TW200625671A - Improvement of structure for light emitting diode package - Google Patents

Improvement of structure for light emitting diode package

Info

Publication number
TW200625671A
TW200625671A TW094100589A TW94100589A TW200625671A TW 200625671 A TW200625671 A TW 200625671A TW 094100589 A TW094100589 A TW 094100589A TW 94100589 A TW94100589 A TW 94100589A TW 200625671 A TW200625671 A TW 200625671A
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting diode
heat conducting
diode chip
lead
Prior art date
Application number
TW094100589A
Other languages
Chinese (zh)
Other versions
TWI258871B (en
Inventor
Jen-Shyan Chen
Chung-Zen Lin
Original Assignee
Neobulb Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Neobulb Technologies Inc filed Critical Neobulb Technologies Inc
Priority to TW94100589A priority Critical patent/TWI258871B/en
Publication of TW200625671A publication Critical patent/TW200625671A/en
Application granted granted Critical
Publication of TWI258871B publication Critical patent/TWI258871B/en

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  • Led Device Packages (AREA)

Abstract

The invention discloses an improvement of structure for light emitting diode package. It includes: providing accommodation space for installing a heat conducting pipe below the heat conducting carrier; installing a light emitting diode chip on the heat conducting carrier; installing two lead legs at one side or two sides; connecting electricity between light emitting diode chip and lead legs by at least two lead wires; covering light emitting diode chip, lead wire and portion of lead leg by a package glue body. The design combines the package structure of light emitting diode with heat conducting pipe. The heat generated from light emitting diode chip can be transferred through heat conducting carrier connecting tightly with heat conducting pipe. Therefore the heat produced by the light emitting diode chip can be quickly guided away through heat conducting pipe.
TW94100589A 2005-01-10 2005-01-10 Improved structure for LED package TWI258871B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94100589A TWI258871B (en) 2005-01-10 2005-01-10 Improved structure for LED package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94100589A TWI258871B (en) 2005-01-10 2005-01-10 Improved structure for LED package

Publications (2)

Publication Number Publication Date
TW200625671A true TW200625671A (en) 2006-07-16
TWI258871B TWI258871B (en) 2006-07-21

Family

ID=37765421

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94100589A TWI258871B (en) 2005-01-10 2005-01-10 Improved structure for LED package

Country Status (1)

Country Link
TW (1) TWI258871B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI395314B (en) * 2009-10-16 2013-05-01 Neobulb Technologies Inc Chip lead frame and photoelectric energy transducing module
TWI404229B (en) * 2006-12-08 2013-08-01 Seoul Semiconductor Co Ltd Light emitting device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7824983B2 (en) 2008-06-02 2010-11-02 Micron Technology, Inc. Methods of providing electrical isolation in semiconductor structures

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI404229B (en) * 2006-12-08 2013-08-01 Seoul Semiconductor Co Ltd Light emitting device
TWI395314B (en) * 2009-10-16 2013-05-01 Neobulb Technologies Inc Chip lead frame and photoelectric energy transducing module

Also Published As

Publication number Publication date
TWI258871B (en) 2006-07-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees