TWI420692B - - Google Patents
Info
- Publication number
- TWI420692B TWI420692B TW096144841A TW96144841A TWI420692B TW I420692 B TWI420692 B TW I420692B TW 096144841 A TW096144841 A TW 096144841A TW 96144841 A TW96144841 A TW 96144841A TW I420692 B TWI420692 B TW I420692B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096144841A TW200924232A (en) | 2007-11-26 | 2007-11-26 | Light emitting diode capable of radiating light and dissipating heat in dual directions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096144841A TW200924232A (en) | 2007-11-26 | 2007-11-26 | Light emitting diode capable of radiating light and dissipating heat in dual directions |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200924232A TW200924232A (en) | 2009-06-01 |
TWI420692B true TWI420692B (zh) | 2013-12-21 |
Family
ID=44728930
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096144841A TW200924232A (en) | 2007-11-26 | 2007-11-26 | Light emitting diode capable of radiating light and dissipating heat in dual directions |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200924232A (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201350736A (zh) * | 2012-06-06 | 2013-12-16 | Kabo Tool Co | 雙向發光器件 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW550830B (en) * | 2002-05-02 | 2003-09-01 | Josuke Nakata | Panel for receiving or emitting light and its manufacturing method |
TWM281249U (en) * | 2004-11-29 | 2005-11-21 | Ren-Nan Luo | Lamp box structure |
TW200633261A (en) * | 2004-10-29 | 2006-09-16 | Ledengin Inc | LED package with structure and materials for high heat dissipation |
US20070241661A1 (en) * | 2006-04-12 | 2007-10-18 | Yin Chua B | High light output lamps having a phosphor embedded glass/ceramic layer |
US20070269915A1 (en) * | 2006-05-16 | 2007-11-22 | Ak Wing Leong | LED devices incorporating moisture-resistant seals and having ceramic substrates |
-
2007
- 2007-11-26 TW TW096144841A patent/TW200924232A/zh not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW550830B (en) * | 2002-05-02 | 2003-09-01 | Josuke Nakata | Panel for receiving or emitting light and its manufacturing method |
TW200633261A (en) * | 2004-10-29 | 2006-09-16 | Ledengin Inc | LED package with structure and materials for high heat dissipation |
TWM281249U (en) * | 2004-11-29 | 2005-11-21 | Ren-Nan Luo | Lamp box structure |
US20070241661A1 (en) * | 2006-04-12 | 2007-10-18 | Yin Chua B | High light output lamps having a phosphor embedded glass/ceramic layer |
US20070269915A1 (en) * | 2006-05-16 | 2007-11-22 | Ak Wing Leong | LED devices incorporating moisture-resistant seals and having ceramic substrates |
Also Published As
Publication number | Publication date |
---|---|
TW200924232A (en) | 2009-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |