TW200625671A - Improvement of structure for light emitting diode package - Google Patents
Improvement of structure for light emitting diode packageInfo
- Publication number
- TW200625671A TW200625671A TW094100589A TW94100589A TW200625671A TW 200625671 A TW200625671 A TW 200625671A TW 094100589 A TW094100589 A TW 094100589A TW 94100589 A TW94100589 A TW 94100589A TW 200625671 A TW200625671 A TW 200625671A
- Authority
- TW
- Taiwan
- Prior art keywords
- light emitting
- emitting diode
- heat conducting
- diode chip
- lead
- Prior art date
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The invention discloses an improvement of structure for light emitting diode package. It includes: providing accommodation space for installing a heat conducting pipe below the heat conducting carrier; installing a light emitting diode chip on the heat conducting carrier; installing two lead legs at one side or two sides; connecting electricity between light emitting diode chip and lead legs by at least two lead wires; covering light emitting diode chip, lead wire and portion of lead leg by a package glue body. The design combines the package structure of light emitting diode with heat conducting pipe. The heat generated from light emitting diode chip can be transferred through heat conducting carrier connecting tightly with heat conducting pipe. Therefore the heat produced by the light emitting diode chip can be quickly guided away through heat conducting pipe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94100589A TWI258871B (en) | 2005-01-10 | 2005-01-10 | Improved structure for LED package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94100589A TWI258871B (en) | 2005-01-10 | 2005-01-10 | Improved structure for LED package |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200625671A true TW200625671A (en) | 2006-07-16 |
TWI258871B TWI258871B (en) | 2006-07-21 |
Family
ID=37765421
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94100589A TWI258871B (en) | 2005-01-10 | 2005-01-10 | Improved structure for LED package |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI258871B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI395314B (en) * | 2009-10-16 | 2013-05-01 | Neobulb Technologies Inc | Chip lead frame and photoelectric energy transducing module |
TWI404229B (en) * | 2006-12-08 | 2013-08-01 | Seoul Semiconductor Co Ltd | Light emitting device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7824983B2 (en) | 2008-06-02 | 2010-11-02 | Micron Technology, Inc. | Methods of providing electrical isolation in semiconductor structures |
-
2005
- 2005-01-10 TW TW94100589A patent/TWI258871B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI404229B (en) * | 2006-12-08 | 2013-08-01 | Seoul Semiconductor Co Ltd | Light emitting device |
TWI395314B (en) * | 2009-10-16 | 2013-05-01 | Neobulb Technologies Inc | Chip lead frame and photoelectric energy transducing module |
Also Published As
Publication number | Publication date |
---|---|
TWI258871B (en) | 2006-07-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |