TWI420368B - The Method and Structure of Touchpad Electrode - Google Patents

The Method and Structure of Touchpad Electrode Download PDF

Info

Publication number
TWI420368B
TWI420368B TW99141322A TW99141322A TWI420368B TW I420368 B TWI420368 B TW I420368B TW 99141322 A TW99141322 A TW 99141322A TW 99141322 A TW99141322 A TW 99141322A TW I420368 B TWI420368 B TW I420368B
Authority
TW
Taiwan
Prior art keywords
layer
substrate
conductive layer
pattern
photoresist
Prior art date
Application number
TW99141322A
Other languages
Chinese (zh)
Other versions
TW201222351A (en
Inventor
li li Fan
Original Assignee
li li Fan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by li li Fan filed Critical li li Fan
Priority to TW99141322A priority Critical patent/TWI420368B/en
Publication of TW201222351A publication Critical patent/TW201222351A/en
Application granted granted Critical
Publication of TWI420368B publication Critical patent/TWI420368B/en

Links

Landscapes

  • Position Input By Displaying (AREA)

Description

觸控板電極佈設方法及其結構Touch plate electrode layout method and structure thereof

本發明係關於一種觸控板電極佈設方法及其結構,特別是具有橋接式溝槽的電極,且藉由最小的製程結構來達到具有相同功效的方法與結構。The present invention relates to a touch panel electrode routing method and structure thereof, particularly an electrode having a bridged trench, and achieves the same efficiency of the method and structure by a minimum process structure.

習知技術在觸控面板的製程中,係於基板上形成兩個不同軸向的電極,並且在其中之一軸向的電極上再次形成絕緣層,用以提供另一軸向的電極透過該絕緣層上所設置的金屬導線進行電連接。然而,傳統上由於設置於絕緣層上的金屬導線可能因為後續的製程而造成該金屬導線的損壞,使得無法導通,進而造成觸控面板製作良率的下降。In the process of the touch panel, the two electrodes are formed on the substrate by two different axial directions, and an insulating layer is formed on one of the axial electrodes to provide another axial electrode. The metal wires provided on the insulating layer are electrically connected. However, conventionally, the metal wire disposed on the insulating layer may cause damage to the metal wire due to subsequent processes, so that the metal wire may not be turned on, thereby causing a decrease in the yield of the touch panel.

故於一些技術中,可再藉由橋接式溝槽的技術將該金屬導線設置於該橋接式溝槽中,可避免該金屬導線遭到損壞。故有必要提供一種新的結構,用以有效率地提升該觸控面板的良率。Therefore, in some technologies, the metal wire can be placed in the bridge groove by the technique of the bridge groove to prevent the metal wire from being damaged. Therefore, it is necessary to provide a new structure for efficiently improving the yield of the touch panel.

本發明的目的係提供一種觸控板電極佈設方法,係具有橋接式溝槽的電極,可用以達到以最小的製程達成相同功效之目的。The object of the present invention is to provide a method for routing a touch panel electrode, which is an electrode having a bridged trench, which can be used to achieve the same effect with a minimum process.

本發明的另一目的係提供一種觸控板電極結構,係藉由減少傳統製程結構,其仍可達到相同觸控功效之目的。Another object of the present invention is to provide a touch panel electrode structure that can achieve the same touch effect by reducing the conventional process structure.

為達上述目的及其它目的,本發明提供一種觸控板電極佈設方法,其方法步驟包含:提供基板;形成第一透明導電層於該基板之一側,且該第一透明導電層具有複數圖樣區塊彼此相鄰設置;形成配向膜層於該基板之一側;形成導電層於該基板之一側,且該導電層具有複數電導線,用以連接該等圖樣區塊之至少其一;以及形成保護層於該導電層上,用以保護該導電層。To achieve the above and other objects, the present invention provides a touch panel electrode routing method, the method comprising the steps of: providing a substrate; forming a first transparent conductive layer on one side of the substrate, and the first transparent conductive layer has a plurality of patterns The blocks are disposed adjacent to each other; the alignment film layer is formed on one side of the substrate; the conductive layer is formed on one side of the substrate, and the conductive layer has a plurality of electrical wires for connecting at least one of the pattern blocks; And forming a protective layer on the conductive layer to protect the conductive layer.

為達上述目的及其它目的,本發明係提供一種觸控板電極結構,其包含:基板層、配向膜層、第一透明導電層、導電層與保護層。其中,該配向膜層係設置於該基板層之一側;該第一透明導電層係設置於該配向膜層之一側,且該第一透明導電層具有複數圖樣區塊彼此相鄰設置;該導電層係鄰接設置於該配向膜層之另一側;以及該保護層係設置於該導電層上。To achieve the above and other objects, the present invention provides a touch panel electrode structure comprising: a substrate layer, an alignment film layer, a first transparent conductive layer, a conductive layer and a protective layer. Wherein the alignment film layer is disposed on one side of the substrate layer; the first transparent conductive layer is disposed on one side of the alignment film layer, and the first transparent conductive layer has a plurality of pattern blocks disposed adjacent to each other; The conductive layer is disposed adjacent to the other side of the alignment film layer; and the protective layer is disposed on the conductive layer.

與習知技術相較,本發明的觸控板電極佈設方法及其結構,係僅利用單一的導電層與保護層並配合基板層、第一透明導電層與配向膜層。此外,亦可於該基板層之另一側,於形成該第一透明導電的同時,一併形成不具有圖樣區塊的第二透明導電層,用以在該基板層之另一側形成保護層;以及,形成外框導線層於該基板與該保護層之間。故利用本發明簡化的製程仍可具有傳統習知觸控板的功效,除可有效地降低製作成本,亦可有效地防止靜電效應與增加其電容量及靈敏度。Compared with the prior art, the touch panel electrode routing method and the structure thereof of the present invention utilize only a single conductive layer and a protective layer and cooperate with the substrate layer, the first transparent conductive layer and the alignment film layer. In addition, a second transparent conductive layer having no pattern block may be formed on the other side of the substrate layer while forming the first transparent conductive layer for forming protection on the other side of the substrate layer. And forming an outer frame wire layer between the substrate and the protective layer. Therefore, the simplified process of the present invention can still have the functions of the conventional conventional touch panel, in addition to effectively reducing the manufacturing cost, and effectively preventing the electrostatic effect and increasing its capacitance and sensitivity.

為充分瞭解本發明的目的、特徵及功效,茲藉由下述具體實施例,並配合所附圖式,對本發明做一詳細說明,說明如後:參考第1至4圖,係本發明實施例觸控板電極佈設方法的流程示意圖。於第1圖中,觸控板電極結構佈設方法的步驟起始於步驟S1,係提供基板;接著步驟S2,係形成第一透明導電層於該基板之一側,且該第一透明導電層具有複數圖樣區塊彼此相鄰設置;又接著步驟S3,係形成配向膜層於該基板之一側;再接著步驟S4,係形成導電層於該基板之一側,且該導電層具有複數電導線,用以連接該等圖樣區塊之至少其一;以及,接著步驟S5,係形成保護層於該導電層上,用以保護該導電層。In order to fully understand the objects, features and advantages of the present invention, the present invention will be described in detail with reference to the accompanying drawings. A schematic flow chart of a method for laying a touch panel electrode. In the first embodiment, the step of the electrode structure of the touch panel is started in step S1 to provide a substrate; then, in step S2, a first transparent conductive layer is formed on one side of the substrate, and the first transparent conductive layer is formed. The plurality of pattern blocks are disposed adjacent to each other; and then step S3 is performed to form an alignment film layer on one side of the substrate; then, in step S4, a conductive layer is formed on one side of the substrate, and the conductive layer has a plurality of electricity a wire for connecting at least one of the pattern blocks; and, in step S5, forming a protective layer on the conductive layer to protect the conductive layer.

其中,於另一實施例中,該導電層的該等電導線係藉由光學補償式光罩,配合過度曝光或過度顯影的至少其一所形成。再者,上述的佈設方法中,更包含形成外框導線層於該基板與該保護層之間;同時地形成第二透明導電層於該基板之另一側,其中該第二透明導電層不具有圖樣區塊且用以遮蔽該基板;以及,形成複數橋接式溝槽於該配向膜層,用以橫跨在該等圖樣區塊之間,而該等電導線分別對應設置於該等橋接式溝槽上。In another embodiment, the electrically conductive wires of the conductive layer are formed by at least one of overexposure or overexposure by an optically compensated reticle. Furthermore, the above-mentioned routing method further includes forming an outer frame wire layer between the substrate and the protective layer; and simultaneously forming a second transparent conductive layer on the other side of the substrate, wherein the second transparent conductive layer is not Having a pattern block for shielding the substrate; and forming a plurality of bridged trenches in the alignment film layer for spanning between the pattern blocks, wherein the respective electrical wires are respectively disposed on the bridges On the groove.

再者,第2圖係上述步驟S3的更詳細的步驟,其該配向膜層形成的步驟進一步包含,起始於步驟S3-1,係塗覆光阻於該基板上;接著步驟S3-2,係提供具有圖樣的光罩或具有半色調網點(Half tone)圖樣的光罩,並且藉由該光罩用以將該圖樣或該半色調網點圖樣曝光於該光阻上;接著步驟S3-3,係顯影該圖樣或該半色調網點圖樣於該光阻上,用以形成具有橫跨在該等圖樣區塊之間的該等橋接式溝槽;以及,接著步驟S3-4,烘烤該光阻。Furthermore, FIG. 2 is a more detailed step of the above step S3, wherein the step of forming the alignment film layer further comprises: starting with step S3-1, applying a photoresist to the substrate; and then following step S3-2 Providing a mask having a pattern or a mask having a halftone dot pattern, and the mask is used to expose the pattern or the halftone dot pattern to the photoresist; and then step S3- 3, developing the pattern or the halftone dot pattern on the photoresist to form the bridged trenches spanning between the pattern blocks; and, following step S3-4, baking The photoresist.

值得注意的是,上述具有該半色調網點圖樣的該光罩的形成步驟包含:提供於該光罩的表面的不透光區域的線徑大於該半色調網點圖樣的線徑或形成複數孔洞(例如該等孔洞可為圓形、矩形或任意形狀),且平均地設置於該光罩的表面,以及經由曝光時光線對於該半色調網點圖樣所造成的干涉與繞射作用,使得該橋接式溝槽的光阻在顯影後該橋接式溝槽低於該橋接絕緣單元的高度。It is noted that the step of forming the reticle having the halftone dot pattern includes: a wire diameter of the opaque region provided on the surface of the reticle is larger than a wire diameter of the halftone dot pattern or forming a plurality of holes ( For example, the holes may be circular, rectangular or of any shape, and are disposed evenly on the surface of the reticle, and the interference and diffraction caused by the light during exposure to the halftone dot pattern, so that the bridge type The photoresist of the trench is lower than the height of the bridge insulating unit after development.

第3圖係上述步驟S4的詳細步驟,其該導電層形成的步驟進一步包含,起始於步驟S4-1,濺鍍導電材料於該基板上;接著步驟S4-2,塗覆光阻於該基板上;再接著步驟S4-3,提供具有該光學補償式光罩,且透過該光學補償式光罩將對應該等電導線之電導線圖樣過度曝光於該光阻上;而接著步驟S4-4,顯影該電導線圖樣,用以形成具有彼此相鄰的該等圖樣區塊,且該電導線圖樣係利用過度曝光與過度顯影而產生。Figure 3 is a detailed step of the above step S4, the step of forming the conductive layer further comprises: starting at step S4-1, sputtering a conductive material on the substrate; and then step S4-2, applying a photoresist to the And then, in step S4-3, providing the optical compensation type reticle, and over-exposing the electric wire pattern corresponding to the isoelectric wire to the photoresist through the optical compensation reticle; and then following step S4 4. Developing the electrical lead pattern to form the pattern blocks having adjacent one another, and the electrical lead pattern is produced by overexposure and overexposure.

