TWI415313B - - Google Patents

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Publication number
TWI415313B
TWI415313B TW98140087A TW98140087A TWI415313B TW I415313 B TWI415313 B TW I415313B TW 98140087 A TW98140087 A TW 98140087A TW 98140087 A TW98140087 A TW 98140087A TW I415313 B TWI415313 B TW I415313B
Authority
TW
Taiwan
Prior art keywords
led wafer
heat
phase flow
lens
led
Prior art date
Application number
TW98140087A
Other languages
Chinese (zh)
Other versions
TW201119104A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW98140087A priority Critical patent/TW201119104A/en
Publication of TW201119104A publication Critical patent/TW201119104A/en
Application granted granted Critical
Publication of TWI415313B publication Critical patent/TWI415313B/zh

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  • Led Device Packages (AREA)

Abstract

A LED packaging structure includes a lens, a metal case, two phase flow heat conductors, at least one LED wafer, a foreign electric plug connector and a fixing seat. The metal case is used to support the lens and which inner is formed into a hollow shaped body to contain the LED wafer. The two phase flow heat conductors have at least one plane on which the LED wafer is dircely soldered or adhered. By using the two phase flow heat conductors such as heat pipes, heat spreaders and so on, the heat generated from the LED wafer can be quickly spread out to prevent heat generation so that the service lifetime of the LED wafer can be extended and prevent radiation performance degradation when the LED wafer overheats. This invention uses Fresnel lens to improve the irradiation efficiency.
TW98140087A 2009-11-25 2009-11-25 LED packaging structure TW201119104A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98140087A TW201119104A (en) 2009-11-25 2009-11-25 LED packaging structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98140087A TW201119104A (en) 2009-11-25 2009-11-25 LED packaging structure

Publications (2)

Publication Number Publication Date
TW201119104A TW201119104A (en) 2011-06-01
TWI415313B true TWI415313B (en) 2013-11-11

Family

ID=44935971

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98140087A TW201119104A (en) 2009-11-25 2009-11-25 LED packaging structure

Country Status (1)

Country Link
TW (1) TW201119104A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216263A (en) * 1990-11-29 1993-06-01 Xerox Corporation High density, independently addressable, surface emitting semiconductor laser-light emitting diode arrays
CN201034307Y (en) * 2007-05-30 2008-03-12 杭州五联照明科技有限公司 Light-emitting diode illuminator with heat dissipation structure
TWM362513U (en) * 2009-01-22 2009-08-01 Yeh Chiang Technology Corp Packaging structure for LED

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5216263A (en) * 1990-11-29 1993-06-01 Xerox Corporation High density, independently addressable, surface emitting semiconductor laser-light emitting diode arrays
CN201034307Y (en) * 2007-05-30 2008-03-12 杭州五联照明科技有限公司 Light-emitting diode illuminator with heat dissipation structure
TWM362513U (en) * 2009-01-22 2009-08-01 Yeh Chiang Technology Corp Packaging structure for LED

Also Published As

Publication number Publication date
TW201119104A (en) 2011-06-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees