TWI414870B - Auto focus camera module - Google Patents

Abstract

An auto focus camera module includes an auto-focus lens module, a wafer level lens, a sleeve and an image detection device. The auto-focus lens module includes: a lens, and an actuator, for performing an auto-focus operation according to a first control signal. The sleeve, which is coupled to the auto-focus lens module, surrounds the wafer level lens and includes a conductive path. The image detecting device is coupled to the sleeve, for generating the first control signal that is transmitted to the auto-focus lens module via the conductive path.

Description

Autofocus camera module

The invention relates to a camera module, in particular to a camera module for zooming and autofocusing.

FIG. 1 is a structural diagram of a conventional camera module 100. As shown in FIG. 1, a control unit 101 (which may be a processor or the like) transmits a control signal CS to a control circuit in the prior art. Then, the control circuit 103 moves the lens group 107 according to the control signal CS and controls the actuator 105 through the external wire 104, thereby achieving the function of auto focus. However, such a structure can only achieve the function of autofocus, and can not have the effect of a room. If the zoom effect is to be achieved, the lens group 107 must include more than three lens groups, and each lens group must have a corresponding motor. Therefore, there are disadvantages of high cost and large volume. Moreover, such lenses may fail during assembly and increase the difficulty of product testing.

Embodiments of the present invention disclose a camera module including an autofocus lens module, a wafer level lens, a sleeve, and an image sensing element. The autofocus lens module includes: a lens; and an actuator for controlling the lens to perform an autofocus operation according to a first control signal. A sleeve is coupled to the autofocus lens module and surrounds the wafer level lens, the sleeve having a conductive path. The image sensing component is coupled to the sleeve to generate a first control signal, and the first control signal is conducted to the autofocus lens module via the conductive path.

With the above-described embodiment, the camera module capable of zooming and autofocusing can be manufactured without adding an external line, thereby reducing the size and cost. In addition, the camera module according to the embodiment of the present invention can be electrically connected to the application product by a reflow process, and thus can be mass-produced quickly.

Certain terms are used throughout the description and following claims to refer to particular elements. Those of ordinary skill in the art should understand that a hardware manufacturer may refer to the same component by a different noun. The scope of this specification and the subsequent patent application do not use the difference of the names as the means for distinguishing the elements, but the difference in function of the elements as the criterion for distinguishing. The term "including" as used throughout the specification and subsequent claims is an open term and should be interpreted as "including but not limited to".

FIG. 2 is a block diagram showing a camera module 200 according to an embodiment of the present invention. As shown in FIG. 2, the camera module 200 includes an actuator 201, a lens group 203 (which may include one or more lenses), and a wafer level lens (Wafer level Len) package unit 205. The actuator 201 and the lens group 203 can be regarded as an automatic zoom lens module. The camera module 200 can further include a sleeve 215 to surround the wafer level lens 205. The sleeve 215 can be used for signal communication, that is, the sleeve 215 forms a conductive path in the wafer level lens 205. In addition, the sleeve 215 can also serve as a light blocking system for the wafer level lens 205. The control circuit 207 receives a control signal CS of a control unit 209 (e.g., a microprocessor), and the control circuit 207 determines the action of the actuator 201 and the wafer level lens 205 based on the control signal CS generating a control signal. In this embodiment, since the lens group 203 and the wafer level lens 205 can be moved correspondingly, the zoom function can be achieved. Therefore, the camera module 200 can control the action of the lens group 203 by the actuator 201 to achieve the function of autofocus, and the zoom function can be achieved by the interaction of the lens group 203 and the wafer level lens 205. Unlike the camera module 100 shown in Fig. 1, it can only have the function of autofocus.

Wafer-level lens system uses semiconductor technology to build signal processing circuits and micro-optical components fabricated by etching technology on the wafer, and then optical lens glass wafers and inductors that are pressed through the polymer material. The wafer is bonded to make it a lens module. In this embodiment, the wafer level lens 205 and the control circuit 201 can be fabricated in a wafer to wafer manner or in a die to wafer manner. The method of manufacturing the bare wafer to the wafer means that the wafer level lens 205 is fabricated and cut, and then bonded to the wafer of the manufacturing control circuit 207. The wafer-to-wafer manufacturing method is such that the wafer of the wafer-level lens 205 and the wafer of the manufacturing control circuit 207 are bonded together and then cut.

The wafer level lens control circuit 207 can adopt a TSV (Through-Silicon Via) or CSP (Chip Size Package) package to form a conduction path. The control circuit 207 can transmit the control signal to the actuator 201 by the conductive path of the sleeve 215, and does not require an external line for signal communication like the camera module 100 shown in FIG. In one embodiment, the control circuit 201 is included in the image sensing component 213, and the actuator 201 and the image sensing component 213 are connected and the signal is communicated by using the glass pins on the sensing component package, but is not intended to limit the present invention. The control circuit 201 is not limited to be integrated with the image sensing element. In addition, the electronic circuit can be connected by solder, clips, thimbles, and ACF (Anisotropic Conductive Film). The camera module 200 can be used in a miniature digital camera module, and the micro digital camera module is mainly used in a non-camera digital electronic device, such as a mobile phone, a personal digital assistant (PDA), and the like.

With the above-described embodiment, the camera module capable of zooming and autofocusing can be manufactured without adding an external line, thereby reducing the size and cost. In addition, the camera module according to the embodiment of the present invention can be electrically connected to the application product by a reflow process, and thus can be mass-produced quickly.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

104. . . External wire

107. . . Lens group

100, 200. . . Camera module

105, 201. . . Actuator

203. . . Lens group

205. . . Wafer level lens

103, 207‧‧‧ control circuit

101, 209‧‧‧Control unit

213‧‧•Image sensing components

215‧‧‧ sleeve

FIG. 1 is a structural diagram of a conventional camera module.

FIG. 2 is a structural diagram of a camera module according to an embodiment of the present invention.

200. . . Camera module

201. . . Actuator

203. . . Lens group

205. . . Wafer level lens

207. . . Control circuit

209. . . control unit

213. . . Image sensing component

215. . . Sleeve

Claims (7)

An autofocus camera module includes: an autofocus lens module comprising: a lens; and an actuator for controlling the lens to perform an autofocus operation according to a first control signal; a wafer level lens (Wafer level Lens); a sleeve connected to the autofocus lens module and surrounding the wafer level lens, the sleeve having a conductive path; and an image sensing component coupled to the sleeve to generate the The first control signal is transmitted to the autofocus lens module via the conductive path. The autofocus camera module of claim 1, wherein the wafer level lens is controlled by the first control signal and is coupled to the autofocus lens module for performing a zooming operation. The autofocus camera module of claim 1, wherein the sleeve is further configured to block light from entering the wafer level lens. The image sensing component further includes a control circuit for generating the first control signal, as in the camera module of the autofocus system of claim 1. The image sensing device further includes a conductive path formed by a through silicon via (TSV) to be electrically connected to the conductive path. The autofocus camera module of claim 1, wherein the wafer level lens and the image sensing element are fabricated in a wafer to wafer manner. The autofocus camera module of claim 1, wherein the wafer level lens and the image sensing element are fabricated in a die-to-wafer manner.