第4圖係上述步驟S5的詳細步驟,其進一步包含起始於步驟S5-1,塗覆光阻、濺鍍光阻或有機物的至少其一於該基板上;接著步驟S5-2,烘烤該光阻或該有機物,以形成硬式保護膜。Figure 4 is a detailed step of the above step S5, further comprising starting at step S5-1, coating at least one of a photoresist, a sputter photoresist or an organic substance on the substrate; and then baking in step S5-2 The photoresist or the organic substance forms a hard protective film.

參考第5圖,係本發明實施例觸控板電極結構的垂直剖面示意圖。於本實施例中,觸控板電極結構係用於觸控板,其包含基板層SL、第一透明導電層FECL、配向膜層PIL、導電層CL與保護層PL。該配向膜層PIL係設置於該基板層SL之一側。該第一透明導電層FECL,係設置於該配向膜層PIL之一側,且該第一透明導電層FECL具有複數圖樣區塊彼此相鄰設置。該導電層CL,係鄰接設置於該配向膜層PIL之另一側;以及該保護層PL係設置於該導電層CL上。Referring to FIG. 5, it is a schematic vertical cross-sectional view of an electrode structure of a touch panel according to an embodiment of the present invention. In this embodiment, the touch panel electrode structure is used for a touch panel, and includes a substrate layer SL, a first transparent conductive layer FECL, an alignment film layer PIL, a conductive layer CL, and a protective layer PL. The alignment film layer PIL is provided on one side of the substrate layer SL. The first transparent conductive layer FECL is disposed on one side of the alignment film layer PIL, and the first transparent conductive layer FECL has a plurality of pattern blocks disposed adjacent to each other. The conductive layer CL is disposed adjacent to the other side of the alignment film layer PIL; and the protective layer PL is disposed on the conductive layer CL.

再者,一併參考第6圖,觸控板電極結構更包含外框導線層ML於該基板SL與該保護層PL之間;以及,更包含第二透明導電層SECL,係同時設置於該基板層SL之另一側,且該第二透明導電層SECL不具有圖樣區塊。其中,該基板層SL、第一透明導電層FECL、配向膜層PIL、導電層CL與該第二透明導電層SECL的結構示意圖如第7圖所示。Furthermore, referring to FIG. 6, the touch panel electrode structure further includes an outer frame wire layer ML between the substrate SL and the protective layer PL; and, further comprising a second transparent conductive layer SECL, which is simultaneously disposed on the The other side of the substrate layer SL, and the second transparent conductive layer SECL does not have a pattern block. The structural schematic diagram of the substrate layer SL, the first transparent conductive layer FECL, the alignment film layer PIL, the conductive layer CL, and the second transparent conductive layer SECL is as shown in FIG. 7 .

然而,值得注意的是,第5圖與第6圖係僅用於舉例說明。換言之,本發明之簡化的該結構所主張的範圍亦包含只要可以達到與傳統觸控之相同功效所進行重新排列局部各層的實施例。However, it is worth noting that Figures 5 and 6 are for illustrative purposes only. In other words, the scope of the simplified structure of the present invention also encompasses embodiments in which the partial layers are rearranged as long as the same effects as conventional touches can be achieved.

與習知技術相較,本發明的觸控板電極佈設方法及其結構,係僅利用單一的導電層與保護層並配合基板層、第一透明導電層與配向膜層。此外,亦可於該基板層之另一側,於形成該第一透明導電的同時,一併形成不具有圖樣區塊的第二透明導電層,用以在該基板層之另一側形成保護層;以及,形成外框導線層於該基板與該保護層之間。故利用本發明之簡化的製程仍可具有傳統習知觸控板的功效,除可有效地降低製作成本,亦可有效地防止靜電效應與增加其電容量及靈敏度。Compared with the prior art, the touch panel electrode routing method and the structure thereof of the present invention utilize only a single conductive layer and a protective layer and cooperate with the substrate layer, the first transparent conductive layer and the alignment film layer. In addition, a second transparent conductive layer having no pattern block may be formed on the other side of the substrate layer while forming the first transparent conductive layer for forming protection on the other side of the substrate layer. And forming an outer frame wire layer between the substrate and the protective layer. Therefore, the simplified process using the present invention can still have the functions of the conventional conventional touch panel, in addition to effectively reducing the manufacturing cost, and effectively preventing the electrostatic effect and increasing its capacitance and sensitivity.

