TWI423390B - The method of making microperforated structure by three-dimensional silicon perforation technique (TSV) and its microperforated structure for micro-nozzle, step-up structure and filter sheet - Google Patents

Description

Method for fabricating a micro-perforated structure by three-dimensional perforation technology (TSV) and use of the microperforated structure thereof for micro nozzles, boosting structures and filter sheets

The present invention relates to a method for fabricating a microperforated structure by a three-dimensional perforation technique (TSV) and a microperforated structure made thereof for use in a micro nozzle, a boosting structure and a filter sheet, in particular, by TSV technology The tantalum substrate is formed into a microperforated structure having a plurality of microperforations for use in a micro nozzle, a boosting structure or a filter sheet.

The Republic of China Patent No. I282325 "Manufacturing Method of Precision Plastic Array Micro-Perforated Sheet" to produce an upper mold and a lower mold, respectively, which are made by the following steps: 1. Preparation steps, 2. X a light exposure step, 3. a mask removal step, 4. an electroforming step, and a step of removing the intermediate layer, whereby the above-mentioned molds having the predetermined convex portion or the concave portion and the lower mold are respectively combined to form a mold The group is then used for injection by a plastic injection machine to produce a precision plastic array micro-perforated sheet that can be applied to inkjet printers, biochip reagents or fuel cell rectifying pores or related nanotechnology. , which can make the pores have a special geometric shape, and the convex portions and the concave portions can be accurately engaged with each other, thereby greatly reducing the procedure and time for repairing or correcting, but the disadvantages thereof are Yu: The micro-perforation aperture is too large: it is mainly applied to nozzle sheets on inkjet printers. The micro-perforation diameter is 100 micrometers, and the adjacent micro-perforations are 100 to 200 micrometers apart, which results in poor precision and cannot be applied. Applications such as micro-nozzles or booster structures with smaller apertures are required, and the excessive aperture also results in their inability to be applied to filter sheets.

Thus, in order to be able to form micro-perforations with smaller apertures, the present invention provides a method for fabricating micro-perforated structures by three-dimensional perforation technology (TSV), the steps are as follows:

A. Forming a plurality of microwell grooves on a substrate.

B. Applying a metal strengthening layer to the inner walls of the microporous grooves.

C. The ruthenium substrate is thinned, and a micro-perforation is formed at each of the micro-holes, and the micro-perforations respectively have a first opening and a second opening, so that the 矽 substrate becomes a micro-perforation structure.

In the above step A, the micropore grooves are formed by a laser through hole or an etched through hole.

In the above step B, the coating method of the metal strengthening layer is one of chemical vapor deposition or electroplating.

In the above step B, the metal material of the metal strengthening layer is one of copper or tungsten.

In the above step C, the thinning treatment of the tantalum substrate is one of grinding, chemical mechanical polishing or plasma etching.

The inner diameter of the first opening is greater than the inner diameter of the second openings.

The depth of the above microperforations is less than 20 microns.

The central axis distance of the adjacent microperforations is less than 6 microns.

The present invention further provides a micro-perforation structure prepared by the method for fabricating a micro-perforated structure by a three-dimensional boring technique (TSV) for use in a micro-nozzle, wherein the inner diameter of the first opening of the micro-perforation is larger than that in the second opening The diameter is such that a fluid flows in from the second opening of the microperforation and flows out of the first opening for use as a micro-nozzle.

The present invention further provides a use of the microperforation structure prepared by the method for fabricating a microperforated structure by a three-dimensional perforation technique (TSV) for a boosting structure, wherein the first opening of the microperforation has an inner diameter larger than the second opening. The inner diameter causes a fluid to flow from the first opening of the microperforation and flow out of the second opening for use as a boosting structure.

The present invention further provides a use of the microperforated structure prepared by the method for fabricating a microperforated structure by a three-dimensional perforation technique (TSV) for filtering a sheet for filtering impurities having a particle diameter of more than 3 μm.

Further, the aforementioned microperforated structure used as a filter sheet can be combined with an activated carbon.

The invention has the following advantages:

1. 矽 Wafer Reuse: The present invention can use Reclaim Wafer as a ruthenium substrate, and does not require any CMP (Chemical Mechanical Polishing) treatment for the regenerated ruthenium wafer, or can also use a slab ( Dummy wafer) uses the wafer as a germanium substrate to make the germanium wafer recyclable.

2. Making high-density micro-perforation arrays: The present invention can easily obtain micro-scale micro-perforations by using three-dimensional perforation technology (TSV), and according to the technology of ITRS Roadmap 2008, 2009, the thinning of germanium wafers can be achieved. Below 20 microns, and the distance between the central axes of adjacent microperforations may be less than 6 microns, that is, the inner diameters of the first openings and the second openings of the microperforations may be within 3 microns, so that the microperforation structure can be thinned. And has an array of high density microperforations.

3. Use as a micro-nozzle or booster structure: When the micro-perforation is formed by the TSV technology, the accuracy of the depth of the inner wall of the micro-perforation is lower, so the first opening of the micro-perforation can be larger than the second opening. It can reduce production costs and can be used as a micro-nozzle or booster structure by changing the direction of fluid inflow.

4. Used as a filter sheet: the first opening and the second opening of the microperforation of the present invention can have an inner diameter of less than 3 microns, so that it can also be used as a filter sheet, and is used for filtering fine dust particles having a large particle size in general air. Or impurities such as mold, can be used as the first filtration program of the filter device, and can be used with filter elements such as activated carbon with smaller perforation to increase the filtration effect, and reduce the activated carbon filter element by filtering out large particle impurities in advance. Loss due to blockage.

(1) ‧ ‧ 矽 substrate

(11)‧‧‧Microwell

(1a)‧‧‧Microperforated structure

(11a)‧‧‧Microperforation

(111a) ‧ ‧ first opening

(112a) ‧ ‧ second opening

(2) ‧‧‧ metal strengthening layer

(A) ‧ ‧ impurities

(B) ‧‧‧Micro-substances

The first figure is a schematic diagram of the steps of the present invention.

The second figure is a schematic diagram of the operation flow of the present invention.

The third figure is a schematic view of the use of the invention as a micro nozzle.

The fourth figure is a schematic diagram of the use of the present invention as a boosting structure.

The fifth drawing is a schematic view of the use of the invention as a filter sheet.

Annex I is a comparison table for various particle sizes.

First, referring to the first figure and the second figure, the present invention is a method for fabricating a micro-perforated structure by a three-dimensional boring and perforating technique (TSV) and a micro-perforated structure made thereof for a micro nozzle and a boosting structure. And the use of the filter sheet, the steps are as follows:

A. forming a plurality of micro-holes (11) on a substrate (1), and according to the required aspect ratio of the micro-holes (11), it can be achieved by using a laser through hole or an etched through hole. The ruthenium substrate (1) can use the etched ruthenium wafer after the initial epitaxy, that is, the initial ruthenium wafer of the unprocessed subsequent process, or the Reclaim Wafer can also be used. As the germanium substrate (1), it is not necessary to perform any CMP (Chemical Mechanical Polishing) treatment on the recycled germanium wafer, and a germanium wafer used as a dummy wafer can also be used as the germanium substrate (1). The source of the wafer allows the wafer to be fully recycled.

B. coating a metal strengthening layer (2) on the inner walls of the microporous grooves (11), and the metal strengthening layer (2) may be coated by chemical vapor deposition or electroplating. One.

C. The ruthenium substrate (1) is thinned, and a micro-perforation (11a) is formed at the positions of the micro-holes (11), and the micro-perforations (11a) respectively have a first opening ( 111a) and the second opening (112a), the germanium substrate (1) is a micro-perforated structure (1a), and the thinning treatment of the germanium substrate (1) is grinding, chemical mechanical polishing or plasma etching. one.

In addition, according to ITRS Roadmap 2008, the technology of 2009 can make the thinning of germanium wafers to be less than 20 micrometers. Therefore, when the micro-perforated structure (1a) is formed by using a germanium wafer as the germanium substrate (1), The micro-perforations (11a) may have a depth of less than 20 micrometers, and the central axes of the micro-perforations (11a) may have a distance of less than 6 micrometers, that is, the first openings (111a) and the second openings of the micro-perforations (11a) ( The inner diameter of 112a) can be within 3 microns, so an array of high density microperforations (11a) can be formed on the microperforated structure (1a).

Referring to the third and fourth figures, the inner diameter of the first opening (111a) of the micro-perforations (11a) is required because the accuracy of the inner wall angle of the micro-perforations (11a) is low. It may be larger than the inner diameter of the second opening (112a), when the fluid flows in from the second opening (112a) of the micro-perforations (11a) and flows out from the first opening (111a), according to the flow principle of the fluid in the diverging tube , may have the effect of a micro-nozzle [please refer to the third figure], when the fluid flows in from the first opening (111a) of the micro-perforations (11a) and flows out from the second opening (112a), according to the fluid in the tapering The flow principle inside the tube can have the effect of the boost structure [see the fourth picture], and When the fluid flows into the micro-perforation (11a) of the micro-perforated structure (1a), the inner wall of the micro-perforation (11a) is pressed, so in the above step B, the metal material of the metal-reinforced layer (2) can be The use of one of copper or tungsten, or other alloys which can subject the inner walls of the microperforations (11a) to higher stresses, allows the inner walls of the microperforations (11a) to withstand higher pressures of the fluid.

Please refer to the fifth figure. Since the size of fine dust particles such as mold or dust in the air is about several tens of micrometers or even more than 100 micrometers [see Annex I], the micro-perforated structure (1a) can also be used. Filtering the flakes to filter out impurities (A) having a particle diameter of more than 3 μm, and only the micro-substrate (B) having a particle diameter of less than 3 μm can pass through the microperforations (11a) of the micro-perforated structure (1a). At the same time, it can be used with a filter element such as activated carbon having a smaller perforation to increase the filtration effect, and also reduce the loss of the activated carbon filter element due to clogging because the large particle impurity (A) is filtered out in advance.

Claims (12)

A method for fabricating a micro-perforated structure by using a three-dimensional perforation technique (TSV) is as follows: A. forming a plurality of micro-hole grooves on a substrate; B. coating a metal reinforcement on the inner walls of the micro-hole grooves a layer of micro-perforations, wherein the micro-perforations respectively have a first opening and a second opening, so that the germanium substrate becomes a A microperforated structure is a micro-nozzle, a boosting structure or a filter sheet. The method for fabricating a micro-perforated structure by using a three-dimensional boring and perforating technique (TSV) according to the first aspect of the patent application, wherein in the step A, the micro-hole grooves are formed by a laser through hole or a etched through hole. The method for fabricating a micro-perforated structure by using a three-dimensional boring and perforating technique (TSV) according to the first aspect of the patent application, wherein in the step B, the metal strengthening layer is coated by a chemical vapor deposition method or a plating method. one. The method for fabricating a micro-perforated structure by a three-dimensional boring and perforating technique (TSV) according to the first aspect of the invention, wherein in the step B, the metal material of the metal reinforced layer is one of copper or tungsten. The method for fabricating a micro-perforated structure by using a three-dimensional boring and perforating technique (TSV) as described in claim 1, wherein in the step C, the thinning treatment of the ruthenium substrate is grinding, chemical mechanical polishing or plasma etching. one. As described in the first paragraph of the patent application, it is made by three-dimensional perforation technology (TSV). The method of micro-perforating structure, wherein the inner diameters of the first openings are larger than the inner diameters of the second openings. A method of fabricating a microperforated structure by a three-dimensional perforation technique (TSV) as described in claim 1, wherein the microperforations have a depth of less than 20 microns. A method of fabricating a microperforated structure by a three-dimensional perforation technique (TSV) as described in claim 1, wherein the adjacent microperforations have a central axis distance of less than 6 micrometers. A microperforation structure prepared by a method of fabricating a microperforated structure by a three-dimensional perforation technique (TSV) according to claim 1 of the patent application, wherein the first opening of the microperforation has an inner diameter larger than that of the first The inner diameter of the opening is such that a fluid flows in from the second opening of the microperforation and flows out of the first opening for use as a micro nozzle. A microperforation structure made by a method of fabricating a microperforated structure by a three-dimensional perforation technique (TSV) according to claim 1 of the patent application, wherein the first opening of the microperforation has an inner diameter greater than The inner diameter of the second opening allows a fluid to flow from the first opening of the microperforation and flow out through the second opening for use as a boosting structure. A microperforation structure prepared by a method of manufacturing a microperforated structure by a three-dimensional perforation technique (TSV) according to the first aspect of the patent application as a filter sheet for filtering impurities having a particle diameter of more than 3 micrometers or more . The microperforated structure prepared by the method of fabricating a microperforated structure by a three-dimensional perforation technique (TSV) is used as a filter sheet as described in claim 11, and the microperforated structure is further bonded to an activated carbon.