度記載於以下表一之中,其中燒結密度達99.5%,但是其平均矽/鋁界面數僅為17個/mm,遠小於上述之實施例之平均矽/鋁界面數,亦即對比實施例之組織之細緻程度較上述之實施例差。The niobium-aluminum alloy was prepared by a conventional smelting casting method, and the pure niobium block and the pure aluminum block were blended according to 70% by weight of the niobium in the above embodiment. Next, the prepared raw materials of aluminum and aluminum were placed in an induction melting furnace for melting, and casting was carried out at 1600 °C. The SEM backscatter image of the bismuth-aluminum alloy produced by this comparative example is shown in Annex 3, and the compactness and fineness of the structure are described in Table 1 below, wherein the sintered density is 99.5%, but the average 矽/aluminum The number of interfaces is only 17/mm, which is much smaller than the average 矽/aluminum interface number of the above embodiments, that is, the degree of detail of the tissue of the comparative example is inferior to that of the above embodiment.

雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範 圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. Fan The scope defined in the patent application scope is subject to the definition of patent application.

100‧‧‧矽基合金之製造方法100‧‧‧Manufacturing method of bismuth based alloy

102‧‧‧步驟102‧‧‧Steps

104‧‧‧熔煉步驟104‧‧‧Smelting steps

106‧‧‧霧化步驟106‧‧‧Atomization step

108‧‧‧熱壓步驟108‧‧‧ hot pressing step

為了能夠對本創作之觀點有較佳之理解,請參照上述之詳細說明並配合相應之圖式。要強調的是,根據工業之標準常規,附圖中之各種特徵並未依比例繪示。事實上,為清楚說明上述實施例,可任意地放大或縮小各種特徵之尺寸。相關圖式內容說明如下。In order to have a better understanding of the ideas of this creation, please refer to the above detailed description and the corresponding drawings. It is emphasized that, in accordance with the standard of the industry, the various features in the drawings are not to scale. In fact, the dimensions of the various features may be arbitrarily enlarged or reduced in order to clearly illustrate the above embodiments. The relevant schema description is as follows.

第1圖係繪示根據本發明之一實施例之矽基合金之製造方法的流程圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a flow chart showing a method of manufacturing a bismuth-based alloy according to an embodiment of the present invention.

100‧‧‧矽基合金之製造方法100‧‧‧Manufacturing method of bismuth based alloy

102‧‧‧步驟102‧‧‧Steps

104‧‧‧熔煉步驟104‧‧‧Smelting steps

106‧‧‧霧化步驟106‧‧‧Atomization step

108‧‧‧熱壓步驟108‧‧‧ hot pressing step

Claims (10)

一種矽基合金之製造方法,包含:提供一矽及一金屬之原料;進行一熔煉步驟,熔煉該矽及該金屬之原料,以形成一矽基合金湯液;進行一霧化步驟,霧化該矽基合金湯液,以形成一矽基合金粉末;以及進行一熱壓步驟,熱壓該矽基合金粉末,以形成該矽基合金,其中係在溫度為該矽基合金之液相生成溫度以下40℃至該矽基合金之液相生成溫度以下20℃,且壓力為150百萬帕斯卡至200百萬帕斯卡進行該熱壓步驟。 A method for manufacturing a bismuth-based alloy, comprising: providing a raw material of a bismuth and a metal; performing a smelting step, melting the bismuth and the raw material of the metal to form a bismuth-based alloy soup solution; performing an atomization step, atomizing The bismuth-based alloy soup solution to form a bismuth-based alloy powder; and performing a hot pressing step of hot pressing the bismuth-based alloy powder to form the bismuth-based alloy, wherein the temperature is the liquid phase formation of the bismuth-based alloy The hot pressing step is carried out at 40 ° C below the temperature to 20 ° C below the liquid phase formation temperature of the ruthenium based alloy and at a pressure of from 150 MPa to 200 MPa. 如請求項1所述之矽基合金之製造方法,其中該熱壓步驟持續之時間為1小時至3小時。 The method for producing a ruthenium-based alloy according to claim 1, wherein the hot pressing step lasts for 1 hour to 3 hours. 如請求項2所述之矽基合金之製造方法,其中該矽基合金之實際密度大於或等於該矽基合金之理論密度的99.5%,且在該矽基合金中,每1微米之範圍內,該矽與該金屬之界面數大於或等於100個。 The method for producing a ruthenium-based alloy according to claim 2, wherein the actual density of the ruthenium-based alloy is greater than or equal to 99.5% of the theoretical density of the ruthenium-based alloy, and in the range of 1 micrometer in the ruthenium-based alloy The number of interfaces between the crucible and the metal is greater than or equal to 100. 如請求項1所述之矽基合金之製造方法,其中該金屬係選自於由鋁、銀、金、錫、鋅或上述材料之矽基合金所組成之一群組。 The method for producing a ruthenium-based alloy according to claim 1, wherein the metal is selected from the group consisting of aluminum, silver, gold, tin, zinc or a ruthenium-based alloy of the above materials. 如請求項1所述之矽基合金之製造方法,其中進行該霧化步驟更包含進行一噴擊步驟,以一氣體噴擊該矽基合金湯液。 The method for producing a ruthenium-based alloy according to claim 1, wherein the atomizing step further comprises performing a spraying step of spraying the bismuth-based alloy soup with a gas. 如請求項5所述之矽基合金之製造方法,其中該氣體係一惰性氣體,該惰性氣體為氮氣或氬氣。 The method for producing a ruthenium-based alloy according to claim 5, wherein the gas system is an inert gas, and the inert gas is nitrogen or argon. 如請求項5所述之矽基合金之製造方法,其中進行該噴擊步驟時,該氣體之壓力為1百萬帕斯卡至5百萬帕斯卡,且該氣體之速度為50公尺/秒至100公尺/秒。 The method for producing a ruthenium-based alloy according to claim 5, wherein the gas is subjected to a pressure of 1 MPa to 5 MPa, and the gas is at a speed of 50 MPa to 100 MPa. Metrics per second. 如請求項1所述之矽基合金之製造方法,其中該矽所佔之重量百分比為50%至90%。 The method for producing a niobium-based alloy according to claim 1, wherein the niobium accounts for 50% to 90% by weight. 如請求項1所述之矽基合金之製造方法,其中係在溫度1500℃至1700℃進行該熔煉步驟。 The method for producing a ruthenium-based alloy according to claim 1, wherein the smelting step is carried out at a temperature of 1500 ° C to 1700 ° C. 一種矽基合金,實質上由一矽及一金屬所組成,其中該矽所佔之重量百分比為50%至90%,該矽基合金之實際密度大於或等於該矽基合金之理論密度的99.5%,且在該矽基合金中,每1微米之範圍內,該矽與該金屬之界面數大於或等於100個,該金屬係選自於由鋁、銀、金、錫、鋅或上述材料之矽基合金所組成之一群組。 A bismuth-based alloy consisting essentially of a bismuth and a metal, wherein the bismuth is 50% to 90% by weight, and the actual density of the bismuth-based alloy is greater than or equal to 99.5 of the theoretical density of the bismuth-based alloy. %, and in the bismuth-based alloy, the number of interfaces of the ruthenium to the metal is greater than or equal to 100 per 1 micrometer, and the metal is selected from the group consisting of aluminum, silver, gold, tin, zinc or the above materials. A group of bismuth based alloys.
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