TWI414641B - Flexible copper clad laminate electroplating device - Google Patents

Abstract

A flexible copper clad laminate electroplating device includes a first cylinder, a second cylinder, and a direction-changing module. The first cylinder is disposed in a first direction and scrolls a flexible copper clad laminate. The second cylinder is disposed in a second direction and scrolls the flexible copper clad laminate, wherein the first direction is perpendicular to the second direction. There is a transporting path between the first cylinder and the second cylinder. The direction-changing module is disposed on the transporting path to change the flexible copper clad laminate from the first direction to the second direction, wherein the direction-changing module includes at least an air hole, the air hole is operable to output air so that the flexible copper clad laminate does not directly contact with the direction-changing module.

Description

Soft copper foil substrate plating device

The present invention relates to an apparatus for use in an electrolytic process, and more particularly to a soft copper foil substrate plating apparatus.

In recent years, due to the development of industrial and commercial development and social progress, the products provided are mainly aimed at convenience, reliability, and economic benefits. Therefore, the products currently being developed are more advanced than before and can contribute to society.

A printed circuit board (PCB) is a printed wiring board in which a conductor is formed on a substrate in accordance with a circuit design in which electronic components are wired to each other. In general, a printed circuit board is formed on a surface of an insulating board to form a necessary circuit wiring corresponding to a wiring pattern, so that various electronic components such as an integrated circuit, a capacitor, and a resistor can be densely arranged on the printed circuit board. .

In a soft copper foil substrate, there is often a need to rotate the flexible copper foil substrate from horizontal to vertical. However, in the prior art flexible copper foil substrate plating apparatus, the flexible copper foil substrate is horizontally turned into a vertical The steering mechanism has defects, and even more, the steering mechanism scratches the soft copper foil substrate.

It can be seen that the above existing methods obviously still have inconveniences and defects, and need to be further improved. In order to solve the above problems, the relevant fields have not exhausted their efforts to seek solutions, but the methods that have not been applied for a long time have been developed. Therefore, how can we provide a soft copper foil substrate? The plating device meets the need to turn the flexible copper foil substrate from horizontal to vertical, and avoids the problem that the above mechanism can scratch the soft copper foil substrate. It is one of the current important research and development topics, and has become an urgent target for improvement in related fields. .

SUMMARY OF THE INVENTION An object of the present invention is to provide a soft copper foil substrate plating apparatus which satisfies the problem of turning a flexible copper foil substrate from horizontal to vertical and avoids the problem that the steering mechanism can scratch the soft copper foil substrate.

In order to achieve the above object, a technical aspect of the present invention relates to a soft copper foil substrate plating apparatus. The flexible copper foil substrate plating apparatus includes a first roller device, a second roller device, and a steering module. The first roller device is disposed in a first direction and is used for winding a flexible copper foil substrate. The second roller device is disposed in a second direction and is used for winding the flexible copper foil substrate, wherein the first direction is perpendicular to the second direction, and a conveying path is formed between the first roller device and the second roller device. The steering module is disposed on the conveying path and is configured to turn the flexible copper foil substrate from the first direction to the second direction, wherein the steering module includes at least one air hole for outputting gas, so that the flexible copper foil substrate is not turned The module is in direct contact.

According to another embodiment of the present invention, the air hole includes at least one of a circular air hole, a square air hole, a polygonal air hole, and a one-piece air hole.

According to still another embodiment of the present invention, the first direction is a horizontal direction and the second direction is a vertical direction.

According to still another embodiment of the present invention, the first direction is a vertical direction and the second direction is a horizontal direction.

According to still another embodiment of the present invention, the steering module includes an intermediate transfer roller and a steering mechanism. The intermediate transfer roller is disposed opposite the first roller device and is configured to turn the flexible copper foil substrate from the first direction to a third direction. The steering mechanism is disposed opposite to the intermediate transport roller and cooperates with the intermediate transport roller to deflect the soft copper foil substrate in the third direction to the second direction, wherein the air hole is disposed on the steering mechanism.

According to still another embodiment of the present invention, the shape of the steering mechanism includes at least one of a cylindrical shape, a square cylindrical shape, a polygonal cylindrical shape, and a rectangular prism shape.

According to still another embodiment of the present invention, the angle between the steering mechanism and the first roller device is 45 degrees.

According to still another embodiment of the present invention, the angle between the steering mechanism and the second roller device is 45 degrees.

Therefore, according to the technical content of the present invention, an embodiment of the present invention provides a soft copper foil substrate plating apparatus to meet the requirement of turning a soft copper foil substrate from horizontal to vertical, and to prevent the steering mechanism from scratching the soft copper foil substrate. The problem.

In order to make the description of the present disclosure more complete and complete, reference is made to the accompanying drawings and the accompanying drawings. However, the embodiments provided are not intended to limit the scope of the invention, and the description of the operation of the structure is not intended to limit the order of its execution, and any device that is recombined by the components produces equal devices. The scope covered by the invention.

The drawings are for illustrative purposes only and are not drawn to the original dimensions. On the other hand, well-known elements and steps are not described in the embodiments to avoid unnecessarily limiting the invention.

In the production process, the material is first placed, that is, the roller device wound around the flexible copper foil substrate is placed in the soft copper foil substrate plating apparatus. Since the flexible copper foil substrate has a weight, it is necessary to horizontally place the roller device during the frame material so as not to vertically place the roller device, and the soft copper foil substrate may slip. However, in the process of electroplating, if the roller device is placed vertically, the processing of the flexible copper foil substrate can be facilitated, so that there is a need to turn the roller device from horizontal to vertical.

Correspondingly, when the soft copper foil substrate is plated and needs to be received, that is, when the soft copper foil substrate is wound into the roller device, the weight of the flexible copper foil substrate is the same, so the receiving roller device is also required. Place horizontally. Therefore, an embodiment of the present invention provides a soft copper foil substrate plating apparatus to meet the needs of the prior art, and a soft copper foil substrate plating apparatus will be described in detail below.

FIG. 1 is a schematic view showing a soft copper foil substrate plating apparatus 100 according to an embodiment of the invention. As shown in FIG. 1, the flexible copper foil substrate plating apparatus 100 includes a first roller device 110, a second roller device 120, and a steering module 130.

Referring to FIG. 1, the first roller device 110 is disposed in the first direction and is used to wind the flexible copper foil substrate 140. The second roller device 120 is disposed in the second direction and is used for winding the flexible copper foil substrate 140, wherein the first direction is perpendicular to the second direction, and the first roller device 110 and the second roller device 120 are A transport path is formed between them. The steering module 130 is disposed on the conveying path and is configured to turn the flexible copper foil substrate 140 from the first direction to the second direction.

In an embodiment, the steering module 130 includes at least one air hole 136. The air holes 136 are for outputting gas, so that the flexible copper foil substrate 140 is not in direct contact with the steering module 130. In this way, since the flexible copper foil substrate 140 is not in direct contact with the steering module 130, the soft copper foil substrate can be prevented from being scratched.

In the production, the air hole comprises at least one of a circular air hole, a square air hole, a polygonal air hole and a single air hole, that is, the shape of the air hole may be a circle, a square, a polygon or a strip, but it is not In order to define the present invention, it is possible to adopt the desired pore shape according to actual needs without departing from the spirit and scope of the present invention.

In another embodiment, the first direction is a horizontal direction and the second direction is a vertical direction, that is, the first roller device 110 is disposed in the horizontal direction and the second roller device 120 is disposed in the vertical direction. Further, the first roller device 110 may be disposed in the vertical direction and the second roller device 120 may be disposed in the horizontal direction according to actual needs.

In detail, the steering module 130 includes an intermediate transfer roller 132 and a steering mechanism 134. The intermediate transfer roller 132 is disposed opposite to the first roller device 110 and is configured to turn the flexible copper foil substrate 140 from the first direction to the third direction. The steering mechanism 134 is disposed opposite the intermediate transport roller 132 and cooperates with the intermediate transport roller 132 to divert the flexible copper foil substrate 140 in the third direction to the second direction.

It should be noted that the above air holes can be selected according to the actual needs. Optionally, it is disposed on the steering mechanism 134 or the steering module 130, and can also be disposed on the steering mechanism 134 and the steering module 130. However, the invention is not limited thereto.

As shown in FIG. 1, the steering mechanism 134 can include at least one air vent 136. The air holes 136 are for outputting gas, so that the flexible copper foil substrate 140 is not in direct contact with the steering module 130. In this way, since the flexible copper foil substrate 140 is not in direct contact with the steering module 130, the soft copper foil substrate can be prevented from being scratched.

In an embodiment, the shape of the steering mechanism 134 includes at least one of a cylindrical shape, a square cylindrical shape, a polygonal cylindrical shape, and a rectangular column shape. However, it is not intended to limit the invention, and the shape of the desired steering mechanism 134 can be selectively employed as desired, without departing from the spirit and scope of the invention.

Referring to FIG. 1, the angle between the steering mechanism 134 and the first roller device 110 may be 45 degrees. Further, the angle between the steering mechanism 132 and the second roller device 120 may be 45 degrees.

2 is a schematic view showing a soft copper foil substrate plating apparatus 100a according to another embodiment of the present invention. As shown in Fig. 2, the flexible copper foil substrate plating apparatus 100a includes a first roller device 110a, a second roller device 120a, and a steering module 130a. The steering module 130a includes an intermediate transfer roller 132a and a steering mechanism 134a.

In Fig. 2, it differs from Fig. 1 in that the shape of the steering mechanism 134a is a rectangular cylinder shape. Therefore, in the second embodiment, only the embodiment in which the shape of the steering mechanism 134a is a rectangular cylinder shape, the flexible copper foil substrate is exemplarily illustrated. The component actuation in the electroplating apparatus 100a is similar to that of FIG. 1, and will not be described herein.

It will be apparent from the above-described embodiments of the present invention that the application of the present invention has the following advantages. Embodiments of the present invention provide a soft copper foil substrate plating apparatus to meet the demand of turning a flexible copper foil substrate from horizontal to vertical and avoiding the problem that the steering mechanism can scratch the soft copper foil substrate.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

100‧‧‧Soft copper foil substrate plating device

110‧‧‧First roller unit

120‧‧‧Second roller unit

130‧‧‧ steering module

132‧‧‧Intermediate transfer roller

134‧‧ ‧ steering mechanism

136‧‧ s vent

140‧‧‧Soft copper foil substrate

100a‧‧‧Soft copper foil substrate plating device

110a‧‧‧First roller unit

120a‧‧‧second roller unit

130a‧‧‧ steering module

132a‧‧‧Intermediate transfer roller

134a‧‧ ‧ steering mechanism

136a‧‧‧ stomata

140a‧‧‧Soft copper foil substrate

The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; Schematic diagram.

2 is a schematic view showing a plating apparatus of a flexible copper foil substrate according to another embodiment of the present invention.

100‧‧‧Soft copper foil substrate plating device

110‧‧‧First roller unit

120‧‧‧Second roller unit

130‧‧‧ steering module

132‧‧‧Intermediate transfer roller

134‧‧ ‧ steering mechanism

136‧‧ s vent

140‧‧‧Soft copper foil substrate

Claims (8)

A soft copper foil substrate plating apparatus comprising: a first roller device disposed in a first direction for winding a flexible copper foil substrate; and a second roller device disposed in a second direction for Rolling the flexible copper foil substrate, wherein the first direction is perpendicular to the second direction, a transport path is formed between the first roller device and the second roller device; and a steering module is disposed on the transport path And rotating the flexible copper foil substrate from the first direction to the second direction, wherein the steering module includes at least one air hole for outputting gas, so that the flexible copper foil substrate does not cooperate with the steering module direct contact. The soft copper foil substrate plating apparatus according to claim 1, wherein the air hole comprises at least one of a circular air hole, a square air hole, a polygonal air hole, and a one-shaped air hole. The soft copper foil substrate plating apparatus according to claim 1, wherein the first direction is a horizontal direction and the second direction is a vertical direction. The soft copper foil substrate plating apparatus according to claim 1, wherein the first direction is a vertical direction and the second direction is a horizontal direction. A soft copper foil substrate plating apparatus according to claim 1, wherein The steering module includes: an intermediate transport roller disposed opposite the first roller device and configured to turn the flexible copper foil substrate from the first direction into a third direction; and a steering mechanism coupled with the intermediary The transfer rollers are disposed opposite to each other and cooperate with the intermediate transfer roller to steer the flexible copper foil substrate in the third direction to the second direction, wherein the air vent is disposed on the steering mechanism. The soft copper foil substrate plating apparatus according to claim 5, wherein the shape of the steering mechanism comprises at least one of a cylindrical shape, a cylindrical shape, a polygonal cylindrical shape, and a rectangular column shape. The soft copper foil substrate plating apparatus according to claim 5, wherein an angle between the steering mechanism and the first roller device is 45 degrees. The soft copper foil substrate plating apparatus according to claim 5, wherein an angle between the steering mechanism and the second roller device is 45 degrees.