本發明在上文中已以較佳實施例揭露,然熟習本項技術者應理解的是,該實施例僅用於描繪本發明,而不應解讀為限制本發明的範圍。應注意的是,舉凡與該實施例等效的變化與置換,均應設為涵蓋於本發明的範疇內。因此,本發明的保護範圍當以下文的申請專利範圍所界定者為準。The invention has been described above in terms of the preferred embodiments, and it should be understood by those skilled in the art that the present invention is not intended to limit the scope of the invention. It should be noted that variations and permutations equivalent to those of the embodiments are intended to be within the scope of the present invention. Therefore, the scope of the invention is defined by the scope of the following claims.

PL...保護層PL. . . The protective layer

FECL...第一透明導電層FECL. . . First transparent conductive layer

SECL...第二透明導電層SECL. . . Second transparent conductive layer

SL...基板層SL. . . Substrate layer

PIL...配向膜層PIL. . . Alignment layer

CL...導電層CL. . . Conductive layer

ML...外框導電層ML. . . Outer frame conductive layer

第1至4圖係觸控板電極佈設方法的流程示意圖;1 to 4 are schematic flow diagrams of a method for laying a touch panel electrode;

第5圖與第6圖係觸控板電極結構的垂直剖面示意圖;以及5 and 6 are vertical cross-sectional views of the electrode structure of the touch panel;

第7圖係觸控板電極結構的俯視圖。Figure 7 is a top view of the electrode structure of the touch panel.

S1~S5...方法步驟S1~S5. . . Method step

Claims (9)

一種觸控板電極佈設方法,其包含:提供一基板;形成一第一透明導電層於該基板之一側,且該第一透明導電層具有複數圖樣區塊彼此相鄰設置,而該等圖樣區塊彼此之間不連接;形成一配向膜層於該基板之一側,該配向膜層由複數橋接式溝槽所組成,該等橋接式溝槽橫跨在該等圖樣區塊之間,讓該等圖樣區塊彼此之間藉由該等橋接式溝槽連接;形成一導電層於該基板之一側,以及該配向膜層的下方,且該導電層具有複數電導線,用以連接該等圖樣區塊之至少其一;形成一保護層於該導電層的上方,用以保護該導電層;以及形成一外框導線層於該基板與該保護層之間。 A touch panel electrode routing method includes: providing a substrate; forming a first transparent conductive layer on one side of the substrate, and the first transparent conductive layer has a plurality of pattern blocks adjacent to each other, and the patterns are The blocks are not connected to each other; an alignment film layer is formed on one side of the substrate, the alignment film layer is composed of a plurality of bridged trenches, and the bridged trenches are spanned between the pattern blocks, Having the pattern blocks connected to each other by the bridged trenches; forming a conductive layer on one side of the substrate and below the alignment film layer, and the conductive layer has a plurality of electrical wires for connecting At least one of the pattern blocks; a protective layer over the conductive layer for protecting the conductive layer; and an outer frame wire layer formed between the substrate and the protective layer. 如申請專利範圍第1項所述的佈設方法,更包含同時地形成一第二透明導電層於該基板之另一側,其中該第二透明導電層不具有圖樣區塊且用以遮蔽該基板。 The arranging method of claim 1, further comprising simultaneously forming a second transparent conductive layer on the other side of the substrate, wherein the second transparent conductive layer does not have a pattern block and is used for shielding the substrate . 如申請專利範圍第1項所述的佈設方法,其中該等電導線分別對應設置於該等橋接式溝槽上。 The arranging method of claim 1, wherein the electric wires are respectively disposed on the bridge grooves. 如申請專利範圍第1項所述的佈設方法,其中該導電層 的該等電導線係藉由光學補償式光罩,配合過度曝光或者過度顯影的至少其一所形成。 The method of laying out according to claim 1, wherein the conductive layer The electrical leads are formed by at least one of overexposure or overexposure by means of an optically compensated reticle. 如申請專利範圍第4項所述的佈設方法,其中該配向膜層形成的步驟進一步包含:塗覆光阻於該基板上;提供具有一圖樣的光罩或具有一半色調網點圖樣的光罩,並且藉由該光罩用以將該圖樣或該半色調網點圖樣曝光於該光阻上;顯影該圖樣或該半色調網點圖樣於該光阻上,用以形成具有橫跨在該等圖樣區塊之間的該等橋接式溝槽;以及烘烤該光阻。 The method of claim 4, wherein the step of forming the alignment layer further comprises: coating a photoresist on the substrate; providing a mask having a pattern or a mask having a halftone dot pattern, And exposing the pattern or the halftone dot pattern to the photoresist by using the mask; developing the pattern or the halftone dot pattern on the photoresist to form a region across the pattern The bridged trenches between the blocks; and baking the photoresist. 如申請專利範圍第5項所述的佈設方法,其中該導電層形成的步驟進一步包含:濺鍍導電材料於該基板上;塗覆光阻於該基板上;提供具有該光學補償式光罩,且透過該光學補償式光罩將對應該等電導線的電導線圖樣過度曝光於該光阻上;以及顯影該電導線圖樣,用以形成具有彼此相鄰的該等圖樣區塊,且該電導線圖樣係利用過度曝光與過度顯影而產生。 The arranging method of claim 5, wherein the step of forming the conductive layer further comprises: sputtering a conductive material on the substrate; coating a photoresist on the substrate; providing the optical compensation type reticle, And exposing the electrical lead pattern corresponding to the isoelectric wire to the photoresist through the optical compensation type reticle; and developing the electric lead pattern to form the pattern blocks adjacent to each other, and the electric Wire patterns are produced using overexposure and overexposure. 如申請專利範圍第6項所述的佈設方法,其中該保護層形成的步驟進一步包含:塗覆光阻、濺鍍光阻或有機物的至少其一於該基板上;以及烘烤該光阻或該有機物,以形成硬式保護膜。 The arranging method of claim 6, wherein the step of forming the protective layer further comprises: coating at least one of a photoresist, a sputter photoresist or an organic substance on the substrate; and baking the photoresist or The organic substance forms a hard protective film. 一種觸控板電極結構,其包含:一基板層;一配向膜層,係設置於該基板層之一側,該配向膜層由複數橋接式溝槽所組成;一第一透明導電層,係設置於該配向膜層之一側,且該第一透明導電層具有複數圖樣區塊彼此相鄰設置,而該等圖樣區塊彼此之間不連接;一導電層,係鄰接設置於該配向膜層之另一側;一保護層,係設置於該導電層上;以及一外框導線層,係設置於該基板與該保護層之間;其中該等橋接式溝槽橫跨在該等圖樣區塊之間,讓該等圖樣區塊彼此之間藉由該等橋接式溝槽連接。 A touch panel electrode structure comprising: a substrate layer; an alignment film layer disposed on one side of the substrate layer, the alignment film layer being composed of a plurality of bridged trenches; a first transparent conductive layer Provided on one side of the alignment film layer, and the first transparent conductive layer has a plurality of pattern blocks disposed adjacent to each other, and the pattern blocks are not connected to each other; a conductive layer is adjacently disposed on the alignment film The other side of the layer; a protective layer disposed on the conductive layer; and an outer frame wire layer disposed between the substrate and the protective layer; wherein the bridged trenches straddle the pattern Between the blocks, the pattern blocks are connected to each other by the bridge grooves. 如申請專利範圍第8項所述的觸控板電極結構,更包含一第二透明導電層,係同時設置於該基板層之另一側。The touch panel electrode structure of claim 8 further comprising a second transparent conductive layer disposed on the other side of the substrate layer.
TW99141322A 2010-11-30 2010-11-30 The Method and Structure of Touchpad Electrode TWI420368B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW99141322A TWI420368B (en) 2010-11-30 2010-11-30 The Method and Structure of Touchpad Electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW99141322A TWI420368B (en) 2010-11-30 2010-11-30 The Method and Structure of Touchpad Electrode

Publications (2)

Publication Number Publication Date
TW201222351A TW201222351A (en) 2012-06-01
TWI420368B true TWI420368B (en) 2013-12-21

Family

ID=46725205

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99141322A TWI420368B (en) 2010-11-30 2010-11-30 The Method and Structure of Touchpad Electrode

Country Status (1)

Country Link
TW (1) TWI420368B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM317050U (en) * 2007-02-12 2007-08-11 Young Fast Optoelectronics Co Capacitive touch sensing device
TW200915151A (en) * 2007-09-29 2009-04-01 Au Optronics Corp Touch panel and manufacturing method thereof
US20100136868A1 (en) * 2008-12-03 2010-06-03 Yu-Feng Chien Method of forming a color filter touch sensing substrate
TW201129270A (en) * 2010-02-06 2011-08-16 li-li Fan Layout method of bridging electrode and the structure thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM317050U (en) * 2007-02-12 2007-08-11 Young Fast Optoelectronics Co Capacitive touch sensing device
TW200915151A (en) * 2007-09-29 2009-04-01 Au Optronics Corp Touch panel and manufacturing method thereof
US20100136868A1 (en) * 2008-12-03 2010-06-03 Yu-Feng Chien Method of forming a color filter touch sensing substrate
TW201129270A (en) * 2010-02-06 2011-08-16 li-li Fan Layout method of bridging electrode and the structure thereof

Also Published As

Publication number Publication date
TW201222351A (en) 2012-06-01

Similar Documents

Publication Publication Date Title
JP5624939B2 (en) Measurement method and measurement mark for pattern shift amount between exposure areas
US9874777B2 (en) Color filter substrate, touch display device and method for manufacturing the color filter substrate
US8653378B2 (en) Structure of bridging electrode
CN103779202B (en) Dot structure and preparation method thereof and display floater
CN107230661A (en) A kind of array base palte and preparation method thereof, display device
TWI478024B (en) Touch panel and the touch panel making method
CN102707486B (en) Color filter substrate and manufacturing method for same
TWI460771B (en) Touch panel, method for forming the same, and display system
TWI545734B (en) Pixel structure and manufacturing method thereof
KR101055379B1 (en) Installing method of bridge type electrode and electrode structure of bridge type
KR20080105987A (en) Mask for manufacturing tft, tft and manufacturing thereof
CN104571757B (en) The preparation method of capacitive touch screen
TWI420368B (en) The Method and Structure of Touchpad Electrode
CN104216562A (en) Touch control panel as well as manufacturing method and display device of touch control panel
US9040858B2 (en) Layout method and layout structure of touch panel electrode
WO2017197915A1 (en) Photolithography mask, manufacturing method thereof, and photolithography method
TWI427513B (en) Construction Method and Structure of Bridge Erection with Shaded High Brightness
TWI404474B (en) Arrangement Method and Structure of Bridge Electrode
WO2015058552A1 (en) Display panel, manufacturing method thereof and display device
TW201337424A (en) Electrophoretic display panel and manufacturing method thereof
CN102541324B (en) Layout method for electrodes of touch pad and electrode structure of touch pad
CN113066803A (en) Display panel manufacturing method, display panel and display panel to be cut
CN105590876B (en) Method for manufacturing and detecting semiconductor element
JP5683125B2 (en) Electrode laying method and structure
US8252151B2 (en) Layout method of bridging electrode

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees