TW201116811A - Temperature sensing tape with RFID tag - Google Patents

Temperature sensing tape with RFID tag Download PDF

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Publication number
TW201116811A
TW201116811A TW98138335A TW98138335A TW201116811A TW 201116811 A TW201116811 A TW 201116811A TW 98138335 A TW98138335 A TW 98138335A TW 98138335 A TW98138335 A TW 98138335A TW 201116811 A TW201116811 A TW 201116811A
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Taiwan
Prior art keywords
temperature sensing
radio frequency
frequency system
system tag
layer
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TW98138335A
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Chinese (zh)
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TWI417525B (en
Inventor
Wei-Te Chu
Nan-Yuan Huang
Yeh-Shun Chen
Tun-Yu Chen
Heng-Ting Liu
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Int Semiconductor Tech Ltd
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Publication of TW201116811A publication Critical patent/TW201116811A/en
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  • Measuring And Recording Apparatus For Diagnosis (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

Temperature sensing tape with RFID tag comprises a base layer, a RFID tag, a temperature sensing chip, an adhesive layer and a removing layer. The base layer has an upper surface, an element disposed zone and an adhesive zone. The RFID tag having a base, an antenna and a chip is disposed on the element disposed zone. The temperature sensing chip is electrically connected to the chip. The adhesive layer is formed on the adhesive zone at least. The removing layer is disposed on the adhesive layer.

Description

201116811 六、發明說明: 【發明所屬之技術領域】 本發明係有關於-種溫度Μ裝置,特別係有關於 種具有無線射頻系統標籤之溫度感測貼片。 [先前技術] 在科技日新月異的時代中,不僅人們的生活生準提 间’各種新型傳染病之發生率也跟著提高,例如大家熟 知的新型流感(H1NU或嚴重急性呼吸道症候群( q ^evere Acute Respiratory Syndrome, SARS) ^ » ϋ述新型傳染病中’最容易判定之指標之-係為發燒 、 症狀,但發燒症狀一般無法由患者外觀輕易察覺,必須 藉由體溫之量測方可得知患者是否發燒。 目刖量測體溫大都使用耳溫搶,如第1圖所示,一種 簡易之耳溫搶10係具有一溫度感測單元丨】、一溫度感測 按鍵12及一溫度顯示單元13,欲量測受測者溫度時,並 須將該耳溫搶1〇之該溫度感測單元u置於受測者之耳朵 0 内,接著按壓該溫度感測按鍵12,等待數秒後,受測者 之溫度會顯示於該溫度顯示單元13以判定受測者是否具 有發燒症狀,此種簡易之耳溫搶10適合使用於人數較少 之地點,例如家庭或一般小型診所,但若受測者之人數 眾多,例如公司企業、學校或大型醫療院所時,容易造 成時間之浪費,且無法隨時掌控受測者之體溫導致錯 失就醫之黃金時間。 【發明内容】 _] 本發明之主要目_在於提供-種具有無線射頻系 098138335 表單編號A0101 第3頁/共13頁 0982065751-0 201116811 統標籤之溫度感測貼片,其包含一基底層、一無線射頻 系統標籤、一溫度感測晶片、一黏著層以及一撕除層, 該基底層係具有一上表面、一下表面、一位於該上表面 之元件設置區及一位於該元件設置區外側之黏著區,該 無線射頻系統標籤係設置於該元件設置區,該無線射頻 系統標籤係具有一基材、一設置於該基材上之天線及一 電性連接該天線之系統標籤晶片,該溫度感測晶片係電 性連接於該系統標籤晶片,該黏著層係至少形成於該黏 著區,該撕除層係設置於該黏著層上。藉由該黏著層使 該具有無線射頻系統標籤之溫度感測貼片方便貼設於受 測者之皮膚,再經由該無線射頻系統標籤將該溫度感測 晶片所感測到之溫度傳送至一無線射頻系統讀取器,以 隨時監控受測者目前之體溫是否位於安全標準内,減少 量測之時間及等待之時間。 【實施方式】 [0004] 請參閱第2圖,其係本發明之第一較佳實施例,一種 具有無線射頻系統標籤之溫度感測貼片100係包含一基底 層110、一無線射頻系統標籤120、一溫度感測晶片130 、一黏著層140以及一撕除層150,該基底層110係具有 一上表面111、一下表面112、一位於該上表面111之元 件設置區113及一位於該元件設置區113外侧之黏著區 114,該基底層110之材質係可選自於棉布或塑膠,該無 線射頻系統標籤120係設置於該元件設置區113,該無線 射頻系統標籤120係具有一基材121、一設置於該基材 121之天線122及一電性連接該天線122之系統標籤晶片 123,該基材121係具有一第一表面121 a及一第二表面 098138335 表單編號A0101 第4頁/共13頁 098 201116811 121b,該第一表面121a係朝向該基底層110之該上表面 111,β玄天線122及该系統標戴晶片123係設置於該基材 121之該第一表面121a ’該溫度感測晶片130係電性連接 於該系統標籤晶片123 ’在本實施例中,該溫度感測晶片 130係設置於該無線射頻系統標籤120之該基材121上, Ο 該溫度感測晶片130係亦設置於該基材121之該第一表面 121a,較佳地,該基材121係具有一貫穿該第一表面 121 a及該第二表面121 b之開口 121 c以顯露該溫度感測晶 片130,該黏著層140係至少形成於該黏著區114,在本 實施例中’該黏著層140係另形成於該元件設置區113, 該黏著層140係具有一黏著層表面141,該無線射頻系統 標箴120係設置於該黏著層表面141,該撕除層150係設 置於該黏著層140上,且該撕除層150係亦設置於該無線 射頻系統標籤120上,在本實施例中,該撕除層150係設 置於該基材121之該第二表面121b。201116811 VI. Description of the Invention: [Technical Field] The present invention relates to a temperature sensing device, and more particularly to a temperature sensing patch having a radio frequency system tag. [Prior Art] In the era of rapid technological advancement, not only the life of people is expected to increase the incidence of various new infectious diseases, such as the well-known new influenza (H1NU or severe acute respiratory syndrome (q ^evere Acute Respiratory) Syndrome, SARS) ^ » The most easiest indicator of the new infectious disease is the fever and symptoms, but the symptoms of fever are generally not easily noticeable by the patient's appearance. It is necessary to measure the body temperature to know if the patient is The fever is measured by the ear temperature. As shown in Fig. 1, a simple ear temperature grab 10 has a temperature sensing unit, a temperature sensing button 12 and a temperature display unit 13, To measure the temperature of the subject, the temperature sensing unit u must be placed in the ear 0 of the subject, then press the temperature sensing button 12, wait a few seconds, and be tested. The temperature of the person will be displayed on the temperature display unit 13 to determine whether the subject has a fever symptom, and the simple ear temperature grab 10 is suitable for use in a small number of places, such as a family or a Small clinics, but if the number of people tested is large, such as a company, a school, or a large medical institution, it is easy to waste time, and it is impossible to control the body temperature of the subject at any time, resulting in the golden time of missing medical treatment. _] The main purpose of the present invention is to provide a temperature sensing patch having a radio frequency system 098138335 Form No. A0101, Page 3 / 13 page 0982065751-0 201116811, which includes a base layer and a radio frequency system. a label, a temperature sensing wafer, an adhesive layer and a tear-off layer, the substrate layer having an upper surface, a lower surface, a component mounting region on the upper surface, and an adhesive region on the outside of the component mounting region, The radio frequency system tag is disposed in the component setting area, the radio frequency system tag has a substrate, an antenna disposed on the substrate, and a system tag wafer electrically connected to the antenna, the temperature sensing chip Electrically connected to the system label wafer, the adhesive layer is formed at least in the adhesive region, and the tearing layer is disposed on the adhesive layer. The temperature sensing patch with the RFID tag is conveniently attached to the skin of the subject by the adhesive layer, and the temperature sensed by the temperature sensing chip is transmitted to a wireless RF via the RFID tag. The system reader monitors whether the current body temperature of the subject is within the safety standard at any time, and reduces the time of measurement and the waiting time. [Embodiment] [0004] Please refer to FIG. 2, which is the first of the present invention. In a preferred embodiment, a temperature sensing patch 100 having a radio frequency system tag includes a base layer 110, a radio frequency system tag 120, a temperature sensing chip 130, an adhesive layer 140, and a tear-off layer 150. The base layer 110 has an upper surface 111, a lower surface 112, a component mounting region 113 on the upper surface 111, and an adhesive region 114 on the outer side of the component mounting region 113. The material of the base layer 110 is selected from In the cotton cloth or the plastic, the RFID system tag 120 is disposed in the component setting area 113. The RFID system tag 120 has a substrate 121 and a day disposed on the substrate 121. 122 and a system label wafer 123 electrically connected to the antenna 122, the substrate 121 having a first surface 121 a and a second surface 098138335 Form No. A0101 Page 4 / 13 pages 098 201116811 121b, the first The surface 121a faces the upper surface 111 of the base layer 110, and the β-antenna 122 and the system-standard wafer 123 are disposed on the first surface 121a of the substrate 121. The temperature sensing chip 130 is electrically connected to the surface 121a. In the present embodiment, the temperature sensing chip 130 is disposed on the substrate 121 of the RFID module tag 120, and the temperature sensing chip 130 is also disposed on the substrate 121. The first surface 121a, preferably, the substrate 121 has an opening 121c extending through the first surface 121a and the second surface 121b to expose the temperature sensing wafer 130. The adhesive layer 140 is at least Formed in the adhesive region 114, in the embodiment, the adhesive layer 140 is formed in the component mounting region 113, the adhesive layer 140 has an adhesive layer surface 141, and the radio frequency system standard 120 is disposed on the adhesive layer 140. Adhesive layer surface 141, the tear-off layer A 150-layer is disposed on the adhesive layer 140, and the tear-off layer 150 is also disposed on the RFID system tag 120. In the embodiment, the tear-off layer 150 is disposed on the second substrate 121. Surface 121b.

較佳地’請再參閱第2圖’該具有無線射頻系統標籤 之溫度感測貼片10 0儀可另包令—圖案層160,該圖案層 160係可形成於該基底層110之該卞表面112。或者,請 參閱第3圖,在另一實施例中,該具有無線射頻系統標籤 之溫度感測貼片10 0之該基底層11 〇之該下表面112係可 形成有一圖案P,以增加美觀性。 接著,請參閱第4圖’當受測者移除該具有無線射頻 系統標籤之溫度感測貼片10 0之該撕除層15 0並利用該具 有無線射頻系統標籤之溫度感測貼片1〇〇之該黏著層丨4〇 貼設於皮膚時,該溫度感測晶片130係可偵測受測者目前 之體溫’且由於該基材121之該開口 121c係顯露該溫度感 098138335 表單編號A0101 第5頁/共13頁 0982065751-0 201116811 測晶片1 3 0,因此該溫度感測晶片13 0可快速偵測受測者 目前之體溫,並將受測者目前之體溫轉成一體溫訊號S傳 送至該無線射頻系統標籤120,經由該無線射頻系統標籤 120之該系統標籤晶片123接收並判讀後,再由該無線射 頻系統標籤120傳送該體溫訊號S至一無線射頻系統讀取 器A,之後,將該體溫訊號S儲存於一資料處理器Β中,以 隨時監控受測者目前之體溫是否位於安全標準内,減少 量測之時間及等待之時間,另,該資料處理器B中也可裝 置有警示器(圖未繪出),以使安檢人員及時發現體溫 異常或過高之受測者,以進行進一步之處理,該資料處 理器B係可為電腦,此外,該無線射頻系統標籤120及該 溫度感測晶片13 0之電力來源係可選用感應電流方式或裝 設軟性電池等。 本發明之保護範圍當視後附之申請專利範圍所界定 者為準,任何熟知此項技藝者,在不脫離本發明之精神 和範圍内所作之任何變化與修改,均屬於本發明之保護 範圍。 【圖式簡單說明】 [0005] 第1圖:習知耳溫搶之示意圖。 第2圖:依據本發明之第一較佳實施例,一種具有無線射 頻系統標籤之温度感測貼片之截面示意圖。 第3圖:依據本發明之第二較佳實施例,另一種具有無線 射頻系統標籤之溫度感測貼片之截面示意圖。 第4圖:依據本發明之第一較佳實施例,該具有無線射頻 系統標籤之溫度感測貼片之流程圖。 098138335 表單編號A0101 第6頁/共13頁 0982065751-0 201116811 Ο ο 【主要元件符號說明】 [0006] 10耳溫搶 11溫度感測單元 12溫度感測按鍵 13溫度顯示單元 100具有無線射頻系統標籤之溫度感測貼片 110基底層 111上表面 112下表面 113元件設置區 114黏著區 120無線射頻系統標籤 121基材 12U第一表面 121b第二表面 121c 開口 122天線 123系統標藏晶片 130溫度感測晶片 140黏著層 141黏著層表面 150撕除層 160圖案層 A無線射頻系統讀取器 B資料處理器 P圖案 S體溫訊號 098138335 表單編號Α0101 第7頁/共13頁 0982065751-0Preferably, please refer to FIG. 2, the temperature sensing patch having a radio frequency system tag, and the pattern layer 160, which may be formed on the substrate layer 110. Surface 112. Alternatively, referring to FIG. 3, in another embodiment, the lower surface 112 of the base layer 11 of the temperature sensing patch 100 having the radio frequency system tag may be formed with a pattern P to increase the appearance. Sex. Next, please refer to FIG. 4 'When the subject removes the tear-off layer 150 of the temperature-sensing patch 100 having the radio frequency system tag and uses the temperature sensing patch 1 with the radio frequency system tag When the adhesive layer 4 is attached to the skin, the temperature sensing wafer 130 can detect the current body temperature of the subject' and the opening 121c of the substrate 121 reveals the temperature sense 098138335. A0101 Page 5 of 13 0982065751-0 201116811 The wafer 1 3 0 is tested, so the temperature sensing wafer 130 can quickly detect the current body temperature of the subject and convert the current body temperature of the subject into an integrated temperature signal. S is transmitted to the radio frequency system tag 120, and after receiving and interpreting the system tag chip 123 of the radio frequency system tag 120, the body temperature signal S is transmitted by the radio frequency system tag 120 to a radio frequency system reader A. After that, the body temperature signal S is stored in a data processor , to monitor whether the current body temperature of the subject is within the safety standard, reduce the measurement time and the waiting time, and the data processor B A warning device (not shown) may also be installed in the middle, so that the security personnel can detect the abnormal temperature or the abnormality of the subject in time for further processing. The data processor B can be a computer, and the wireless device The power source of the RF system tag 120 and the temperature sensing chip 130 may be an inductive current mode or a flexible battery. The scope of the present invention is defined by the scope of the appended claims, and any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention are within the scope of the present invention. . [Simple description of the diagram] [0005] Figure 1: Schematic diagram of the conventional ear temperature grab. Figure 2 is a cross-sectional view of a temperature sensing patch having a wireless radio frequency system tag in accordance with a first preferred embodiment of the present invention. Figure 3 is a cross-sectional view of another temperature sensing patch having a radio frequency system tag in accordance with a second preferred embodiment of the present invention. Figure 4 is a flow diagram of a temperature sensing patch having a radio frequency system tag in accordance with a first preferred embodiment of the present invention. 098138335 Form No. A0101 Page 6 of 13 0982065751-0 201116811 Ο ο [Main component symbol description] [0006] 10 ear temperature grab 11 temperature sensing unit 12 temperature sensing button 13 temperature display unit 100 has a radio frequency system tag Temperature sensing patch 110 Base layer 111 Upper surface 112 Lower surface 113 Component setting area 114 Adhesion area 120 Radio frequency system label 121 Substrate 12U First surface 121b Second surface 121c Opening 122 Antenna 123 System labeling wafer 130 Temperature sense Test wafer 140 adhesive layer 141 adhesive layer surface 150 tear layer 160 pattern layer A radio frequency system reader B data processor P pattern S body temperature signal 098138335 Form number Α 0101 Page 7 / Total 13 page 0982065751-0

Claims (1)

201116811 七、申請專利範圍: 1 . 一種具有無線射頻系統標籤之溫度感測贴片,其至少包含 一基底層,其係具有一上表面、一下表面、一位於該上表 面之元件設置區及一位於該元件設置區外侧之黏著區; 一無線射頻系統標籤,其係設置於該元件設置區,該無線 射頻系統標籤係具有一基材、一設置於該基材上之天線及 —電性連接該天線之系統標戴晶片, 一溫度感測晶片,其係電性連接於該系統標籤晶片; 一黏著層,其係至少形成於該黏著區;以及 一撕除層,其係設置於該黏著層上。 2 .如申請專利範圍第1項所述之具有無線射頻系統標籤之溫 度感測貼片,其中該溫度感測晶片係設置於該無線射頻系 統標籤上。 3 .如申請專利範圍第1項所述之具有無線射頻系統標籤之溫 度感測貼片,其中該基底層之該下表面係可形成有一圖案 〇 4 .如申請專利範圍第1項所述之具有無線射頻系統標籤之溫 度感測貼片,其中該黏著層係另形成於該元件設置區。 5 .如申請專利範圍第4項所述之具有無線射頻系統標籤之溫 度感測貼片,其中該黏著層係具有一黏著層表面,該無線 射頻系統標籤係設置於該黏著層表面。 6 .如申請專利範圍第1項所述之具有無線射頻系統標籤之溫 度感測貼片,其中該基底層之材質係選自於棉布或塑膠。 098138335 表單編號A0101 第8頁/共13頁 0982 201116811 7 . 如申請專利範圍第1項所述之具有無線射頻系統標籤之溫 度感測貼片,其中該撕除層係設置於該無線射頻系統標籤 上。 如申請專利範圍第1項所述之具有無線射頻系統標籤之溫 度感測貼片,其另包含一圖案層,該圖案層係形成於該基 底層之該下表面。 如申請專利範圍第1項所述之具有無線射頻系統標籤之溫 度感測貼片,其中該基材係具有一第一表面及一第二表面 ,該第一表面係朝向該基底層之該上表面。 〇 10 . 如申請專利範圍第2項所述之具有無線射頻系統標籤之溫 度感測貼片,其中該基材係具有一開口以顯露該溫度感測 晶片。 ❹ 098138335 表單編號Α0101 第9頁/共13頁 0982065751-0201116811 VII. Patent application scope: 1. A temperature sensing patch having a wireless radio frequency system tag, comprising at least a base layer having an upper surface, a lower surface, a component setting area on the upper surface, and a component An adhesive region located outside the component setting area; a radio frequency system tag disposed in the component setting area, the radio frequency system tag having a substrate, an antenna disposed on the substrate, and an electrical connection The system of the antenna is a wafer, a temperature sensing wafer electrically connected to the system label wafer; an adhesive layer formed at least in the adhesive region; and a tear-off layer disposed on the adhesive On the floor. 2. The temperature sensing patch having a radio frequency system tag as described in claim 1, wherein the temperature sensing chip is disposed on the radio frequency system tag. 3. The temperature sensing patch having a radio frequency system tag according to claim 1, wherein the lower surface of the base layer is formed with a pattern 〇4 as described in claim 1 A temperature sensing patch having a radio frequency system tag, wherein the adhesive layer is additionally formed in the component mounting region. 5. The temperature sensing patch of the radio frequency system tag of claim 4, wherein the adhesive layer has an adhesive layer surface, and the radio frequency system tag is disposed on the surface of the adhesive layer. 6. The temperature sensing patch having a radio frequency system tag as described in claim 1, wherein the material of the base layer is selected from cotton or plastic. 098138335 Form No. A0101 Page 8 of 13 0982 201116811 7. A temperature sensing patch having a radio frequency system tag as described in claim 1 wherein the tear layer is disposed on the radio frequency system tag on. A temperature sensing patch having a radio frequency system tag as described in claim 1 further comprising a pattern layer formed on the lower surface of the base layer. A temperature sensing patch having a radio frequency system tag as described in claim 1, wherein the substrate has a first surface and a second surface, the first surface facing the substrate layer surface. A temperature sensing patch having a radio frequency system tag as described in claim 2, wherein the substrate has an opening to expose the temperature sensing wafer. ❹ 098138335 Form No. Α0101 Page 9 of 13 0982065751-0
TW98138335A 2009-11-12 2009-11-12 Temperature sensing tape with rfid tag TWI417525B (en)

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