TWI417525B - Temperature sensing tape with rfid tag - Google Patents

Description

Temperature sensing patch with wireless RF system tag

The present invention relates to a temperature sensing device, and more particularly to a temperature sensing patch having a radio frequency system tag.

In an era of rapid technological advancement, not only do people's lives improve, but the incidence of various new infectious diseases has also increased, such as the well-known new influenza (H1N1) or Severe Acute Respiratory Syndrome (SARS). Among the above-mentioned novel infectious diseases, one of the easiest indicators to judge is fever, but the symptoms of fever are generally not easily noticeable by the patient's appearance, and it is necessary to measure whether the patient has a fever by the measurement of body temperature.
At present, the ear thermometer is mostly used for measuring body temperature. As shown in Fig. 1, a simple ear thermometer 10 has a temperature sensing unit 11, a temperature sensing button 12 and a temperature display unit 13 for measuring and receiving. When the temperature is measured, the temperature sensing unit 11 of the ear thermometer 10 is placed in the ear of the subject, and then the temperature sensing button 12 is pressed, and after waiting for a few seconds, the temperature of the subject is displayed. The temperature display unit 13 determines whether the subject has a fever symptom, and the simple ear thermometer 10 is suitable for use in a small number of places, such as a family or a general small clinic, but if the number of subjects is large, such as a company When enterprises, schools or large medical institutions are used, it is easy to waste time, and it is impossible to control the body temperature of the subjects at any time, resulting in the golden time of missing medical treatment.

The main object of the present invention is to provide a temperature sensing patch having a radio frequency system tag, comprising a base layer, a radio frequency system tag, a temperature sensing chip, an adhesive layer and a tear-off layer, the substrate The layer has an upper surface, a lower surface, a component setting area on the upper surface, and an adhesive area on the outer side of the component mounting area. The radio frequency system tag is disposed in the component setting area, and the radio frequency system tag system Having a substrate, an antenna disposed on the substrate, and a system tag wafer electrically connected to the antenna, the temperature sensing chip is electrically connected to the system tag wafer, and the adhesive layer is formed at least on the adhesive The tear-off layer is disposed on the adhesive layer. The temperature sensing patch with the RFID tag is conveniently attached to the skin of the subject by the adhesive layer, and the temperature sensed by the temperature sensing chip is transmitted to the wireless via the RFID tag. The RF system reader is used to monitor whether the current body temperature of the subject is within the safety standard, reducing the measurement time and waiting time.

Referring to FIG. 2, which is a first preferred embodiment of the present invention, a temperature sensing patch 100 having a radio frequency system tag includes a base layer 110, a radio frequency system tag 120, and a temperature sensing chip. 130, an adhesive layer 140 and a tear-off layer 150 having an upper surface 111, a lower surface 112, a component mounting region 113 on the upper surface 111, and an adhesive layer on the outside of the component mounting region 113. The material of the base layer 110 is selected from cotton or plastic. The RFID system tag 120 is disposed in the component setting area 113. The RFID system tag 120 has a substrate 121 and is disposed on the substrate. An antenna 122 of the substrate 121 and a system label wafer 123 electrically connected to the antenna 122. The substrate 121 has a first surface 121a and a second surface 121b. The first surface 121a faces the base layer 110. The upper surface 111, the antenna 122 and the system label wafer 123 are disposed on the first surface 121a of the substrate 121. The temperature sensing wafer 130 is electrically connected to the system label wafer 123, in this embodiment. The sense of temperature The wafer 130 is disposed on the substrate 121 of the RFID module tag 120. The temperature sensing chip 130 is also disposed on the first surface 121a of the substrate 121. Preferably, the substrate 121 has a An opening 121c penetrating the first surface 121a and the second surface 121b to expose the temperature sensing wafer 130. The adhesive layer 140 is formed at least in the adhesive region 114. In the embodiment, the adhesive layer 140 is formed separately. In the component setting area 113, the adhesive layer 140 has an adhesive layer surface 141. The RFID system label 120 is disposed on the adhesive layer surface 141. The tearing layer 150 is disposed on the adhesive layer 140, and the adhesive layer 140 is disposed on the adhesive layer 140. The tear-off layer 150 is also disposed on the radio frequency system tag 120. In the embodiment, the tear-off layer 150 is disposed on the second surface 121b of the substrate 121.
Preferably, referring to FIG. 2, the temperature sensing patch 100 having a radio frequency system tag may further include a pattern layer 160, and the pattern layer 160 may be formed on the lower surface 112 of the base layer 110. . Alternatively, referring to FIG. 3, in another embodiment, the lower surface 112 of the base layer 110 of the temperature sensing patch 100 having a radio frequency system tag may be formed with a pattern P to enhance aesthetics.
Next, referring to FIG. 4, when the subject removes the tear-off layer 150 of the temperature sensing patch 100 having the wireless radio system tag and utilizes the temperature sensing patch 100 having the wireless radio system tag When the adhesive layer 140 is attached to the skin, the temperature sensing wafer 130 can detect the current body temperature of the subject, and since the opening 121c of the substrate 121 exposes the temperature sensing wafer 130, the temperature sensing is performed. The chip 130 can quickly detect the current body temperature of the subject, and convert the current body temperature of the subject into an integrated temperature signal S to be transmitted to the wireless radio system tag 120, and receive the system tag wafer 123 via the radio frequency system tag 120. After the interpretation, the radio frequency system tag 120 transmits the body temperature signal S to a radio frequency system reader A, and then stores the body temperature signal S in a data processor B to monitor the current subject at any time. Whether the body temperature is within the safety standard, reducing the measurement time and waiting time, in addition, the data processor B can also be equipped with a warning device (not shown), so that the security personnel can find abnormal temperature or For the further processing, the data processor B can be a computer. In addition, the power source of the RFID module tag 120 and the temperature sensing chip 130 can be inductive current mode or soft. Battery, etc.
The scope of the present invention is defined by the scope of the appended claims, and any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention are within the scope of the present invention. .

10‧‧‧ ear thermometer
11‧‧‧Temperature sensing unit
12‧‧‧Temperature sensing button
13‧‧‧Temperature display unit
100‧‧‧ Temperature sensing patch with RFID tag
110‧‧‧ basal layer
111‧‧‧Upper surface
112‧‧‧ lower surface
113‧‧‧Component setting area
114‧‧‧Adhesive zone
120‧‧‧Wireless RF System Label
121‧‧‧Substrate
121a‧‧‧ first surface
121b‧‧‧second surface
121c‧‧‧ openings
122‧‧‧Antenna
123‧‧‧System Label Wafer
130‧‧‧ Temperature Sensing Wafer
140‧‧‧Adhesive layer
141‧‧‧Adhesive surface
150‧‧‧ tear-off layer
160‧‧‧pattern layer
A‧‧‧Wireless RF System Reader
B‧‧‧Data Processor
P‧‧‧ pattern
S‧‧‧ body temperature signal

Figure 1: Schematic diagram of a conventional ear thermometer.
2 is a cross-sectional view of a temperature sensing patch having a radio frequency system tag in accordance with a first preferred embodiment of the present invention.
Figure 3 is a cross-sectional view of another temperature sensing patch having a radio frequency system tag in accordance with a second preferred embodiment of the present invention.
Figure 4 is a flow diagram of a temperature sensing patch having a radio frequency system tag in accordance with a first preferred embodiment of the present invention.

100‧‧‧ Temperature sensing patch with RFID tag

110‧‧‧ basal layer

111‧‧‧Upper surface

112‧‧‧ lower surface

113‧‧‧Component setting area

114‧‧‧Adhesive zone

120‧‧‧Wireless RF System Label

121‧‧‧Substrate

121a‧‧‧ first surface

121b‧‧‧second surface

121c‧‧‧ openings

122‧‧‧Antenna

123‧‧‧System Label Wafer

130‧‧‧ Temperature Sensing Wafer

140‧‧‧Adhesive layer

141‧‧‧Adhesive surface

150‧‧‧ tear-off layer

160‧‧‧pattern layer

Claims (10)

A temperature sensing patch having a radio frequency system tag, comprising at least:
a base layer having an upper surface, a lower surface, a component mounting region on the upper surface, and an adhesive region on the outside of the component mounting region;
A radio frequency system tag is disposed in the component setting area, the radio frequency system tag has a substrate, an antenna disposed on the substrate, and a system tag wafer electrically connected to the antenna;
a temperature sensing wafer electrically connected to the system tag wafer;
An adhesive layer formed at least in the adhesive region; and a tear-off layer disposed on the adhesive layer.
A temperature sensing patch having a radio frequency system tag as described in claim 1, wherein the temperature sensing chip is disposed on the radio frequency system tag.
A temperature sensing patch having a radio frequency system tag as described in claim 1, wherein the lower surface of the base layer is formed with a pattern.
A temperature sensing patch having a radio frequency system tag as described in claim 1, wherein the adhesive layer is formed in the component mounting region.
A temperature sensing patch having a radio frequency system tag as described in claim 4, wherein the adhesive layer has an adhesive layer surface, and the radio frequency system tag is disposed on the surface of the adhesive layer.
A temperature sensing patch having a radio frequency system tag as described in claim 1, wherein the material of the base layer is selected from cotton or plastic.
A temperature sensing patch having a radio frequency system tag as described in claim 1, wherein the tearing layer is disposed on the radio frequency system tag.
A temperature sensing patch having a radio frequency system tag as described in claim 1, further comprising a pattern layer formed on the lower surface of the base layer.
A temperature sensing patch having a radio frequency system tag as described in claim 1, wherein the substrate has a first surface and a second surface, the first surface facing the substrate layer surface.
A temperature sensing patch having a radio frequency system tag as described in claim 2, wherein the substrate has an opening to expose the temperature sensing wafer.